CN115365923A

CN115365923A - Grinding mechanism for PCB grinding equipment and PCB grinding equipment

Info

Publication number: CN115365923A
Application number: CN202210916388.4A
Authority: CN
Inventors: 谭义满
Original assignee: Guangdong Xinjixin Industrial Co ltd
Current assignee: Guangdong Xinjixin Industrial Co ltd
Priority date: 2022-08-01
Filing date: 2022-08-01
Publication date: 2022-11-22

Abstract

The invention discloses a grinding mechanism for PCB (printed circuit board) grinding equipment and the PCB grinding equipment, and relates to the technical field of grinders. Comprises a fixed frame, a lifting component, a swinging component and a polishing component which are sequentially arranged on the fixed frame; the grinding assembly comprises a grinding wheel and a parallel wheel which are arranged in parallel and is used for grinding the PCB; the lifting assembly is used for driving the grinding wheel and/or the parallel wheel to lift; the swinging assembly is used for driving the grinding wheel to move along the axial direction and grinding the PCB in the axial direction. The grinding mechanism automatically adjusts the grinding distance between the grinding wheel and the parallel wheel through the lifting assembly, has high debugging precision and good adaptation performance, can reduce the operation intensity of workers, and avoids the influence on the appearance quality of a PCB (printed circuit board) caused by uneven grinding force of manual adjustment; the swinging assembly is adopted to drive the grinding wheel to move along the axial direction, so that the condition that the same PCB needs to be polished for multiple times is avoided, the polishing uniformity of the PCB is improved, and the production efficiency is improved.

Description

Grinding mechanism for PCB grinding equipment and PCB grinding equipment

Technical Field

The invention relates to the technical field of grinding machines, in particular to a grinding mechanism of PCB (printed circuit board) flash grinding equipment and PCB grinding equipment.

Background

The electronic component carrier plate comprises a PCB single-sided circuit board, a PCB double-sided circuit board, a PCB multilayer circuit board and the like, the PCB circuit boards are basic carriers of various electronic and electrical appliances, and play a role in conducting electric signal connection, so that the electronic component carrier plate can control the safe operation of trains, airplanes and steamships, can control the safe operation of household electrical appliances such as mobile phones and computers, and can also control the automatic safe operation of numerical control machines, cutting equipment and the like in industrial production. After the circuit board is initially cut and formed, the positions of the circuit board where the electronic components are installed need to be drilled, and therefore the electronic components are conducted and welded. The PCB can generate raised rough edges, burrs, sharp heads, acute angles and the like after mechanical processing such as drilling, trimming and the like. The batch edge brings many adverse effects to the subsequent process production of the PCB, such as poor conduction to electronic components, circuit short circuit and burning and other safety problems; therefore, the burrs on the circuit board need to be polished to be removed for the next operation.

Most of the prior manual abrasive belt type grinding machines are used in the market, and the grinding method is that a worker fixes a circuit board on a machine table of a grinding machine by using a pressing plate of a pressing mechanism, then the worker holds the grinding machine by hand, the grinding machine carries out grinding along the edge direction of the circuit board by a grinding wheel on the grinding machine, and the rotating grinding wheel lifts and grinds off a burr; this machine of polishing uses loaded down with trivial details, and the abrasive band wearing and tearing are changed frequently (change many times a day) soon, change the abrasive band and have certain technical requirement to the operator, and the machine of transferring is frequent and the cost time is long, and the debugging effect can only rely on the staff to feel, has not only increased workman's working strength, has reduced production efficiency, still has many unstable factors, for example: after polishing, the polishing thickness of the polishing surface on the circuit board is different, and the edge of the circuit board is not uniformly polished, so that the finished product qualification rate of the circuit board is reduced, and the appearance quality of the circuit board is reduced.

In the production process of the PCB, the PCB steel plate is used as a production tool, and the quality of the PCB steel plate influences the quality of the PCB, so that the PCB steel plate needs to be ground before the production of the PCB, and the flatness, the cleanliness and the like of the PCB steel plate are kept. Meanwhile, after manual polishing, residual foreign matters, PP dust, gummosis and the like are left on the surface of the steel plate, so that the finished product qualification rate of the circuit board is seriously reduced, and the appearance quality of the circuit board is reduced.

Therefore, in view of the above problems, an automated grinding device can be used to grind PCB (including PCB circuit boards, PCB steel plates, PCB copper plates, etc.) wherein a driving roller is used to convey or grind the circuit boards, the driving roller includes a grinding wheel and a parallel wheel, and a grinding space is formed between the grinding wheel and the parallel wheel. In the polishing process, the polishing equipment can only polish a circuit board with a single thickness, the lifting operation of a polishing wheel and a parallel wheel is difficult to adjust, namely the polishing distance is difficult to adjust, and the polishing equipment needs manual debugging or manual calibration aiming at PCB boards with different thicknesses, so that the adaptability of the polishing equipment is poor; some polishing equipment can only polish the PCB or can only polish the upper surface of the PCB in a single direction (namely the conveying direction of the circuit board) in the polishing process, and cannot polish the PCB along the axial direction of the grinding wheel, so that the polishing surface of the circuit board is not uniformly polished, and the appearance quality of the PCB is influenced.

Disclosure of Invention

The invention aims to solve the problems of the existing PCB polishing equipment, and provides a grinding mechanism and PCB polishing equipment which have reasonable and compact structural design, good polishing effect, high polishing efficiency and are suitable for PCBs with different thicknesses.

In order to solve the technical problems, the invention is realized by the following technical scheme:

a grinding mechanism for a PCB board grinding apparatus, comprising:

a fixed mount;

the polishing assembly comprises a grinding wheel and a parallel wheel which are arranged in parallel, and the grinding wheel and the parallel wheel are used for polishing the PCB;

the lifting assembly is connected to the fixed frame and used for driving the grinding wheel and/or the parallel wheel to lift so as to adjust the grinding distance between the grinding wheel and the parallel wheel;

and the swinging assembly is arranged on the fixed frame and used for driving the grinding wheel to move along the axial direction and polish the PCB in the axial direction.

Preferably, the number of the polishing assemblies is two sets and the polishing assemblies are arranged in parallel, the two sets of polishing assemblies respectively comprise a first polishing wheel and a first parallel wheel which are arranged in parallel, and a second polishing wheel and a second parallel wheel which are arranged in parallel, and the first polishing wheel and the second polishing wheel are respectively used for polishing the upper surface and the lower surface of the PCB.

Preferably, the lifting assembly comprises:

the lifting unit is connected to the fixed frame;

the first servo motor is connected with the lifting unit and is used for driving the lifting unit to drive the grinding wheel and/or the parallel wheel to move up and down;

wherein, the lift unit includes:

the first mounting frame is connected to the fixing frame and corresponds to the end parts of the grinding wheels and/or the parallel wheels;

one end of the lifting screw is connected with one end of the grinding wheel and/or the parallel wheel through a first connecting frame, the other end of the lifting screw is in adaptive connection with an output shaft of the first servo motor through a matching piece, and the first servo motor is used for driving the lifting screw to drive the grinding wheel and/or the parallel wheel to move up and down;

preferably, the lifting assembly further comprises:

the first sliding rail is arranged on the fixed frame in the vertical direction and is in adaptive connection with the first connecting frame, and a sliding groove matched with the sliding rail is formed in the first connecting frame.

Preferably, the lifting assembly further comprises:

and the measuring instrument is connected to the first mounting frame, is in adaptive connection with the first connecting frame and is used for measuring the movement stroke of the first connecting frame.

Preferably, the swing assembly includes:

the second mounting rack is mounted on the side edge of the fixing rack and corresponds to the end part of the grinding wheel;

the second servo motor is arranged on the second mounting frame and is in transmission connection with the end part of the grinding wheel through a cam assembly, and the second servo motor drives the grinding wheel to swing through the cam assembly;

the second slide rail, set up along the second direction in on the second mounting bracket, and along the axial setting of grinding miller, the tip of grinding miller pass through the second link with second slide rail adaptation is connected, the second slide rail is used for injecing second link rectilinear movement.

Preferably, the rotational speed of the grinding wheel is greater than the rotational speed of the parallel wheels, and the grinding wheel is counter-rotating to the parallel wheels.

Preferably, the outer diameter of the grinding wheel is larger than that of the parallel wheel, and the mesh number of the grinding wheel is 400 meshes, 600 meshes or 800 meshes.

Preferably, the method further comprises the following steps:

the water delivery pipe is arranged on the fixing frame and is positioned at the upper end of the polishing component, and a plurality of water spraying heads are arranged on the water delivery pipe and are used for spraying water when the PCB is polished;

and the liquid return hopper is arranged on the fixing frame and positioned at the lower end of the polishing assembly and used for recovering waste liquid.

A PCB board equipment of polishing includes foretell grinding mechanism.

Compared with the prior art, the invention has the beneficial effects that: the grinding mechanism is reasonable and compact in structural design and high in automation degree, the grinding distance between the grinding wheel and the parallel wheel is automatically adjusted through the lifting assembly, the debugging precision is high, the grinding surface of a PCB is more uniform, the grinding equipment is good in adaptability, is suitable for PCBs with different thicknesses, can reduce the operation intensity of workers, and avoids the influence on the appearance quality of the PCB due to the fact that the grinding distance and the grinding force are not uniform through manual adjustment; the grinding wheel is driven to move along the axial direction by the aid of the swinging assembly, so that the PCB can be ground along the second direction while being ground along the first direction by the grinding assembly, the problem that the same PCB needs to be ground for multiple times is avoided, grinding uniformity of the PCB is improved, grinding technological processes are reduced, production cost is reduced, and production efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic diagram of a PCB burring grinding apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of another perspective view of a PCB flash polishing apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of an exemplary embodiment of an internal structure of a PCB burring polishing apparatus;

FIG. 4 is a schematic diagram of another perspective view of the interior of the PCB flash polishing apparatus according to the embodiment of the present invention;

FIG. 5 is a block diagram of a sanding assembly in an embodiment of the present invention;

FIG. 6 is a block diagram of another perspective of a sanding assembly in an embodiment of the present invention;

FIG. 7 is a partial block diagram of a grinding assembly in an embodiment of the present invention;

FIG. 8 is a partial enlarged view of A;

FIG. 9 is a block diagram of a thickness measuring assembly in an embodiment of the present invention;

FIG. 10 is a partial block diagram of a transfer assembly in an embodiment of the present invention;

FIG. 11 is a block diagram of a lift assembly in an embodiment of the present invention;

FIG. 12 is an exploded view of a lift assembly in an embodiment of the present invention;

FIG. 13 is a partial block diagram of the lifting assembly mounted on the mounting bracket in an embodiment of the present invention;

FIG. 14 is a block diagram of a swing assembly in an embodiment of the present invention;

FIG. 15 is an exploded view of the wobble assembly of the present invention;

FIG. 16 is a structural view of a rocking cam in the embodiment of the present invention;

FIG. 17 is a structural view of a return liquid hopper in an embodiment of the present invention;

in the figure:

100 is a fixing plate, 110 is a bottom frame, 120 is a supporting frame, 130 is a PCB plate,

200 is a polishing assembly, 210 is a first polishing wheel, 211 is a first driving motor, 212 is a stop, 213 is a fourth bearing, 214 is a driving wheel, 220 is a first parallel wheel, 221 is a first driving gear, 222 is a first fixed block, 223 is a first bearing, 224 is a first limit block, 230 is a second polishing wheel, 231 is a second driving motor, 240 is a second parallel wheel,

300 is a second lifting component, 310 is a first swinging component, 320 is a third lifting component, 321 is a second mounting rack, 3211 is a rear side plate, 3212 is a second left side plate, 3213 is a second right side plate, 3214 is a second top plate, 3215 is a bottom plate, 3216 is a support rod, 3217 is a through hole, 3218 is a second slide rail, 322 is a second servo motor, 3221 is a second reducer, 323 is a cam component, 3231 is a second bearing, 3232 is a third bearing, 3233 is a set-up screw, 3234 is a first connecting hole, 3235 is a second connecting hole, 324 is a second fixing block, 325 is a second connecting rack, 3251 is a connecting post, 3252 is a mounting hole, 326 is an eccentric wheel, 327 is a third sliding block, 3271 is a third slide rail, 330 is a second mounting rack, 340 is a first lifting component, 341 is a first lifting component, 3411 is a first right side plate, 3412 is a first top plate, 3413 is a first swinging component, 3421 is a first sliding rail, 3441 is a first sliding rack, 3441 is a sliding rack, 3421 is a sliding rack, 3441 is a sliding rack, a sliding mechanism,

400 is an elastic compression member, 410 is a third fixing block, 420 is a second limiting block, 430 is a tension rod, 440 is a fourth fixing block, 450 is a tension spring,

500 is a conveying assembly, 510 is an upper roller shaft, 520 is a lower roller shaft, 521 is a second driving gear,

600 is a thickness measuring component, 610 is a rotating shaft, 620 is a guide rod, 630 is a pressure rod, 640 is a trigger rod, 650 is a first sensor,

700 is a first sensing element, 710 is a second sensing element, 720 is an air blowing pipe,

800 is a shell, 810 is a feed inlet, 820 is a discharge outlet, 830 is an operation panel, 840 is a control system,

900 is a liquid return bucket, 910 is a water delivery pipe, 920 is a liquid return bucket, and 930 is a water outlet pipe.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.

In the description of the present application, it is to be understood that the terms "intermediate," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular orientation, and thus should not be construed as limiting the present application. The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In addition, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are intended to be inclusive and mean, for example, that there may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

Example (b): referring to fig. 1-17, the present invention provides a grinding mechanism for a PCB deburring grinding apparatus, which mainly aims at the problems that the existing PCB deburring grinding apparatus has a low automation degree, is relatively dependent on operation, cannot adjust grinding effects for PCBs with different thicknesses, only can the grinding effects depend on the hand feeling of staff, and has a single grinding direction, and needs to repeatedly grind for many times, thereby not only increasing the working strength of workers and reducing the production efficiency, but also reducing the grinding quality of PCBs and the appearance quality of PCBs due to different grinding thicknesses of grinding surfaces on PCBs and uneven grinding of edges of PCBs after grinding. As shown in fig. 1 and 2, in the drawings: a is a first direction, b is a second direction, c is a third direction, the grinding mechanism comprises:

a fixed mount;

and the swinging assembly is arranged on the fixed frame and used for driving the grinding wheel to move along the axial direction and axially polish the PCB.

In this embodiment, referring to fig. 1 to 4, the grinding mechanism is applied to a PCB grinding device, the grinding device includes a housing 800, the grinding mechanism is located in the housing 800, a feeding hole 810 and a discharging hole 820 are respectively formed on an opposite side wall of the housing 800, and a PCB 130 to be ground enters the housing 800 through the feeding hole 810, is ground, and is then output to a next production line along the discharging hole 820. The polishing device further comprises an operation panel 830 and a control system 840 which are arranged on the casing 800, wherein the operation panel 830 is used for operation and debugging of operators, and the control system 840 is used for receiving commands or executing commands to operate the whole polishing device.

Specifically, the polishing apparatus further includes a conveying assembly 500 fixed on the fixing frame, wherein the conveying assembly 500 conveys the PCB 130 according to a preset path; the conveying assembly 500 includes an input roller set and an output roller set on the shaft-connected fixed frame, as shown in fig. 10, the input roller set and the output roller set are both composed of an upper roller shaft 510 and a lower roller shaft 520 which are oppositely arranged, and the PCB 130 is conveyed along the space between the upper roller shaft 510 and the lower roller shaft 520; in this embodiment, the number of input roller groups is two and parallel, and the number of output roller groups is two and parallel, but of course, the number of input roller groups and output roller groups may be two or more.

Specifically, this equipment of polishing still includes thickness measurement subassembly 600 that is fixed in on the mount, and thickness measurement subassembly 600 installs on the mount and is located input roller set and polishing subassembly 200 between for carry out the thickness measurement with the different thickness PCB boards of adaptation to the PCB board.

This equipment of polishing is at the during operation of polishing, the PCB board 130 of treating to polish gets into and carries out accurate detection through thickness measurement subassembly 600 subassembly to the thickness of PCB board 130 along the input roller group, and feed back to control system 840, control system 840 receives thickness measurement signal or thickness measurement data after, control system 840 control lifting unit carries out the survey lift operation based on the thickness measurement signal, adjust the interval of polishing subassembly 200, and polish to the upper and lower surface of PCB board 130, the in-process of polishing, the swing subassembly can be used to control grinding miller along axial displacement, so that along first direction to PCB board 130, the second direction is polished, PCB board 130 after polishing gets into next manufacturing procedure along output roller group output. The grinding path of the PCB 130 is a conveying path of the present application. According to the grinding mechanism, the thickness measuring assembly 600 is adopted to measure the thickness of the PCB 130 and feed back a thickness measuring signal, the lifting assembly can automatically adjust the grinding distance between the grinding wheel and the parallel wheel based on the thickness measuring signal, manual debugging is avoided, the precision is high, the grinding mechanism is suitable for PCBs with different thicknesses, the adaptive performance of the grinding mechanism is better, and meanwhile, the operation intensity of workers is reduced; after the thickness interval is debugged, the PCB is polished by the polishing assembly 200, so that the polishing surface of the PCB 130 is more uniform, and the influence on the appearance quality of the PCB 130 caused by the nonuniform polishing interval adjusted manually is avoided; this grinding mechanism adopts swing subassembly drive grinding miller along axial displacement to in the time of the subassembly 200 of polishing is polished PCB board along the first direction, still can polish along the second direction, avoided same PCB board to need the operation of polishing many times, reduced the process flow of polishing, reduced manufacturing cost, improved production efficiency.

Specifically, in the present embodiment, the fixing frame includes a bottom frame 110 and fixing plates 100 disposed in parallel on two sides of the upper end of the bottom frame 110, and the input roller set, the output roller set, the grinding wheel and the parallel wheel are connected between the fixing plates 100 on two sides.

Specifically, as shown in fig. 4 and 9, the thickness measuring assembly 600 includes:

a rotating shaft 610 rotatably connected to the fixing frame in a first direction;

one end of the guide rod 620 is fixedly arranged on the rotating shaft 610 and is used for driving the rotating shaft 610 to rotate after being extruded by the PCB 130;

the first sensor 650 is mounted on the fixing frame and connected to the rotating shaft 610, wherein the first sensor 650 is configured to trigger a corresponding thickness measuring signal when the rotating shaft 610 rotates.

In this embodiment, the rotating shaft 610 is disposed in parallel with the input roller set, and both ends of the rotating shaft 610 are rotatably connected to the inner walls of the two side fixing plates 100; the rotating shaft 610 is fixedly connected with a guide rod 620, in this embodiment, the guide rod 620 is of an L-shaped structure, one end of the guide rod 620 is fixedly connected with the rotating shaft 610, and the other end extends to one side of the input roller group, in this embodiment, the input roller group includes an upper roller shaft 510 and a lower roller shaft 520 which are corresponding to each other, and the number of the input roller groups is two; the other end of guide bar 620 extends to between two sets of roller sets, when PCB board 130 along last roller 510, pass through and extrude behind the guide bar 620 between the lower roller 520, guide bar 620 rebound and drive pivot 610 and rotate, the inner wall of fixed plate 100 has set firmly first inductor 650, it is connected to trigger between pivot 610 and the first inductor 650, after pivot 610 rotates triggers first inductor 650, and trigger corresponding thickness measurement signal or thickness measurement data transmission to control system 840, it is further, fixedly connected with trigger bar 640 on the pivot 610, when trigger bar 640 can rotate along with pivot 610, the butt triggers first inductor 650.

Further, the thickness measuring assembly 600 further includes:

a pressing rod 630 connected to one end of the guide rods 620 far away from the rotating shaft 610 and connected between the two guide rods 620;

and the abutting rods are rotatably connected to the fixed frame along the first direction and correspond to the guide rods 620, wherein the pressing rods 630 and the abutting rods are respectively arranged on the upper side and the lower side of the conveying path in parallel.

In this embodiment, the number of the guide rods 620 is two, the pressing rod 630 is a cylindrical rod, and two ends of the cylindrical rod are respectively rotatably connected to the two guide rods 620, so that the PCB 130 does not interfere with the transportation of the PCB 130 when passing through the rear pressing rod 630 between the upper roller 510 and the lower roller 520. The device further comprises a butt-joint rod which is rotatably connected to the fixing frame along the first direction and corresponds to the guide rod 620, and the pressing rod 630 and the butt-joint rod are respectively arranged on the upper side and the lower side of the conveying path in parallel. When no PCB board 130 passes, the pressing bar 630 contacts the abutment bar; when the PCB 130 passes through, the abutting rod abuts against the lower surface of the PCB 130, and meanwhile, the PCB 130 presses the pressing rod 630 to move upward and drive the rotating shaft 610 to rotate.

Specifically, the front end of the fixing frame is provided with a first sensing assembly 700 electrically connected with the thickness measuring assembly 600, the first sensing assembly 700 is used for detecting whether the PCB 130 is conveyed in the input roller set, and the thickness measuring assembly 600 can be used for receiving a detection signal of the first sensing assembly 700 and measuring the thickness of the PCB 130 based on the detection signal. And the rear end of the fixing frame, that is, one end of the discharge hole 820 is provided with a second sensing assembly 710, and the second sensing assembly 710 is used for detecting whether the PCB 130 is conveyed in the input roller set or not and feeding back a detection signal to the processing equipment of the next process. Further, the fixing plate 100 is further provided with an air blowing pipe 720, and the air blowing pipe 720 can be used for cleaning dust on the first induction assembly 700 and the second induction assembly 710, so that interference of the dust generated in the polishing process on the first induction assembly 700 and the second induction assembly 710 is avoided.

In this embodiment, the first sensing assembly 700 is fixedly disposed on the inner wall of the fixing plate 100 and located on one side of the input roller shaft, the first sensing assembly 700 can be used to detect whether a PCB 130 enters the input roller set, and if a PCB 130 enters the input roller set, the thickness measuring assembly 600 can be used to receive a detection signal of the first sensing assembly 700 and prepare to measure the thickness of the PCB 130 based on the detection signal, but in another embodiment, the polishing assembly 200 can also start to work based on the detection signal.

Specifically, the polishing assemblies 200 include parallel-arranged grinding wheels and parallel wheels, and in this embodiment, in order to improve the polishing efficiency, the number of the polishing assemblies 200 is two and is set along the conveying path, and the two sets of polishing assemblies 200 are respectively used for polishing the upper surface and the lower surface of the PCB 130.

As shown in fig. 5, 6 and 7, in the present embodiment, two sets of grinding assemblies 200 respectively include a first grinding wheel 210 and a first parallel wheel 220 which are oppositely arranged, and a second grinding wheel 230 and a second parallel wheel 240 which are oppositely arranged, the first grinding wheel 210 is used for grinding the lower surface of the PCB board, and the second grinding wheel 230 is used for grinding the upper surface of the PCB board; the first grinding wheel 210 is located at the lower end of the first parallel wheel 220, i.e., to first start a grinding work on the lower surface of the PCB 130, and the second grinding wheel 230 is located at the upper end of the second parallel wheel 240, i.e., to first and then start a grinding work on the upper surface of the PCB 130.

Furthermore, the outer diameter of the grinding wheel is larger than that of the parallel wheel, and the mesh number of the grinding wheel is 400 meshes, 600 meshes or 800 meshes, so that the grinding quality is improved.

In order to ensure that the PCB 130 is conveyed and the polishing effect is improved, in the embodiment, the rotating speed of the grinding wheel is greater than that of the parallel wheel, and the rotating directions of the grinding wheel and the parallel wheel are opposite, so that the grinding wheel can fully polish the PCB 130.

In order to improve the adaptability of the grinding mechanism, the PCB 130 with different thicknesses can be effectively ground, and in the embodiment, a lifting assembly is adopted to control the grinding distance; the lifting assembly in this embodiment can lift the grinding wheel, can lift the parallel wheel, and can lift the parallel wheel and the grinding wheel at the same time; in this embodiment, three sets of lifting assemblies are used to lift the grinding wheels and/or the parallel wheels, which are respectively a first lifting assembly 340 for controlling the first parallel wheel 220 to lift, a second lifting assembly 300 for controlling the first grinding wheel 210 to lift, and a third lifting assembly 320 for controlling the second grinding wheel 230 to lift. Since the working principle of the first lifting assembly 340, the second lifting assembly 300 and the third lifting assembly 320 is basically the same, the first lifting assembly 340 is taken as an example in this embodiment.

Specifically, as shown in fig. 7, 11, 12, and 13, the lifting assembly includes:

the lifting unit is connected to the fixed frame;

the first servo motor 342 is connected with the lifting unit and is used for driving the lifting unit to drive the grinding wheels and/or the parallel wheels to move up and down;

wherein, the lift unit includes:

a first mounting frame 341 connected to the fixing frame and corresponding to the end of the grinding wheel and/or the parallel wheel;

the lifting screw 347 is arranged along the third direction, one end of the lifting screw 347 is connected with one end of the grinding wheel and/or the parallel wheel through a first connecting frame 343, the other end of the lifting screw 347 is connected with an output shaft of the first servo motor 342 through a fitting part 3422 in a matching manner, and the first servo motor 342 is used for driving the lifting screw 347 to drive the grinding wheel and/or the parallel wheel to move up and down.

And a first sliding rail 345 disposed on the fixed frame along a third direction and adapted to the first connecting rack 343, for limiting the linear movement of the first connecting rack 343.

In this embodiment, the elevating unit is connected to an outer wall of the fixed plate 100 for performing an elevating operation on the first parallel wheel 220. The output shaft of the first servo motor 342 may be decelerated using a first decelerator; the first servo motor 342 is used for driving the lifting unit to drive the first parallel wheel 220 to lift. The first mounting bracket 341 is fixedly installed at one side of the fixing plate 100; the first servo motor 342 is mounted on the first mounting frame 341, the first mounting frame 341 is further provided with a lifting screw 347 along the vertical direction, and an output shaft of the first servo motor 342 is in fit connection with the lifting screw 347 through a fitting part 3422; the fitting part 3422 is fixed on the first mounting frame 341, and under the driving of the first servo motor 342, the lifting screw 347 moves up and down along the fitting part 3422, and by driving the first parallel wheel 220 and adjusting the distance between the first parallel wheel 220 and the first grinding wheel 210, the PCB 130 with different thicknesses is ground, so that the adaptability of the whole device to materials with different thicknesses is improved.

In a further embodiment, the first mounting frame 341 includes a first left side plate 3413, a first right side plate 3411 and a first top plate 3412 disposed at the upper ends of the first left side plate 3413 and the first right side plate 3411 in parallel to the outer wall of the fixing plate 100, the first servo motor 342 is connected to the first top plate 3412 through the first mounting frame 341, the fitting component 3422 is also fixed to the first top plate 3412, the lifting screw 347 penetrates through the first top plate 3412 and is connected to the first mounting frame 341 through the connecting component, and the lifting screw 347 drives the first mounting frame 341 to lift.

Specifically, the lifting unit further includes:

the first slide rail 345 is disposed on the fixed plate 100 along the vertical direction and is connected to the first connecting rack 343 in a fitting manner, so as to limit the linear movement of the first connecting rack 343.

In this embodiment, the first sliding rail 345 is fixedly disposed along the vertical direction on the side of the fixing plate 100. So as to ensure that the first connecting frame 343 is driven by the lifting screw 347 to make linear motion; a first sliding groove matched with the first sliding rail 345 is formed in the first connecting frame 343 in the vertical direction, so that the lifting screw 347 can stably drive the first parallel wheel 220 to lift when the first parallel wheel 220 works.

Specifically, the lifting unit further includes:

and the measuring instrument is connected to the first mounting frame 341, is in adaptive connection with the first connecting frame 343, and is used for measuring the movement stroke of the first connecting frame 343.

In this embodiment, the gauge includes a dial gauge 344 attached to the first left side plate 3413 for measuring or displaying the lifting stroke of the first parallel wheel 220. The lower end of the dial indicator 344 is fixedly connected with the connecting piece through the abutting rod 3441, and when the lifting screw 347 moves up and down, the abutting rod 3441 triggers the dial indicator 344 to display the numerical value of the lifting displacement for the reference of workers.

In a further embodiment, a second sensor 3462 is disposed on the outer wall of the fixing plate 100, a trigger 3431 for triggering the second sensor 3462 is disposed on the first connecting frame 343, and the second sensor 3462 is used for sensing the moving stroke of the first connecting frame 343; when the first connecting frame 343 performs a lifting displacement, the trigger 3431 triggers the second sensor 3462, and the second sensor 3462 feeds back a lifting signal and lifting data to the control system 840 of the polishing apparatus, thereby controlling the next operation of the first servo motor 342.

Specifically, the two sides of the fixing frame are both provided with lifting units, the lifting units on the two sides are connected through a transmission shaft 3421, the transmission shaft 3421 is in transmission connection with the first servo motor 342, and the transmission shaft 3421 is used for driving the lifting units on the two sides of the fixing frame to synchronously lift.

In this embodiment, the two sides of the fixing frame are both provided with the lifting units, that is, the lifting units are fixed on the outer walls of the two fixing plates 100, and the lifting units on the two sides are connected through the transmission shaft 3421, and the transmission shaft 3421 is parallel to the first parallel wheel 220, so as to ensure that the lifting units on the two sides can synchronously lift and move. Further, the end of the transmission shaft 3421 is connected to the output shaft of the first servo motor 342 in an adaptive manner, when in use, the first servo motor 342 drives the transmission shaft 3421 to rotate, both ends of the transmission shaft 3421 are connected to the fitting pieces 3422, and the fitting pieces 3422 drive the lifting screws 347 at both ends of the transmission shaft 3421 to lift synchronously; when the distance between the first parallel wheel 220 and the grinding wheel is controlled in the mode, the first parallel wheel 220 can be guaranteed to be always parallel to the grinding wheel, so that the grinding gap is more suitable for the PCB 130, and the phenomenon that the PCB is not uniformly ground due to the fact that the displacements of the two ends of the first parallel wheel 220 are not uniform is avoided.

Specifically, a first fixing block 222 is fixed on the fixing frame, a mounting hole 3252 penetrating through the fixing frame is formed in the first fixing block 222, one end of the first parallel wheel 220 penetrates through the mounting hole 3252 to be connected with the first connecting frame 343, and one end of the first parallel wheel 220 can move in the vertical direction along the mounting hole 3252.

In this embodiment, the first fixing block 222 is fixedly connected to the fixing frame, a mounting hole 3252 is formed in the first fixing block 222, and one end of the driving roller passes through the mounting hole 3252 to be connected to the first connecting frame 343, and can move in the vertical direction along the mounting hole 3252. In the present embodiment, the mounting hole 3252 is a vertically disposed slot-type through hole, but the mounting hole 3252 may also be an oval through hole or a vertically disposed elongated through hole.

Further, the first parallel wheel 220 passes through the mounting hole 3252 and is connected with a first limit block 224 through a first bearing 223, and the first limit block 224 is fixedly connected with the first connecting frame 343; a first limit groove matched with the first limit block 224 is formed in one side of the first fixed block 222 in the vertical direction; the first connecting frame 343 may be configured to drive the first limiting block 224 to move linearly along the first limiting groove.

In this embodiment, the first parallel wheel 220 passes through the mounting hole 3252 and is connected to a first limit block 224 through a first bearing 223, the first limit block 224 is fixedly connected to the first connecting frame 343, the first limit block 224 can move in the vertical direction relative to the first fixing block 222 under the driving of the lifting screw 347, and meanwhile, the first bearing 223 is connected between the first parallel wheel 220 and the first limit block 224, so that the rotation of the first parallel wheel 220 is not affected in the lifting process. Further, in order to keep the first limiting block 224 moving in the vertical direction along the first limiting groove, in this embodiment, a first limiting groove adapted to the first limiting block 224 is disposed on one side of the first fixing block 222 in the vertical direction, and the first connecting frame 343 may be configured to drive the first limiting block 224 to move linearly along the first limiting groove.

Further, a first driving gear 221 is further disposed after the end of the first parallel wheel 220 passes through the first limiting block 224, and the first driving gear 221 is connected to the first driving motor 211 through chain transmission, so that the first parallel wheel 220 rotates to convey the PCB 130; since the first driving gear 221 needs to be lifted and lowered synchronously with the first parallel wheel 220, in this embodiment, the transmission chain between the first driving gear 221 and the first driving motor 211 is further provided with a chain tensioning assembly.

Since the two sets of lifting units are provided, the other end of the first parallel wheel 220 is also matched with a first fixing block 222, a first limiting block 224, and the like, which will not be described again.

Further, in order to ensure the conveying efficiency of the PCB 130, a transition roller shaft is further arranged between the two groups of grinding assemblies 200, the transition roller group also comprises at least one group of upper roller shaft 510 and lower roller shaft 520 which are oppositely arranged, one end of the lower roller shaft 520 is connected with a second driving gear 521, and the upper roller shaft 510 and the lower roller shaft 520 are in transmission connection through a transmission gear. In order to ensure that the upper roller shaft 510 and the lower roller shaft 520 can effectively convey the PCB 130, as shown in fig. 10, one end of the upper roller shaft 510 is provided with an elastic compression member 400, and the elastic compression member 400 is used for a conveying gap between the upper roller shaft 510 and the lower roller shaft 520.

In this embodiment, the elastic compression element 400 includes a third fixed block 410 fixedly connected to the fixed plate 100 and a second limit block 420 slidably connected to the third fixed block 410, a fourth fixed block 440 fixedly connected to the fixed plate 100 is disposed above the third fixed block 410, a tension rod 430 is fixedly connected to an upper end of the third fixed block 410, an upper end of the fixed rod penetrates through the third fixed block 410, a tension spring 450 is disposed between the third fixed block 410 and the fourth fixed block 440, the tension spring 450 is a compression spring and is sleeved on the tension rod 430, the tension spring 450 is used for driving the upper roller shaft 510 and the lower roller shaft 520 to approach each other, and when the PCB 130 is conveyed between the upper roller shaft 510 and the lower roller shaft 520, the tension spring 450 is in a compressed state; further, a second limiting groove matched with the second limiting block 420 is formed in one side of the third fixing block 410 in the vertical direction, and the second limiting block 420 can slide linearly along the second limiting groove.

This lifting unit structural design is reasonable compact, through carrying or polishing the parallel wheel and/or the grinding miller of PCB board 130 and go up and down the operation, can adjust the interval of polishing according to the thickness of PCB board 130 for this grinding mechanism's suitability is better, and is applicable in the PCB board of different thickness, and the PCB board that makes different thickness is polished is more even, thereby has improved the production quality of PCB board, has reduced manufacturing cost, has improved production efficiency.

Specifically, for improving the efficiency of polishing of this grinding mechanism, both the first direction and the second direction to the PCB board can be effectively polished, in this embodiment, this swing subassembly mainly used drive grinding miller carries out axial reciprocating motion to control grinding miller and polish in step to the first direction and the second direction of PCB board 130. Further, in this embodiment, two sets of swing assemblies are used to control the first grinding wheel 210 and the second grinding wheel 230 to perform the axial movement operation, respectively, and the two sets of swing control assemblies are the first swing assembly 310 and the second swing assembly 330, respectively. Specifically, the first oscillating assembly 310 is used to control the axial movement of the first grinding wheel 210, and the second oscillating assembly 330 is used to control the axial movement of the second grinding wheel 230. Since the working principle of the first swing element 310 and the second swing element 330 are substantially the same, the first swing element 310 is taken as an example in this embodiment.

As shown in fig. 14, 15 and 16, the swing assembly includes:

a second mounting bracket 321 connected to a side of the fixing bracket and corresponding to an end of the grinding wheel;

the second servo motor 322 is installed on the second installation frame 321 and is in transmission connection with the end part of the grinding wheel through a cam component 323, wherein the second servo motor 322 drives the grinding wheel to swing through the cam component 323;

the second slide rail 3218 is disposed on the second mounting frame 321 along the second direction and disposed along the axial direction of the grinding wheel, the end of the grinding wheel is connected to the second slide rail 3218 through the second connecting frame 325, and the second slide rail 3218 is used to limit the second connecting frame 325 to move linearly.

In this embodiment, the second mounting frame 321 is fixedly connected to the side wall of the fixing plate 100 and corresponds to the end of the first grinding wheel 210, the second servo motor 322 is fixed on the second mounting frame 321, and the output shaft of the second servo motor 322 can be decelerated by the second decelerator 3221; the second servo motor 322 is used for driving the first grinding wheel 210 to move along the axial direction of the first grinding wheel 210.

Further, the second servo motor 322 is connected with the first grinding wheel 210 through a cam assembly 323, and the cam assembly 323 is arranged on the second mounting frame 321; one end of the cam assembly 323 is eccentrically connected with the output shaft of the driving member, and the other end is connected with the end of the first grinding wheel 210 through the second connecting frame 325; the second servo motor 322 can drive the cam assembly 323 to perform an eccentric motion, i.e., a swinging motion, so as to drive one end of the first grinding wheel 210 to move synchronously.

In this embodiment, in order to convert the swinging motion of the cam assembly 323 into a linear motion, the second mounting frame 321 is further provided with two second sliding rails 3218, the number of the second sliding rails 3218 is two and are arranged in parallel, and the purpose of the second sliding rails 3218 is mainly to limit the second connecting frame 325 to move only along the axial direction, so that the number of the second sliding rails 3218 may be one or more; second slide rail 3218 sets up along the axial of first grinding miller 210, second slide rail 3218 and second link 325 adaptation are connected, make second link 325 along axial displacement, this mode is through controlling first grinding miller 210 along axial displacement, can make the PCB board polish along the axial of first grinding miller 210, avoided polishing the second direction again after polishing the first direction, saved process flow, production cost is reduced, the face of polishing that makes the PCB board is polished is more even.

In a specific embodiment, the second mounting bracket 321 includes a rear side plate 3211 connected to the fixing plate 100, a second left side plate 3212 and a second right side plate 3213 respectively connected to two sides of the rear side plate 3211, a second top plate 3214 connected to upper ends of the second left side plate 3212 and the second right side plate 3213, and a bottom plate 3215 connected to lower ends of the second left side plate 3212 and the second right side plate 3213, and the top plate and the bottom plate 3215 are supported and fixed by a supporting rod 3216; two second slide rails 3218 are disposed in parallel at the upper end of the second top plate, the second servo motor 322 is disposed between the second top plate 3214 and the bottom plate 3215 and fixedly connected to the second top plate 3214, an output shaft of the second servo motor 322 passes through the second top plate 3214 and is adaptively connected to the cam assembly 323 disposed at the upper end of the second top plate 3214, and further, a through hole 3217 is disposed on the second top plate 3214 for the output shaft of the second servo motor to pass through.

Specifically, the cam assembly 323 includes:

the eccentric wheel 326 is arranged on the second mounting frame 321 and is eccentrically connected with the output shaft of the second servo motor 322;

one end of the swinging cam is sleeved on the eccentric wheel 326 through a bearing, and the other end of the swinging cam is connected with the second connecting frame 325 through a bearing;

the second servo motor 322 is used to drive the eccentric wheel 326 to eccentrically rotate, so as to drive the swing cam to drive one end of the first grinding wheel 210 to swing.

In this embodiment, the cam assembly 323 is disposed at the upper end of the second top plate 3214 and includes an eccentric 326, and a non-central position of the eccentric 326 is provided with a shaft hole for being connected with the output shaft of the second servo motor 322. Further, the eccentric wheel 326 is installed in the through hole 3217, and the outer diameter of the through hole 3217 is larger than that of the eccentric wheel 326, so that the eccentric wheel 326 can perform eccentric motion. One end of the rocking cam is sleeved on the eccentric wheel 326 through a second bearing 3231, and the other end of the rocking cam is connected with a second connecting frame 325 through a third bearing 3232.

Further, as shown in fig. 16, the rocking cam is disposed between the two second sliding rails 3218, the rocking cam is provided with a first connection hole 3234 and a second connection hole 3235, the first connection hole 3234 is sleeved on the eccentric wheel 326 through a second bearing 3231, and the second connection hole 3235 is sleeved on the second connection frame 325 through a third bearing 3232. In order to avoid increasing the friction force caused by the contact between the rocking cam and the second top plate 3214, which is not beneficial to the rocking motion of the rocking cam, in this embodiment, a raising screw 3233 for raising is screwed on the bottom surface of the rocking cam.

Specifically, the second link frame 325 includes:

the connecting plate is erected at the upper ends of the two second sliding rails 3218, wherein a mounting hole 3252 corresponding to one end of the first grinding wheel 210 is formed in the connecting plate, and one end of the first grinding wheel 210 is connected into the mounting hole 3252 through a bearing;

the connecting column 3251 is fixedly arranged at the bottom end of the connecting plate, and the connecting column 3251 is matched with the second connecting hole 3235 through a bearing;

the second sliding grooves are formed in two sides of the bottom surface of the connecting plate and are matched with the second sliding rails 3218.

In this embodiment, a connecting plate is vertically erected at the upper ends of the two second sliding rails 3218, a mounting hole 3252 corresponding to one end of the grinding wheel is formed in the connecting plate, one end of the grinding wheel is connected to the mounting hole 3252 through a fourth bearing 213, and a stop member 212 is screwed to the end of the grinding wheel, so that the third bearing 3232 is prevented from sliding down through the stop member 212; two sides of the bottom surface of the connecting plate are fixedly provided with a second fixing block 324, the second fixing block 324 is provided with a second sliding groove matched with the second sliding rail 3218, and the second connecting frame 325 stably drives the first grinding wheel 210 to move axially through the matching between the second sliding groove and the second sliding rail 3218. Furthermore, the bottom end of the connecting plate is fixedly provided with a connecting column 3251, and the connecting column 3251 is matched with the second connecting hole 3235 through a third bearing 3232, so that the transmission process is more stable.

Specifically, the fixing plate 100 on the other side of the fixing frame is also provided with a second mounting frame 321, a second sliding rail 3218, and a second connecting frame 325, so as to ensure that the two ends of the first grinding wheel 210 are located on the same horizontal plane when the first grinding wheel 210 moves, and also enable the two ends of the first grinding wheel 210 to stably slide along the axial direction, and the structure on the other side of the fixing frame is not repeated herein.

Further, the end of the first grinding wheel 210 is provided with a driving wheel 214, and the driving wheel 214 is connected to the second driving motor 231 through a belt transmission, so that the first grinding wheel 210 rotates to grind the PCB 130.

Further, as shown in fig. 7 and 8, a supporting frame 120 is disposed on the bottom frame 110, a second lifting assembly 300 for driving the first grinding wheel 210 to lift is connected to the supporting frame 120, in this embodiment, the second lifting assembly 300 is used for controlling the first swinging assembly 310 to lift integrally, the first swinging assembly 310 is connected to the fixing plate 100 in a sliding manner, a third sliding rail 3271 is disposed on the fixing plate 100, third sliding blocks 327 adapted to the third sliding rail 3271 are disposed on two sides of the rear side plate 3211, and the second mounting frame 321 is driven by the second lifting assembly 300 to lift linearly along the third sliding rail 3271.

This swing subassembly structural design is reasonable compact, through controlling first grinding miller 210 along axial displacement, can make first grinding miller 210 polish the PCB board along the axial, avoided present vertically polishing the PCB board back again transversely polishing, saved the process flow of polishing, and manufacturing cost is reduced, it is more even to make the face of polishing of PCB board polish, has improved the grinding efficiency of grinding mechanism and the quality of polishing of PCB board, has reduced workman's working strength.

Specifically, the upper end that lies in grinding component 200 on the mount is equipped with raceway 910, is equipped with a plurality of sprinkler bead on raceway 910, and the sprinkler bead is used for spraying water when polishing for the PCB board and avoids the high temperature of polishing, damages the PCB board.

In this embodiment, the lower end of the polishing assembly 200 is provided with a liquid return funnel 900 fixed to the bottom frame 110, the liquid return funnel 900 has a tapered structure, the bottom end of the liquid return funnel 900 is provided with a water outlet and a water outlet pipe 930 connected to the water outlet, and the liquid return funnel 900 is used for receiving waste liquid. The liquid return hopper 900 is provided with a filter plate to prevent parts of the grinding mechanism from falling into the liquid return hopper 900.

In another embodiment, the invention also provides grinding equipment for the PCB, and the grinding equipment comprises the grinding mechanism.

The grinding mechanism is reasonable and compact in structural design and high in automation degree, the grinding distance between the grinding wheel and the parallel wheel is automatically adjusted through the lifting assembly, the debugging precision is high, the grinding surface of the PCB is more uniform, the grinding equipment is good in adaptability, is suitable for PCBs with different thicknesses, can reduce the operation intensity of workers, and avoids the influence on the appearance quality of the PCB due to the fact that the manually adjusted grinding distance is not uniform; the grinding wheel is driven by the swinging assembly to move along the axial direction, so that the PCB can be ground along the second direction while the grinding assembly is used for grinding the PCB along the first direction, the condition that the same PCB needs to be ground for multiple times is avoided, the grinding process flow is reduced, the production cost is reduced, and the production efficiency is improved.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A grinding mechanism for PCB board equipment of polishing, its characterized in that includes:

a fixed mount;

the lifting assembly is connected to the fixing frame and is used for driving the grinding wheel and/or the parallel wheel to lift so as to adjust the grinding distance between the grinding wheel and the parallel wheel;

2. The grinding mechanism for a PCB board grinding device of claim 1, wherein the grinding components are two sets and are arranged in parallel, and the two sets of grinding components respectively comprise a first grinding wheel and a first parallel wheel which are arranged in parallel and a second grinding wheel and a second parallel wheel which are arranged in parallel, and the first grinding wheel and the second grinding wheel are respectively used for grinding the upper surface and the lower surface of the PCB board.

3. The grinding mechanism for a PCB board grinding apparatus of claim 1, wherein the lifting assembly comprises:

the lifting unit is connected to the fixed frame;

wherein, the lift unit includes:

one end of the lifting screw is connected with one end of the grinding wheel and/or the parallel wheel through a first connecting frame, the other end of the lifting screw is connected with an output shaft of the first servo motor in an adaptive mode through a matching piece, and the first servo motor is used for driving the lifting screw to drive the grinding wheel and/or the parallel wheel to move up and down.

4. The grinding mechanism for a PCB board grinding apparatus of claim 3, wherein the lifting assembly further comprises:

5. The grinding mechanism for a PCB board grinding apparatus of claim 4, wherein the lifting assembly further comprises:

the measuring instrument is connected to the first mounting frame, is in adaptive connection with the first connecting frame, and is used for measuring the moving stroke of the first connecting frame.

6. The grinding mechanism for a PCB board grinding apparatus of claim 1, wherein the swing assembly comprises:

the second sliding rail is arranged on the second mounting frame along the axial direction of the grinding wheel, the end part of the grinding wheel is connected with the second sliding rail in an adaptive mode through a second connecting frame, and the second sliding rail is used for limiting the second connecting frame to move linearly.

7. The grinding mechanism for a PCB board grinding device of claim 1, wherein the rotation speed of the grinding wheel is greater than that of the parallel wheels, and the grinding wheel and the parallel wheels are opposite in rotation direction.

8. The grinding mechanism for a PCB polishing apparatus of claim 7, wherein the outer diameter of the grinding wheel is larger than the outer diameter of the parallel wheel, and the mesh number of the grinding wheel is 400 mesh or 600 mesh or 800 mesh.

9. The grinding mechanism for a PCB board grinding apparatus according to claim 1, further comprising:

the water pipe is arranged on the fixing frame and positioned at the upper end of the polishing component, and a plurality of water spraying heads are arranged on the water pipe and used for spraying water when the PCB is polished;

and the liquid return hopper is arranged on the fixed frame and positioned at the lower end of the polishing assembly and used for recovering waste liquid.

10. A PCB board grinding apparatus comprising a grinding mechanism as claimed in any one of claims 1 to 9.