CN115360568B - Heat transfer device, laser module, laser array system and design method - Google Patents
Heat transfer device, laser module, laser array system and design method Download PDFInfo
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- CN115360568B CN115360568B CN202211025599.5A CN202211025599A CN115360568B CN 115360568 B CN115360568 B CN 115360568B CN 202211025599 A CN202211025599 A CN 202211025599A CN 115360568 B CN115360568 B CN 115360568B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a heat transfer device, a laser module, a laser array system and a design method, which belong to the technical field of lasers, wherein the heat transfer device comprises a temperature equalization plate and a cooling module, one end of the temperature equalization plate can be used as a heat absorption end for absorbing heat on a device by utilizing corresponding arrangement of a cavity accommodated by the temperature equalization plate Wen Banzhong, a rod core and a heat exchange matrix in the cavity accommodated by the temperature equalization plate, the heat absorption and the heat transfer are completed by utilizing phase change of the heat exchange matrix, and the heat exchange between the other end of the temperature equalization plate and the cooling module is completed, so that the heat transfer and the heat release in the working process of the device are realized. The heat transfer device provided by the invention has the advantages of simple structure and convenience in arrangement, can realize reliable heat transfer of corresponding devices, ensures the heat transfer efficiency, provides conditions for modularized heat transfer design of the devices, simplifies the maintenance procedures of the corresponding devices, shortens the maintenance time of the corresponding devices, ensures the reliability and safety of the work of the devices, and has good practical value and application prospect.
Description
Technical Field
The invention belongs to the technical field of lasers, in particular to the optimization field of heat transfer of an optical fiber laser and maintainability of an optical fiber laser array, and particularly relates to a heat transfer device, a laser module comprising the heat transfer device, a laser array system and a design method of the laser array system.
Background
Along with the needs of industrial processing, the application of fiber laser sources of thousands to tens of thousands of watts is more extensive, and is limited by the output power of a single fiber laser module, the fiber laser sources of thousands to tens of thousands of watts generally need to adopt a fiber beam combining means, and after a plurality of fiber laser modules are integrated into an array, the output power of each module is combined by using a fiber beam combiner and then output.
Currently, for the thermal control mode of a single fiber laser module, a metal cold plate is generally used as an integration and heat transfer device of a laser device. The fiber laser device is integrated on a cold plate and a refrigerant flow channel is machined in the metal cold plate. The refrigerating working medium absorbs heat generated by the fiber laser device and heats up while flowing through the cold plate, and after flowing out of the cold plate, the refrigerating working medium is cooled and flows back into the laser cold plate through an external circulation heat control system. The inner flow passage of the cold plate is communicated with the external circulation cooling loop. The processing method, the design thought and the related processing technology are very mature, and can meet the cooling and setting requirements of the laser device to a certain extent, but according to long-time application and research, the traditional thermal control mode still has some defects, which are mainly reflected in the following aspects:
1. because the refrigerant is required to be in contact with the pipeline, and the refrigerant is required to circularly flow between the heat transfer source and the heat exchange source during working, when a single module in the array is maintained, a valve, a plug pipeline, a short circuit pipeline and the like are required to be closed, and the maintenance process is complicated.
2. Because the metal cold plate runner is communicated with an external heat control system pipeline, the problem of leakage of heat transfer working medium inevitably occurs in the maintenance process.
3. The existing thermal control mode needs to independently manage each module, the number of valves is large, and the potential safety hazard of working medium leakage is further increased; if the valve is closed incorrectly, a large amount of refrigerant is easy to gush out when the pipeline is plugged and unplugged due to higher pressure in the pipeline. The reduction of the refrigeration working medium not only can reduce the thermal control stability; moreover, because a large number of high-power electric appliances exist in the array, and most of the refrigerating working media are not insulated, accidents such as short circuit and electric shock are likely to be caused by leakage of the refrigerating working media, and great potential safety hazards are brought.
4. Along with the improvement of laser array integration level, the space for setting up heat transfer device on each laser unit is smaller and smaller, leads to the setting degree of difficulty of traditional thermal control form to need carry out extra design to the structure of metal cold plate and runner, and the thermal control ability after the extra design also can not necessarily fully satisfy practical application's demand.
Disclosure of Invention
Aiming at one or more of the defects or improvement demands of the prior art, the invention provides a heat transfer device, a laser module, a laser array system and a design method, which can realize the modularized design of the heat transfer device and a laser unit, effectively meet the heat transfer and heat exchange demands of a laser and ensure the reliability of the use and maintenance of the laser.
To achieve the above object, in one aspect of the present invention, there is provided a heat transfer device for conducting heat of a device; the cooling device comprises a temperature equalizing plate and a cooling module;
one end of the temperature equalizing plate is a heat absorbing end which can be contacted with a device and is used for absorbing heat on the device, and the other end of the temperature equalizing plate is a heat radiating end matched with the cooling module and is used for transmitting the absorbed heat to the cooling module; and is also provided with
At least one accommodating cavity is arranged in the temperature equalization plate; the accommodating cavity extends from the heat absorbing end to the heat dissipating end, and at least one rod core extending along the extending direction of the cavity is arranged in the accommodating cavity; the rod core is of a porous rod-shaped structure, and the accommodating cavity is filled with a heat exchange matrix; the heat exchange matrix can absorb heat and gasify at the heat absorption end and release heat and liquefy at the heat dissipation end, and the liquefied heat exchange matrix can be adsorbed on the rod core and conducted to the heat absorption end;
the cooling module is used for being connected with an external thermal control system, is in contact with the heat dissipation end of the temperature equalization plate, and is used for absorbing heat transferred to the heat dissipation end and transmitting the heat out.
As a further improvement of the invention, the rod core is a metal sintered aluminum rod core;
and/or
The heat exchange matrix is filled with ammonia arranged in the accommodating cavity.
As a further improvement of the invention, the heat absorbing end is horizontally arranged, and one end from the heat radiating end to the heat absorbing end extends vertically upwards, so that the section form of the temperature equalizing plate is L-shaped;
correspondingly, the rod core is L-shaped formed by combining a horizontal section and a vertical section.
As a further improvement of the invention, the cooling module is connected with the temperature equalizing plate through a plurality of locking pieces, and an interface filling material is filled between the cooling module and the temperature equalizing plate.
As a further improvement of the invention, a plurality of unlocking mechanisms are arranged on the cooling module and are used for overcoming the adhesion force of the interface filling material and realizing the separation of the cooling module and the temperature equalization plate.
As a further development of the invention, a plurality of said rod cores share the same cooling module.
As a further improvement of the invention, a micro-channel is arranged at the position of the cooling module opposite to the radiating end, and a flowable cooling working medium is arranged in the micro-channel.
In another aspect of the invention, a laser module is provided, comprising a laser unit and the heat transfer device;
the laser unit is connected with the heat absorption end of the temperature equalization plate, an independent module is formed by the laser unit and the heat absorption end, and the independent module is connected with the cooling module.
In another aspect of the present invention, there is also provided a laser array system including a plurality of device units arranged in an array form, a corresponding part or all of the device units of which are provided with the heat transfer device;
the device unit is connected with the heat absorption end of the temperature equalization plate, an independent module is formed by the device unit and the heat absorption end, and the independent module is connected with the cooling module; and is also provided with
At least one of the device units is a laser unit.
In another aspect of the present invention, there is also provided a method for designing a laser array system, for designing the laser array system, comprising the steps of:
(1) Calculating thermodynamic parameters of each device unit according to the performance or working requirements of the laser array system; the thermodynamic parameters include, but are not limited to, heat generation power, heat generation region, heat control temperature, heat flux density, and thermal inertia;
(2) Determining the setting position of each device unit according to the integration requirement, and determining the type of the heat exchange matrix in the temperature equalization plate according to the thermodynamic parameter of the corresponding device unit;
(3) Determining the connection relation between the temperature equalization plate and the corresponding device unit according to the integration requirement, and determining the condensation area and the evaporation area of the temperature equalization plate;
(4) Determining the materials and structures of the temperature equalization plate and the cooling module according to the integration requirement and the thermal control requirement, setting the setting mode of the rod core in the temperature equalization plate on the basis, and packaging the heat exchange matrix in the accommodating cavity of the temperature equalization plate;
(5) The locking piece is arranged according to the connection of the cooling module and the temperature equalization plate, and the heat exchange temperature difference delta T of the external heat control system is determined according to the following formula:
△T＝QL/kA
wherein Q is the heat transmitted, L is the heat transmission distance, k is the heat conductivity, and A is the area through which the heat flux flows;
(6) Each device unit is respectively connected with the heat absorption end of the temperature equalization plate which is correspondingly designed to form an independent module, and the independent module is connected and arranged in the array system; and connecting the cooling module in the array system, and connecting the cooling module with the heat dissipation end of the corresponding temperature equalization plate to form the laser array system.
The above-mentioned improved technical features can be combined with each other as long as they do not collide with each other.
In general, the above technical solutions conceived by the present invention have the beneficial effects compared with the prior art including:
(1) The heat transfer device comprises the temperature equalization plate and the cooling module, wherein the cavity is accommodated by utilizing the temperature equalization plate Wen Banzhong, and the rod cores and the heat exchange matrixes in the cavity are correspondingly arranged, so that one end of the temperature equalization plate can be used as a heat absorption end for absorbing heat on a device, the phase change of the heat exchange matrixes is utilized to complete the absorption and transfer of the heat, and the heat exchange between the other end of the temperature equalization plate and the cooling module is completed, so that the heat transfer and release in the working process of the device are realized, the reliability of the heat transfer is ensured, and the reliable working of the device is realized.
(2) According to the heat transfer device, the rod core structure with the porous form is arranged in the mode of optimizing the arrangement form of the rod core, the heat exchange matrix after heat release and liquefaction is reliably adsorbed by the rod core structure, and the heat exchange matrix is transferred at the two ends of the rod core under the action of capillary force, so that the heat transfer cycle efficiency of the heat transfer device is improved; meanwhile, the heat dissipation end of the rod core is further preferably arranged in a vertically extending mode, so that the liquid heat exchange matrix adsorbed by the rod core can accelerate the transmission efficiency under the action of gravity, the setting length of the temperature equalization plate is effectively shortened, the heat exchange area between the heat dissipation end and the cooling module is enlarged, and the heat transfer efficiency and the heat exchange efficiency are further improved.
(3) According to the heat transfer device, the interface filling material is arranged between the temperature equalization plate and the cooling module, so that the connection reliability between the temperature equalization plate and the cooling module can be improved, the connection gap between the temperature equalization plate and the cooling module can be accurately eliminated, the heat resistance during heat transfer between the temperature equalization plate and the cooling module is reduced, and the heat exchange efficiency of the temperature equalization plate is improved; meanwhile, through the arrangement of the unlocking mechanism on the cooling module, the separation of the temperature equalizing plate and the cooling module can be realized rapidly, the adsorption force introduced by the arrangement of the interface filling material is overcome, and the maintainability of the heat exchange device is improved.
(4) According to the laser module and the laser array system, the device units and the temperature equalization plates in the heat transfer device are arranged in a modularized mode, and particularly the laser units and the temperature equalization plates in the heat transfer device are connected in a modularized mode, so that the laser units and the temperature equalization plates can be synchronously assembled and disassembled on the array system to form an integral modularized structure, and a pipeline for directly communicating working media does not exist between the modular structure formed by combining the laser units and the temperature equalization plates and an external thermal control system, so that maintenance and installation processes can be further simplified, leakage of heat exchange matrixes or cooling working media is avoided, and safety and reliability of equipment operation are guaranteed.
(5) The design method of the laser array system has the advantages of simple steps and strong operability, can accurately complete the design and the setting of the laser array system, ensures the heat transfer and heat exchange requirements of each device unit in the laser array system, simplifies the maintenance process of the corresponding device unit in the laser array system, realizes the modularized maintenance of the corresponding device unit, shortens the maintenance procedures and the maintenance time, and improves the convenience and the safety of the setting and the use of the laser array system.
(6) The heat transfer device provided by the invention has the advantages of simple structure and convenience in arrangement, can realize reliable heat transfer of corresponding devices, ensures the heat transfer efficiency, provides conditions for modularized heat transfer design of the devices, simplifies the maintenance procedures of the corresponding devices, shortens the maintenance time of the corresponding devices, ensures the reliability and safety of the work of the devices, and has good practical value and application prospect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a heat transfer device in an embodiment of the invention;
like reference numerals denote like technical features throughout the drawings, in particular:
100. a heat transfer device; 200. a laser unit;
110. a temperature equalizing plate; 120. a cooling module; 130. an interface filler material; 140. a locking piece;
111. a heat exchange matrix; 112. a rod core; 121. a microchannel; 122. and an unlocking mechanism.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Examples:
referring to fig. 1, a heat transfer device 100 in a preferred embodiment of the present invention includes a temperature equalizing plate 110 and a cooling module 120, wherein one end of the temperature equalizing plate 110 is a heat absorbing end, which is in abutting fit with a laser unit 200, and is used for absorbing heat generated during operation of the laser unit 200 and transferring the heat to the other end; the other end of the temperature equalizing plate 110 is a heat dissipation end, which is connected to the cooling module 120 and is used for transferring heat to the cooling module 120 and guiding out from the cooling module 120, so as to complete the heat transfer and cooling process of the laser unit 200.
Specifically, the temperature equalization plate 110 in the preferred embodiment is preferably made of an aluminum alloy material, in which a receiving cavity is formed, and a heat exchange matrix 111 and a rod core 112 are embedded in the receiving cavity. Wherein, the accommodating cavity is preferably provided in a vacuum form or a low vacuum form, and the heat exchange matrix 111 provided in the accommodating cavity is more preferably specifically ammonia, and the absorption of heat from the laser unit 200, the transfer in the temperature equalizing plate 110 and the heat exchange release with the cooling module 120 are completed by utilizing the phase change between ammonia water and ammonia gas.
Meanwhile, the rod core 112 in the preferred embodiment is preferably an aluminum rod core, which is preferably manufactured by a metal sintering method, and a pore network is densely formed on the rod core 112, so that a strong capillary force is provided for the liquid heat exchange matrix 111, thereby adsorbing the liquid heat exchange matrix and realizing the transmission between the two ends of the rod core 112.
In order to shorten the lateral dimension of the heat transfer device 100 and improve the lateral transport capacity of the liquid heat exchange matrix 111, the temperature equalizing plate 110 in the preferred embodiment is configured in an "L-shaped" or "T-shaped" structure, which includes a heat absorbing end disposed horizontally and a heat dissipating end disposed at an angle to the heat absorbing end, for example, in the preferred embodiment shown in fig. 1, the temperature equalizing plate 110 is configured in a "T-shaped" structure in which the heat absorbing end is disposed horizontally, the heat dissipating end is disposed vertically, and the receiving cavity further preferably includes a "horizontal section" and a "vertical section"; accordingly, one end of the rod core 112 is disposed horizontally in the "horizontal section" of the receiving cavity and the other end extends vertically into the "vertical section" of the receiving cavity, forming an "L-shaped" structure as shown in fig. 1.
Through the arrangement, the extension length of the accommodating cavity can be fully ensured, and the heat exchange path is ensured to meet the thermodynamic transmission requirement of the heat exchange matrix 111; moreover, by vertically arranging the heat dissipation ends, the horizontal length of the temperature equalization plate 110 can be shortened, and on the basis of not increasing the horizontal length of the heat transfer device 100, the matching length of the cooling module 120 and the temperature equalization plate 110 is prolonged, and the heat exchange area between the two is increased. Meanwhile, by the heat dissipation end of the temperature equalization plate 110 and the vertical arrangement of the rod core 112 in the heat dissipation end, the vapor heat exchange matrix 111 can be liquefied and adsorbed on the rod core 112 after heat dissipation and condensation, and the transmission between the two ends of the rod core 112 is accelerated under the action of gravity.
In actual setting, more than one rod core 112 may be configured corresponding to the same laser unit 200 according to the heating power and heating area of the laser unit 200, and the plurality of rod cores 112 may be simultaneously set in the same temperature equalizing plate 110 or may be set in a plurality of temperature equalizing plates 110 set side by side. For example, in a preferred embodiment, the plurality of accommodating cavities are arranged side by side in the temperature equalizing plate 110 at the same time, and each accommodating cavity is provided with a rod core 112; of course, in actual installation, the plurality of cores 112 may be disposed in the same accommodating cavity side by side at the same time, which is not limited herein.
Further, the cooling module 120 is closely connected with the heat dissipation end of the temperature equalization plate 110, and the connection between the cooling module 120 and the heat dissipation end of the temperature equalization plate 110 is further preferably achieved by providing a locking member 140, and one end of the locking member 140 preferably penetrates through the cooling module 120 and extends into the heat dissipation end of the temperature equalization plate 110, and the cooling module and the heat dissipation end of the temperature equalization plate are further preferably connected through threads. Of course, in actual setting, the connection form between the cooling module 120 and the temperature equalization plate 110 may be replaced correspondingly according to the setting requirement, for example, magnetic attraction fit, snap fit, etc.
Meanwhile, in order to improve the heat exchange efficiency of the heat dissipation end of the temperature equalization plate 110, a plurality of micro channels 121 are arranged in the area, opposite to the rod core 112, of the cooling module 120, and are connected with an external heat control system, and a flowable cooling working medium is arranged in the micro channels 121, so that the heat dissipation and condensation of the heat exchange matrix 111 are completed by driving the heat absorbed by the cooling module 120 in real time through the flow of the cooling working medium.
In order to achieve close adhesion between the temperature equalization plate 110 and the cooling module 120, heat transfer resistance caused by an air gap is prevented from being introduced between the temperature equalization plate 110 and the cooling module 120, heat transfer effect is improved, and an interface filling material 130 is arranged between the temperature equalization plate 110 and the cooling module 120 to fill gaps between the temperature equalization plate 110 and the cooling module 120. In actual setting, the setting thickness of the interface filler 130 is preferably not more than 0.1mm, and the tightening torque of the tightening latch 140 is not less than 2n·m.
In more detail, the interface filling material 130 in the preferred embodiment is preferably a thermally conductive rubber (e.g., thermally conductive silicone grease), a thermally conductive resin (e.g., highly thermally conductive polyurethane resin), or a liquid metal, which can reliably fill the gap between the temperature uniformity plate 110 and the cooling module 120.
Further, the interface filling material 130 has a certain adhesion, so that the temperature equalizing plate 110 and the cooling module 120 are not easily separated when there is a separation requirement. Therefore, in the preferred embodiment, for the separation of the cooling module 120 from the temperature equalization plate 110, an unlocking mechanism 122 is further provided, so that the adhesion of the interface filling material 130 to the two structures can be overcome, and the rapid separation between the two structures can be realized.
In a specific embodiment, the unlocking mechanism 122 preferably comprises a nut provided on the cooling module 120 and a screw with threads matching in the nut, wherein the abutment of the screw end with the interface filler material 130 can be achieved by screwing the screw to rotate, and the adhesion of the interface filler material 130 can be counteracted by screwing in, so that the two are separated.
Of course, according to the actual application and the setting requirement, the unlocking mechanism 122 may be set in another form, for example, in a knocking manner, so long as the two can be quickly separated, which is not described herein.
By the corresponding arrangement of the heat transfer device 100 as described above, a compact application of the heat transfer device 100 in a laser array system can be fully ensured.
More specifically, in one particularly preferred embodiment, a laser module is also disclosed that includes a laser unit 200 with the heat transfer device 100 described above.
In more detail, the laser unit 200 is disposed above the heat absorbing end of the temperature equalizing plate 110, and the two are connected to form an independent module, and then the independent module is connected to the cooling module 120, thereby completing the overall arrangement. Meanwhile, in the actual arrangement, the number of the arrangement of the temperature equalizing plates 110 in the longitudinal direction of the laser unit 200 is more preferably more than one, and when the heat transfer devices 100 are plural, the plural heat transfer devices 100 are arranged at intervals in the longitudinal direction of the laser unit 200. Of course, when the temperature equalizing plate 110 is provided in a plurality of embodiments, the plurality of temperature equalizing plates 110 may share the same cooling module 120, and this may be applied when the plurality of independent modules are provided side by side, that is, the plurality of independent modules share the same cooling module 120, and at this time, the cooling modules 120 extend along the direction in which the independent modules are provided side by side.
In addition, for the connection between the temperature equalizing plate 110 and the laser unit 200, in the preferred embodiment, a filling material is disposed between the two, which is similar to the interface filling material 130 in arrangement form and function, so that a gap between the top surface of the heat absorbing end of the temperature equalizing plate 110 and the bottom of the laser unit 200 can be effectively filled, and the reliability of heat transfer between the two is ensured.
In actual operation, after the laser unit 200 heats, the liquid heat exchange matrix 111 (such as liquid ammonia) absorbs heat and evaporates, and because there is a pressure difference between the evaporation area (the heat absorption end cavity of the temperature equalization plate 110) and the condensation area (the heat dissipation end cavity of the temperature equalization plate 110), the gaseous heat exchange matrix 111 moves horizontally and vertically to the condensation area under the action of pressure, and then releases heat and liquefies, and the metal sintered aluminum rod core 112 can provide a stronger capillary force for the liquid heat exchange matrix 111, and is vertically and horizontally transferred from the cooling area to the evaporation area, so that heat transfer from the heating device to the cooling module 120 can be continuously completed.
The data show that the heat transfer power of the aluminum ammonia channel structure can reach at least 200W, and the heat flow density of the treatable aluminum ammonia channel structure is not less than 5W/cm 2 . If the heat exchange matrix 111 (ammonia) is transported by the metal sintered aluminum rod core 112 in the preferred embodiment, the heat transfer power will be stronger and the actual heat transfer distance will not exceed 1m. Therefore, under the condition of the same cross-sectional area, the heat transfer power and the heat flow density of the heat transfer device 100 in the preferred embodiment can be at least 1 time, the heat conductivity can reach 1000W/(m.K), the heat conductivity is more than 3 times of the heat conductivity of red copper, the heat conductivity is more than 5 times of the heat conductivity of aluminum alloy, and the heat exchange efficiency of the heat transfer device 100 is greatly improved.
Illustratively, a high power LD (Laser Diode) in a fiber Laser is the device with the greatest heat generation power and the greatest heat flux density in an independent module. For example, the heating power of a certain type of LD is about 250W, and the heat flux density is about 4W/cm 2 The evaporation area of the temperature equalization plate 110 is arranged below the LD, the vertical part where the condensation area of the temperature equalization plate 110 is arranged is taken as the packaging outer shell of the independent module, the heat transfer path generated by the LD is less than 1m, the section size of the aluminum bar core 112 is preferably 4mm multiplied by 4mm, and 6-8 aluminum bar cores 112 can be arranged at the lower part of the LD. Reducing the number of aluminum rod cores 112 requires improving the heat transfer capability of a single aluminum rod core 112, and the cross-sectional dimension is correspondingly enlarged, so that the size of the temperature equalizing plate 110 is thickened. It can be seen that the design and arrangement of the aluminum core 112 can be changed according to practical requirements.
In order to make the advantages of the heat transfer device 100 for improving the maintainability of the laser array according to the embodiment of the present invention more clear, a specific embodiment is listed below to compare the maintainability of the heat transfer device 100 according to the embodiment of the present invention with the cold plate using the conventional method.
For both of the above approaches, it is assumed that the heating power of the individual laser units is 2kW.
When the metal cold plate in the traditional mode is adopted, 2 water cooling loops are adopted to complete heat transfer, one loop transfers heat for a plurality of high-power LD devices, and the other loop transfers heat for a low-power optical fiber device. The 2 loop internal volumes are not less than 0.5L, requiring 4 lines. In addition, 8M 6 screws are required to act on two opposite sides of the independent module, respectively, so that the laser independent module is fixed on the laser array frame. When the independent module is detached from the array, the external thermal control system valve is closed firstly, then 4 refrigeration pipelines are detached and cooling water in the 4 refrigeration pipelines is discharged, and 0.5L of water is formed by 2 parts of water
Is slowly discharged without pressure in the pipeline, so far, the time t is consumed 1 More than or equal to 150s, the time for loosening 8M 6 screws is t 2 More than or equal to 40s, additionally taking 1 pipeline joint to short the dismantled thermal control system pipeline, consuming time t 3 And more than or equal to 20s. In actual operation, 0.5L of water in the metal cold plate and water in the pipeline of the thermal control system have a certain amount of leakage, so that during the operation, on one hand, short circuit of an electric appliance is prevented, and on the other hand, after dismantling is completed, the leaked water is treated to eliminate other potential safety hazards, and the time is consumed by t 4 And more than or equal to 30s. When the independent modules are re-integrated in the array, 4 heat control system pipelines are required to be connected to the metal cold plate through 4 connectors again, then valves of the heat control system pipelines are opened, and time is consumed t 5 More than or equal to 30s, finally fastening 8M 6 screws again, and consuming time t 6 And more than or equal to 40s. It can be seen that the conventional cold plate is provided corresponding to the laser unit 200, and the maintenance process thereof requires at least 9 steps, respectively:
1. closing the valve;
2. dismantling the pipeline;
3. discharging water;
4. loosening the fixing screw;
5. shorting the thermal control system lines;
6. treating the leaked water;
7. the pipeline of the heat pipe system is connected with the metal plate of the independent module;
8. locking a screw tightly;
9. the valve is opened.
The whole process requires time consuming: t is t Total 1 ＝t 1 +t 2 +t 3 +t 4 +t 5 +t 6 ≥150+40+20+30+30+40＝310s。
In contrast, when the heat transfer device 100 in the preferred embodiment is provided for the laser unit 200, the independent modules (the laser unit 200 and the temperature equalizing plate 110 provided in connection with each other) are not in communication with the external thermal control system circuit. At this time, 14M 6 screws are required, wherein 4 screws are respectively applied to two opposite sides of the independent module, so that the independent module is fixed to the laser array frame, and 10 screws are used for locking the temperature equalizing plate 110 and the cooling module 120. When the independent module is detached from the array, 16M 6 screws are loosened, which takes time t 7 70s or more, a group 1 unlocking mechanism 122 separates the independent module from the cooling module 120 in a precession manner, which takes time t 8 And more than or equal to 20s. When the individual modules are re-integrated into the array, 0.1mm heat conductive silicone grease is smeared as the interface filling material 130 on the condensation area of the individual module temperature equalization plate 110, which takes time t 9 More than or equal to 20s, 14M 6 screws are tightly locked, and the time is consumed t 10 And more than or equal to 70s. The whole maintenance process can be seen to be totally 4 steps of processes, namely:
1. loosening the fixing screw;
2. precession unlocking mechanism 122;
3. applying interface filler material 130;
4. and (5) tightly locking the screw.
Time t is required Total 2 ＝t 7 +t 8 +t 9 +t 10 ≥70+20+20+70＝210s。
By contrast, in a quantifiable project, the number of steps in the process was reduced by 56% and a 32% reduction in a single complete maintenance. Moreover, with the traditional mode, the water storage capacity in the water tank is reduced, so that water supply is insufficient, and 'water supplementing time consumption' is additionally increased. The water replenishment time is dependent on the distance between the device and the water supply point. Assuming that the two are closer, the water supplementing time is more than or equal to 300 seconds. In the unquantifiable project, the invention eliminates the potential safety hazards of short circuit, electric leakage and the like caused by leakage of working media.
It is apparent that the heat transfer scheme of the preferred embodiment of the present invention has great advantages over the conventional cold plate heat transfer scheme in terms of maintainability, and can effectively improve maintainability of the laser unit 200.
Further, in another embodiment of the present invention, a laser array system is provided, which includes a plurality of device units arranged in an array, and at least one of the device units is a laser unit 200. Accordingly, the heat transfer device 100 is provided for part or all of the device units, each device unit is connected with the temperature equalizing plate 110 of the heat transfer device 100 to form an independent module, and the cooling module 120 is provided for each independent module, so that the independent module is connected with the cooling module 120 through the interface filling material 130 to form a laser array system with high maintainability.
Meanwhile, in another embodiment of the present invention, there is also provided a method for designing a laser array system with the heat transfer device 100, which comprises the following specific steps:
1. according to the performance or working requirements of the fiber laser (laser array system), thermodynamic parameters such as heating power, heating area, thermal control temperature, heat flux density, thermal inertia and the like of each device unit are calculated;
2. determining the setting position of each device unit according to the integration requirement, and determining the type of the heat exchange matrix 111 in the temperature equalization plate 110 according to the thermodynamic parameter of the corresponding device unit, so as to ensure that the work of the heat exchange matrix 111 meets the thermodynamic parameter setting requirement of the device unit;
meanwhile, for the high heating power device units, the heat transfer devices 100 are respectively arranged corresponding to the high heating power device units; regarding the device units with small heating power and low heat flux, consider whether the heat transfer device 100 can be shared with the device units with large heating power, if so, the heat transfer device 100 is integrated; if the heat transfer device 100 can not be shared, the device units with small heating power and low heat flux density can be preferably integrated in a certain area in a concentrated manner, and then the heat transfer device 100 is arranged in the area for unified heat control;
3. determining a condensation area of the temperature equalization plate 110 according to the integration requirement, wherein the condensation area is preferably arranged on the long side of the independent module;
4. determining an evaporation area of the temperature equalization plate 110 according to the integration requirement; in a typical case, the area below the device unit is the evaporation area of each aluminum rod core 112 in the temperature equalizing plate 110, and at this time, the heat transfer path of each device unit may be determined, including: a heat transfer path line, a heat transfer path length, the bending times of the aluminum bar core and the like;
5. determining the materials and the structural forms of the temperature equalization plate 110 and the cooling module 120 according to the thermal control requirement;
wherein, the temperature equalizing plate 110 and the cooling module 120 are preferably made of stainless steel, and the cooling module 120 is internally provided with a micro-channel 121 group, and the design type, size and number of the micro-channel 121 group are preferably dependent on the performance of an external thermal control system, and meanwhile, the condensation requirement of the heat exchange matrix 111 is required to be met; in addition, the heat transfer wall thickness of the temperature equalizing plate 110 and the cooling module 120 is preferably equal to or less than 1mm;
6. setting the setting form of the aluminum bar core 112 according to the integration requirement, and packaging the heat exchange matrix 111 in the accommodating cavity;
in actual arrangement, one end of the aluminum rod core 112 preferably extends vertically in the condensation area, so that the conveying effect of the aluminum rod core 112 on the liquid heat exchange matrix 111 is improved by utilizing gravity;
meanwhile, if the size in the vertical direction is insufficient to meet the requirement of the condensation area, the aluminum rod core 112 is preferably bent in the vertical plane, and the bending angle depends on practical situations. However, since the heat transfer power of each 90 ° bending of the aluminum bar core 112 is reduced by about 10%, the aluminum bar core 112 is preferably laid in a diagonal manner without affecting the heat transfer of other device units, so that the bending times can be reduced, and the heat transfer distance can be shortened;
7. the locking member 140 and the unlocking mechanism 122 are provided for the cooling module 120 and the temperature equalizing plate 110 such that the force applied by the unlocking mechanism 122 in the cooling module 120 does not act on the condensation area of the temperature equalizing plate 110;
8. the interface filling material 130 which can be filled between the heat dissipation end of the temperature equalization plate 110 and the cooling module 120 is designed or selected, and the material type and the size parameters of the interface filling material are determined, and the thickness of the interface filling material is preferably less than or equal to 0.1mm;
9. the external thermal control system is designed by determining the temperature difference of the cooling module 120 according to the heat transfer formula when the steady-state heat transfer path is L, and the calculation of the heat exchange temperature difference DeltaT preferably refers to the following formula:
△T＝QL/kA
wherein Q is the transmitted heat, L is the heat transfer distance, k is the heat conductivity, A is the area through which the heat flux flows; meanwhile, in a preferred embodiment, the thermal conductivity of the temperature equalization plate 110 is not less than 1000W/(m.K), the thermal conductivity of the interface filling material 130 is not less than 5W/(m.K), the thermal conductivity of the aluminum alloy and the stainless steel can be obtained through table lookup, the temperature of the LD in the fiber laser is set to be not more than 25 ℃, and the temperature of the gain fiber and other fiber devices is set to be not more than 40 ℃;
10. each device unit is respectively connected with the temperature equalization plate 110 in the corresponding heat transfer device 100 to form an independent module, the independent module is connected and arranged in the array system, and the corresponding cooling module 120 is arranged in the array system, so that the cooling module 120 is connected with the heat dissipation end of the corresponding temperature equalization plate 110, and the laser array system with high maintainability is formed.
Through the design process, the laser array system can be set, the modularized design between the heat transfer device 100 and the unit type devices in the laser array system is realized, the reliable setting and the rapid maintenance of a single independent module are realized, the problems of complicated working procedures, leakage of heat exchange matrixes, long time consumption and the like in the maintenance of the traditional laser array system are solved, and the laser array system has stronger research and practical application values.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (8)
1. The design method of the laser array system is used for designing the laser array system and is characterized in that the laser array system comprises a plurality of device units which are arranged in an array form, and a heat transfer device is arranged corresponding to part or all of the device units;
the heat transfer device comprises a temperature equalizing plate and a cooling module;
one end of the temperature equalizing plate is a heat absorbing end which can be contacted with a device and is used for absorbing heat on the device, and the other end of the temperature equalizing plate is a heat radiating end matched with the cooling module and is used for transmitting the absorbed heat to the cooling module; and is also provided with
At least one accommodating cavity is arranged in the temperature equalization plate; the accommodating cavity extends from the heat absorbing end to the heat dissipating end, and at least one rod core extending along the extending direction of the cavity is arranged in the accommodating cavity; the rod core is of a porous rod-shaped structure, and the accommodating cavity is filled with a heat exchange matrix; the heat exchange matrix can absorb heat and gasify at the heat absorption end and release heat and liquefy at the heat dissipation end, and the liquefied heat exchange matrix can be adsorbed on the rod core and conducted to the heat absorption end;
the cooling module is used for being connected with an external thermal control system, is in contact with the heat dissipation end of the temperature equalization plate, and is used for absorbing heat transferred to the heat dissipation end and transmitting the heat out;
the device unit is connected with the heat absorption end of the temperature equalization plate, an independent module is formed by the device unit and the heat absorption end, and the independent module is connected with the cooling module; and at least one of the device units is a laser unit;
the design method of the laser array system comprises the following steps:
(1) Calculating thermodynamic parameters of each device unit according to the performance or working requirements of the laser array system; the thermodynamic parameters include, but are not limited to, heat generation power, heat generation region, heat control temperature, heat flux density, and thermal inertia;
(2) Determining the setting position of each device unit according to the integration requirement, and determining the type of the heat exchange matrix in the temperature equalization plate according to the thermodynamic parameter of the corresponding device unit;
(3) Determining the connection relation between the temperature equalization plate and the corresponding device unit according to the integration requirement, and determining the condensation area and the evaporation area of the temperature equalization plate;
(4) Determining the materials and structures of the temperature equalization plate and the cooling module according to the integration requirement and the thermal control requirement, setting the setting mode of the rod core in the temperature equalization plate on the basis, and packaging the heat exchange matrix in the accommodating cavity of the temperature equalization plate;
(5) The locking piece is arranged according to the connection of the cooling module and the temperature equalization plate, and the heat exchange temperature difference delta T of the external heat control system is determined according to the following formula:
△T=QL/kA
wherein Q is the heat transmitted, L is the heat transmission distance, k is the heat conductivity, and A is the area through which the heat flux flows;
(6) Each device unit is respectively connected with the heat absorption end of the temperature equalization plate which is correspondingly designed to form an independent module, and the independent module is connected and arranged in the array system; and connecting the cooling module in the array system, and connecting the cooling module with the heat dissipation end of the corresponding temperature equalization plate to form the laser array system.
2. A laser array system, characterized in that the laser array system is designed by the design method of the laser array system as claimed in claim 1.
3. The laser array system of claim 2 wherein the rod core is a metal sintered aluminum rod core;
and/or
The heat exchange matrix is filled with ammonia arranged in the accommodating cavity.
4. A laser array system as claimed in claim 2 or 3 wherein the heat absorbing end is disposed horizontally and the heat dissipating end extends vertically upward to one end of the heat absorbing end such that the cross-sectional form of the temperature equalizing plate is L-shaped;
correspondingly, the rod core is L-shaped formed by combining a horizontal section and a vertical section.
5. The laser array system of claim 4 wherein the cooling module and the temperature equalization plate are connected by a plurality of locking members and are filled with an interface filler material therebetween.
6. The laser array system of claim 5 wherein a plurality of unlocking mechanisms are provided on the cooling module to overcome the adhesion of the interface filler material and effect separation of the cooling module from the temperature equalization plate.
7. The laser array system of claim 2 or 3 or 5 or 6 wherein a plurality of the rod cores share the same cooling module.
8. The laser array system of claim 2 or 3 or 5 or 6 wherein the cooling module has a microchannel disposed opposite the heat sink and a flowable cooling medium disposed in the microchannel.
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| DE4041130A1 (en) * | 1990-12-21 | 1992-07-02 | Messerschmitt Boelkow Blohm | Solid-state laser generating single frequency and visible, pulsed beams - comprises laser diode pumped solid-state laser with electronic supply and regulating unit as well as optical head with adjusters |
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