CN115372740B - RF chip line loss test method, system, readable storage medium and electronic device - Google Patents
RF chip line loss test method, system, readable storage medium and electronic device Download PDFInfo
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- CN115372740B CN115372740B CN202211000593.2A CN202211000593A CN115372740B CN 115372740 B CN115372740 B CN 115372740B CN 202211000593 A CN202211000593 A CN 202211000593A CN 115372740 B CN115372740 B CN 115372740B
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a method and a system for testing the line loss of an RF chip, a readable storage medium and electronic equipment, and belongs to the technical field of chip testing. The method comprises the steps of: placing the radio frequency chip to be tested in a test base, wherein the first spring needle and the second spring needle touch the pin part of the radio frequency chip; the first spring needle is connected with the testing instrument; establishing a connection between the goldensmple and the second spring needle; acquiring a radio frequency signal sent by a goldensmple to a first test instrument, and calculating the power value of the radio frequency signal; acquiring a line loss value of a radio frequency line under the frequency of the radio frequency signal and a line loss value of a PCB wiring; obtaining a line loss value introduced by the contact impedance of the spring needle; after the connection between the goldensmple and the second spring needle is disconnected, the radio frequency chip to be tested sends or receives radio frequency signals, and the first test instrument measures the power of the radio frequency signals to obtain the line loss value of the test loop. The invention can measure the line loss value introduced by the contact impedance of the spring needle, and reduce the test deviation so as to improve the accuracy of the result.
Description
Technical Field
The invention belongs to the technical field of chip testing, and particularly relates to an RF chip line loss testing method, an RF chip line loss testing system, a readable storage medium and electronic equipment.
Background
Different rf wire materials and lengths of wire result in different power losses, commonly referred to as line losses. During mass production testing, the power loss of the radio frequency line must be measured, and the corresponding value is compensated during the testing, otherwise, the testing introduces a larger measurement error. However, this compensation value is usually a fixed compensation value for a specific line, which may lead to anomalies in the test value once the radio frequency line corresponding to the calibration value is not used.
Fig. 1 shows a schematic diagram of the connection relationship of the RF chip in the mass production test at present. The circuit wiring on the test board is connected with the spring needle and the SMA interface, the distance is short, and the introduced line loss is small and can be ignored.
Spring pins (pogo pins) connecting the chip pins with the circuit board are the easiest to ignore in the test loop, and are also the place where larger measurement errors are most easily introduced.
Under ideal conditions, the contact impedance between the spring needle and the chip pin is about 0.2 ohm, but along with the increase of the test times, the spring needle can be oxidized or stained, so that the contact impedance can also be changed, and the contact impedance can reach 5 ohm when serious.
In addition, the magnitude of the pressure of the handler also affects the value of the contact resistance. The power loss of the radio frequency signal introduced by different contact impedances is different, and because the contact impedance is dynamically changed, each contact of the chip with the spring pin in the test base can cause impedance change, which leads to the power loss of the radio frequency signal in each test to be dynamically changed. Therefore, the dynamic line loss value makes the traditional method of compensating the fixed value not applicable any more, and also causes a larger deviation of the test value.
In summary, how to provide a method for testing the line loss of the RF chip, which can measure the line loss value introduced by the contact impedance of the spring needle and reduce the deviation of the test value, thereby improving the accuracy of the test result, is a technical problem to be solved currently.
Disclosure of Invention
The invention aims to provide a method, a system, a readable storage medium and electronic equipment for testing the line loss of an RF chip, wherein a first spring needle and a second spring needle which touch the pin of the RF chip are arranged on a test base, the first spring needle is connected with a first test instrument, and the second spring needle is connected with a golden sample. In the test, a test loop from the first test instrument to the first spring needle is disconnected, and a loop from the second spring needle to the golden sample is communicated, so that a line loss value introduced by the contact impedance of the spring needle can be obtained.
The invention provides a method for testing the line loss of an RF chip, which is applied to a testing device, wherein the testing device comprises a testing base, a testing instrument and a network analyzer;
the test base comprises a spring needle, wherein the spring needle comprises a first spring needle and a second spring needle;
the test instrument comprises a golden sample and a first test instrument;
the method comprises the following steps:
placing the radio frequency chip to be tested in a test base, wherein the first spring needle and the second spring needle touch the pin part of the radio frequency chip, and the first spring needle is connected to a first test instrument so as to communicate a test loop from the first spring needle to the first test instrument;
establishing a connection of the golden sample with the second spring needle to communicate a loop from golden sample to second spring needle;
acquiring a radio frequency signal sent by the golden sample to the first test instrument, and calculating the power value of the radio frequency signal;
acquiring a line loss value of a radio frequency line under the frequency of the radio frequency signal and a line loss value of a PCB wiring through the network analyzer; the PCB wiring comprises a first PCB wiring and a second PCB wiring;
obtaining a line loss value introduced by the contact impedance of the spring needle;
after the golden sample is disconnected with the second spring needle, the radio frequency chip to be tested sends or receives radio frequency signals, and the first test instrument measures the power of the radio frequency signals to obtain the line loss value of the test loop.
Further, the calculation formula of the line loss value introduced by the contact resistance of the spring needle is as follows,
wherein X is the frequency of the radio frequency signal;
P 1 power value, P, of radio frequency signal transmitted for golden sample 2 A power value of the radio frequency signal received by the first test instrument;
L1 x the line loss value of the first PCB line is used as the line loss value; l2 x The radio frequency line loss value is; l3 x And the line loss value of the second PCB line.
Further, the obtaining the line loss value of the contact resistance introduction of the spring needle further comprises obtaining the line loss value of the contact resistance introduction of the first spring needle, the obtaining the line loss value of the contact resistance introduction of the first spring needle comprises the following steps,
connecting the test loop, and obtaining the power of a first radio frequency signal sent by a chip to be tested according to a golden sample;
disconnecting the test loop, and obtaining the power of a second radio frequency signal sent by the chip to be tested according to the golden sample, wherein the power of the second radio frequency signal is the same as that of the first radio frequency signal;
calculating a power difference between the measured power of the first radio frequency signal and the measured power of the second radio frequency signal;
and calculating the line loss value introduced by the contact resistance of the first spring needle and the line loss value introduced by the contact resistance of the second spring needle.
Further, the calculation formula of the line loss value introduced by the contact impedance of the first spring needle is as follows,
wherein X is the frequency of the radio frequency signal; p (P) rg For the measured power of the first radio frequency signal; p (P) re For the measured power of the second radio frequency signal.
Further, the obtaining the line loss value of the test loop further comprises compensating the test loop according to the obtained line loss value introduced by the contact impedance of the spring needle.
Further, the calculation formula of the line loss value of the test loop is PA x ＝PL x +L1 x +L2 x 。
Further, the method also comprises the steps of obtaining an ideal line loss value of the test loop before the test, and calculating a difference value between the line loss value of the test loop and the ideal line loss value of the test loop;
and triggering an alarm when the difference value is larger than a preset threshold value.
Further, the sum of the length of the second spring needle and the length of the PCB trace is smaller than the wavelength of the radio frequency signal.
The invention also provides a system for testing the line loss of the mass production of the RF chips, which is used for implementing the method of any one of the above steps, and comprises the following steps:
the Switch module: the test circuit is used for establishing connection between the first spring needle and the first test instrument so as to communicate the radio frequency chip to be tested with the first test instrument; and the connection between the golden sample and the second spring needle is established to communicate a loop from the golden sample to the second spring needle, or the connection between the golden sample and the second spring needle is cut off to disconnect the loop from the golden sample to the second spring needle.
And a sending module: for transmitting a radio frequency signal to the first test instrument via a golden sample;
and a receiving module: the first test instrument is used for receiving a radio frequency signal generated by a golden sample;
the acquisition module is used for: the network analyzer is used for acquiring the radio frequency line loss value of the radio frequency signal under the frequency and the line loss value of the PCB wiring;
the calculation module: the power value, the line loss value introduced by the contact impedance of the spring needle and the line loss value of the test loop are used for calculating the power value of the radio frequency signal received by the first test instrument.
Further, the calculation module is further configured to calculate an ideal line loss value of the test loop, and calculate a difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and determine whether the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is greater than a preset threshold.
The present invention also provides a computer readable storage medium having a detection program stored thereon, which when executed by a processor, implements the steps of the RF chip line loss testing method as described in any one of the above.
The invention also provides an electronic device, comprising: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing when executing the program: the method for testing the line loss of the RF chip according to any one of the above.
Compared with the prior art, the invention adopts the technical proposal, and has the following advantages and positive effects by way of example and not limitation:
the method comprises the steps of enabling a first spring needle connected with a first test instrument to be in contact with a pin part of a radio frequency chip in a test base, enabling a second spring needle connected with a golden sample to be in contact with the pin part of the radio frequency chip, keeping a test loop from the first test instrument to the first spring needle disconnected in test, enabling a loop from the second spring needle to the golden sample to be communicated, enabling the test loop to be communicated after a line loss value introduced by contact impedance of the spring needle is obtained, compensating the line loss value introduced by contact impedance of the spring needle, and obtaining the line loss value of the test loop. By measuring the contact impedance of the dynamically-changed spring needle and the radio frequency chip to be tested and compensating the contact impedance in the test process, the test deviation is reduced, and the accuracy of the measurement result is improved.
The chip test can be automatically compensated or monitored and alarmed.
The golden sample is adopted to send the radio frequency signal, so that the wiring of the PCB is simplified, the requirement on radio frequency test equipment resources is avoided, and the test cost is reduced.
Drawings
Fig. 1 is a schematic diagram of connection relationship of RF chips in mass production test.
Fig. 2 is a flowchart of a method for testing line loss of an RF chip according to the present invention.
Fig. 3 is a schematic diagram of connection relation of the method for testing line loss of an RF chip according to the present invention.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Wherein the drawings are for illustrative purposes only and are shown in schematic, non-physical, and not intended to be limiting of the present patent; for the purpose of better illustrating embodiments of the invention, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the size of the actual product; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
As shown in fig. 2, the present invention provides a method for testing line loss of an RF chip, which is applied to a testing device, wherein the testing device comprises a testing base, a testing instrument and a network analyzer.
Wherein the test base includes a spring probe including a first spring probe and a second spring probe using a dual spring pinhole for RF IO.
The test instrument includes a golden sample and a first test instrument.
S100, placing a radio frequency chip to be tested in a test base, wherein the first spring needle and the second spring needle touch the pin part of the radio frequency chip, and the first spring needle is connected to a first test instrument so as to communicate a test loop from the first spring needle to the first test instrument; the test loop is kept in a connected state in the process of testing the line loss value introduced by the contact impedance of the spring needle. Optionally, the connection between the first pogo pin and the first test instrument is controlled by the RFswitch.
S200, establishing connection between the golden sample and the second spring needle, and optionally connecting the golden sample to a loop of the second spring needle through an RF switch; the connection or disconnection between the golden sample and the second pogo pin is controlled by the RF switch.
S300, acquiring a radio frequency signal sent by the golden sample to the first test instrument, and calculating the power value of the radio frequency signal.
Specifically, if golden sample is sent to the first test instrument with frequency X 1 The power is a known value P 1 The first test instrument receives the signal and calculates the received signal power as P 2 . Thus, the frequency X can be calculated 1 When the line loss value of the radio frequency line connecting the golden sample and the loop of the first test instrument is
The implementation isIn the example, the golden sample is used to transmit power from one end of the loop to a known value P 1 The first test instrument at the other end of the loop receives the signal, thereby avoiding adding extra circuits and reducing the test cost.
And repeating the process, and calculating and obtaining the line loss value corresponding to each channel frequency only by changing the frequency.
S400, acquiring a line loss value of a radio frequency line under the radio frequency signal and a line loss value of a PCB (printed Circuit Board) wiring through the network analyzer, wherein the PCB wiring comprises a first PCB wiring and a second PCB wiring. Setting the transmitting power of the network analyzer, connecting the radio frequency line to the network analyzer interface for transmission calibration, and connecting the radio frequency line to be tested, wherein the insertion loss value is the measured radio frequency line loss value.
S500, obtaining a line loss value introduced by the contact impedance of the spring needle, wherein the calculation formula is as follows,
wherein X is 1 Is the frequency of the radio frequency signal; p (P) 1 Power value, P, of radio frequency signal transmitted for golden sample 2 A power value of the radio frequency signal received by the first test instrument;
It should be emphasized that, in this embodiment, the above formula refers to the mean value processing of the line loss values introduced by the first spring needle and the second spring needle and the contact resistance thereof, so as to obtain the line loss value introduced by the contact resistance of each spring needle after uniformity.
Likewise, disconnecting the golden sample from the second spring pin by the RF switch described above disconnects the loop between the golden sample and the second spring pin and the loop remains disconnected until the test process for testing the actual line loss value of the loop is completed. This operation means that the golden sample is now in the power off or idle state.
The following is the line loss value test procedure of the test loop: s600, after the golden sample is disconnected from the second spring needle, under the condition that a test loop between the first spring needle and the first test instrument is kept communicated, a radio frequency signal is sent or received through a radio frequency chip to be tested, and the radio frequency signal frequency is X 2 。X 2 With the frequency X of the radio frequency signal emitted by the golden sample 1 The values of (2) may be the same or different.
Specifically, the first test instrument measures the power of the radio frequency signal sent or received by the radio frequency chip to be tested, and the first test instrument measures the power of the radio frequency signal to obtain the line loss value of the test loop.
It should be noted that the obtaining the line loss value of the test loop further includes compensating the test loop according to the obtained line loss value introduced by the contact impedance of the spring needle.
By formula PA x ＝PL x +L1 x +L2 x And calculating the line loss value of the test loop.
As one of typical embodiments, an ideal line loss value of the test loop is obtained before a single rf chip test begins.
The ideal line loss value of the test loop can be obtained by the following method steps: placing a radio frequency chip to be tested in the test base, wherein the first spring needle and the second spring needle touch the pin of the radio frequency chip and are in a conducting state, and the radio frequency chip is in a power off state at the moment;
the RF switch is controlled to connect the golden sample to the second pogo pin.
And controlling the golden sample to send a radio frequency signal, receiving the signal by the first test instrument, and calculating the power of the received signal. The bus loss value of the loop from the golden sample to the first test instrument at the frequency of the radio frequency signal can thus be calculated. Line loss values corresponding to the channel frequencies can be calculated in sequence.
And obtaining a line loss value introduced by the contact resistance of the spring needle, and recording the line loss value in a preset calibration file.
Controlling the RF switch off may cause the golden sample to be in a power off or idle state. The first test instrument can measure the radio frequency signal by sending or receiving the radio frequency signal with the frequency X through the radio frequency chip to be tested. Obtaining the ideal line loss value of the corresponding test loop as PA x ＝PL X +L1 X +L2 X Recorded in a preset calibration file. It should be emphasized that the method step of testing the ideal line loss value may refer to the testing method of the RF chip line loss test described above.
After the test of the line loss value of the test loop is completed, calculating the difference value between the line loss value of the test loop and the ideal line loss value of the test loop, triggering an alarm when the difference value is larger than a preset threshold value, and stopping the test and waiting for subsequent manual processing. Therefore, whether the line loss value of the test environment is abnormal or not can be monitored, the monitoring times and the monitoring time period can be flexibly controlled, and the additional test time is short.
In another embodiment, after the line loss value of the test loop introduced due to the contact impedance or other reasons is obtained by the steps of the method for testing the line loss of the RF chip provided by the invention, the dynamic line loss value introduced by the contact impedance of the spring needle under different radio frequency signal frequencies and the total line loss value of the test loop at the moment can be obtained similarly. When the radio frequency chip is tested, corresponding line loss values are compensated in real time, and the accuracy of subsequent measurement can be improved.
The invention can also be used for compensating the line loss value of the test loop at different temperatures.
Considering that automotive or industrial type chips typically require testing of the chip at different temperatures. For example, the vehicle gauge Grade1 Grade requires testing at three temperatures of-40 ℃,25 ℃,125 ℃. The contact resistance of the spring needle at different temperatures is obviously different, and the oxidation speed of the spring needle at high temperature is obviously faster than that at normal temperature and low temperature. The oxidation degree of the spring needle per 500 times used needle tip under the high temperature condition is close to the result of 2000 times under the normal temperature condition.
Before the test starts, the line loss values of the test loops at different ambient temperatures are measured and recorded as calibration values.
First, the program sets the test temperature of the classifier through the GPIB. After the setting is completed, whether the test environment temperature reaches the set temperature or not is inquired through GPIB. When the ambient temperature reaches the set temperature, the line loss value at the moment is measured by the testing method for testing the line loss value of the loop, and the line loss value is recorded in the corresponding temperature line loss calibration file. If the line loss value is measured at the temperature of minus 40 ℃, recording the line loss value to a calibration file Lx LT In the method, a line loss value measured at 25 ℃ is recorded to a calibration file Lx RT In the method, a 125 ℃ test line loss value is recorded to a calibration file Lx HT Is a kind of medium.
After the actual test begins, the program reads the test environment temperature at that time of the classifier through the GPIB. And reading the line loss calibration temperature of the corresponding temperature according to the test temperature at the moment. If the test temperature is 125 ℃, accessing and reading the calibration file Lx HT . And compensating the corresponding line loss value in the file into an actual test. It is also possible to set a test that triggers the line loss value of the test loop, for example, after every 200 total test times. When the test line loss value exceeds the line loss value of 0.2dB in the calibration file, an alarm is triggered, and the test is suspended. The loop line loss at 2442Mhz was 3.3dB at this point, while the loop line loss at 2442Mhz, as specified in the document, was 2.1dB at this temperature. The actual loop line loss value is 1.2dB greater than the calibration value, so that the program alarms and stops testing.
The method can compensate the line loss values of the test loops under different test environments, and avoid test errors caused by test temperature changes. Meanwhile, the scheme does not need to carry out real-time compensation, and can save test time.
The invention also provides an implementation mode, namely, the method for testing the line loss of the RF chip comprises the steps of respectively calculating the line loss values introduced by the first spring needle, the second spring needle and the contact impedance of the first spring needle.
The obtaining of the spring pin contact resistance induced line loss value further comprises obtaining a first spring pin contact resistance induced line loss value, the obtaining of the first spring pin contact resistance induced line loss value comprising the steps of,
and connecting the testing loop, and obtaining the power of the first radio frequency signal according to the first radio frequency signal sent by the golden sample by the chip to be tested.
And disconnecting the test loop, and obtaining the power of a second radio frequency signal sent by the chip to be tested according to the golden sample, wherein the power of the second radio frequency signal is the same as that of the first radio frequency signal.
A power difference is calculated between the measured power of the first radio frequency signal and the measured power of the second radio frequency signal.
And calculating the line loss value introduced by the contact resistance of the first spring needle and the line loss value introduced by the contact resistance of the second spring needle.
In the foregoing embodiment, the average value of the line loss values introduced by the contact resistances of the first spring needle and the second spring needle is processed. In practical applications, there is an unavoidable difference in contact resistance due to the possible contamination and oxidation levels or lifetime differences of the two pogo pins. In the embodiment, the line loss value introduced by the contact impedance of each spring needle is calculated, so that more accurate measurement can be realized.
The RF chip line loss test method can be used for obtaining:
(L p1 +L p2 ) X ＝(P1-P2) X -(L1 X +L2 X +L3 X ) (1) (X is the signal frequency)
Wherein the first spring needle has a contact resistance introducing a line loss value L p1 The second spring needle and the contact resistance of the second spring needle lead in a line loss value L p2 。
The DUT is configured to be in a receive state. Closing the RF switch, GU, sends a signal of power P, at which time the DUT may obtain a received power value P rg 。
Switching off the RF switch and transmitting power together at P by testingA signal. At this point the DUT may obtain another received power value P re 。
The difference in the two power values received by the DUT is due to the inconsistent line losses of the two test loops, and thus can be obtained:
(P rg -P re ) X ＝(L 1 +L 2 +L p1 ) X -(L 3 +L p2 ) x (2) (X is the signal frequency)
The method is characterized by comprising the following steps of (1) and (2):
For example, at 2442Mhz, the loop is closed, the golden sample transmits a signal with p1=5 dB, and p2=2.4 dB is measured at the test instrument end. L1=0.1 dB at 2442Mhz, l2=1.9 dB, l3=0.05 dB. Then configuring the DUT in a receiving state, and transmitting a 5dB signal by the golden sample, wherein the DUT measures the corresponding power P rg =4.7 dB. The RF switch is turned off and the test instrument sends a 5dB signal, at which time the DUT measures the corresponding power P re =2.6db. L can be obtained by taking the formula (3) p1 =0.35 dB. When testing the DUT, 0.35dB is taken into compensation when calculating power.
The invention provides an RF chip mass production line loss test system for implementing the method of any one of the above, comprising:
the Switch module: the test circuit is used for establishing connection between the first spring needle and the first test instrument so as to communicate the radio frequency chip to be tested with the first test instrument; and the connection between the golden sample and the second spring needle is established to communicate a loop from the golden sample to the second spring needle, or the connection between the golden sample and the second spring needle is cut off to disconnect the loop from the golden sample to the second spring needle.
And a sending module: for transmitting a radio frequency signal to the first test instrument via a golden sample;
and a receiving module: the first test instrument is used for receiving a radio frequency signal generated by a golden sample;
the acquisition module is used for: the network analyzer is used for acquiring the radio frequency line loss value of the radio frequency signal under the frequency and the line loss value of the PCB wiring;
the calculation module: the power value, the line loss value introduced by the contact impedance of the spring needle and the line loss value of the test loop are used for calculating the power value of the radio frequency signal received by the first test instrument.
The calculation module is further configured to calculate an ideal line loss value of the test loop, and calculate a difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and to determine whether the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is greater than a preset threshold.
Optionally, the system further comprises an alarm module configured to: and when the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is calculated by the calculation module to be larger than a preset threshold value, an alarm is sent out.
The present invention also provides a computer readable storage medium, for example, a Read-Only Memory (ROM), a random access Memory (RandomAccess Memory, RAM), a compact disc Read-Only Memory (CDROM), a magnetic tape, a floppy disk, an optical data storage device, and the like.
The computer-readable storage medium stores a detection program which, when executed by a processor, implements the steps of the RF chip line loss testing method according to any one of the above.
The invention also provides electronic equipment which can be an industrial personal computer, a notebook computer, a tablet personal computer, a handheld computer, an ultra mobile personal computer, a netbook and other equipment with data processing functions, and the embodiment of the invention is not particularly limited. The electronic device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing when executing the program: the method for testing the line loss of the RF chip according to any one of the above.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. The method is applied to a testing device, and the testing device comprises a testing base, a testing instrument and a network analyzer;
the test base comprises a spring needle, wherein the spring needle comprises a first spring needle and a second spring needle;
the test instrument comprises a golden sample and a first test instrument;
the method is characterized by comprising the following steps:
placing the radio frequency chip to be tested in a test base, wherein the first spring needle and the second spring needle touch the pin part of the radio frequency chip, and the first spring needle is connected to a first test instrument so as to communicate a test loop from the first spring needle to the first test instrument;
establishing a connection of the golden sample with the second spring needle to communicate a loop from golden sample to second spring needle;
acquiring a radio frequency signal sent by the golden sample to the first test instrument, and calculating the power value of the radio frequency signal;
acquiring a line loss value of a radio frequency line under the frequency of the radio frequency signal and a line loss value of a PCB wiring through the network analyzer; the PCB wire comprises a first PCB wire and a second PCB wire, wherein the first PCB wire is connected with a first spring needle and an SMA; the second PCB wire is connected with the second spring needle and the RF SWITCH; the radio frequency wire is connected with the SMA and the first testing instrument;
obtaining a line loss value introduced by the contact impedance of the spring needle;
after the golden sample is disconnected with the second spring needle, the radio frequency chip to be tested sends or receives a radio frequency signal, and the first test instrument measures the power of the radio frequency signal to obtain a line loss value of a test loop;
the step of obtaining the line loss value of the test loop further comprises the step of compensating the test loop according to the obtained line loss value introduced by the contact impedance of the spring needle;
the calculation formula of the actual line loss value of the test loop is as follows,
；/>
a line loss value introduced for spring pin contact resistance; />
The line loss value of the first PCB line is used as the line loss value; />
Is the radio frequency line loss value.
2. The method for testing the line loss of the RF chip according to claim 1, wherein: the calculation formula of the line loss value introduced by the contact resistance of the spring needle is as follows,
3. The method for testing the line loss of the RF chip according to claim 1, wherein: the method comprises the steps of connecting a loop from a second spring needle to a golden sample, and obtaining the power of a first radio frequency signal according to the first radio frequency signal sent by the golden sample by a chip to be tested; disconnecting the loop from the second spring needle to the golden sample, and obtaining the power of the second radio frequency signal by the chip to be tested according to the second radio frequency signal sent by the first test instrument, wherein the power of the second radio frequency signal sent by the first test instrument is the same as that of the first radio frequency signal sent by the golden sample; calculating a power difference between the measured power of the first radio frequency signal and the measured power of the second radio frequency signal; and calculating the line loss value introduced by the contact resistance of the first spring needle and the line loss value introduced by the contact resistance of the second spring needle.
4. The method for testing the line loss of the RF chip according to claim 3, wherein; the calculation formula of the line loss value introduced by the contact impedance of the first spring needle is as follows,
5. The method for testing the line loss of the RF chip according to claim 1, wherein: the method further comprises the steps of obtaining an ideal line loss value of the test loop before testing, and calculating a difference value between the line loss value of the test loop and the ideal line loss value of the test loop;
and triggering an alarm when the difference value is larger than a preset threshold value.
6. The method for testing the line loss of the RF chip according to claim 1, wherein: the length of the second spring needle and the length of the PCB wire are added to be smaller than the wavelength of the radio frequency signal.
7. An RF chip line loss testing system for implementing the method of any one of claims 1-6, characterized by:
the system comprises:
the Switch module: the test circuit is used for establishing connection between the first spring needle and the first test instrument so as to communicate the radio frequency chip to be tested with the first test instrument; and establishing a connection between the golden sample and the second spring needle to communicate a loop from the golden sample to the second spring needle, or cutting off the connection between the golden sample and the second spring needle to disconnect the loop from the golden sample to the second spring needle;
and a sending module: for transmitting a radio frequency signal to the first test instrument via a golden sample;
and a receiving module: the method comprises the steps of acquiring a radio frequency signal sent by a golden sample to a first test instrument;
the acquisition module is used for: the network analyzer is used for acquiring the radio frequency line loss value of the radio frequency signal under the frequency and the line loss value of the PCB wiring;
the calculation module: the power supply device is used for calculating the power value of the radio frequency signal received by the first test instrument, the line loss value introduced by the contact impedance of the spring needle and the line loss value of the test loop.
8. The RF chip line loss testing system of claim 7, wherein: the calculation module is further configured to calculate an ideal line loss value of the test loop, and calculate a difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and to determine whether the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is greater than a preset threshold.
9. A computer-readable storage medium, wherein a detection program is stored on the computer-readable storage medium, the detection program implementing the steps of the RF chip line loss testing method according to any one of claims 1 to 6 when executed by a processor.
10. An electronic device, comprising: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing when executing the program: the RF chip line loss testing method according to any one of claims 1 to 6.
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