CN115346882B - Indium column balling-up control method, device and equipment - Google Patents

Indium column balling-up control method, device and equipment Download PDF

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Publication number
CN115346882B
CN115346882B CN202211263760.2A CN202211263760A CN115346882B CN 115346882 B CN115346882 B CN 115346882B CN 202211263760 A CN202211263760 A CN 202211263760A CN 115346882 B CN115346882 B CN 115346882B
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wafer
mixed solution
unit
spin coating
driving mechanism
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CN115346882A (en
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王阳
魏猛
张健
孙源
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Xinda Semiconductor Equipment Suzhou Co ltd
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Xinda Semiconductor Equipment Suzhou Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/117—Manufacturing methods involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention relates to the technical field of semiconductors, and provides an indium column balling control method, device and equipment. The method comprises the steps of controlling the action of a rotary driving mechanism of a spin coating unit to drive a wafer to rotate along with the rotary driving mechanism; when the rotary driving mechanism reaches a preset rotating speed, spraying the glycerol mixed solution to the central position of the upper surface of the wafer; if the glycerin mixed solution on the surface of the wafer covers the whole surface of the wafer, controlling the spin coating unit to stop spraying the glycerin mixed solution and stop rotating the driving mechanism; and after the rotary driving mechanism is in a stop state, controlling the robot arm to sequentially convey the wafer with the surface covered with the glycerol mixed solution into the baking unit and the cleaning unit for baking and cleaning. The method has simple operation process, can realize automatic balling of the indium columns, and only needs to clean one surface of the wafer after reaction.

Description

Indium column balling-up control method, device and equipment
Technical Field
The present invention relates generally to the field of semiconductor technology, and more particularly, to a method, apparatus and device for controlling bumping of indium columns.
Background
The indium columns are raised to improve the height of the indium ball salient points, so that the interconnection reliability of the area array photosensitive chip and the circuit chip is improved, the problem that part of pixels cannot be interconnected due to uneven surface of a device is solved, the difference between the indium columns is effectively reduced, and the later flip-chip bonding process is guaranteed to be smoothly developed.
In the prior art, indium columns are soaked in a mixed solution of ammonium chloride and glycerol in a certain proportion, heated to a temperature around the melting point of indium, and reacted with an ammonium chloride active agent dissolved in the glycerol by using the glycerol as a heat-conducting medium, so that the surfaces of the indium columns are in a reflux shape to form a sphere or a hemisphere. However, the operation in the existing method is too complex, and because both sides of the wafer are soaked in glycerol, both sides need to be cleaned, and the requirement on the cleaning process is high.
Disclosure of Invention
According to an embodiment of the present invention, an indium stud bumping control scheme is provided. The scheme is simple in operation process, automatic balling of the indium columns can be achieved, and only one surface of the wafer needs to be cleaned after reaction.
In a first aspect of the invention, an indium stud bumping control method is provided. The method is applied to a robot controller and comprises the following steps:
responding to a starting signal, controlling a rotary driving mechanism of the spin coating unit to act, and driving the wafer to rotate along with the rotary driving mechanism; the starting signal is generated by the spin coating unit after the wafer is placed in the spin coating unit and is in a vacuum adsorption state;
when the rotation driving mechanism reaches a preset rotation speed, controlling the spin coating unit to spray the glycerol mixed solution to the center of the upper surface of the wafer;
judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer, if so, controlling the spin coating unit to stop spraying the glycerol mixed solution and stop the rotary driving mechanism; otherwise, keeping the current working state;
after the rotary driving mechanism is in a stop state, controlling the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit and send the wafer into a baking unit for baking, so that the glycerol mixed solution covered on the surface of the wafer reacts with the indium columns on the surface of the wafer; when the preset reaction time is reached, controlling the robot arm to take the reacted wafer out of the baking unit and send the wafer into a cleaning unit for cleaning; and when the preset cleaning time is reached, controlling the robot arm to take out the cleaned wafer from the cleaning unit and send the wafer to the wafer box.
Furthermore, a plurality of indium columns are arranged on the surface of the wafer.
Further, the determining whether the glycerol mixture solution on the surface of the wafer covers the entire surface of the wafer includes:
acquiring the surface image of the wafer;
judging whether the non-edge texture features exist in the wafer surface image or not; if the mixed solution exists, the glycerol mixed solution on the surface of the wafer does not cover the whole surface of the wafer; otherwise, the glycerol mixed solution on the surface of the wafer is considered to cover the whole surface of the wafer.
Further, the determining whether the non-edge texture features exist in the wafer surface image includes:
extracting the edge contour of the wafer according to a contour extraction algorithm to obtain the edge texture of the wafer;
judging whether the edge texture features of the glycerol mixed solution exist in the edge textures of the wafer or not, and if so, taking the edge texture features of the glycerol mixed solution as non-edge texture features; otherwise, the non-edge texture features do not exist in the wafer surface image.
Further, still include: before the wafer is placed in the spin coating unit, the robot controller controls the robot arm to take the wafer out of the wafer box and place the wafer into the centering unit for centering.
Further, still include: and after the alignment is finished, the robot controller controls the robot arm to take the wafer out of the alignment unit and send the wafer into the spin coating unit.
Further, the spraying amount of the glycerol mixed solution is preset by the robot controller, and when the spraying amount of the glycerol mixed solution reaches the preset spraying amount of the glycerol mixed solution, the robot controller controls the spin-coating unit to stop spraying the glycerol mixed solution.
In a second aspect of the present invention, an indium stud bumping control device is provided. The device includes:
the rotation control unit responds to the starting signal and controls the rotation driving mechanism of the spin coating unit to act so as to drive the wafer to rotate along with the rotation driving mechanism; the starting signal is generated by the spin coating unit after the wafer is placed in the spin coating unit and is in a vacuum adsorption state;
the spraying control unit is used for controlling the spin coating unit to spray the glycerol mixed solution to the center of the upper surface of the wafer when the rotation driving mechanism reaches a preset rotation speed;
the detection unit is used for judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer, and if so, the spin coating unit is controlled to stop spraying the glycerol mixed solution and stop the rotary driving mechanism; otherwise, keeping the current working state;
the taking and delivering control unit is used for controlling the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit after the rotary driving mechanism is in a stop state, and sending the wafer into the baking unit for baking so that the glycerol mixed solution covered on the surface of the wafer reacts with the indium columns on the surface of the wafer; when the preset reaction time is reached, controlling the robot arm to take the reacted wafer out of the baking unit and send the wafer into a cleaning unit for cleaning; and when the preset cleaning time is reached, controlling the robot arm to take out the cleaned wafer from the cleaning unit and send the wafer to the wafer box.
In a third aspect of the invention, an electronic device is provided. The electronic device at least one processor; and a memory communicatively coupled to the at least one processor; the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of the first aspect of the invention.
It should be understood that the statements herein reciting aspects are not intended to limit the critical or essential features of any embodiment of the invention, nor are they intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
The above and other features, advantages and aspects of embodiments of the present invention will become more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters denote like or similar elements, and wherein:
fig. 1 shows a flow chart of an indium stud bumping control method according to an embodiment of the invention;
FIG. 2 shows a schematic structural diagram of a spin-coating unit according to an embodiment of the invention;
FIG. 3 is an enlarged view taken at A in FIG. 2;
FIG. 4 shows a block diagram of an indium stud bumping control device according to an embodiment of the invention;
FIG. 5 illustrates a block diagram of an exemplary electronic device capable of implementing embodiments of the present invention;
the device comprises a base plate 1, a spin-coating nozzle assembly 2, a wafer bearing seat 3, a collecting barrel 4, a waterproof cover 5, a water retaining ring 6, a spindle 7, a bearing group 8, a small toothed wheel 9, a synchronous belt 10, a vacuum air inlet joint 11, a motor connecting plate 12, a large toothed wheel 13, a motor 14, a sealing ring 15, a bearing seat 17, a bearing seat 41, an outer barrel 42, an inner barrel 42, an annular groove 43, a through hole 44, an annular cavity 45, a device 400, a rotation control unit 410, a spraying control unit 420, a detection unit 430, a taking and sending control unit 440, an electronic device 500, a calculation unit 501, a ROM 502, a RAM 503, a RAM 504, a bus, an I/O interface 505, an input unit 506, an output unit 507, a storage unit 508 and a communication unit 509.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In addition, the term "and/or" herein is only one kind of association relationship describing the association object, and means that there may be three kinds of relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Fig. 1 shows a flow chart of an indium stud bumping control method according to an embodiment of the present invention.
The method is applied to a robot controller and comprises the following steps:
s101, the robot controller responds to a starting signal to control a rotary driving mechanism of a spin coating unit to act and drive a wafer to rotate along with the rotary driving mechanism; the start signal is generated by the spin coating unit after the wafer is placed in the spin coating unit and in a vacuum adsorption state.
In some embodiments, before the wafer is placed in the spin coating unit, the method further comprises:
an operator fixes the wafer box filled with wafers on the wafer box base through taking/sending the wafer box, and the wafer box base is provided with a detection device for detecting whether the wafer box is placed at a fixed position of the wafer box base. If the wafer box is already placed at the fixed position of the wafer box base, an arm of a driving robot takes out the wafer in the wafer box and puts the wafer into a centering unit for centering. In the embodiment, the centering manner of the centering unit is conventional, such as double-arm positioning air cylinder driving, six-point PPS material contact with the edge of the wafer, and the like.
And after the centering is finished, taking out the wafer by a robot arm, and putting the wafer into a spin coating unit.
After the wafer is placed in the spin coating unit, the spin coating unit performs vacuum adsorption on the wafer.
In the present embodiment, a vacuum detection unit is provided to detect the vacuum state. Such as a vacuum gauge. When the vacuum detection unit detects that negative pressure is formed inside the wafer bearing seat and reaches a preset negative pressure value, the wafer is placed in the spin coating unit and is in a vacuum adsorption state, the vacuum detection unit generates a starting signal at the moment and sends the starting signal to the robot controller, and the robot controller responds to the starting signal and sends a control command to the rotary driving mechanism in the spin coating unit to control the rotary driving mechanism of the spin coating unit to act, and particularly controls the motor to rotate to drive the wafer to follow the rotary driving mechanism to rotate.
In this embodiment, as shown in fig. 2, the spin coating unit includes a bottom plate 1, a wafer bearing seat 3, a collecting barrel 4, a waterproof cover 5, a main shaft 7, a bearing seat 17, and a rotation driving mechanism, wherein a mounting hole is formed in the bottom of the collecting barrel 4, the bearing seat 17 is mounted in the mounting hole, the main shaft 7 is mounted on the bearing seat 17 through a bearing set 8, the upper end of the main shaft 7 is connected to the wafer bearing seat 3, the rotation driving mechanism is disposed at the bottom of the bearing seat 17 and connected to the main shaft 7, and the rotation driving mechanism is configured to drive the main shaft 7 to rotate; the waterproof cover 5 is sleeved outside the main shaft 7, and the lower end of the waterproof cover 5 is hermetically connected with the bottom of the collecting barrel 4; the bottom plate 1 is sleeved at the top of the collecting barrel 4, and the spin-coating nozzle assembly 2 is arranged on the bottom plate 1.
In this embodiment, as shown in fig. 2, the rotation driving mechanism includes a small toothed wheel 9, a synchronous belt 10, a motor connecting plate 12, a large toothed wheel 13 and a motor 14, wherein the motor connecting plate 12 is installed at the bottom of the bearing seat 17, the motor 14 is installed on the motor connecting plate 12, an output end of the motor 14 is connected with the large toothed wheel 13, the small toothed wheel 9 is disposed at a lower end of the main shaft 7 and is in transmission connection with the large toothed wheel 13 through the synchronous belt 10. The motor 14 drives the large cog 13 to rotate, the small cog 9 is driven to rotate by the synchronous belt 10, and the small cog 9 drives the main shaft 7 and the wafer bearing seat 3 to rotate at a high speed.
In the present embodiment, as shown in fig. 3, the collecting tub 4 includes an inner tub 42 and an outer tub 41 nested with each other, an upper end of the inner tub 42 is connected to an upper end of the outer tub 41 through a connecting portion, a lower end of the inner tub 42 is suspended, and a ring cavity 45 is formed between the outer tub 41 and the inner tub 42; an annular groove 43 is arranged on the connecting part along the circumferential direction, and a plurality of through holes 44 communicated with an annular cavity 45 are arranged at the bottom of the annular groove 43 at intervals.
In the embodiment, the wafer carrier 3 is located above the collecting barrel 4, and the outer edge of the wafer carrier 3 corresponds to the annular groove 43. During the spin coating process, the thrown glycerol mixed solution enters the annular groove 43 and then enters the annular cavity 45 through the through hole 44.
In this embodiment, a vacuum channel is axially arranged in the main shaft 7, and the lower end of the main shaft 7 is connected with an external vacuum air source through a vacuum air inlet joint 11.
In the present embodiment, the spin-coating nozzle assembly 2 is disposed on one side of the wafer carrier 3 for spraying the glycerol mixture solution.
In this embodiment, a wafer is placed on the wafer bearing seat 3, and then the wafer is connected to a vacuum pipeline through the vacuum air inlet joint 11, so that negative pressure is formed inside the wafer bearing seat 3, and it is ensured that the wafer can be adsorbed on the wafer bearing seat 3, after the wafer is adsorbed, the motor 14 is started, the motor 14 drives the large toothed wheel 13 to rotate, the small toothed wheel 9 is driven to rotate through the synchronous belt 10, and the small toothed wheel 9 drives the main shaft 7 and the wafer bearing seat 3 to rotate at a high speed. In the rotation process, the spin-coating nozzle assembly 2 is moved to the designated position of the wafer for spraying, corresponding spraying amount is calculated according to the sizes of different wafers for metering and spraying, and the glycerol mixed solution sprayed by the spin-coating nozzle can be uniformly and smoothly adsorbed on the surface of the wafer by the centrifugal force formed by high-speed rotation of the wafer, so that the consistency and the smoothness of the coating thickness sprayed on the surface of the wafer are ensured. The motor 14 directly drives the main shaft 7 to rotate through the synchronous belt 10, and because the synchronous belt 10 is thin and light, the linear speed is high during transmission, the transmission ratio is high, the transmission efficiency can reach 98 percent, the transmission efficiency is greatly increased, and the energy loss is reduced. Still because the inside of hold-in range 10 is designed according to gear structure, the transmission precision is high, and tensile strength is strong, so when driving the wafer gyration, the centrifugal force of wafer can be accurate and smooth will adsorb glycerine on the wafer surface. The spraying amount and the spraying speed of the glycerol are controlled, so that the glycerol is fully, accurately and uniformly sprayed on the wafer. In addition, the solution thrown out in the spin coating process can be effectively collected through the collecting barrel 4, so that the waste liquid generated in the wafer preparation process is greatly reduced, the environmental pollution is reduced, the material waste is avoided, the production cost is reduced, and the product rate is improved.
And S102, when the rotation driving mechanism reaches a preset rotation speed, controlling the spin coating unit to spray the glycerol mixed solution to the center of the upper surface of the wafer.
In this embodiment, the glycerol mixed solution is a mixed solution of ammonium chloride and glycerol in a certain ratio.
In this embodiment, the spraying position of the glycerol mixed solution is the central position of the upper surface of the wafer, and the glycerol mixed solution needs to cover the entire surface of the wafer through wafer rotation in the following process, so that if the spraying position is located at other positions on the surface of the wafer, the glycerol mixed solution is prone to not cover the entire surface of the wafer, and the glycerol mixed solution rotates and flies away from the surface of the wafer when the entire surface of the wafer is not covered yet, which causes solution waste.
In some embodiments, the robot controller presets a spray amount of the glycerin mixture solution, and controls the spin-coating unit to stop spraying the glycerin mixture solution when the spray amount of the glycerin mixture solution sprayed by the spin-coating unit reaches the preset spray amount of the glycerin mixture solution. The spraying amount of the glycerin mixture solution is set to prevent the glycerin from being wasted.
In this embodiment, a plurality of indium columns are disposed on the surface of the wafer, the indium columns are distributed on the surface of the wafer in a rectangular array, and the edges of indium column distribution areas are close to the edges of the wafer. Therefore, if the glycerin mixture solution is to cover all the indium columns on the surface of the wafer, the glycerin mixture solution is similar to the glycerin mixture solution covering the whole surface of the wafer.
S103, judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer, if so, controlling the spin coating unit to stop spraying the glycerol mixed solution and stop the rotary driving mechanism; otherwise, the current working state is kept.
Further, the determining whether the glycerol mixture solution on the surface of the wafer covers the entire surface of the wafer includes:
acquiring the surface image of the wafer through a high-speed camera; judging whether the non-edge texture features exist in the wafer surface image or not; if the mixed solution exists, the glycerol mixed solution on the surface of the wafer does not cover the whole surface of the wafer; otherwise, the glycerol mixture solution on the surface of the wafer is considered to cover the whole surface of the wafer.
The judging whether the non-edge texture features exist in the wafer surface image comprises the following steps:
extracting the edge contour of the wafer according to a contour extraction algorithm to obtain the edge texture of the wafer; judging whether the edge texture features of the glycerol mixed solution exist in the edge texture of the wafer, and if so, taking the edge texture features of the glycerol mixed solution as non-edge texture features; otherwise, the non-edge texture features do not exist in the wafer surface image.
In this embodiment, the current working state is maintained, that is, the current rotation speed of the rotation driving mechanism is kept unchanged, the spin coating unit is kept to continuously spray the glycerol mixed solution, and whether the glycerol mixed solution on the surface of the wafer covers the entire surface of the wafer is continuously determined.
And S104, after the rotary driving mechanism is in a stop state, the robot controller controls the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit, and the wafer is sent into a baking unit to be baked, so that the glycerol mixed solution covered on the surface of the wafer is reacted with the indium columns on the surface of the wafer.
In this embodiment, after the glycerin mixture solution on the surface of the wafer covers the entire surface of the wafer, the rotation driving mechanism of the spin coating unit stops rotating. And the robot controller controls the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit and send the wafer into the baking unit for baking.
In this example, since the reaction temperature (melting point) of indium is about 160 °, the baking temperature of the baking unit is set to 160 ° or more, and the metal indium is reacted with the ammonium chloride activator dissolved in glycerin by using glycerin as a heat transfer medium.
In this embodiment, the robot controller presets a response time, and performs timing by using the timer, and when the preset response time is reached, the robot controller controls the robot arm to take out the reacted wafer from the baking unit and send the wafer into the cleaning unit for cleaning.
In this embodiment, the robot controller presets a cleaning time, and when the preset cleaning time is reached, the robot controller controls the robot arm to take out the cleaned wafer from the cleaning unit and send the wafer to the wafer box.
According to the embodiment of the invention, the operation process is simple, the automatic balling of the indium columns can be realized, and only one surface (upper surface) of the wafer needs to be cleaned after reaction.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are exemplary embodiments and that the acts and modules illustrated are not necessarily required to practice the invention.
The above is a description of method embodiments, and the embodiments of the present invention are further described below by way of apparatus embodiments.
As shown in fig. 4, the apparatus 400 includes:
the rotation control unit 410 is used for responding to the starting signal and controlling the rotation driving mechanism of the spin coating unit to act so as to drive the wafer to rotate along with the rotation driving mechanism; the starting signal is generated by the spin coating unit after the wafer is placed in the spin coating unit and is in a vacuum adsorption state;
a spraying control unit 420, configured to control the spin coating unit to spray the glycerol mixture solution to a center position of an upper surface of a wafer in the spin coating unit when the rotation driving mechanism reaches a preset rotation speed;
the detection unit 430 is configured to determine whether the glycerol mixed solution on the surface of the wafer covers the entire surface of the wafer, and if so, control the spin coating unit to stop spraying the glycerol mixed solution and stop the rotation driving mechanism; otherwise, keeping the current working state;
the taking and feeding control unit 440 is used for controlling the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit after the rotation driving mechanism is in the stop state, and sending the wafer into the baking unit for baking, so that the glycerol mixed solution covered on the surface of the wafer reacts with the indium columns on the surface of the wafer; when the preset reaction time is reached, controlling the robot arm to take the reacted wafer out of the baking unit and send the wafer into a cleaning unit for cleaning; and when the preset cleaning time is reached, controlling the robot arm to take out the cleaned wafer from the cleaning unit and send the wafer to the wafer box.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working process of the described module may refer to the corresponding process in the foregoing method embodiment, and is not described herein again.
In the technical scheme of the invention, the acquisition, storage, application and the like of the personal information of the related user all accord with the regulations of related laws and regulations without violating the good customs of the public order.
According to an embodiment of the invention, the invention further provides an electronic device.
FIG. 5 shows a schematic block diagram of an electronic device 500 that may be used to implement an embodiment of the invention. Electronic devices are intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.
The device 500 comprises a computing unit 501 which may perform various suitable actions and processes in accordance with a computer program stored in a Read Only Memory (ROM) 502 or a computer program loaded from a storage unit 508 into a Random Access Memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the device 500 can also be stored. The calculation unit 501, the ROM 502, and the RAM 503 are connected to each other by a bus 504. An input/output (I/O) interface 505 is also connected to bus 504.
A number of components in the device 500 are connected to the I/O interface 505, including: an input unit 506 such as a keyboard, a mouse, or the like; an output unit 507 such as various types of displays, speakers, and the like; a storage unit 508, such as a magnetic disk, optical disk, or the like; and a communication unit 509 such as a network card, modem, wireless communication transceiver, etc. The communication unit 509 allows the device 500 to exchange information/data with other devices through a computer network such as the internet and/or various telecommunication networks.
The computing unit 501 may be a variety of general-purpose and/or special-purpose processing components having processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various dedicated Artificial Intelligence (AI) computing chips, various computing units running machine learning model algorithms, a Digital Signal Processor (DSP), and any suitable processor, controller, microcontroller, and so forth. The computing unit 501 performs the various methods and processes described above, such as methods S101-S104. For example, in some embodiments, methods S101-S104 may be implemented as a computer software program tangibly embodied in a machine-readable medium, such as storage unit 508. In some embodiments, part or all of the computer program may be loaded and/or installed onto device 500 via ROM 502 and/or communications unit 509. When the computer program is loaded into the RAM 503 and executed by the computing unit 501, one or more of the steps of the methods S101-S104 described above may be performed. Alternatively, in other embodiments, the computing unit 501 may be configured to perform the methods S101-S104 by any other suitable means (e.g., by way of firmware).
Various implementations of the systems and techniques described here above may be implemented in digital electronic circuitry, integrated circuitry, field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), system on a chip (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and/or combinations thereof. These various embodiments may include: implemented in one or more computer programs that are executable and/or interpretable on a programmable system including at least one programmable processor, which may be special or general purpose, receiving data and instructions from, and transmitting data and instructions to, a storage system, at least one input device, and at least one output device.
Program code for implementing the methods of the present invention may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the program codes, when executed by the processor or controller, cause the functions/operations specified in the flowchart and/or block diagram to be performed. The program code may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.
In the context of the present invention, a machine-readable medium may be a tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. The machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
To provide for interaction with a user, the systems and techniques described here can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which a user may provide input to the computer. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic, speech, or tactile input.
The systems and techniques described here can be implemented in a computing system that includes a back-end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front-end component (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back-end, middleware, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local Area Networks (LANs), wide Area Networks (WANs), and the Internet.
The computer system may include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. The server may be a cloud server, a server of a distributed system, or a server combining a blockchain.
It should be understood that various forms of the flows shown above may be used, with steps reordered, added, or deleted. For example, the steps described in the present invention may be executed in parallel, sequentially, or in different orders, and are not limited herein as long as the desired result of the technical solution of the present invention can be achieved.
The above-described embodiments should not be construed as limiting the scope of the invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made, depending on design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. An indium column balling control method is applied to a robot controller and is characterized by comprising the following steps:
responding to a starting signal, controlling a rotary driving mechanism of the spin coating unit to act, and driving the wafer to rotate along with the rotary driving mechanism; the starting signal is generated by the spin coating unit after the wafer is placed in the spin coating unit and is in a vacuum adsorption state;
when the rotation driving mechanism reaches a preset rotation speed, controlling the spin coating unit to spray the glycerol mixed solution to the center of the upper surface of the wafer;
judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer, if so, controlling the spin coating unit to stop spraying the glycerol mixed solution and stop the rotary driving mechanism; otherwise, keeping the current working state;
after the rotary driving mechanism is in a stop state, controlling the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit and send the wafer into a baking unit for baking, so that the glycerol mixed solution covered on the surface of the wafer reacts with the indium columns on the surface of the wafer; when the preset reaction time is reached, controlling the robot arm to take the wafer after reaction out of the baking unit and send the wafer into a cleaning unit for cleaning; when the preset cleaning time is up, controlling a robot arm to take out the cleaned wafer from the cleaning unit and send the wafer to a wafer box;
the judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer comprises the following steps:
acquiring the surface image of the wafer;
judging whether the non-edge texture features exist in the wafer surface image or not; if the mixed solution exists, the glycerol mixed solution on the surface of the wafer does not cover the whole surface of the wafer; otherwise, the glycerol mixed solution on the surface of the wafer is considered to cover the whole surface of the wafer;
the judging whether the non-edge texture features exist in the wafer surface image comprises the following steps:
extracting the edge contour of the wafer according to a contour extraction algorithm to obtain edge texture of the wafer;
judging whether the edge texture features of the glycerol mixed solution exist in the edge texture of the wafer, and if so, taking the edge texture features of the glycerol mixed solution as non-edge texture features; otherwise, the non-edge texture features do not exist in the wafer surface image.
2. The method of claim 1, wherein the surface of the wafer is provided with a plurality of indium columns.
3. The method of claim 1, further comprising: before the wafer is placed in the spin coating unit, the robot controller controls the robot arm to take the wafer out of the wafer box and place the wafer into the centering unit for centering.
4. The method of claim 3, further comprising: and after the alignment is finished, the robot controller controls the robot arm to take the wafer out of the alignment unit and send the wafer into the spin coating unit.
5. The method according to claim 1, wherein the robot controller presets a spraying amount of the glycerin mixture solution, and when the amount of the glycerin mixture solution sprayed by the spin-coating unit reaches the preset spraying amount of the glycerin mixture solution, the robot controller controls the spin-coating unit to stop spraying the glycerin mixture solution.
6. An indium bump bumping control device, comprising:
the rotation control unit responds to the starting signal and controls the rotation driving mechanism of the spin coating unit to act so as to drive the wafer to rotate along with the rotation driving mechanism; the starting signal is generated by the spin coating unit after the wafer is placed in the spin coating unit and is in a vacuum adsorption state;
the spraying control unit is used for controlling the spin coating unit to spray the glycerol mixed solution to the central position of the upper surface of the wafer when the rotary driving mechanism reaches a preset rotating speed;
the detection unit is used for judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer, and if so, the spin coating unit is controlled to stop spraying the glycerol mixed solution and stop the rotary driving mechanism; otherwise, keeping the current working state;
the taking and delivering control unit is used for controlling the robot arm to take the wafer with the surface covered with the glycerol mixed solution out of the spin coating unit after the rotary driving mechanism is in a stop state, and sending the wafer into the baking unit for baking so that the glycerol mixed solution covered on the surface of the wafer reacts with the indium columns on the surface of the wafer; when the preset reaction time is reached, controlling the robot arm to take the reacted wafer out of the baking unit and send the wafer into a cleaning unit for cleaning; when the preset cleaning time is up, controlling a robot arm to take out the cleaned wafer from the cleaning unit and send the wafer to a wafer box;
the judging whether the glycerol mixed solution on the surface of the wafer covers the whole surface of the wafer comprises the following steps:
acquiring the surface image of the wafer;
judging whether the non-edge texture features exist in the wafer surface image or not; if the mixed solution exists, the glycerol mixed solution on the surface of the wafer does not cover the whole surface of the wafer; otherwise, the glycerol mixed solution on the surface of the wafer is considered to cover the whole surface of the wafer;
the judging whether the non-edge texture features exist in the wafer surface image comprises the following steps:
extracting the edge contour of the wafer according to a contour extraction algorithm to obtain edge texture of the wafer;
judging whether the edge texture features of the glycerol mixed solution exist in the edge textures of the wafer or not, and if so, taking the edge texture features of the glycerol mixed solution as non-edge texture features; otherwise, the non-edge texture features do not exist in the wafer surface image.
7. An electronic device comprising at least one processor; and
a memory communicatively coupled to the at least one processor; it is characterized in that the preparation method is characterized in that,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-5.
CN202211263760.2A 2022-10-17 2022-10-17 Indium column balling-up control method, device and equipment Active CN115346882B (en)

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