CN115882890A - Radio frequency circuit and power test method thereof, communication module and wireless terminal equipment - Google Patents
Radio frequency circuit and power test method thereof, communication module and wireless terminal equipment Download PDFInfo
- Publication number
- CN115882890A CN115882890A CN202211525061.0A CN202211525061A CN115882890A CN 115882890 A CN115882890 A CN 115882890A CN 202211525061 A CN202211525061 A CN 202211525061A CN 115882890 A CN115882890 A CN 115882890A
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- circuit
- resistor
- test
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The embodiment of the application provides a radio frequency circuit, a power test method thereof, a communication module and wireless terminal equipment. The radio frequency circuit comprises a radio frequency transceiving circuit, an antenna module, a resistor and a test pad; the radio frequency receiving and generating circuit is connected with the antenna module through a first radio frequency line; one end of the resistor is connected with the first radio frequency wire, and the other end of the resistor is connected with the test bonding pad; wherein, the resistance value of the resistor is larger than the preset resistance value. This application can reduce cost through adopting resistance and test pad to replace the dedicated test switch who adopts in the correlation technique, can not exert an influence to the measurement of relevant index when production test simultaneously, and when not producing the test, the extra insertion loss that radio frequency circuit produced is less than predetermineeing the insertion loss value, can not bring the influence of extra insertion loss basically.
Description
Technical Field
The application relates to the technical field of radio frequency, in particular to a radio frequency circuit, a power testing method thereof, a communication module and wireless terminal equipment.
Background
The wireless terminal equipment comprises a communication module, wherein the communication module comprises a radio frequency circuit, and the radio frequency circuit realizes radio frequency modulation, amplification, receiving and transmitting of space radio frequency signals and the like through a radio frequency receiving and transmitting circuit and an antenna module, so that wireless communication is realized. Because each communication module has inconsistent radio frequency performance before production calibration test due to factors such as devices, production batches, environment and the like, the communication module needs to be calibrated and tested for radio frequency indexes by using a test instrument, for example, power calibration and test, frequency calibration and test, receiving calibration and sensitivity test and the like, so that the requirement of radio frequency index consistency is met.
In the related art, when a production test is performed, the meter connection test point is tested, and an antenna branch is not disconnected during the production test, the antenna may cause a bias effect on the load impedance of the radio frequency transceiver circuit, thereby causing a test error.
Disclosure of Invention
The application provides a radio frequency circuit, a power testing method thereof, a communication module and wireless terminal equipment aiming at the defects of the prior art, and is used for solving the technical problem that testing errors are caused during production testing in the prior art.
In a first aspect, an embodiment of the present application provides a radio frequency circuit, including: the radio frequency transceiver circuit, the antenna module, the resistor and the test pad;
the radio frequency receiving and generating circuit is connected with the antenna module through a first radio frequency line;
one end of the resistor is connected with the first radio frequency wire, and the other end of the resistor is connected with the test bonding pad; wherein the resistance value of the resistor is greater than the preset resistance value; wherein: during production test, the test pad is connected with external test equipment, the resistance value of the resistor is larger than a preset resistance value, so that the mode of the load impedance of the radio frequency transceiver circuit is in a preset range, and the reflection coefficient obtained through the load impedance is smaller than a preset value;
during non-production testing, the test pads are not connected to external test equipment.
In one possible implementation, the preset resistance value is 68 ohms.
In one possible implementation, the test pads include signal pads and ground pads; the resistor is connected with the signal bonding pad;
during production test, the signal pad and the grounding pad are respectively connected with external test equipment;
and in the non-production test, the signal pad and the grounding pad are not connected with external test equipment.
In a possible implementation manner, a resistor is correspondingly provided with a first bonding pad and a second bonding pad, one end of the resistor is connected with the first bonding pad, and the other end of the resistor is connected with the second bonding pad;
the first bonding pad is arranged on the first radio frequency line, and one end of the resistor is connected with the first radio frequency line through the first bonding pad; or the first pad is not arranged on the first radio frequency line, and one end of the resistor is connected with the first radio frequency line through the second radio frequency line;
the second bonding pad is connected with the signal bonding pad, and the other end of the resistor is connected with the signal bonding pad through the second bonding pad; or the second bonding pad is not connected with the signal bonding pad, and the other end of the resistor is connected with the signal bonding pad through a third radio frequency line;
the length of the second radio frequency line is smaller than a first preset length value, and the length of the third radio frequency line is smaller than a second preset length value. In a possible implementation manner, the first preset length value is a ratio of 0.01 times of the light speed to the frequency of the radio frequency signal transmitted or received by the radio frequency transceiver circuit;
the second preset length is a ratio of 0.025 times of the speed of light to the frequency of the rf signal transmitted or received by the rf transceiver circuit.
In one possible implementation manner, the radio frequency transceiver circuit includes a WIFI module and a filter circuit;
the WIFI module is connected with the filter circuit through a fourth radio frequency line;
the filter circuit is connected with the antenna module through a first radio frequency line.
In one possible implementation, an antenna module includes: a matching circuit and an antenna;
the matching circuit is connected with the radio frequency transceiving circuit through a first radio frequency line and is connected with the antenna through a fifth radio frequency line.
In a second aspect, an embodiment of the present application provides a communication module, which includes the radio frequency circuit as in the first aspect.
In a third aspect, an embodiment of the present application provides a wireless terminal device, including the communication module according to the second aspect.
In a fourth aspect, an embodiment of the present application provides a method for testing power of a radio frequency circuit as in the first aspect, including:
obtaining a first power through the test pad;
obtaining a compensation insertion loss value through a mode of impedance of the antenna module, the resistance value of the resistor and a mode of impedance of the test equipment;
obtaining the power at the antenna port of the radio frequency circuit based on the first power and the compensation insertion loss value; the power at the antenna port refers to the power transmitted by the radio frequency transceiver circuit and entering the antenna module, or the power received by the radio frequency transceiver circuit from the antenna module.
In a possible implementation manner, obtaining the insertion loss compensation value through a mode of an impedance of the antenna module, a resistance value of the resistor and a mode of an impedance of the test equipment includes:
obtaining a first parameter based on a mode of impedance of the antenna module, a resistance value of the resistor and a mode of impedance of the test equipment;
obtaining a second parameter based on the first parameter and a mode of the impedance of the antenna module;
obtaining a third parameter based on the impedance of the antenna module and the resistance of the resistor;
obtaining a compensated insertion loss value based on the second parameter and the third parameter
In one possible implementation, obtaining the power of the antenna module of the radio frequency circuit based on the first power and the compensation insertion loss value includes:
and adding the first power and the compensation insertion loss value to obtain the power at the antenna port of the radio frequency circuit.
The technical scheme provided by the embodiment of the application at least has the following beneficial effects:
the radio frequency circuit that this application embodiment provided, through setting the resistance of resistance to predetermined value, make when production test, the test pad is connected with outside test equipment, the mould of radio frequency transceiver circuit's load impedance is at the default setting, make the reflection coefficient who obtains through load impedance be less than the default, when test emission index, can not produce the load and pull, thereby can improve the test accuracy, and can not exert an influence to the measurement of indexes such as signal quality EVM (Error Vector Magnitude), error Vector amplitude). Therefore, when the test pad is used for non-production test, the test pad is not connected with external test equipment, the extra insertion loss generated by the radio frequency circuit is smaller than a preset insertion loss value, and the influence of the extra insertion loss is basically avoided.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram illustrating a circuit principle of an RF circuit during production test in the related art;
fig. 2 is a schematic circuit schematic diagram of an rf circuit during production test according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of another RF circuit provided in an embodiment of the present application during production test;
FIG. 4 is a schematic diagram illustrating a schematic circuit diagram of another RF circuit during production test according to an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a production test according to an embodiment of the present disclosure;
fig. 6 is a schematic flowchart of a power testing method of a radio frequency circuit according to an embodiment of the present disclosure.
Reference numerals:
100-radio frequency circuit, 10-radio frequency transceiver circuit, 20-antenna module, 30-resistor, 40-test pad; the antenna comprises a WIFI module 11, a WIFI module 12, a filter circuit 21, a matching circuit 22, an antenna 41, a signal pad 42 and a grounding pad 42;
51-a first radio frequency line, 52-a second radio frequency line, 53-a third radio frequency line, 54-a fourth radio frequency line, 55-a fifth radio frequency line, 61-a first pad, 62-a second pad;
200-test probe, 300-test meter, 400-controller.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
In the prior art, when in production test, a test instrument is connected with a test pad through a test probe for testing. However, during production test, the antenna module is not disconnected from the rf transceiver circuit, and the antenna module may cause a bias effect on the load impedance of the rf transceiver circuit, thereby causing a test error.
In order to solve the technical problem of test errors caused during production test in the prior art, the following two improvement schemes are adopted in the related art.
In an improved technical scheme, a test is carried out through a manual test point, assuming that the antenna impedance is 50 ohms, the characteristic impedance of a radio frequency line is 50 ohms, the load impedance seen from a radio frequency transceiver circuit is not 50 ohms, the load impedance of the radio frequency transceiver circuit is changed into 25 ohms under the influence of the antenna impedance, and the calculated reflection coefficient S11= -9.54db is obtained. However, when the improved scheme is adopted, when a transmitting target is tested, the actual power of a PA (power amplifier) port of a radio frequency transceiving circuit can be changed due to load traction, and a power test error is caused; moreover, due to load pulling, the linearity of a PA (power amplifier) of the radio frequency transceiver circuit is also changed, and indexes such as signal quality EVM (Error Vector Magnitude) are deteriorated.
In another modification, as shown in fig. 1, a dedicated test switch is connected in series between the rf transceiver circuit and the antenna module, and the test switch automatically disconnects the antenna module during production test, and is only connected to the test probe. When the production test is not carried out, namely when the production test is carried out normally, the connection between the probe and the test switch is disconnected, and the radio frequency transceiving circuit and the antenna module are communicated through the test switch. However, for products such as internet of things modules with sensitive prices, the cost of the products can be increased by testing the switch device.
The application provides a radio frequency circuit, a power test method thereof, a communication module and wireless terminal equipment, and aims to solve the technical problems.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments. These several specific embodiments may be combined with each other below, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
The embodiment of the present application provides an rf circuit 100, as shown in fig. 2 and fig. 3, the rf circuit 100 includes an rf transceiver circuit 10, an antenna module 20, a resistor 30, and a test pad 40.
The rf transceiver circuit 10 is connected to the antenna module 20 through a first rf line 51.
One end of the resistor 30 is connected with the first radio frequency line 51, and the other end of the resistor 30 is connected with the test pad 40; wherein, the resistance value of the resistor 30 is greater than the preset resistance value.
During production test, the test pad 40 is connected with external test equipment, and the mode of the load impedance of the radio frequency transceiver circuit 10 is within a preset range, so that the reflection coefficient obtained through the load impedance is smaller than a preset value; in the non-production test, the test pad 40 is not connected to the external test equipment, and theoretically, the resistor 30 is open-circuited and hung on the first rf line 51, so that no additional insertion loss is generated. In fact, it can be obtained through testing that the extra insertion loss generated by the rf circuit 100 is smaller than the preset insertion loss value, and the influence of the extra insertion loss is not substantially brought. Wherein the external test equipment includes a test probe 200 and a test meter 300.
It should be noted that, during production test, the load impedance of the rf transceiver circuit includes the resistor 30, the impedance of the antenna module 20, and the impedance of the test meter 300.
The radio frequency circuit 100 provided in the embodiment of the present application can reduce the cost by using the resistor 30 and the test pad 40 instead of a dedicated test switch used in the related art. Meanwhile, the resistance value of the resistor 30 is set to be a preset value, so that during production test, the test pad 40 is connected with external test equipment, the load impedance of the radio frequency transceiver circuit 10 is within a preset range, the reflection coefficient obtained through the load impedance is smaller than the preset value, and when the emission index is tested, load traction cannot be generated, so that the test accuracy can be improved, and the measurement of indexes such as signal quality EVM (Error Vector Magnitude) cannot be influenced. So that the test pad 40 is not connected to an external test device during non-production test, and theoretically, the resistor 30 is hung on the first rf line 51 in an open circuit, thereby generating no additional insertion loss. In fact, it can be obtained through testing that the extra insertion loss generated by the rf circuit 100 is smaller than the preset insertion loss value, and the influence of the extra insertion loss is not substantially brought.
Therefore, the radio frequency circuit 100 provided by the embodiment of the application, through adopting the resistor 30 and the test pad 40, and set the resistance of the resistor 30 to a preset value, can reduce cost, and when the production test is performed, load traction cannot be generated, so that the test accuracy can be improved, and the measurement of indexes such as signal quality EVM (Error Vector Magnitude) cannot be influenced, when the non-production test is performed, the extra insertion loss generated by the radio frequency circuit 100 can be obtained through the test and is smaller than the preset insertion loss value, and the influence of extra insertion loss can not be basically brought.
The resistance of the resistor 30 is not specifically limited, the resistance of the resistor 30 can meet the insertion loss compensation requirement during comprehensive production and test and the load impedance requirement of the radio frequency transceiver circuit, and the influence on the load and insertion loss of the radio frequency transceiver circuit during normal work is comprehensively debugged and selected. For example, when the reflection coefficient S11 of the rf transceiver circuit 10 is required to be smaller than-15 db (a preset value) when the test power is performed from the test pad 40, the resistance of the resistor 30 may be larger than 68 ohms. I.e., the predetermined resistance value is 68 ohms, the resistance value of the resistor 30 is greater than 68 ohms.
In some embodiments, as shown in fig. 2 and 3, the test pad 40 includes two separate pads, a signal pad 41 and a ground pad 42; the resistor 30 is connected to the signal pad 41; the signal pad 41 and the ground pad 42 are connected to external test equipment, respectively, at the time of production test; in the non-production test, neither the signal pad 41 nor the ground pad 42 is connected to the external test equipment, and in the production test and the non-production test, the signal pad 41 and the ground pad 42 are not connected.
In some embodiments, as shown in fig. 2, the resistor 30 is correspondingly provided with a first pad 61 and a second pad 62, one end of the resistor 30 is connected with the first pad 61, and the other end of the resistor 30 is connected with the second pad 62; the first pad 61 is disposed on the first rf line 51, and one end of the resistor 30 is connected to the first rf line 51 through the first pad 61.
In other embodiments, as shown in fig. 3, the resistor 30 is correspondingly provided with a first pad 61 and a second pad 62, the first pad 61 is not provided on the first rf line 51, one end of the resistor 30 is connected to the first rf line 51 through the second rf line 52, the second pad 62 is connected to the signal pad 41, and the other end of the resistor 30 is connected to the signal pad 61 through the second pad 62 (not shown in the figure); alternatively, the second pad 62 is not connected to the signal pad 41, and the other end of the resistor 30 is connected to the signal pad 41 through the third rf line 53.
The length of the second rf line 52 is smaller than a first preset length, and the length of the third rf line 53 is smaller than a second preset length. Preferably, as shown in fig. 2, the first pad 61 is disposed on the first rf line 51, one end of the resistor 30 is connected to the first rf line 51 through the first pad 61, the second pad 62 is not connected to the signal pad 41, and the other end of the resistor 30 is connected to the signal pad 41 through the third rf line 53.
Thus, in the embodiment of the present application, instead of placing the signal pad 41 next to the second pad 62, so that the signal pad 41 is connected to the resistor 30, the signal pad 41 is connected to the second pad 62 through a short radio frequency line (i.e., the third radio frequency line 53), so that the signal pad 41 is connected to the resistor 30, and thus the signal pad 41 and the ground pad 42 can be pulled away, so that when the PCB is wired, the requirements of the structure and the size are not limited, and the PCB layout and the wiring are more convenient.
In some embodiments, the ratio of the speed of light to the frequency of the RF signals transmitted or received by the RF transceiver circuitry 10 is 0.01 times the first predetermined length value, i.e., the length of the second RF line 52 is less than 0.01C/F, where C is the speed of light 3.10 ^8m/s (i.e., 3.10) 8 m/s), the unit of the speed of light is meter/second, F is the frequency of the radio frequency signal transmitted or received by the radio frequency transceiver circuit, and the unit of the frequency is Hz (Hertz).
In some embodiments, the ratio of the speed of light with the second predetermined length value of 0.025 times to the frequency of the radio frequency signal transmitted or received by the radio frequency transceiver circuit 10, i.e. the length of the third radio frequency line 53 is less than 0.025. C/F, where C is the speed of light 3.10 ^8m/s (i.e. 3.10) 8 m/s), the unit of the speed of light is meter/second, F is the frequency of the radio frequency signal transmitted or received by the radio frequency transceiver circuit, and the unit of the frequency is Hz (Hertz).
The following describes the principle of the rf circuit 100 provided in the embodiment of the present application in detail with reference to fig. 2 and fig. 3, specifically as follows:
1. when the production test is performed, the test pad 40 is connected to the test probe 200, and when the value of the resistor 30 is proper, that is, the resistance value of the resistor 30 is greater than 68 ohms, the load impedance of the rf transceiver circuit 10 is almost determined by the antenna module 20. For example, when the resistance 30 is 200 ohms and the impedance of the test meter 300 is 50 ohms, it is assumed that the impedance of the antenna module 20 measured by the test meter 300 is 50 ohms (the 50 ohms is obtained by a test performed in a development and design stage).
Then the load impedance of the rf transceiver circuit 10 is the impedance of the first branch (the impedance of the antenna module 20) and the impedance of the second branch (the sum of the resistance of the resistor 30 and the impedance of the test meter 300, i.e. 200 ohm +50 ohm =250 ohm) connected in parallel, and the load impedance Z is calculated L And is 41.67 ohms.
See expression (one), as follows:
wherein, testingImpedance Z of meter 300 0 =50 ohm, load impedance Z L And (d) =41.67 ohms, which is substituted into expression (one), resulting in S11= -20.8db. In general, S11<At-15 db, i.e., S11 is less than-15 db (preset value), the qualification is that the antenna module 20 does not exert a pulling influence on the PA (power amplifier) of the rf transceiver circuit 10, i.e., S11 is less than-15 db.
Therefore, the reflection coefficient S11= -20.8db can be obtained by the above expression (one), and thus, when the production test is performed, the antenna module 20 does not exert a pulling influence on the PA (power amplifier) of the radio frequency transceiver circuit 10.
2. When the radio frequency circuit 100 is in normal operation, the test pad 40 is not connected to the test probe 200, the radio frequency transceiver circuit 10 is connected to the antenna module 20 through the first radio frequency line 51, only one end of the resistor 30 is connected to the first radio frequency line 51, and the other end of the resistor 30 is connected to the test pad 40 through the third radio frequency line 53. That is, when the rf circuit 100 is operating normally, a 200 ohm resistor is connected to a small segment of the rf line and the test pad, and the resistor 30 is open-circuited on the first rf line 51, theoretically accounting for 0db of extra insertion loss. In practice, however, a small capacitance is equivalent due to the reactance effect of the short rf line and the test pad, and thus the additional insertion loss caused by the test resistor 30 is less than 0.2db through practical testing. The present example is an additional insertion loss caused by the test resistor 30 when the frequency of the rf signal transmitted or received by the rf transceiver circuit 10 is 2.4G. In general, the extra insertion loss is less than 0.5db (the preset insertion loss value) and is acceptable, and the added 200 ohm resistance hardly brings extra insertion loss.
Alternatively, the resistor 30 may be an axial lead resistor or a leadless resistor (chip resistor). Preferably, the resistor 30 is a chip resistor, which may be a 0201 package chip resistor, an 0402 package chip resistor, a 0603 package chip resistor, or the like, and the present application is not limited thereto.
On the PCB layout trace, as shown in fig. 2 and 3, the two pads for mounting the resistor 30 are a first pad 61 and a second pad 62, the resistor 30 is generally disposed near the first rf line 51, the first pad 61 for mounting the resistor 30 may be disposed on the first rf line 51 or not disposed on the first rf line 51, and the resistor 30 and the first rf line 51 are connected through the second rf line 52.
Optionally, the signal pad 41 is generally a circular PCB pad, but is not limited to the circular shape and may also be a square or other shape, a ground pad 42 is further disposed near the signal pad 41, and the shape of the ground pad 42 is not limited. In performing production testing, a general test probe 200 is connected to the signal pad 41 and the ground pad 42. The test probe 200 is then connected to the test meter 300 by a radio frequency coaxial cable.
Optionally, the radio frequency transceiver circuit 10 is mainly used to perform radio frequency transceiving modulation, transceiving gain radio frequency amplification, radio frequency switch switching, or duplexer combiner, etc. The rf transceiver circuit 10 may be a wireless integrated chip, or a rf transceiver plus peripheral related circuits.
Optionally, the radio frequency transceiver circuit 10 may include a 4G wireless module, a 5G wireless module, a WIFI module, and the like, which is not limited in this application.
Preferably, as shown in fig. 4, the radio frequency transceiver circuit 10 includes a WIFI module 11 and a filter circuit 12; the WIFI module 11 is connected with the filter circuit 12 through a fourth radio frequency line 54; the filter circuit 12 is connected to the antenna module 20 via a first radio frequency line 51.
Optionally, the WIFI module 11 includes a WIFI integrated chip. The filter circuit 12 includes an LC filter (passive filter).
In some embodiments, as shown in fig. 4, the antenna module 20 includes a matching circuit 21 and an antenna 22; the matching circuit 21 is connected to the rf transceiver circuit 10 via a first rf line 51 and to the antenna 22 via a fifth rf line 55.
Optionally, the matching circuit 21 is used to complete antenna impedance matching. The general matching circuit 21 may be a PI type, an L type, a T type, etc., and the present application is not limited thereto, and the specific setting manner of the matching circuit 21 is the same as that of the prior art, and is not described herein again.
Optionally, the radio frequency lines in this application all refer to PCB radio frequency lines arranged in a PCB (printed circuit board), and the radio frequency lines may be PCB radio frequency microstrip lines, PCB coplanar waveguide lines, and PCB grounded coplanar waveguide lines. Alternatively, antennas are typically integrated into wireless terminal devices, some antennas are integrated onto a PCB (printed circuit board), and some antennas are fabricated on a structural housing of the wireless terminal device.
Based on the same inventive concept, the present application provides a communication module including the rf circuit 100 according to any of the above embodiments.
Optionally, the communication module further includes other circuits, and the other circuits include a CPU control circuit, a baseband processing circuit, an interface circuit, a power supply circuit, and the like, which is not limited in this application.
The communication module provided in the embodiment of the present application has the same inventive concept and the same advantageous effects as those of the previous embodiments, and the content not shown in detail in the communication module may refer to the previous embodiments and is not described herein again.
Based on the same inventive concept, an embodiment of the present application provides a wireless terminal device, including the communication module provided in any of the above embodiments.
The wireless terminal device provided in the embodiment of the present application has the same inventive concept and the same advantageous effects as those of the previous embodiments, and the content not shown in detail in the wireless terminal device may refer to the previous embodiments, and is not described again here.
Based on the same inventive concept, as shown in fig. 6, an embodiment of the present application provides a power testing method for an antenna module of a radio frequency circuit, where the power testing method includes:
s1, obtaining first power through a test pad;
s2, obtaining a compensation insertion loss value through a mode of the impedance of the antenna module, the resistance value of the resistor and a mode of the impedance of the testing equipment;
s3, obtaining the power at the antenna port of the radio frequency circuit based on the first power and the compensation insertion loss value; the power at the antenna port refers to the power transmitted by the radio frequency transceiver circuit and entering the antenna module, or the power received by the radio frequency transceiver circuit from the antenna module.
According to the power test method for the radio frequency circuit, the first power is obtained through the test pad, and the first power is compensated through the insertion loss compensation value, so that the power at the antenna port (namely, the position A in the figures 1, 2, 3 and 4) of the radio frequency circuit after compensation can be obtained, and the test method is simple and convenient.
Optionally, obtaining the compensation insertion loss value through a mode of an impedance of the antenna module, a resistance value of the resistor, and a mode of an impedance of the test equipment, includes:
obtaining a first parameter (r) based on a mode (r 1) of the impedance of the antenna module, a resistance value (r 2) of the resistor and a mode (50) of the impedance of the test equipment;
obtaining a second parameter (p) based on the first parameter (r) and a mode (r 1) of the impedance of the antenna module;
obtaining a third parameter (q) based on a mode (r 1) of the impedance of the antenna module and a resistance value (r 2) of the resistor;
and obtaining a compensation insertion loss value (A) based on the second parameter (p) and the third parameter (q).
Optionally, obtaining the power of the antenna module of the radio frequency circuit based on the first power and the compensation insertion loss value includes:
and adding the first power and the compensation insertion loss value to obtain the power at the antenna port of the radio frequency circuit.
The following describes in detail a power testing method of the rf circuit 100 provided in the embodiment of the present application with reference to fig. 2, fig. 3, and fig. 5, specifically as follows:
the power at position a is the power at the antenna port. In the related art, as shown in fig. 1, when measuring the power at the a position, the antenna module 20 needs to be disconnected from the a position, and a test switch is added to be connected in series between the rf transceiver circuit and the antenna module, so that when a production test is performed, the test switch is switched to a test probe to automatically disconnect the rf transceiver circuit from the antenna module. When the test is not produced, no test probe is connected, and the test switch is connected to the antenna module. However, for products such as internet of things modules with sensitive prices, testing the switch device increases the cost of the products.
The test equipment includes a test probe 200 and a test meter 300. The mode of the impedance of the test equipment is the mode of the impedance of the test meter 300.
Illustratively, the impedance of the antenna module 20 may be measured in a modulo r1 ohm, the resistance of the resistor 30 in a modulo r2 ohm, and the impedance of the test meter 300 in a modulo Z ohm 0 At 50 ohms, the compensated insertion loss value a (db) can be obtained by the following expression.
A＝10·LOG(q 2 10-LOG (1-p) expression (V)
If the transmitted power (first power) of the radio frequency transceiver circuitry 10 is measured as B dbm at the test pad 40, the power at the antenna port (at the a position in the figure) may be equivalent to (a + B) dbm.
For example, r1=50 ohms and r2=200 ohms, the first parameter r =41.67 ohms can be obtained by the above expression (two); a second parameter p =0.00826 can be obtained through the expression (three); the third parameter q =5 can be obtained by the above expression (four). And calculating the compensated insertion loss value A =14.77db by the expression (five).
As can be seen from the above, Z 0 =50 ohm, Z L And (d) =41.67 ohms, which is substituted into expression (one), resulting in S11= -20.8db. In general, S11<15db (preset), i.e. S11 less than 15db (preset) is acceptable.
Therefore, the reflection coefficient S11= -20.8db can be obtained by the above expression (one), and thus, when the production test is performed, the antenna module 20 does not exert a pulling influence on the PA (power amplifier) of the radio frequency transceiver circuit 10.
In the embodiment, the power (power at the position A) at the antenna port is calculated by adding the resistor and the test pad, so that a special test switch is not needed, and the cost is saved. At least the following beneficial effects can be achieved:
1) The radio frequency circuit 100 provided in the embodiment of the present application can reduce the cost by using the resistor 30 and the test pad 40 instead of a dedicated test switch used in the related art.
2) Through setting the resistance of resistance 30 to predetermined value for when production test, test pad 40 is connected with external test equipment, and the mould of the load impedance of radio frequency transceiver circuit 10 is in predetermineeing the within range, makes the reflection coefficient who obtains through load impedance be less than the default, when testing emission target, can not produce the load and pull, thereby can improve the test accuracy, can not exert an influence to the measurement of indexes such as signal quality EVM (Error Vector Magnitude, error Vector amplitude) moreover.
3) In the non-production test, the test pad 40 is not connected to the external test equipment, and theoretically, the resistor 30 is in an open circuit and hangs on the first radio frequency line 51, so that no additional insertion loss is generated. In fact, the test can obtain that the extra insertion loss generated by the radio frequency circuit is smaller than the preset insertion loss value, and the influence of the extra insertion loss is basically not brought.
4) In the embodiment of the present application, instead of placing the signal pad 41 next to the second pad 62, so that the signal pad 41 is connected to the resistor 30, the signal pad 41 is connected to the second pad 62 through a short radio frequency line (i.e., the third radio frequency line 53), so that the signal pad 41 is connected to the resistor 30, and thus the signal pad 41 and the ground pad 42 can be pulled away, so that when the PCB is wired, the requirements on structure and size are not limited, and the PCB layout and wiring are more convenient.
5) According to the power test method of the radio frequency circuit, the first power is obtained through the test pad, the first power is compensated through the insertion loss compensation value, the power at the antenna port of the radio frequency circuit after compensation can be obtained, and the test method is simple and convenient.
Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a few embodiments of the present application and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present application, and that these improvements and modifications should also be considered as the protection scope of the present application.
Claims (12)
1. A radio frequency circuit, comprising: the radio frequency transceiver circuit, the antenna module, the resistor and the test pad;
the radio frequency receiving and generating circuit is connected with the antenna module through a first radio frequency line;
one end of the resistor is connected with the first radio frequency line, and the other end of the resistor is connected with the test bonding pad; wherein:
during production test, the test pad is connected with external test equipment, the resistance value of the resistor is larger than a preset resistance value, so that the mode of the load impedance of the radio frequency transceiver circuit is in a preset range, and the reflection coefficient obtained through the load impedance is smaller than a preset value;
the test pads are not connected to external test equipment during non-production testing.
2. The radio frequency circuit of claim 1,
the preset resistance value is 68 ohms.
3. The radio frequency circuit of claim 1, wherein the test pads include signal pads and ground pads;
the resistor is connected with the signal bonding pad;
during production test, the signal pad and the grounding pad are respectively connected with external test equipment;
and in the non-production test, the signal pad and the grounding pad are not connected with external test equipment.
4. The radio frequency circuit of claim 3,
the resistor is correspondingly provided with a first bonding pad and a second bonding pad, one end of the resistor is connected with the first bonding pad, and the other end of the resistor is connected with the second bonding pad;
the first bonding pad is arranged on the first radio frequency line, and one end of the resistor is connected with the first radio frequency line through the first bonding pad; or the first pad is not arranged on the first radio frequency line, and one end of the resistor is connected with the first radio frequency line through a second radio frequency line;
the second bonding pad is connected with the signal bonding pad, and the other end of the resistor is connected with the signal bonding pad through the second bonding pad; or the second bonding pad is not connected with the signal bonding pad, and the other end of the resistor is connected with the signal bonding pad through a third radio frequency line;
the length of the second radio frequency line is smaller than a first preset length value, and the length of the third radio frequency line is smaller than a second preset length value.
5. The radio frequency circuit of claim 4,
the ratio of the light speed with the first preset length value of 0.01 times to the frequency of the radio-frequency signal transmitted or received by the radio-frequency transceiver circuit;
the second preset length value is a ratio of 0.025 times of the speed of light to the frequency of the radio frequency signal transmitted or received by the radio frequency transceiver circuit.
6. The radio frequency circuit according to claim 1, wherein the radio frequency transceiver circuit comprises a WIFI module and a filter circuit;
the WIFI module is connected with the filter circuit through a fourth radio frequency line;
the filter circuit is connected with the antenna module through the first radio frequency line.
7. The radio frequency circuit of claim 1, wherein the antenna module comprises: a matching circuit and an antenna;
the matching circuit is connected with the radio frequency transceiving circuit through the first radio frequency line and is connected with the antenna through a fifth radio frequency line.
8. A communication module comprising a radio frequency circuit as claimed in any one of claims 1 to 7.
9. A wireless terminal device, characterized in that it comprises a communication module according to claim 8.
10. A method for power testing a radio frequency circuit as claimed in any one of claims 1 to 7, comprising:
obtaining a first power through the test pad;
obtaining a compensation insertion loss value through a mode of impedance of the antenna module, the resistance value of the resistor and a mode of impedance of the test equipment;
obtaining the power at an antenna port of the radio frequency circuit based on the first power and the compensation insertion loss value; the power at the antenna port refers to the power transmitted by the radio frequency transceiver circuit and entering the antenna module, or the power received by the radio frequency transceiver circuit from the antenna module.
11. The method for testing power of a radio frequency circuit according to claim 10, wherein the obtaining of the compensation insertion loss value through a mode of an impedance of the antenna module, a resistance value of the resistor, and a mode of an impedance of the test equipment comprises:
obtaining a first parameter based on a mode of the impedance of the antenna module, a resistance value of the resistor and a mode of the impedance of the test equipment;
obtaining a second parameter based on the first parameter and a modulus of the impedance of the antenna module;
obtaining a third parameter based on a mode of the impedance of the antenna module and a resistance value of the resistor;
and obtaining a compensation insertion loss value based on the second parameter and the third parameter.
12. The method of claim 10, wherein the deriving the power of the antenna module of the rf circuit based on the first power and the compensated insertion loss value comprises:
and adding the first power and the compensation insertion loss value to obtain the power at the antenna port of the radio frequency circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211525061.0A CN115882890A (en) | 2022-11-30 | 2022-11-30 | Radio frequency circuit and power test method thereof, communication module and wireless terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211525061.0A CN115882890A (en) | 2022-11-30 | 2022-11-30 | Radio frequency circuit and power test method thereof, communication module and wireless terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115882890A true CN115882890A (en) | 2023-03-31 |
Family
ID=85765129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211525061.0A Pending CN115882890A (en) | 2022-11-30 | 2022-11-30 | Radio frequency circuit and power test method thereof, communication module and wireless terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115882890A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116708624A (en) * | 2023-06-13 | 2023-09-05 | 云谷（固安）科技有限公司 | Multifunctional assembly, wireless communication device and display panel |
-
2022
- 2022-11-30 CN CN202211525061.0A patent/CN115882890A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116708624A (en) * | 2023-06-13 | 2023-09-05 | 云谷（固安）科技有限公司 | Multifunctional assembly, wireless communication device and display panel |
| CN116708624B (en) * | 2023-06-13 | 2024-02-20 | 云谷（固安）科技有限公司 | Multifunctional assembly, wireless communication device and display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI593252B (en) | Test station for wireless devices and methods for calibration thereof | |
| CN105548978B (en) | A kind of phased array antenna active refelction coefficient test system and method | |
| CN109309749B (en) | Line loss calibration method and system | |
| CN111426940B (en) | Test system of radar chip | |
| CN103414526A (en) | Test system and test method of radio frequency identification index | |
| CN115882890A (en) | Radio frequency circuit and power test method thereof, communication module and wireless terminal equipment | |
| CN107994959B (en) | Method and device for detecting standing-wave ratio of remote radio unit RRU | |
| CA2771815A1 (en) | Hybrid reflectometer system (hrs) | |
| CN103995185A (en) | Method for carrying out insertion loss test through simple probe | |
| CN112816787A (en) | Line loss point inspection system and method | |
| CN103795482B (en) | A kind of antenna transmission performance adjusting method | |
| CN105187135B (en) | Test the method and system of wireless device | |
| CN2724306Y (en) | Radio frequency automatic detector | |
| CN101285858B (en) | Radio frequency stationary wave and power simple detection device based on UHF frequency range | |
| CN110470973B (en) | Automatic on-chip test system for noise coefficient of low-noise amplifier chip | |
| KR101298428B1 (en) | RF signal test system and the method thereof | |
| CN108107350A (en) | A kind of long-range wide-band amplitude versus frequency characte measuring instrument | |
| EP1476765B1 (en) | Radio frequency power generation and power measurement | |
| WO2020217088A1 (en) | Method and apparatus for over the air calibration for integrated antenna vswr monitoring | |
| CN108923872A (en) | A kind of repeater passband fluctuation calibration method and system | |
| CN101598751B (en) | Measuring method and measuring device of dynamic impedance of high-power radio-frequency module | |
| CN101730217A (en) | Improved radio frequency power control method and terminal | |
| US20040138844A1 (en) | Impedance standard substrate and correction method for vector network analyzer | |
| US6510392B2 (en) | In-situ test for embedded passives | |
| CN115372740B (en) | RF chip line loss test method, system, readable storage medium and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |