CN115340784A - Solder resist ink with reflection performance, circuit board and display device - Google Patents
Solder resist ink with reflection performance, circuit board and display device Download PDFInfo
- Publication number
- CN115340784A CN115340784A CN202210977412.5A CN202210977412A CN115340784A CN 115340784 A CN115340784 A CN 115340784A CN 202210977412 A CN202210977412 A CN 202210977412A CN 115340784 A CN115340784 A CN 115340784A
- Authority
- CN
- China
- Prior art keywords
- solder resist
- weight
- resist ink
- temperature
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The embodiment of the application provides solder resist ink with reflection performance, a circuit board and a display device. The solder resist ink with the reflection performance comprises an ink matrix and temperature response type micro-vesicles dispersed in the ink matrix, wherein the temperature response type micro-vesicles comprise temperature response type polymers and free radical inhibitors coated by the temperature response type polymers, and the temperature response type polymers are decomposed when the external environment reaches a high temperature, so that the temperature response type micro-vesicles can be decomposed at the high temperature to release the free radical inhibitors in the vesicles, the generation of free radicals in the solder resist ink is inhibited, the generation of oxidation products such as chromophoric groups and auxiliary chromophoric groups in the solder resist ink is inhibited or reduced, and the yellowing phenomenon of the solder resist ink is reduced or eliminated.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a solder resist ink with reflection performance, a circuit board and a display device.
Background
In recent years, the Mini-LED display technology has been widely applied in the display field due to its advantages of fast response, high color gamut, high PPI, low energy consumption, ultra-high partition number, accurate dimming, ultra-high contrast, and the like.
In order to improve the light emitting efficiency of the Mini-LED display and reduce the energy consumption, a layer of white oil with high reflectivity is usually coated on the surface of a circuit board on which the Mini-LED device is mounted, so as to improve the reflectivity of the circuit board to the light emitted by the Mini-LED device, and further improve the light emitting efficiency of the Mini-LED display.
At present, a Mini-LED device is generally soldered on a circuit board by a reflow soldering method, and heating is often required to melt solder paste during soldering, however, at a high temperature, white oil on the circuit board is easily oxidized by oxygen in the air to generate chromophoric groups or color assisting groups such as double bonds (-C = C-), carbonyl (-C = O), carboxyl (-COOH), hydroxyl (-OH), and the like, so that the white oil is yellowed, and the light-emitting efficiency of the Mini-LED display is reduced due to the reduced reflectivity of light after the white oil is yellowed.
Disclosure of Invention
The embodiment of the application provides a hinder welding ink, circuit board and display device with reflectivity, when this hinder welding ink with reflectivity is applied to and forms the solder mask ink layer in display device's the circuit board, can avoid leading to the problem that light reflectivity reduces because of solder mask ink layer etiolation, promotes display device's luminous efficacy.
In a first aspect, the present application provides a solder resist ink with reflective performance, which includes an ink matrix and temperature-responsive micro-capsules dispersed in the ink matrix, wherein the mass ratio of the temperature-responsive micro-capsules in the solder resist ink is 0.1wt% to 3wt%, and the temperature-responsive micro-capsules include a temperature-responsive polymer and a radical inhibitor encapsulated by the temperature-responsive polymer.
In some embodiments, the temperature responsive polymer comprises at least one of PNIPAm, PEOGMA-EE, and PEOGMA-MA;
the free radical inhibitor comprises at least one of 2, 6-di-tert-butyl-4-methylphenol and tetramethylpiperidine nitroxide.
In some embodiments, the temperature-responsive microvesicles have a particle size ranging from 80nm to 120nm;
the mass ratio of the temperature response type polymer to the free radical inhibitor is (50-100): 1.
in some embodiments, the ink matrix comprises 50-60 parts by weight of photosensitive resin material, 10-15 parts by weight of solvent, 5-10 parts by weight of cross-linking agent, 3-6 parts by weight of photosensitizer, 3-6 parts by weight of reflecting material, 0.6-0.1 part by weight of filler and 0.03-0.18 part by weight of auxiliary agent.
In some embodiments, the photosensitive resin material is a carboxyl group-containing photosensitive resin;
the solvent comprises pentaerythritol tripropionate;
the cross-linking agent comprises at least one of diethylene glycol diacrylate, triethylene glycol dimethacrylate and diethylene glycol diacrylate.
In some embodiments, the photosensitizer comprises at least one of benzoin ethyl ether, acetophenone, and 4,4' -dimethylaminobenzophenone;
the reflective material comprises titanium dioxide;
the filler includes at least one of a silica powder, a calcium carbonate powder, a zeolite powder, and a metal oxide powder.
In some embodiments, the 0.03-0.18 parts of the auxiliary agent comprises 0.01-0.1 part of defoaming agent and 0.02-0.08 part of leveling agent by weight, wherein the defoaming agent comprises at least one of silicone oil, polyether defoaming agent and polyether modified silicon defoaming agent, and the leveling agent comprises at least one of benzotriazole, isophorone and diacetone alcohol.
In some embodiments, the ink base includes 50 to 60 parts by weight of a carboxyl group-containing photosensitive resin, 10 to 15 parts by weight of pentaerythritol tripropionate, 5 to 10 parts by weight of diethylene glycol diacrylate, 3 to 6 parts by weight of benzoin ethyl ether, 3 to 6 parts by weight of titanium dioxide, 0.6 to 0.1 part by weight of silicon dioxide, 0.01 to 0.1 part by weight of silicone oil, and 0.02 to 0.08 part by weight of benzotriazole.
In a second aspect, an embodiment of the present application provides a circuit board, including:
a substrate;
the solder resist ink layer is arranged on the base material, a hollow part is arranged on the solder resist ink layer, and the solder resist ink layer is made of the solder resist ink with the reflecting performance;
and the welding disc assembly is arranged on the base material and arranged in the hollow-out part of the solder resist ink layer.
In a third aspect, an embodiment of the present application provides a display device, including:
a circuit board, the circuit board being as described above;
and the light-emitting device is electrically connected with the welding disc assembly of the circuit board.
The solder resist ink with the reflection performance provided by the embodiment of the application comprises a temperature response type micro-vesicle, wherein the temperature response type micro-vesicle comprises a temperature response type polymer and a free radical inhibitor coated by the temperature response type polymer, and the temperature response type polymer can be decomposed when the external environment reaches a higher temperature (for example, the temperature is higher than or equal to 60 ℃), so that the temperature response type micro-vesicle can be decomposed at the higher temperature, the free radical inhibitor in the vesicle is released, the generation of free radicals in the solder resist ink is inhibited, the generation of oxidation products such as chromophoric groups, auxiliary chromophoric groups and the like in the solder resist ink is inhibited or reduced, the yellowing phenomenon of the solder resist ink is reduced or eliminated, when the ink with the reflection performance is applied to a circuit board of a display device to form an ink layer, the problem of light reflectivity reduction caused by the yellowing of the solder resist ink layer can be avoided, and the light extraction efficiency of the display device is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below.
Fig. 1 is a schematic structural diagram of a temperature-responsive microvesicle provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application firstly provides solder resist ink with reflection performance, which comprises an ink matrix and temperature response type micro-vesicles dispersed in the ink matrix, wherein the mass ratio of the temperature response type micro-vesicles in the solder resist ink is 0.1wt% -3 wt%. Illustratively, the mass ratio of the temperature-responsive microvesicles in the solder resist ink may be 0.1wt%, 0.5wt%, 1wt%, 1.5wt%, 2wt%, 2.5wt%, 3wt%, etc.
It can be understood that the mass ratio of the ink matrix in the solder resist ink is 97wt% to 99.9wt%.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a temperature-responsive microvesicle according to an embodiment of the present disclosure. The temperature-responsive microvesicle 10 includes a temperature-responsive polymer 11 and a radical inhibitor 12 encapsulated by the temperature-responsive polymer 11.
Illustratively, the particle size of the temperature-responsive microvesicles 10 ranges from 80nm to 120nm, such as 80nm, 85nm, 90nm, 95nm, 100nm, 105nm, 110nm, 115nm, 120nm, etc.
Illustratively, the mass ratio of the temperature-responsive polymer 11 to the radical inhibitor 12 is (50 to 100): 1, e.g. 50: 1. 60: 1. 70: 1. 80: 1. 90: 1. 100:1, etc.
For example, the color of the solder resist ink with the reflective property may be white, because white has a higher reflectivity, and therefore, when the solder resist ink with the reflective property is applied to the circuit board 20 of the display device 100 to form the solder resist ink layer 22, the reflectivity of the circuit board 20 to the emitted light of the light emitting device 30 may be improved, thereby improving the light extraction efficiency of the display device 100.
Illustratively, the temperature responsive polymer 11 may include at least one of PNIPAm (poly (N-isopropylacrylamide)), PEOGMA-EE, and PEOGMA-MA. PEOGMA-EE is a polyethylene oxide-grafted polymethyl methacrylate dissolved in ethylene glycol ethyl ether as a solvent, and PEOGMA-MA is a polyethylene oxide-grafted polymethyl methacrylate dissolved in methyl methacrylate as a solvent.
Wherein the structural formula of the poly (N-isopropyl acrylamide) (PNIPAm) is shown in the specification
The structural formula of the polyoxyethylene grafted polymethyl methacrylate is shown as
Illustratively, the free radical inhibitor 12 includes at least one of 2, 6-di-tert-butyl-4-methylphenol (BHT) and tetramethylpiperidine nitroxide (TEMPO).
Illustratively, the ink matrix comprises 50 to 60 parts by weight of photosensitive resin material, 10 to 15 parts by weight of solvent, 5 to 10 parts by weight of cross-linking agent, 3 to 6 parts by weight of photosensitizer, 3 to 6 parts by weight of reflecting material, 0.6 to 0.1 part by weight of filler and 0.03 to 0.18 part by weight of assistant. It should be noted that, by adding the photosensitive resin material to the ink matrix, when the solder resist ink layer 22 on the circuit board 20 is prepared by using the solder resist ink, the solder resist ink can be exposed and developed by utilizing the photosensitivity of the photosensitive resin material, so that the solder resist ink layer 22 is patterned to form the patterns such as the hollow-out portion 225. Further, by adding a photosensitizer to the ink base, the photosensitivity of the photosensitive resin material can be enhanced, which is advantageous for patterning the solder resist ink layer 22.
Illustratively, the color of the ink matrix may be white to enhance the reflective properties of the solder resist ink.
Illustratively, the photosensitive resin material may be a carboxyl group-containing photosensitive resin. The carboxyl group-containing photosensitive resin is a conventional material in the art, and the specific components of the carboxyl group-containing photosensitive resin are not limited in the examples of the present application.
Illustratively, the solvent may include pentaerythritol tripropionate.
Illustratively, the crosslinking agent may include at least one of triethylene glycol diacrylate, triethylene glycol dimethacrylate, and diethylene glycol diacrylate. It will be appreciated that the cross-linking agent may function to promote cross-linking and curing of the photosensitive resin material so that the solder resist ink may be cured to form the solder resist ink layer 22. The crosslinking agents such as triethylene glycol diacrylate, triethylene glycol dimethacrylate and diethylene glycol diacrylate also serve as a co-solvent and promote dissolution of the photosensitive resin material during the preparation of the solder resist ink.
Illustratively, the photosensitizer may include at least one of benzoin ethyl ether, acetophenone, and 4,4' -dimethylaminobenzophenone. The photosensitizer such as benzoin ethyl ether, acetophenone, and 4,4' -dimethylamino benzophenone can also function as a cosolvent to promote the dissolution of the photosensitive resin material.
Illustratively, the reflective material may include titanium dioxide. It is understood that the reflection performance of the solder resist ink can be improved by adding a reflective material such as titanium dioxide to the ink base.
Illustratively, the filler includes at least one of a silica powder, a calcium carbonate powder, a zeolite powder, and a metal oxide powder. The silica can be prepared by a thermal decomposition method. Illustratively, the metal oxide powder may include at least one of aluminum oxide powder, lead oxide powder, and beryllium oxide powder.
Illustratively, the particle size of the reflective material and the filler may each be 10nm to 1000nm, such as 10nm, 30nm, 50nm, 80nm, 100nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1000nm, and the like.
Illustratively, the auxiliary agent 0.03-0.18 part by weight can comprise defoaming agent 0.01-0.1 part and leveling agent 0.02-0.08 part.
Illustratively, the defoaming agent may include at least one of silicone oil, polyether-based defoaming agent, and polyether-modified silicon-based defoaming agent. It should be noted that silicone oil generally refers to a linear silicone product that remains in a liquid state at room temperature.
Illustratively, the leveling agent may include at least one of benzotriazole, isophorone, and diacetone alcohol. The leveling agent such as benzotriazole, isophorone or diacetone alcohol may also function as a cosolvent to promote dissolution of the photosensitive resin material.
In some embodiments, the ink base may include 50 to 60 parts by weight of a carboxyl group-containing photosensitive resin, 10 to 15 parts by weight of pentaerythritol tripropionate, 5 to 10 parts by weight of diethylene glycol diacrylate, 3 to 6 parts by weight of benzoin ethyl ether, 3 to 6 parts by weight of titanium dioxide, 0.6 to 0.1 part by weight of silicon dioxide, 0.01 to 0.1 part by weight of silicone oil, and 0.02 to 0.08 part by weight of benzotriazole. It should be noted that the ink base of the formula is white in color and has good reflection performance.
The solder resist ink with the reflection performance provided by the embodiment of the application comprises a temperature response type micro-capsule 10, wherein the temperature response type micro-capsule 10 comprises a temperature response type polymer 11 and a free radical inhibitor 12 coated by the temperature response type polymer 11, and the temperature response type polymer 11 is decomposed when the external environment reaches a higher temperature (for example, greater than or equal to 60 ℃), so that the temperature response type micro-capsule 10 can be decomposed under the higher temperature condition, the free radical inhibitor 12 in the interior of the micro-capsule is released, the generation of free radicals in the solder resist ink is inhibited, the generation of oxidation products such as chromophoric groups and auxiliary chromophoric groups in the solder resist ink is inhibited or reduced, the yellowing phenomenon of the solder resist ink is reduced or eliminated, when the solder resist ink with the reflection performance is applied to a solder resist ink layer 22 formed in a circuit board 20 of a display device 100, the problem of the reduction of the light reflectivity caused by the yellowing of the solder resist ink layer 22 can be avoided, and the light extraction efficiency of the display device 100 is improved.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure. The embodiment of the present application further provides a circuit board 20, which includes a substrate 21, a solder resist ink layer 22, and a pad assembly 23. The solder resist ink layer 22 is disposed on the substrate 21, the solder resist ink layer 22 is provided with a hollow portion 225, and the material of the solder resist ink layer 22 is solder resist ink with reflection performance in any of the above embodiments. The pad assembly 23 is disposed on the substrate 21 and disposed in the hollow 225 of the solder resist ink layer 22.
Referring to fig. 2, the circuit board 20 may further include a first insulating layer 24, a reflective layer 26 and a second insulating layer 25 disposed between the substrate 21 and the pad assembly 23 and sequentially stacked in a direction from the substrate 21 to the pad assembly 23, wherein the reflective layer 26 is disposed corresponding to the hollow portion 225 of the solder resist ink layer 22, and the reflective layer 26 may cover a region between an edge of the pad assembly 23 and an edge of the hollow portion 225. It can be understood that by disposing the reflective layer 26 around the pad assembly 23 on the circuit board 20, the reflectivity of the circuit board 20 to the emitted light of the light emitting device 30 can be improved, and thus the light extraction efficiency of the display device can be improved. Illustratively, the material of the first insulating layer 24 and the material of the second insulating layer 25 may each include at least one of silicon oxide, silicon nitride, and silicon oxynitride.
Illustratively, the reflective layer 26 may include a first transparent conductive metal oxide layer, a metal layer, and a second transparent conductive metal oxide layer, which are sequentially stacked in a direction from the substrate 21 to the pad assembly 23, wherein the material of the first transparent conductive metal oxide layer and the second transparent conductive metal oxide layer may be Indium Tin Oxide (ITO), the material of the metal layer may be silver (Ag), and the reflective layer 26 may be formed into a bragg mirror by disposing the reflective layer 26 in a structure composed of the first transparent conductive metal oxide layer, the metal layer, and the second transparent conductive metal oxide layer, so that the reflective performance of the reflective layer 26 may be enhanced.
Referring to fig. 2, the circuit board 20 may further include a conductive line 27 disposed between the substrate 21 and the first insulating layer 24, and the conductive line 27 is electrically connected to the pad assembly 23 and may function to input an electrical signal to the pad assembly 23. Illustratively, the material of the wire 27 may be a metal, such as copper.
Illustratively, the substrate 21 may be an insulating material, such as glass.
Illustratively, the material of the pad assembly 23 may be a metal, such as copper.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. The embodiment of the present application further provides a display device 100, which includes a circuit board 20 and a light emitting device 30, where the circuit board 20 is the circuit board 20 in any of the embodiments, and the light emitting device 30 is electrically connected to the pad assembly 23 in the circuit board 20.
It is understood that the light emitting device 30 may be connected to the pad assembly 23 by soldering, when the light emitting device 30 is soldered to the pad assembly 23, the solder paste between the light emitting device 30 and the pad assembly 23 needs to be heated to be melted, the conventional solder resist ink is easily oxidized at high temperature to generate color-emitting groups or color-promoting groups such as double bonds (-C = C-), carbonyl (-C = O), carboxyl (-COOH), hydroxyl (-OH), and the like, thereby causing yellowing of the solder resist ink, which may result in a decrease in light extraction efficiency of the display device 100 due to a decrease in reflectivity of light after yellowing of the solder resist ink, whereas the solder resist ink having reflective property adopted in the embodiment of the present application contains the temperature-responsive microcapsule 10, the temperature-responsive microcapsule 10 includes the temperature-responsive polymer 11 and the radical inhibitor 12 encapsulated by the temperature-responsive polymer 11, and the temperature-responsive polymer 11 may decompose when an external environment reaches a high temperature (for example, greater than or equal to 60 ℃), and thus the temperature-responsive microcapsule 10 may further reduce the generation of the solder resist ink and the generation of radicals in the solder resist ink, thereby eliminating the color-emitting groups or the oxidation of the solder resist ink, and the color-emitting groups, and the color-emitting ink may reduce the generation of the radicals of the solder resist ink, and the generation of the color-emitting ink, thereby eliminating the generation inhibitor 12, and the generation of the color-emitting groups in the solder resist ink in the display device 100.
Exemplarily, the light emitting device 30 may be an LED, such as a Mini-LED.
The solder resist ink with reflection performance, the circuit board and the display device provided by the embodiment of the application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The solder resist ink with the reflection performance is characterized by comprising an ink matrix and temperature-responsive micro-capsules dispersed in the ink matrix, wherein the mass ratio of the temperature-responsive micro-capsules in the solder resist ink is 0.1-3 wt%, and the temperature-responsive micro-capsules comprise a temperature-responsive polymer and a free radical inhibitor coated by the temperature-responsive polymer.
2. The solder resist ink with reflective properties of claim 1, wherein the temperature responsive polymer comprises at least one of PNIPAm, PEOGMA-EE and PEOGMA-MA;
the free radical inhibitor comprises at least one of 2, 6-di-tert-butyl-4-methylphenol and tetramethylpiperidine nitroxide.
3. The solder resist ink with reflection performance of claim 1, wherein the temperature response type micro vesicle has a particle size of 80nm to 120nm;
the mass ratio of the temperature response type polymer to the free radical inhibitor is (50-100): 1.
4. the solder resist ink with reflection property of any one of claims 1 to 3, wherein the ink matrix comprises 50 to 60 parts by weight of photosensitive resin material, 10 to 15 parts by weight of solvent, 5 to 10 parts by weight of cross-linking agent, 3 to 6 parts by weight of photosensitizer, 3 to 6 parts by weight of reflection material, 0.6 to 0.1 part by weight of filler, and 0.03 to 0.18 part by weight of auxiliary agent.
5. The solder resist ink with reflection property according to claim 4, wherein the photosensitive resin material is a carboxyl group-containing photosensitive resin;
the solvent comprises pentaerythritol tripropionate;
the cross-linking agent comprises at least one of diethylene glycol diacrylate, triethylene glycol dimethacrylate and diethylene glycol diacrylate.
6. The solder resist ink with reflection property of claim 4, wherein the photosensitizer comprises at least one of benzoin ethyl ether, acetophenone and 4,4' -dimethylamino benzophenone;
the reflective material comprises titanium dioxide;
the filler includes at least one of a silica powder, a calcium carbonate powder, a zeolite powder, and a metal oxide powder.
7. The solder resist ink with reflection performance of claim 4, wherein the 0.03-0.18 part by weight of the auxiliary comprises 0.01-0.1 part by weight of an antifoaming agent and 0.02-0.08 part by weight of a leveling agent, wherein the antifoaming agent comprises at least one of silicone oil, polyether antifoaming agent and polyether modified silicon antifoaming agent, and the leveling agent comprises at least one of benzotriazole, isophorone and diacetone alcohol.
8. The solder resist ink with reflection property of claim 4, wherein the ink base comprises 50 to 60 parts by weight of a carboxyl group-containing photosensitive resin, 10 to 15 parts by weight of pentaerythritol tripropionate, 5 to 10 parts by weight of triethylene glycol diacrylate, 3 to 6 parts by weight of benzoin ethyl ether, 3 to 6 parts by weight of titanium dioxide, 0.6 to 0.1 part by weight of silica, 0.01 to 0.1 part by weight of silicone oil, and 0.02 to 0.08 part by weight of benzotriazole.
9. A circuit board, comprising:
a substrate;
the solder resist ink layer is arranged on the substrate, a hollow part is arranged on the solder resist ink layer, and the solder resist ink layer is made of the solder resist ink with the reflection performance as claimed in any one of claims 1 to 8;
and the welding disc assembly is arranged on the base material and arranged in the hollow-out part of the solder resist ink layer.
10. A display device, comprising:
a circuit board according to claim 9;
and the light-emitting device is electrically connected with the welding disc assembly of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210977412.5A CN115340784B (en) | 2022-08-15 | 2022-08-15 | Solder resist ink with reflection performance, circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210977412.5A CN115340784B (en) | 2022-08-15 | 2022-08-15 | Solder resist ink with reflection performance, circuit board and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115340784A true CN115340784A (en) | 2022-11-15 |
| CN115340784B CN115340784B (en) | 2023-08-01 |
Family
ID=83951457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210977412.5A Active CN115340784B (en) | 2022-08-15 | 2022-08-15 | Solder resist ink with reflection performance, circuit board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115340784B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106133600A (en) * | 2014-12-10 | 2016-11-16 | 互应化学工业株式会社 | Photosensitive polymer combination, solder mask composition and capped printed substrate |
| CN109946883A (en) * | 2019-04-24 | 2019-06-28 | 深圳市华星光电技术有限公司 | Polymer stabilizing homeotropic liquid crystal display panel and its manufacturing method |
| CN110850644A (en) * | 2019-11-27 | 2020-02-28 | Tcl华星光电技术有限公司 | Liquid crystal display panel and method for manufacturing the same |
| CN112366197A (en) * | 2020-11-13 | 2021-02-12 | 深圳市鼎华芯泰科技有限公司 | Lead frame for chip packaging, preparation method and chip packaging structure |
-
2022
- 2022-08-15 CN CN202210977412.5A patent/CN115340784B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106133600A (en) * | 2014-12-10 | 2016-11-16 | 互应化学工业株式会社 | Photosensitive polymer combination, solder mask composition and capped printed substrate |
| CN109946883A (en) * | 2019-04-24 | 2019-06-28 | 深圳市华星光电技术有限公司 | Polymer stabilizing homeotropic liquid crystal display panel and its manufacturing method |
| CN110850644A (en) * | 2019-11-27 | 2020-02-28 | Tcl华星光电技术有限公司 | Liquid crystal display panel and method for manufacturing the same |
| CN112366197A (en) * | 2020-11-13 | 2021-02-12 | 深圳市鼎华芯泰科技有限公司 | Lead frame for chip packaging, preparation method and chip packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115340784B (en) | 2023-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4287449A (en) | Light-absorption film for rear electrodes of electroluminescent display panel | |
| KR100377309B1 (en) | An Improved Method To Embed Passive Components | |
| TW200303160A (en) | An improved method to embed thick film components | |
| KR20080037734A (en) | Light-emitting device, backlight using same, and liquid crystal display | |
| US6873091B2 (en) | Organic electroluminescent display device comprising an optical filter | |
| JP2007129191A5 (en) | ||
| US20090159855A1 (en) | Composition for use in making a light-blocking layer | |
| US20070166873A1 (en) | Organic electro luminescent display and manufacturing method thereof | |
| CN115340784B (en) | Solder resist ink with reflection performance, circuit board and display device | |
| US5462696A (en) | Electrically-conductive and ionically-conductive polymeric networks and their preparation | |
| KR20190111776A (en) | Photosensitive composition, composite, electronic component and electronic component manufacturing method | |
| CN102543254A (en) | Composition for forming electrode and electrode formed with the same | |
| CN113004808B (en) | Low-dielectric-coefficient ultraviolet curing adhesive and use method and application thereof | |
| CN114023492A (en) | Silver nanowire dispersion liquid with low ultraviolet absorption and application of silver nanowire dispersion liquid in conductive ink and conductive film | |
| JP2781475B2 (en) | Optical device | |
| CN110611020A (en) | Light emitting element | |
| CN109600910B (en) | Reflective circuit board and manufacturing method thereof | |
| KR20130060302A (en) | Polymer composite, use of the polymer composite and optoelectronic component containing the polymer composite | |
| US3860424A (en) | Led display | |
| TW200522398A (en) | Optoelectronic module and its production method | |
| JP5406691B2 (en) | Semiconductor light emitting device | |
| KR102292668B1 (en) | Thermoplastic resin film base for optical firing, conductive circuit board using same, and method for manufacturing said conductive circuit board | |
| KR20190085349A (en) | Adhesives for LED die bonding | |
| CN114551418A (en) | Preparation method of flexible light bar, flexible light bar and display device | |
| CN201146194Y (en) | LED capable of filtering ultraviolet waveband |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |