CN115319110B - 一种陶瓷增强金属基复合材料及其增材制造方法 - Google Patents
一种陶瓷增强金属基复合材料及其增材制造方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 81
- 239000011156 metal matrix composite Substances 0.000 title claims abstract description 37
- 239000000654 additive Substances 0.000 title claims abstract description 33
- 230000000996 additive effect Effects 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 title abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 80
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 229910017053 inorganic salt Inorganic materials 0.000 claims abstract description 51
- 239000012266 salt solution Substances 0.000 claims abstract description 44
- 239000002245 particle Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 238000011065 in-situ storage Methods 0.000 claims abstract description 14
- 238000005979 thermal decomposition reaction Methods 0.000 claims abstract description 12
- 239000011265 semifinished product Substances 0.000 claims abstract description 11
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 10
- 239000002131 composite material Substances 0.000 claims abstract description 3
- 238000005245 sintering Methods 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 18
- 239000011777 magnesium Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 6
- 229910020489 SiO3 Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000003870 refractory metal Substances 0.000 claims description 3
- 229910000601 superalloy Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000000197 pyrolysis Methods 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 abstract description 15
- 238000005728 strengthening Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005054 agglomeration Methods 0.000 abstract description 5
- 230000002776 aggregation Effects 0.000 abstract description 5
- 230000008021 deposition Effects 0.000 abstract description 5
- 238000004663 powder metallurgy Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 17
- 238000003892 spreading Methods 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 10
- 230000007480 spreading Effects 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 8
- 230000003014 reinforcing effect Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000001351 cycling effect Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000883 Ti6Al4V Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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- B33Y80/00—Products made by additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
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- C22C32/0031—Matrix based on refractory metals, W, Mo, Nb, Hf, Ta, Zr, Ti, V or alloys thereof
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Abstract
本发明属于多材料增材制造相关技术领域，其公开了一种陶瓷增强金属基复合材料及其增材制造方法，所述方法包括以下步骤：(1)将无机盐溶液均匀地沉积到金属基半成品上，所述金属基半成品是对铺设的金属基粉末进行激光烧结得到的；(2)对步骤(1)得到的金属基半成品进行加热，使得无机盐溶液受热分解而原位形成陶瓷相颗粒，进而得到陶瓷增强金属基复合材料。其中无机盐溶液中溶质是均匀溶解的，因而在受热分解时产生的陶瓷增强颗粒在整个金属基体上的分布是极为均匀的，相比目前的粉末冶金、增材制造方式，无需人工混合金属基粉末和陶瓷颗粒，避免了陶瓷颗粒的沉积和团聚，强化作用显著。
Description
技术领域
本发明属于多材料增材制造相关技术领域，更具体地，涉及一种陶瓷增强金属基复合材料及其增材制造方法。
背景技术
陶瓷增强金属基复合材料，是以陶瓷颗粒作为增强相，通过工艺使其连续均匀分散到金属基体中成形的复合材料。陶瓷增强金属基复合材料具备金属的延展性和韧性，同时又表现出高的强度和刚度。常见的陶瓷增强相包括Al2O3、B4C、BeO、NbC、SiC、TaC、TiB、TiC、WC等，这些增强相与Al、Co、Ti、Fe、Cu、Mg、Ni等金属形成了多种金属基复合材料，广泛适用于航空航天、汽车领域中高负载、高磨损、高温环境中，成为重要的产业材料。
目前，常见的陶瓷增强金属基复合材料加工方法包括搅拌铸造法、粉末冶金法、挤压铸造法、喷射成形法等。但上述方式都存在一定的缺点，如搅拌铸造法容易造成陶瓷颗粒沉积和团聚，引入气孔；粉末冶金法成本较高，不适合加工形状复杂的零件；挤压铸造法难加工大尺寸零件等。近年来，增材制造技术的兴起，使得陶瓷增强金属基复合材料有了一个新的加工途径。增材制造能够满足复杂几何零件的自由成形，满足陶瓷增强金属基复合材料的加工需求。目前，通过增材制造加工零件的主要过程为：通过预先混合金属基粉末和陶瓷增强相颗粒，然后激光烧结成形。但在粉末混合的过程中，增强颗粒和金属基体之间的相容性、颗粒表面污染、表面化学处理过程、以及两种粉末能否充分混合，是否会造成颗粒沉积和团聚的现象，都是需要考虑的因素，这使得增材制造难以充分发挥增强相的优势。
综上所述，现有的陶瓷增强金属基复合材料缺乏一种高效快速的加工方法。
发明内容
针对现有技术的以上缺陷或改进需求，本发明提供了一种陶瓷增强金属基复合材料及其增材制造方法，其在传统的粉末熔融技术基础上，通过引入无机盐溶液，而无机盐溶液受热分解原位形成陶瓷相颗粒，得到了陶瓷增强金属基复合材料。
为实现上述目的，按照本发明的一个方面，提供了一种陶瓷增强金属基复合材料的增材制造方法，所述方法包括以下步骤：
(1)将无机盐溶液均匀地沉积到金属基半成品上，所述金属基半成品是对铺设的金属基粉末进行激光烧结得到的；
(2)对步骤(1)得到的金属基半成品进行加热，使得无机盐溶液受热分解而原位形成陶瓷相颗粒，进而得到陶瓷增强金属基复合材料。
进一步地，得到陶陶瓷相颗粒后进行整体烧结，使得陶瓷颗粒进一步弥散分布，以得到所述陶瓷增强金属基复合材料。
进一步地，整体烧结温度选择800℃-1000℃。
进一步地，无机盐溶液为Al2(SO4)3溶液、饱和Mg(OH)2溶液、H2SiO3溶液中的任一种。
进一步地，步骤(2)中采用的加热温度为250℃-350℃，该加热温度高于无机盐溶液的热解温度。
进一步地，激光烧结时，激光功率P为100W-400W，激光扫描速度V为300mm/s-1000mm/s，激光填充间距h为0.1mm-0.12mm，层厚u为30-50μm。
进一步地，所述金属基粉末为铝基粉末、镁基粉末、铜基粉末、铁基粉末、钛基粉末、镍基粉末、高温合金基粉末、以及难熔金属基粉末中的任一种或者多种。
进一步地，金属基粉末铺设时采用的铺粉层厚为30μm～50μm。
进一步地，采用螺杆挤出机将无机盐溶液沉积到金属基半成品上，螺杆挤出机挤出的溶液厚度在40μm。
按照本发明的另一个方面，提供了一种陶瓷增强金属基复合材料，该陶瓷增强金属基复合材料是采用如上所述的陶瓷增强金属基复合材料的增材制造方法制造而成的。
总体而言，通过本发明所构思的以上技术方案与现有技术相比，本发明提供的陶瓷增强金属基复合材料及其增材制造方法主要包括以下步骤：
1.无机盐溶液中溶质是均匀溶解的，因而在受热分解时产生的陶瓷增强颗粒在整个金属基体上的分布是极为均匀的，相比目前的粉末冶金、增材制造方式，无需人工混合金属基粉末和陶瓷颗粒，避免了陶瓷颗粒的沉积和团聚，强化作用显著。
2.在整个激光加工过程中，加工工艺是针对金属基材料制定的，不需要考虑陶瓷颗粒的微观形状，因为非球形的颗粒会影响铺粉过程的均匀性，省去了陶瓷颗粒的制粉过程，降低了成本；同时也不需要考虑陶瓷颗粒和金属基体之间在高温下的化学反应及颗粒表面的污染问题。
3.本发明相对于传统的陶瓷增强金属基复合材料加工方法，工艺简单高效，且在复杂构件的成形方面具有很大的优势。
4、采用合适的加热温度，使得无机盐溶液能够热分解，继而顺利完成陶瓷相颗粒的原位生成；整体烧结温度选择800℃-1000℃，该温度高于无机盐溶液的热分解温度，在该温度下保温可以保证残余无机盐的全部分解，并原位弥散分布于金属基体内部，起到弥散强化的作用。
附图说明
图1是本发明用到的增材制造设备的示意图；
图2是本发明提供的一种陶瓷增强金属基复合材料的增材制造方法的流程示意图。
在所有附图中，相同的附图标记用来表示相同的元件或结构，其中：1-激光器，2-激光，3-聚焦透镜，4-振镜，5-加热装置，6-金属基粉末，7-粉缸升降平台，8-工作缸升降平台，9-成形零件，10-铺粉滚轮，11-螺杆挤出机。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。此外，下面所描述的本发明各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。
请参阅图1及图2，本发明提供了一种陶瓷增强金属基复合材料的增材制造方法，所述方法在传统的粉末床熔融技术基础上，在每层金属基粉末烧结后，通过螺杆挤出机引入无机盐溶液，无机盐溶液受热分解原位形成陶瓷相颗粒，由于溶质在溶液中均匀分布，由此受热分解得到的陶瓷相颗粒均匀分布于金属基体上，起弥散强化的作用，因而得到陶瓷增强金属基复合材料。相比目前的粉末冶金、增材制造方式，无需人工混合金属基粉末和陶瓷颗粒，避免了陶瓷颗粒的沉积和团聚，强化作用显著。而且在加工时不需要考虑陶瓷颗粒的微观形状，因为非球形的颗粒会影响铺粉过程的均匀性，省去了陶瓷颗粒的制粉过程，降低了成本。同时也不需要考虑陶瓷颗粒和金属基体之间在高温下的化学反应以及颗粒表面的污染问题。
所述方法主要包括以下步骤：
步骤一，铺粉：利用铺粉滚轮将金属基粉末进行铺粉。
本实施方式中，采用的增材制造设备包括激光器1、聚焦透镜3、振镜4、加热装置5、粉缸升降平台7、工作缸升降平台8、铺粉滚轮10及螺杆挤出机11，所述激光器1用于发射激光2。所述聚焦振镜3与所述振镜4相邻设置，所述加热装置5设置在所述工作缸升降平台8上方。所述铺粉滚轮10与所述螺杆挤出机11相邻设置，且位于所述工作缸升降平台8的一侧。所述粉缸升降平台7位于所述工作缸升降平台8的外侧，其用于收容金属基粉末6。成形零件9最后形成在所述工作缸升降平台7上。
本实施方式中，金属基粉末包括铝基、镁基、铜基、铁基、钛基、镍基、高温合金基、以及难熔金属基等金属基粉末，铺粉滚轮铺送的一个铺粉层厚为30μm～50μm。
步骤二，激光烧结，采用合适的激光工艺参数烧结预铺的金属基粉末。
合适的激光工艺参数为：激光功率P为100W-400W，激光扫描速度V为300mm/s-1000mm/s，激光填充间距h为0.1mm-0.12mm，层厚u为30-50μm。
步骤三，沉积无机盐溶液：利用螺杆挤出机将配置好的无机盐溶液定量的沉积到烧结后的金属基零件表面上。
本实施方式中，沉积的无机盐溶液主要为Al2(SO4)3溶液、饱和Mg(OH)2溶液、H2SiO3溶液等能够受热分解形成陶瓷相的盐溶液。螺杆挤出机挤出的溶液厚度在40μm左右。
步骤四，加热烘干：利用加热装置提供热量以使得无机盐溶液受热分解而形成陶瓷相颗粒，并将沉积的无机盐溶液中的酒精/水分蒸发，防止影响下一次铺粉操作。
加热装置提供的表面温度控制在无机盐热分解温度以上，一般取250℃-350℃，因材料而异。
步骤五，转至步骤一，直至零件全部打印完成。
步骤六，整体烧结：将打印完毕的零件放入高温炉中烧结，使得陶瓷颗粒进一步弥散分布，起强化的作用。
整体烧结温度选择800℃-1000℃，该温度高于无机盐溶液的热分解温度，在该温度下保温可以保证残余无机盐的全部分解，并原位弥散分布于金属基体内部，起到弥散强化的作用。
本发明还提供了一种陶瓷增强金属基复合材料，该陶瓷增强金属基复合材料是采用如上所述的陶瓷增强金属基复合材料的增材制造方法制造而成的。
以下以几个具体实施例来对本发明进行进一步的详细说明。
实施例1
本发明实施例1提供的一种陶瓷增强金属基复合材料的增材制造方法，包括以下步骤：
(1)铺粉：利用铺粉滚轮10将金属基粉末材料铺送至加工平台上；
(2)激光烧结：采用合适的激光工艺参数烧结预铺的金属基粉末；
(3)沉积无机盐溶液：利用螺杆挤出机11将配置好的无机盐溶液定量的沉积到烧结后的金属基零件表面；
(4)加热烘干：利用加热装置5提供热量，使无机盐溶液受热分解，形成陶瓷相颗粒，并将沉积的无机盐溶液中的酒精/水分蒸发，防止影响下一次铺粉操作；
(5)循环步骤(1)-(4)，直至零件全部打印完成；
(6)整体烧结：将打印完毕的零件放入高温炉中烧结，使得陶瓷颗粒进一步弥散分布，起强化的作用。
进一步地，在步骤(1)中，金属基粉末为CuSn10粉末，铺粉滚轮铺送的一个铺粉层厚为50μm。
进一步地，在步骤(2)中，合适的激光工艺参数为：激光功率P为400W，激光扫描速度V为500mm/s，激光填充间距h为0.12mm，层厚u为50μm。
进一步地，在步骤(3)中，沉积的无机盐溶液为Al2(SO4)3盐溶液。根据受热分解方程式：Al2(SO4)3→Al2O3+3SO3，分解产生的Al2O3陶瓷相会原位分布于CuSn10基体上。螺杆挤出机挤出的溶液厚度为40μm。
进一步地，在步骤(4)中，加热装置提供的表面温度控制在无机盐热分解温度以上，取为300℃。
进一步地，在步骤(6)中，整体烧结温度选择800℃，在该温度下保温可以保证残余无机盐的全部分解，并原位弥散分布于金属基体内部，起到弥散强化的作用。
实施例2
本发明实施例2提供的一种陶瓷增强金属基复合材料的增材制造方法，包括以下步骤：
(1)铺粉：利用铺粉滚轮10将金属基粉末材料铺送至加工平台上；
(2)激光烧结：采用合适的激光工艺参数烧结预铺的金属基粉末；
(3)沉积无机盐溶液：利用螺杆挤出机11将配置好的无机盐溶液定量的沉积到烧结后的金属基零件表面；
(4)加热烘干：利用加热装置5提供热量，使无机盐溶液受热分解，形成陶瓷相颗粒，并将沉积的无机盐溶液中的酒精/水分蒸发，防止影响下一次铺粉操作；
(5)循环步骤(1)-(4)，直至零件全部打印完成；
(6)整体烧结：将打印完毕的零件放入高温炉中烧结，使得陶瓷颗粒进一步弥散分布，起强化的作用。
进一步地，在步骤(1)中，金属基粉末为316L钢粉末，铺粉滚轮铺送的一个铺粉层厚为50μm。
进一步地，在步骤(2)中，合适的激光工艺参数为：激光功率P为320W，激光扫描速度V为650mm/s，激光填充间距h为0.14mm，层厚u为50μm。
进一步地，在步骤(3)中，沉积的无机盐溶液为饱和Mg(OH)2溶液。根据受热分解方程式：Mg(OH)2→MgO+H2O，分解产生的MgO陶瓷相会原位分布于316L基体上。螺杆挤出机挤出的溶液厚度为40μm。
进一步地，在步骤(4)中，加热装置提供的表面温度控制在无机盐热分解温度以上，取为350℃。
进一步地，在步骤(6)中，整体烧结温度选择1000℃，在该温度下保温可以保证残余无机盐的全部分解，并原位弥散分布于金属基体内部，起到弥散强化的作用。
实施例3
本发明实施例3提供的一种陶瓷增强金属基复合材料的增材制造方法，包括以下步骤：
(1)铺粉：利用铺粉滚轮10将金属基粉末材料铺送至加工平台上；
(2)激光烧结：采用合适的激光工艺参数烧结预铺的金属基粉末；
(3)沉积无机盐溶液：利用螺杆挤出机11将配置好的无机盐溶液定量的沉积到烧结后的金属基零件表面；
(4)加热烘干：利用加热装置5提供热量，使无机盐溶液受热分解，形成陶瓷相颗粒，并将沉积的无机盐溶液中的酒精/水分蒸发，防止影响下一次铺粉操作；
(5)循环步骤(1)-(4)，直至零件全部打印完成；
(6)整体烧结：将打印完毕的零件放入高温炉中烧结，使得陶瓷颗粒进一步弥散分布，起强化的作用。
进一步地，在步骤(1)中，金属基粉末为Ti6Al4V粉末，铺粉滚轮铺送的一个铺粉层厚为40μm。
进一步地，在步骤(2)中，合适的激光工艺参数为：激光功率P为275W，激光扫描速度V为760mm/s，激光填充间距h为0.12mm，层厚u为40μm。
进一步地，在步骤(3)中，沉积的无机盐溶液为H2SiO3溶液。根据受热分解方程式：H2SiO3→SiO2+H2O，分解产生的SiO2陶瓷相会原位分布于Ti6Al4V基体上。螺杆挤出机挤出的溶液厚度为40μm。
进一步地，在步骤(4)中，加热装置提供的表面温度控制在无机盐热分解温度以上，取为250℃。
进一步地，在步骤(6)中，整体烧结温度选择900℃，在该温度下保温可以保证残余无机盐的全部分解，并原位弥散分布于金属基体内部，起到弥散强化的作用。
本领域的技术人员容易理解，以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。
Claims (8)
1.一种陶瓷增强金属基复合材料的增材制造方法，其特征在于，该方法包括以下步骤：
(1)将无机盐溶液均匀地沉积到金属基半成品上，所述金属基半成品是对铺设的金属基粉末进行激光烧结得到的；
(2)对步骤(1)得到的金属基半成品进行加热，使得无机盐溶液受热分解而原位形成陶瓷相颗粒，进而得到陶瓷增强金属基复合材料；
得到陶瓷相颗粒后进行整体烧结，使得陶瓷颗粒进一步弥散分布，以得到所述陶瓷增强金属基复合材料；整体烧结温度选择800℃-1000℃，且高于无机盐溶液的热分解温度。
2.如权利要求1所述的陶瓷增强金属基复合材料的增材制造方法，其特征在于：无机盐溶液为Al2(SO4)3溶液、饱和Mg(OH)2溶液、H2SiO3溶液中的任一种。
3.如权利要求1所述的陶瓷增强金属基复合材料的增材制造方法，其特征在于：步骤(2)中采用的加热温度为250℃-350℃，该加热温度高于无机盐溶液的热解温度。
4.如权利要求1所述的陶瓷增强金属基复合材料的增材制造方法，其特征在于：激光烧结时，激光功率P为100W-400W，激光扫描速度V为300mm/s-1000mm/s，激光填充间距h为0.1mm-0.12mm，层厚u为30-50μm。
5.如权利要求1-4任一项所述的陶瓷增强金属基复合材料的增材制造方法，其特征在于：所述金属基粉末为铝基粉末、镁基粉末、铜基粉末、铁基粉末、钛基粉末、镍基粉末、高温合金基粉末、以及难熔金属基粉末中的任一种或者多种。
6.如权利要求1-4任一项所述的陶瓷增强金属基复合材料的增材制造方法，其特征在于：金属基粉末铺设时采用的铺粉层厚为30μm～50μm。
7.如权利要求1-4任一项所述的陶瓷增强金属基复合材料的增材制造方法，其特征在于：采用螺杆挤出机将无机盐溶液沉积到金属基半成品上，螺杆挤出机挤出的溶液厚度在40μm。
8.一种陶瓷增强金属基复合材料，其特征在于：该陶瓷增强金属基复合材料是采用权利要求1-7任一项所述的陶瓷增强金属基复合材料的增材制造方法制造而成的。
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| CN108772568A (zh) * | 2018-05-25 | 2018-11-09 | 迈特李新材料(广州)有限公司 | 一种用于3d打印的金属基纳米复合材料粉末的制备方法 |
| CN110877427A (zh) * | 2018-09-06 | 2020-03-13 | 西安交通大学 | 一种含有空心陶瓷球的复合材料及其制备方法 |
| CN113277856A (zh) * | 2021-05-26 | 2021-08-20 | 西安交通大学 | 一种陶瓷与高温合金复合构件及其制造方法 |
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