CN115315085A - Process for improving gold finger matte ink shedding - Google Patents
Process for improving gold finger matte ink shedding Download PDFInfo
- Publication number
- CN115315085A CN115315085A CN202211120755.6A CN202211120755A CN115315085A CN 115315085 A CN115315085 A CN 115315085A CN 202211120755 A CN202211120755 A CN 202211120755A CN 115315085 A CN115315085 A CN 115315085A
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- Prior art keywords
- circuit board
- ink
- improving
- printing
- shedding
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a process for improving the shedding of ink on the matte surface of a golden finger, which comprises the following steps: a. pre-treatment of solder mask: cleaning the copper surface of the circuit board by a grinding plate and a sand blasting line in sequence to ensure that the roughness of the copper surface is more than 0.3um; b. solder mask printing: printing ink on the copper surface of the circuit board by a printer; c. solder mask exposure: carrying out photocuring on the circuit board ink by using ultraviolet rays of an exposure machine; d. solder mask development: enabling the circuit board to pass through a developing machine, and enabling potassium carbonate liquid medicine in the developing machine to develop the redundant printing ink completely; e. baking after welding prevention: baking the circuit board to enable the printing ink to be thermoset; f. gold electroplating: plating gold on the golden finger area of the circuit board by using gantry type electroplating equipment; g. pressing a character plate: and pressing the circuit board by a plate pressing machine to ensure that the bending and warping degree of the circuit board is less than 0.3%. The process for improving the gold finger matte ink shedding reduces the whole factory scrap by 0.2 percent and reduces the rework rate by 0.35 percent.
Description
Technical Field
The invention relates to the technical field of circuit board printing, in particular to a process for improving the shedding of ink on a gold finger matte surface.
Background
With the progress and development of industrial technology, the requirements of customers on products are higher and higher, the customers clearly require the ink to use the matte ink, the plate warping has strict requirements, and the technological parameters are optimized to meet the requirements of the customers.
Disclosure of Invention
The invention aims to overcome and supplement the defects in the prior art, and provides a process for improving gold finger matte ink shedding, which can meet the requirements of improving scrappage and rework of gold finger matte ink shedding, and reduces the scrappage of the whole plant by 0.2% and the rework rate by 0.35%.
A process for improving the ink shedding of the matte surface of a golden finger comprises the following steps: the method comprises the following steps:
a. pretreatment of solder resist: cleaning the copper surface of the circuit board by a grinding plate and a sand blasting line in sequence to increase the adhesive force between the ink and the copper surface, so that the roughness of the copper surface is more than 0.3um;
b. solder mask printing: printing ink on the copper surface of the circuit board by a printer, and increasing the thickness of the ink by adopting a 90-mesh screen plate;
c. solder mask exposure: carrying out photocuring on the circuit board ink by ultraviolet rays of an exposure machine, and setting exposure energy at 9-11 grids to avoid the ink falling off after development;
d. solder mask development: the circuit board passes through a developing machine, so that the residual ink is developed completely by potassium carbonate liquid medicine in the developing machine, and poor ink falling is avoided;
e. baking after welding prevention: baking the circuit board to enable the ink to be thermally cured, so as to prevent the later process liquid medicine from attacking the ink;
f. gold electroplating: gold is plated on the golden finger area of the circuit board through gantry type electroplating equipment, so that the requirement on gold thickness can be met, and the attack to ink can be reduced;
g. pressing a plate by characters: and pressing the circuit board by a pressing plate machine to ensure that the bending and warping degree of the circuit board is less than 0.3 percent, and leveling the board.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: in the step a, the line speed of the pretreatment of cleaning the copper surface by sequentially passing through a grinding plate and a sand blasting line is 1.0-2.0 m/min.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: and b, printing the ink on the copper surface of the circuit board by adopting a 90-mesh screen printing plate, wherein the printing speed is 2-4 m/min, the angle of a printing scraper is 0-20 degrees, and the pressure of the printing scraper is 0.2-0.3 Mpa.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: and c, the exposure energy grids in the step c are 9-11 grids.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: in the step d, the developing point is 30-50%, and the developing linear speed is 3-4 m/min.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: in the step e, the baking temperature is 140-150 ℃, and the baking time is 60-80 min.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: and f, gold plating the gold finger area of the circuit board at the linear speed of 1.0-2.0 m/min.
Preferably, the process for improving the ink shedding of the matte surface of the gold finger comprises the following steps: and g, pressing the plate at 145-155 ℃ for 120-150 min.
The invention has the advantages that:
the invention relates to a process for improving the ink drop of a gold finger matte surface, which comprises the steps of cleaning the copper surface of a circuit board to increase the adhesive force between the ink and the copper surface, increasing the ink thickness by using a 90-mesh screen plate in the solder mask printing, setting exposure energy grids at 9-11 through solder mask exposure, setting to prevent the ink from dropping after development, developing excess ink of the circuit board through potassium carbonate liquid medicine in a developing machine, baking the ink by the circuit board at high temperature to thermally cure the ink, preventing the ink from being attacked by the subsequent process liquid medicine, plating gold wires on the circuit board through gantry type electroplating gold wires, plating gold on a gold finger area, meeting the requirement on gold thickness and reducing the attack on the ink, enabling the circuit board to pass through a vertical press plate, using a high-temperature press plate, leveling parts, bending and warping the board by less than 0.3%, reducing the scrap rate of the whole plant by 0.2%, and reducing the rework rate by 0.35%.
Detailed Description
The present invention will be further described with reference to the following specific examples.
Example 1
A process for improving the shedding of ink on the matte surface of a golden finger comprises the following steps:
a. pretreatment of solder resist: cleaning the copper surface of the circuit board by a grinding plate and a sand blasting line in sequence, wherein the pretreatment line speed is 1.0m/min, so that the roughness of the copper surface is more than 0.3um;
b. solder mask printing: printing ink on the copper surface of the circuit board by a printing machine, adopting a 90-mesh screen plate, controlling the printing speed to be 2m/min, controlling the angle of a printing scraper to be 0 degrees, controlling the pressure of the printing scraper to be 0.2Mpa, and increasing the thickness of the ink by using the 90-mesh screen plate;
c. solder mask exposure: carrying out photocuring on the circuit board ink by ultraviolet rays of an exposure machine, wherein the exposure energy is 9 grids, and the exposure energy is set to avoid the ink falling off after development;
d. solder mask development: enabling the circuit board to pass through a developing machine, controlling a developing point to be 30%, and controlling the developing linear speed to be 3m/min, so that the excessive ink is developed completely by potassium carbonate liquid medicine in the developing machine;
e. baking after welding prevention: baking the circuit board at the baking temperature of 140 ℃ for 60min to thermally cure the ink;
f. gold electroplating: plating gold on the golden finger area of the circuit board by a gantry type electroplating device at the linear speed of 1.5 m/min;
g. pressing a plate by characters: and (3) pressing the circuit board by a pressing machine, wherein the pressing temperature is 145 ℃, the pressing time is 135min, and the bending degree of the circuit board is less than 0.3%.
Example 2
A process for improving the shedding of ink on the matte surface of a golden finger comprises the following steps:
a. pretreatment of solder resist: cleaning the copper surface of the circuit board by a grinding plate and a sand blasting line in sequence, wherein the pretreatment line speed is 1.5m/min, so that the roughness of the copper surface is more than 0.3um;
b. solder mask printing: printing ink on the copper surface of the circuit board by a printing machine, adopting a 90-mesh screen plate, controlling the printing speed to be 3m/min, controlling the angle of a printing scraper to be 0 degrees, controlling the pressure of the printing scraper to be 0.2Mpa, and increasing the thickness of the ink by using the 90-mesh screen plate;
c. solder mask exposure: carrying out photocuring on the circuit board ink by ultraviolet rays of an exposure machine, wherein the exposure energy is in a grid of 10;
d. solder mask development: enabling the circuit board to pass through a developing machine, controlling the developing point to be 40%, and controlling the developing linear speed to be 3.5m/min, so that the excessive ink is developed completely by potassium carbonate liquid medicine in the developing machine;
e. and (3) preventing postweld baking: baking the circuit board at 145 ℃ for 70min to thermally cure the ink;
f. gold electroplating: plating gold on the golden finger area of the circuit board by a gantry type electroplating device at a linear speed of 1.5 m/min;
g. pressing a plate by characters: and (3) pressing the circuit board by a pressing plate machine, wherein the pressing plate temperature is 145 ℃, and the pressing plate time is 135min, so that the bending degree of the circuit board is less than 0.3%.
Example 3
A process for improving the shedding of ink on the matte surface of a golden finger comprises the following steps:
a. pretreatment of solder resist: cleaning the copper surface of the circuit board by a grinding plate and a sand blasting line in sequence, wherein the pretreatment line speed is 2m/min, so that the roughness of the copper surface is more than 0.3um;
b. solder mask printing: printing ink on the copper surface of the circuit board by a printing machine, adopting a 90-mesh screen plate, controlling the printing speed to be 4m/min, controlling the angle of a printing scraper to be 20 degrees, controlling the pressure of the printing scraper to be 0.4Mpa, and increasing the thickness of the ink by using the 90-mesh screen plate;
c. solder mask exposure: carrying out photocuring on the circuit board ink by ultraviolet rays of an exposure machine, wherein the exposure energy is in 11 grids;
d. solder mask development: enabling the circuit board to pass through a developing machine, controlling the developing point to be 50%, and controlling the developing linear speed to be 4m/min, so that the excessive ink is developed completely by potassium carbonate liquid medicine in the developing machine;
e. baking after welding prevention: baking the circuit board at the baking temperature of 150 ℃ for 80min to ensure that the printing ink is thermally cured;
f. gold electroplating: plating gold on the golden finger area of the circuit board by a gantry type electroplating device at the linear speed of 2 m/min;
g. pressing a plate by characters: and (3) pressing the circuit board by a pressing plate machine, wherein the pressing plate temperature is 155 ℃, the pressing time is 150min, and the bending degree of the circuit board is less than 0.3%.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (8)
1. A process for improving the shedding of ink on the matte surface of a golden finger is characterized by comprising the following steps: the method comprises the following steps:
a. pretreatment of solder resist: cleaning the copper surface of the circuit board by a grinding plate and a sand blasting line in sequence to ensure that the roughness of the copper surface is more than 0.3um;
b. solder mask printing: printing ink on the copper surface of the circuit board by a printer;
c. solder mask exposure: carrying out photocuring on the circuit board ink by ultraviolet rays of an exposure machine;
d. solder mask development: solder resist development is carried out on the circuit board through a developing machine, so that residual ink is developed completely by potassium carbonate liquid medicine in the developing machine;
e. baking after welding prevention: baking the circuit board to enable the printing ink to be thermally cured;
f. gold electroplating: plating gold on the golden finger area of the circuit board by using gantry type electroplating equipment;
g. pressing a character plate: and pressing the circuit board by a plate pressing machine to ensure that the bending and warping degree of the circuit board is less than 0.3%.
2. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein: in the step a, the line speed of the pretreatment of cleaning the copper surface by sequentially passing through a grinding plate and a sand blasting line is 1.0-2.0 m/min.
3. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein: and b, printing the ink on the copper surface of the circuit board by adopting a 90-mesh screen printing plate, wherein the printing speed is 2-4 m/min, the angle of a printing scraper is 0-20 degrees, and the pressure of the printing scraper is 0.2-0.3 Mpa.
4. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein: and c, the exposure energy lattice of photocuring in the step c is 9-11 lattices.
5. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein the step of: and d, the developing point of the circuit board which is subjected to solder mask development by a developing machine is 30-50%, and the developing linear speed is 3-4 m/min.
6. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein: in the step e, the baking temperature is 140-150 ℃, and the baking time is 60-80 min.
7. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein the step of: and f, gold plating the gold finger area of the circuit board at the linear speed of 1.0-2.0 m/min.
8. The process for improving the ink shedding of the matte surface of the gold finger as claimed in claim 1, wherein: and g, pressing the plate at 145-155 ℃ for 120-150 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211120755.6A CN115315085A (en) | 2022-09-15 | 2022-09-15 | Process for improving gold finger matte ink shedding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211120755.6A CN115315085A (en) | 2022-09-15 | 2022-09-15 | Process for improving gold finger matte ink shedding |
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| Publication Number | Publication Date |
|---|---|
| CN115315085A true CN115315085A (en) | 2022-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211120755.6A Pending CN115315085A (en) | 2022-09-15 | 2022-09-15 | Process for improving gold finger matte ink shedding |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116761346A (en) * | 2023-06-07 | 2023-09-15 | 江苏博敏电子有限公司 | Process for preparing white solder resist ink in PCB solder resist process |
-
2022
- 2022-09-15 CN CN202211120755.6A patent/CN115315085A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116761346A (en) * | 2023-06-07 | 2023-09-15 | 江苏博敏电子有限公司 | Process for preparing white solder resist ink in PCB solder resist process |
| CN116761346B (en) * | 2023-06-07 | 2023-11-21 | 江苏博敏电子有限公司 | Process for preparing white solder resist ink in PCB solder resist process |
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