CN115295703A - LED chip fluorescent glue film pressing forming device and process thereof - Google Patents
LED chip fluorescent glue film pressing forming device and process thereof Download PDFInfo
- Publication number
- CN115295703A CN115295703A CN202210952943.9A CN202210952943A CN115295703A CN 115295703 A CN115295703 A CN 115295703A CN 202210952943 A CN202210952943 A CN 202210952943A CN 115295703 A CN115295703 A CN 115295703A
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- film pressing
- die base
- led chip
- fluorescent glue
- upper die
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- 238000003825 pressing Methods 0.000 title claims abstract description 108
- 239000003292 glue Substances 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 title claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 72
- 238000007493 shaping process Methods 0.000 claims description 34
- 230000003028 elevating effect Effects 0.000 claims description 21
- 238000009434 installation Methods 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 8
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 8
- 241001330002 Bambuseae Species 0.000 claims description 8
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 8
- 239000011425 bamboo Substances 0.000 claims description 8
- 230000005012 migration Effects 0.000 claims description 7
- 238000013508 migration Methods 0.000 claims description 7
- 210000005069 ears Anatomy 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 2
- 210000001503 joint Anatomy 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 210000003128 head Anatomy 0.000 description 20
- 239000000843 powder Substances 0.000 description 9
- 238000005507 spraying Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007723 die pressing method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 241001232346 Gymnosperma glutinosum Species 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000002489 tectorial membrane Anatomy 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a light-emitting diode (LED) chip fluorescent glue film pressing forming device and a process thereof, which belong to the technical field of LED chip processing, and comprise a forming box, a film pressing lifting mechanism, a film pressing moving mechanism, a film pressing balancing mechanism, a forming buffer mechanism, a film pressing mold and an automatic dispensing mechanism, wherein the film pressing lifting mechanism is arranged on the forming box, the film pressing balancing mechanism is arranged on the film pressing lifting mechanism, the film pressing balancing mechanism comprises an automatic balancing device and a balance adjusting device, the automatic balancing device is positioned at the lifting end of the film pressing lifting mechanism, the balance adjusting device is arranged on the film pressing lifting mechanism, and the balance adjusting device is in butt joint with the automatic balancing device. According to the invention, the balance plate is adjusted to be in a balanced state, so that the upper die base is in a horizontal state, the thickness of the fluorescent glue on the LED chip is consistent when film pressing is carried out, and the phenomenon that the LED chip emits light inconsistently to influence subsequent use due to the fact that the thickness of the fluorescent glue is not uniform and inconsistent when the film pressing is carried out on the LED chip by the fluorescent glue due to unbalance of the upper die base is avoided.
Description
Technical Field
The invention belongs to the technical field of LED chip processing, and particularly relates to an LED chip fluorescent glue film pressing forming device and a process thereof.
Background
At present white light LED adopts the blue light wafer to add the encapsulation of phosphor powder coating more and forms, and the phosphor powder coating mainly contains fluorescent glue dispensing technique, fluorescent glue spraying technique and fluorescent glue tectorial membrane technique, adopts the fluorescent glue that the blue light arouses, and the thickness on fluorescent glue layer seriously influences the luminous efficacy of product, and the homogeneity of fluorescent glue thickness also has very big influence to the uniformity and the yields of product.
Fluorescent glue dispensing technology: the traditional dispensing process is to mix and defoam powder and glue and then dispense the powder and glue on the surface, and after baking, an arc-shaped structure with a thick middle part and thin two sides is formed on the surface of an LED wafer, so that a large amount of fluorescent powder is low in excitation efficiency and uneven in light emission, yellow rings and blue rings are generated, the consistency of a product is difficult to control, and color areas are dispersed.
Fluorescent glue spraying technology: the existing spraying technology has large spraying area and is easy to cause uneven spraying; after spraying, the colloid has high fluidity, so that the glue is overflowed; the fluorescent glue of the packaged product after spraying is fully distributed on the substrate, so that the appearance is not attractive; in the product after the whole-plate spraying, fluorescent powder powdery substances exist between the external sealing glue and the substrate, and the external sealing glue is easy to separate from the substrate. But also results in a large area of phosphor coverage on the LED substrate. After the solvent is added for dilution, the fluorescent powder is very easy to settle, so that the content of the fluorescent powder at the bottom of the charging barrel is higher than that of the fluorescent powder at the upper layer; after the materials are mixed, the components of the raw materials are changed greatly, the material consumption is not controllable, the repeatability of production is poor, and the consistency of products is reduced.
Fluorescent glue film coating technology: the phosphor coating technique requires the bonding between the LED chip and the coating by dispensing with a device, resulting in high cost, serious waste, complicated operation, and reduced brightness.
However, when the existing fluorescent glue film forming device is used, the upper die moves downwards, the position of the upper die head cannot be always in the horizontal and balanced position, and the difference of the positions of the upper die head and the fluorescent glue in contact when film pressing is carried out has deviation, so that the thickness of the fluorescent glue film is uneven, the light emission of a follow-up LED chip is influenced, and the qualification rate of the LED chip is influenced.
Therefore, it is desirable to provide a device and a process for molding a fluorescent glue film for an LED chip.
Disclosure of Invention
The embodiment of the invention provides a light-emitting diode (LED) chip fluorescent glue film pressing forming device and a process thereof, which aim to solve the problems in the prior art.
The embodiment of the invention adopts the following technical scheme: the utility model provides a LED chip fluorescence glues film pressing forming device and technology thereof, includes shaping case, film pressing elevating system, film pressing moving mechanism, film pressing balance mechanism, shaping buffer gear, film pressing mould and automatic point gum machine and constructs, the shaping case is the level setting, be equipped with the carriage release lever of four vertical settings in the shaping incasement, film pressing elevating system sets up on the shaping case and film pressing elevating system's lift end and four carriage release lever sliding fit, film pressing moving mechanism level sets up the bottom in the shaping case, film pressing balance mechanism sets up on film pressing elevating system, film pressing balance mechanism includes automatic balancing unit and balanced adjusting device, automatic balancing unit is located film pressing elevating system's lift and serves, balanced adjusting device sets up on film pressing elevating system, balanced adjusting device and automatic balancing unit dock, film pressing mould sets up respectively on film pressing moving mechanism and film pressing balance mechanism, shaping buffer gear sets up on film pressing mould, automatic point gum machine sets up in the shaping incasement, be equipped with film pressing elevating system, film pressing moving balance adjusting mechanism, film pressing balance adjusting mechanism, automatic point gum machine and automatic point gum machine control.
Further, press mold elevating system includes lift electric jar, lifter plate and lifting frame, the lift electric jar is located the top of shaping case, the lifting frame is connected on the flexible end of lift electric jar, lifter plate and four carriage release levers sliding fit, the top fixed connection of lifting frame and lifter plate, be equipped with on the lateral wall of shaping case with controller electric connection's position sensor.
Further, automatic balancing device includes balance plate, an installation section of thick bamboo, slide bar, first balance spring, rotates seat, two first dwangs and two second dwangs, the vertical setting of an installation section of thick bamboo is on the lifter plate, slide bar sliding connection is in an installation section of thick bamboo, the both ends of first balance spring are connected on an installation section of thick bamboo and slide bar, rotate the seat and rotate the bottom of connecting at the slide bar, two the one end of first dwang is rotated and is connected at the both ends of rotating the seat, two the top of second dwang rotates with the other end of two first dwangs respectively and is connected, the top of balance plate is rotated and is connected the bottom at two second dwangs, the balance plate is the level setting, is connected with second balance spring between two second dwangs.
Further, balance adjustment device all includes rolling disc, first gear, second gear, rotation motor, driving electricity jar, regulation circle piece and regulation cylinder, the rolling disc rotates to be connected on the lifter plate, be equipped with the mounting groove in the lifter plate, first gear level sets up on the rolling disc, the second gear rotates to be connected in the mounting groove and second gear and first gear engagement, the rotation motor is located the top of lifter plate and is connected with second gear drive, the vertical setting of driving electricity jar is on the rolling disc, it is connected with the flexible end of driving electricity jar to adjust the circle piece, adjust the cylinder setting on the second dwang, be equipped with the draw-in groove with regulation circle piece joint on the regulation cylinder.
Further, press mold moving mechanism removes seat and two press mold and removes the slip table, two the press mold removes the slip table symmetry and sets up the interior bottom at the shaping incasement, remove the seat setting and serve at the removal of two press mold removal slip tables, be equipped with the contact pick-up that the seat set up is removed to the orientation in the shaping incasement, contact pick-up and controller electric connection.
Further, the press mold comprises an upper mold base, a lower mold base, a gasket and a heating table, the heating table is horizontally arranged on the movable base, the lower mold base is horizontally arranged at the top of the heating table, the upper mold base is arranged at the bottom of the balance plate, the gasket is arranged on the upper mold base, a boss is arranged on the lower mold base, an infrared sensor is arranged on the forming box, the infrared sensor is arranged at the pressing position of the upper mold base and the lower mold base, the infrared sensor is electrically connected with the controller, two electromagnetic regions are arranged on the lower mold base, and two magnetic blocks corresponding to the electromagnetic regions are arranged on the upper mold base.
Furthermore, the forming buffer mechanism comprises four positioning pins and four buffer springs, the four positioning pins are arranged on the lower die base, the upper die base is provided with four placing grooves, the four buffer springs are respectively arranged in the four placing grooves, and each buffer spring is provided with a buffer cushion.
Further, automatic point gum machine constructs including horizontal migration slip table, point glue electric jar, automatic point gum head and installing frame, horizontal migration slip table level sets up at the shaping incasement, the tail end of point glue electric jar is held with the removal of horizontal migration slip table and is connected, the installing frame is held with the flexible of point glue electric jar and is connected, automatic point gum head sets up on the installing frame.
Further, be equipped with four installation ears on the upper die base, four the installation ear is the rectangle and sets up on the upper die base, every all be equipped with the bolt on the upper die base, the upper die base passes through the bolt and installs on the balance plate.
A molding process of an LED chip fluorescent glue film molding device comprises the following steps:
the first step is as follows: when fluorescent glue is molded, the controller controls the two film pressing moving sliding tables to move the lower die base to the position below the automatic dispensing head, the controller controls the horizontal moving sliding tables to work to drive the automatic dispensing head to move to the position above the upper die base, the mounting frame is driven to move downwards through the work of the dispensing cylinder to drive the automatic dispensing head to move, so that the automatic dispensing head drops the fluorescent glue on the boss, the dispensing cylinder drives the automatic dispensing head to move upwards after dispensing is completed, the lower die base is moved to the position below the upper die base through the two film pressing moving sliding tables, and the position of the lower die base is controlled through the contact sensor at the moment so that the lower die base is butted with the upper die base;
the second step: when film pressing is carried out, the controller controls the lifting electric cylinder to work to drive the lifting frame to move downwards so as to drive the lifting plate to move on the four moving rods, the upper die base moves towards the lower die base, the four positioning pins move on the four buffer cushions in the moving process, the four buffer cushions buffer the force generated when the upper die base moves downwards through the four buffer springs, and the LED chips can be prevented from being damaged when the upper die base moves downwards;
the third step: when the fluorescent glue is subjected to film pressing, the upper die base is required to be always kept in a horizontal state, so that the fluorescent glue keeps consistent in thickness after being formed on the LED chip, at the moment, the sliding rod moves up and down in the mounting cylinder through the first balance spring, the rotating base of the belt rotates, the two first rotating rods and the two second rotating rods rotate, the two second rotating rods are always in a balanced state through the second balance spring, the balance plate is kept in a horizontal state, so that the fluorescent glue is subjected to film pressing in the subsequent process, and the film pressing of the fluorescent glue on the LED chip is uniform;
the fourth step: when the infrared sensor detects that one end of the upper die base is in a tilting state, the electric cylinder is driven to work to drive the adjusting round block to move downwards into the clamping groove in the adjusting cylinder, the controller controls the rotating motor to work to drive the first gear to rotate so as to drive the second gear to rotate, the rotating disc is made to rotate, the electric cylinder is driven to drive the adjusting round block to move downwards while rotating, the adjusting round block is clamped in the clamping groove in the adjusting cylinder, the position of the second rotating rod is driven to rotate through the work of the electric cylinder, the balance plate is adjusted to a balance state so that the upper die base is in a horizontal state, the thickness of fluorescent glue on an LED chip is consistent when film pressing is conducted, and the consistency of light emitting of a follow-up LED chip is ensured;
the fifth step: when the film pressing is carried out, the heating table works to solidify the fluorescent glue, so that the forming speed of the fluorescent glue is accelerated, and the fluorescent glue is solidified on the LED chip;
and a sixth step: after the chip film pressing is completed, the film pressing lifting mechanism works to move the upper die base upwards, the LED chip formed on the lower die base is moved outwards through the film pressing moving mechanism, and the LED chip is manually taken out.
The embodiment of the invention adopts at least one technical scheme to achieve the following beneficial effects:
firstly, when the fluorescent glue is subjected to film pressing, the upper die base is required to be always kept in a horizontal state, so that the fluorescent glue keeps consistent in thickness after being formed on an LED chip, at the moment, the sliding rod moves up and down in the mounting cylinder through the first balance spring, the rotating base of the belt rotates, the two first rotating rods and the two second rotating rods rotate, the two second rotating rods are always in a balanced state through the second balance spring, the balance plate is kept in a horizontal state, so that the film pressing of the fluorescent glue is performed subsequently, and the film pressing of the fluorescent glue on the LED chip is uniform; when the infrared sensor detects that the one end of upper die base is in the perk state, will with signal transmission to on the controller, controller this moment control drive electric jar work drives regulation circle piece in the draw-in groove of removal cylinder downwards, thereby the controller control rotates first gear of motor work drive and drives second gear revolve, make the rolling disc rotate, drive the electric jar and drive regulation circle piece downstream in the pivoted, make regulation circle piece joint in the draw-in groove of adjustment cylinder, the position of drive second dwang is rotated through the work of drive electric jar, adjust the balance plate to balanced state and make the upper die base be in the horizontality, in order to guarantee that fluorescent glue is unanimous at the thickness of LED chip when carrying out the press mold, can not because the unbalance of the upper die base leads to the fluorescent glue when the press mold is pressed on the LED chip, the inhomogeneous inconsistency of thickness of fluorescent glue, lead to the luminous nonconformity of LED chip, influence follow-up use.
Secondly, the upper die base moves towards the lower die base, the four buffer cushions move through the four positioning pins in the moving process, the four buffer cushions buffer the force generated when the upper die base moves downwards through the four buffer springs, and the LED chip can be prevented from being damaged when the upper die base moves downwards.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not limit the invention. In the drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a partial perspective view of the present invention;
fig. 4 is a schematic perspective view of a film pressing balance mechanism according to the present invention;
FIG. 5 is an enlarged view taken at A in FIG. 4;
FIG. 6 is a cross-sectional view of an adjustment cylinder of the present invention;
FIG. 7 is a schematic perspective view of the squeeze film moving mechanism and the lower die holder according to the present invention;
FIG. 8 is a schematic perspective view of an upper mold base according to the present invention;
FIG. 9 is a schematic perspective view of the automatic dispensing mechanism of the present invention;
FIG. 10 is a schematic view of the upper and lower die bases of the present invention as they are being pressed together;
fig. 11 is a top view of a lamination die of the present invention;
FIG. 12 is a cross-sectional view taken along line B-B of FIG. 11;
fig. 13 is a schematic structural diagram of an LED chip product produced by the apparatus and process of the present invention.
Reference numerals
The molding box 1, the moving rod 11, the film pressing lifting mechanism 2, the lifting electric cylinder 21, the lifting plate 22, the lifting frame 23, the position sensor 24, the film pressing moving mechanism 3, the moving seat 31, the film pressing moving sliding table 32, the contact sensor 33, the film pressing balancing mechanism 4, the automatic balancing device 41, the balancing plate 411, the mounting cylinder 412, the sliding rod 413, the first balancing spring 414, the rotating seat 415, the first rotating rod 416, the second rotating rod 417, the second balancing spring 418, the balance adjusting device 42, the rotating disc 421, the first gear 422, the second gear 423, the rotating motor 424, the driving electric cylinder 425, the adjusting circular block 426, the adjusting cylinder 427, the clamping groove 428, the molding buffer mechanism 5, the positioning needle 51, the buffer spring 52, the buffer pad 53, the film pressing mold 6, the upper mold base 61, the lower mold base 62, the gasket 63, the heating table 64, the mounting lug 65, the infrared sensor 67, the electromagnetic zone 68, the magnetic block 69, the automatic dispensing mechanism 7, the horizontal moving sliding table 71, the electric cylinder 72, the automatic dispensing head 73, the mounting frame 74, and the controller 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 12, an embodiment of the present invention provides an LED chip fluorescent glue film pressing forming apparatus and a process thereof, including a forming box 1, a film pressing lifting mechanism 2, a film pressing moving mechanism 3, a film pressing balancing mechanism 4, a forming buffer mechanism 5, a film pressing mold 6 and an automatic dispenser mechanism 7, wherein the forming box 1 is horizontally disposed, four vertically disposed moving rods 11 are disposed in the forming box 1, the film pressing lifting mechanism 2 is disposed on the forming box 1, lifting ends of the film pressing lifting mechanism 2 are in sliding fit with the four moving rods 11, the film pressing moving mechanism 3 is horizontally disposed at an inner bottom of the forming box 1, the film pressing balancing mechanism 4 is disposed on the film pressing lifting mechanism 2, press mold balanced mechanism 4 includes automatic balancing device 41 and balanced adjusting device 42, automatic balancing device 41 is located press mold elevating system 2 lift and serves, balanced adjusting device 42 sets up on press mold elevating system 2, balanced adjusting device 42 docks with automatic balancing device 41, press mold mould 6 sets up respectively on press mold moving mechanism 3 and press mold balanced mechanism 4, shaping buffer gear 5 sets up on press mold mould 6, automatic dispensing mechanism 7 sets up in shaping case 1, be equipped with on shaping case 1 with press mold elevating system 2, press mold moving mechanism 3, balanced adjusting device 42, shaping buffer gear 5, press mold mould 6 and automatic dispensing mechanism 7 electric connection's controller 8, controller 8 models IPC-940.
Specifically, press mold elevating system 2 includes lift electric cylinder 21, lifter plate 22 and lifting frame 23, lift electric cylinder 21 is located the top of shaping case 1, lifting frame 23 is connected on lift electric cylinder 21's flexible end, lifter plate 22 and four carriage bars 11 sliding fit, lifter plate 23 and lifter plate 22's top fixed connection, be equipped with on the lateral wall of shaping case 1 with controller 8 electric connection's position sensor 24. Position sensor 24 model LX34050, thereby controller 8 control lift electric cylinder 21 work drives lift frame 23 and moves down driving lifter plate 22 and remove on four carriage release levers 11, move upper die base 61 to lower die base 62, position sensor 24 will be with signal transmission to controller 8 after sensing the position of last mould this moment, controller 8 will control lift electric cylinder 21 stop work, make be equipped with the space that supplies pressure membrane balance mechanism 4 adjustment upper die base 61 between upper die base 61 and the die base 62, adjust the back to upper die base 61, make upper die base 61 and die base 62 merge, so that follow-up pressure membrane to fluorescent glue, make the even operation of fluorescent glue pressure membrane on the LED chip.
Specifically, the automatic balancing device 41 includes a balancing plate 411, an installation cylinder 412, a sliding rod 413, a first balancing spring 414, a rotating seat 415, two first rotating rods 416 and two second rotating rods 417, the installation cylinder 412 is vertically disposed on the lifting plate 22, the sliding rod 413 is slidably connected in the installation cylinder 412, two ends of the first balancing spring 414 are connected to the installation cylinder 412 and the sliding rod 413, the rotating seat 415 is rotatably connected to the bottom of the sliding rod 413, one end of each of the two first rotating rods 416 is rotatably connected to two ends of the rotating seat 415, top portions of the two second rotating rods 417 are respectively rotatably connected to the other ends of the two first rotating rods 416, top portions of the balancing plate 411 are rotatably connected to bottom portions of the two second rotating rods 417, the balancing plate 411 is horizontally disposed, and the second balancing spring 418 is connected between the two second rotating rods 417; the balance adjusting devices 42 each include a rotating disc 421, a first gear 422, a second gear 423, a rotating motor 424, an electric driving cylinder 425, an adjusting circular block 426 and an adjusting cylinder 427, the rotating disc 421 is rotatably connected to the lifting plate 22, a mounting groove is formed in the lifting plate 22, the first gear 422 is horizontally arranged on the rotating disc 421, the second gear 423 is rotatably connected to the mounting groove, the second gear 423 is meshed with the first gear 422, the rotating motor 424 is located at the top of the lifting plate 22 and is in transmission connection with the second gear 423, the electric driving cylinder 425 is vertically arranged on the rotating disc 421, the adjusting circular block 426 is connected with the telescopic end of the electric driving cylinder 425, the adjusting cylinder 427 is arranged on the second rotating bar 417, and a clamping groove 428 clamped with the adjusting circular block 426 is formed in the adjusting cylinder 427. When the film pressing is performed on the fluorescent glue, the upper die holder 61 needs to be always kept in a horizontal state, so that the thickness of the fluorescent glue is kept consistent after the fluorescent glue is formed on the LED chip, at this time, the sliding rod 413 moves up and down in the mounting cylinder 412 through the first balance spring 414, so that the rotating seat 415 of the belt rotates, the two first rotating rods 416 and the two second rotating rods 417 rotate, the two second rotating rods 417 are always in a balanced state through the second balance spring 418, and the balance plate 411 is kept in a horizontal state, so that the film pressing is performed on the fluorescent glue in the subsequent process, and the film pressing on the LED chip by the fluorescent glue is uniform; when the infrared sensor 67 detects that one end of the upper die holder 61 is in a tilting state, a signal is transmitted to the controller 8, the controller 8 controls the driving electric cylinder 425 to work at the moment to drive the adjusting circular block 426 to move downwards into the clamping groove 428 in the adjusting cylinder 427, the controller 8 controls the rotating motor 424 to work to drive the first gear 422 to rotate so as to drive the second gear 423 to rotate, the rotating disc 421 rotates, the driving electric cylinder 425 drives the adjusting circular block 426 to move downwards while rotating, the adjusting circular block 426 is clamped in the clamping groove 428 in the adjusting cylinder 427, the position of the second rotating rod 417 is driven to rotate by the work of the driving electric cylinder 425, the balance plate 411 is adjusted to a balance state so that the upper die holder 61 is in a horizontal state, the thickness of the fluorescent glue on the LED chip is consistent when film pressing is performed, the thickness of the fluorescent glue on the LED chip cannot be inconsistent due to unbalance of the upper die holder 61, the light emitting of the LED chip is inconsistent, and subsequent use is influenced.
Specifically, press mold moving mechanism 3 removes seat 31 and two press molds and removes slip table 32, two the press mold removes the interior bottom that slip table 32 symmetry set up at shaping case 1, remove seat 31 and set up and serve at the removal that two press molds removed slip table 32, be equipped with in the shaping case 1 towards the contact pick up 33 that removes seat 31 and set up, contact pick up 33 model CS065A, contact pick up 33 and controller 8 electric connection. Controller 8 controls two press mold and removes slip table 32 and remove die holder 62 to the below of automatic dispensing head 73, contact pick up 33 receives behind the position of removing seat 31, will be with signal transmission to controller 8 on, controller 8 will control two press mold and remove slip table 32 and stop to drive and remove seat 31 and remove, the back is accomplished to the chip press mold, 2 work of press mold elevating system are with upper die base 61 rebound, outwards remove out through pressing mold moving mechanism 3 fashioned LED chip on with die holder 62, take out it through the manual work.
Specifically, the film pressing mold 6 comprises an upper mold base 61, a lower mold base 62, a gasket 63 and a heating table 64, wherein the heating table 64 is horizontally arranged on the movable base 31, and the heating table 64 works to cure the fluorescent glue, so that the fluorescent glue forming speed is increased, and the fluorescent glue is cured on the LED chip; the horizontal setting of die holder 62 is at the top of warm table 64, upper die base 61 sets up the bottom at balance plate 411, gasket 63 is located upper die base 61, be equipped with the boss on the die holder 62, shaping case 1 is equipped with infrared sensor 67, and infrared sensor 67 model KDS209, infrared sensor 67 is located upper die base 61 and die holder 62 pressfitting department, infrared sensor 67 and controller 8 electric connection, be equipped with two electromagnetic zone 68 on the die holder 62, be equipped with two magnetic block 69 that correspond with electromagnetic zone 68 on the upper die base 61, magnetic block 69 can merge back and work with electromagnetic zone 68 at upper die base 61 and die holder 62 for be in the closed state between upper die base 61 and die holder 62 and the die holder 62, so that follow-up is to the film pressing operation of fluorescent glue, place the chip on lower die base 62 when carrying out the mould pressing, carry out the film pressing to fluorescent glue and belong to prior art, refer to chinese patent number CN203316339U.
Specifically, the molding buffer mechanism 5 includes four positioning pins 51 and four buffer springs 52, the four positioning pins 51 are disposed on the lower die holder 62, the upper die holder 61 is provided with four placing grooves, the four buffer springs 52 are respectively disposed in the four placing grooves, and each buffer spring 52 is provided with a buffer cushion 53. The upper die holder 61 moves towards the lower die holder 62, the four cushion pads 53 move on the four cushion pads 51 through the four positioning pins 51 in the moving process, the four cushion pads 53 cushion the force generated when the upper die holder 61 moves downwards through the four cushion springs 52, and the upper die holder 61 can be prevented from damaging the LED chip when moving downwards.
Specifically, the automatic dispensing mechanism 7 includes a horizontal movement sliding table 71, an electric dispensing cylinder 72, an automatic dispensing head 73 and an installation frame 74, the horizontal movement sliding table 71 is horizontally arranged in the molding box 1, the tail end of the electric dispensing cylinder 72 is connected with the moving end of the horizontal movement sliding table 71, the installation frame 74 is connected with the telescopic end of the electric dispensing cylinder 72, and the automatic dispensing head 73 is arranged on the installation frame 74. Controller 8 control horizontal migration slip table 71 work drives automatic dispensing head 73 and moves to upper die base 61 top, drives the installing frame 74 through the work of electric jar 72 of gluing and moves down and drive automatic dispensing head 73 and move for automatic dispensing head 73 is with fluorescent glue drippage on the boss, and electric jar 72 of gluing drives automatic dispensing head 73 rebound after the completion of dispensing, can realize the automatic dispensing operation to fluorescent glue, has improved work efficiency.
Specifically, four mounting ears 65 are arranged on the upper die base 61, the four mounting ears 65 are arranged on the upper die base 61 in a rectangular shape, each upper die base 61 is provided with a bolt, and the upper die base 61 is arranged on the balance plate 411 through the bolt. The upper die base 61 is unbalanced and can be adjusted to the upper die base 61 through the press mold balance mechanism 4 under the tiny state, make the upper die base 61 be in balanced state all the time, the upper die base 61 is after long-time use, unbalanced state appears, just can dismantle the upper die base 61 from the balance plate 411 through dismantling qualification bolt this moment, change the upper die base 61, be in balanced state with guaranteeing that the upper die base 61 is, ensure that fluorescent glue is in even state all the time on the LED chip when the press mold.
A molding process of an LED chip fluorescent glue film molding device comprises the following steps:
the first step is as follows: when fluorescent glue is formed, the controller 8 controls the two film pressing moving sliding tables 32 to move the lower die base 62 to the position below the automatic dispensing head 73, at the moment, the controller 8 controls the horizontal moving sliding table 71 to work to drive the automatic dispensing head 73 to move to the position above the upper die base 61, the mounting frame 74 is driven to move downwards through the work of the dispensing electric cylinder 72 to drive the automatic dispensing head 73 to move, so that the automatic dispensing head 73 drops the fluorescent glue on the boss, the dispensing electric cylinder 72 drives the automatic dispensing head 73 to move upwards after the dispensing is finished, the lower die base 62 is moved to the position below the upper die base 61 through the two film pressing moving sliding tables 32, and at the moment, the position of the lower die base 62 is controlled through the contact sensor 33, so that the lower die base 62 is in butt joint with the upper die base 61;
the second step is that: when film pressing is performed, the controller 8 controls the lifting electric cylinder 21 to work to drive the lifting frame 23 to move downwards so as to drive the lifting plate 22 to move on the four moving rods 11, the upper die holder 61 moves towards the lower die holder 62, the four positioning pins 51 move on the four buffer pads 53 in the moving process, the four buffer pads 53 buffer the force generated when the upper die holder 61 moves downwards through the four buffer springs 52, and the upper die holder 61 can be prevented from damaging the LED chip when moving downwards;
the third step: when the film pressing is performed on the fluorescent glue, the upper die holder 61 needs to be kept in a horizontal state all the time, so that the thickness of the fluorescent glue is kept consistent after the fluorescent glue is formed on the LED chip, at this time, the sliding rod 413 moves up and down in the installation cylinder 412 through the first balance spring 414, so that the rotating seat 415 of the belt rotates, the two first rotating rods 416 and the two second rotating rods 417 rotate, the two second rotating rods 417 are always in a balanced state through the second balance spring 418, the balance plate 411 is kept in a horizontal state, so that the film pressing on the fluorescent glue is performed subsequently, and the film pressing on the LED chip is uniform;
the fourth step: when the infrared sensor 67 detects that one end of the upper die holder 61 is in a tilting state, at this time, the driving electric cylinder 425 works to drive the adjusting circular block 426 to move downwards into the clamping groove 428 in the adjusting cylinder 427, the controller 8 controls the rotating motor 424 to work to drive the first gear 422 to rotate so as to drive the second gear 423 to rotate, so that the rotating disc 421 rotates, the driving electric cylinder 425 drives the adjusting circular block 426 to move downwards while rotating, so that the adjusting circular block 426 is clamped in the clamping groove 428 in the adjusting cylinder 427, the position of the second rotating rod 417 is driven to rotate through the work of the driving electric cylinder 425, the balance plate 411 is adjusted to a balance state so as to enable the upper die holder 61 to be in a horizontal state, so that the thickness of the fluorescent glue on the LED chips is consistent during film pressing, and the consistency of light emission of subsequent LED chips is ensured;
the fifth step: when the film pressing is carried out, the heating table 64 works to cure the fluorescent glue, so that the forming speed of the fluorescent glue is accelerated, and the fluorescent glue is cured on the LED chip;
and a sixth step: after the die pressing of the chip is completed, the die pressing lifting mechanism 2 works to move the upper die base 61 upwards, and the die pressing moving mechanism 3 moves the LED chip formed on the lower die base 62 outwards, and the LED chip is taken out manually.
The pressed film completed LED chip is shown in fig. 13.
The above description is only an example of the present invention and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a LED chip fluorescence glue film forming device, its characterized in that, including shaping case (1), press mold elevating system (2), press mold moving mechanism (3), press mold balance mechanism (4), shaping buffer gear (5), press mold mould (6) and automatic dispensing mechanism (7), shaping case (1) is the level setting, be equipped with carriage release lever (11) of four vertical settings in shaping case (1), press mold elevating system (2) set up on shaping case (1) and the lift end and the four carriage release lever (11) sliding fit of press mold elevating system (2), press mold moving mechanism (3) level sets up the interior bottom at shaping case (1), press mold balance mechanism (4) sets up on press mold elevating system (2), press mold balance mechanism (4) include automatic balance device (41) and balance adjusting device (42), automatic balance device (41) are located the lift end of press mold elevating system (2), press mold balance adjusting device (42) set up on press mold elevating system (2), press mold balance adjusting device (6) and automatic dispensing mechanism (6) set up on the press mold balance adjusting mechanism (41) respectively, press mold balance adjusting device (6) and balance adjusting device (6) set up on the press mold mechanism (3), automatic dispensing mechanism (7) set up in forming box (1), be equipped with on forming box (1) with press mold elevating system (2), press mold moving mechanism (3), balance adjustment device (42), shaping buffer gear (5), press mold utensil (6) and automatic dispensing mechanism (7) electric connection's controller (8).
2. The LED chip fluorescent glue film pressing and forming device according to claim 1, characterized in that: press mold elevating system (2) are including lift electric jar (21), lifter plate (22) and lift frame (23), lift electric jar (21) are located the top of shaping case (1), the flexible of lift electric jar (21) is served in connection lift frame (23), lifter plate (22) and four carriage release levers (11) sliding fit, the top fixed connection of lifter frame (23) and lifter plate (22), be equipped with position sensor (24) with controller (8) electric connection on the lateral wall of shaping case (1).
3. The LED chip fluorescent glue film pressing and forming device according to claim 2, characterized in that: automatic balancing unit (41) are including balance plate (411), an installation section of thick bamboo (412), slide bar (413), first balance spring (414), rotation seat (415), two first dwang (416) and two second dwang (417), the vertical setting of an installation section of thick bamboo (412) is on lifter plate (22), slide bar (413) sliding connection is in installation section of thick bamboo (412), the both ends of first balance spring (414) are connected on installation section of thick bamboo (412) and slide bar (413), rotation seat (415) rotate the bottom of connecting at slide bar (413), two the one end of first dwang (416) is rotated and is connected at the both ends that rotate seat (415), two the top of second dwang (417) rotates with the other end of two first dwang (416) respectively and is connected, the top dwang of balance plate (411) is rotated and is connected in the bottom of two second dwang (417), balance plate (411) is the horizontal setting, is connected with second balance spring (418) between two second dwang (417).
4. The LED chip fluorescent glue film pressing and forming device as claimed in claim 3, wherein: the balance adjusting device (42) comprises a rotating disc (421), a first gear (422), a second gear (423), a rotating motor (424), an electric driving cylinder (425), an adjusting round block (426) and an adjusting cylinder (427), wherein the rotating disc (421) is rotatably connected to a lifting plate (22), a mounting groove is formed in the lifting plate (22), the first gear (422) is horizontally arranged on the rotating disc (421), the second gear (423) is rotatably connected to the mounting groove, the second gear (423) is meshed with the first gear (422), the rotating motor (424) is located at the top of the lifting plate (22) and is in transmission connection with the second gear (423), the electric driving cylinder (425) is vertically arranged on the rotating disc (421), the adjusting round block (426) is connected with a telescopic rotating rod end of the electric driving cylinder (425), the adjusting cylinder (427) is arranged on the second gear (417), and a clamping groove (428) clamped with the adjusting round block (426) is formed in the adjusting cylinder (427).
5. The LED chip fluorescent glue film pressing and forming device as claimed in claim 4, wherein: pressing film moving mechanism (3) remove seat (31) and two pressing films and remove slip table (32), two the pressing film removes slip table (32) symmetry and sets up the interior bottom in forming box (1), remove seat (31) and set up and serve at the removal that two pressing films removed slip table (32), be equipped with in forming box (1) towards removing contact pick up (33) that seat (31) set up, contact pick up (33) and controller (8) electric connection.
6. The LED chip fluorescent glue film pressing and forming device according to claim 5, characterized in that: squeeze film mould (6) are including upper die base (61), die holder (62), gasket (63) and warm table (64), warm table (64) level sets up on removal seat (31), die holder (62) level sets up the top at warm table (64), upper die base (61) set up the bottom in balance plate (411), gasket (63) are located upper die base (61), be equipped with the boss on die holder (62), shaping case (1) is equipped with infrared sensor (67), infrared sensor (67) are located upper die base (61) and die holder (62) pressfitting department, infrared sensor (67) and controller (8) electric connection, be equipped with two electromagnetic zone (68) on die holder (62), be equipped with two magnetic block (69) that correspond with electromagnetic zone (68) on upper die base (61).
7. The LED chip fluorescent glue film pressing and forming device as claimed in claim 6, wherein: shaping buffer gear (5) include four pilot pins (51) and four buffer spring (52), four pilot pin (51) set up on lower die base (62), be equipped with four standing grooves on upper die base (61), four buffer spring (52) set up respectively in four standing grooves, every all be equipped with blotter (53) on buffer spring (52).
8. The LED chip fluorescent glue film pressing and forming device as claimed in claim 1, wherein: automatic dispensing mechanism (7) are including horizontal migration slip table (71), point and are glued electric jar (72), automatic dispensing head (73) and installing frame (74), horizontal migration slip table (71) level sets up in shaping case (1), the tail end of point and glue electric jar (72) is connected with the removal end of horizontal migration slip table (71), installing frame (74) and the flexible end of point and glue electric jar (72) are connected, automatic dispensing head (73) set up on installing frame (74).
9. The LED chip fluorescent glue film pressing and forming device as claimed in claim 6, wherein: be equipped with four installation ears (65) on upper die base (61), four installation ear (65) are the rectangle and set up on upper die base (61), every all be equipped with the bolt on upper die base (61), upper die base (61) are installed on balance plate (411) through the bolt.
10. The molding process of the molding device for the fluorescent glue film of the LED chip according to any one of claims 1 to 9, wherein the molding process comprises the following steps:
the first step is as follows: when fluorescent glue is molded, the controller (8) controls the two film pressing moving sliding tables (32) to move the lower die base (62) to the position below the automatic dispensing head (73), at the moment, the controller (8) controls the horizontal moving sliding table (71) to work to drive the automatic dispensing head (73) to move to the position above the upper die base (61), the dispensing electric cylinder (72) works to drive the installation frame (74) to move downwards to drive the automatic dispensing head (73) to move, so that the automatic dispensing head (73) drops the fluorescent glue on the boss, the dispensing electric cylinder (72) drives the automatic dispensing head (73) to move upwards after dispensing is completed, the lower die base (62) is moved to the position below the upper die base (61) through the two film pressing moving sliding tables (32), and at the moment, the position of the lower die base (62) is controlled through the contact sensor (33), so that the lower die base (62) is butted with the upper die base (61);
the second step is that: when film pressing is carried out, the controller (8) controls the lifting electric cylinder (21) to work to drive the lifting frame (23) to move downwards so as to drive the lifting plate (22) to move on the four moving rods (11), the upper die base (61) moves towards the lower die base (62), the four cushion pads (53) move on the four cushion pads (51) through the four positioning pins in the moving process, the four cushion pads (53) buffer the force generated when the upper die base (61) moves downwards through the four buffer springs (52), and the upper die base (61) can be prevented from damaging the LED chip when moving downwards;
the third step: when the film pressing is carried out on the fluorescent glue, the upper die base (61) is required to be always kept in a horizontal state, so that the thickness of the fluorescent glue is kept consistent after the fluorescent glue is formed on an LED chip, at the moment, the sliding rod (413) moves up and down in the mounting cylinder (412) through the first balance spring (414), the rotating base (415) of the belt rotates, the two first rotating rods (416) and the two second rotating rods (417) rotate, the two second balance springs (418) enable the two second rotating rods (417) to be always in a balanced state, the balance plate (411) is kept in a horizontal state, the fluorescent glue is pressed on the LED chip in the subsequent process, and the film pressing of the fluorescent glue on the LED chip is uniform;
the fourth step: when the infrared sensor (67) detects that one end of the upper die holder (61) is in a tilting state, at the moment, the driving electric cylinder (425) works to drive the adjusting circular block (426) to move downwards into the clamping groove (428) in the adjusting cylinder (427), the controller (8) controls the rotating motor (424) to work to drive the first gear (422) to rotate so as to drive the second gear (423) to rotate, the rotating disc (421) rotates, the driving electric cylinder (425) drives the adjusting circular block (426) to move downwards while rotating, the adjusting circular block (426) is clamped in the clamping groove (428) in the adjusting cylinder (427), the position of the second rotating rod (417) is driven to rotate by the driving electric cylinder (425), the balance plate (411) is adjusted to a balance state so as to enable the upper die holder (61) to be in a horizontal state, the thickness of the fluorescent glue on the LED chip is ensured to be consistent when film pressing is performed, and the light emitting consistency of the subsequent LED chip is ensured;
the fifth step: when the film pressing is carried out, the heating table (64) works to solidify the fluorescent glue, so that the forming speed of the fluorescent glue is accelerated, and the fluorescent glue is solidified on the LED chip;
and a sixth step: after the chip film pressing is completed, the film pressing lifting mechanism (2) works to move the upper die base (61) upwards, the molded LED chip on the lower die base (62) is moved outwards through the film pressing moving mechanism (3), and the molded LED chip is taken out manually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210952943.9A CN115295703A (en) | 2022-08-10 | 2022-08-10 | LED chip fluorescent glue film pressing forming device and process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210952943.9A CN115295703A (en) | 2022-08-10 | 2022-08-10 | LED chip fluorescent glue film pressing forming device and process thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115295703A true CN115295703A (en) | 2022-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210952943.9A Pending CN115295703A (en) | 2022-08-10 | 2022-08-10 | LED chip fluorescent glue film pressing forming device and process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116344717A (en) * | 2023-01-30 | 2023-06-27 | 惠州市鑫惠利光电材料有限公司 | Be applicable to glue thermosetting encapsulation LED chip film pressing equipment |
-
2022
- 2022-08-10 CN CN202210952943.9A patent/CN115295703A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116344717A (en) * | 2023-01-30 | 2023-06-27 | 惠州市鑫惠利光电材料有限公司 | Be applicable to glue thermosetting encapsulation LED chip film pressing equipment |
| CN116344717B (en) * | 2023-01-30 | 2023-10-31 | 惠州市鑫惠利光电材料有限公司 | Be applicable to glue thermosetting encapsulation LED chip film pressing equipment |
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