CN115915727A - Micro liquid cooling loop system and control method thereof - Google Patents
Micro liquid cooling loop system and control method thereof Download PDFInfo
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- CN115915727A CN115915727A CN202211548489.7A CN202211548489A CN115915727A CN 115915727 A CN115915727 A CN 115915727A CN 202211548489 A CN202211548489 A CN 202211548489A CN 115915727 A CN115915727 A CN 115915727A
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Abstract
The invention relates to the technical field of computer heat dissipation, and provides a micro liquid cooling loop system and a control method thereof. The micro liquid cooling loop system comprises a circulating pump, a preheater, an evaporator assembly and a condenser, and all elements are connected through pipelines to form a liquid cooling loop; the circulating pump provides power for the circulation of working medium in the whole liquid cooling loop, and send the working medium to the pre-heater, the pre-heater will need to get into the working medium heating of evaporimeter subassembly to the saturated state, and in the evaporimeter subassembly, the saturated state working medium is continued to be heated under the thermal effect of integrated circuit board, and then produces gaseous working medium, reaches the purpose to the board heat absorption, and gaseous working medium is cooled into liquid working medium after reaching the condenser, begins next circulation again. The invention realizes the temperature control of the board card by using the two-phase change of the working medium through the way that the preheater heats the working medium to the saturated state and the working medium in the evaporator evaporates and absorbs heat, has good heat dissipation effect and has low noise when the system works.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to a micro liquid cooling loop system and a control method thereof.
Background
With the increasing complexity of electronic information systems and the popularization and application of new technologies such as high-performance cluster computing, large-capacity data storage, high-bandwidth network exchange and the like, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly, and the improvement of heat flux density puts new demands on the heat dissipation capacity of computers.
In the autonomous controllable computer, a high-performance multi-core chip is widely applied, the heat flux density of the chip is increased more and more, and the heat of the whole computer is increased from 100 watts to 500 watts at present. Although the traditional air-cooled heat dissipation has simple technical structure, low cooling cost and high reliability, when the heat consumption of a case is high and the heat is concentrated, the traditional heat dissipation system has huge volume, large noise and poor heat dissipation effect.
It is statistically considered that more than 55% of the causes of electronic product failures are due to poor design of the cooling system. The over-high working temperature can not only reduce the working stability of the chip and increase the error rate, but also directly influence the working frequency, mechanical strength, electrical property and reliability of the chip due to the thermal stress formed between the inside of the module and the external environment of the module.
In view of the above, overcoming the drawbacks of the prior art is an urgent problem in the art.
Disclosure of Invention
The invention aims to solve the technical problem of providing a micro liquid cooling loop system and a control method thereof, and solves the problems that the traditional heat dissipation system is high in noise and poor in heat dissipation effect, so that parameters such as the working frequency and the mechanical strength of a chip are influenced, and the error probability of the chip is increased.
In a first aspect, the present invention provides a micro liquid cooling loop system, which includes a circulation pump 1, a preheater 2, an evaporator assembly 3, and a condenser 4, wherein:
the outlet end of the circulating pump 1 is connected with the inlet end of the preheater 2 through a pipeline, the outlet end of the preheater 2 is connected with the inlet end of the evaporator assembly 3 through a pipeline, the outlet end of the evaporator assembly 3 is connected with the inlet end of the condenser 4 through a pipeline, and the inlet end of the circulating pump 1 is connected with the outlet end of the condenser 4 through a pipeline to form a liquid cooling loop; the evaporator assembly 3 is used for being coupled with a board card;
the circulating pump 1 is used for providing power for the working medium in the liquid cooling loop, the preheater 2 is used for heating the liquid working medium to a saturated state, and the saturated working medium flows into the evaporator assembly 3;
the evaporator assembly 3 is used for absorbing heat generated by the board card during working so as to control the temperature of the board card; the condenser 4 is used for cooling the working medium flowing out of the evaporator assembly 3 to form a liquid working medium, and the liquid working medium enters the circulating pump 1 again.
Further, the micro liquid cooling loop system further includes a heat regenerator 5, the heat regenerator 5 includes a first port, a second port, a third port and a fourth port, the first port and the second port form a flow channel, the third port and the fourth port form a flow channel, wherein:
the first port is communicated with the outlet end of the circulating pump 1, the second port is communicated with the inlet end of the preheater 2, the third port is communicated with the outlet end of the evaporator assembly 3, and the fourth port is communicated with the inlet end of the condenser 4;
the regenerator 5 is used for heating the liquid working medium from the circulating pump 1 by using the saturated working medium from the evaporator assembly 3.
Further, miniature liquid cooling loop system still includes reservoir 6, reservoir 6 is installed condenser 4 with on the pipeline between the circulating pump 1, be applicable to the miniature liquid cooling loop system provides or stores working medium in the operation process.
Further, a heater is arranged in the liquid storage device 6 and is suitable for controlling the saturation pressure and the saturation temperature of the working medium in the liquid storage device 6, and therefore the saturation temperature of the working medium in the evaporator assembly 3 is controlled.
Furthermore, the micro liquid cooling loop system further comprises a filter 7, wherein the filter 7 is arranged on a pipeline between the condenser 4 and the circulating pump 1 and is suitable for filtering working media.
Further, the evaporator assembly 3 comprises a plurality of evaporator units 31, the outlet end and the inlet end of each evaporator unit 31 are provided with a disconnecting device 33, and the disconnecting devices 33 are suitable for controlling working media to enter and exit the evaporators, so that the working media flow control between the evaporators is realized.
Further, the evaporator assembly 3 is coupled to the board by means of a micro-channel cold plate or loop heat pipe 32.
Further, the loop heat pipe 32 includes a flat pipe 321, a shell 322, and a steam cavity 323, wherein:
the flat pipe 321 is a heat pipe formed by pressing a heat pipe body before entering the evaporator, a layer of shell 322 is welded above the flat pipe 321, a cavity formed between the shell 322 and the flat pipe 321 is the steam cavity 323, capillary holes 324 are formed in the pipe wall of the flat pipe 321 wrapped by the shell 322 and used for communicating the steam cavity 323 with the flat pipe 321, so that gaseous working media enter the steam cavity 323 from the flat pipe 321, and the flat pipe 321 is used for providing a circulation channel for liquid working media;
under the action of the aperture of the capillary hole 324, the length of the capillary hole 324 and the steam pressure in the steam cavity 323, the liquid working medium can only overflow to the preset height of the steam cavity 323 through the capillary hole 324, so that the liquid working medium is filled in the flat tube 321.
Further, the micro liquid cooling loop system further comprises a plurality of pressure sensors 8, wherein:
the circulating pump 1 with be provided with a pressure sensor 8 on the pipeline between the pre-heater 2, evaporator assembly 3 with be provided with a pressure sensor 8 on the pipeline between the condenser 4, condenser 4 with be provided with a pressure sensor 8 on the pipeline between the circulating pump 1, pressure sensor 8 is applicable to the monitoring the pressure of pipeline everywhere in the miniature liquid cooling return circuit system.
In a second aspect, the present invention provides a method for controlling a micro liquid cooling loop system, where the method includes:
the working state of the circulating pump 1 is controlled through a PLC control loop, the power of the circulating pump 1 is controlled according to the temperature of the clamping plate, the flow and the pressure of the working medium entering the preheater 2 are controlled, and the supercooling degree of the system is changed;
the saturation temperature and saturation pressure of the working medium in the evaporator are controlled by controlling the saturation pressure and saturation temperature of the working medium in the liquid storage device 6;
the control of working medium flow between the evaporators is realized by controlling the on-off of the inlet end disconnect device 33 of the evaporators, and further the accurate temperature control of the board card is achieved.
In the embodiment of the invention, the circulating pump 1, the preheater 2, the evaporator assembly 3 and the condenser 4 are connected through pipelines to form a liquid cooling loop, the evaporator assembly 3 is coupled with a board card, wherein the circulating pump 1 provides power for circulation of working media in the whole liquid cooling loop, the working media are sent to the preheater 2, the preheater 2 heats the working media needing to enter the evaporator assembly 3 to a saturated state, the saturated working media are continuously heated under the action of the heat of the board card in the evaporator assembly 3, and then are evaporated to generate gaseous working media, so that the purpose of absorbing the heat of the board card is achieved, the gaseous working media are cooled into liquid working media after reaching the condenser 4, and then the next cycle is started. According to the embodiment of the invention, the working medium is heated to a saturated state by the preheater 2, and the working medium is evaporated and absorbs heat in the evaporator, and the two-phase change of the working medium is utilized, so that the temperature control of the board card is realized, the heat dissipation effect is good, the noise of the system during working is low, the influence of thermal stress on the working frequency, the mechanical strength and the electrical property of the chip on the board card is reduced, the working stability of the chip can be improved, and the error rate is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic diagram of a micro liquid cooling loop system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another micro liquid cooling loop system according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a loop heat pipe 32 of a micro liquid cooling loop system according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of another exemplary embodiment of a loop heat pipe 32 of a micro liquid cooling loop system;
fig. 5 is a schematic flowchart of a method for controlling a micro liquid cooling loop system according to an embodiment of the present invention;
fig. 6 is a schematic test wiring diagram of a micro liquid cooling loop system according to an embodiment of the present invention.
Wherein the reference numerals are: a circulation pump 1; a preheater 2; an evaporator assembly 3; an evaporator unit 31; a loop heat pipe 32; flat tubes 321; a housing 322; a steam chamber 323; a capillary bore 324; a disconnect 33; a condenser 4; a heat regenerator 5; a reservoir 6; a filter 7; a pressure sensor 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are for convenience only to describe the present invention without requiring the present invention to be necessarily constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1:
The circulating pump 1 is used for providing power for the working medium in the liquid cooling loop, the preheater 2 is used for heating the liquid working medium to a saturated state, and the saturated working medium flows into the evaporator assembly 3.
The evaporator assembly 3 is used for absorbing heat generated by the board card during working so as to control the temperature of the board card; the condenser 4 is used for cooling the working medium flowing out of the evaporator assembly 3 to form a liquid working medium, and the liquid working medium enters the circulating pump 1 again.
The saturated working medium is a liquid working medium and a gaseous working medium, the liquid working medium and the gaseous working medium are in a dynamic balance state, and the saturated working medium is a liquid working medium and a gaseous working medium.
When the working medium enters the preheater 2, the preheater 2 heats the liquid working medium to a saturated state, after the saturated working medium flows into the evaporator assembly 3, the heat of the plate card absorbed by the working medium is further heated, a part of the liquid working medium is changed into a gaseous working medium, the mass fraction of the gaseous working medium is further increased, namely, the heat of the plate card is absorbed in the process that the working medium is changed from the liquid working medium to the gaseous working medium, and the purpose of controlling the temperature of the plate card is achieved.
In a general two-phase liquid cooling system, if the evaporation temperature of the working medium is 40 ℃, the working medium starts to evaporate rapidly after entering the evaporator assembly 3 under the condition that the temperature of the board card is heated to exceed 40 ℃, and the heat of the board card is absorbed. Generally speaking, in a reasonable range, the lower the evaporation temperature of the working medium is, the easier the working medium is to evaporate, and the better the heat dissipation effect is.
In this embodiment, the preheater 2 is adopted to heat the working medium to the saturated state, and has the advantages that the working medium can be converted into a two-phase working medium with a liquid working medium and a gaseous working medium before entering the evaporator assembly 3, so that the working medium can be rapidly gasified when entering the evaporator assembly 3, and further a large amount of heat generated by the board card is absorbed, the temperature control of the board card is realized, and the heat dissipation efficiency of the micro liquid cooling loop system is enhanced.
After flowing out of the evaporator assembly 3, the working medium flows to the condenser 4, the working medium is cooled in the condenser 4, and the gaseous working medium in the working medium can be converted into a liquid working medium.
It should be noted that the micro liquid cooling loop system may include a plurality of the evaporator assemblies 3, the plurality of evaporator assemblies 3 are connected in series or in parallel in a pipeline of the micro liquid cooling loop system, and each evaporator assembly 3 may dissipate heat for one board card or a plurality of board cards.
In the embodiment of the invention, a circulating pump 1, a preheater 2, an evaporator assembly 3 and a condenser 4 are connected through pipelines to form a liquid cooling loop, the evaporator assembly 3 is coupled with a board card, wherein the circulating pump 1 provides power for the circulation of working media in the whole liquid cooling loop, the working media are sent into the preheater 2, the preheater 2 heats the working media needing to enter the evaporator assembly 3 to a saturated state, the saturated working media are continuously heated under the action of the heat of the board card in the evaporator assembly 3, and further, the gaseous working media are evaporated to generate gaseous working media, so that the purpose of absorbing the heat of the board card is achieved, the gaseous working media are cooled into liquid working media after reaching the condenser 4, and the next cycle is started. According to the embodiment of the invention, the working medium is heated to a saturated state by the preheater 2, and the working medium is evaporated in the evaporator to absorb heat, and the two-phase change of the working medium is utilized, so that the temperature control of the board is realized, the heat dissipation effect is good, the noise of the system during working is low, the influence of thermal stress on the working frequency, the mechanical strength and the electrical property of the chip on the board is reduced, the working stability of the chip is improved, and the error rate is reduced.
In order to utilize the waste heat of the system, the micro liquid cooling loop system further comprises a heat regenerator 5, wherein the heat regenerator 5 comprises a first port, a second port, a third port and a fourth port, the first port and the second port form a circulation channel, and the third port and the fourth port form a circulation channel.
The first port is communicated with the outlet end of the circulating pump 1, the second port is communicated with the inlet end of the preheater 2, the third port is communicated with the outlet end of the evaporator assembly 3, and the fourth port is communicated with the inlet end of the condenser 4.
The regenerator 5 is used for heating the liquid working medium from the circulation pump 1 by using the saturated working medium from the evaporator assembly 3.
Wherein the first port and the second port form a flow channel and the third port and the fourth port form a flow channel are non-communicating.
As shown in fig. 2, the working medium in the evaporator assembly 3 enters the heat regenerator 5 through the third port, and then flows out through the fourth port to reach the condenser 4 for cooling; the circulating pump 1 firstly conveys the working medium to the heat regenerator 5 through the first port, the working medium output from the circulating pump 1 exchanges heat with the working medium flowing out of the evaporator assembly 3 in the heat regenerator 5, namely the working medium output from the circulating pump 1 is heated by the working medium flowing out of the evaporator assembly 3 in the heat regenerator 5, then flows out through the second port, and then flows into the preheater 2 to be heated to a saturated state.
In order to control the working medium amount participating in the whole heat dissipation cycle in the micro liquid cooling loop system, the micro liquid cooling loop system further comprises a liquid storage device 6, as shown in fig. 2, the liquid storage device 6 is installed on a pipeline between the condenser 4 and the circulating pump 1, and is suitable for providing or storing the working medium in the operation process of the micro liquid cooling loop system.
Specifically, the exit end of condenser 4 with the entry end of reservoir 6 passes through the pipe connection, the exit end of reservoir 6 with the entry end of circulating pump 1 passes through the pipe connection when miniature liquid cooling loop system's operating condition changes, the phase transition of working medium can make the volume of working medium change by a wide margin, needs this moment reservoir 6 holds unnecessary working medium or provides miniature liquid cooling loop system normal operating required working medium. For example, when the temperature of the board card is reduced and the mass ratio of the liquid working medium in the whole micro liquid cooling loop system is increased, the liquid storage tank can store the redundant liquid working medium.
In order to enable the evaporator assembly 3 to have a better heat dissipation effect, a heater is arranged in the liquid storage device 6 and is suitable for controlling the saturation pressure and the saturation temperature of the working medium in the liquid storage device 6, and further the saturation temperature control of the working medium in the evaporator assembly 3 is achieved.
Specifically, the evaporator assembly 3 and the liquid storage device 6 are located in the same closed loop, and the pressure and the temperature of the whole system can be influenced by controlling the pressure and the temperature of the liquid storage device 6, so that the pressure and the temperature of the working medium in the evaporator assembly 3 are influenced. Because the volume of the working medium in the micro liquid cooling loop system is certain, and the space is also certain, the saturation temperature and the saturation pressure of the working medium in the evaporator can be further controlled by controlling the saturation pressure and the saturation temperature of the working medium in the liquid storage device 6.
The higher the saturation pressure of the working medium, the easier the working medium is to gasify, and the easier the working medium is to gasify, the better the heat absorption capacity is, so that whether the saturation pressure of the working medium in the liquid storage device 6 needs to be increased or decreased can be determined according to the temperature of the board card, and the saturation pressure of the working medium in the evaporator can be controlled by controlling the saturation pressure of the working medium in the liquid storage device 6.
The relationship between the saturation temperature difference and the saturation pressure difference of the working medium between the evaporator assembly 3 and the liquid reservoir 6 can be expressed as:
wherein, T E Is the saturation temperature, T, of the working medium in the evaporator assembly 3 A Is the saturation temperature, delta P, of the working medium in the liquid reservoir 6 EA The saturation pressure of the working medium in the evaporator component 3 and the saturation pressure of the working medium in the liquid storage device 6The pressure difference of the force is such that,
is the saturation temperature T A The pressure-temperature slope value of the point.
In order to filter impurities in the working medium and ensure normal use of the micro liquid cooling loop system, the micro liquid cooling loop system further comprises a filter 7, as shown in fig. 2, the filter 7 is arranged on the pipeline between the condenser 4 and the circulating pump 1 and is suitable for filtering the working medium.
Working medium is in miniature liquid cooling loop system's circulation flow in-process, inevitable impurity such as dirt can appear, in order to avoid impurity to influence components such as circulating pump 1 at working medium circulation flow in-process miniature liquid cooling loop system has set up filter 7 for filter working medium, guarantee miniature liquid cooling loop system's normal use prolongs miniature liquid cooling loop system's life.
In order to realize accurate temperature control of the board card, the evaporator assembly 3 comprises a plurality of evaporator units 31, each of the outlet end and the inlet end of each evaporator unit 31 is provided with a disconnecting device 33, each disconnecting device 33 is suitable for controlling working media to enter and exit the evaporator units 31, and the working media flow control among the evaporator units 31 is realized.
Be provided with a plurality of evaporimeter units 31 in the evaporimeter subassembly 3, can be the heat dissipation of one or more integrated circuit boards, for the temperature of each integrated circuit board of more accurate control, the entry end of every evaporimeter unit 31 all is provided with disconnect 33 to control working medium can or can not get into corresponding evaporimeter unit 31, realize the work mass flow control of the evaporimeter unit 31 between different integrated circuit boards, and then realize increasing or reducing the heat dissipation support of corresponding integrated circuit board.
Specifically, when a plurality of evaporator units 31 provide heat dissipation support for a target board card, when the temperature of the target board card is obviously lower than the temperature of other board cards, the disconnection device 33 corresponding to one or more evaporator units 31 providing heat dissipation support for the target board card can be closed, so that the working medium flow of the evaporator units 31 providing heat dissipation support for the target board card is reduced, the working medium flow of the evaporator units 31 providing heat dissipation support for other board cards is improved, further, the heat dissipation support for the target board card is reduced, the heat dissipation support for other board cards is enhanced, and the purpose of accurately controlling the temperature of each board card is achieved.
In an optional embodiment, a flow valve is installed at an inlet end of each evaporator unit 31, and the flow rate of the working medium between the evaporator units 31 can be controlled, so that accurate temperature control of different board cards is realized.
In order to improve the heat dissipation effect of the micro liquid cooling loop system, the evaporator assembly 3 is coupled with the board card in a micro-channel cold plate or loop heat pipe 32 manner.
The evaporator assembly 3 is coupled with the board card in a micro-channel cold plate or loop heat pipe 32 mode, and the advantage that the contact surface between the evaporator assembly 3 and the board card can be increased, so that more working media can absorb heat from the board card at the same time, and the heat dissipation effect of the evaporator assembly 3 is enhanced.
In order to further improve the heat dissipation effect of the micro liquid cooling loop system, as shown in fig. 3 and fig. 4, the loop heat pipe 32 includes a flat pipe 321, a shell 322 and a steam cavity 323, wherein the flat pipe 321 is a heat pipe formed by pressing a heat pipe body before entering the evaporator unit 31, that is, the loop heat pipe of this embodiment is used in the evaporator unit 31, the flat pipe 321 is provided with a layer of shell 322 above the flat pipe 321, that is, the shell 322 is only wrapped above the flat pipe 321, a cavity formed between the shell 322 and the flat pipe 321 is the steam cavity 323, the flat pipe 321 is wrapped by the shell 322, and a plurality of capillary holes 324 are provided on a pipe wall wrapped by the shell 322, wherein the capillary holes 324 are distributed along the length direction of the flat pipe 321, and the plurality of capillary holes 324 are distributed in multiple rows, the capillary holes 324 are used for communicating the steam cavity 323 with the flat pipe 321, so that a gaseous working medium enters the steam cavity 323 from the flat pipe 321, and the flat pipe 321 is used for providing a circulation channel for a liquid working medium.
Under the action of the aperture of the capillary hole 324, the length of the capillary hole 324 and the steam pressure in the steam cavity 323, the liquid working medium can only overflow to the preset height of the steam cavity 323 through the capillary hole 324, so that more liquid working medium can fill the flat pipe 321, and the liquid working medium and the gas working medium in the saturated working medium can be separated in this way, so that the contact surface between the liquid working medium and the lower part of the flat pipe 321 is increased, and the heat dissipation area of the board card is increased.
Specifically, when the loop heat pipe 32 is laminated on the board card, the lower part of the flat pipe 321 is closer to the board card, the flat pipe 321 can increase the liquid working medium and the contact surface of the lower part of the flat pipe 321, meanwhile, the steam cavity 323 is arranged above the flat pipe 321, the steam cavity 323 can contain the gaseous working medium, the gaseous working medium formed after the liquid working medium is evaporated in a heat absorption mode enters the steam cavity 323 through the capillary holes 324, the circulation space of the liquid working medium in the flat pipe 321 is not occupied, the liquid working medium is further enabled to pass through when the flat pipe 321, the heat absorption evaporation can be carried out to the maximum extent, and the heat dissipation capacity of the evaporator assembly 3 on the board card is further enhanced. Due to the small aperture of the capillary holes 324 and the pressure generated by the gaseous working medium in the steam cavity 323, the liquid working medium cannot enter the steam cavity 323 in a large amount, part of the liquid working medium entering the steam cavity 323 can be gradually evaporated, the liquid working medium cannot occupy the steam cavity 323 all the time, and the gaseous working medium in the steam cavity 323 flows out of the steam cavity 323 from the capillary holes 324 at the front end of the steam cavity 323 along the flowing direction of the working medium in the whole system.
In order to monitor the pressure of miniature liquid cooling loop system, miniature liquid cooling loop system still includes a plurality of pressure sensor 8, as shown in fig. 2, circulating pump 1 with be provided with a pressure sensor 8 on the pipeline between the pre-heater 2, evaporator assembly 3 with be provided with a pressure sensor 8 on the pipeline between condenser 4, condenser 4 with be provided with a pressure sensor 8 on the pipeline between the circulating pump 1, pressure sensor 8 is applicable to the monitoring the pressure of pipeline everywhere in the miniature liquid cooling loop system.
Wherein a pressure sensor 8 measures the pressure at the inlet of the circulation pump 1; a pressure sensor 8 measures the pressure at the outlet of the evaporator; a pressure sensor 8 measures the pressure at the outlet of the circulation pump 1, in particular the pressure in the pipe between the regenerator 5 and the preheater 2.
The method comprises the steps of measuring the pressure of each pipeline in the micro liquid cooling loop system, monitoring whether the micro liquid cooling loop system is in a normal working state, and maintaining the normal operation of the micro liquid cooling loop system in time according to the pressure in the abnormal regulation pipeline of the micro liquid cooling loop system. For example, when the pressure of the pipeline is too low, the power of the circulating pump 1 is increased, so that working medium can normally flow in the loop, and the micro liquid cooling loop system can normally run.
Example 2:
step 101: the working state of the circulating pump 1 is controlled by a PLC (Programmable Logic Controller) control loop, the power of the circulating pump 1 is controlled according to the temperature of a clamping plate, the flow and pressure of a working medium entering the preheater 2 are controlled, and the supercooling degree of the system is changed;
step 102: the saturation temperature and saturation pressure of the working medium in the evaporator assembly 3 are controlled by controlling the saturation pressure and saturation temperature of the working medium in the liquid storage device 6;
step 103: the control of the working medium flow among the heat dissipation channels is realized by controlling the on-off of the heat dissipation channels of the evaporator assembly 3, so that the accurate temperature control of the board card is realized.
Specifically, in step 101, when the board temperature rises, the heat dissipation efficiency is too low under the current power of the circulating pump 1, the power of the circulating pump 1 is increased, the flow of the working medium entering the preheater 2 is increased, the flow of the working medium entering the evaporator is increased, and the heat dissipation effect of the micro liquid cooling loop system is further improved.
In an alternative, the temperature of the board is divided into a temperature gradient corresponding to the power gradient of the circulation pump 1, and when the temperature of the board reaches a certain temperature gradient value, the power of the circulation pump 1 is changed to the corresponding power. For example, the working temperature of the board card is 30 ℃ to 80 ℃, three power gears of the circulating pump 1 are provided, when the temperature of the board card is below 40 ℃, the circulating pump 1 adopts first gear power, when the temperature of the board card is 40 ℃ to 60 ℃, the circulating pump 1 adopts second gear power, when the temperature of the board card is above 60 ℃, the circulating pump 1 adopts third gear power, wherein the third gear power is greater than the second gear power, and the second gear power is greater than the first gear power.
In a general two-phase liquid cooling system, if the evaporation temperature of the working medium is 40 ℃, the working medium starts to evaporate rapidly after entering the evaporator assembly 3 under the condition that the temperature of the board card is heated to exceed 40 ℃, and the heat of the board card is absorbed. Generally speaking, in a reasonable range, the lower the evaporation temperature of the working medium is, the easier the working medium is to evaporate, and the better the heat dissipation effect is. In this embodiment, the preheater 2 is adopted to heat the working medium, and the advantage of the system lies in that the working medium can be converted into a two-phase working medium with a liquid working medium and a gaseous working medium before entering the evaporator, so that the working medium can be rapidly gasified when entering the evaporator, and then a large amount of heat generated by the board card is absorbed, the temperature control of the board card is realized, and the heat dissipation efficiency of the micro liquid cooling loop system is ensured.
In step 102, a heater is arranged in the liquid storage device 6, and can control the saturation pressure and saturation temperature of the working medium in the liquid storage device 6, so as to control the saturation temperature and saturation pressure of the working medium in the evaporator, specifically, the evaporator assembly 3 and the liquid storage device 6 are located in the same closed loop, and the pressure and temperature of the whole system can be influenced by controlling the pressure and temperature of the liquid storage device 6, so as to influence the pressure and temperature of the working medium in the evaporator assembly 3. Because the amount of the working medium in the micro liquid cooling loop system is certain and the space is also certain, the saturation temperature and the saturation pressure of the working medium in the evaporator can be controlled by controlling the saturation pressure and the saturation temperature of the working medium in the liquid storage device 6.
The higher the saturation pressure of the working medium, the easier the working medium is to gasify, and the easier the working medium is to gasify, the better the heat absorption capacity is, so that whether the saturation pressure of the working medium in the liquid storage device 6 needs to be increased or decreased can be determined according to the temperature of the board card, and the saturation pressure of the working medium in the evaporator can be controlled by controlling the saturation pressure of the working medium in the liquid storage device 6.
In step 103, in order to realize accurate temperature control of the board card, the evaporator assembly 3 includes a plurality of evaporator units 31, an outlet end and an inlet end of each evaporator unit 31 are provided with a disconnect 33, and the disconnect 33 is adapted to control whether a working medium can enter or exit the evaporator units 31, so as to realize flow control of the working medium between the evaporator units 31. One of the evaporator units 31 corresponds to one of the heat dissipation channels.
Be provided with a plurality of evaporimeter units 31 in the evaporimeter subassembly 3, can be the heat dissipation of one or more integrated circuit boards, for the temperature of each integrated circuit board of more accurate control, the entry end of every evaporimeter unit 31 all is provided with disconnect 33 to control working medium can or can not get into corresponding evaporimeter unit 31, realize the work mass flow control of the evaporimeter unit 31 between different integrated circuit boards, and then realize increasing or reducing the heat dissipation support of corresponding integrated circuit board.
Specifically, when a plurality of evaporator units 31 provide heat dissipation support for a target board card, when the temperature of the target board card is obviously lower than the temperature of other board cards, the disconnection device 33 corresponding to one or more evaporator units 31 providing heat dissipation support for the target board card can be closed, so that the working medium flow of the evaporator units 31 providing heat dissipation support for the target board card is reduced, the working medium flow of the evaporator units 31 providing heat dissipation support for other board cards is improved, further, the heat dissipation support for the target board card is reduced, the heat dissipation support for other board cards is enhanced, and the purpose of accurately controlling the temperature of each board card is achieved.
In the embodiment of the invention, the circulating pump 1, the preheater 2, the evaporator assembly 3 and the condenser 4 are connected through pipelines to form a liquid cooling loop, the evaporator assembly 3 is coupled with a board card, wherein the circulating pump 1 provides power for circulation of working media in the whole liquid cooling loop, the working media are sent to the preheater 2, the working media needing to enter the evaporator assembly 3 are heated to a saturated state by the preheater 2, the saturated working media are continuously heated under the action of the heat of the board card in the evaporator assembly 3, and then are evaporated to form a large amount of gaseous working media, so that the heat of the board card is absorbed, the gaseous working media are cooled to be liquid working media after reaching the condenser 4, and then the next cycle is started. According to the embodiment of the invention, the working medium is heated to a saturated state by the preheater 2, and the working medium is evaporated and absorbs heat in the evaporator, and the temperature control of the board card is realized by utilizing the two-phase quality change of the working medium, so that the heat dissipation effect is good, and the noise of the system is low during working.
Example 3:
In an optional embodiment, the multi-path temperature measuring instrument adopts a JK808 multi-path temperature measuring instrument, and 8 temperature measuring points of the JK808 multi-path temperature measuring instrument are arranged on a pipeline of the micro liquid cooling loop system at preset intervals to measure the temperature; the multipoint data acquisition instrument adopts a 34970A multipoint data acquisition instrument; the control power supply adopts a DC 0-5V power supply; so as to realize the heat dissipation test of the micro liquid cooling loop system under the condition of different powers of the circulating pump 1.
In this embodiment, a multi-channel temperature measuring instrument and a multi-point data acquisition instrument are used to test the heat dissipation performance and the working condition of the micro liquid cooling loop system, so that the reliability of the micro liquid cooling loop system in the actual use process is ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The miniature liquid cooling loop system is characterized by comprising a circulating pump (1), a preheater (2), an evaporator assembly (3) and a condenser (4), wherein:
the outlet end of the circulating pump (1) is connected with the inlet end of the preheater (2) through a pipeline, the outlet end of the preheater (2) is connected with the inlet end of the evaporator assembly (3) through a pipeline, the outlet end of the evaporator assembly (3) is connected with the inlet end of the condenser (4) through a pipeline, and the inlet end of the circulating pump (1) is connected with the outlet end of the condenser (4) through a pipeline to form a liquid cooling loop; the evaporator assembly (3) is used for being coupled with a board card;
the circulating pump (1) is used for providing power for the working medium in the liquid cooling loop, the preheater (2) is used for heating the liquid working medium to a saturated state, and the saturated working medium flows into the evaporator assembly (3);
the evaporator assembly (3) is used for absorbing heat generated by the board card during working so as to control the temperature of the board card; the condenser (4) is used for cooling the working medium flowing out of the evaporator assembly (3) to form a liquid working medium, and the liquid working medium enters the circulating pump (1) again.
2. The micro liquid cooling loop system of claim 1, further comprising a regenerator (5), the regenerator (5) comprising a first port, a second port, a third port, and a fourth port, the first port and the second port forming a flow channel, the third port and the fourth port forming a flow channel, wherein:
the first port is communicated with the outlet end of the circulating pump (1), the second port is communicated with the inlet end of the preheater (2), the third port is communicated with the outlet end of the evaporator assembly (3), and the fourth port is communicated with the inlet end of the condenser (4);
the heat regenerator (5) is used for heating the liquid working medium from the circulating pump (1) by using the saturated working medium from the evaporator assembly (3).
3. The micro liquid cooling circuit system of claim 1, further comprising a liquid reservoir (6), wherein the liquid reservoir (6) is mounted on the pipe between the condenser (4) and the circulation pump (1) and is adapted to provide or store a working fluid during operation of the micro liquid cooling circuit system.
4. The micro liquid cooling loop system of claim 3, wherein a heater is disposed in the reservoir (6) and adapted to control a saturation pressure and a saturation temperature of the working fluid in the reservoir (6), thereby controlling the saturation temperature of the working fluid in the evaporator assembly (3).
5. The micro liquid cooling loop system of claim 1, further comprising a filter (7), wherein the filter (7) is disposed on the pipe between the condenser (4) and the circulation pump (1) and adapted to filter the working fluid.
6. The micro liquid cooling loop system of claim 1, wherein the evaporator assembly (3) comprises a plurality of evaporator units (31), each of the evaporator units (31) having an outlet end and an inlet end provided with a disconnect (33), the disconnect (33) being adapted to control the flow of working medium to and from the evaporators to achieve flow control of working medium between the evaporators.
7. The micro liquid cooling loop system of claim 1, wherein the evaporator assembly (3) is coupled to a board card by means of a micro channel cold plate or a loop heat pipe (32).
8. The micro liquid cooling loop system of claim 7, wherein the loop heat pipe (32) comprises a flat tube (321), a shell (322), and a vapor chamber (323), wherein:
the flat pipe (321) is a heat pipe formed by pressing a heat pipe body before entering an evaporator, a shell (322) is welded above the flat pipe (321), a cavity formed between the shell (322) and the flat pipe (321) is a steam cavity (323), capillary holes (324) are formed in the pipe wall of the flat pipe (321) wrapped by the shell (322), the capillary holes (324) are used for communicating the steam cavity (323) with the flat pipe (321) so that a gaseous working medium enters the steam cavity (323) from the flat pipe (321), and the flat pipe (321) is used for providing a circulation channel for a liquid working medium;
under the action of the aperture of the capillary hole (324), the length of the capillary hole (324) and the steam pressure in the steam cavity (323), the liquid working medium can only overflow to the preset height of the steam cavity (323) through the capillary hole (324), so that the liquid working medium can be filled in the flat pipe (321).
9. The micro liquid cooling circuit system according to any one of claims 1 to 8, further comprising a plurality of pressure sensors (8), wherein:
the system is characterized in that a pressure sensor (8) is arranged on a pipeline between the circulating pump (1) and the preheater (2), a pressure sensor (8) is arranged on a pipeline between the evaporator assembly (3) and the condenser (4), a pressure sensor (8) is arranged on a pipeline between the condenser (4) and the circulating pump (1), and the pressure sensor (8) is suitable for monitoring the pressure of each pipeline in the micro liquid cooling loop system.
10. A method for controlling a micro liquid cooling loop system, wherein the method is applied to the micro liquid cooling loop system according to any one of claims 1 to 9, and the method comprises:
the working state of the circulating pump (1) is controlled through a PLC control loop, the power of the circulating pump (1) is controlled according to the temperature of the clamping plate, the flow and pressure of a working medium entering the preheater (2) are controlled, and the supercooling degree of the system is changed;
the saturation temperature and saturation pressure of the working medium in the evaporator assembly (3) are controlled by controlling the saturation pressure and saturation temperature of the working medium in the liquid storage device (6);
the working medium flow between the heat dissipation channels is controlled by controlling the on-off of the heat dissipation channels of the evaporator assembly (3), so that the accurate temperature control of the board card is achieved.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116839430A (en) * | 2023-06-30 | 2023-10-03 | 北京天兵科技有限公司 | Deflector pump driving active liquid cooling system of carrier rocket and design method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116839430A (en) * | 2023-06-30 | 2023-10-03 | 北京天兵科技有限公司 | Deflector pump driving active liquid cooling system of carrier rocket and design method |
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