CN115308393A - Method for automatically detecting plumpness of Printed Circuit Board (PCB) ink printing plug hole - Google Patents
Method for automatically detecting plumpness of Printed Circuit Board (PCB) ink printing plug hole Download PDFInfo
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- CN115308393A CN115308393A CN202210938583.7A CN202210938583A CN115308393A CN 115308393 A CN115308393 A CN 115308393A CN 202210938583 A CN202210938583 A CN 202210938583A CN 115308393 A CN115308393 A CN 115308393A
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000007639 printing Methods 0.000 title claims abstract description 15
- 238000001514 detection method Methods 0.000 claims abstract description 32
- 238000005096 rolling process Methods 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005751 Copper oxide Substances 0.000 abstract description 3
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 3
- 239000000428 dust Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/32—Paints; Inks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
The invention provides a method for automatically detecting the plumpness of a printed hole of Printed Circuit Board (PCB) ink, which comprises the following steps of: ink sticking: sticking and removing the printing ink on the surface of the PCB; and (3) positioning: conveying the PCB with the surface ink removed to an infrared scanning device, and adjusting the detection position of the PCB; infrared detection: scanning the plug holes on the surface of the PCB by an infrared scanning device, sending the scanned information to a computer, and calculating plug hole real-time depth information by the computer; and (3) judging: calculating to obtain the ink fullness in the plug hole, and comparing the calculated ink fullness with the preset ink fullness to judge the fullness is qualified; the printed PCB is automatically subjected to surface overflowing ink adhesion removal, so that the subsequent detection result is more accurate, and meanwhile, the overflowing of ink copper oxide surface is avoided; and secondly, double-sided infrared scanning is set, the ink fullness calculated after scanning is compared with the preset ink fullness, and then the qualified judgment of the fullness is made, so that the existing human eye observation is replaced, and the method is convenient and efficient.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a method for automatically detecting the plumpness of a PCB ink printing plug hole.
Background
The PCB ink refers to an ink used for Printed Circuit Boards (PCBs), and important physical properties are viscosity, thixotropy and fineness of the ink. These physical properties, which need to be known to improve the ability to apply the ink; in the manufacturing process of printed circuit boards, screen printing is one of the essential important processes. To achieve fidelity of image reproduction, the ink must have good viscosity and suitable thixotropy. Viscosity is the internal friction of a liquid, and means the friction force exerted by the liquid in the inner layer when the liquid in one layer slides on the liquid in the other layer under the action of external force. The thick liquid inner layer has larger mechanical resistance when sliding, and the thinner liquid has smaller resistance. The units of viscosity measurement are poise. In particular, the temperature has a significant influence on the viscosity. At present, when a PCB is printed with green oil, hole plugging ink of the PCB is usually printed, and the fullness of the ink in the holes usually has different fullness requirements aiming at different manufacturers.
In the prior art, the traditional method for detecting the plumpness of the plug hole after the printing of the green oil is carried out by visual detection of workers, the detection mode has strong subjectivity, no unified standard and no scientific test means, and cannot effectively meet the requirements of customers, so that a new detection means is urgently needed to solve the defects and shortcomings in the prior art.
Disclosure of Invention
Aiming at the defects in the technology, the invention provides a method for automatically detecting the plumpness of the printing plug hole of the PCB ink, which ensures that the subsequent detection result is more accurate and simultaneously avoids overflowing ink to oxidize the copper surface by automatically removing overflowing ink on the surface of the printed PCB; and secondly, double-sided infrared scanning is set, the ink plumpness is calculated after scanning and is compared with the preset ink plumpness, and then the plumpness qualification judgment is made, the existing human eye observation is replaced, and the method is convenient and efficient.
In order to achieve the aim, the invention provides a method for automatically detecting the plumpness of a Printed Circuit Board (PCB) ink plug hole, which comprises the following steps of:
ink sticking: the printed PCB surface ink is adhered and removed by an ink adhering and removing mechanism;
positioning: conveying the PCB with the surface ink removed to an infrared scanning device, detecting the position of the PCB and adjusting the PCB to be in a preset detection position after the PCB reaches the infrared scanning device;
infrared detection: scanning the plug holes on the surface of the PCB by an infrared scanning device, sending the scanned information to a computer, and calculating plug hole real-time depth information by the computer;
and (3) judging: and calculating the ink fullness in the plug hole according to the scanned real-time plug hole depth information and the depth information of the plug hole, and comparing the calculated ink fullness with the preset ink fullness to judge the acceptability of the fullness.
Specifically, the method comprises the following steps: in the step of ink sticking, the printed PCB is conveyed to an infrared scanning device through a conveyor belt mechanism, and the ink sticking and removing mechanism is arranged right above the conveyor belt mechanism and is tightly attached to the surface of the PCB to carry out rolling type surface ink sticking and removing.
Preferably, the method comprises the following steps: the printing ink glues except that mechanism includes unreel machine, rolling machine and rolls and glues the black machine, and the roll is glued the black machine and is hugged closely conveyer belt structure setting, and the rolling machine of gluing is located with the unreeling machine and is rolled the black machine both sides, is equipped with the adhesion dust membrane feed cylinder on the unreeling machine, and the blowing of adhesion dust membrane feed cylinder is carried out the surperficial printing ink of PCB board to the roll and is glued the black machine and remove the back, carries out the rolling through the rolling machine.
Specifically, the method comprises the following steps: in the step of falling, the PCB detection device further comprises a first vision sensor, a MARK point is arranged at the edge position of the PCB, and the first vision sensor judges whether the PCB falls at the preset detection position or not by identifying the MARK point position and comparing the MARK point position with the preset position.
Preferably, the method comprises the following steps: the correcting device is arranged under a scanning port of the infrared scanning device and used for correcting and adjusting the position of the MARK point on the PCB to be overlapped with a preset position, and the position falling is completed.
Specifically, the method comprises the following steps: in the infrared detection step, the infrared scanning device feeds back the red light reflected back after emission to the CDD camera, the CDD camera sends the received information to the computer, and the computer calculates the real-time depth information of the taphole through a phase height conversion algorithm.
Preferably, the method comprises the following steps: the infrared scanning device comprises a first scanning device for scanning the front surface of the PCB and a second scanning device for scanning the back surface of the PCB.
Specifically, the method comprises the following steps: in the step of determining, the ink fullness in the plug holes is the ratio of the real-time depth of the plug holes to the depth of the plug holes themselves.
Preferably, the method comprises the following steps: the preset ink fullness is 70%, and when the calculated ink fullness is more than 70% and less than 100%, the ink is judged to be qualified; and judging as disqualification when the calculated ink fullness is less than 70%.
Preferably, the method comprises the following steps: the method further comprises a step after the step of determining: when the PCB is judged to be qualified, transmitting the qualified PCB to the next processing step; and when the PCB is judged to be unqualified, pushing the PCB out of the conveyor belt mechanism and giving an alarm.
The invention has the beneficial effects that: compared with the prior art, the method for automatically detecting the plumpness of the printed plug holes of the PCB ink, provided by the invention, comprises the following steps of: ink sticking: the printed PCB surface ink is adhered and removed by an ink adhering and removing mechanism; and (3) positioning: conveying the PCB with the surface ink removed to an infrared scanning device, and after the PCB reaches the infrared scanning device, detecting the position of the PCB and adjusting the PCB to be at a preset detection position; infrared detection: scanning the plug holes on the surface of the PCB by an infrared scanning device, sending the scanned information to a computer, and calculating plug hole real-time depth information by the computer; and (3) judging: calculating to obtain the ink fullness in the plug hole according to the scanned real-time plug hole depth information and the depth information of the plug hole, and comparing the calculated ink fullness with the preset ink fullness to judge that the ink fullness is qualified; the printed PCB is automatically subjected to surface overflowing ink adhesion removal, so that the subsequent detection result is more accurate, and meanwhile, the overflowing of ink copper oxide surface is avoided; and secondly, double-sided infrared scanning is set, the ink fullness calculated after scanning is compared with the preset ink fullness, and then the qualified judgment of the fullness is made, so that the existing human eye observation is replaced, and the method is convenient and efficient.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Detailed Description
In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.
In the following description, details of the preferred examples are given to provide a more thorough understanding of the invention. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. It should be understood that the specific embodiments are illustrative of the invention and are not to be construed as limiting the invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
In the prior art, the traditional method for detecting the plumpness of the plug hole after the printing of the green oil is carried out by visual detection of workers, the detection mode has strong subjectivity, no unified standard and no scientific test means, and cannot effectively meet the requirements of customers, so that a new detection means is urgently needed to solve the defects and shortcomings in the prior art.
In order to solve the defects and shortcomings in the prior art, the invention specifically provides a method for automatically detecting the plumpness of a Printed Circuit Board (PCB) ink plug hole, which refers to a figure 1 and comprises the following steps:
ink sticking: the printed PCB surface ink is adhered and removed by an ink adhering and removing mechanism; in the step, the purpose of adhering and removing the ink on the surface of the PCB board is two, one is to avoid the influence of the overflowed ink on the accuracy of subsequent detection, and the overflowed ink can cause the copper surface of the PCB board to be oxidized to cause irreversible damage, so that the step of adhering and removing the ink is arranged to adhere and remove unnecessary ink residues on the surface.
Positioning: conveying the PCB with the surface ink removed to an infrared scanning device, and after the PCB reaches the infrared scanning device, detecting the position of the PCB and adjusting the PCB to be at a preset detection position; after the printing ink on the surface of the PCB is adhered and removed, the PCB needs to be calibrated before being sent to an infrared scanning device for scanning, in the step, the PCB can not accurately reach a detection position after reaching the position, the current position of the PCB is detected through position detection, the current position is compared with a preset detection position, the position deviation is calculated, the deviation is adjusted according to the position deviation, and the PCB is in the preset detection position to be detected.
Infrared detection: scanning plug holes on the surface of the PCB by an infrared scanning device, sending scanned information to a computer, and calculating plug hole real-time depth information by the computer; the infrared light source of the infrared scanning device projects infrared light to the surface of the PCB and simultaneously projects the infrared light into the plug hole, the plug hole reflects the received infrared light back to the infrared scanning device, the infrared scanning device receives the reflected infrared light and then sends the infrared light to the computer, and the computer performs calculation analysis to obtain real-time depth information of the plug hole.
And (3) judging: calculating the ink saturation in the plug hole according to the scanned real-time plug hole depth information and the depth information of the plug hole, and comparing the calculated ink saturation with the preset ink saturation to judge whether the saturation is qualified; the proportion of ink in the plug holes can be obtained by calculating the real-time depth information of the plug holes and the depth information of the plug holes, namely the ink fullness, in practical production application, different customers have different ink saturations in the plug holes of the PCB processed, so that the preset ink fullness information is set according to the requirements of different customers and then compared, and whether the ink fullness in the plug holes of the PCB is qualified or not can be directly judged.
In the present embodiment, mention is made of: in the step of ink sticking, the printed PCB is conveyed to an infrared scanning device through a conveyor belt mechanism, and an ink sticking and removing mechanism is arranged right above the conveyor belt mechanism and is tightly attached to the surface of the PCB to carry out rolling type surface ink sticking and removing; the printing ink sticking and removing mechanism is arranged right above the conveying belt mechanism, and the printing ink sticking and removing mechanism carries out sticking and removing of redundant printing ink on the surface of the PCB plate through rolling type sticking and removing.
In a preferred embodiment, mention is made of: the ink sticking and removing mechanism comprises an unreeling machine, a reeling machine and a rolling ink sticking machine, the rolling ink sticking machine is arranged close to the conveyor belt structure, the reeling machine and the unreeling machine are arranged on two sides of the rolling ink sticking machine, a dust sticking film material cylinder is arranged on the unreeling machine, and the dust sticking film material cylinder is discharged to the rolling ink sticking machine to stick and remove ink on the surface of the PCB and then is wound by the reeling machine; the unreeling machine is provided with a dust-binding film charging barrel, the dust-binding film has certain adhesive force, ink overflowing from the edge position of the hole plugging can be bound off, and meanwhile, the whole PCB cannot be bound up due to overlarge adhesive force; the rolling machine, the unreeling machine and the rolling ink sticking machine are arranged in a triangular mode, the rolling ink sticking machine is tightly attached to the surface of the PCB, and dust is stuck to the surface of the PCB through the rolling dust sticking film.
Preferably, roll and glue black machine and set up to elevation structure, can carry out the regulation of height relatively conveyor belt mechanism to carry out height-adjusting with the adaptation according to different PCB plate thickness.
In the present embodiment, mention is made of: in the step of locating, a first vision sensor is further included, a MARK point is arranged at the edge position of the PCB, and the first vision sensor judges whether the PCB is located at a preset detection position or not by identifying the MARK point position and comparing the MARK point position with the preset position; the first vision sensor is used for capturing a surface image of the PCB so as to determine a position of a MARK point, and the MARK point is used for judging whether the PCB is accurately located or not so as to help a computer calculate the position deviation of the PCB according to the image to correct the deviation.
In a preferred embodiment are mentioned: the correcting device is arranged right below a scanning port of the infrared scanning device and used for correcting and adjusting the position of the MARK point on the PCB to be overlapped with a preset position so as to finish the position falling; the deviation correcting device is arranged at the position right opposite to the scanning port of the infrared scanning device and comprises an adsorption device used for adsorbing two sides of the PCB, the adsorption device is arranged on a swinging base capable of realizing swinging action, and the position of the PCB is adjusted through continuous swinging to finish accurate positioning.
In the present embodiment, mention is made of: in the infrared detection step, the infrared scanning device feeds back the red light reflected back after emission to the CDD camera, the CDD camera sends the received information to the computer, and the computer calculates the real-time depth information of the plug hole through a phase height conversion algorithm; an infrared light source processor of the infrared scanning device projects infrared light to a collimating lens, and the collimating lens projects the infrared light to the PCB plug hole; the PCB plug hole reflects the received infrared light to the objective lens, and then the infrared light is fed back to the CCD camera after sequentially passing through the rod lens and the imaging lens; the CCD camera sends the received information to a computer, phase difference is calculated through a phase recovery algorithm, and the real-time depth information of the jack is further calculated according to a phase height conversion algorithm.
In a preferred embodiment are mentioned: the infrared scanning device comprises a first scanning device for scanning the front surface of the PCB and a second scanning device for scanning the back surface of the PCB; the first scanning device and the second scanning device scan the two sides of the PCB, so that the depth of ink in the plug hole of the PCB can be accurately obtained.
In the present embodiment, mention is made of: in the step of determining, the ink fullness in the plug holes is the ratio of the real-time depth of the plug holes to the depth of the plug holes themselves.
In a preferred embodiment, mention is made of: the preset ink fullness is 70%, and when the calculated ink fullness is more than 70% and less than 100%, the ink is judged to be qualified; and judging as disqualified when the calculated ink fullness is less than 70%.
Preferably, in the step, 70% is not a fixed value and is a common ratio, a customer of the regular PCB requires that the plumpness of the plug holes in the holes at least reaches more than 50%, which is a cured value, and if a high-end PCB is manufactured, the control is stricter; because the ink will shrink after being baked, so when printing) at least 70% above is guaranteed. Specifically, a value lower than 100% may be set according to actual production requirements.
In a preferred embodiment, mention is made of: the method further comprises a step after the step of determining: when the PCB is judged to be qualified, transmitting the qualified PCB to the next processing step; when the PCB is judged to be unqualified, pushing the PCB out of the conveyor belt mechanism and giving an alarm; the pushed-out PCB board needs to be printed again.
The invention has the advantages that:
1. the printed PCB is automatically subjected to surface overflowing ink adhesion removal, so that the subsequent detection result is more accurate, and meanwhile, the overflowing ink copper oxide surface is avoided;
2. and double-sided infrared scanning is arranged, the ink fullness calculated after scanning is compared with the preset ink fullness, and then the qualified judgment of the fullness is made, the existing human eye observation is replaced, and the method is convenient and efficient.
The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be considered by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
1. A method for automatically detecting the plumpness of a printed hole of Printed Circuit Board (PCB) ink is characterized by comprising the following steps of:
ink sticking: the printed PCB surface ink is adhered and removed by an ink adhering and removing mechanism;
and (3) positioning: conveying the PCB with the surface ink removed to an infrared scanning device, and after the PCB reaches the infrared scanning device, detecting the position of the PCB and adjusting the PCB to be at a preset detection position;
infrared detection: scanning the plug holes on the surface of the PCB by an infrared scanning device, sending the scanned information to a computer, and calculating plug hole real-time depth information by the computer;
and (3) judging: and calculating the ink saturation in the plug hole according to the scanned real-time plug hole depth information and the depth information of the plug hole, and comparing the calculated ink saturation with the preset ink saturation to judge whether the saturation is qualified.
2. The method as claimed in claim 1, wherein in the step of sticking ink, the printed PCB is transferred to the infrared scanner via a conveyor mechanism, and the ink sticking mechanism is disposed directly above the conveyor mechanism and closely attached to the surface of the PCB for rolling-type surface ink sticking.
3. The method for automatically detecting the fullness of the Printed Circuit Board (PCB) ink plug holes, according to claim 2, is characterized in that the ink sticking and removing mechanism comprises an unreeling machine, a reeling machine and a rolling ink sticking machine, the rolling ink sticking machine is arranged in a manner of being tightly attached to the conveyor belt structure, the reeling machine and the unreeling machine are arranged on two sides of the rolling ink sticking machine, a dust-sticking film charging barrel is arranged on the unreeling machine, and the dust-sticking film charging barrel is discharged to the rolling ink sticking machine to stick and remove the ink on the surface of the PCB, and then is reeled by the reeling machine.
4. The method as claimed in claim 1, wherein the step of positioning further comprises a first vision sensor, the edge of the PCB is provided with a MARK point, and the first vision sensor determines whether the PCB is positioned at the predetermined detection position by comparing the MARK point position with a predetermined position.
5. The method as claimed in claim 4, further comprising a deviation-correcting device, wherein the deviation-correcting device is disposed under the scanning port of the infrared scanning device, and the deviation-correcting device is used to adjust the position of the MARK point on the PCB to overlap the predetermined position, thereby completing the positioning.
6. The method as claimed in claim 1, wherein in the step of infrared detection, the infrared scanning device feeds back the red light reflected after emission to the CDD camera, the CDD camera sends the received information to the computer, and the computer calculates the real-time depth information of the jack through a phase height conversion algorithm.
7. The method as claimed in claim 6, wherein the infrared scanning device comprises a first scanning device for scanning the front surface of the PCB and a second scanning device for scanning the back surface of the PCB.
8. The method as claimed in claim 1, wherein in the step of determining, the ink fullness in the vias is a ratio of a real-time via-hole depth to a depth of the vias.
9. The method for automatically detecting the ink printing jack fullness of the PCB as claimed in claim 8, wherein the preset ink fullness is 70%, and the calculated ink fullness is judged to be qualified when the calculated ink fullness is more than 70% and less than 100%; and judging as disqualification when the calculated ink fullness is less than 70%.
10. The method of claim 9, further comprising a step after the determining step of: when the PCB is judged to be qualified, the qualified PCB is transmitted to the next processing step; and when the PCB is judged to be unqualified, pushing the PCB out of the conveyor belt mechanism and giving an alarm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210938583.7A CN115308393A (en) | 2022-08-05 | 2022-08-05 | Method for automatically detecting plumpness of Printed Circuit Board (PCB) ink printing plug hole |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210938583.7A CN115308393A (en) | 2022-08-05 | 2022-08-05 | Method for automatically detecting plumpness of Printed Circuit Board (PCB) ink printing plug hole |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768265A (en) * | 2012-07-26 | 2012-11-07 | 福州瑞华印制线路板有限公司 | Detection method of printing via hole of taphole weld-preventing oil on PCB (printed circuit board) |
| KR20170066046A (en) * | 2015-12-04 | 2017-06-14 | (주)맥스벨 | Automatic marking apparatus for printed circuit board |
| CN107345789A (en) * | 2017-07-06 | 2017-11-14 | 深圳市强华科技发展有限公司 | A kind of pcb board hole location detecting device and method |
| KR101835276B1 (en) * | 2017-07-21 | 2018-03-08 | 김승근 | Method for manufacturing printed circuit board with via hole |
-
2022
- 2022-08-05 CN CN202210938583.7A patent/CN115308393A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768265A (en) * | 2012-07-26 | 2012-11-07 | 福州瑞华印制线路板有限公司 | Detection method of printing via hole of taphole weld-preventing oil on PCB (printed circuit board) |
| KR20170066046A (en) * | 2015-12-04 | 2017-06-14 | (주)맥스벨 | Automatic marking apparatus for printed circuit board |
| CN107345789A (en) * | 2017-07-06 | 2017-11-14 | 深圳市强华科技发展有限公司 | A kind of pcb board hole location detecting device and method |
| KR101835276B1 (en) * | 2017-07-21 | 2018-03-08 | 김승근 | Method for manufacturing printed circuit board with via hole |
Non-Patent Citations (1)
| Title |
|---|
| 吴江浩;: "印制电路板阻焊油墨塞孔对孔铜的影响", 印制电路信息, no. 09, 10 September 2016 (2016-09-10) * |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518000 Shajing Town Xihuan Road Xihuan Jiaotang Industrial Zone, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Trustech Electronics Co.,Ltd. Address before: 518000 Shajing Town Xihuan Road Xihuan Jiaotang Industrial Zone, Bao'an District, Shenzhen City, Guangdong Province Applicant before: QUANCHENGXIN ELECTRONICS (SHENZHEN) CO.,LTD. |