CN115340784B - Solder resist ink with reflection performance, circuit board and display device - Google Patents

Solder resist ink with reflection performance, circuit board and display device Download PDF

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Publication number
CN115340784B
CN115340784B CN202210977412.5A CN202210977412A CN115340784B CN 115340784 B CN115340784 B CN 115340784B CN 202210977412 A CN202210977412 A CN 202210977412A CN 115340784 B CN115340784 B CN 115340784B
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parts
circuit board
solder resist
temperature
ink
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CN115340784A (en
Inventor
周世新
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Guangzhou China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Guangzhou China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The embodiment of the application provides a solder resist ink with reflection performance, a circuit board and a display device. The solder resist ink with reflection performance comprises an ink matrix and temperature-responsive microvesicles dispersed in the ink matrix, wherein the temperature-responsive microvesicles comprise temperature-responsive polymers and free radical inhibitors wrapped by the temperature-responsive polymers, and the temperature-responsive polymers can be decomposed when the external environment reaches a higher temperature, so that the temperature-responsive microvesicles can be disintegrated under the condition of higher temperature to release the free radical inhibitors in the microvesicles, thereby inhibiting the generation of free radicals in the solder resist ink, and further inhibiting or reducing the generation of oxidation products such as chromophores, color-assisting groups and the like in the solder resist ink, and further reducing or eliminating the yellowing phenomenon of the solder resist ink.

Description

Solder resist ink with reflection performance, circuit board and display device
Technical Field
The present disclosure relates to the field of electronic technology, and in particular, to a solder resist ink with reflective properties, a circuit board, and a display device.
Background
In recent years, the Mini-LED display technology has the advantages of quick response, high color gamut, high PPI, low energy consumption, accurate dimming realized by ultrahigh partition number, ultrahigh contrast and the like, and is widely applied to the display field.
In order to improve the light-emitting efficiency of the Mini-LED display and reduce the energy consumption, a layer of white oil with high reflectivity is coated on the surface of a circuit board provided with the Mini-LED device, so that the reflectivity of the circuit board to the light emitted by the Mini-LED device is improved, and the light-emitting efficiency of the Mini-LED display is further improved.
At present, a Mini-LED device is generally welded on a circuit board by adopting a reflow soldering method, heating is often needed in the welding process to melt solder paste, however, under the condition of high temperature, white oil on the circuit board is easily oxidized by oxygen in air to generate double bonds (-C=C-), carbonyl (-C=O), carboxyl (-COOH), hydroxyl (-OH) and other chromophoric groups or auxiliary chromophoric groups, so that the white oil is yellow, and the light extraction efficiency of the Mini-LED display is reduced due to the reduction of the reflectivity of light after the white oil is yellow.
Disclosure of Invention
The embodiment of the application provides a solder resist ink with reflection performance, a circuit board and a display device, when the solder resist ink with reflection performance is applied to the circuit board of the display device to form a solder resist ink layer, the problem that the reflectivity of light is reduced due to yellowing of the solder resist ink layer can be avoided, and the light emitting efficiency of the display device is improved.
In a first aspect, embodiments of the present application provide a solder resist ink with reflective properties, including an ink matrix and temperature-responsive microvesicles dispersed in the ink matrix, wherein the mass ratio of the temperature-responsive microvesicles in the solder resist ink is 0.1wt% to 3wt%, and the temperature-responsive microvesicles include a temperature-responsive polymer and a radical inhibitor encapsulated by the temperature-responsive polymer.
In some embodiments, the temperature responsive polymer comprises at least one of PNIPAm, PEOGMA-EE and PEOGMA-MA;
the free radical inhibitor comprises at least one of 2, 6-di-tert-butyl-4-methylphenol and tetramethylpiperidine nitroxide.
In some embodiments, the temperature responsive microvesicles have a particle size of 80nm to 120nm;
the mass ratio of the temperature-responsive polymer to the free radical inhibitor is (50-100): 1.
in some embodiments, the ink matrix comprises, in parts by weight, 50-60 parts of photosensitive resin material, 10-15 parts of solvent, 5-10 parts of cross-linking agent, 3-6 parts of photosensitizer, 3-6 parts of reflective material, 0.6-0.1 part of filler, and 0.03-0.18 part of auxiliary agent.
In some embodiments, the photosensitive resin material is a carboxyl group-containing photosensitive resin;
the solvent comprises pentaerythritol tripropionate;
the cross-linking agent comprises at least one of triethylene glycol diacrylate, triethylene glycol dimethacrylate and diethylene glycol diacrylate.
In some embodiments, the photosensitizer comprises at least one of benzoin diethyl ether, acetophenone, and 4,4' -dimethylaminobenzophenone;
the reflective material comprises titanium dioxide;
the filler includes at least one of silica powder, calcium carbonate powder, zeolite powder, and metal oxide powder.
In some embodiments, the auxiliary agent 0.03-0.18 parts by weight includes an antifoaming agent 0.01-0.1 parts by weight and a leveling agent 0.02-0.08 parts by weight, wherein the antifoaming agent includes at least one of silicone oil, polyether type antifoaming agent and polyether modified silicone type antifoaming agent, and the leveling agent includes at least one of benzotriazole, isophorone and diacetone alcohol.
In some embodiments, the ink matrix includes, in parts by weight, 50 to 60 parts of a carboxyl group-containing photosensitive resin, 10 to 15 parts of pentaerythritol tripropionate, 5 to 10 parts of triethylene glycol diacrylate, 3 to 6 parts of benzoin diethyl ether, 3 to 6 parts of titanium dioxide, 0.6 to 0.1 part of silicon dioxide, 0.01 to 0.1 part of silicone oil, and 0.02 to 0.08 part of benzotriazole.
In a second aspect, embodiments of the present application provide a circuit board, including:
a substrate;
the solder resist ink layer is arranged on the base material, a hollowed-out part is arranged on the solder resist ink layer, and the solder resist ink layer is made of the solder resist ink with the reflection performance;
and the bonding pad component is arranged on the base material and in the hollowed-out part of the solder resist ink layer.
In a third aspect, an embodiment of the present application provides a display device, including:
a circuit board, the circuit board being as described above;
and the light emitting device is electrically connected with the bonding pad assembly of the circuit board.
The solder resist ink with the reflection performance comprises the temperature response type micro-bubble, wherein the temperature response type micro-bubble comprises the temperature response type polymer and the free radical inhibitor wrapped by the temperature response type polymer, and the temperature response type polymer can be decomposed when the external environment reaches a higher temperature (for example, the temperature is higher than or equal to 60 ℃), so that the temperature response type micro-bubble can be disintegrated under the higher temperature condition to release the free radical inhibitor in the bubble, thereby inhibiting the generation of free radicals in the solder resist ink, further inhibiting or reducing the generation of oxidation products such as a color-forming group, a color-assisting group and the like in the solder resist ink, further reducing or eliminating the yellowing phenomenon of the solder resist ink, and when the solder resist ink with the reflection performance is applied to a circuit board of a display device, the problem of reduced light reflectivity caused by the yellowing of the solder resist ink layer can be avoided, and the light emitting efficiency of the display device is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below.
Fig. 1 is a schematic structural diagram of a temperature-responsive microvesicle according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application firstly provides a solder mask ink with reflection performance, which comprises an ink matrix and temperature response type micro vesicles dispersed in the ink matrix, wherein the mass ratio of the temperature response type micro vesicles in the solder mask ink is 0.1-3 wt%. Illustratively, the mass ratio of the temperature responsive microvesicles in the solder resist ink may be 0.1wt%, 0.5wt%, 1wt%, 1.5wt%, 2wt%, 2.5wt%, 3wt%, etc.
It is understood that the mass ratio of the ink matrix in the solder resist ink is 97wt% to 99.9wt%.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a temperature-responsive microvesicle according to an embodiment of the present disclosure. The temperature-responsive microvesicles 10 include a temperature-responsive polymer 11 and a radical inhibitor 12 encapsulated by the temperature-responsive polymer 11.
Illustratively, the temperature responsive microvesicles 10 have a particle size of 80nm to 120nm, such as 80nm, 85nm, 90nm, 95nm, 100nm, 105nm, 110nm, 115nm, 120nm, etc.
Illustratively, the mass ratio of the temperature responsive polymer 11 and the radical inhibitor 12 is (50 to 100): 1, for example 50: 1. 60: 1. 70: 1. 80: 1. 90: 1. 100:1, etc.
For example, the color of the solder resist ink having the reflective property may be white, because white has a higher reflectivity, and thus, when the solder resist ink having the reflective property is applied to the circuit board 20 of the display device 100 to form the solder resist ink layer 22, the reflectivity of the circuit board 20 to the emitted light of the light emitting device 30 may be improved, thereby improving the light emitting efficiency of the display device 100.
Illustratively, the temperature responsive polymer 11 may include at least one of PNIPAm (poly (N-isopropylacrylamide)), PEOGMA-EE, and PEOGMA-MA. The PEOGMA-EE refers to polyethylene oxide grafted polymethyl methacrylate dissolved in ethylene glycol diethyl ether as a solvent, and the PEOGMA-MA refers to polyethylene oxide grafted polymethyl methacrylate dissolved in methyl methacrylate as a solvent.
Wherein the structural formula of the poly (N-isopropyl acrylamide) (PNIPAm) is
The structural formula of the polyoxyethylene grafted polymethyl methacrylate is
Illustratively, the free radical inhibitor 12 includes at least one of 2, 6-di-tert-butyl-4-methylphenol (BHT) and tetramethylpiperidine nitroxide (TEMPO).
Illustratively, the ink matrix includes, in parts by weight, 50 to 60 parts of a photosensitive resin material, 10 to 15 parts of a solvent, 5 to 10 parts of a crosslinking agent, 3 to 6 parts of a photosensitizer, 3 to 6 parts of a reflective material, 0.6 to 0.1 part of a filler, and 0.03 to 0.18 part of an auxiliary agent. When the solder resist ink layer 22 on the circuit board 20 is prepared by adding a photosensitive resin material to the ink matrix, the solder resist ink may be exposed and developed by utilizing the photosensitive performance of the photosensitive resin material, so that the solder resist ink layer 22 is patterned to form a pattern such as the hollowed-out portion 225. Further, by adding a photosensitizer to the ink matrix, the photosensitivity of the photosensitive resin material can be enhanced, facilitating patterning of the solder resist ink layer 22.
Illustratively, the ink matrix may be white in color to enhance the reflective properties of the solder mask ink.
Illustratively, the photosensitive resin material may be a carboxyl group-containing photosensitive resin. The carboxyl group-containing photosensitive resin is a material known in the art, and specific components of the carboxyl group-containing photosensitive resin are not limited in the examples herein.
Illustratively, the solvent may include pentaerythritol tripropionate.
Illustratively, the crosslinker may include at least one of triethylene glycol diacrylate, triethylene glycol dimethacrylate, and diethylene glycol diacrylate. It will be appreciated that the cross-linking agent may act to promote cross-linking curing of the photosensitive resin material so that the solder resist ink may be cured to form the solder resist ink layer 22. The crosslinking agents such as triethylene glycol diacrylate, triethylene glycol dimethacrylate and diethylene glycol diacrylate can also play a role of a cosolvent at the same time, and can play a role of promoting dissolution of the photosensitive resin material when the solder resist ink is prepared.
Illustratively, the photosensitizer may include at least one of benzoin diethyl ether, acetophenone, and 4,4' -dimethylaminobenzophenone. The photosensitizers such as benzoin diethyl ether, acetophenone and 4,4' -dimethylamino benzophenone can also act as a cosolvent to promote dissolution of the photosensitive resin material.
Illustratively, the reflective material may include titanium dioxide. It is understood that the reflective properties of the solder resist ink can be improved by adding a reflective material such as titanium dioxide to the ink matrix.
Illustratively, the filler includes at least one of a silica powder, a calcium carbonate powder, a zeolite powder, and a metal oxide powder. The silica may be prepared by a thermal decomposition method. Illustratively, the metal oxide powder may include at least one of an aluminum oxide powder, a lead oxide powder, and a beryllium oxide powder.
Illustratively, the particle size of the reflective material and the filler may each be from 10nm to 1000nm, such as 10nm, 30nm, 50nm, 80nm, 100nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1000nm, etc.
Illustratively, the adjuvant 0.03 to 0.18 parts may include an antifoaming agent 0.01 to 0.1 parts and a leveling agent 0.02 to 0.08 parts in parts by weight.
Illustratively, the defoamer may include at least one of silicone oil, polyether defoamer, and polyether modified silicone defoamer. Silicone oil is generally referred to as a linear silicone product that remains in a liquid state at room temperature.
Illustratively, the leveling agent may include at least one of benzotriazole, isophorone, and diacetone alcohol. The leveling agent such as benzotriazole, isophorone and diacetone alcohol may also function as a cosolvent, thereby promoting dissolution of the photosensitive resin material.
In some embodiments, the ink matrix may include, in parts by weight, 50 to 60 parts of a carboxyl group-containing photosensitive resin, 10 to 15 parts of pentaerythritol tripropionate, 5 to 10 parts of triethylene glycol diacrylate, 3 to 6 parts of benzoin diethyl ether, 3 to 6 parts of titanium dioxide, 0.6 to 0.1 part of silicon dioxide, 0.01 to 0.1 part of silicone oil, and 0.02 to 0.08 part of benzotriazole. The color of the ink matrix of the formula is white, and the ink matrix has good reflection performance.
The solder resist ink with reflection performance provided in this embodiment includes a temperature-responsive micro-vesicle 10, where the temperature-responsive micro-vesicle 10 includes a temperature-responsive polymer 11 and a radical inhibitor 12 wrapped by the temperature-responsive polymer 11, and since the temperature-responsive polymer 11 is decomposed when the external environment reaches a higher temperature (for example, greater than or equal to 60 ℃), the temperature-responsive micro-vesicle 10 can be decomposed under a higher temperature condition to release the radical inhibitor 12 inside the vesicle, thereby inhibiting the generation of radicals in the solder resist ink, and further inhibiting or reducing the generation of oxidation products such as a color-forming group and a color-assisting group in the solder resist ink, so as to reduce or eliminate the yellowing phenomenon of the solder resist ink, when the solder resist ink with reflection performance is applied to the circuit board 20 of the display device 100, the problem of reducing the light reflectivity due to the yellowing of the solder resist ink layer 22 can be avoided, and the light-emitting efficiency of the display device 100 is improved.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application. The embodiment also provides a circuit board 20, which comprises a base material 21, a solder resist ink layer 22 and a pad assembly 23. The solder resist ink layer 22 is disposed on the substrate 21, and the solder resist ink layer 22 is provided with a hollowed portion 225, and the material of the solder resist ink layer 22 is the solder resist ink with reflective properties in any of the above embodiments. The pad assembly 23 is disposed on the substrate 21 and disposed in the hollowed-out portion 225 of the solder resist ink layer 22.
Referring to fig. 2, the circuit board 20 may further include a first insulating layer 24, a reflective layer 26, and a second insulating layer 25 disposed between the substrate 21 and the pad assembly 23 and sequentially stacked in a direction from the substrate 21 to the pad assembly 23, wherein the reflective layer 26 is disposed corresponding to the hollowed-out portion 225 of the solder resist ink layer 22, and the reflective layer 26 may cover an area between an edge of the pad assembly 23 and an edge of the hollowed-out portion 225. It can be appreciated that by disposing the reflective layer 26 around the pad assembly 23 on the circuit board 20, the reflectivity of the circuit board 20 to the emitted light of the light emitting device 30 can be improved, thereby improving the light emitting efficiency of the display device. Illustratively, the material of the first insulating layer 24 and the material of the second insulating layer 25 may each include at least one of silicon oxide, silicon nitride, and silicon oxynitride.
Illustratively, the reflective layer 26 may include a first transparent conductive metal oxide layer, a metal layer, and a second transparent conductive metal oxide layer sequentially stacked in a direction from the substrate 21 to the pad assembly 23, wherein materials of the first transparent conductive metal oxide layer and the second transparent conductive metal oxide layer may be Indium Tin Oxide (ITO), materials of the metal layer may be silver (Ag), and the reflective performance of the reflective layer 26 may be enhanced by providing the reflective layer 26 in a structure composed of the first transparent conductive metal oxide layer, the metal layer, and the second transparent conductive metal oxide layer, such that the reflective layer 26 forms a bragg mirror.
Referring to fig. 2, the circuit board 20 may further include a conductive wire 27 disposed between the substrate 21 and the first insulating layer 24, and the conductive wire 27 is electrically connected to the pad assembly 23 and may function to input an electrical signal to the pad assembly 23. Illustratively, the material of the wire 27 may be a metal, such as copper.
Illustratively, the substrate 21 may be an insulating material, such as glass.
Illustratively, the material of the pad assembly 23 may be a metal, such as copper.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display device according to an embodiment of the disclosure. The embodiment also provides a display device 100, which includes a circuit board 20 and a light emitting device 30, wherein the circuit board 20 is the circuit board 20 in any of the embodiments, and the light emitting device 30 is electrically connected to the pad assembly 23 in the circuit board 20.
It will be appreciated that, the light emitting device 30 may be connected to the pad assembly 23 by soldering, when the light emitting device 30 and the pad assembly 23 are soldered, solder paste between the light emitting device 30 and the pad assembly 23 needs to be heated to be melted, and conventional solder mask ink is easily oxidized at high temperature to generate double bonds (-c=c-), carbonyl (-c=o), carboxyl (-COOH), hydroxyl (-OH) and other chromophores or co-chromophores, so as to cause yellowing of the solder mask ink, and the light reflectance of the solder mask ink after yellowing is reduced, so that the light emitting efficiency of the display device 100 is reduced, while the solder mask ink with reflective performance adopted in the embodiment of the present application contains temperature-responsive microbubbles 10, and the temperature-responsive microbubbles 10 include the temperature-responsive polymer 11 and the free radical inhibitor 12 wrapped by the temperature-responsive polymer 11, and the temperature-responsive microbubbles 11 decompose at higher temperature (for example, at 60 ℃ or higher temperature), so that the temperature-responsive microbubbles 10 can inhibit or eliminate the occurrence of the chromophores in the solder mask ink under the conditions of the external environment, thereby reducing the occurrence of the yellowing of the free radical inhibitor, and further reducing the occurrence of the photo-mask bubble in the solder mask ink, and further reducing the occurrence of the photo-mask bubble phenomenon.
Illustratively, the light emitting device 30 may be an LED, such as a Mini-LED.
The solder resist ink, the circuit board and the display device with the reflection performance provided by the embodiment of the application are described in detail above. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, with the description of the examples given above only to assist in understanding the present application. Meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims (7)

1. A circuit board, comprising:
a substrate;
the solder resist ink layer is arranged on the base material, and a hollowed-out part is arranged on the solder resist ink layer;
the bonding pad assembly is arranged on the base material and in the hollowed-out part of the solder resist ink layer;
the material of the solder mask ink layer is solder mask ink with reflection performance, the solder mask ink with reflection performance comprises an ink matrix and temperature response type micro vesicles dispersed in the ink matrix, the mass ratio of the temperature response type micro vesicles in the solder mask ink is 0.1-3wt%, the temperature response type micro vesicles comprise temperature response type polymers and free radical inhibitors wrapped by the temperature response type polymers, and the mass ratio of the temperature response type polymers to the free radical inhibitors is (50-100): 1, a step of;
the temperature responsive polymer comprises at least one of PNIPAm, PEOGMA-EE and PEOGLA-MA;
the free radical inhibitor comprises at least one of 2, 6-di-tert-butyl-4-methylphenol and tetramethylpiperidine nitroxide;
the ink matrix comprises, by weight, 50-60 parts of photosensitive resin material, 10-15 parts of solvent, 5-10 parts of cross-linking agent, 3-6 parts of photosensitizer, 3-6 parts of reflecting material, 0.6-0.1 part of filler and 0.03-0.18 part of auxiliary agent.
2. The circuit board of claim 1, wherein the temperature responsive microvesicles have a particle size of 80nm to 120nm.
3. The circuit board according to claim 1, wherein the photosensitive resin material is a carboxyl group-containing photosensitive resin;
the solvent comprises pentaerythritol tripropionate;
the cross-linking agent comprises at least one of triethylene glycol diacrylate, triethylene glycol dimethacrylate and diethylene glycol diacrylate.
4. The circuit board of claim 1, wherein the photosensitizer comprises at least one of benzoin diethyl ether, acetophenone, and 4,4' -dimethylaminobenzophenone;
the reflective material comprises titanium dioxide;
the filler includes at least one of silica powder, calcium carbonate powder, zeolite powder, and metal oxide powder.
5. The circuit board of claim 1, wherein the auxiliary agent 0.03-0.18 parts by weight comprises an antifoaming agent 0.01-0.1 parts by weight and a leveling agent 0.02-0.08 parts by weight, wherein the antifoaming agent comprises at least one of silicone oil, polyether antifoaming agent and polyether modified silicone antifoaming agent, and the leveling agent comprises at least one of benzotriazole, isophorone and diacetone alcohol.
6. The circuit board of claim 1, wherein the ink matrix comprises, by weight, 50-60 parts of a carboxyl group-containing photosensitive resin, 10-15 parts of pentaerythritol tripropionate, 5-10 parts of triethylene glycol diacrylate, 3-6 parts of benzoin diethyl ether, 3-6 parts of titanium dioxide, 0.6-0.1 part of silicon dioxide, 0.01-0.1 part of silicone oil and 0.02-0.08 part of benzotriazole.
7. A display device, comprising:
a circuit board, the circuit board being as claimed in claim 1;
and the light emitting device is electrically connected with the bonding pad assembly of the circuit board.
CN202210977412.5A 2022-08-15 2022-08-15 Solder resist ink with reflection performance, circuit board and display device Active CN115340784B (en)

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KR101685520B1 (en) * 2014-12-10 2016-12-12 고오 가가쿠고교 가부시키가이샤 Liquid solder resist composition and covered-printed wiring board
CN109946883B (en) * 2019-04-24 2020-10-27 深圳市华星光电技术有限公司 Polymer stabilized vertical alignment liquid crystal display panel and manufacturing method thereof
CN110850644B (en) * 2019-11-27 2020-12-08 Tcl华星光电技术有限公司 Liquid crystal display panel and method for manufacturing the same
CN112366197A (en) * 2020-11-13 2021-02-12 深圳市鼎华芯泰科技有限公司 Lead frame for chip packaging, preparation method and chip packaging structure

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