KR101613787B1 - Thermosetting Resin Composition and Method for Preparing the Same - Google Patents
Thermosetting Resin Composition and Method for Preparing the Same Download PDFInfo
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Abstract
TECHNICAL FIELD The present invention relates to a thermosetting resin composition and a method for producing the same.
Description
This application claims the benefit of the filing date of Korean Patent Application No. 10-2013-0069802 filed with the Korean Intellectual Property Office on June 18, 2013, the entire contents of which are incorporated herein by reference.
TECHNICAL FIELD The present invention relates to a thermosetting resin composition and a method for producing the same.
The trend of display technology in recent years is to utilize a touch panel which makes all the functions on the screen. During touch panel manufacturing, all leads and circuits are fabricated on glass. After all the conductors and circuits have been fabricated, it is necessary to insulate between the conductors or to protect the already deposited circuits. In order to protect them in various environments, they are coated with an organic film. The permeability of the organic film may affect the performance after completion of the touch panel.
The present specification intends to provide a thermosetting resin composition and a method for producing the same.
(A) a binder resin having an epoxy group, which is a thermosetting functional group; And (b) a urethane resin,
The content of the urethane resin (b) is (a) 1.5 to 3 times as much as the weight of the solid content of the binder resin having an epoxy group.
The present invention also provides a printing composition comprising the thermosetting resin composition.
The present disclosure also provides a printed substrate using the printing composition.
The present disclosure also relates to a substrate comprising: a substrate;
A conductor or circuit provided on the substrate; And
And a protective layer formed on the surface of the substrate, the protective layer being formed using the printing composition.
Preparing a printing composition comprising the thermosetting resin composition;
Coating the printing composition onto a substrate;
Drying the coated printing composition; And
And a step of firing the coated printing composition.
The thermosetting resin composition according to one embodiment of the present invention is excellent in heat resistance at a high temperature, has an effect of suppressing yellowing due to baking, and further has an effect of preventing a decrease in permeability.
The present specification provides a thermosetting resin composition.
(a) a binder resin having an epoxy group
According to one embodiment of the present invention, the (a) binder resin having an epoxy group includes a repeating unit represented by the following formula (1).
[Chemical Formula 1]
In Formula 1,
R 1 to R 3 are the same or different and each independently hydrogen or a C 1 to C 12 alkyl group,
R4 is an organic group containing an epoxy group.
The organic group containing the epoxy group may be represented by any one of the following formulas (2) to (4), but is not limited thereto.
(2)
(3)
[Chemical Formula 4]
In the above formulas (2) to (4), * denotes a position at which the epoxy group-containing substituent is bonded.
The formula (1) may be derived from a monomer having an epoxy group.
Examples of the monomer having an epoxy group include allyl glycidyl ether, glycidyl 5-norbornene-2-methyl-2-carboxylate (endo, exo mixture), 1,2- (Meth) acrylate, glycidyl? -Ethyl (meth) acrylate, glycidyl? -Propyl (meth) acrylate, glycidyl? (Meth) acrylate, 4,4-epoxybutyl (meth) acrylate, 4,5-epoxypentyl (meth) acrylate, 5,6-epoxyheptyl ethyl acrylate, methyl glycidyl (meth) acrylate, and the like, or a mixture thereof.
In particular, glycidyl (meth) acrylate or 3,4-epoxycyclohexyl (meth) acrylate is preferred.
According to one embodiment of the present invention, the binder resin having (a) epoxy group may further contain two or more kinds of repeating units derived from an olefin-based monomer capable of radical polymerization.
According to one embodiment of the present invention, the binder resin having (a) epoxy group may contain two to five repeating units derived from an olefin-based monomer capable of radical polymerization.
According to one embodiment of the present invention, the repeating unit derived from the olefin-based monomer may be represented by any one of the following formulas (6) to (11).
According to one embodiment of the present invention, the binder resin having (a) epoxy group may further include at least two of the repeating units represented by formulas (6) to (11).
[Chemical Formula 6]
(7)
[Chemical Formula 8]
[Chemical Formula 9]
[Chemical formula 10]
(11)
In the above formulas 6 to 11,
The alkyl groups of R5 to R14, R16, R17, R18, R20, R21 and R22 are the same or different and each is independently of one another hydrogen or C 1 ~ C 12,
R15 is a dicyclopentanyl group, a dicyclopentenyl group, a dicyclopentenyloxyethyl group, an adamantalgallium group or an isobonyl group,
R19 is an alkyl group of C 8 ~ C 18,
R23 is a halogen, C 1 ~ C 12 alkyl group, C 6 ~ C 20 aryl group or a C 1 ~ C 12 alkoxy group substituted or unsubstituted C 6 ~ C 20 of the ring of the aryl group,
R24 is halogen, C 6 ~ C 20 aryl group or a C 1 ~ C 12 alkoxy group substituted or unsubstituted in the C ~ C alkyl group of 1 12; A C 1 to C 12 alkyl ester group; Or a halogen, C 1 ~ C 12 alkyl group, C 6 ~ C 20 aryl group or a C 1 ~ C 12 alkoxy group substituted or unsubstituted C 6 ~ C 20 of the ring of the aryl group and,
m is an integer of 0 to 5,
And b to g are molar mixing ratios (%) of the respective repeating units in the binder resin having (a) an epoxy group, and when a molar mixing ratio of the repeating units represented by the above formula d + e + f + g > where d: e: f: g = 10 to 60: 1 to 45: 0 to 45: 0 to 45: 0 to 45: 0 to 45: 0 to 45, 0.
Specifically, the content of the repeating unit represented by the formula (1) may be from 40 mol% to 50 mol% with respect to the solid content of the binder resin having (a) an epoxy group. When the content of the repeating unit represented by the above-mentioned formula (1) is 40 mol% or more, it can have a proper degree of curing. When the content of the repeating unit represented by the above formula (1) is more than 50 mol% .
In the polymer according to the present invention, the substituents in the above formulas (6) to (11) will be described in more detail as follows.
Examples of the halogen group include, but are not limited to, fluorine, chlorine, bromine, and iodine.
The alkyl group may be linear or branched, and specific examples thereof include, but are not limited to, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a t-butyl group.
Specific examples of the alkoxy group include, but are not limited to, a methoxy group, an ethoxy group, and an isopropyloxy group.
The aryl group may be monocyclic or polycyclic. Examples of the monocyclic aryl group include a phenyl group, a biphenyl group, a terphenyl group and a stilbene group. Examples of the polycyclic aryl group include a naphthyl group, an anthracenyl group, a phenanthrene group, a pyrenyl group, a perylenyl group, A benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group,
According to one embodiment of the present invention, the binder resin having (a) epoxy group may further include at least three of the repeating units represented by the above formulas (6) to (11).
According to one embodiment of the present invention, the binder resin having (a) epoxy group may further include the repeating units represented by the above formulas (6) to (8). In this case, b to d are molar mixing ratios (%) of the respective repeating units in the binder resin having (a) epoxy group, and when a molar mixing ratio of the repeating units represented by the formula (1) b: c: d = 10 to 60: 1 to 30: 1 to 30: 1 to 30. The molar mixing ratio means the number of moles of each repeating unit based on 100 moles of the total repeating units (monomers) constituting the polymer. That is, it can be interpreted as mol%.
Wherein the olefinic monomer is a trialkoxysilane group-containing unsaturated carboxylic acid ester selected from the group consisting of trimethoxysilylpropyl (meth) acrylate and triethoxysilylpropyl (meth) acrylate;
Acrylates such as benzyl (meth) acrylate, phenyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, dimethylaminoethyl (Meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobonyl (Meth) acrylate, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy- (Meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, 2-methoxyethyl (Meth) acrylate, methoxy (Meth) acrylate, methoxytripropylene glycol (meth) acrylate, poly (ethylene glycol) methyl ether (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, p-nonylphenoxypolyethylene glycol (Meth) acrylate, p-nonylphenoxypolypropylene glycol (meth) acrylate, tetrafluoropropyl (meth) acrylate, 1,1,1,3,3,3-hexafluoroisopropyl (Meth) acrylate, cyclohexyl (meth) acrylate, octafluoropentyl (meth) acrylate, heptadecafluorodecyl (meth) acrylate, tribromophenyl , Ethyl? -Hydroxymethyl acrylate, propyl? -Hydroxymethyl acrylate, butyl? -Hydroxymethyl acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) Unsaturated carboxylic acid esters selected from the group consisting of acrylate, dicyclopentanyloxyethyl (meth) acrylate and dicyclopentenyloxyethyl (meth) acrylate;
Aromatic vinyls selected from the group consisting of styrene,? -Methylstyrene, (o, m, p) -vinyltoluene, (o, m, p) -methoxystyrene, and (o, m, p) -chlorostyrene;
Unsaturated ethers selected from vinyl methyl ether, and vinyl ethyl ether;
N-vinyl tertiary amines selected from the group consisting of N-vinyl pyrrolidone, N-vinyl carbazole and N-vinyl morpholine;
Unsaturated imides selected from the group consisting of N-phenylmaleimide, N- (4-chlorophenyl) maleimide, N- (4-hydroxyphenyl) maleimide and N-cyclohexylmaleimide;
1,4-butadiene, and isopropene, and mixtures thereof;
Selected from the group consisting of TONE M-100, TONE M-101, TONE M-201 (manufactured by DOW Chemical) and FM-1, FM-2 and FM-3 (manufactured by Daicel UCB) Caprolactone-modified (meth) acrylates; or
Acrylate monomer having a hydroxyl group selected from the group consisting of 2-hydroxyethyl (meth) acrylate, M-20G, M-40G and M-90G (manufactured by Shin-Nakamura).
According to one embodiment of the present invention, the binder resin having (a) epoxy group is a random copolymer, a block copolymer or the like.
According to one embodiment of the present invention, the (a) binder resin having an epoxy group may be a commercially available epoxy resin, or may be a resin obtained by synthesis.
The commercially available epoxy resin may be any one of EPOLEAD PB3600, PB4700 (manufactured by Daicel Chemical Industrial Co., Ltd.) and celloxide 2021P (manufactured by Shandong Lukang Record Pharmaceutical Co., Ltd.).
According to one embodiment of the present invention, the (a) binder resin having an epoxy group may be a polymer polymerized by adding a thiol compound as a monomer.
When the thiol compound is added as a monomer in the polymerization of the binder resin having the epoxy group (a), the polymerization can be stopped and the molecular weight of the binder resin can be controlled.
The thiol compound may be 1-dodecanethiol.
The thiol compound is preferably 5 parts by weight or less, more preferably 2 parts by weight or less, based on the total weight of monomers used in the polymerization of (a) the binder resin having an epoxy group. When the content of the thiol compound is within the above range, the molecular weight of the binder resin can be appropriately controlled.
According to one embodiment of the present invention, the weight average molecular weight of the binder resin having (a) an epoxy group is 6,000 to 50,000, specifically 15,000 to 25,000.
When the weight average molecular weight is 6,000 or more, the strength is not lowered when forming the film, and it is advantageous to form a composition having a high viscosity and thus to form a thick film. When the weight average molecular weight is 50,000 or less, storage stability is not lowered and reproducible synthesis is easy.
According to one embodiment of the present invention, the polydispersity index (PDI) of the binder resin having (a) epoxy group is 1 to 5.
In the present invention, the polydispersity index is a numerical value (Mw / Mn) obtained by dividing the weight average molecular weight (Mw) of the polymerized product by the number average molecular weight (Mn) The molecular weight and the number average molecular weight can be measured by a known method such as GPC (Gel Permeation Chromatograph).
According to one embodiment of the present invention, the weight of the binder resin having the epoxy group (a) is 8 wt% to 30 wt% or less of the total weight of the thermosetting resin composition. When the (a) binder resin having an epoxy group is in the above range, it can have stability.
The molecular weight of the binder resin having (a) epoxy group is not particularly limited as long as a temporary protective film can be formed, and can be appropriately selected depending on the thickness of the film to be formed, the equipment to be coated,
(b) urethane resin
According to one embodiment of the present invention, the (b) urethane resin comprises an acrylate group.
The (b) urethane resin may be a urethane (meth) acrylate compound.
Examples of the hydroxy (meth) acrylate compound contained in the urethane (meth) acrylate compound include hydroxymethyl (meth) acrylate, hydroxyethyl (meth) acrylate, tetramethylol ethane tri (Meth) acrylate compound such as hydroxyethyl (meth) acrylate.
The urethane (meth) acrylates are preferably urethane (meth) acrylates containing the allophanate-modified polyisocyanurate. Urethane (meth) acrylates containing allophanate-modified polyisocyanurate have low viscosity and excellent solubility in solvents, and also have improved adhesion to a substrate and improved film strength by photo-curing and / or thermosetting Which is advantageous.
UA-306A, U6LPA (Shin-Nakamura Chemical Co.), UX-2201, UXE-3002, UXE-3024, UX-3204, UX-4101, UX6-101 (Manufactured by Kayarad), UN-9000H, UN-9000PEP, UN-9200A, and UN-9000P, (Manufactured by Negami Kogyo Co., Ltd.) and Bayer Japan Co., Ltd. (manufactured by Nihon Kogyo Co., Ltd.) and UN-3300, UN-3320, UN-3320HC, UN-3320HS, UN-6060P, UN-5500 and SH- And AGROR 4060 which is a compound having an allophanate skeleton.
According to one embodiment of the present invention, the (b) urethane resin has a weight average molecular weight of 6,000 to 100,000. When the weight average molecular weight of the urethane resin (b) is within the above range, the viscosity can be controlled to improve the efficiency of the process.
According to one embodiment of the present disclosure, the composition further comprises at least one selected from the group consisting of (c) a solvent, (d) a surfactant, and (e) a thermal polymerization initiator.
According to one embodiment of the present invention, the content of the (b) urethane resin may be (a) 2 to 2.5 times as much as the weight of the solid content of the binder resin having an epoxy group.
According to one embodiment of the present invention, the content of the (b) urethane resin is 20 wt% to 60 wt%, specifically 30 wt% to 60 wt% with respect to the total weight of the thermosetting resin composition. When the (a) binder resin having an epoxy group is in the above range, it can have stability.
The thermosetting resin composition according to one embodiment of the present invention is a thermosetting resin composition comprising (a) a binder resin having an epoxy group and (b) a urethane resin having a content of 1.5 to 3 times the solid content of the binder resin having the epoxy group The heat resistance at a high temperature is excellent and the effect of inhibiting yellowing due to baking is suppressed. Furthermore, the lowering rate of the permeability after baking is low.
(c) Surfactant
According to one embodiment of the present invention, (d) the surfactant is selected from a siloxane-based compound and a fluorine-based compound.
According to one embodiment of the present invention, the surfactant (c) is a BYK series (066,141, 306, 307, 310, 315, 320, 322, 323, 330, 331, 333, 340, 355, F-488, F-110, and TF-1697 (manufactured by DIC, Inc.) (BL-20, R-30, F-477, R-08, F-486, F- , TF-1624) and Novec series (FC-4430, FC-4432) manufactured by 3M Company.
According to one embodiment of the present invention, the content of the (c) surfactant may be 0.1 wt% to 1 wt% with respect to the total weight of the thermosetting resin composition.
(d) solvent
The solvent (d) is not particularly limited as long as it can dissolve the constituents uniformly and is chemically stable and is not reactive with the components of the composition.
According to one embodiment of the present invention, the solvent (d) is at least one selected from the group consisting of a ketone compound, an ether compound, an ethylene glycol alkyl ether acetate compound, a propylene glycol alkyl ether acetate compound, an ethylene glycol compound and an ester compound Or a mixture thereof.
The ketone-based compound may be methyl ethyl ketone or cyclohexanone.
The ether compound may be tetrahydrofuran.
The ethylene glycol alkyl ether acetate based compound may be methyl cellosolve acetate, ethyl cellosolve acetate or ethylene glycol butyl ether acetate.
The propylene glycol alkyl ether acetate based compound may be propylene glycol monomethyl ether acetate, propylene glycol ethyl ether acetate or propylene glycol propyl ether acetate.
The ethylene glycol compound may be butyl cellosolve, 2-methoxyethyl ether, ethylene glycol ethyl methyl ether or ethylene glycol diethyl ether.
The ester compound may be ethyl acetate, ethyl lactate, methyl-3-methoxypropionate, methyl 3-butoxypropionate or ethyl 3-ethoxypropionate.
When the ester compound of the solvent (d) is a mixed solvent of methyl-3-methoxypropionate or methyl-3-methoxypropionate, the viscosity of the synthesized binder resin having the epoxy group (a) The viscosity of the thermosetting resin composition is lowered. By adjusting the viscosity as described above, the coating speed of the composition can be controlled.
When the ethylene glycol compound of the solvent (d) is ethylene glycol ethyl methyl ether, the storage stability of the binder resin having the epoxy group (a) synthesized is improved, and the storage stability of the thermosetting resin composition can be improved.
According to an embodiment of the present invention, the solvent (d) may be 10% by weight to 50% by weight based on the total weight of the thermosetting resin composition.
According to one embodiment of the present invention, the viscosity of the thermosetting resin composition is 700 cP or more.
When the viscosity of the thermosetting resin composition is 700 cP or more, thick film formation is easy.
The present invention also provides a process for producing the thermosetting resin composition.
According to one embodiment of the present invention, there is provided a method for preparing a binder resin, comprising heating a composition comprising a monomer having an epoxy group to prepare (a) a binder resin having an epoxy group;
A binder resin having (a) an epoxy group and (b) a urethane resin.
The step (a) of preparing a binder resin having an epoxy group may include (a) mixing a binder resin having an epoxy group.
The step (b) of preparing the composition comprising (b) the urethane resin may comprise (b) mixing the composition comprising the urethane resin.
According to one embodiment of the present invention, the composition comprising the monomer having an epoxy group further comprises (c) a solvent.
According to one embodiment of the present invention, the composition comprising the monomer having an epoxy group further comprises (e) a thermal polymerization initiator.
According to one embodiment of the present invention, the binder resin having (a) epoxy group may be prepared by any one of various polymerization methods known in the art such as radical polymerization, cationic polymerization, anionic polymerization or condensation polymerization .
The above-mentioned radical polymerization is easy to manufacture and has an economic advantage over other production methods.
According to one embodiment of the present invention, (e) the thermal polymerization initiator is a radical polymerization initiator, a cation polymerization initiator, an anionic polymerization initiator or a condensation polymerization initiator.
As the radical polymerization initiator usable in the radical polymerization reaction, those conventionally used in the art can be used.
Specific examples of the radical polymerization initiator include 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis- (2,4-dimethylvaleronitrile), 2,2'-azobis - (4-methoxy-2,4-dimethylvaleronitrile), benzoyl peroxide, t-butyl peroxypivalate, and 1,1'-bis- (bis- t- butylperoxy) cyclohexane. But is not limited thereto.
According to one embodiment of the present invention, the thermosetting resin composition may further include at least one selected from a dispersant, an antioxidant, an ultraviolet absorber, a thermal polymerization inhibitor, a leveling agent, and an adhesive. The content of the additive may be 0.01 wt% to 10 wt% with respect to the total weight of the thermosetting resin composition.
The present invention also provides a printing composition comprising the thermosetting resin composition.
According to one embodiment of the present invention, the printing composition may further include, in addition to the thermosetting resin composition, an additional component depending on the printing purpose or the target substrate.
According to an embodiment of the present invention, a printing method using the printing composition includes:
Preparing a printing composition comprising the thermosetting resin composition;
Coating the printing composition onto a substrate;
Drying the coated printing composition; And
And firing the coated printing composition.
The step of coating the printing composition on the substrate may be coated on the substrate by a screen printing method.
In this specification, screen printing is a method in which a mask having a through hole formed in a portion corresponding to an adhesive application region is placed on a substrate and an adhesive is pushed into the through hole with a squeegee, Can be easily controlled.
The substrate may be a substrate.
In the printing method using the printing composition,
1) dissolving and stirring the binder resin, the curing agent and the surfactant in an organic solvent;
2) coating the prepared printing composition solution on a substrate by a screen printing technique;
3) drying at 60 ° C to 180 ° C for 0.5 to 10 minutes after the step 2); And
4) After the drying, the calcination step may be carried out at 180 ° C to 250 ° C for 5 minutes to 20 minutes.
The fired printing composition may form a cured film.
According to one embodiment of the present disclosure, the printing composition is for screen printing.
The present disclosure also provides a printed substrate using the printing composition.
According to one embodiment of the present invention, a protective layer can be formed using the printing composition.
In addition,
Board;
A conductor or circuit provided on the substrate; And
And a protective layer formed on the surface of the substrate, the protective layer being formed using the printing composition.
The substrate may be transparent.
The protective film may be transparent.
The transparent substrate may be formed of glass, polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (PMMA), polyethylene naphthalate (PEN), polyether sulfone (PES) (TAC), polyvinyl alcohol (PVA) film, polyimide (PI) film, polystyrene (PS), biaxially oriented PS (BOPS) Glass. ≪ / RTI >
Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the scope of the present invention is not limited to the following examples.
Example One
40 g of (meth) acrylic acid, 80 g of glycidyl methacrylate, 20 g of styrene, 60 g of dicyclopentanyl methacrylate, and 800 g of ethylene glycol ethyl methyl ether as a solvent were mixed in a nitrogen atmosphere using a mechanical stirrer And mixed for 1 hour. The temperature of the reactor was raised to 65 ° C under a nitrogen atmosphere. When the temperature of the mixture reached 65 ° C, 0.8 g of 2,2'-azobis- (2,4-dimethylvaleronitrile) Lt; / RTI > As a result, a binder resin having an epoxy group (a) having an Mw of 20,000 and a PDI of 2.5 was obtained.
300 g of a binder resin having an epoxy group (a) having a solid content of 30%, (b) 190 g of a product name UXE-3002 manufactured by Shin Nakamura Chemical Co., Ltd. as a urethane resin, 3 g of BYK307 as a surfactant and 4 g of KBM 403 as an additive Were mixed and sufficiently stirred to obtain a thermosetting resin composition.
Example 2
55 g of methacrylic acid, 50 g of glycidyl methacrylate, 40 g of styrene, 70 g of dicyclopentanyl methacrylate, and 800 g of ethylene glycol ethyl methyl ether as a solvent under a nitrogen atmosphere using a mechanical stirrer for 1 hour . The temperature of the reactor was raised to 65 ° C under a nitrogen atmosphere. When the temperature of the mixture reached 65 ° C, 0.6 g of 2,2'-azobis- (2,4-dimethylvaleronitrile), which is a thermal polymerization initiator, Lt; / RTI > As a result, a binder resin having an epoxy group (a) having an Mw of 18,000 and a PDI of 2.4 was obtained.
185 g of UXE-3024, 3 g of BYK307 and 4 g of KBM 403 as an additive were sufficiently mixed with 308 g of the binder resin (solid content 30%) and stirred to obtain a thermosetting resin composition.
Example 3.
150 g of Celloxide 2012, 300 g of UXE-3002, 4 g of BYK307 and 4 g of KBM403 as an additive were mixed with 45 g of PGMEA as a solvent and stirred to obtain a thermosetting resin composition.
Comparative Example One
490 g of a binder resin having an epoxy group (a) in Example 1 (solid content 30%), 3 g of BYK307 and 4 g of KBM 403 as an additive were mixed and sufficiently stirred to obtain a thermosetting resin composition.
Comparative Example 2
493 g of a binder resin having an epoxy group (a) in Example 2 (solid content 30%), 3 g of BYK307 and 4 g of KBM 403 as an additive were mixed and thoroughly stirred to obtain a thermosetting resin composition.
Comparative Example 3
4000 g of BYK307 and 4 g of KBM 403 as an additive were mixed and sufficiently stirred to obtain a thermosetting resin composition.
The properties of the respective thermosetting resin compositions obtained in the above Examples and Comparative Examples were measured by the following methods, and the results are shown in Table 1 below.
1) The thickness and permeability were measured after film formation (completion of PB at 230 ° C) by spin coating at the same thickness.
2) The thickness and permeability were measured after baking (additional baking) for 1 hour at 250 ℃ convection.
As can be seen from the results in Table 1, it can be confirmed that the decrease in the transmittance is small when the weight of the binder resin having (a) epoxy group is less than 50% of the weight of (b) the urethane resin.
Claims (19)
Wherein the content of the urethane resin (b) is 1.5 to 3 times as much as the weight of the binder resin having an epoxy group (a), and the binder resin having the epoxy group comprises a repeating unit represented by the following formula (1) :
[Chemical Formula 1]
In Formula 1,
R 1 to R 3 are the same or different and each independently hydrogen or a C 1 to C 12 alkyl group,
R4 is an organic group containing an epoxy group.
(2)
(3)
[Chemical Formula 4]
[Chemical Formula 6]
(7)
[Chemical Formula 8]
[Chemical Formula 9]
[Chemical formula 10]
(11)
In the above formulas 6 to 11,
The alkyl groups of R5 to R14, R16, R17, R18, R20, R21 and R22 are the same or different and each is independently of one another hydrogen or C 1 ~ C 12,
R15 is a dicyclopentanyl group, a dicyclopentenyl group, a dicyclopentenyloxyethyl group, an adamantalgallium group or an isobonyl group,
R19 is an alkyl group of C 8 ~ C 18,
R23 is a halogen, C 1 ~ C 12 alkyl group, C 6 ~ C 20 aryl group or a C 1 ~ C 12 alkoxy group substituted or unsubstituted C 6 ~ C 20 of the ring of the aryl group,
R24 is halogen, C 6 ~ C 20 aryl group or a C 1 ~ C 12 alkoxy group substituted or unsubstituted in the C ~ C alkyl group of 1 12; A C 1 to C 12 alkyl ester group; Or a halogen, C 1 ~ C 12 alkyl group, C 6 ~ C 20 aryl group or a C 1 ~ C 12 alkoxy group substituted or unsubstituted C 6 ~ C 20 of the ring of the aryl group and,
m is an integer of 0 to 5,
And b to g are molar mixing ratios (%) of the respective repeating units in the binder resin having (a) an epoxy group, and the molar mixing ratio of the repeating units represented by the formula (1) d + e + f + g > where d: e: f: g = 10 to 60: 1 to 30: 0 to 30: 0 to 30: 0 to 30: 0 to 30: 0.
A conductor or circuit provided on the substrate; And
Wherein the touch panel comprises a protective film formed on the surface of the substrate having the lead wire or the circuit and using the printing composition of claim 15.
Coating the printing composition onto a substrate;
Drying the coated printing composition; And
And firing the coated printing composition.
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| JP2006117922A (en) | 2004-09-21 | 2006-05-11 | Showa Denko Kk | Thermosetting resin composition using urethane resin |
| WO2012157627A1 (en) | 2011-05-16 | 2012-11-22 | 昭和電工株式会社 | Curable heat-dissipating composition |
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| JP2006117922A (en) | 2004-09-21 | 2006-05-11 | Showa Denko Kk | Thermosetting resin composition using urethane resin |
| WO2012157627A1 (en) | 2011-05-16 | 2012-11-22 | 昭和電工株式会社 | Curable heat-dissipating composition |
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