CN115327711B - ONT optical module based on COB encapsulation - Google Patents
ONT optical module based on COB encapsulation Download PDFInfo
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- CN115327711B CN115327711B CN202210770320.XA CN202210770320A CN115327711B CN 115327711 B CN115327711 B CN 115327711B CN 202210770320 A CN202210770320 A CN 202210770320A CN 115327711 B CN115327711 B CN 115327711B
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- optical
- port
- fiber array
- cob
- module
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- 230000003287 optical effect Effects 0.000 title claims abstract description 106
- 238000005538 encapsulation Methods 0.000 title claims description 6
- 239000013307 optical fiber Substances 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 32
- 239000010703 silicon Substances 0.000 claims abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 230000007704 transition Effects 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical communication, and provides an ONT optical module based on COB packaging, which comprises an optical receiving assembly, an optical transmitting assembly, an optical port and an optical fiber array, wherein one port of the optical fiber array is used as the optical port, and the other two ports are respectively coupled with the optical receiving assembly and the optical transmitting assembly. According to the ONT optical module based on COB packaging, the optical emission component, the optical port and the optical receiving component which are independently arranged are connected through the optical fiber array, only one-time coupling is needed, no sequential division is needed, synchronous operation can be performed, and the production efficiency is improved; through the COB packaged silicon optical chip, multi-wavelength signal transmission can be realized.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an ONT optical module based on COB encapsulation.
Background
The PON network is an access network, and is applied to an optical distribution network formed by a passive optical cable, an optical splitter/combiner, and the like between a local side device (OLT) and a plurality of user side devices (ONU/ONTs). The ONT is used as a main component of an access network in a large number of applications in data, multimedia and integrated service demands, and the demand of the ONT is increasing. The traditional 10G ONT adopts a BOSA packaging structure, and the structure cannot be compatible with multi-wavelength signal transmission. In the process, the BOSA coupling mode is to couple the transmitting component and then couple the receiving component, so that the BOSA coupling mode cannot be synchronously performed, and the production efficiency is low.
Disclosure of Invention
The invention aims to provide an ONT optical module based on COB encapsulation, which at least can solve part of defects in the prior art.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the utility model provides an ONT optical module based on COB encapsulation, includes optical receiving module, optical emission subassembly, light mouth and fiber array, one of them port of fiber array is as the light mouth, and two other ports couple optical receiving module and optical emission subassembly respectively.
Further, the light receiving assembly, the light emitting assembly, the light port and the optical fiber array are located in the same plane.
Further, the light port and the light emitting assembly are not on the same axis, and the light port and the light emitting assembly are arranged side by side.
Further, the light port and the light emitting assembly are arranged in parallel at intervals.
Further, the light receiving assembly is located on a side of the optical fiber array away from the light port.
Further, the light receiving assembly includes a silicon optical chip having a PD and a WDM integrated therein.
Further, the light receiving assembly further comprises a TEC, and the silicon optical chip is arranged on the TEC.
Further, the light receiving assembly further comprises a thermistor and a transition block which are arranged on the TEC, and the transition block is located on one side of the silicon optical chip.
Further, a pressing block is arranged on the silicon optical chip and used for connecting the optical fiber array and the silicon optical chip.
Further, the light receiving assembly is covered with a cover.
Compared with the prior art, the invention has the beneficial effects that:
1. the optical fiber array is connected with the independently existing optical emission component, optical port and optical receiving component, only one-time coupling is needed, no sequential division is needed, synchronous operation can be performed, and production efficiency is improved.
2. Through the COB packaged silicon optical chip, multi-wavelength signal transmission can be realized.
Drawings
Fig. 1 is a schematic diagram of an ONT optical module based on COB package (with an upper cover removed) according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an optical receiving assembly of an ONT optical module based on COB package according to an embodiment of the present invention;
In the reference numerals: 1-a light emitting assembly; 2-a light receiving assembly; 3-optical port; 4-an optical fiber array; a 5-silicon optical chip; 6-TEC; 7-a thermistor; 8-a transition block; 9-briquetting; 10-TIA; 11-a cover; 12-PCB board.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 and 2, an embodiment of the present invention provides an ONT optical module based on COB package, which includes an optical receiving module 2, an optical transmitting module 1, an optical port 3, and an optical fiber array 4, wherein one port of the optical fiber array 4 is used as the optical port 3, and the other two ports are respectively coupled to the optical receiving module 2 and the optical transmitting module 1. In this embodiment, the optical fiber array 4 connects the optical transmitting assembly 1, the optical port 3 and the optical receiving assembly 2 which are independently present, only one coupling is needed, and no sequential division is needed, so that the production efficiency is improved. Specifically, the optical fiber array 4 is arranged on the circuit board, the optical emission component 1 and the optical receiving component 2 are coupled and connected through the optical fiber array 4 to input and output optical signals, then the electric port connection is carried out through the golden finger, and the transmission of electric signals is controlled by the PCB 12, so that the transmission and conversion of photoelectric signals are realized. The traditional 10G ONT adopts a BOSA packaging structure, and the structure needs to be coupled twice and has sequential division, so that the 10G ONT cannot be synchronously carried out, and the production efficiency is reduced.
The following are specific examples:
With reference to fig. 1 and 2, the light receiving assembly 2, the light emitting assembly 1, the light port 3 and the optical fiber array 4 are located on the same plane, the light port 3 and the light emitting assembly 1 are not on the same axis, and the light port 3 and the light emitting assembly 1 are arranged side by side. The light ports 3 and the light emitting assembly 1 are arranged in parallel at intervals. In this embodiment, the light receiving component 2, the light emitting component 1, the light port 3 and the optical fiber array 4 are all designed in the same plane by COB packaging, and do not share one optical center, so that the production efficiency can be improved compared with the existing coaxial packaging. The light emitting component 1, the light port 3 and the light receiving component 2 of the embodiment are all independent, and the light emitting component 1 and the light receiving component 2 are not coaxially arranged, so that the structure can be coupled in place at one time, the light emitting component 1 and the light receiving component 2 can be synchronously carried out, the light emitting component 1 and the light receiving component 2 are not interfered with each other, and the production efficiency is greatly improved.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and 2, the light receiving assembly 2 is located on a side of the optical fiber array 4 away from the light port 3. In this embodiment, the light receiving module 2 is disposed on the side of the optical fiber array 4 away from the light port 3, which facilitates the layout on the PCB board 12, and facilitates the connection of the optical fiber array 4 with the light receiving module 2 and the light port 3, respectively.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and 2, the optical receiving assembly 2 includes a silicon optical chip 5, and a PD (detector) and a WDM (wavelength division multiplexer) are integrated in the silicon optical chip 5. In the present embodiment, the light receiving element 2 may include a silicon optical chip 5, and the silicon optical chip 5 integrates PD and WDM to have functions of PD and WDM. Moreover, since the light receiving assembly 2, the light emitting assembly 1, the light port 3 and the optical fiber array 4 are located in the same plane, the silicon optical chip 5 can be adopted, and the silicon optical chip 5 cannot be adopted in the conventional coaxial arrangement. While the present embodiment enables multiple wavelength choices by integrating PD and WDM with the silicon optical chip 5, the conventional coaxial arrangement can only have one wavelength choice, since the present silicon optical chip 5 integrates WDM and can have filtering capability.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and 2, the light receiving assembly 2 further includes a TEC6, and the silicon optical chip 5 is disposed on the TEC 6. In the present embodiment, by providing a TEC6 (thermoelectric cooler) under the silicon optical chip 5, since a variety of wavelengths are possible to select, the TEC6 can stabilize the wavelength and satisfy the required wavelength by adjusting the temperature. Preferably, the light emitting component 1 also comprises a TEC, and the light emitting component 1 can select various wavelengths, and the TEC can stabilize the wavelength and meet the required wavelength by adjusting the temperature.
With further optimization of the above-mentioned scheme, referring to fig. 1 and 2, the light receiving component 2 further includes a thermistor 7 and a transition block 8 disposed on the TEC6, where the transition block 8 is located on one side of the silicon optical chip 5. In this embodiment, the thermistor 7 can sense temperature, and the transition block 8 can lead out the gold wire on the silicon optical chip 5, so as to facilitate wire bonding.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and 2, the silicon optical chip 5 is provided with a pressing block 9. The silicon optical chip 5 is provided with a TIA10 (transimpedance amplifier) on a side remote from the optical fiber array 4. In this embodiment, the pressing block 9 is used to connect the optical fiber array 4 and the silicon optical chip 5, and when in operation, the pressing block is firstly adhered to the silicon optical chip 5, and then the optical fiber array 4 is fixed by glue on the side edge point of the pressing block 9 after coupling.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and 2, the light receiving component 2 is covered with a cover 11. In the present embodiment, the cover 11 can protect the light receiving element 2 on the light receiving element 2. Preferably, the optical fiber array 4 is also within the range of the cover 11.
The specific packaging process is as follows:
1. Packaging the transmitting assembly with refrigeration according to the performance requirement of the module, wherein the transmitting assembly can be coaxially packaged by adopting a conventional TOSA; 2. adopting COB packaging, and assembling and fixing a silicon optical chip 5, a TIA10, a transition block 8, a TEC6 and a thermistor 7 on a PCBA board by using glue according to the patch position and the wire bonding requirement; 3. fixedly connecting the transmitting assembly to the PCBA; 4. connecting the optical ports 3 of one optical port 3TOSA (transmitting) of the optical fiber array 4 together, starting the optical fiber array 4 to be coupled with the silicon optical chip 5 and fixing the optical fiber array 4 on the PCBA board by using glue, wherein the other optical port 3 of the optical fiber array 4 is used for inputting and outputting optical signals of the whole module; 5. and placing the optical device after coupling into a tube shell and a cover plate to complete the module packaging.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An ONT optical module based on COB encapsulation, its characterized in that: including optical receiving module, optical emission subassembly, optical port and optical fiber array, one of them port of optical fiber array is as the optical port, and two other ports couple optical receiving module and optical emission subassembly respectively, optical receiving module optical emission subassembly optical port with optical fiber array is located the coplanar, optical port with optical emission subassembly is not on the same axis, just optical port with optical emission subassembly sets up side by side, optical receiving module includes the silicon optical chip, be equipped with the briquetting on the silicon optical chip, the briquetting is used for connecting optical fiber array with the silicon optical chip, optical fiber array is connected respectively through two optic fibers the optical port with optical emission subassembly.
2. The COB-package-based ONT optical module of claim 1, wherein: the light port and the light emitting component are arranged in parallel at intervals.
3. The COB-package-based ONT optical module of claim 1, wherein: the light receiving assembly is positioned on one side of the optical fiber array away from the light port.
4. The COB-package-based ONT optical module of claim 1, wherein: the silicon optical chip has integrated therein a PD and a WDM.
5. The COB-package-based ONT optical module of claim 1, wherein: the light receiving assembly further comprises a TEC, and the silicon optical chip is arranged on the TEC.
6. The COB-package-based ONT optical module of claim 5, wherein: the light receiving assembly further comprises a thermistor and a transition block which are arranged on the TEC, and the transition block is located on one side of the silicon optical chip.
7. The COB-package-based ONT optical module of claim 1, wherein: the light receiving assembly is covered with a cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210770320.XA CN115327711B (en) | 2022-06-30 | 2022-06-30 | ONT optical module based on COB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210770320.XA CN115327711B (en) | 2022-06-30 | 2022-06-30 | ONT optical module based on COB encapsulation |
Publications (2)
| Publication Number | Publication Date |
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| CN115327711A CN115327711A (en) | 2022-11-11 |
| CN115327711B true CN115327711B (en) | 2024-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210401753U (en) * | 2019-08-13 | 2020-04-24 | 苏州旭创科技有限公司 | Optical transceiver module and optical module |
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
| CN112965183A (en) * | 2021-03-11 | 2021-06-15 | 宁波芯速联光电科技有限公司 | Silicon optical module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407230A (en) * | 2018-12-04 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN110474688A (en) * | 2019-08-16 | 2019-11-19 | 武汉光迅信息技术有限公司 | A kind of optical module |
| CN111061019A (en) * | 2019-12-02 | 2020-04-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN114647037A (en) * | 2020-12-17 | 2022-06-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210401753U (en) * | 2019-08-13 | 2020-04-24 | 苏州旭创科技有限公司 | Optical transceiver module and optical module |
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
| CN112965183A (en) * | 2021-03-11 | 2021-06-15 | 宁波芯速联光电科技有限公司 | Silicon optical module |
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| CN115327711A (en) | 2022-11-11 |
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