CN115313040A - 用于传感器的覆盖元件以及用于制造覆盖元件的方法 - Google Patents
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Abstract
本发明涉及一种薄膜(5)的覆盖元件(1),所述覆盖元件具有壳体,所述薄膜在前面板(4)和承载板(6)之间成型和喷注用于示出多维结构,其中承载板(6)在背侧上与加热板(7)连接,其特征在于,壳体由环形的壳体基座(2)和环形的壳体前部(3)构成,并且在壳体基座(2)中装入有具有LED(8b)和插头(8a)的电路板环(8)。
Description
技术领域
本发明涉及一种薄膜的覆盖元件,所述覆盖元件具有壳体,所述薄膜在前面板和承载板之间成型和喷注并且用于示出三维结构,所述承载板在背侧上与加热板连接。
本发明还涉及一种用于制造覆盖元件的方法。
背景技术
由于功能,用于车辆环境检测的雷达传感器必须在高程度设计相关的位置处,尤其在车辆前部或车辆尾部内构造。由于近程和远程雷达传感器的当前极其不同的频率范围得出在其集成情况下不同的情形:雷达传感器在76GHz和81GHz之间的频率范围内运行。在此频率范围内,在一些具有高浓度金属颗粒的漆色(例如金属银)的情况下,在涂漆的塑料面后方放置带来高的反射。因此,尽可能避免将这些传感器集成在以这种车色涂漆的面后方。
一些制造商偏爱明显可见的传感器。通常将传感器放置在保险杠的下部中的开口内。
其他方式是尽可能不显眼的安装,这需要对雷达传感器进行覆盖。这些被覆盖的传感器的常见的安装位置是散热格栅的区域。然而,刚好散热格栅是对于品牌具有很高识别价值的主要构造元件。这种雷达覆盖,即所谓的雷达罩,在理想情况下应当匹配于车辆设计的要求以及在波传播方面表现为尽可能协调的。在此,会造成相互冲突的要求,所述相互冲突的要求不允许在任何方面最优安装。
如果在温度接近或低于冰点的环境条件下使用雷达设备,会造成雷达罩上结冰。由于雷达罩上的附加冰层,雷达设备无法正常运行或仅可能受限制地正常运行。
雷达罩是电磁辐射的发射器和/或接收器的覆盖件,例如雷达设备和/或其天线的覆盖件。通过雷达罩应当避免例如雷达设备由于环境影响受到损害。雷达罩由通常是塑料的材料制成,通过该材料可以发射相应的辐射,例如雷达辐射,并且可以接收反射的雷达辐射。
从DE 10 2013 016 667 A1中已知一种多层覆盖元件形式的雷达罩,其中至少一个第一层由透明塑料形成。在第一层和第二层之间构成边界层,所述边界层由散射结构和金属结构形成。散射结构被金属结构部段地中断。雷达罩可以借助于耦合输入到散射层中的光来照亮。
从DE 10 2015 004 204 A1中已知一种雷达罩,其具有正侧和背侧并且包括用于将光耦合到雷达罩中的至少一个耦合输入结构。此外,雷达罩具有至少一个加热元件。雷达罩是汽车制造商标志。该标记由金属结构形成。在这里,车辆设计在雷达设备的性能保持不变的情况下得到升级。在此要注意的是,这种金属结构,至少当其在雷达辐射范围内时,必须是薄的,使得其仍然是雷达可穿透的。例如,铟以仅几μm气相喷镀到雷达罩上。
发明内容
本发明的目的是,提出一种改进的覆盖元件,所述覆盖元件包括照明和加热的优点,然而不阻碍雷达透射。
所述目的借助一种薄膜的覆盖元件实现,所述覆盖元件具有壳体,所述薄膜在前面板和承载板之间成型和喷注并且用于示出三维结构,所述承载板在背侧上与加热板连接,其中壳体由环形的壳体基座和环形的壳体前部构成,并且在壳体基座中安装有具有LED和插头的电路板环。
所述设计方案的优点在于,所有电部件及其引线位于壳体之内,如在环形的区域之内。由此,壳体朝向外覆盖这些部件。覆盖元件的中间区域保持不受不利地影响雷达射束通过的部件的干扰。
LED的光经由光学装置耦合输入到承载板中,其中该耦合输入刚好在壳体的环形结构之内发生,从而不从外部被感知并且也不干扰雷达射束。
在此有利的是,光学装置是承载板的一部分从而可以简单地制造。
光学装置是锥体,所述锥体从承载板起朝向LED延伸。
有利的是,薄膜在光学装置的区域内相对于薄膜的平面成角度地朝向光学装置延伸。由此,LED的光以最优的方式耦合输入到承载板中并且可以分布在承载板的光导结构中。
在此,光在薄膜和加热板的上侧之间在承载板中作为光导引导。
为了将光耦合输出,通过选择加热板的上侧的材料或通过安装几何结构中断全反射并且将光通过薄膜和前面板部分地耦合输出。
电路板环的固定经由在加热板处改型的销进行。所述固定位于覆盖元件的中间区域之外,使得在此也不阻碍通过雷达信号的穿透。
所述目的还借助一种用于制造覆盖元件的方法来实现,其特征在于,具有以下步骤:
-在第一步骤中,将在HPF法中预成型的薄膜装入2k模具的第一腔中并且透明地包覆成型;
-在第二步骤中,将加热板装入注塑模具的第二半模中;
-将模具转动。随后将承载板的透明材料喷注到第一部件和加热板之间;
-在第三步骤中,将喷注的组件涂硬漆或浸入硬漆中。
附图说明
图1示出覆盖元件的侧视图;
图2示出覆盖元件的位于车辆内部的一侧上的俯视图;
图3示出覆盖元件的分解示图;
图4示出贯穿覆盖元件的边缘的剖面图;
图5示出剖面;
图6示出贯穿边缘区域的剖面;
图7示出覆盖元件的制造步骤。
具体实施方式
在图1中从侧面示出覆盖元件1。覆盖元件1具有壳体,所述壳体由壳体前部3和壳体基座2构成。这两个环形构成的壳体部分经由钩状部3a彼此连接,所述钩状部卡在接合部2a中。如还从图3中可见,在此多个钩状部3a沿着壳体前部3的半径分布地设置。壳体基座2同样在其半径上具有相应的接合部2a。
图3示出具有所有各个层的覆盖元件1的整体构造,所述各个层部分地直接彼此连接地制造。
从车辆外部观察,可见壳体前部3连同前面板4。前面板4覆盖薄膜5,薄膜是金属化的或部分金属化的薄膜。薄膜5也可以部分地或完全地设有涂漆。薄膜5由承载板6承载,在所述承载板的指向车辆内部的一侧上安装有加热板7。构件,即前面板4、薄膜5、承载板6和加热板7,是组合式注塑件的组成部分,随后对此再进行讨论。
作为覆盖元件1的其他构件可见电路板环8。整个构件用环形的壳体基座2封闭。
为了示出覆盖元件中的标志,薄膜5以及承载板6可以具有几何上多维的结构,即二维或三维的结构。由此,扩展的构造可行性可能与纯覆层无关。
在图2中示出从车辆内部到覆盖元件1的视图。在此,可见加热板的背侧。作为割线与圆形的加热板相交的水平线限定设计用于雷达射束无干扰穿过的内面。
在壳体基座2的一个部位处存在切口,插头8a从电路板环8穿过所述切口向外引导。
在图4中以及在图6中示出贯穿覆盖元件1的边缘区域的剖面。从壳体前部3、前面板4、薄膜5和承载板6起始可见各个部件的构造。加热板7具有销7a,所述销沿着加热板7的外边缘分布地设置。所述销7a接合到电路板环8的凹口中并且适当地与电路板环连接。对此替选地,销7a也可以穿过电路板环8延伸直至壳体基座2并且在那连接。例如,所述连接借助于超声铆接进行。在电路板环8上,LED8b沿着电路板环8的边缘分布。电路板环8保持在壳体基座2中。LED分别经由光学装置9射入承载板6中,所述光学装置在电路板环8上方延伸直至壳体基座2的外壁部,即侧壁2c。LED的光在薄膜5处和在加热板7的上表面处全反射。因此,光沿着承载板6分布。光的没有射到薄膜5上的部分作为散射光被散发到前面板中,在那里,其随后在表面处通过全反射转向。然而,散射光位于环形的壳体前部的区域中,遮住所述区域从而散射光从外部不可见。
薄膜5在LED的直接的光路的区域中具有倾斜面5a,所述倾斜面优化耦合输入。最优地,在此倾斜度为45°,面5a从薄膜5的平面折弯。
因为耦合输入的光经由全反射沿着承载板6传播,所以必须采取预防措施,以便光也能向外射出。
为此使用加热板7的覆层或颜色或金属化,所述覆层或颜色或金属化适当地在整个面上或在对应于标志的部段中减小全反射效应。
在图5中阐明替选的可能性,用于从承载板中耦合输出光。为此,在加热板7上构造肋片14。肋片在为标志的结构的下方构成,使得在这些部位处耦合输出特别多的光。耦合输出结构在此是不同形状和延展的肋片以及肋片的分组。
图6示出一个替选的实施方式。加热板7在此构成为,使得销7a接合到壳体基座2的凹口中。在壳体基座2中,电路板环8在两个侧壁2b和2c之间。
光学装置9是承载板6的一部分,其延伸至壳体基座2的侧壁2c。薄膜5以折弯的面5a在如下区域中终止,在所述区域中,光学装置9作为承载板6的锥状构成部伸展。
另一替选方案是直接与壳体基座2粘接或焊接的电路板环8。
图7以彼此紧接的步骤S1至S5示出制造工艺。薄膜5在高压变形方法中制造并且具有二维或三维的结构。在所述方法中,使塑料薄膜在其被放入注塑模具之前变形并且形成轮廓,所述塑料薄膜通常通过背侧的印刷来装饰。
在第一步骤S1中,将薄膜5置入注塑模具的第一半模中。
在第二步骤S2中,将薄膜透明地包覆成型从而将第一部件制成为透明地包覆成型的薄膜。透明的区域形成前面板4。注塑法的浇口部位12位于模具的边缘处。
在步骤S3中,将加热板7的加热丝和接触引脚置入注塑模具的第二半模11中并且将模具在步骤S4中旋转,使得可以从与在第一部件的情况下相同的侧进行喷注。加热板7具有中心开口,所述中心开口用作为浇口开口13。
随后在步骤S5中,用透明材料在第一组件薄膜5+承载板6和加热板7之间喷注承载板6。
作为结果,得到在排除空气的情况下的层的连接。所述连接是紧密的并且可以被简单地进一步加工。
在最后的步骤S6中,将喷注的组件在前侧喷涂硬漆或浸入硬漆中。在最后的步骤中,将构成为镀铬环的壳体前部3卡上。
附图标记列表
1 覆盖元件
2 壳体基座
2a 接合部
2b、2c 侧壁
3 壳体前部
3a 钩状部
4 前面板
5 薄膜
5a 面
6 承载板
7 加热板
7a 销
8 电路板环
8a 插头
8b LED
9 光学装置
10 第一半模
11 第二半模
12 靠近边缘的浇口
13 中间的浇口
14 肋片
Claims (9)
1.一种薄膜(5)的覆盖元件(1),所述覆盖元件具有壳体,所述薄膜在前面板(4)和承载板(6)之间成型和喷注并且用于示出多维结构,其中所述承载板(6)在背侧上与加热板(7)连接,
其特征在于,所述壳体由环形的壳体基座(2)和环形的壳体前部(3)构成,并且在所述壳体基座(2)中装入有具有LED(8b)和插头(8a)的电路板环(8)。
2.根据权利要求1所述的覆盖元件(1),
其特征在于,所述LED的光经由光学装置(9)耦合输入到所述承载板中。
3.根据权利要求2所述的覆盖元件(1),
其特征在于,所述光学装置(9)是所述承载板(6)的一部分。
4.根据权利要求2所述的覆盖元件(1),
其特征在于,所述光学装置(9)是锥体,所述锥体从所述承载板(6)起朝向所述LED(8a)延伸。
5.根据权利要求2所述的覆盖元件(1),
其特征在于,所述薄膜(5)在所述光学装置(9)的区域中相对于所述薄膜(5)的平面成角度地朝向所述光学装置(9)延伸。
6.根据权利要求1所述的覆盖元件(1),
其特征在于,所述光在所述薄膜(5)和所述加热板(7)的上侧之间被引导。
7.根据权利要求1所述的覆盖元件(1),
其特征在于,所述光通过选择所述加热板(7)的上侧的材料或通过在所述加热板(7)上安装几何结构穿过所述薄膜(5)和所述前面板(4)耦合输出。
8.根据权利要求1所述的覆盖元件(1),
其特征在于,所述加热板(7)经由销(7a)固定在所述电路板环(8)的凹口中或固定在所述壳体基座(2)的容纳部中。
9.一种用于制造根据权利要求1的覆盖元件(1)的方法,其特征在于,具有以下步骤:
-在第一步骤(S1)中,将所述薄膜(5)装入注塑模具的第一半模(10)中;
-在第二步骤(S2)中,将所述薄膜(5)透明地包覆成型,从而制造所述前面板(4);
-在第三步骤(S3)中,将所述加热板(7)装入所述注塑模具的第二半模(11)中;
-在第四步骤(S4)中,将所述模具旋转,并且随后将所述加热板(7)用所述承载板(6)的透明材料包覆成型(S5);
-在步骤S6中,将喷注的组件涂硬漆或浸入硬漆中。
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