CN108955469B - Contact stroke measuring method during interaction of machine disc and back plate - Google Patents
Contact stroke measuring method during interaction of machine disc and back plate Download PDFInfo
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- CN108955469B CN108955469B CN201810494870.7A CN201810494870A CN108955469B CN 108955469 B CN108955469 B CN 108955469B CN 201810494870 A CN201810494870 A CN 201810494870A CN 108955469 B CN108955469 B CN 108955469B
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
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Abstract
The invention discloses a contact stroke measuring method during the interaction of a machine disc and a back plate, and relates to the field of the interaction test of the machine disc and the back plate. The method comprises the following steps: measuring the capacitance of the differential pair wiring of the machine disc in the process of the mutual matching of the machine disc and the back plate; and when the capacitance reaches a specified threshold value corresponding to the stable contact state of the connecting terminal, measuring the displacement distance of the machine disc, when the connecting terminal is in a locking state, acquiring the displacement distance of the machine disc, and determining the contact stroke between the machine disc and the back plate according to the displacement distance of the machine disc. The invention can accurately measure the contact stroke of the machine disc and the back plate on the basis of lower measurement requirements, has higher measurement precision, can be suitable for the machine disc and the back plate of a high-speed signal connector with smaller contact stroke, and is very suitable for popularization.
Description
Technical Field
The invention relates to the field of testing of the mutual matching of a machine disc and a back plate, in particular to a method for measuring the contact stroke when the machine disc and the back plate are matched.
Background
When the machine disc and the backboard are mutually matched (namely the process that the machine disc is inserted into the backboard), the connecting terminal of the connector of the backboard and the machine disc (the connecting terminal of the backboard is a straight male pin, and the connecting terminal of the machine disc is a bent female terminal) can be in a non-contact state (figure 1-1, namely the connecting terminal of the machine disc and the backboard is not in contact), a contact starting state (figure 1-2, namely the connecting terminal of the machine disc and the backboard is in contact), a stable contact state (figure 1-3, namely the connecting terminal of the machine disc and the backboard is in stable contact), and finally a locking state (namely the connecting terminal of the machine disc and the backboard is fixed and the machine disc and the backboard are locked). The connection terminal of the machine disc starts from the position corresponding to the stable contact state and ends to the position corresponding to the locking state, namely the contact stroke of the machine disc and the back plate.
If the contact stroke of the machine disc and the back plate is too large (the connecting terminal is too long), a strong antenna effect can be generated under the high-frequency condition, and the machine disc and the back plate are not suitable for high-speed signal transmission; if the contact stroke is too small (the connection terminal is too short), the contact reliability is reduced or even no contact is caused due to various matching and processing errors in practical application.
Therefore, the contact stroke of the machine disc and the back plate is very important for the reliability of the communication equipment, the short and effective contact stroke has weak antenna effect under the high-frequency condition, high-speed signal transmission is facilitated, the size of the connector is reduced, and the size of the communication equipment is reduced and the transmission capacity is improved. In order to ensure the reliability of the communication equipment, the related standard requires that the effective contact stroke of the signal connector is not less than 0.51 mm; when the contact stroke of the machine disc and the back plate is different from the effective contact stroke, the size of the machine disc connector needs to be adjusted.
At present, the method for testing the contact stroke between a machine disc and a back plate comprises the following steps: in the process of inserting the machine disc into the backboard, when the connecting terminal of the connector of the backboard and the machine disc is in a stable contact state, the distance a between the machine disc and the backboard is measured, when the connecting terminal of the connector of the backboard and the machine disc is in a locking state, the distance b between the machine disc and the backboard is measured, and the contact stroke c between the machine disc and the backboard is obtained according to a and b, wherein c is a-b. The conditions that the contact stroke measured by the method is consistent with the actual stroke are as follows: 1. the measuring surfaces of the back plate and the chassis are planes (so that a-b is guaranteed to be the actual c); 2. the position of the connection terminal in a stable contact state is accurately known.
However, the back plate and the chassis may not be completely flat due to the deviation of the actual machining and mounting fit, and the position of the connection terminal in a stable contact state is determined empirically (because the connection terminal is not visible when in contact). Therefore, the conditions in accordance with the actual stroke in the method all have deviation, so that the finally measured contact stroke result has larger error, the measurement precision is lower, the measurement requirement is higher, and the method is not suitable for a machine disc and a back plate of a high-speed signal connector with smaller contact stroke.
Disclosure of Invention
Aiming at the defects in the prior art, the invention solves the technical problems that: on the basis of lower measurement requirements, the contact stroke of the machine disc and the back plate is accurately measured; the invention has higher measurement precision, can be suitable for a machine disc and a back plate of a high-speed signal connector with smaller contact stroke, and is very suitable for popularization.
In order to achieve the above object, the present invention provides a method for measuring a contact stroke when a chassis and a backplane are mated, in which the chassis and the backplane each include a differential pair wiring and a connector, and the differential pair wiring is connected to a connection terminal of the connector, the method including the steps of: measuring the capacitance of the differential pair wiring of the machine disc in the process of the mutual matching of the machine disc and the back plate; and when the capacitance reaches a specified threshold value corresponding to the stable contact state of the connecting terminal, measuring the displacement distance of the machine disc, when the connecting terminal is in a locking state, acquiring the displacement distance of the machine disc, and determining the contact stroke between the machine disc and the back plate according to the displacement distance of the machine disc.
On the basis of the technical scheme, the method specifically comprises the following steps:
s1: acquiring the capacitance C1 of the chassis differential pair wiring and the capacitance C2 of the backplane differential pair wiring, determining a specified threshold C3 according to C1 and C2, and turning to S2 when the connecting terminal is in a stable contact state;
s2: measuring the capacitance C of the differential pair wiring of the machine disk in the process of inserting the machine disk into the back plate; when the capacitance C is equal to C3, determining that the connecting terminal is in a stable contact state, starting to measure the displacement distance of the machine disc, and when the connecting terminal is in a locking state, acquiring the displacement distance of the machine disc; and determining the contact stroke of the machine disc and the back plate according to the displacement distance of the machine disc.
On the basis of the above technical solution, in the process of inserting the chassis into the backplane in S2, the process of measuring the capacitance C of the differential pair wiring of the chassis includes: when the connecting terminal is in a non-contact state, starting to measure the capacitance C of the differential pair wiring of the machine disc, and when the capacitance C changes, determining that the connecting terminal is in a contact starting state and starting to measure the pseudo-contact displacement distance of the machine disc; after determining that the connection terminal is in the stable contact state when the capacitance C is C3 as described in S2, the method further includes the following steps: and acquiring the pseudo contact displacement distance of the chassis, and determining the pseudo contact stroke of the chassis and the back plate according to the pseudo contact displacement distance of the chassis.
On the basis of the above technical solution, the procedure of determining that the connection terminal is in the stable contact state when the capacitance C is equal to C3 in S2 is as follows: when the capacitor C is monitored to be C3, judging whether the capacitor C changes within a specified time, if so, determining that the connecting terminal is not in a stable contact state; otherwise, the connection terminal is determined to be in a stable contact state.
On the basis of the technical scheme, the specified time is more than 5 s.
On the basis of the technical scheme, the displacement distance and the pseudo-contact displacement distance of the chassis are measured through a dial indicator in S2, and the dial indicator is fixed at the tail end of the connector of the chassis.
On the basis of the above technical solution, the process of determining the pseudo-contact stroke of the disk and the backplane according to the disk pseudo-contact displacement distance in S2 includes: and 3 pseudo-contact stroke parameters are obtained, each pseudo-contact stroke parameter represents 1 measured machine disk pseudo-contact displacement distance, and the average value of all the pseudo-contact stroke parameters is taken as the pseudo-contact stroke of the machine disk and the back plate.
On the basis of the above technical solution, the process of determining the contact stroke between the chassis and the back plate according to the chassis displacement distance in S2 includes: and 3 contact stroke parameters are obtained, each contact stroke parameter represents 1 measured machine disc displacement distance value, and the average value of all the contact stroke parameters is taken as the contact stroke of the machine disc and the back plate.
On the basis of the technical scheme, the specified threshold C3 is C1+ C2 in S1.
Compared with the prior art, the invention has the advantages that:
(1) compared with the prior art that the contact stroke is estimated by measuring the distance between the machine disc and the back plate, the method and the device measure the contact stroke between the machine disc and the back plate by monitoring the change of the capacitance, do not need to consider whether the machine disc and the back plate are planes or not in the measuring process, and can accurately know the position of the connecting terminal in a stable contact state through the change of the capacitance. Therefore, the invention can accurately measure the contact stroke of the machine disc and the back plate on the basis of lower measurement requirements, has higher measurement precision, can be suitable for the machine disc and the back plate of a high-speed signal connector with smaller contact stroke, and is very suitable for popularization.
(2) According to the invention, the contact stroke of the machine disc and the back plate is measured in a manner of counting by the dial indicator, and the test distribution points of the dial indicator can be flexibly distributed at the most obvious position of actual deformation; meanwhile, the dial indicator test probe is similar to a detection point, the flatness of the back plate and the dial indicator has almost no influence on the test result of the dial indicator probe, the measurement error is reduced, the back plate does not need to be processed, the state of the connecting terminal is determined only through the change of the capacitance, the stroke counting starting point of the dial indicator is determined, the dial indicator is inserted into the dial indicator step by step subsequently, and the contact stroke of the dial indicator and the back plate can be displayed on the dial indicator visually until the dial indicator is pulled to the locking position (at the moment, the connecting terminal is in the locking state, and the stroke counting end position of the dial indicator is displayed on the dial indicator.
(3) When the state of the connecting terminal is determined by monitoring the change of the capacitance, the state of the connecting terminal is determined immediately instead of when the monitored capacitance reaches a threshold value, but the state of the connecting terminal is determined only when the value of the capacitance is not changed within a certain time, so that errors caused by the floating of the capacitance are avoided, and the correctness of the known state of the connecting terminal is further ensured.
(4) The invention also measures the pseudo contact stroke from the initial contact state to the stable contact state of the machine disk and the back plate, and the pseudo contact stroke can provide reference for designers, thereby facilitating the subsequent optimization and adjustment of the machine disk by the designers.
Drawings
FIG. 1-1 is a schematic structural diagram of a backplane and a chassis connecting terminal in a non-contact state in the prior art;
fig. 1-2 are schematic structural views illustrating a connection terminal of a backplane and a chassis in a contact starting state in the prior art;
FIGS. 1-3 are schematic structural views illustrating a stable contact state between a backplane and a connection terminal of a chassis in the prior art;
FIG. 2-1 is a schematic structural diagram of a connection terminal of a backplane and a chassis in a non-contact state according to an embodiment of the present disclosure;
FIG. 2-2 is a schematic structural diagram of a connection terminal of a backplane and a chassis in a contact start state according to an embodiment of the present invention;
fig. 2-3 are schematic structural diagrams illustrating the connection terminals of the back plate and the chassis in a stable contact state according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Referring to fig. 2-1, the chassis and the backplane in the embodiment of the present invention each include a differential pair wiring and a connector, where the differential pair wiring is connected to a connection terminal of the connector (the connection terminal of the backplane is a straight male pin, and the connection terminal of the chassis is a bent female terminal); on the basis, the contact stroke measuring method when the machine disc and the back plate are mutually matched comprises the following steps:
referring to fig. 2-1, in the process of matching the chassis and the back plate, the capacitance of the differential pair wiring of the chassis is measured; referring to fig. 2-3, when the capacitance reaches a specified threshold corresponding to the connection terminal being in a stable contact state, the displacement distance of the chassis starts to be measured, when the connection terminal is in a locked state, the displacement distance of the chassis is obtained, and the contact stroke between the chassis and the back plate is determined according to the displacement distance of the chassis.
The process of the invention is illustrated below by means of six examples.
The first embodiment is as follows:
the method for measuring the contact stroke during the interaction of the machine disc and the back plate in the embodiment of the invention specifically comprises the following procedures:
s1: acquiring the capacitance C1 of the chassis differential pair wiring and the capacitance C2 of the backplane differential pair wiring, determining a specified threshold C3 according to C1 and C2, wherein C3 is equal to C1+ C2 (when the connection terminal is in a stable contact state, C3 is necessarily the sum of C1 and C2), and going to S2.
S2: referring to fig. 2-1, during the process of inserting the chassis into the backplane, the capacitance C of the differential pair wiring of the chassis is measured; as shown in fig. 2-3, when the capacitance C is equal to C3, determining that the connection terminal is in a stable contact state, starting to measure the displacement distance of the chassis, and when the connection terminal is in a locked state, obtaining the displacement distance of the chassis; and determining the contact stroke of the machine disc and the back plate according to the displacement distance of the machine disc.
Example two:
based on the first embodiment, in S2, the process of measuring the capacitance C of the differential pair wiring of the chassis during the process of inserting the chassis into the backplane includes: as shown in fig. 2-1, when the connection terminal is in a non-contact state, starting to measure the capacitance C of the differential pair wiring of the machine disk, as shown in fig. 2-2, when the capacitance C changes, determining that the connection terminal is in a contact starting state, and starting to measure the pseudo-contact displacement distance of the machine disk; when the capacitance C is C3 in S2, after determining that the connection terminal is in the stable contact state, the method further includes the following steps: and acquiring the pseudo contact displacement distance of the chassis, and determining the pseudo contact stroke of the chassis and the back plate according to the pseudo contact displacement distance of the chassis.
The purpose of the second embodiment is as follows: the contact stroke of the chassis and the back plate is measured, meanwhile, the pseudo contact stroke of the chassis and the back plate is also measured, the pseudo contact stroke can provide reference for designers, and the subsequent optimization and adjustment of the chassis are facilitated for the designers.
Example three:
on the basis of the second embodiment, when the capacitance C is equal to C3 in S2, the process of determining that the connection terminal is in the stable contact state is as follows: when the capacitor C is monitored to be C3, judging whether the capacitor C changes within a specified time (more than 5s, in the embodiment, 5s), if so, determining that the connecting terminal is not in a stable contact state (at the moment, the machine disc is monitored again after the position of the machine disc is adjusted); otherwise, the connection terminal is determined to be in a stable contact state. Therefore, in the embodiment, the connection terminal is not immediately determined to be in the stable contact state when the capacitor C is monitored to be C3, but the connection terminal is determined to be in the stable contact state only when the value of the capacitor C is unchanged and is C3 within a certain time, so that an error caused by floating of the capacitor is avoided, and the correctness of determining that the connection terminal is in the stable contact state is further ensured.
Example four:
on the basis of the third embodiment, the displacement distance and the pseudo-contact displacement distance of the chassis are measured through the dial indicator in the step S2, and the dial indicator is fixed at the tail end of the connector of the chassis, so that the measurement accuracy of the dial indicator can be improved, and the problems that the dial indicator is arranged on the chassis and the displacement between the chassis and the connector is measured are solved.
Example five:
on the basis of the third embodiment, the process of determining the contact stroke between the chassis and the back plate according to the displacement distance of the chassis in S2 includes: and 3 contact stroke parameters are obtained, each contact stroke parameter represents 1 measured displacement distance value of the machine disc, and the average value of all the contact stroke parameters is taken as the contact stroke of the machine disc and the back plate, so that the measurement precision of the contact stroke can be improved, and the error is further reduced. Similarly, the process of determining the pseudo-contact stroke between the chassis and the backplane according to the pseudo-contact displacement distance of the chassis in S2 includes: and 3 pseudo-contact stroke parameters are obtained, each pseudo-contact stroke parameter represents 1 measured machine disk pseudo-contact displacement distance, and the average value of all the pseudo-contact stroke parameters is taken as the pseudo-contact stroke of the machine disk and the back plate.
Example six:
the implementation process of the contact stroke measuring method during the interaction of the machine disc and the back plate in the embodiment of the invention is as follows:
the capacitance C1 of the chassis differential pair wiring and the capacitance C2 of the backplane differential pair wiring are obtained, and the specified threshold C3 is determined according to C1 and C2, and C3 is C1+ C2.
Referring to fig. 2-1, when the connection terminals are in a non-contact state, the capacitance C of the differential pair wiring of the chassis is measured by a capacitance measuring instrument.
Referring to fig. 2-2, when the capacitance C changes, it is determined that the connection terminal is in a contact start state, and after the dial indicator and the tail end of the connector of the chassis are fixed and cleared, counting is started.
As shown in fig. 2-3, when the capacitance C is monitored to be C3 and no change occurs within 5S, determining that the connection terminal is in a stable contact state, recording the reading of the dial indicator, and taking the reading as the false contact displacement distance of the chassis; and after the dial indicator is reset, counting is started again, when the connecting terminal is in a locking state, the reading of the dial indicator is recorded, and the reading is used as the displacement distance of the machine disc.
And after the execution is carried out for 3 times according to the execution process, obtaining 3 machine disk pseudo-contact displacement distances and 3 machine disk displacement distances, taking the average value of the 3 machine disk pseudo-contact displacement distances as the pseudo-contact stroke of the machine disk and the back plate, and taking the average value of the 3 machine disk displacement distances as the contact stroke of the machine disk and the back plate.
Further, the present invention is not limited to the above-mentioned embodiments, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements are also considered to be within the scope of the present invention. Those not described in detail in this specification are within the skill of the art.
Claims (6)
1. A contact travel measuring method when a machine disc and a back plate are mutually matched, wherein the machine disc and the back plate in the method respectively comprise a differential pair wiring and a connector, and the differential pair wiring is connected with a connecting terminal of the connector, and the method is characterized by comprising the following steps: measuring the capacitance of the differential pair wiring of the machine disc in the process of the mutual matching of the machine disc and the back plate; when the capacitance reaches a specified threshold value corresponding to the stable contact state of the connecting terminal, measuring the displacement distance of the machine disc, when the connecting terminal is in a locking state, acquiring the displacement distance of the machine disc, and determining the contact stroke between the machine disc and the back plate according to the displacement distance of the machine disc;
the method specifically comprises the following steps:
s1: acquiring a capacitance C1 of the chassis differential pair wiring and a capacitance C2 of the backboard differential pair wiring, determining a specified threshold C3 according to C1 and C2, wherein the specified threshold C3 is C1+ C2, and turning to S2 when the connecting terminal is in a stable contact state;
s2: measuring the capacitance C of the differential pair wiring of the machine disk in the process of inserting the machine disk into the back plate; when the capacitance C is equal to C3, determining that the connecting terminal is in a stable contact state, starting to measure the displacement distance of the machine disc, and when the connecting terminal is in a locking state, acquiring the displacement distance of the machine disc; determining the contact stroke of the machine disc and the back plate according to the displacement distance of the machine disc;
in the process of inserting the chassis into the backplane in S2, the process of measuring the capacitance C of the differential pair wiring of the chassis includes: when the connecting terminal is in a non-contact state, starting to measure the capacitance C of the differential pair wiring of the machine disc, and when the capacitance C changes, determining that the connecting terminal is in a contact starting state and starting to measure the pseudo-contact displacement distance of the machine disc; after determining that the connection terminal is in the stable contact state when the capacitance C is C3 as described in S2, the method further includes the following steps: and acquiring the pseudo contact displacement distance of the chassis, and determining the pseudo contact stroke of the chassis and the back plate according to the pseudo contact displacement distance of the chassis.
2. The method of claim 1, wherein the contact stroke of the disk and the back plate is measured by the following steps: when the capacitance C is equal to C3 in S2, the process of determining that the connection terminal is in the stable contact state is: when the capacitor C is monitored to be C3, judging whether the capacitor C changes within a specified time, if so, determining that the connecting terminal is not in a stable contact state; otherwise, the connection terminal is determined to be in a stable contact state.
3. The method for measuring a contact stroke when a chassis and a back plate are mutually engaged as set forth in claim 2, wherein: the specified time is 5s or more.
4. The method of claim 1, wherein the contact stroke of the disk and the back plate is measured by the following steps: and in S2, measuring the displacement distance and the pseudo-contact displacement distance of the chassis through a dial indicator, wherein the dial indicator is fixed at the tail end of the connector of the chassis.
5. The method of claim 1, wherein the contact stroke of the disk and the back plate is measured by the following steps: the process of determining the pseudo-contact stroke of the chassis and the back plate according to the pseudo-contact displacement distance of the chassis in S2 includes: and 3 pseudo-contact stroke parameters are obtained, each pseudo-contact stroke parameter represents 1 measured machine disk pseudo-contact displacement distance, and the average value of all the pseudo-contact stroke parameters is taken as the pseudo-contact stroke of the machine disk and the back plate.
6. The method for measuring a contact stroke when a chassis and a back plate are mated according to any one of claims 1 to 5, wherein: the process of determining the contact stroke of the chassis and the back plate according to the chassis displacement distance in S2 includes: and 3 contact stroke parameters are obtained, each contact stroke parameter represents 1 measured machine disc displacement distance value, and the average value of all the contact stroke parameters is taken as the contact stroke of the machine disc and the back plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810494870.7A CN108955469B (en) | 2018-05-22 | 2018-05-22 | Contact stroke measuring method during interaction of machine disc and back plate |
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| CN201810494870.7A CN108955469B (en) | 2018-05-22 | 2018-05-22 | Contact stroke measuring method during interaction of machine disc and back plate |
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| CN108955469B true CN108955469B (en) | 2020-05-05 |
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| CN109737911B (en) * | 2019-01-07 | 2020-08-14 | 烽火通信科技股份有限公司 | Calibration tool, and device and method for measuring blind-mate connector mutual-matching gap |
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| CN108955469A (en) | 2018-12-07 |
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