CN115339093A - 一种全自动晶圆覆膜机 - Google Patents
一种全自动晶圆覆膜机 Download PDFInfo
- Publication number
- CN115339093A CN115339093A CN202210756196.1A CN202210756196A CN115339093A CN 115339093 A CN115339093 A CN 115339093A CN 202210756196 A CN202210756196 A CN 202210756196A CN 115339093 A CN115339093 A CN 115339093A
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- China
- Prior art keywords
- film
- assembly
- roller
- angle
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010030 laminating Methods 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 104
- 238000003825 pressing Methods 0.000 claims abstract description 43
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 235000012431 wafers Nutrition 0.000 claims description 84
- 230000007246 mechanism Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 12
- 238000005485 electric heating Methods 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 4
- 239000012528 membrane Substances 0.000 abstract description 16
- 230000037303 wrinkles Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000007723 die pressing method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 241000220317 Rosa Species 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000014820 Galium aparine Nutrition 0.000 description 1
- 240000005702 Galium aparine Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210756196.1A CN115339093A (zh) | 2022-06-30 | 2022-06-30 | 一种全自动晶圆覆膜机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210756196.1A CN115339093A (zh) | 2022-06-30 | 2022-06-30 | 一种全自动晶圆覆膜机 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115339093A true CN115339093A (zh) | 2022-11-15 |
Family
ID=83948530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210756196.1A Pending CN115339093A (zh) | 2022-06-30 | 2022-06-30 | 一种全自动晶圆覆膜机 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115339093A (zh) |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102173316A (zh) * | 2010-12-21 | 2011-09-07 | 上海技美电子科技有限公司 | 贴膜方法及贴膜设备 |
CN209701039U (zh) * | 2018-12-29 | 2019-11-29 | 泰州芯格电子科技有限公司 | 一种半导体晶圆贴膜装置 |
CN209747463U (zh) * | 2019-03-18 | 2019-12-06 | 广东思沃精密机械有限公司 | 送膜装置 |
CN210025469U (zh) * | 2019-03-18 | 2020-02-07 | 广东思沃精密机械有限公司 | 切膜装置 |
CN111739821A (zh) * | 2020-06-24 | 2020-10-02 | 东莞思沃智能装备有限公司 | 晶圆贴膜机 |
CN214827810U (zh) * | 2021-02-07 | 2021-11-23 | 苏州镭明激光科技有限公司 | 一种膜切割结构及贴膜装置 |
CN115206840A (zh) * | 2022-06-30 | 2022-10-18 | 河南通用智能装备有限公司 | 一种固定角度贴膜装置及其方法 |
CN115194875A (zh) * | 2022-06-30 | 2022-10-18 | 河南通用智能装备有限公司 | 一种晶圆圆切装置 |
CN115194861A (zh) * | 2022-06-30 | 2022-10-18 | 河南通用智能装备有限公司 | 一种热切刀 |
CN115223896A (zh) * | 2022-06-30 | 2022-10-21 | 河南通用智能装备有限公司 | 一种便于调角度的热切刀 |
CN115274423A (zh) * | 2022-06-30 | 2022-11-01 | 河南通用智能装备有限公司 | 一种晶圆覆膜方法 |
CN115274517A (zh) * | 2022-06-30 | 2022-11-01 | 河南通用智能装备有限公司 | 一种晶圆转接装置 |
CN218241779U (zh) * | 2022-06-30 | 2023-01-06 | 河南通用智能装备有限公司 | 一种固定角度贴膜装置 |
CN218255505U (zh) * | 2022-06-30 | 2023-01-10 | 河南通用智能装备有限公司 | 一种晶圆圆切装置 |
CN218255522U (zh) * | 2022-06-30 | 2023-01-10 | 河南通用智能装备有限公司 | 一种调节刀角度结构 |
CN218255414U (zh) * | 2022-06-30 | 2023-01-10 | 河南通用智能装备有限公司 | 一种热切刀 |
CN218447826U (zh) * | 2022-06-30 | 2023-02-03 | 河南通用智能装备有限公司 | 一种便于调角度的热切刀 |
CN218602406U (zh) * | 2022-06-30 | 2023-03-10 | 河南通用智能装备有限公司 | 一种用于环切的晶圆载台 |
CN218631962U (zh) * | 2022-06-30 | 2023-03-14 | 河南通用智能装备有限公司 | 一种晶圆转接装置 |
CN218699308U (zh) * | 2022-06-30 | 2023-03-24 | 河南通用智能装备有限公司 | 一种保证环切的平衡的装置 |
CN218939629U (zh) * | 2022-06-30 | 2023-04-28 | 河南通用智能装备有限公司 | 一种承接晶圆装置 |
-
2022
- 2022-06-30 CN CN202210756196.1A patent/CN115339093A/zh active Pending
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102173316A (zh) * | 2010-12-21 | 2011-09-07 | 上海技美电子科技有限公司 | 贴膜方法及贴膜设备 |
CN209701039U (zh) * | 2018-12-29 | 2019-11-29 | 泰州芯格电子科技有限公司 | 一种半导体晶圆贴膜装置 |
CN209747463U (zh) * | 2019-03-18 | 2019-12-06 | 广东思沃精密机械有限公司 | 送膜装置 |
CN210025469U (zh) * | 2019-03-18 | 2020-02-07 | 广东思沃精密机械有限公司 | 切膜装置 |
CN111739821A (zh) * | 2020-06-24 | 2020-10-02 | 东莞思沃智能装备有限公司 | 晶圆贴膜机 |
CN214827810U (zh) * | 2021-02-07 | 2021-11-23 | 苏州镭明激光科技有限公司 | 一种膜切割结构及贴膜装置 |
CN115206840A (zh) * | 2022-06-30 | 2022-10-18 | 河南通用智能装备有限公司 | 一种固定角度贴膜装置及其方法 |
CN115194875A (zh) * | 2022-06-30 | 2022-10-18 | 河南通用智能装备有限公司 | 一种晶圆圆切装置 |
CN115194861A (zh) * | 2022-06-30 | 2022-10-18 | 河南通用智能装备有限公司 | 一种热切刀 |
CN115223896A (zh) * | 2022-06-30 | 2022-10-21 | 河南通用智能装备有限公司 | 一种便于调角度的热切刀 |
CN115274423A (zh) * | 2022-06-30 | 2022-11-01 | 河南通用智能装备有限公司 | 一种晶圆覆膜方法 |
CN115274517A (zh) * | 2022-06-30 | 2022-11-01 | 河南通用智能装备有限公司 | 一种晶圆转接装置 |
CN218241779U (zh) * | 2022-06-30 | 2023-01-06 | 河南通用智能装备有限公司 | 一种固定角度贴膜装置 |
CN218255505U (zh) * | 2022-06-30 | 2023-01-10 | 河南通用智能装备有限公司 | 一种晶圆圆切装置 |
CN218255522U (zh) * | 2022-06-30 | 2023-01-10 | 河南通用智能装备有限公司 | 一种调节刀角度结构 |
CN218255414U (zh) * | 2022-06-30 | 2023-01-10 | 河南通用智能装备有限公司 | 一种热切刀 |
CN218447826U (zh) * | 2022-06-30 | 2023-02-03 | 河南通用智能装备有限公司 | 一种便于调角度的热切刀 |
CN218602406U (zh) * | 2022-06-30 | 2023-03-10 | 河南通用智能装备有限公司 | 一种用于环切的晶圆载台 |
CN218631962U (zh) * | 2022-06-30 | 2023-03-14 | 河南通用智能装备有限公司 | 一种晶圆转接装置 |
CN218699308U (zh) * | 2022-06-30 | 2023-03-24 | 河南通用智能装备有限公司 | 一种保证环切的平衡的装置 |
CN218939629U (zh) * | 2022-06-30 | 2023-04-28 | 河南通用智能装备有限公司 | 一种承接晶圆装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Country or region after: China Address after: 214400, 1st to 2nd floors, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Applicant after: Jiangsu General Semiconductor Co.,Ltd. Address before: No.a130-10, 1st floor, No.2 entrepreneurship center, No.96 Ruida Road, high tech Industrial Development Zone, Zhengzhou City, Henan Province, 450001 Applicant before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |