CN115328226A - Pressure regulating device and method applied to vapor deposition equipment - Google Patents
Pressure regulating device and method applied to vapor deposition equipment Download PDFInfo
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- CN115328226A CN115328226A CN202211056621.2A CN202211056621A CN115328226A CN 115328226 A CN115328226 A CN 115328226A CN 202211056621 A CN202211056621 A CN 202211056621A CN 115328226 A CN115328226 A CN 115328226A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
- G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
- G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
- G05D16/2026—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means
Abstract
The invention discloses a pressure regulating device and a pressure regulating method applied to vapor deposition equipment, and the pressure regulating device comprises a main air inlet pressure regulating pipeline, a load air inlet pressure regulating pipeline, a main path valve, a bypass regulating valve and a vacuum gauge, wherein an air inlet of a deposition furnace is connected with the main air inlet pressure regulating pipeline, an air outlet of the deposition furnace is connected with a vacuum pump set through the main path valve, the bypass regulating valve is connected with two sides of the main path valve, the load air inlet pressure regulating pipeline is connected with an air inlet of the main path valve, the main air inlet pressure regulating pipeline and the load air inlet pressure regulating pipeline are both connected with a process air inlet end, and the deposition furnace is provided with the vacuum gauge for measuring the air pressure in the deposition furnace. The invention solves the problems of long-term stability and accurate controllability of the process pressure in the deposition furnace.
Description
Technical Field
The invention relates to the technical field of chemical vapor deposition, in particular to a pressure regulating device and a pressure regulating method applied to vapor deposition equipment.
Background
Chemical vapor deposition is a process widely used to produce composite materials. Most of the existing vapor deposition furnaces or deposition systems introduce process gas into the deposition furnace from the bottom of the deposition furnace through a multi-path gas inlet pipe, the process gas is directly introduced into the bottom of a deposition chamber in the furnace body at a certain flow rate and flow velocity, and a series of physical and chemical reactions occur to deposit the process gas inside or on the surface of a blank product. In the deposition process of the deposition furnace, long-term stability and accurate controllability of the process pressure are key factors for ensuring the uniformity of the deposition rate; in reality, under the superposition of various effects, the pressure of the deposition system usually oscillates periodically with a fast rising speed and then slowly falls back, and the conventional regulation mode through simple pressure measurement feedback and electric regulation valve action is difficult to meet the requirement of accurate regulation of the pressure due to the limitation of hysteresis.
Disclosure of Invention
Technical problem to be solved
Based on the problems, the invention provides a pressure regulating device and a pressure regulating method applied to vapor deposition equipment, and solves the problems of long-term stability and accurate controllability of process pressure in a deposition furnace.
(II) technical scheme
Based on the technical problem, the invention provides a pressure regulating device applied to vapor deposition equipment, which comprises a main air inlet pressure regulating pipeline, a load air inlet pressure regulating pipeline, a main path valve, a bypass regulating valve and a vacuum gauge, wherein an air inlet of a deposition furnace is connected with the main air inlet pressure regulating pipeline, an air outlet of the deposition furnace is connected with a vacuum pump set through the main path valve, the bypass regulating valve is connected with two sides of the main path valve, the load air inlet pressure regulating pipeline is connected with an air inlet of the main path valve, the main air inlet pressure regulating pipeline and the load air inlet pressure regulating pipeline are both connected with a process air inlet end, and the deposition furnace is provided with the vacuum gauge for measuring the air pressure in the deposition furnace.
Furthermore, the main air inlet pressure regulating pipeline comprises a first mass flow meter, a first volume flow meter and a first valve, and an air inlet end of the main air inlet pressure regulating pipeline is connected with a process air inlet end through a third valve.
Furthermore, the load air inlet pressure regulating pipeline comprises a second mass flow meter, a second volume flow meter and a second valve, and an air inlet end of the load air inlet pressure regulating pipeline is connected with a process air inlet end through a third valve.
Furthermore, the main valve adopts a pneumatic valve, the bypass regulating valve adopts an electric regulating valve, and the first valve, the second valve and the third valve all adopt pneumatic valves.
Furthermore, a filter is arranged on an air inlet pipeline of the process air inlet end.
The invention also discloses a pressure regulation and control method of the pressure regulation and control device applied to the vapor deposition equipment, which is used for monitoring the air pressure in the deposition furnace obtained by the vacuum gauge, wherein the pressure delta P = the pressure in the furnace-target pressure, and P1 is more than P2 and more than P3 is more than 0Pa, and the following regulation is carried out according to the air pressure difference delta P:
when the delta P is larger than or equal to P1, the main path valve is opened, and the bypass regulating valve keeps a constant opening degree;
when P3 is less than delta P and less than P2, the main circuit valve is closed and automatically adjusted through the bypass adjusting valve;
when the delta P is more than or equal to 0Pa and less than or equal to P3, the main circuit valve is closed, and an adjusting range (OPL, OPH) is limited for the bypass adjusting valve to adjust in the range;
and when the delta P is less than 0Pa, automatically setting the opening of the bypass regulating valve to the OPL position, opening the first valve, ventilating the furnace through the main air inlet pressure regulating pipeline, and closing the air inlet pressure regulating pipeline when the delta P =0.
Further, after the air inlet pressure regulating pipeline is closed when the delta P =0, if the delta P still has a negative trend, the second valve is opened, the load air inlet pressure regulating pipeline is opened, the air exhaust capacity of the vacuum pump group is reduced, and the delta P =0.
Further, the pressure regulation method further comprises: in the initial vacuum stage, closing the third valve, the first valve and the second valve, closing the main path valve, opening the bypass regulating valve, and gradually regulating the opening of the bypass regulating valve according to the change of the furnace pressure; and when the furnace pressure reaches the value which allows the opening of the main path valve, opening the main path valve, and adjusting the bypass adjusting valve to a constant opening degree.
Further, P1=300pa, P2=200pa, P3=100pa.
The invention also discloses vapor deposition equipment comprising the pressure regulating and controlling device applied to the vapor deposition equipment.
(III) advantageous effects
The technical scheme of the invention has the following advantages:
(1) According to the invention, the main valve and the bypass regulating valve are matched to realize pumping speed regulation, so that the main regulating function is undertaken, and according to the pressure condition in the furnace, not only can quick pressure reduction be realized, but also pressure increase can be realized; the load air inlet pressure regulating pipeline can quickly regulate the effective pumping speed of the vacuum pump set, the main air inlet pressure regulating pipeline can supplement the pressure change of the deposition chamber, and the pumping speed regulation mode and the air inlet load regulation mode are superposed, so that the deposition pressure control precision is higher, the long-term stability and the accurate controllability of the process pressure are favorably kept, and the response period of pressure monitoring and pressure regulation is shortened;
(2) In the initial vacuumizing stage, the bypass adjusting valve is firstly used for carrying out flexible vacuumizing and then is used for quickly vacuumizing, so that the damage to the interior of the furnace caused by sudden change of the pressure in the furnace can be prevented;
(3) In the deposition process, different double-valve linkage adjustment is continuously carried out according to the differential pressure between the pressure in the furnace and the target pressure in the differential pressure interval range, and the pressure is quickly and accurately controlled, so that the furnace pressure is constant or fluctuates near the target value.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and not to be construed as limiting the invention in any way, and in which:
FIG. 1 is a schematic connection diagram of a pressure control device applied to a vapor deposition apparatus according to an embodiment of the present invention;
in the figure: 1: a main path valve; 2: a bypass regulating valve; 31: a first mass flow meter; 41: a first valve; 51: a first volume flow meter; 32: a second mass flow meter; 42: a second valve; 52: a second volume flow meter; 43: a third valve; 6: a vacuum gauge; 7: and (3) a filter.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The invention discloses a pressure regulating device applied to vapor deposition equipment, which comprises a main air inlet pressure regulating pipeline, a load air inlet pressure regulating pipeline, a main pipeline valve 1, a bypass regulating valve 2 and a vacuum gauge 6, wherein an air inlet of a deposition furnace is connected with the main air inlet pressure regulating pipeline, an air outlet of the deposition furnace is connected with a vacuum pump set through the main pipeline valve 1, the bypass regulating valve 2 is connected with two sides of the main pipeline valve 1, the load air inlet pressure regulating pipeline is connected with an air inlet of the main pipeline valve 1, the main air inlet pressure regulating pipeline and the load air inlet pressure regulating pipeline are both connected with a process air inlet end, and the deposition furnace is provided with the vacuum gauge 6 for measuring the air pressure in the deposition furnace.
The main pressure regulating pipeline that admits air includes mass flow meter one 31, volumetric flowmeter one 51 and valve one 41, the load pressure regulating pipeline that admits air includes mass flow meter two 32, volumetric flowmeter two 52 and valve two 42, the main pressure regulating pipeline that admits air and the inlet end of load pressure regulating pipeline that admits air are connected technology inlet end through three 43 valves, carry out the unified open-close control of admitting air through three 43 valves, carry out the main pressure regulating pipeline that admits air or the open-close control of load pressure regulating pipeline that admits air respectively through valve one 41 or valve two 42. The main path valve 1 only needs to be opened and closed in two states, the air suction amount is large, and a pneumatic valve or an electric valve is adopted in the embodiment; the bypass regulating valve 2 adopts an electric regulating valve and can regulate the opening degree; the first valve 41, the second valve 42 and the third valve 43 only need to be opened and closed in two states, and the embodiment adopts pneumatic valves or electric valves; a filter 7 is arranged on the air inlet pipeline of the process air inlet end for filtering.
The pumping speed regulation bears the main regulation function, the pumping rate of the main valve 1 is large, the opening of the bypass regulating valve 2 is adjustable, the pumping rate is adjustable, the main valve 1 and the bypass regulating valve 2 are matched according to the change of the furnace pressure, the pumping speed of a vacuum pump set is regulated, and the furnace pressure control is realized; according to the change of the furnace pressure, the main path valve 1 is matched with the bypass regulating valve 2, for example, when the deposition pressure fluctuates sharply and the pressure control is abnormal, the opening degree of the bypass regulating valve 2 is automatically regulated through the existing control algorithm, and the main path valve 1 is opened (the furnace pressure exceeds a target value too much) or closed (the furnace pressure is lower than the target value too much) when necessary, so that the purposes of quickly regulating the pumping speed of the vacuum pump set and controlling the pressure are achieved; or when the process air inflow is large and the pressure regulating function cannot be realized through the bypass regulating valve 2, the main path valve 1 is opened, and when the process air inflow is small, the main path valve 1 is closed.
In the main air inlet pressure regulating pipeline, the air inlet flow of the main air inlet pressure regulating pipeline is controlled through a first mass flow meter 31; when the pressure in the furnace is smaller than the target value, the pressure change in the furnace is compensated by controlling the first mass flow meter 31, so that the pressure in the furnace is increased.
In the load air inlet pressure regulating pipeline, the air inlet flow of the load air inlet pressure regulating pipeline is controlled through a second mass flow meter 32; when the load air inlet pressure regulating pipeline is opened, the load air inlet pressure regulating pipeline and gas in the furnace are pumped into the vacuum pump set together, the pumping force of the vacuum pump set is directly influenced, the air pumping capacity of the vacuum pump set is reduced, the air inlet flow of the pipeline in front of the pump is regulated by controlling the second 32 mass flow meters, the effective pumping speed of the vacuum pump set is rapidly regulated, the pressure in the furnace is increased in a micro-scale mode, and rapid fine adjustment is achieved. Therefore, by superposing two adjusting modes of pumping speed and air inlet load, the accuracy of deposition pressure control can be greatly improved, and the response period of pressure monitoring and pressure adjustment is shortened.
The pressure regulating device controls the opening and closing of the main road valve 1, the opening degree of the bypass regulating valve 2, the opening and closing of the first valve 41, the opening and closing of the second valve 42, the flow of the first mass flow meter 31 and the flow of the second mass flow meter 32 according to the air pressure in the deposition furnace obtained by the monitoring vacuum gauge 6, and comprises a two-stage pressure regulating method:
A. initial vacuum-pumping stage:
because the deposition process is carried out under the vacuum condition, the furnace pressure is firstly pumped to the vacuum state from the atmospheric state, but the sudden change of the furnace pressure can damage the interior of the furnace, the flexible vacuum pumping is carried out firstly, after the air is thin, the main circuit valve 1 is opened to accelerate the vacuum pumping and approach the vacuum, the fine adjustment is not needed, and the deposition process is carried out when the heating condition is met;
closing the third valve 43, the first valve 41 and the second valve 42, closing the main path valve 1, opening the bypass regulating valve 2, gradually regulating the opening degree of the bypass regulating valve 2 according to the change of the furnace pressure, and further controlling the vacuum obtaining speed; the flexible vacuum pumping of the bypass regulating valve 2 controls the vacuum obtaining speed, so that the damage effect of the sudden change of the pressure in the furnace on the interior of the furnace can be avoided;
when the furnace pressure reaches the value that the main path valve 1 is allowed to be opened, the main path valve 1 is opened, the bypass regulating valve 2 is regulated to an opening degree which is a target opening degree value in the operation process of the subsequent deposition process, and the vacuum pumping state is always kept before the deposition process is operated;
B. adjusting to a set target pressure stage:
defining a pressure difference: delta P = furnace pressure-target pressure, P1> P2> P3>0Pa, and during the operation of the deposition process, the pressure is quickly and accurately controlled through the linkage adjustment action of the double valves, so that the furnace pressure is constant or fluctuates near the target value, and the method comprises the following steps:
(1) When the delta P is larger than or equal to P1, the main road valve 1 is opened, and the bypass regulating valve 2 keeps a constant opening degree;
at this time, Δ P is large, the main path valve 1 is opened to rapidly reduce pressure, and in this embodiment, P1=300Pa;
(2) When P3 is less than delta P and less than P2, the main path valve 1 is closed, and the automatic adjustment is carried out through the bypass adjusting valve 2, so that the main path valve slowly approaches the target set pressure;
the main circuit valve 1 is opened when the delta P is more than or equal to P1, the pressure reduction is fast, and the situation that the delta P is more than or equal to P2 and less than the P1 generally does not occur due to the inertia of the main circuit valve 1, so that the situation that the P3 is less than the delta P and less than the P2 is directly judged, in the embodiment, P2=200Pa, and P3=100Pa is set according to the actual situation;
(3) When the delta P is more than or equal to 0Pa and less than or equal to P3, the main path valve 1 is closed, and an adjusting range (OPL, OPH) is limited for the bypass adjusting valve 2, so that the furnace pressure is adjusted in the range, the furnace pressure is ensured to be constant, or the furnace pressure is ensured to be stable and fluctuate in a small range;
since the delta P is very small, if the pressure is still automatically adjusted according to a value through the bypass adjusting valve 2, frequent adjustment is carried out, so that the fluctuation is larger, and accurate pressure adjustment is not facilitated, therefore, the opening adjusting range of the bypass adjusting valve 2 is limited, and the pressure adjustment is more accurate;
(4) When the delta P is less than 0Pa, automatically setting the opening of the bypass regulating valve 2 to the OPL position, opening a first valve 41, ventilating the furnace through a main air inlet pressure regulating pipeline, and closing the air inlet pressure regulating pipeline when the delta P = 0; after the air inlet pressure regulation is closed, if the delta P still has a negative trend, the second valve 42 is opened, the load air inlet pressure regulation pipeline is opened, the air exhaust capacity of the vacuum pump set is reduced, and the delta P =0.
In addition, the P1, the P2 and the P3 can be set through experience, and can also be subjected to multiple experiments to record the opening degree of the bypass regulating valve 2 after the pressure control is stable, obtain a data table of the pressure-valve opening degree relation, and corresponding valve opening degree OPL and OPH values under different target pressures, and establish fluctuation characteristic databases under different deposition process pressures; based on the fluctuation characteristic database and the data table of the pressure-valve opening relation, P1, P2 and P3 can be reasonably selected, and the intelligent control of the pressure of the deposition system is realized to achieve the aim of quickly and accurately controlling the deposition pressure.
In summary, the pressure regulating device of the vapor deposition apparatus and the method thereof have the following advantages:
(1) According to the invention, the main valve and the bypass regulating valve are matched to realize pumping speed regulation, so that the main regulating function is undertaken, and according to the pressure condition in the furnace, not only can quick pressure reduction be realized, but also pressure increase can be realized; the load air inlet pressure regulating pipeline can quickly regulate the effective pumping speed of the vacuum pump set, the main air inlet pressure regulating pipeline can supplement the pressure change of the deposition chamber, and the pumping speed regulation mode and the air inlet load regulation mode are superposed, so that the deposition pressure control precision is higher, the long-term stability and the accurate controllability of the process pressure can be favorably maintained, and the response period of pressure monitoring and pressure regulation is shortened;
(2) In the initial vacuumizing stage, the bypass adjusting valve is firstly used for carrying out flexible vacuumizing and then is used for quickly vacuumizing, so that the damage to the interior of the furnace caused by sudden change of the pressure in the furnace can be prevented;
(3) In the deposition process, different double-valve linkage adjustment is continuously carried out according to the differential pressure between the pressure in the furnace and the target pressure in the differential pressure interval range, and the pressure is quickly and accurately controlled, so that the furnace pressure is constant or fluctuates near the target value.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (10)
1. The utility model provides a pressure regulation and control device for vapor deposition equipment, its characterized in that, including main pressure regulating pipeline, the load pressure regulating pipeline that admits air, main way valve, bypass governing valve and vacuum gauge of admitting air, the main pressure regulating pipeline that admits air is connected to the air inlet of depositing stove, and the gas outlet of depositing stove passes through main way valve and connects the vacuum pump group, and bypass governing valve connects the both sides of main way valve, the load pressure regulating pipeline that admits air connect the air inlet of main way valve, main pressure regulating pipeline and the load pressure regulating pipeline that admits air all connect the technology inlet end, and the depositing stove is equipped with the vacuum gauge of measuring atmospheric pressure in the depositing stove.
2. The pressure regulating device applied to the vapor deposition equipment as recited in claim 1, wherein the main gas inlet pressure regulating pipeline comprises a first mass flow meter, a first volume flow meter and a first valve, and a gas inlet end of the main gas inlet pressure regulating pipeline is connected with a process gas inlet end through a third valve.
3. The pressure regulating device applied to the vapor deposition equipment as recited in claim 2, wherein the load air inlet pressure regulating pipeline comprises a second mass flow meter, a second volume flow meter and a second valve, and an air inlet end of the load air inlet pressure regulating pipeline is connected with a process air inlet end through a third valve.
4. The pressure regulating device applied to the vapor deposition apparatus according to claim 3, wherein the main valve is a pneumatic valve, the bypass regulating valve is an electrically operated regulating valve, and the first valve, the second valve, and the third valve are all pneumatic valves.
5. The pressure regulating device applied to the vapor deposition equipment as recited in claim 4, wherein a filter is further disposed on the gas inlet pipeline of the process gas inlet end.
6. A pressure control method for a pressure control apparatus for a vapor deposition apparatus according to any one of claims 1 to 5, wherein the atmospheric pressure in the deposition furnace obtained by the vacuum gauge is monitored, Δ P = the pressure in the furnace-target pressure, P1> P2> P3>0Pa, and the following adjustment is made in accordance with the atmospheric pressure difference Δ P:
when the delta P is larger than or equal to P1, the main path valve is opened, and the bypass regulating valve keeps a constant opening degree;
when P3 is less than delta P and less than P2, the main circuit valve is closed, and automatic adjustment is carried out through the bypass adjusting valve;
when the delta P is more than or equal to 0Pa and less than or equal to P3, the main circuit valve is closed, and an adjusting range (OPL, OPH) is limited for the bypass adjusting valve to adjust in the range;
and when the delta P is less than 0Pa, automatically setting the opening of the bypass regulating valve to the OPL position, opening the first valve, ventilating the furnace through the main air inlet pressure regulating pipeline, and closing the air inlet pressure regulating pipeline when the delta P =0.
7. The pressure regulating method applied to the vapor deposition equipment as recited in claim 6, wherein after the air inlet pressure regulating pipeline is closed when Δ P =0, if Δ P still has a negative trend, the second valve is opened, the load air inlet pressure regulating pipeline is opened, the air exhaust capacity of the vacuum pump set is reduced, and Δ P =0.
8. The pressure regulating method applied to a vapor deposition apparatus according to claim 6, further comprising: in the initial vacuum stage, closing the third valve, the first valve and the second valve, closing the main path valve, opening the bypass regulating valve, and gradually regulating the opening of the bypass regulating valve according to the change of the furnace pressure; and when the furnace pressure reaches the value which allows the opening of the main path valve, opening the main path valve, and adjusting the bypass adjusting valve to a constant opening degree.
9. The pressure regulating method applied to the vapor deposition apparatus according to claim 6, wherein P1=300Pa, P2=200Pa, P3=100Pa.
10. A vapor deposition apparatus comprising the pressure regulating device for a vapor deposition apparatus according to any one of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211056621.2A CN115328226A (en) | 2022-08-31 | 2022-08-31 | Pressure regulating device and method applied to vapor deposition equipment |
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| CN202211056621.2A CN115328226A (en) | 2022-08-31 | 2022-08-31 | Pressure regulating device and method applied to vapor deposition equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116493195A (en) * | 2023-05-23 | 2023-07-28 | 苏州锐智航智能科技有限公司 | Online vacuum glue filling machine and control method thereof |
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2022
- 2022-08-31 CN CN202211056621.2A patent/CN115328226A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116493195A (en) * | 2023-05-23 | 2023-07-28 | 苏州锐智航智能科技有限公司 | Online vacuum glue filling machine and control method thereof |
| CN116493195B (en) * | 2023-05-23 | 2023-11-28 | 苏州锐智航智能科技有限公司 | Online vacuum glue filling machine and control method thereof |
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