CN115297618A - Radar plate PCB manufacturing process - Google Patents
Radar plate PCB manufacturing process Download PDFInfo
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- CN115297618A CN115297618A CN202211221696.1A CN202211221696A CN115297618A CN 115297618 A CN115297618 A CN 115297618A CN 202211221696 A CN202211221696 A CN 202211221696A CN 115297618 A CN115297618 A CN 115297618A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 192
- 229910052802 copper Inorganic materials 0.000 claims abstract description 192
- 239000010949 copper Substances 0.000 claims abstract description 192
- 238000009713 electroplating Methods 0.000 claims abstract description 127
- 238000000034 method Methods 0.000 claims abstract description 101
- 230000008569 process Effects 0.000 claims abstract description 99
- 238000005530 etching Methods 0.000 claims abstract description 24
- 238000003754 machining Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000011049 filling Methods 0.000 claims description 51
- 230000002093 peripheral effect Effects 0.000 claims description 45
- 238000000151 deposition Methods 0.000 claims description 43
- 230000008021 deposition Effects 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 32
- 238000005406 washing Methods 0.000 claims description 30
- 238000007747 plating Methods 0.000 claims description 16
- 239000012535 impurity Substances 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 8
- 230000008719 thickening Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 238000007598 dipping method Methods 0.000 claims description 5
- 238000002386 leaching Methods 0.000 claims description 2
- 238000007781 pre-processing Methods 0.000 claims 2
- 238000005137 deposition process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 12
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 6
- 229910001431 copper ion Inorganic materials 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
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- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a radar board PCB manufacturing process which comprises a pressing process, a copper reducing process, a hole machining process, a copper deposition process, an outer layer dry film process, an electroplating process and a flash etching process.
Description
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a radar board PCB manufacturing process.
Background
The Printed Circuit Board (PCB) is also called a Printed Circuit Board (PCB), and the rapid development and wide application of integrated circuits make the volume of electronic equipment smaller and the Circuit wiring density and difficulty larger and larger, and based on different use scenes and use requirements, the types of the PCBs are continuously updated, and the structure and the quality are also developing to ultrahigh density, miniaturization and high reliability. The radar board PCB is a kind of PCB responsible for generating, transmitting and receiving radio frequency signals, and generally includes an antenna structure and a radio frequency circuit mounted on a high frequency laminate, the antenna structure is used for transmitting radio frequency signals generated by the radio frequency circuit and radio frequency signals reflected after hitting an object, the radio frequency circuit is used for generating radio frequency signals and receiving and analyzing the reflected radio frequency signals, and therefore, the radar board PCB has high requirements for the fineness, stability, reliability and the like of the circuits thereon.
In reality, MSAP flow is often adopted in the manufacturing industry of high-frequency radar panel PCBs: the whole board is pressed and then subjected to processes of copper reduction, drilling, copper deposition, outer layer dry film, electroplating, flash etching and the like to finally obtain the radar board PCB with the finally designed copper-clad graph, namely, a through hole and a blind hole are drilled on a substrate with a thin initial copper layer, conductive layers are connected through the copper deposition, a required place is exposed after exposure and development of the outer layer dry film, then the copper thickness of a formal circuit on a circuit board is thickened to a required specification through electroplating, redundant copper layers on a non-circuit layer are removed through flash etching, and the retained copper layers are copper-filled layers of the through hole and the blind hole and required circuit layers. The through hole and the blind hole on the PCB are used for connecting each circuit layer, the quality of through hole electroplating and blind hole copper filling plays a crucial role in the electrical connection and performance of each PCB layer, the MSAP flow is characterized in that the integration of through hole electroplating and blind hole filling is realized, and the formation of the circuit and the metallization filling of the through hole and the blind hole mainly depend on electroplating and flash etching. In the electroplating process, the integration of through-hole electroplating and blind hole filling reduces the production flow of the radar board PCB, improves the production efficiency, and increases the conductivity and the heat dissipation, and in the etching process, because the etched chemical copper layer is very thin, the etching time is very short, the lateral etching to the circuit is small, the width of the circuit is not affected by the thickness of the copper plating, the resolution is higher, and the yield of fine circuits can be greatly improved. However, as the aperture of the domestic PCB is reduced and the thickness-diameter ratio is increased, through hole electroplating and hole electroplating on the wall of a blind hole are more and more difficult, particularly, the too small aperture is easy to cause poor quality of a copper deposition process, the copper deposition process can enable the through hole and the blind hole to be better connected with each circuit layer and provide a conductive layer for a subsequent electroplating process because of certain concavity of the surfaces of the through hole, the blind hole and the copper deposition process, the copper deposition quality of the through hole and the blind hole plays an important role in electrical connection and performance of each layer of the PCB, the poor copper deposition quality of the through hole and the blind hole can influence the effect of the subsequent electroplating process, the phenomenon that the electric charge attraction force is lacked in the hole during electroplating is caused, the uneven through hole electroplating is caused, the hole filling efficiency of the blind hole is low, and the like.
Common plating processes include horizontal continuous plating lines, vertical plating lines, and vertical continuous plating lines. The high-frequency radar PCB is used as a type of PCB with extremely high requirements on fineness and reliability, a vertical continuous plating line (VCP) is adopted for the electroplating process of the radar PCB in the actual production, and compared with a horizontal plating line, the vertical continuous plating line is characterized by realizing the integration of through hole electroplating and blind hole copper filling of the radar PCB; compared with the traditional vertical electroplating line, the vertical continuous electroplating line is characterized in that the cathode is plated in a stepping mode, a jet flow mode is adopted in the solution exchange treatment, the stepping working mode can enhance the uniformity of the whole plate electroplating, the jet flow mode can ensure that the solution exchange is sufficient, the liquid level is relatively stable, the vertical swing of the plate is less influenced, the electroplating quality can be effectively improved by adopting the vertical continuous electroplating line, the occupied area is greatly reduced, and the vertical continuous electroplating line also has advantages in the aspect of batch production, so that the quality and the yield of the PCB can be effectively improved. However, the through hole electroplating and blind hole filling of the high-frequency radar PCB by adopting the vertical continuous electroplating line have the following problems:
firstly, the copper content of the radar PCB in the holes after copper deposition is not uniform, the copper deposition layer is easy to oxidize, the hole filling rate after electroplating is low, and the depressions of the blind holes are large, so that the conductivity and the precision of the radar PCB are influenced;
secondly, the method is not suitable for the radar board PCB after horizontal copper deposition, the copper deposition layer of the horizontal copper deposition is thin, the electric charge attraction is small during electroplating, and the through hole electroplating is insufficient, the blind hole filling rate is low and large depression is caused;
thirdly, when the jet flow frequency is overlarge during electroplating, the areas with thicker hole walls and lower copper shielding in the blind holes on the radar board PCB are easy to form holes and other defects.
Disclosure of Invention
The invention aims to provide a radar board PCB manufacturing process, which effectively solves the problems of uneven through hole electroplating of a high-frequency radar board PCB, depression and cavities during blind hole filling and the like, and improves the precision and reliability of the radar board PCB.
In order to solve the problems, the invention adopts the following technical scheme: a radar board PCB manufacturing process comprises the following steps:
s1, completing whole plate pressing;
s2, reducing copper to reduce the thickness of the copper layer of the outer-layer plate and form an initial copper layer;
s3, hole machining, namely machining through holes and blind holes which are connected with different layers on the whole plate;
s4, depositing copper, namely depositing copper layers in the through holes and the blind holes to realize the electric connection of each layer;
s5, forming an outer layer circuit pattern on the initial copper layer and filling the blind holes by using an outer layer dry film process and an electroplating process;
s6, removing redundant initial copper layers by a flash etching process to form a final outer layer circuit pattern;
entering a subsequent process;
wherein the step S5 comprises the following steps:
s51, an outer layer dry film process is carried out, an initial copper layer of a to-be-thickened graph is exposed after exposure and development, the to-be-thickened graph comprises an antenna surface graph, a peripheral graph, a through hole, a blind hole and a balance copper surface graph filled between the antenna surface graph and the peripheral graph, and the balance copper surface graph is not communicated with the antenna surface graph and the peripheral graph;
s52, electroplating, namely electroplating the to-be-thickened graph on the initial copper layer, wherein the to-be-thickened graph comprises thickening the thicknesses of the antenna surface graph, the peripheral graph and the balance copper surface graph, thickening the copper layer deposited in the through hole, filling the blind hole, and removing the outer dry film once;
and S54, etching the balance copper surface pattern by using a secondary outer layer dry film process. Compared with the prior art, the invention has the beneficial effects that:
in the technical scheme, the radar board PCB is manufactured based on an MSAP (multiple input multiple output) process, specifically comprises a pressing process, a copper reduction process, a hole processing process, an outer layer dry film and electroplating process and a flash etching process, specifically improves the outer layer dry film and the electroplating process in the MSAP process, and specifically adopts a primary outer layer dry film process, electroplating and a secondary outer layer dry film process to achieve the effects of realizing the integration of blind hole electroplating filling and through hole electroplating and improving the quality of electroplating and filling. The reason why the area between the antenna surface pattern and the peripheral pattern is increased and developed, namely the copper surface pattern is balanced, and the subsequent copper layer thickening is carried out on the area between the antenna surface pattern and the peripheral pattern is because the through hole, the blind hole and the copper-clad surface have certain concavity, particularly when the aperture of the radar board PCB is small, if the quality problems of the copper-clad layer such as the thinness and the like caused by the adoption of a horizontal copper-clad wire process, the charge attraction force of the copper layer in the blind hole and the through hole during electroplating is small, copper ions in chemical copper plating liquid can be gathered on the initial copper layer of the radar board PCB panel with stronger charge attraction force, so that the blind hole filling rate is low and larger concavity is further generated. Therefore, the balance copper surface is added, the electroplating area is enlarged, and the developed balance copper surface pattern is not communicated with the antenna surface pattern and the peripheral pattern, so that the charge attraction of the area needing to be electroplated on the radar board PCB can be balanced, the uniformity of electroplating and copper increasing of the whole area needing to be electroplated is ensured, and the balance copper surface is added on the board surface of the radar board PCB which is fully distributed with the through holes and the blind holes, so that the charge attraction can be increased for the through holes and the blind holes on the board surface of the radar board PCB, the uniformity of electroplating and filling the through holes and the blind holes on the board surface of the radar board PCB is improved, and the efficiency and the fullness degree of filling the blind holes are improved. Electroplating all the quasi-thickening patterns developed after one outer layer dry film process in the subsequent electroplating process, wherein the electroplating process comprises the thickening of copper layers of the antenna surface pattern, the peripheral pattern and the balanced copper surface pattern, the thickening of the deposited copper layer on the inner wall of the through hole on the surface of the radar board PCB, and the filling of the inside of the blind hole; and then, after the electroplating process is finished, the outer layer dry film is removed, and the balance copper surface pattern is more formed on the obtained radar board PCB than the original pattern design, so that in order to avoid the influence of the balance copper layer on the subsequent process, the secondary outer layer dry film process is adopted, the exposure machine is used for exposing and developing the balance copper surface pattern after copper increase, and the copper layer attached to the balance copper surface pattern area is removed in an etching mode.
Further, the electroplating process of the step S52 in the radar board PCB manufacturing process specifically includes:
s521, a one-step electroplating process is carried out, so that the deposition speed of copper in the blind hole is higher than that of other parts, and the blind hole filling is completed;
s522, secondary electroplating process, wherein the thickness of copper deposition on the antenna surface pattern and the peripheral pattern is at least 4-8 times of that of the initial copper layer.
In the technical scheme, two electroplating processes are adopted, wherein the one electroplating process focuses on copper deposition filling of blind holes arranged on a radar board PCB, and adopts a mode that accelerating particles capable of attracting copper ions are attached in the blind holes, and inhibiting particles capable of inhibiting copper ion accumulation are attached to a board surface near the blind holes; because the primary electroplating process is mainly used for filling blind holes, the cost is controlled and excessive filling of the blind holes is avoided, the copper deposition amount on the surface copper in the primary electroplating process is not too large, and the secondary electroplating process is mainly used for thickening the copper layer on the radar board PCB to the design value of the radar board PCB, namely, the thickness of the copper deposition on the antenna surface graph and the peripheral graph is at least 4-8 times of that of the initial copper layer.
Further, in the manufacturing process of the radar board PCB, the thickness of an initial copper layer in the S2 step is 0.21-0.29mil, in the S521 step, the thickness of copper deposition on the antenna surface pattern and the peripheral pattern is 0.8-1.2mil, the blind holes are filled until the distance from the upper surface of the copper deposition on the antenna surface pattern or the peripheral pattern in the step is not more than 1.5mil, and in the S522 step, the thickness of the copper deposition on the antenna surface pattern and the peripheral pattern is 1.6-2.0 mil.
Further, in the step S6 of the manufacturing process of the radar board PCB, the thickness of the final outer layer circuit pattern is 1.3-1.5mil, and the recess of the blind hole is less than 1.2mil.
In the technical scheme, the thickness of the initial copper layer is reduced to 0.21-0.29mil, so that the initial copper layer is thinner, the attraction of the initial copper layer to copper ions can be reduced during copper deposition, the electric charge attraction on the surface of the radar PCB during the uniform electroplating process is realized, the electroplating uniformity of the surface is improved, meanwhile, the influence of the copper deposition quality in the through hole and the blind hole on the through hole electroplating and the blind hole filling in the electroplating process is weakened, and the through hole electroplating and the blind hole filling quality is improved; meanwhile, the thinner initial copper layer means that less copper is needed to balance the charge influence, so that the copper deposition amount can be reduced during the subsequent formation of the balance copper layer, the loss is reduced, and the economic benefit is improved; the thickness of copper deposition on the antenna surface graph and the peripheral graph in the primary electroplating process is maintained between 0.8 and 1.2mil, and correspondingly, the thickness of a balance copper layer is also maintained between 0.8 and 1.2mil, so that the effect of balancing the charge attraction of the surface of the radar PCB is achieved, the copper layer is thin, the copper deposition amount is small, the subsequent etching treatment is more convenient, and the cost is saved; filling the blind holes until the distance between the blind holes and the upper surface of the copper deposit on the antenna surface graph or the peripheral graph in the step is not more than 1.5mil, enabling the thickness of the copper deposit on the antenna surface graph and the peripheral graph to be 1.6-2.0mil after the secondary electroplating process, continuously filling the blind holes on the radar board PCB at the moment, increasing the copper layers of the antenna surface graph and the peripheral graph to be 1.6-2.0mil after the secondary electroplating process, and meanwhile, fully filling the blind holes until the distance between the blind holes and the upper surface of the copper deposit on the antenna surface graph or the peripheral graph in the step is not more than 1.2mil because the copper deposition speed in the blind holes is higher than that of the board surface; finally, the radar board PCB needs to be subjected to flash etching process to integrally thin the copper layer on the radar board PCB, all initial copper layers except the required outer layer circuit graph are removed through flash etching, the flash-etched copper reduction thickness is consistent with the reserved initial copper layer and ranges from 0.21 mil to 0.29mil, the thickness of the finally obtained outer layer circuit graph ranges from 1.3 mil to 1.5mil, the depression value of the blind hole is still smaller than 1.2mil, therefore, the radar board PCB can reach the standard when the depression value of the blind hole is smaller than 1.2mil, and the precision and the reliability of the radar board PCB are not affected by the depression of the blind hole at the moment.
Further, in step S51 of the manufacturing process of the radar board PCB, the distance between the balanced copper pattern and the antenna pattern and the periphery pattern are between 8 and 18 mil.
Preferably, the distance between the balanced copper pattern and the antenna pattern and the peripheral pattern is between 10 and 15 mils.
In the technical scheme, a balance copper surface is added, the distance between a developed balance copper surface pattern and an antenna surface pattern and a peripheral pattern is controlled to be 8-18mil, preferably 10-15mil, the balance copper surface pattern is not communicated with the antenna surface pattern and the peripheral pattern, so that the balance copper surface pattern, the antenna pattern and the peripheral pattern are uniformly distributed on a radar board PCB as much as possible, the charge attraction force of an area needing electroplating on the radar board PCB is balanced, the balance copper layer is prevented from being excessively concentrated with one copper layer in the antenna surface pattern and the peripheral pattern, and the uniformity of copper increase in the whole electroplating of the radar board PCB is ensured; meanwhile, the balance copper surface pattern is not communicated with the antenna surface pattern and the peripheral pattern, namely, the balance copper surface pattern area is defined in the area where the through holes and the blind holes are distributed on the radar board PCB, so that the electric charge attraction near the holes is increased, and the quality and the efficiency of through hole electroplating and blind hole filling are improved.
Further, in order to improve the efficiency and the fullness of blind hole filling, in the technical scheme, a pretreatment step is added between the step S51 and the step S52, and the pretreatment step comprises the following steps:
s121, cleaning the whole plate to remove attached impurities and oxides;
s122, attaching a gloss agent to the whole plate to attach the gloss agent to the surface of the whole plate and the blind holes;
and S123, cleaning the surface of the whole plate to enable the concentration of the polishing agent in the blind holes to be larger than that of the surface of the whole plate.
In this technical scheme, after a dry film process, still need carry out the preliminary treatment to radar board PCB before the electroplating process once, because spot facing work and heavy copper process, debris such as cull are probably adhered to in radar board PCB face and the hole, influence radar board PCB's planarization, and the heavy copper layer is easily oxidized, the electric conductivity of heavy copper layer when can influencing radar board PCB electroplating process, consequently carry out whole board cleaning process and get rid of adnexed debris and oxide on the radar board PCB, can promote the roughness of radar board PCB face, promote the electric conductivity of heavy copper layer when electroplating, promote radar board PCB's electroplating quality greatly. In order to improve the filling quality of through holes and blind holes on a radar board PCB, the whole board is required to be attached with a gloss agent, then the gloss agent attached to the board surface is washed away, so that the concentration of the gloss agent in the blind holes is greater than that of the surface of the whole board, the components of the gloss agent generally comprise a brightener, a leveling agent, a wetting agent and a dispersing agent, the brightener is accelerating particles, and the brightener acts on a copper plating layer to accelerate the deep plating capability in an electroplating process, improve the filling plumpness of the blind holes and improve the filling efficiency of the blind holes; the leveling agent is inhibiting particles which are adsorbed on the surface of the cathode, particularly microcosmic convex parts, and inhibit electrodeposition so as to level the copper plating layer; and the wetting agent and the dispersing agent play roles of wetting and mutual diffusion on the plating solution. The chemical components and formula of the gloss agent have great influence on the electroplating process, the ratio (TP) of the central thickness of a hole to the surface copper thickness of the hole designed by the chemical formula required by the integrated operation of through hole electroplating and blind hole filling in a vertical continuous electroplating line is more than 200%, and preferably, the commercially available chemicals meeting the requirements, such as VF200 of Madei and PC630 of OMG, can be adopted.
Further, in the pretreatment step, the step S121 includes at least one acid washing, one water washing, and one microetching treatment; the step S122 comprises primary acid leaching and primary pre-dipping of a gloss agent; and the step S123 comprises one-time washing, and the washing direction during the washing is horizontal to the PCB surface.
In this technical scheme, after initial radar board PCB upper plate, make radar board PCB go up copper face and blind hole and through-hole internal surface adnexed debris and break away from through the pickling, the rethread washing is washed debris out, for going out debris the most, the washing direction of washing should be perpendicular with radar board PCB face. Then soaking the cleaned radar PCB in a microetching cylinder containing acid liquor, after the microetching treatment, etching the oxidized part of the initial copper layer on the radar PCB, and soaking the acid-soaked radar PCB in a presoaking cylinder filled with a gloss agent containing accelerated particles to uniformly adhere the gloss agent to the surface and the holes of the radar PCB; and then, washing the whole radar PCB with the gloss agent once, enabling the washing direction of water flow to be parallel to the radar PCB, and removing the gloss agent on the surface of the radar PCB, so that the gloss agent with larger concentration exists in the hole, copper ions can be concentrated in the hole when copper is deposited by electroplating once, the copper thickness in the hole exceeds the surface copper, and the sunken area can be filled.
Further, the electroplating process in the step S52 adopts a vertical continuous electroplating line, and the transmission speed of the vertical continuous electroplating line is 0.3m/min.
Further, in the electroplating process in the step S52, the current coefficient adopted by the vertical continuous electroplating is 0.8 to 1.5, the current density is 10-12ASF, and the spraying frequency is 15 to 35Hz.
In the technical scheme, the electroplating process of the radar PCB still adopts vertical continuous electroplating, reduces the transmission speed of a vertical continuous electroplating line, and controls the transmission speed to be 0.3m/min, so that the radar PCB can slowly and uniformly contact with electroplating solution during electroplating spraying, the full deposition and matching are realized, and the electroplating quality of the whole radar PCB is improved; meanwhile, the current coefficient, the current density and the spraying frequency of the vertical continuous electroplating line are reduced, the electroplating uniformity is further improved by reducing the electroplating frequency and the moving speed of ions, the jet flow frequency is reduced, the electroplating time is prolonged, copper ions in the electroplating solution fully react with holes, and then micro blind holes in blind holes on a radar board PCB, areas with thicker hole walls and lower copper shielding, and the like can also be uniformly electroplated to avoid forming holes in the areas.
The beneficial effects of this technical scheme do: the outer layer dry film and the electroplating process in the MSAP manufacturing process of the radar board PCB are improved, the charge attraction of the area needing electroplating on the radar board PCB is balanced by adding the balance copper surface pattern which is not communicated with the antenna surface pattern and the peripheral pattern in the primary outer layer dry film process, particularly the charge attraction near the hole is increased, the quality and the efficiency of through hole electroplating and blind hole filling are improved, and the uniformity of electroplating copper increase is improved; in the subsequent electroplating process, all the patterns developed after the primary outer layer dry film process are electroplated and thickened, the copper layer deposited in the through hole is further thickened, the blind hole is filled, the primary outer layer dry film is removed after electroplating is finished, and the balance copper surface is etched and removed by adopting a secondary outer layer dry film process, so that the effect of integrating blind hole electroplating and filling and through hole electroplating is achieved, and meanwhile, the electroplating and filling quality is improved.
Drawings
FIG. 1 is a flow chart of the MSAP manufacturing process of the present invention.
FIG. 2 is a schematic diagram of an additional balanced copper surface pattern according to the present invention.
FIG. 3 is a flow chart of an electroplating process on a radar board PCB of the present invention.
FIG. 4 is a diagram of the process of filling blind holes in the PCB of the radar board of the present invention.
FIG. 5 is a test chart of example 1.
FIG. 6 is a test chart of example 2.
FIG. 7 is a test chart of example 3.
Detailed Description
The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For the purpose of better illustrating the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1 to 4, in the present embodiment, the MSAP manufacturing process is adopted for the radar board PCB, and the whole board lamination of the radar board PCB is completed first;
then, reducing copper of the radar board PCB to reduce the thickness of the copper layer of the outer layer board of the radar board PCB so as to form an initial copper layer with the thickness of 0.25 mil;
then, hole machining is carried out on the radar board PCB, and through holes and blind holes which are connected with different layers and have the diameter of 6mil are machined in the whole board;
then, carrying out copper deposition on the radar board PCB, and depositing copper layers in the through holes and the blind holes to realize the electric connection of each layer;
then, carrying out an outer layer dry film process on the radar board PCB, exposing and developing to expose an antenna surface graph to be thickened, a peripheral graph, a through hole, a blind hole and an initial copper layer of a balance copper surface graph;
then, electroplating the radar PCB by using a vertical continuous electroplating line, wherein the transmission speed of the vertical continuous electroplating line is 0.3m/min, the current coefficient is 1.0, and the spraying frequency is 30Hz; firstly, carrying out a primary electroplating process, after loading a plate, separating impurities attached to the copper surface and the inner surface of a hole by acid washing, washing the impurities out by water, then putting the impurities into a microetching cylinder to etch the oxidized part of the copper deposited on the plate surface, soaking the copper-deposited part in a presoaking cylinder containing Mai De Mei VF200 series gloss agents, and then washing the copper-deposited part to reduce the concentration of the gloss agents on the plate surface, so that the concentration of the gloss agents in the hole is higher, the deposition speed of the copper in the blind hole is higher than that of other parts, and filling the blind hole; then washing off the gloss agent in the hole by water, and carrying out a secondary electroplating process to enable the thickness of copper deposition on the antenna surface pattern and the peripheral pattern to reach more than 1.5 mil;
then, carrying out a secondary outer layer dry film process, and exposing the balanced copper surface pattern through exposure and development;
the balanced copper surface pattern is then etched away by a flash etching process.
Then, an optical microscope is used for carrying out section observation on the obtained radar plate PCB, and the blind hole filling effect is tested; the test process is as follows:
a. sampling: taking down a blind hole sample from the radar PCB, polishing the sample and pouring glue to form a slice convenient for observation;
b. coarse grinding: roughly grinding the section to the middle of the aperture of the blind hole;
c. polishing: polishing the surface of the slice;
d. micro-etching: dipping a clean cotton swab in the microetching solution, placing the microetching solution on a position to be observed of a sample, immediately washing the sample by using water after the microetching solution lasts for 5 seconds, and then ultrasonically cleaning the sample;
e. and (4) observation: after the sample is dried, an optical microscope is used for observation, and the brightness and the contrast of the image should be adjusted in the observation process so as to achieve the optimal observation and imaging effects.
In the embodiment, a detection image of the blind hole section of the PCB of the radar board is shown in FIG. 5.
Example 2
As shown in fig. 1 to 4, in the present embodiment, the MSAP manufacturing process is adopted for the radar board PCB, and the whole board lamination of the radar board PCB is completed first;
then, reducing copper of the radar PCB to reduce the thickness of the copper layer of the outer layer board of the radar PCB so as to form an initial copper layer with the thickness of 0.25 mil;
then, hole machining is carried out on the radar board PCB, and through holes and blind holes which are connected with different layers and have the diameter of 5.5mil are machined in the whole board;
then, carrying out copper deposition on the radar board PCB, and depositing copper layers in the through holes and the blind holes to realize the electric connection of each layer;
then, carrying out an outer layer dry film process on the radar board PCB, exposing and developing to expose an antenna surface graph to be thickened, a peripheral graph, a through hole, a blind hole and an initial copper layer of a balance copper surface graph;
then, electroplating the radar PCB by using a vertical continuous electroplating line, wherein the transmission speed of the vertical continuous electroplating line is 0.3m/min, the current coefficient is 1.0, and the spraying frequency is 30Hz; firstly, carrying out a primary electroplating process, after loading a plate, separating impurities attached to the copper surface and the inner surface of a hole by acid washing, washing the impurities out by water, then putting the impurities into a microetching cylinder to etch the oxidized part of the copper deposited on the plate surface, soaking the copper-deposited part in a presoaking cylinder containing Mai De Mei VF200 series gloss agents, and then washing the copper-deposited part to reduce the concentration of the gloss agents on the plate surface, so that the concentration of the gloss agents in the hole is higher, the deposition speed of the copper in the blind hole is higher than that of other parts, and filling the blind hole; then washing off the gloss agent in the hole by water, and carrying out a secondary electroplating process to enable the thickness of copper deposition on the antenna surface pattern and the peripheral pattern to reach more than 1.5 mil;
then, carrying out a secondary outer layer dry film process, and exposing the balanced copper surface pattern through exposure and development;
the balanced copper surface pattern is then etched away by a flash etching process.
Then, an optical microscope is used for carrying out section observation on the obtained radar plate PCB, and the blind hole filling effect is tested; the test process is as follows:
a. sampling: taking down a blind hole sample from the radar PCB, polishing the sample and pouring glue to form a slice convenient for observation;
b. coarse grinding: roughly grinding the section to the middle of the aperture of the blind hole;
c. polishing: polishing the surface of the slice;
d. micro-etching: dipping a clean cotton swab in the microetching solution, placing the microetching solution on a position to be observed of a sample, immediately washing the sample by using water after the microetching solution lasts for 5 seconds, and then ultrasonically cleaning the sample;
e. and (4) observation: after the sample is dried, an optical microscope is used for observation, and the brightness and the contrast of the image should be adjusted in the observation process so as to achieve the optimal observation and imaging effects.
In the embodiment, a detection image of the blind hole section of the PCB is shown in FIG. 6.
Example 3
As shown in fig. 1 to 4, in the present embodiment, the MSAP manufacturing process is adopted for the radar board PCB, and the whole board lamination of the radar board PCB is completed first;
then, reducing copper of the radar board PCB to reduce the thickness of the copper layer of the outer layer board of the radar board PCB so as to form an initial copper layer with the thickness of 0.25 mil;
then, hole machining is carried out on the PCB, and through holes and blind holes which are connected with different layers and have the diameter of 5.0mil are machined in the whole board;
then, carrying out copper deposition on the radar board PCB, and depositing copper layers in the through holes and the blind holes to realize the electric connection of each layer;
then, carrying out an outer layer dry film process on the radar board PCB once, and exposing the antenna surface graph to be thickened, the peripheral graph, the through hole, the blind hole and an initial copper layer of the balance copper surface graph after exposure and development;
then, electroplating the radar PCB by using a vertical continuous electroplating line, wherein the transmission speed of the vertical continuous electroplating line is 0.3m/min, the current coefficient is 1.0, and the spraying frequency is 30Hz; firstly, carrying out a primary electroplating process, after loading a plate, separating impurities attached to the copper surface and the inner surface of a hole by acid washing, washing the impurities out by water, then putting the impurities into a microetching cylinder to etch the oxidized part of the copper deposited on the plate surface, soaking the copper-deposited part in a presoaking cylinder containing Mai De Mei VF200 series gloss agents, and then washing the copper-deposited part to reduce the concentration of the gloss agents on the plate surface, so that the concentration of the gloss agents in the hole is higher, the deposition speed of the copper in the blind hole is higher than that of other parts, and filling the blind hole; then washing away the gloss agent in the hole, and carrying out a secondary electroplating process to enable the thickness of copper deposition on the antenna surface pattern and the peripheral pattern to reach more than 1.5 mil;
then, carrying out a secondary outer layer dry film process, and exposing the balanced copper surface pattern through exposure and development;
the balanced copper surface pattern is then etched away by a flash etching process.
Then, an optical microscope is used for carrying out slice observation on the obtained radar board PCB, and the blind hole filling effect of the radar board PCB is tested; the test process is as follows:
a. sampling: taking down the blind hole sample from the radar board PCB, polishing and filling glue into the sample to form a slice convenient for observation;
b. coarse grinding: roughly grinding the slices to the middle of the aperture of the blind hole;
c. polishing: polishing the surface of the slice;
d. micro-etching: dipping a clean cotton swab in the microetching solution, placing the microetching solution on a position to be observed of a sample, immediately washing the sample by using water after the microetching solution lasts for 5 seconds, and then ultrasonically cleaning the sample;
e. and (4) observation: after the sample is dried, an optical microscope is used for observation, and the brightness and the contrast of the image should be adjusted in the observation process so as to achieve the optimal observation and imaging effects.
The detection image of the blind hole section of the PCB of the radar board in the embodiment is shown in FIG. 7.
As shown in fig. 5 to 7, the blind via hole with a 6mil aperture produced in example 1 is completely filled with copper, the recess value from the top of the surrounding antenna pattern or peripheral pattern is 1.08mil, and the thickness of the copper deposit at two adjacent positions of the surrounding antenna pattern or peripheral pattern is 1.52mil and 1.74mil; the blind via hole with 5.5mil aperture produced in example 2 was completely filled with copper, the recess value from the top of the surrounding antenna pattern or peripheral pattern was 0.86mil, and the thickness of the copper deposit at two adjacent positions of the surrounding antenna pattern or peripheral pattern was 1.97mil and 1.78mil; the blind via produced in example 3, which had a 5mil via size, was completely filled with copper, with a recess of 0.83mil from the top of the surrounding antenna pattern or peripheral pattern, and with a copper deposit thickness of 1.80mil and 1.64mil between two adjacent portions of the surrounding antenna pattern or peripheral pattern. The depression value of the blind hole in the three embodiments from the top of the surrounding antenna pattern or the surrounding pattern is smaller than 1.2mil, the hole filling effect is uniform and full, the hole filling quality is excellent, meanwhile, the difference of the copper deposition thicknesses of two adjacent positions of the antenna pattern or the surrounding pattern in the slice of the radar board PCB is not large, the electroplating uniformity in the technical scheme is reflected to be excellent, accordingly, the technical scheme can be considered to improve the outer layer dry film and the electroplating process in the MSAP manufacturing process of the radar board PCB, the effect of integrating the blind hole electroplating hole filling and the through hole electroplating is achieved, and the electroplating quality and the hole filling quality are greatly improved.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.
Claims (10)
1. A radar board PCB manufacturing process comprises the following steps:
s1, completing whole plate pressing;
s2, reducing copper to reduce the thickness of the copper layer of the outer plate and form an initial copper layer;
s3, hole machining, namely machining through holes and blind holes which are connected with different layers on the whole plate;
s4, depositing copper, namely depositing copper layers in the through holes and the blind holes to realize the electric connection of each layer;
s5, forming an outer layer circuit pattern on the initial copper layer and filling the blind holes by using an outer layer dry film process and an electroplating process;
s6, removing redundant initial copper layers by a flash etching process to form a final outer layer circuit pattern;
entering a subsequent process;
the method is characterized in that the step S5 comprises the following steps:
s51, performing an outer layer dry film process, exposing an initial copper layer of a to-be-thickened graph after exposure and development, wherein the to-be-thickened graph comprises an antenna surface graph, a peripheral graph, a through hole, a blind hole and a balance copper surface graph filled between the antenna surface graph and the peripheral graph, and the balance copper surface graph is not communicated with the antenna surface graph and the peripheral graph;
s52, electroplating, namely electroplating the to-be-thickened graph on the initial copper layer, wherein the to-be-thickened graph comprises thickening the thicknesses of the antenna surface graph, the peripheral graph and the balance copper surface graph, thickening the copper layer deposited in the through hole, filling the blind hole, and removing the outer dry film once;
and S53, etching the balance copper surface pattern by using a secondary outer layer dry film process.
2. The manufacturing process of the PCB of claim 1, wherein the step S52 specifically comprises:
s521, a one-step electroplating process is carried out, so that the deposition speed of copper in the blind hole is higher than that of other parts, and the blind hole filling is completed;
s522, secondary electroplating process, wherein the thickness of copper deposition on the antenna surface pattern and the peripheral pattern at least reaches 4-8 times of the thickness of the initial copper layer.
3. The process of claim 2, wherein the thickness of the initial copper layer in the step S2 is 0.21-0.29mil, the thickness of the copper deposit on the antenna surface pattern and the peripheral pattern in the step S521 is 0.8-1.2mil, the blind via is filled to a distance not more than 1.5mil from the upper surface of the copper deposit on the antenna surface pattern or the peripheral pattern in the step S521, and the thickness of the copper deposit on the antenna surface pattern and the peripheral pattern in the step S522 is 1.6-2.0 mil.
4. The process of claim 1, wherein in the step S6, the final outer layer circuit pattern has a thickness of 1.3-1.5mil, and the blind via recess is less than 1.2mil.
5. The manufacturing process of PCB of claim 1, wherein the distance between the balanced copper pattern and the antenna pattern and the periphery pattern in step S51 is between 8-18 mil.
6. The manufacturing process of a PCB of a radar board as recited in claim 5, wherein the distance between the balanced copper pattern and the antenna pattern and the periphery pattern in the step S51 is between 10 and 15 mils.
7. The PCB manufacturing process of any of claims 1 to 6, further comprising the following preprocessing steps after the step S51 and before the step S52:
s121, cleaning the whole plate to remove attached impurities and oxides;
s122, attaching a gloss agent to the whole plate to attach the gloss agent to the surface of the whole plate and the blind holes;
and S123, cleaning the surface of the whole plate to enable the concentration of the polishing agent in the blind holes to be larger than that of the surface of the whole plate.
8. The manufacturing process of a radar panel PCB according to claim 7, wherein in the preprocessing step, the step S121 includes at least one acid washing, one water washing and one micro etching treatment; the step S122 comprises primary acid leaching and primary pre-dipping of a gloss agent; and the step S123 comprises one-time washing, and the washing direction during the washing is horizontal to the surface of the PCB of the radar board.
9. The manufacturing process of a radar board PCB according to claim 1, wherein the plating process in the step S52 uses a vertical continuous plating line, and a transmission speed of the vertical continuous plating line is 0.3m/min.
10. The manufacturing process of the PCB as claimed in claim 9, wherein in the electroplating process in the step S52, the current coefficient adopted by the vertical continuous electroplating is 0.8 to 1.5, the current density is 10-12ASF, and the spraying frequency is 15 to 35Hz.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
| CN106132116A (en) * | 2016-07-05 | 2016-11-16 | 广州美维电子有限公司 | A kind of wiring board blind hole fills out process for copper |
| CN106211561A (en) * | 2016-08-29 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | PCB outer graphics plating flow dividing structure and shunt method thereof |
| CN108601245A (en) * | 2018-05-30 | 2018-09-28 | 江门崇达电路技术有限公司 | A kind of electro-plating method of HDI plates high thickness to diameter ratio blind hole |
| CN110662361A (en) * | 2019-10-11 | 2020-01-07 | 广州添利电子科技有限公司 | Embedded radar antenna PCB manufacturing process |
| CN112437558A (en) * | 2020-11-16 | 2021-03-02 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
-
2022
- 2022-10-08 CN CN202211221696.1A patent/CN115297618B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
| CN106132116A (en) * | 2016-07-05 | 2016-11-16 | 广州美维电子有限公司 | A kind of wiring board blind hole fills out process for copper |
| CN106211561A (en) * | 2016-08-29 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | PCB outer graphics plating flow dividing structure and shunt method thereof |
| CN108601245A (en) * | 2018-05-30 | 2018-09-28 | 江门崇达电路技术有限公司 | A kind of electro-plating method of HDI plates high thickness to diameter ratio blind hole |
| CN110662361A (en) * | 2019-10-11 | 2020-01-07 | 广州添利电子科技有限公司 | Embedded radar antenna PCB manufacturing process |
| CN112437558A (en) * | 2020-11-16 | 2021-03-02 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
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| CN115297618B (en) | 2023-11-03 |
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