CN115335470B - Encapsulation composition and light emitting diode - Google Patents
Encapsulation composition and light emitting diode Download PDFInfo
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- CN115335470B CN115335470B CN202180024714.4A CN202180024714A CN115335470B CN 115335470 B CN115335470 B CN 115335470B CN 202180024714 A CN202180024714 A CN 202180024714A CN 115335470 B CN115335470 B CN 115335470B
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- 239000000203 mixture Substances 0.000 title claims abstract description 119
- 238000005538 encapsulation Methods 0.000 title description 33
- 239000000178 monomer Substances 0.000 claims abstract description 178
- 150000001875 compounds Chemical class 0.000 claims abstract description 83
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 15
- 239000003999 initiator Substances 0.000 claims abstract description 13
- -1 acryl end group Chemical group 0.000 claims abstract description 11
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 19
- 229910052760 oxygen Inorganic materials 0.000 claims description 19
- 239000001301 oxygen Substances 0.000 claims description 19
- 238000004382 potting Methods 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims 1
- 239000010408 film Substances 0.000 description 39
- 238000001723 curing Methods 0.000 description 25
- 239000008393 encapsulating agent Substances 0.000 description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 239000010410 layer Substances 0.000 description 14
- 238000000016 photochemical curing Methods 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 230000005611 electricity Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 235000015655 Crocus sativus Nutrition 0.000 description 5
- 244000124209 Crocus sativus Species 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 239000004248 saffron Substances 0.000 description 5
- 235000013974 saffron Nutrition 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 125000001153 fluoro group Chemical group F* 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- PYLRGSOFJMYQNO-UHFFFAOYSA-N 14-(2-methylprop-2-enoyloxy)tetradecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCCCOC(=O)C(C)=C PYLRGSOFJMYQNO-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- VAZQKPWSBFZARZ-UHFFFAOYSA-N 2-(2-phenylphenoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1C1=CC=CC=C1 VAZQKPWSBFZARZ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- WYYQKWASBLTRIW-UHFFFAOYSA-N 2-trimethoxysilylbenzoic acid Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1C(O)=O WYYQKWASBLTRIW-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical class NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Abstract
The present disclosure is an encapsulating composition and a light emitting device having at least one surface comprising an organic cured film formed from the encapsulating composition, the encapsulating composition comprising: a first monomer group; a second monomer group; and an initiator, wherein the first monomer group includes one or more first monomer compounds, and each of the first monomer compounds has an acrylic end group and includes an ethylenically unsaturated hydrocarbon compound represented by formula 2, wherein the second monomer group includes two or more second monomer compounds, and each of the second monomer compounds has an acryl end group and includes an ethylenically unsaturated hydrocarbon compound represented by formula 3, wherein the first monomer group has a first dielectric constant of 2.90 to 4.45, and the second monomer group has a second dielectric constant of 4.46 to 8.20.
Description
Technical Field
The present disclosure relates to an encapsulation composition, and more particularly, to an encapsulation composition, an organic cured film formed from the encapsulation composition, and a stack and a light emitting device including the organic cured film.
Background
A light emitting device, particularly an Organic Light Emitting Device (OLED), is a self-light emitting device used in televisions, computers, mobile communication equipment, and the like, and is widely used in various fields due to its advantages of a wide viewing angle, excellent contrast, fast response, excellent brightness, low driving voltage, excellent response rate characteristics, and realization of various colors.
Exposure of the organic light emitting device to oxygen, moisture and ultraviolet rays disadvantageously causes degradation of physical properties and life span thereof due to degradation. Therefore, an encapsulation device capable of protecting an organic light emitting device from oxygen, moisture, and ultraviolet rays is introduced into the organic light emitting device. For example, a packaging device in which an organic layer having a property of serving as a barrier against passage of gas and moisture and an inorganic layer having excellent mechanical properties are alternately stacked is being considered. In this case, the inorganic layer may be formed using deposition, and the organic layer may be formed using inkjet printing.
Meanwhile, in recent years, thickness reduction and resolution improvement of the organic light emitting device have caused various driving failures. Wherein external static electricity interferes with the electrical signal, thereby causing a driving failure. To solve this problem, it is important to reduce the dielectric constant of the encapsulation layer.
Disclosure of Invention
Technical problem
Accordingly, embodiments of the present disclosure have been made in view of the above-mentioned problems, and it is an object of the present disclosure to provide an encapsulation composition that does not interfere with an electrical signal and can solve the problem of driving failure by determining an optimized composition to improve both curing performance and dielectric constant, even if external static electricity is introduced into a light emitting device, based on the finding that a conventional photocurable monomer cannot optimize both curing performance and dielectric constant, and a light emitting device including the encapsulation composition.
Technical proposal
In accordance with the present disclosure, the above and other objects can be accomplished by the provision of an encapsulating composition comprising: a first monomer group, a second monomer group, and an initiator, wherein the first monomer group includes one or more first monomer compounds, and each of the first monomer compounds has an acrylic end group and includes an ethylenically unsaturated hydrocarbon compound represented by the following formula 2, wherein the second monomer group includes two or more second monomer compounds, and each of the second monomer compounds has an acryl end group and includes an ethylenically unsaturated hydrocarbon compound represented by the following formula 3, wherein the first monomer group has a first dielectric constant of 2.90 to 4.45, the second monomer group has a second dielectric constant of 4.46 to 8.20,
[ 2]
C a H b O c
Wherein a is an integer of 15 to 28, b is an integer of 28 to 54, c is an integer of 1 to 4, and satisfies the relationship a/c.gtoreq.7.5,
[ 3]
C d H e O f
Wherein d is an integer of 10 to 25, e is an integer of 10 to 40, f is an integer of 1 to 9, and satisfies the relationship 2.ltoreq.d/f <7.5.
In addition, the two or more second monomer compounds may include one or more aromatic second monomer compounds and one or more aliphatic second monomer compounds.
In addition, the encapsulation composition may include 40 to 80 wt% of the first monomer group and 20 to 60 wt% of the second monomer group based on 100 wt% of the total weight of the first monomer group and the second monomer group.
In addition, the ratio ([ C ]/[ O ]) of the total number of carbon ([ C ]) atoms to the total number of oxygen ([ O ]) atoms calculated based on the amounts of carbon and oxygen in the first monomer group and the amounts of carbon and oxygen in the second monomer group may be 7.5 or more.
In addition, at least one of the one or more first monomer compounds or the two or more second monomer compounds may be a liquid.
In addition, the liquid dielectric constant of the encapsulation composition at 25 ℃ may be 4.20 or less.
In addition, the encapsulating composition, when cured, may have a solid dielectric constant of 2.70 or less.
In addition, the viscosity of the encapsulating composition may be 1cPs to 20cPs at 25 ℃.
Additionally, the encapsulating composition may be solvent-free.
According to another aspect of the present disclosure, there is provided a light emitting device having at least one surface including an organic cured film formed from the encapsulation composition.
Advantageous effects
The encapsulation composition according to the embodiments of the present disclosure can exhibit a low dielectric constant, so that the problem of external electrostatic interference electrical signals introduced into a substrate and causing driving failure can be solved when a dielectric film having high resolution is obtained.
In addition, the encapsulation composition according to embodiments of the present disclosure may exhibit a low dielectric constant, thereby preventing capacitive interference.
In addition, the encapsulation composition according to embodiments of the present disclosure has a low dielectric constant, but ensures curing properties generally known as properties incompatible with dielectric constants, provides improved storage stability and jet spreadability, is useful in inkjet processes, and improves lifetime and reliability stability associated with physical properties of light emitting devices.
Further, the encapsulating composition according to the embodiment of the present disclosure has an effect of acting as an encapsulant without additionally forming an encapsulating film.
Detailed Description
Before the following detailed description of the present disclosure, it is to be understood that the terminology used herein is provided for the purpose of describing particular embodiments only, and is not limited only to the appended claims. Unless otherwise mentioned, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art.
In addition, the terms or words used in the present specification and the following claims are intended to have meanings and concepts consistent with the technical ideas of the present disclosure as described in the present specification based on the principle that an inventor can properly define terms in order to best describe the invention, and are not limited to only conventional or dictionary meanings.
In one embodiment of the present disclosure, the present disclosure relates to an encapsulation composition capable of printing and photo-curing on a substrate. Specifically, the encapsulating composition is an organic composition capable of forming an organic layer of an encapsulant.
As used herein, the term "printing" may refer to any of a variety of coating types, including inkjet.
An encapsulant including a cured product formed from the organic composition may be disposed on the organic light emitting device to reduce or prevent damage of an organic layer of the organic light emitting device from physical impact or foreign substances such as oxygen or moisture.
In addition, the composition for an organic cured film of an encapsulant according to the present disclosure is configured to perform a function of protecting a light emitting device, which is an inherent function of the encapsulant, and effectively prevents introduction of static electricity that interferes with an electrical signal.
In the present disclosure, the encapsulating composition may be a solvent-free photocurable composition. That is, the composition for forming an organic cured film for an encapsulant described later may be a solvent-free composition containing a photocurable component.
As used herein, the term "solvent-free composition" refers to a composition that does not contain a solvent, e.g., an organic solvent or an aqueous solvent.
As used herein, the term "photocurable composition" refers to a composition that can be cured by free radical polymerization with light irradiation. The photo-curing may be performed, for example, with electromagnetic waves such as microwaves, infrared rays, ultraviolet rays and gamma rays; or particle beams such as electron rays including alpha particle rays, proton beams, and neutron beam irradiation.
Specific photo-curing conditions are not particularly limited. However, for example, when the photo-curing is performed using ultraviolet rays, the wavelength thereof may be in the range of 290nm to 400nm, which is a near ultraviolet region, and the light intensity of the total period of time irradiated with ultraviolet rays may be 400mW/cm 2 Below, or at 100mW/cm 2 To 400mW/cm 2 And the light quantity can be within the range of 300mJ/cm 2 To 2,500mJ/cm 2 Or 500mJ/cm 2 To 1,500mJ/cm 2 Within a range of (2).
The solvent-free composition omits a solvent drying process as compared to the solvent-based composition, thereby improving process efficiency and overcoming disadvantages such as bubble generation due to a solvent and deterioration of functions of an encapsulant.
In addition, the solvent-free composition can reduce the content of moisture in the encapsulation composition, thereby having an advantage of being suitable for an organic light emitting device susceptible to moisture.
In addition, the composition may be a composition applied to a substrate by inkjet printing. In general, since inkjet printing uses a plurality of heads including a plurality of nozzles connected to each other, mass production and the like are facilitated. The composition is configured to meet the following viscosity and surface energy (tension) requirements in order to be suitable for inkjet printing.
In order to photo-cure the composition, the composition may comprise a compound having photo-curable functional groups. In particular, the composition may be provided as a composition that imparts a reduced dielectric constant by combining the first monomer set with the second monomer set.
The term "dielectric constant" as used herein refers to the liquid dielectric constant unless otherwise indicated. Specific measurement methods are disclosed in experimental examples described later.
In order to lower the dielectric constant, a weak polar monomer should be used. Although it is weak in polarity, monomers with low dielectric constants typically have only one functional group that generates free radicals during photocuring. Thus, the dielectric constant and the curing property are mutually incompatible with each other; for example, a cured film is not formed even after photo-curing.
Monomers capable of compensating for insufficient curing properties, for example, monomers having a high dielectric constant but having sufficient functional groups to generate radicals during photocuring and capable of forming a desired cured film during photocuring are used in combination to provide an encapsulating composition that exhibits storage stability and sufficient spray spreadability while a dielectric constant significantly reduced by more than 10% as compared with the prior art.
In order to digitize the decrease in dielectric constant, the dielectric constant measured in the encapsulation composition containing the mixture of the first monomer group and the second monomer group is defined as "C", the dielectric constant measured in the encapsulation composition containing only 1, 14-tetradecanediol dimethacrylate (1, 14-tetradecane dimethacrylate) as a conventional industrially known encapsulation ingredient, that is, 4.56, is defined as "D", as a reference value, and the correlation of C and D calculated according to the following formula is 10 or more, 12 to 20, 20 to 30 or 12 to 18. Preferably, the above-defined ranges can overcome the incompatibility between the curing properties and the dielectric constant, and at the same time provide significantly improved curing properties and significantly reduced dielectric constants. In this case, a value of 10 or more calculated using formula 1 means that the dielectric constant is increased by 10% or more as compared with the above-described reference value (D, 4.56), and also curing performance is ensured.
[ 1]
(D-C)/D×100
For example, an encapsulating composition according to one embodiment of the present disclosure comprises: a first monomer group having a first dielectric constant; a second monomer group having a second dielectric constant; and an initiator.
The first monomer group includes one or more first monomer compounds and the second monomer group includes two or more second monomer compounds.
The first monomer compound and the second monomer compound may each independently have a (meth) acrylate group or a vinyl group as a photocurable functional group. The monomer having a (meth) acrylate group is, for example, a monofunctional (meth) acrylate of a monohydric alcohol or a polyhydric alcohol, or a polyfunctional (meth) acrylate of a monohydric alcohol or a polyhydric alcohol. Further, the monomer having a vinyl group is, for example, an aromatic compound containing a vinyl group such as styrene or vinyl toluene. For example, the composition may include two or more of the compounds listed above.
Specifically, for example, the first monomer compound may be a monofunctional polymerizable monomer, a polyfunctional polymerizable monomer, or an oligomer thereof.
In addition, the first monomer compound may be a monofunctional polymerizable monomer having a condensed ring hydrocarbon group or a polycyclic hydrocarbon group.
The type of the first monomer compound is not particularly limited as long as the first monomer compound includes an ethylenically unsaturated hydrocarbon compound having the general formula represented by the following formula 2:
[ 2]
C a H b O c
In formula 2, a is an integer of 15 to 28.
In addition, preferably, a is an integer of 16 to 28.
In formula 2, b may be an integer of 28 to 54.
In addition, b is preferably an integer of 30 to 54.
In formula 2, c may be an integer of 1 to 4.
In addition, c is preferably an integer of 2 to 4.
In this case, the relation a/c.gtoreq.7.5 can be satisfied.
In addition, the relation 7.5.ltoreq.a/c.ltoreq.14 is preferably satisfied.
Specifically, the first monomer compound is, for example, 2-decyl-1-tetradecyl (meth) acrylate, stearyl (meth) acrylate, 2-octyl-dodecyl (meth) acrylate, 2-hexyl-decyl (meth) acrylate, iso-stearyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, or the like.
In addition, the first monomer compound may have any one of structures represented by the following formulas 1 to 1,1 to 2, 1 to 3, 1 to 4, and 1 to 5.
[ 1-1]
[ 1-2]
[ 1-3]
[ 1-4]
[ 1-5]
In the formula 1-1, n is preferably 5 or more, in the formula 1-2, n is preferably 5 or more, in the formula 1-3, n is preferably 5 or more, in the formula 1-4, n is preferably 5 or more, and in the formula 1-5, n is preferably 5 or more.
Specifically, for example, the first monomer compound may have any one of structures represented by the following formulas 2-1 to 2-8.
[ 2-1]
[ 2-2]
[ 2-3]
[ 2-4]
[ 2-5]
[ 2-6]
[ 2-7]
[ 2-8]
According to one embodiment of the present disclosure, the first monomer group may include two or more first monomer compounds.
According to one embodiment of the present disclosure, the content of the first monomer group is in the range of 40 to 80 wt%, 50 to 70 wt%, or 55 to 70 wt%, relative to 100 wt% of the total weight of the first monomer group and the second monomer group. When 40 to 80 wt% of the first monomer group is present based on 100 wt% of the encapsulation composition, driving defects are not generated even if external static electricity is introduced into the light emitting device to which the thin film and the high resolution are imparted.
According to one embodiment of the present disclosure, the first monomer group includes one or more first monomer compounds, and the dielectric constant (first dielectric constant) of the first monomer group is 2.90 to 4.45, preferably 3.00 to 3.75. Preferably, the first dielectric constant is 2.90 to 4.45, because the first monomer group imparts spray spreadability and solid light transmittance, while the dielectric constant measured in the composition can be reduced by more than 10% as compared with the prior art, and the problem of incompatibility between curing property and dielectric constant can be solved.
More specifically, the first dielectric constant is the dielectric constant of a first monomer group including one or more first monomer compounds, and is the dielectric constant of a mixture of one or more first monomer compounds.
The second monomer compound may include at least one ethylenically unsaturated hydrocarbon compound having the general formula represented by the following formula 3, and the specific type of compound is not particularly limited.
[ 3]
C d H e O f
In formula 3, d is an integer of 10 to 25.
In addition, d is preferably an integer of 10 to 22.
In formula 3, e may be an integer of 10 to 40.
In addition, e is preferably an integer of 10 to 38.
In formula 3, f may be an integer of 1 to 9.
In addition, f is preferably an integer of 2 to 4.
In this case, the relation 2.ltoreq.d/f <7.5 may be satisfied.
In addition, the relation 5.ltoreq.d/f.ltoreq.6 is preferably satisfied.
As a specific example, the second monomer compound may be a monofunctional polymerizable monomer, a polyfunctional polymerizable monomer, or an oligomer thereof. Preferably, the second monomer compound may be a multifunctional polymerizable monomer having two or more functional groups. More preferably, the second monomer compound may be a multifunctional polymerizable monomer having three functional groups, and each functional group may be any one of acrylate and methacrylate.
In addition, the second monomer compound may be a monofunctional polymerizable monomer having a condensed ring hydrocarbon group or a polycyclic hydrocarbon group.
In addition, the second monomer compound may be an aliphatic polymerizable monomer or an aromatic polymerizable monomer.
In addition, the second monomer compound may have any one of structures represented by the following formulas 3 and 4.
[ 3]
[ 4]
In formula 3, n is preferably 12 or more.
As a specific example, the structure represented by formula 3 may be any one of the structures represented by the following formulas 3-1 and 3-2.
[ 3-1]
[ 3-2]
The structure represented by formula 3 is an aliphatic polymerizable monomer structure, referred to herein as an "aliphatic second monomer compound". The structure represented by formula 4 is an aromatic polymerizable monomer structure, referred to herein as an "aromatic second monomer compound".
According to one embodiment of the present disclosure, the second monomer group includes two or more second monomer compounds, and the two or more second monomer compounds include one or more aromatic second monomer compounds and one or more aliphatic second compounds.
The aliphatic second monomer compound is a multifunctional monomer having two or more photocurable functional groups. When a cured film is formed by photo-curing using a radical reaction, a phenomenon occurs in which a polymerization rate decreases as radicals generated on the surface layer of the encapsulation composition decrease due to the influence of oxygen in the air. Further, as the thickness of the cured film decreases, the ratio of the surface of the film to the inside thereof increases, and thus, the problem of the decrease in polymerization rate caused by this phenomenon becomes more serious.
In view of this, when a polyfunctional monomer is used instead of a monofunctional monomer, a higher curing rate can be ensured, and the curing time can be shortened. Therefore, the polyfunctional monomer may be advantageous in ensuring physical properties required for an organic cured film for an encapsulant.
For reference, a multifunctional monomer having three functional groups has advantages of increasing the curing density and improving the modulus of the cured film.
The aromatic second monomer compound has the effect of increasing the film strength and thereby decreasing the etching rate of the plasma. When the encapsulation composition is used to form an organic light emitting device, a plasma treatment is performed to deposit an inorganic layer. In this case, a device having excellent reliability can be realized by reducing the etching rate.
The second monomer group may be present in an amount ranging from 20 to 60 wt%, from 30 to 50 wt%, from 20 to 40 wt%, or from 30 to 45 wt%, based on 100 wt% of the total weight of the first and second monomer groups. When 20 to 60 wt% of the second monomer group is present with respect to 100 wt% of the encapsulation composition, a driving failure does not occur even if external static electricity is introduced into a light emitting device having a thin film and high resolution, and a viscosity range suitable for use as the encapsulation composition, i.e., a range of 15 to 20cPs may be satisfied.
When the two or more second monomer compounds include one or more aromatic second monomer compounds and one or more aliphatic second monomer compounds, the content of the one or more aromatic second monomer compounds may be 1 to 20% by weight based on 100% by weight of the total weight of the first and second monomer groups, and the content of the aliphatic second monomer compounds may be 19 to 59% by weight based on 100% by weight of the total weight of the first and second monomer groups.
Specifically, the second monomer compound may be, for example, pentaerythritol di (meth) acrylate, dipentaerythritol di (meth) acrylate, 1, 12-dodecanediol dimethacrylate, 1, 14-tetradecanediol dimethacrylate, trimethylolpropane trimethacrylate, o-phenylphenoxyethyl acrylate, or the like.
Meanwhile, according to an embodiment of the present disclosure, the second monomer group includes two or more second monomer compounds, and the dielectric constant (second dielectric constant) of the second monomer group is 4.46 to 8.20, preferably 4.46 to 5.35. Since the problem of compatibility between curability and dielectric constant can be solved, the dielectric constant can be reduced by 10% or more as compared with the prior art, and jet spreadability, solid phase light transmittance, and the like can be imparted, the second dielectric constant is preferably 4.46 to 8.20.
More specifically, the second dielectric constant is the dielectric constant of a second monomer group including two or more second monomer compounds, and is the dielectric constant of a mixture of two or more second monomer compounds.
According to one embodiment of the present disclosure, the one or more first monomer compounds or at least one of the two or more second monomer compounds may be in a liquid phase.
In one embodiment of the present disclosure, the ratio ([ C ]/[ O ]) of the total number of carbon ([ C ]) atoms to the total number of oxygen ([ O ]) atoms calculated based on the amounts of carbon and oxygen in the first monomer group and the amounts of carbon and oxygen in the second monomer group may be 7.5 or more. Preferably, [ C ]/[ O ] may be 8 or more. [C] Is the number of carbon atoms and [ O ] is the number of oxygen atoms. [C] The upper limit of the value of/(O) may be 12.0 or less, preferably 11.5 or less, but is not limited thereto. When the ratio ([ C ]/[ O ]) of the total number of carbon atoms ([ C ]) to the total number of oxygen atoms ([ O ]) is less than 7.5, the decrease in dielectric constant is small compared to the conventional encapsulant, causing the driving failure of the light emitting device.
For example, in the case where the first monomer compound is a monomer having C 27 H 52 O 2 An ethylenically unsaturated hydrocarbon compound of the structure and the second monomer compound comprises a compound having C 22 H 38 O 4 Ethylenically unsaturated hydrocarbon compound having structure and C 17 H 16 O 3 In the case of both of the ethylenically unsaturated hydrocarbon compounds of the structure, whenA monomer compound present in an amount of 67% having C 22 H 38 O 4 The second monomer compound of the structure is present in an amount of 30% and has C 17 H 16 O 3 When the second monomer compound of the structure is present in an amount of 3%, the ratio (C/O) of the total number of carbon atoms to the total number of oxygen atoms is 10.9, which satisfies the above range of 7.5 or more.
The initiator may absorb light energy from the outside and provide free radicals for photocuring of the first and second monomer sets to the acrylic end groups of the respective monomers.
The initiator may be, for example, a substance comprising a main chain containing a heteroatom and providing an a-valent radical and at least one aryl end group linked to the main chain by a carbonyl linker in the molecule. In this case, a may be an integer of 3 or more.
As a specific example, the initiator may have a main chain structure represented by any one of the following formulas 5-1 and 5-2.
[ 5-1]
[ 5-2]
For example, the aryl end group linked to the main chain through the carbonyl linker may have a structure represented by the following formula 6.
[ 6]
In addition, the initiator may use a substance having an absorption wavelength of 500nm or less, specifically, in the range of 380nm to 410nm to improve the photo-curing effect.
Specific examples of the initiator include: hydroxy ketones, such as 1-hydroxycyclohexyl phenyl ketone (Irgacure 184); aminoketones, such as 2-benzyl-2- (dimethylamino) -1- [4- (4-morpholino) phenyl ] -1-butanone (Irgacure 369) and α -aminoacetophenone (Irgacure 907); benzyl dimethyl ketal such as benzyl dimethyl ketal (Irgacure-651); bisacylphosphines, such as phenyl bis (2, 4, 6) -trimethylbenzoyl phosphine oxide (Irgacure 819); and monoacylphosphines such as 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide (TPO).
In addition, the encapsulation composition may include one or more additives selected from the group consisting of heat stabilizers, ultraviolet stabilizers, and antioxidants, and the additives may be selected from various other types of additives.
In addition, the initiator may be present in an amount of 5 parts by weight or less, 1 to 5 parts by weight, or 3 to 5 parts by weight, based on 100 parts by weight of the total weight of the monomers constituting the encapsulating composition. When light energy is incident on the first monomer compound of the first monomer group and the second monomer compound of the second monomer group constituting the encapsulating composition, the content of the initiator is within the above-defined range, and the free radicals suitable for forming the coating film are preferably supplied to the acrylic end groups of each of the first monomer compound of the first monomer group and the second monomer compound of the second monomer group.
In this case, the light energy may, for example, be composed of a light having a power of 400mW/cm 2 Hereinafter, more specifically, 100 to 400mW/cm 2 Or 200 to 400mW/cm 2 But is not limited thereto.
According to one embodiment, the encapsulating composition may further comprise additives such as a surfactant, an adhesion aid for improving adhesion to a substrate, a stabilizer, an adhesion promoter, a curing promoter, a thermal polymerization inhibitor, a dispersant, a plasticizer, a filler, an antifoaming agent, and the like, within a range that does not adversely affect the encapsulating composition.
Such additives may be used in amounts of 0.001 wt% to 10 wt% based on the total weight of the encapsulating composition. In this case, when the content of the additive does not fall within the above range, the permeability, heat resistance, adhesion to an inorganic barrier layer, ejection stability, and the like of the cured film may be poor.
In this case, the surfactant can improve applicability, defoaming property, leveling property, and the like, examples of which include: fluorine-based surfactants such as BM-1000, BM-1100, megapack F142D, megapack F172, megapack F173, megapack F183, fluoro FC-135, fluoro FC-170C, fluoro FC-430, fluoro FC-431, saffron S-112, saffron S-113, saffron S-131, saffron S-141, saffron S-145, SH-28PA, SH-190, SH-193, SZ-6032, and SF-8428.
In addition, the adhesion promoter is, for example, a silane coupling agent having a reactive substituent such as a carboxyl group, a methacryloyl group, an isocyanate group, or an epoxy group. Specific examples thereof include trimethoxysilylbenzoic acid, γ -methacryloxypropyl trimethoxysilane, vinyltriacetoxy silane, vinyltrimethoxysilane, γ -glycidoxypropyl trimethoxysilane, β - (3, 4-epoxycyclohexyl) ethyl trimethoxysilane, and the like.
According to one embodiment, the composition may not comprise units derived from a siloxane. When the composition contains units derived from siloxane, siloxane-based outgassing may occur at high temperature, causing damage to the light emitting device.
The composition may have a moisture content of 20ppm or less prior to curing. Conventional light emitting devices are susceptible to moisture. Therefore, the moisture content before curing can be adjusted to 20ppm or less by the moisture removal process as needed.
Regarding the inkjet process, preferably, the composition has a viscosity suitable for the inkjet process, for example, a viscosity of 20cPs or less, 1 to 20cPs, or 15 to 20cPs measured at 25 ℃ using a brookfield viscometer in view of improvement of both printing performance and curing performance. For reference, when the viscosity is too high, it is difficult to jet the composition from the inkjet nozzle, and when the viscosity is too low, it is difficult to form a coating film having an appropriate thickness due to an increase in fluidity.
According to one embodiment, the composition may have a surface energy (tension) in the range of 20 to 45mN/m to facilitate ejection from an inkjet head. The above range is suitable for smoothly ejecting ink from an ink jet device. For reference, when the surface energy of the ink is large, ink droplets may fly, and when the surface energy is low, spreadability or dispersibility of the solution may increase when colliding with the substrate. The measurement of the surface energy (tension) can be performed at 25 ℃ using any of various known methods, for example, a loop method.
The liquid dielectric constant of the encapsulation composition according to an exemplary embodiment may be 4.20 or less measured at 25 ℃. Within the above range, even if external static electricity is introduced into the coating film, the encapsulating composition having a liquid dielectric constant of 4.20 or less can prevent driving failure in the light emitting device, and can effectively protect the coating film from oxygen, moisture and ultraviolet rays without an additional encapsulant.
Conventional mass-produced compositions have a liquid dielectric constant in the range of about 4.50 or more and 6.20 or less, and therefore have disadvantages such as parasitic capacitance generated between electrodes or insufficient prevention of capacitive interference. However, the encapsulation composition having the above-described configuration may have a dielectric constant of 4.20 or less, 2.90 to 4.45, or 3.00 to 3.75. Since the decrease in the dielectric constant is advantageous in preventing capacitive interference, the lower limit of the dielectric constant is not particularly limited.
Preferably, the encapsulating composition according to one embodiment is in N 2 The curing property measured at a wavelength of 395nm at 1,000mJ under an atmosphere is 95% or more because a coating film improving physical properties of a light emitting device can be efficiently produced.
Preferably, the encapsulation composition provided according to one aspect of the present disclosure has an optical property (light transmittance) of 95% or more measured using a UV-Vis spectrometer, because light emission characteristics as well as physical properties of the light emitting device can be improved.
According to one embodiment, there is provided a process for photopolymerizing a compound containing ethylenically unsaturated double bonds, comprising using a light having an intensity of 400mW/cm 2 The following laser or plasma is irradiated onto the encapsulating composition, wherein the surface hardness is increased due to the effect of radicals generated by the irradiation of light.
The measured solid dielectric constant of an organic cured film obtained by curing the encapsulating composition according to one embodiment may be 2.70 or less. Application of the encapsulating composition having a dielectric constant of 2.70 or less as measured as a solid at the time of curing to an organic light emitting device is suitable for protecting a coating film from external static electricity, thereby preventing driving failure of the light emitting device.
According to another embodiment, there is provided an organic cured film comprising the cured product of the composition.
In one embodiment, the thickness of the organic cured film for the encapsulant may be 0.5 μm to 100 μm, 1 μm to 90 μm, or 5 μm to 70 μm.
In one embodiment, the organic cured film for the encapsulant may have a light transmittance measured at a wavelength of 400nm of 97.0% or more. The organic cured film for the encapsulant is disposed close to the organic light emitting device in the display apparatus, and when the light transmittance is satisfied, it is possible to provide a clear visibility to a user.
According to another embodiment of the present disclosure, an encapsulant is provided. Specifically, the encapsulant may include an organic cured film for the encapsulant and an inorganic layer containing a metal.
The inorganic layer may contain a metal component. The inorganic layer may also be a metal film.
In one embodiment, the inorganic layer may include at least one oxide or nitride selected from Al, zr, ti, hf, ta, in, sn, zn, ce and Si. The inorganic layer may be formed by vapor deposition. In this case, there is no particular limitation on the specific deposition process. For example, when the inorganic layer contains Si component, the inorganic layer may have a SiNx film and/or a SiOx film.
According to another embodiment of the present disclosure, there is provided a light emitting device, wherein at least one surface of the organic cured film is formed of the encapsulation composition.
The configuration of the light emitting device is not particularly limited and may be any configuration known to those of ordinary skill in the art.
The cured film, for example, for use as a printing ink; printing plate; an encapsulant; photoresists for use in electronic devices; electroplating a resist; etching the resist; liquid and dry films; a solder resist; resists for manufacturing color filters for various display applications; resists for use in manufacturing structures in the manufacture of plasma display panels, electroluminescent displays and LCDs; a composition for manufacturing spacers of LCD; compositions for Holographic Data Storage (HDS); and in applications of compositions for encapsulating electrical and electronic components, in applications for manufacturing magnetic recording materials, micromechanical components, waveguides, optical switches, electroplating masks, etching masks, color correction systems, glass fiber cable coatings and screen printing templates, in applications for manufacturing three-dimensional objects by stereolithography, in applications as image recording materials, in applications as holographic recording, microelectronic circuits and decolorizing materials for image recording materials, in applications as image recording materials using microcapsules, in applications as photoresist materials for ultraviolet and visible laser-induced imaging systems, and in applications as photoresist materials for forming dielectric layers in sequentially built layers.
The transmittance of the cured film was measured using a UV-Vis spectrometer according to ASTM D1003, and found to be 95% or more, which significantly improved the surface hardness compared to the prior art.
According to one embodiment, an electronic device is provided wherein the cured film is formed from an encapsulating film material or an overcoat material.
Non-limiting examples of substrates for curing films include: a substrate for electronic components, a substrate on which a predetermined wiring pattern is formed, and the like. Examples of the substrate include: glass or plastic substrates coated or uncoated with silicon, silicon nitride, silicon oxide, titanium, tantalum, palladium, titanium tungsten, copper, chromium, aluminum, alNd, ITO, IGZO, and the like.
Hereinafter, the present disclosure will be described in more detail with reference to examples. These examples are provided only for a better understanding of the present disclosure and should not be construed as limiting the scope of the present disclosure.
Implementation of the embodimentsExample(s)
< examples and comparative examples >
The compositions of examples and comparative examples were prepared using the photocurable monomers shown in table 1 while varying the contents thereof as shown in table 2 below. 3 to 4 parts by weight of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide as an initiator are mixed with a total of 100 parts by weight of the first monomer group and the second monomer group.
Irradiating short wavelength ultraviolet light (UV LED light source, light intensity of the whole irradiation time: 400 mW/cm) at room temperature 2 Light amount: 1,000mJ/cm 2 ) So that the composition was cured to a thickness of 8 μm.
Tables 1 to 3 below show physical properties measured on the raw material, the encapsulating composition or the cured product using the following evaluation items.
Evaluation item
* Calculation of liquid dielectric constant and 1
Liquid dielectric constant: the dielectric constant was measured at 10kHz using a dielectric constant meter (model 871) at room temperature and is represented as value "C" in tables 1 and 3 below.
Of the C values, the liquid dielectric constant measured using 100% of the monomer B1 was used as the D value in the following formula 1, and the calculation results (unit%) are listed in the following table 3.
[ 1]
(D-C)/D×100
* Solid dielectric constant: the dielectric constant was measured at 100kHz using a precision impedance analyzer.
Solid dielectric constant samples were prepared as follows: the composition was spin-coated on Cr glass (Cr thickness is) Curing (thickness of 8.0 μm, exposure of 1,000 mJ/cm) 2 ) And depositing Al (Al thickness isAl size 3.0 x 3.0mm 2 )。
* Solid light transmittance of organic composition after curing: light transmittance was measured at 400nm using a UV-Vis spectrometer according to ASTM D1003.
* Viscosity of organic composition(cPs, at 25 ℃): measured using a Brookfield/DV-II+Pro viscometer.
* Storage stability of organic compositions: the viscosity change was measured when the potting composition was stored at 50 ℃ for 7 days, and the storage stability was considered excellent when the viscosity change over 7 days was within 3%.
* Spray spreadability of organic compositions: spreadability was evaluated based on the change in droplet size from the initial droplet size after 5 minutes of curing when the potting composition was ejected at a head temperature of 35 ℃ and a volume of 13 picoliters. For reference, the coating surface is well formed when the spreadability is about 110% to about 130%. When spreadability is low, the droplet does not spread and a surface cannot be properly formed. When the spreadability is too high, the encapsulating composition flows down before ultraviolet curing, which disadvantageously makes it impossible to form a normal surface.
TABLE 1
* The [ C ]/[ O ] ratio in Table 1 represents the ratio of carbon to oxygen in the monomer.
TABLE 2
* [ C ] in Table 2]/[O]The ratio is the ratio of the total number of carbon atoms to the total number of oxygen atoms in the composition calculated from the amounts of carbon and oxygen in the monomers of the first monomer group and the amounts of carbon and oxygen in the monomers of the second monomer group, corresponding to formula C a H b O c In a/c.
TABLE 3
As can be seen from the results in table 3, the dielectric constants of the encapsulation compositions according to examples 1 to 9, which were properly mixed in view of compatibility between curing property and dielectric constants, were lower than those of the encapsulation compositions according to comparative examples 1 to 12, which were not mixed or properly mixed. Specifically, examples 1 to 9 exhibited dielectric constants in the range of 3.39 to 4.03, and comparative examples 1 to 12 exhibited dielectric constants in the range of 4.22 to 5.71.
In addition, as can be seen from the calculated value of formula 1 in which the degree of dielectric constant reduction was quantified, it was found that the encapsulation compositions according to examples 1 to 9, which were properly mixed in consideration of compatibility between curability and dielectric constant, increased the degree of dielectric constant reduction to 12% or more, up to 26% as compared with the reference value (D, 4.56).
On the other hand, it can be seen that the potting compositions according to comparative examples 1 to 3 and comparative examples 4 to 12, which were not mixed to solve the compatibility problem, exhibited a dielectric constant decrease of only 7% or less, and thus, the desired low dielectric properties were not sufficiently achieved.
In particular, the calculated values of formula 1 of table 3 above relate to the C/O ratio of table 2. This is based on the following observations: in the encapsulating compositions according to examples 1 to 9, wherein the C/O ratio is in the range of 7.9 or more and 12.3 or less, the calculated value of formula 1 is 12% or more and at most 26%, and in the encapsulating compositions according to comparative examples 1 to 12, wherein the C/O ratio is in the relatively low range of 4.1 to 6.8, the calculated value of formula 1 is only 7% or less.
In summary, these results show that only embodiments in which photocurable monomers having different dielectric constants are used in combination and the C/O ratio calculated from these monomers satisfies a specific value provide significantly improved dielectric constants, protect coating films from external static electricity, and are suitable for preventing driving failure of light emitting devices, and improve solid light transmittance, inkjet spreadability, and storage stability.
The features, structures, effects, and the like illustrated in the respective embodiments described above may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Accordingly, matters related to these combinations and modifications are to be understood as falling within the scope of the present disclosure.
Claims (9)
1. An encapsulating composition comprising:
a first monomer group;
a second monomer group; and
an initiator is used to prepare the mixture of the polymer and the initiator,
wherein the first monomer group includes one or more first monomer compounds, and each of the first monomer compounds has an acrylic end group and includes an ethylenically unsaturated hydrocarbon compound represented by the following formula 2,
wherein the second monomer group includes two or more second monomer compounds, and each of the second monomer compounds has an acryl end group and includes an ethylenically unsaturated hydrocarbon compound represented by the following formula 3,
wherein a ratio ([ C ]/[ O ]) of a total number of carbon ([ C ]) atoms to a total number of oxygen ([ O ]) atoms ([ C ]/[ O ]) is 7.5 or more, calculated based on the amounts of carbon and oxygen in the first monomer group and the amounts of carbon and oxygen in the second monomer group,
[C] /(O) = (carbon number of first monomer compound/oxygen number of first monomer compound) × (weight percent of first monomer compound) + (carbon number of second monomer compound/oxygen number of second monomer compound) × (weight percent of second monomer compound),
wherein the first monomer group has a first dielectric constant of 2.90 to 4.45, the second monomer group has a second dielectric constant of 4.46 to 8.20,
[ 2]
C a H b O c
Wherein a is an integer of 15 to 28, b is an integer of 28 to 54, c is an integer of 1 to 4, and satisfies the relationship a/c.gtoreq.7.5,
[ 3]
C d H e O f
Wherein d is an integer of 10 to 25, e is an integer of 10 to 40, f is an integer of 1 to 9, and satisfies the relationship 2.ltoreq.d/f <7.5.
2. The potting composition of claim 1, wherein the two or more second monomer compounds comprise one or more aromatic second monomer compounds and one or more aliphatic second monomer compounds.
3. The potting composition of claim 1, wherein the potting composition comprises 40 to 80 wt% of the first monomer set and 20 to 60 wt% of the second monomer set, based on 100 wt% of the total weight of the first monomer set and the second monomer set.
4. The potting composition of claim 1, wherein at least one of the one or more first monomer compounds or the two or more second monomer compounds is a liquid.
5. The potting composition of claim 1, wherein the potting composition has a liquid dielectric constant of 4.20 or less at 25 ℃.
6. The potting composition of claim 1, wherein the solid dielectric constant of the potting composition when cured is 2.70 or less.
7. The potting composition of claim 1, wherein the potting composition has a viscosity of 1cPs to 20cPs at 25 ℃.
8. The potting composition of claim 1, wherein the potting composition is solvent-free.
9. A light emitting device having at least one surface comprising an organic cured film formed from the encapsulating composition of claim 1.
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| CN109952663A (en) * | 2016-11-11 | 2019-06-28 | 三星Sdi株式会社 | Organic illuminating element composition for sealing and the organic illuminating element display device as manufactured by the composition |
| KR20190138220A (en) * | 2018-06-04 | 2019-12-12 | 삼성에스디아이 주식회사 | Composition for preventing bleeding of composition for encapsulating organic light emitting diode device and organic light emitting diode display comprising barrier prepared using the same |
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| KR101943688B1 (en) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | Organic light emmiting diode display apparatus |
| KR101826020B1 (en) | 2016-11-15 | 2018-02-06 | (주)휴넷플러스 | Non solvent type photocurable inkjet composition and transparent film |
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| CN109952663A (en) * | 2016-11-11 | 2019-06-28 | 三星Sdi株式会社 | Organic illuminating element composition for sealing and the organic illuminating element display device as manufactured by the composition |
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| KR20190138220A (en) * | 2018-06-04 | 2019-12-12 | 삼성에스디아이 주식회사 | Composition for preventing bleeding of composition for encapsulating organic light emitting diode device and organic light emitting diode display comprising barrier prepared using the same |
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