CN115348814A - Data center phase change immersion type liquid cooling cabinet - Google Patents

Data center phase change immersion type liquid cooling cabinet Download PDF

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Publication number
CN115348814A
CN115348814A CN202211085078.9A CN202211085078A CN115348814A CN 115348814 A CN115348814 A CN 115348814A CN 202211085078 A CN202211085078 A CN 202211085078A CN 115348814 A CN115348814 A CN 115348814A
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CN
China
Prior art keywords
liquid
cabinet
data center
condenser pipe
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211085078.9A
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Chinese (zh)
Inventor
栾义军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jinshi Yifu Beijing Technology Co ltd
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Jinshi Yifu Beijing Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jinshi Yifu Beijing Technology Co ltd filed Critical Jinshi Yifu Beijing Technology Co ltd
Priority to CN202211085078.9A priority Critical patent/CN115348814A/en
Publication of CN115348814A publication Critical patent/CN115348814A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a phase-change immersion type liquid cooling cabinet of a data center, which comprises a cabinet, wherein a server and a condenser pipe are arranged in the cabinet, the server and the condenser pipe are immersed in a liquid area, the condenser pipe is immersed in the liquid area, cooling liquid flows inside the condenser pipe, the cooling liquid is arranged on the top of the liquid area, the surface of a heat source in the server is boiled, bubbles release heat to the condenser pipe under a composite mechanism of forced convection and condensation when rising to the top area of the liquid area, the bubbles cannot escape from the liquid level, and the top area of the liquid where the condenser pipe is located is in a gas-liquid two-phase coexisting state. The invention has the following advantages: simple structure and convenient use.

Description

Data center phase change immersion type liquid cooling cabinet
Technical Field
The invention relates to the technical field of cabinet equipment, in particular to a phase change immersion type liquid cooling cabinet of a data center.
Background
At present, the heat management of a data center is mainly in an air-conditioning air-cooling mode, and a server in the data center is cooled by cooling air blown out by an indoor air conditioner, so that the server is prevented from being over-heated and burnt. However, the air-cooled data center has the defects of high noise, high energy consumption, local hot spots, high maintenance cost and the like. Due to the requirements of energy policies on green, energy conservation and emission reduction, the heat management mode of the existing data center is gradually changed from an air-cooling mode of an air conditioner to a liquid-cooling mode, wherein the liquid-cooling mode comprises a cold plate type, an immersion type (single-phase type and phase-change type) and a spraying type. Regarding the phase change immersion type liquid cooling cabinet, since the server is immersed in the low boiling point liquid working medium in the current design technology, the condenser pipe is located in the vapor space (or a separate condenser) above the liquid level. When the server operates, the low-boiling-point working medium is heated by an electronic device in the server and is boiled (gas-liquid phase change), bubbles rise to an upper-layer steam space (or are further guided to a condenser), cooling liquid (generally water) with lower temperature flows in the condenser pipe, and the gaseous working medium is condensed on the surface of the condenser pipe.
The problems that internal pressure caused by gas-liquid phase change is unstable, non-condensable gas is not thoroughly removed, the actual effect of condensation heat exchange is seriously influenced, the sealing performance does not reach the standard, or the sealing performance cannot be maintained for a long time and the like exist in the background design, so that the application of the phase change immersion liquid cooling system of the conventional data center is less, and most of the phase change immersion liquid cooling systems are in experimental research stages.
Disclosure of Invention
The invention provides a phase-change immersion type liquid cooling cabinet for a data center, and aims to solve the problems that internal pressure caused by gas-liquid phase change is unstable, non-condensable gas is not thoroughly removed, the actual effect of condensation heat exchange is seriously influenced, the sealing performance does not reach the standard, or the sealing performance cannot be maintained for a long time.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: data center phase transition submergence formula liquid cooling rack, it includes the rack, be equipped with server and condenser pipe in the rack, server and condenser pipe all submerge in the liquid district, the condenser pipe submerges in the liquid district, and inside flow is equipped with the coolant liquid, the coolant liquid is at liquid district top, the boiling takes place for the heat source surface in the server, and when the bubble buoyancy rose to the liquid district top region, under "forced convection + condense" composite mechanism, the bubble released the heat to the condenser pipe, and the liquid level can not escaped to the bubble, the liquid top region at condenser pipe place presents the state of the double-phase coexistence of gas-liquid.
After adopting the structure, the invention has the following advantages: 1. even if non-condensable air exists in the cabinet, the surface of the condensing pipe is completely wrapped by pure low-boiling-point working media (liquid, bubbles and steam) and is not contacted with the air, so that the actual effect of condensing and releasing heat is greatly improved;
2. because the bubbles begin to condense at the top of the liquid area, the share and the probability of the escaping liquid level are reduced (even the liquid level does not escape at all), and the unstable state of the pressure in the cabinet caused by the irregular movement of the bubbles is fundamentally improved;
3. above two beneficial effects also reflect, and the rack reduces to the required degree of leakproofness, and the gas-liquid situation of rack inside reduces the influence destruction degree of rack seal design.
The beneficial effects are also related to each other, so that the process of 'heat absorption boiling in the server and heat release on the surface of the condenser pipe' of the working medium in the cabinet is close to or even reaches theoretical calculation parameters, and the design expectation of the phase-change immersion type liquid cooling is realized to the maximum extent.
As an improvement, the cabinet housing and the flow dividing component may be made of metal materials, engineering plastic materials, composite materials, and the like, such as: and filling the metal framework and the plastic.
As an improvement, water and cooling liquid flow in the condensation pipe.
As a modification, the condensation pipe is wholly or partially immersed at the top of the liquid zone.
As a modification, the condensation pipe can be a bare pipe or a finned pipe (a square fin, an annular fin, an H-shaped fin and the like).
As an improvement, the interior of the cabinet is low-boiling-point fluorinated liquid.
Drawings
FIG. 1 is an external view of a data center phase change immersion liquid cooled cabinet of the present invention.
FIG. 2 is a schematic diagram of an immersed server of a data center phase change immersion liquid cooled cabinet of the present invention.
FIG. 3 illustrates a fully submerged condition of the condenser tube of the immersion liquid cooled enclosure of the phase change data center of the present invention.
FIG. 4 illustrates a partial immersion of a condenser tube of an immersion liquid cooled enclosure of a data center phase change system according to the present invention.
FIG. 5 is a schematic diagram of the internal structure of a baffle of the phase change immersion liquid cooled enclosure of a data center of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Combine attached figure 1-5, data center phase transition submergence formula liquid cooling rack, it includes the rack, be equipped with server and condenser pipe in the rack, server and condenser pipe all submerge in the liquid district, the condenser pipe submergence is equipped with the coolant liquid in the liquid district, the coolant liquid level is in liquid district top, the boiling takes place for the heat source surface in the server, and when the bubble rises to liquid district top region, under "forced convection + condense" combined mechanism, the bubble releases the heat to the condenser pipe, and the bubble can not escape the liquid level, the liquid top region at condenser pipe place presents the two-phase coexistence state of gas-liquid, rack shell and reposition of redundant personnel part can be metal material, engineering plastic material, combined material etc. if: and filling the metal framework and plastic.
Water and cooling liquid flow in the condensation pipe, the condensation pipe is completely or partially immersed at the top of the liquid area, the condensation pipe can be a bare pipe or a finned pipe (a square fin, an annular fin, an H-shaped fin and the like), and low-boiling-point fluorinated liquid is arranged in the cabinet.
In the specific implementation of the invention, as shown in fig. 1 and 2, in the design of the immersed liquid-cooling cabinet, the server and the condenser pipe are immersed in the liquid region. The server is positioned at the bottom of the liquid area, as in the prior art; the condenser tube is also immersed in the liquid zone (see fig. 4) and a relatively low temperature cooling liquid (typically water) is flowed through the condenser tube at the top of the liquid zone. Under the design scheme, electronic devices (CPU, GPU and the like) on a main board in the server generate heat, and the low-boiling-point liquid working medium is heated to generate boiling gasification, so that continuous bubbles are generated on the surface of the devices. When the bubbles rise to the top area of the liquid area, the bubbles release heat to the condensing pipe with lower temperature and the surrounding low-temperature liquid under the composite mechanism of forced convection and condensation. The top area of the liquid where the condensing tube is located is in a gas-liquid two-phase coexistence state.
The condenser tube may also span the liquid level, i.e., partially above the liquid level (bottom of the vapor zone) and partially below the liquid level (see fig. 5). Due to the rising driving action of bubbles, the concentration of non-condensable gas (air) at the bottom of a steam zone is extremely low and can be regarded as pure gaseous working medium almost, so that the surface of the condensing tube is a composite heat release mechanism of forced convection and condensation and pure condensation.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (6)

1. Data center phase transition submergence formula liquid cooling rack, it includes the rack, its characterized in that: the solar heat collecting cabinet is characterized in that a server and a condenser pipe are arranged in the cabinet, the server and the condenser pipe are immersed in a liquid area, the condenser pipe is immersed in the liquid area, cooling liquid flows inside the condenser pipe, the cooling liquid level is located at the top of the liquid area, the surface of a heat source in the server boils, and when bubbles float to the top area of the liquid area, the bubbles release heat to the condenser pipe under a forced convection and condensation composite mechanism, the bubbles cannot escape from the liquid level, and the top area of the liquid where the condenser pipe is located is in a gas-liquid two-phase coexisting state.
2. The data center phase change immersion liquid cooled cabinet of claim 1, wherein: the cabinet shell and the shunt part can be made of metal materials, engineering plastic materials, composite materials and the like, such as: and filling the metal framework and plastic.
3. The data center phase change immersion liquid cooled cabinet of claim 1, wherein: and water and cooling liquid flow in the condensation pipe.
4. The data center phase change immersion liquid cooled cabinet of claim 1, wherein: the condensation pipe is fully or partially immersed at the top of the liquid zone.
5. The data center phase change immersion liquid cooled cabinet of claim 1, wherein: the condensation pipe can be a bare pipe or a finned pipe (a square fin, an annular fin, an H-shaped fin and the like).
6. The data center phase change immersion liquid cooled cabinet of claim 1, wherein: the interior of the cabinet is low-boiling-point fluorinated liquid.
CN202211085078.9A 2022-09-06 2022-09-06 Data center phase change immersion type liquid cooling cabinet Pending CN115348814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211085078.9A CN115348814A (en) 2022-09-06 2022-09-06 Data center phase change immersion type liquid cooling cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211085078.9A CN115348814A (en) 2022-09-06 2022-09-06 Data center phase change immersion type liquid cooling cabinet

Publications (1)

Publication Number Publication Date
CN115348814A true CN115348814A (en) 2022-11-15

Family

ID=83955446

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211085078.9A Pending CN115348814A (en) 2022-09-06 2022-09-06 Data center phase change immersion type liquid cooling cabinet

Country Status (1)

Country Link
CN (1) CN115348814A (en)

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