CN116344717B - Be applicable to glue thermosetting encapsulation LED chip film pressing equipment - Google Patents
Be applicable to glue thermosetting encapsulation LED chip film pressing equipment Download PDFInfo
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- CN116344717B CN116344717B CN202310046037.7A CN202310046037A CN116344717B CN 116344717 B CN116344717 B CN 116344717B CN 202310046037 A CN202310046037 A CN 202310046037A CN 116344717 B CN116344717 B CN 116344717B
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- film pressing
- glue
- led chip
- press mold
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- 238000003825 pressing Methods 0.000 title claims abstract description 73
- 239000003292 glue Substances 0.000 title claims abstract description 60
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 20
- 238000005538 encapsulation Methods 0.000 title claims abstract description 17
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000001125 extrusion Methods 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 50
- 230000003014 reinforcing effect Effects 0.000 claims description 22
- 238000013007 heat curing Methods 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 9
- 238000007723 die pressing method Methods 0.000 claims 8
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 15
- 238000001029 thermal curing Methods 0.000 abstract description 13
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Abstract
The application discloses a film pressing device suitable for glue thermosetting packaging LED chips, and relates to the field of LED chip processing. The LED chip film pressing equipment suitable for glue thermocuring packaging comprises an LED chip conveying table and a film pressing equipment support, wherein the film pressing equipment support is fixedly connected to the side wall of the LED chip conveying table, and a top bearing table is fixedly connected to the film pressing equipment support. This be applicable to glue thermosetting encapsulation LED chip press mold equipment adopts solenoid valve and nozzle to carry out glue point and glues the solidification to utilize press mold pedestal and press mold movable extrusion plate to carry out the press mold to the glue after the extrusion, thereby reach glue thermosetting encapsulation LED chip purpose, this processing equipment utilizes press mold linkage subassembly to realize solenoid valve and nozzle and press mold pedestal and press mold movable extrusion plate coordinated control, is in the coplanar, only need carry out once location.
Description
Technical Field
The application relates to the technical field of LED chip processing, in particular to a film pressing device suitable for glue thermosetting packaging of an LED chip.
Background
The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a bracket, the other end of the wafer is a negative electrode, and the other end of the wafer is connected with the positive electrode of a power supply, so that the whole wafer is encapsulated by epoxy resin.
The LED chip is packaged by glue heat curing, the protection effect on the LED chip is good through a film pressing process, the traditional processing equipment needs to convey and position the LED chip by utilizing a conveying table, the LED chip is positioned below a glue outlet position, quantitative glue is sprayed on the LED chip through an electromagnetic valve, then the LED chip is conveyed to the position below the film pressing equipment to be positioned, and the LED chip and the glue are further pressed by the film pressing equipment.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the application provides the film pressing equipment suitable for the glue thermocuring packaging LED chips, which solves the problems that the existing processing mode needs to perform twice positioning of the LED chips, the processing time is long, the operation is inconvenient, the positioning inaccuracy is easy to occur in multiple times of positioning, the glue thermocuring packaging process of the LED chips is complex, the offset is easy to occur in the glue thermocuring position, the processing effect is poor, the quality is low, and the qualification rate is reduced.
(II) technical scheme
In order to achieve the above purpose, the application is realized by the following technical scheme: the film pressing equipment comprises an LED chip conveying table and a film pressing equipment support, wherein the film pressing equipment support is fixedly connected to the side wall of the LED chip conveying table, a top bearing table is fixedly connected to the film pressing equipment support, a first electric push rod is arranged on the top bearing table, and the output end of the first electric push rod is fixedly connected with a lifting table;
the bottom of the lifting table is provided with a supporting fixing frame, the bottom of the supporting fixing frame is fixedly connected with an auxiliary middle table, the bottom of the auxiliary middle table is fixedly connected with a connecting fixing column, and the bottom of the connecting fixing column is provided with a film pressing pedestal;
the bottom of the lifting table is provided with a second electric push rod, the output end of the second electric push rod is provided with a pushing table, and the pushing table is provided with an electromagnetic control valve and a nozzle;
the inside swing joint of press mold pedestal has press mold movable stripper plate, be equipped with the press mold linkage subassembly between press mold movable stripper plate and the pushing away the platform, the bottom fixedly connected with laser rangefinder sensor of pushing away the platform.
Preferably, the film pressing linkage assembly comprises a first supporting arm and a second supporting arm;
the first support arm is fixedly connected to the auxiliary middle table, and the second support arm is fixedly connected to the first support arm;
the first support arm is provided with a first transmission gear, and the second support arm is provided with a second transmission gear and a third transmission gear;
the movable squeeze plate for film pressing is fixedly connected with a second reinforcing fixed arm, and the second reinforcing fixed arm is fixedly connected with a second rack;
the pushing table is fixedly connected with a first reinforcing fixing arm, and the first reinforcing fixing arm is fixedly connected with a first rack.
Preferably, the first rack is meshed with the second transmission gear;
the third transmission gear is meshed with the first transmission gear, and the first transmission gear is meshed with the second rack.
Preferably, the first supporting arm is rotatably connected with a first rotating shaft, and the first transmission gear is fixedly connected on the first rotating shaft.
Preferably, the second supporting arm is rotatably connected with a second rotating shaft, and the second transmission gear and the third transmission gear are fixedly connected to the second rotating shaft.
Preferably, the top fixedly connected with side direction support column of supplementary intermediate table, the top fixedly connected with side direction support sleeve pipe of top plummer, side direction support column sliding connection is in side direction support sleeve pipe.
Preferably, a jogged groove is formed in the film pressing pedestal, and the film pressing movable extrusion plate is connected in the jogged groove in a sliding manner;
the side wall of the film pressing pedestal is fixedly connected with a guide seat, the film pressing movable extrusion plate is slidably connected in the guide seat, and a limiting groove corresponding to the second reinforcing fixing arm is formed in the guide seat.
Preferably, the pushing table is fixedly connected with a supporting and positioning pipe, and the supporting and positioning pipe is movably sleeved on the connecting and fixing column.
Preferably, the electromagnetic control valve is fixedly connected with a glue transmission hose, and a hose line notch corresponding to the glue transmission hose is formed in the pushing table.
The application discloses a film pressing device suitable for glue thermosetting packaging LED chips, which has the following beneficial effects:
1. this be applicable to glue thermosetting encapsulation LED chip press mold equipment adopts solenoid valve and nozzle to carry out glue dispensing solidification to utilize press mold pedestal and press mold movable extrusion plate to carry out the press mold to the glue after the extrusion, thereby reach glue thermosetting encapsulation LED chip purpose, this processing equipment utilizes press mold linkage subassembly to realize solenoid valve and nozzle and press mold pedestal and press mold movable extrusion plate coordinated control, be in same position, only need carry out once location, guarantee the below of press mold pedestal to the LED chip dispensing position accurate, and guarantee the press mold position accurate, it is convenient to counterpoint to the LED chip, simplify LED chip dispensing and thermosetting encapsulation press mold step, utilize laser ranging sensor and control computer accurate detection and control thermosetting encapsulation point to glue the processing distance, guarantee that the machining effect is good, high quality, this equipment is obvious to the promotion effect of thermosetting encapsulation LED chip press mold technology, be fit for using widely.
2. This be applicable to glue thermosetting encapsulation LED chip press mold equipment, the integral structure of the press mold linkage subassembly of setting is simple, convenient to use, the operation is stable, with low costs, convenient maintenance utilizes the cooperation of gear and rack subassembly, establish the linkage relation of motion between press mold pedestal and the electromagnetic control valve for when the electromagnetic control valve motion, automatic drive press mold movable stripper plate lateral sliding of the inside press mold pedestal of press mold movable stripper plate can protect electromagnetic control valve and nozzle on the one hand, guarantees stronger with electromagnetic control valve and nozzle wholeness, conveniently processes, on the other hand also cooperates the press mold pedestal to realize pressing mold to LED chip and thermosetting glue.
3. This be applicable to glue thermosetting encapsulation LED chip press mold equipment, the first electric putter who sets up is when driving elevating platform, supporting the mount and assisting the intermediate table global motion, can drive side direction support column in step and support sheathed tube inside slip along side direction for elevating platform, supporting the mount and assisting the intermediate table wholly receives the side direction to support, and then guarantees the in-process of gluing or pressing the membrane, and the whole subassembly atress of press mold equipment is stable, can not take place the position deviation.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a first view of a schematic overall structure of the present application;
FIG. 2 is a schematic view of the whole structure of the present application at a second view angle;
FIG. 3 is a front view of the overall structure of the present application;
FIG. 4 is a schematic view of the drop of the nozzle of the present application;
FIG. 5 is a schematic view of the structure of the guide holder of the present application;
FIG. 6 is an enlarged view of portion A of FIG. 5 in accordance with the present application;
FIG. 7 is a view showing the construction of a movable squeeze plate for film pressing according to the present application;
fig. 8 is a schematic diagram of a pushing table according to the present application.
In the figure: 1. an LED chip conveying table; 2. a film pressing equipment support; 3. a top loading table; 4. a first electric push rod; 5. a lifting table; 6. a supporting and fixing frame; 7. an auxiliary intermediate station; 701. a lateral support column; 702. a lateral support sleeve; 8. connecting the fixed column; 9. a film pressing pedestal; 901. a fitting groove; 902. a guide seat; 9021. a limit groove; 10. a second electric push rod; 11. pushing the platform; 1101. a first reinforcing fixed arm; 1102. a first rack; 1103. supporting the positioning tube; 1104. a hose line slot; 12. an electromagnetic control valve; 1201. a glue delivery hose; 13. a nozzle; 14. a movable squeeze plate for film pressing; 1401. a second reinforcing fixed arm; 1402. a second rack; 15. a film pressing linkage assembly; 1501. a first support arm; 1502. a first rotating shaft; 15021. a first transmission gear; 1503. a second support arm; 1504. a second rotating shaft; 15041. a second transmission gear; 15042. a third transmission gear; 16. a laser ranging sensor.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application are clearly and completely described, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The embodiment of the application solves the problems that the existing processing mode needs to perform two-time positioning of the LED chip, the processing time is long, the operation is inconvenient, the positioning inaccuracy phenomenon is easy to occur due to multiple positioning, the glue thermocuring packaging process of the LED chip is complex, the offset of the glue thermocuring position is easy to occur, the processing effect is poor, the quality is low and the qualification rate is reduced by providing the film pressing equipment suitable for the glue thermocuring packaging LED chip.
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
Embodiment 1,
The embodiment of the application discloses a film pressing device suitable for glue thermocuring packaging LED chips, which comprises an LED chip conveying table 1 and a film pressing device support 2 according to the drawings 1-8, wherein the film pressing device support 2 is fixedly connected to the side wall of the LED chip conveying table 1, a top bearing table 3 is fixedly connected to the film pressing device support 2, a first electric push rod 4 is arranged on the top bearing table 3, and the output end of the first electric push rod 4 is fixedly connected with a lifting table 5;
the bottom of the lifting table 5 is provided with a supporting fixed frame 6, the bottom of the supporting fixed frame 6 is fixedly connected with an auxiliary middle table 7, the bottom of the auxiliary middle table 7 is fixedly connected with a connecting fixed column 8, and the bottom of the connecting fixed column 8 is provided with a film pressing pedestal 9;
the bottom of the lifting table 5 is provided with a second electric push rod 10, the output end of the second electric push rod 10 is provided with a push table 11, and the push table 11 is provided with an electromagnetic control valve 12 and a nozzle 13;
the inside swing joint of press mold pedestal 9 has press mold movable stripper plate 14, is equipped with press mold linkage assembly 15 between press mold movable stripper plate 14 and the push away platform 11, and the bottom fixedly connected with laser range sensor 16 of push away platform 11.
This be applicable to glue thermocuring encapsulation LED chip press mold equipment adopts solenoid valve 12 and nozzle 13 to carry out glue dispensing solidification to utilize press mold pedestal 9 and press mold movable stripper plate 14 to carry out the press mold to the glue after the extrusion, thereby reach glue thermocuring encapsulation LED chip purpose, this processing equipment utilizes press mold linkage subassembly 15 to realize solenoid valve 12 and nozzle 13 and press mold pedestal 9 and press mold movable stripper plate 14 linkage control, be in same position, only need once fix a position, guarantee that the below of press mold pedestal 9 is to the LED chip dispensing position accurate, and guarantee that press mold position is accurate, it is convenient to the LED chip counterpoint, simplify LED chip dispensing and thermocuring encapsulation press mold step, utilize laser ranging sensor 16 and control computer accurate detection and control thermocuring encapsulation point to glue the processing distance, guarantee that the machining effect is good, high quality, this equipment is obvious to the promotion effect of encapsulation LED chip press mold technology, and is fit for using widely.
Embodiment II,
The embodiment of the application discloses a film pressing device suitable for glue thermocuring packaging LED chips, which comprises an LED chip conveying table 1 and a film pressing device support 2 according to the drawings 1-8, wherein the film pressing device support 2 is fixedly connected to the side wall of the LED chip conveying table 1, a top bearing table 3 is fixedly connected to the film pressing device support 2, a first electric push rod 4 is arranged on the top bearing table 3, and the output end of the first electric push rod 4 is fixedly connected with a lifting table 5;
the bottom of the lifting table 5 is provided with a supporting fixed frame 6, the bottom of the supporting fixed frame 6 is fixedly connected with an auxiliary middle table 7, the bottom of the auxiliary middle table 7 is fixedly connected with a connecting fixed column 8, and the bottom of the connecting fixed column 8 is provided with a film pressing pedestal 9;
the bottom of the lifting table 5 is provided with a second electric push rod 10, the output end of the second electric push rod 10 is provided with a push table 11, and the push table 11 is provided with an electromagnetic control valve 12 and a nozzle 13;
the inside swing joint of press mold pedestal 9 has press mold movable stripper plate 14, is equipped with press mold linkage assembly 15 between press mold movable stripper plate 14 and the push away platform 11, and the bottom fixedly connected with laser range sensor 16 of push away platform 11.
The lamination linkage assembly 15 includes a first support arm 1501 and a second support arm 1503;
the first support arm 1501 is fixedly connected to the auxiliary intermediate stage 7, and the second support arm 1503 is fixedly connected to the first support arm 1501;
a first transfer gear 15021 is provided on the first support arm 1501, and a second transfer gear 15041 and a third transfer gear 15042 are provided on the second support arm 1503;
a second reinforcing fixed arm 1401 is fixedly connected to the film pressing movable extrusion plate 14, and a second rack 1402 is fixedly connected to the second reinforcing fixed arm 1401;
the fixed arm 1101 is strengthened to fixedly connected with on the push away platform 11, the first rack 1102 of fixedly connected with on the fixed arm 1101 is strengthened to the first, the integral structure of the press mold linkage subassembly 15 that sets up, and a load is convenient, and a load is stable, and is with low costs, convenient maintenance, utilize the cooperation of gear and rack subassembly, establish the linkage relation of motion between press mold pedestal 9 and electromagnetic control valve 12, make when electromagnetic control valve 12 moves, automatic drive press mold pedestal 9 inside press mold movable extrusion plate 14 transversely slides, press mold movable extrusion plate 14 can protect electromagnetic control valve 12 and nozzle 13 on the one hand, guarantee stronger with electromagnetic control valve 12 and nozzle 13 wholeness, conveniently process, on the other hand also cooperates press mold pedestal 9 to realize pressing mold to LED chip and thermosetting glue.
The first rack 1102 is meshed with the second transfer gear 15041;
the third transmission gear 15042 is meshed with the first transmission gear 15021, the first transmission gear 15021 is meshed with the second rack 1402, the central axes of the second transmission gear 15041 and the third transmission gear 15042 are overlapped and are in a whole, so that when the first rack 1102 drives the second transmission gear 15041 to rotate, the third transmission gear 15042 is driven to rotate, and meanwhile, the third transmission gear 15042 drives the second rack 1402 to move, so that the second reinforcing fixed arm 1401 is utilized to drive the movable extrusion plate 14 to move, the movable extrusion plate 14, the second reinforcing fixed arm 1401 and the second rack 1402 are in a whole, and the pushing table 11, the first reinforcing fixed arm 1101 and the first rack 1102 are in a whole.
The first support arm 1501 is rotatably connected with a first rotating shaft 1502, the first transmission gear 15021 is fixedly connected to the first rotating shaft 1502, a bearing corresponding to the first rotating shaft 1502 is arranged on the first support arm 1501, and the first rotating shaft 1502 supports and limits the first transmission gear 15021, so that stability is guaranteed.
The second supporting arm 1503 is rotatably connected with a second rotating shaft 1504, the second transmission gear 15041 and the third transmission gear 15042 are fixedly connected to the second rotating shaft 1504, a bearing corresponding to the second rotating shaft 1504 is arranged on the second supporting arm 1503, and the second rotating shaft 1504 provides supporting limit for the second transmission gear 15041 and the third transmission gear 15042 and ensures the stability of the second transmission gear 15041 and the third transmission gear 15042.
The top fixedly connected with side direction support column 701 of supplementary intermediate table 7, the top fixedly connected with side direction support sleeve 702 of top plummer 3, side direction support column 701 sliding connection is in side direction support sleeve 702, the first electric putter 4 of setting is when driving elevating platform 5, support mount 6 and supplementary intermediate table 7 integrated motion, can drive side direction support column 701 simultaneously and slide along the inside of side direction support sleeve 702 for elevating platform 5, support mount 6 and supplementary intermediate table 7 are wholly received the side direction and are supported, and then guarantee to carry out the in-process of point gluing or press the membrane, press the whole subassembly atress of membrane equipment stable, can not take place the position deviation.
A jogged groove 901 is formed in the film pressing pedestal 9, and a film pressing movable extrusion plate 14 is connected in the jogged groove 901 in a sliding way;
the guide seat 902 is fixedly connected to the side wall of the film pressing pedestal 9, the film pressing movable extrusion plate 14 is slidably connected in the guide seat 902, the guide seat 902 is provided with the limiting groove 9021 corresponding to the second reinforcing fixed arm 1401, the set film pressing movable extrusion plate 14 is supported and limited by the embedded groove 901 and the guide seat 902, the stress is stable, the position deviation cannot occur, and the set limiting groove 9021 realizes limiting support of the second reinforcing fixed arm 1401.
The supporting and positioning pipe 1103 is fixedly connected to the pushing table 11, the supporting and positioning pipe 1103 is movably sleeved on the connecting and fixing column 8, the supporting and positioning pipe 1103 can enable the pushing table 11 to be laterally supported by the connecting and fixing column 8, and when the second electric push rod 10 pushes the pushing table 11 to move, the pushing table 11 is not easy to generate position deviation, and the position movement is accurate.
The electromagnetic control valve 12 is fixedly connected with a glue transmission hose 1201, the push table 11 is provided with a hose line notch 1104 corresponding to the glue transmission hose 1201, and the arranged hose line notch 1104 is used for limiting the glue transmission hose 1201 and a line, so that the whole installation and line arrangement of the device are convenient.
Working principle: when dispensing and film pressing of the LED chips are carried out, the LED chips are firstly transported to the lower part of the film pressing equipment through the LED chip conveying table 1 and are arranged below the film pressing table seat 9;
pushing the pushing table 11 to move by using the second electric push rod 10, wherein the pushing table 11 drives the electromagnetic control valve 12 and the first reinforced fixed arm 1101 to move;
the electromagnetic control valve 12 drives the nozzle 13 to move downwards, meanwhile, the first reinforcing fixed arm 1101 drives the first rack 1102 to move, the first rack 1102 drives the second transmission gear 15041 to rotate, the second transmission gear 15041 drives the second rotating shaft 1504 to rotate, the second rotating shaft 1504 drives the third transmission gear 15042 to rotate, the third transmission gear 15042 drives the first transmission gear 15021 to rotate, the first transmission gear 15021 drives the second rack 1402 to move, the second rack 1402 drives the second reinforcing fixed arm 1401 to move, the second reinforcing fixed arm 1401 drives the film pressing movable extrusion plate 14 to slide transversely, and the film pressing movable extrusion plate 14 is prevented from blocking the electromagnetic control valve 12 and the nozzle 13;
at the moment, the distance between the nozzle 13 and the LED chip is detected by using the laser ranging sensor 16, data is transmitted to the control computer, the computer controls the first electric push rod 4 to work through the data, and enables the lifting platform 5, the supporting fixing frame 6, the auxiliary middle platform 7, the connecting fixing column 8 and the film pressing pedestal 9 to integrally move downwards, and the second electric push rod 10, the pushing platform 11, the electromagnetic control valve 12 and the nozzle 13 integrally move downwards and move to the position above the position where dispensing is required;
the electromagnetic control valve 12 controls the nozzle 13 to spray thermosetting glue, and the glue is transmitted by the glue transmission hose 1201, so that the thermosetting glue is arranged on the LED chip;
the electromagnetic control valve 12 and the nozzle 13 are reset, the push table 11, the electromagnetic control valve 12 and the nozzle 13 are upwards moved under the action of the second electric push rod 10, and meanwhile, the film pressing movable extrusion plate 14 is reset under the action of the film pressing linkage assembly 15;
finally, under the action of the first electric push rod 4, the film pressing pedestal 9 continuously moves downwards and presses the LED chip and the thermosetting glue to form protection, and in the processing equipment, the LED chip is only required to be positioned once, so that the processes of dispensing and film pressing are convenient;
after the dispensing and film pressing processes are completed, the LED chips are finally conveyed through the LED chip conveying table 1 and heated by heating equipment, so that the glue is solidified, and the LED chip can be processed.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing has shown and described the basic principles and main features of the present application and the advantages of the present application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made without departing from the spirit and scope of the application, which is defined in the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a be applicable to glue thermosetting encapsulation LED chip press mold equipment, includes LED chip transfer table (1) and press mold equipment support (2), press mold equipment support (2) fixed connection is on the lateral wall of LED chip transfer table (1), its characterized in that:
the film pressing equipment support (2) is fixedly connected with a top bearing table (3), a first electric push rod (4) is arranged on the top bearing table (3), and the output end of the first electric push rod (4) is fixedly connected with a lifting table (5);
the bottom of the lifting table (5) is provided with a supporting fixing frame (6), the bottom of the supporting fixing frame (6) is fixedly connected with an auxiliary middle table (7), the bottom of the auxiliary middle table (7) is fixedly connected with a connecting fixing column (8), and the bottom of the connecting fixing column (8) is provided with a film pressing pedestal (9);
the bottom of the lifting table (5) is provided with a second electric push rod (10), the output end of the second electric push rod (10) is provided with a pushing table (11), and the pushing table (11) is provided with an electromagnetic control valve (12) and a nozzle (13);
the novel plastic film pressing device is characterized in that a film pressing movable extrusion plate (14) is movably connected inside the film pressing pedestal (9), a film pressing linkage assembly (15) is arranged between the film pressing movable extrusion plate (14) and the pushing table (11), and a laser ranging sensor (16) is fixedly connected to the bottom of the pushing table (11).
2. The die pressing device for glue heat curing packaging of LED chips as defined in claim 1, wherein: the film pressing linkage assembly (15) comprises a first supporting arm (1501) and a second supporting arm (1503);
the first supporting arm (1501) is fixedly connected to the auxiliary middle stage (7), and the second supporting arm (1503) is fixedly connected to the first supporting arm (1501);
a first transmission gear (15021) is arranged on the first supporting arm (1501), and a second transmission gear (15041) and a third transmission gear (15042) are arranged on the second supporting arm (1503);
a second reinforcing fixed arm (1401) is fixedly connected to the film pressing movable extrusion plate (14), and a second rack (1402) is fixedly connected to the second reinforcing fixed arm (1401);
the pushing table (11) is fixedly connected with a first reinforcing fixed arm (1101), and the first reinforcing fixed arm (1101) is fixedly connected with a first rack (1102).
3. The die pressing device for glue heat curing packaging of LED chips as defined in claim 2, wherein: the first rack (1102) is meshed with a second transmission gear (15041);
the third transfer gear (15042) is meshed with a first transfer gear (15021), and the first transfer gear (15021) is meshed with a second rack (1402).
4. The die pressing device for glue heat curing packaging of LED chips as defined in claim 2, wherein: the first supporting arm (1501) is rotatably connected with a first rotating shaft (1502), and the first transmission gear (15021) is fixedly connected to the first rotating shaft (1502).
5. The die pressing device for glue heat curing packaging of LED chips as defined in claim 2, wherein: and a second rotating shaft (1504) is rotatably connected to the second supporting arm (1503), and the second transmission gear (15041) and the third transmission gear (15042) are fixedly connected to the second rotating shaft (1504).
6. The die pressing device for glue heat curing packaging of LED chips as defined in claim 1, wherein: the top of auxiliary middle platform (7) fixedly connected with side direction support column (701), the top fixedly connected with side direction support sleeve (702) of top plummer (3), side direction support column (701) sliding connection is in side direction support sleeve (702).
7. The die pressing device for glue heat curing packaging of LED chips as defined in claim 2, wherein: an embedded groove (901) is formed in the film pressing pedestal (9), and the film pressing movable extrusion plate (14) is connected in the embedded groove (901) in a sliding manner;
the side wall of the film pressing pedestal (9) is fixedly connected with a guide seat (902), the film pressing movable extrusion plate (14) is slidably connected in the guide seat (902), and a limiting groove (9021) corresponding to the second reinforcing fixing arm (1401) is formed in the guide seat (902).
8. The die pressing device for glue heat curing packaging of LED chips as defined in claim 1, wherein: the pushing table (11) is fixedly connected with a supporting and positioning pipe (1103), and the supporting and positioning pipe (1103) is movably sleeved on the connecting and fixing column (8).
9. The die pressing device for glue heat curing packaging of LED chips as defined in claim 1, wherein: glue transmission hoses (1201) are fixedly connected to the electromagnetic control valves (12), and hose line notches (1104) corresponding to the glue transmission hoses (1201) are formed in the pushing table (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310046037.7A CN116344717B (en) | 2023-01-30 | 2023-01-30 | Be applicable to glue thermosetting encapsulation LED chip film pressing equipment |
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| CN202310046037.7A CN116344717B (en) | 2023-01-30 | 2023-01-30 | Be applicable to glue thermosetting encapsulation LED chip film pressing equipment |
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| CN116344717A CN116344717A (en) | 2023-06-27 |
| CN116344717B true CN116344717B (en) | 2023-10-31 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202205803U (en) * | 2011-08-04 | 2012-04-25 | 厦门市弘瀚电子科技有限公司 | Full-automatic film and chip mounter |
| JP2012222251A (en) * | 2011-04-12 | 2012-11-12 | Seiwa Electric Mfg Co Ltd | Discharge device, discharging method and manufacturing method of led module |
| JP2013138221A (en) * | 2006-02-03 | 2013-07-11 | Hitachi Chemical Co Ltd | Method of manufacturing package substrate for mounting optical semiconductor element and method of manufacturing optical semiconductor device using the same |
| CN113097369A (en) * | 2021-05-07 | 2021-07-09 | 广东新宇智能装备有限公司 | Automatic film pressing equipment suitable for glue thermosetting packaging LED chip |
| WO2022121583A1 (en) * | 2020-12-08 | 2022-06-16 | 惠州市开蒙医疗科技有限公司 | Technological process and production line system for dispensing and curing glass and metal sheet |
| CN115295703A (en) * | 2022-08-10 | 2022-11-04 | 深圳市卢米斯科技有限公司 | LED chip fluorescent glue film pressing forming device and process thereof |
-
2023
- 2023-01-30 CN CN202310046037.7A patent/CN116344717B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013138221A (en) * | 2006-02-03 | 2013-07-11 | Hitachi Chemical Co Ltd | Method of manufacturing package substrate for mounting optical semiconductor element and method of manufacturing optical semiconductor device using the same |
| JP2012222251A (en) * | 2011-04-12 | 2012-11-12 | Seiwa Electric Mfg Co Ltd | Discharge device, discharging method and manufacturing method of led module |
| CN202205803U (en) * | 2011-08-04 | 2012-04-25 | 厦门市弘瀚电子科技有限公司 | Full-automatic film and chip mounter |
| WO2022121583A1 (en) * | 2020-12-08 | 2022-06-16 | 惠州市开蒙医疗科技有限公司 | Technological process and production line system for dispensing and curing glass and metal sheet |
| CN113097369A (en) * | 2021-05-07 | 2021-07-09 | 广东新宇智能装备有限公司 | Automatic film pressing equipment suitable for glue thermosetting packaging LED chip |
| CN115295703A (en) * | 2022-08-10 | 2022-11-04 | 深圳市卢米斯科技有限公司 | LED chip fluorescent glue film pressing forming device and process thereof |
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| CN116344717A (en) | 2023-06-27 |
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