CN115291700A

CN115291700A - Integrated CPU water-cooling radiator

Info

Publication number: CN115291700A
Application number: CN202210932485.2A
Authority: CN
Inventors: 陈小昌; 谢海波; 杨华勇; 刘仕尧
Original assignee: High End Equipment Research Institute Of Zhejiang University
Current assignee: High End Equipment Research Institute Of Zhejiang University
Priority date: 2022-08-04
Filing date: 2022-08-04
Publication date: 2022-11-04

Abstract

The invention discloses an integrated CPU water-cooling radiator which is mainly used for radiating CPU of a desktop computer. The water cooling device mainly comprises water cooling heads arranged on the periphery of a CPU on a mainboard inside a case, and further comprises heat dissipation fins, a supporting bottom plate, a water pump motor, a circulating water pump, a water storage tank, a fan motor and a wind channel baffle plate which are arranged outside the case. The water cooling head is arranged around the CPU of the desktop computer, so that the heat of the CPU is transferred to the water cooling liquid; the water cooling bar and the like are arranged outside the case, and heat exchange and cooling are carried out through external air, so that dust accumulation inside the case is avoided; the water pump motor, the circulating water pump and the water storage tank ensure the stable operation of the circulating water pump; the fan cooperates the wind channel baffle simultaneously, can realize different heat dissipation modes according to the load size. The invention provides a brand-new CPU heat dissipation mode, which has the characteristics of compact structure, convenience in cleaning, flexible arrangement, low noise and the like.

Description

Integrated CPU water-cooling radiator

Technical Field

The invention belongs to the technical field of CPU heat dissipation, and particularly relates to an integrated CPU water-cooling heat radiator.

Background

The radiator is important equipment for ensuring the normal operation of the CPU, a large amount of heat can be generated when the CPU operates, the heat accumulation can greatly increase the operation temperature of the CPU to influence the normal operation of the CPU, and therefore the radiator is required to transmit the heat to the outside so as to achieve the purpose of reducing the operation temperature of the CPU. The radiator can be divided into an air-cooled radiator and a water-cooled radiator according to different radiating media. The air cooling radiator has simple structure, low price, good reliability and the like; because the specific heat capacity of water is far greater than that of air, the water-cooled radiator can transfer more heat more quickly, and the position of the radiator can be flexibly arranged on the water-cooled radiator generally, so that the water-cooled radiator is mainly used for a host machine with high heat productivity.

In recent years, with the improvement of a computer CPU (central processing unit) manufacturing process, more transistors are integrated on a unit area, so that the heat generation of a CPU is more concentrated, a higher requirement is put on the heat radiation performance of a radiator, the reliability of the water-cooled radiator is greatly improved due to the improvement of the manufacturing process of the water-cooled radiator, therefore, the acceptance of a user on the CPU water-cooled radiator is higher, and the retail ratio of the integrated water-cooled radiator with various highly integrated components is greatly improved.

The common integrated CPU water-cooling radiator consists of a water-cooling head integrated with a water pump, a connecting hose and a water-cooling row integrated with a fan. The water-cooling row is generally installed inside the machine case, in order to reduce the volume and increase the heat dissipation capacity, the water-cooling is fully distributed with compact heat dissipation fins, the fan is required to keep the running state during working, so that a large amount of air is driven to enter the machine case to participate in heat exchange, the dust accumulation inside the machine case is serious, the running safety of other electronic elements in the machine case is influenced, the fan which continuously runs also brings noise trouble, and meanwhile, the compact heat dissipation fins also cause the difficulty in dust cleaning. Therefore, it is also desirable to design an integrated CPU water-cooled heat sink that can reduce noise and reduce dust accumulation in the chassis.

Disclosure of Invention

In order to solve the problems in the background art, the invention provides an integrated CPU water-cooling radiator.

The technical scheme adopted by the invention is as follows:

an integrated CPU water-cooling radiator comprises water-cooling heads arranged on the periphery of a CPU on a mainboard inside a case, and also comprises heat dissipation fins, a supporting bottom plate, a water pump motor, a circulating water pump, a water storage tank, a fan motor and a wind channel baffle plate which are arranged outside the case;

the water cooling bar is formed by the radiating fins and the supporting bottom plate, the water pump motor, the circulating water pump and the water storage tank are all arranged on the water cooling bar, the water storage tank, the circulating water pump and the radiating fins are sequentially communicated, the radiating fins and the water cooling head are connected through one connecting hose, and the water cooling head and the water storage tank are connected through the other connecting hose to form closed circulation of the whole water cooling liquid;

a cavity communicated with the outside is formed in the water cooling bar, the fan and the fan motor are arranged on the water cooling bar, and an air duct baffle capable of being automatically opened is arranged between the fan and the cavity; the air duct baffle is arranged on the side wall between the fan and the cavity through an elastic element and can be opened and closed towards the inside of the cavity; the air duct baffle is tightly attached to the side wall under the action of the elastic element when the fan is not started.

Furthermore, the novel air duct structure further comprises a fin cover plate, wherein the fin cover plate is installed on the supporting bottom plate and can be drawn out, and dust accumulated in the fin air duct can be conveniently cleaned.

Furthermore, the radiating fins are arranged in parallel, and the fin cover plate enables independent channels to be formed between the adjacent radiating fins.

Furthermore, the system also comprises a control circuit, wherein the control circuit is connected to a CPU _ FAN jack of the mainboard, and the BIOS program of the mainboard automatically controls the rotating speed of the FAN to match different use scenes.

Further, the water cooling row keeps a vertical installation state.

Further, the elastic element is a coil spring.

Further, the fan is a cross-flow fan.

Compared with a common integrated water-cooling radiator, the integrated water-cooling radiator has the beneficial effects that:

1. the invention adopts external water cooling discharge, which can effectively reduce the dust accumulation in the case;

2. the invention adopts two-stage cooling, one stage is water cooling of natural wind, the other stage is accelerated air cooling of the fan, and the fan needs to be started only when the heat dissipation capacity of the CPU is large, so that the running noise can be effectively reduced;

3. the heat dissipation mode can be automatically switched, and the heat dissipation device has multiple heat dissipation mode selections and is flexibly adaptive to a use scene;

4. the fin cover plate is detachable and easy to maintain and clean.

Drawings

FIG. 1 is a schematic view of an integrated CPU water-cooled heat sink of the present invention.

Fig. 2 is a schematic view of the installation position of the present invention in the cabinet.

FIG. 3 is a schematic view of an integrated CPU water-cooled heat sink of the present invention.

FIG. 4 is a partial cross-sectional view of the fan structure of the present invention at low load intensity.

FIG. 5 is a partial cross-sectional view of the fan structure of the present invention at medium load intensity.

FIG. 6 is a partial cross-sectional view of the fan structure of the present invention at high load strengths.

In the figure, a case 1, a water cooling head 2, a connecting hose 3, a main board 4, a water cooling row 5, a fin cover plate 6, a water pump motor 7, a heat dissipation fin 8, a control circuit 9, a supporting bottom plate 10, a fan 11, a fan motor 12, a spring 13, a circulating water pump 14, an air duct baffle 15 and a water storage tank 16.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments, and the objects and effects of the present invention will become more apparent, and the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 1-3, the integrated CPU water-cooled heat sink of the present invention comprises a water-cooled head 2, a connection hose 3, a fin cover plate 6, a water pump motor 7, heat dissipation fins 8, a control circuit 9, a support base plate 10, a fan 11, a fan motor 12, a spring 13, a circulating water pump 14, an air duct baffle 15, and a water storage tank 16.

The water cooling head 2 is arranged above a CPU of a main board 4 in the case 1, the upper surface of the CPU is compressed through a fixing screw, the heat dissipation fins 8 and the support bottom plate 10 form the water cooling bar 5, the water cooling bar 5 is arranged outside the case 1, the rest parts of the radiator are arranged outside the case 1, and the water cooling head 2 is communicated with the rest parts through two connecting hoses 3; the cooling air flow of the water cooling bank 5 does not need to pass through the inside of the cabinet 1. The control circuit 9 is connected to the CPU _ FAN jack of the motherboard 4, and the BIOS program of the motherboard 4 can automatically control the rotation speed of the FAN 11, so as to achieve the purpose of matching different usage scenarios.

The radiator mainly absorbs the heat of the CPU by the water cooling liquid and carries the heat to the outside of the case, so as to achieve the purpose of reducing the temperature of the CPU. The fin cover plate 6 is arranged in front of the water cooling bar 5, and the fin cover plate 6 is detachable and easy to maintain and clean; the water pump motor 7, the circulating water pump 14 and the water storage tank 16 are arranged at the rear upper part of the water cooling bar 5; the water storage tank 16, the circulating water pump 14 and the radiating fins 8 are sequentially communicated, one connecting hose 3 is connected with the radiating fins 8 and the water cooling head 2, and the other connecting hose 3 is connected with the water cooling head 2 and the water storage tank 16. The low-temperature water cooling liquid is subjected to heat exchange through the water cooling head 2, the temperature of the low-temperature water cooling liquid rises, the low-temperature water cooling liquid is conveyed into a water storage tank 16 outside the case through one connecting hose 3, a circulating water pump 14 keeps running at a rated rotating speed, the circulating water pump 14 can directly suck the water cooling liquid in the water storage tank 16, the pressurized water cooling liquid enters the heat dissipation fins 8, the water cooling liquid sequentially passes through the heat dissipation fins 8 to reduce the temperature, and then enters the water cooling head 2 through the other connecting hose 3 to form closed-loop circulation of the water cooling liquid. Meanwhile, the high-pressure area of the whole loop is mainly positioned on the radiating fins 8, and the design enables the water cooling liquid to enter the water cooling head 2 at a lower pressure, so that the probability of liquid leakage of the joint of the water cooling head 2 can be effectively reduced.

The fan motor 12 and the fan 11 are installed at the rear lower part of the water cooling row 5, as shown in fig. 4, when the CPU is in a low load state, the fan 11 does not operate, the air duct baffle 15 keeps the fan air duct in a normally closed state under the action of the spring 13, the air duct right below the heat dissipation fins 8 is open, the heat dissipation air passes through the heat dissipation fins 8 from bottom to top, and the whole water cooling row 5 dissipates heat in a natural convection heat dissipation manner; in this embodiment, the air intake fan 11 is a cross-flow fan.

As shown in fig. 5, when the CPU is in a medium load state, the cross flow fan 11 operates at a low speed, the air duct baffle 15 rotates around the shaft by a certain angle due to a small air pressure, the air duct of the fan is half-open, the air duct below the heat dissipation fins 8 is half-shielded by the air duct baffle 15, air blown out by the fan participates in heat dissipation through the heat dissipation fins 8 at a high speed, and meanwhile, air in the half-shielded air duct is also driven by high-speed air to move upward, and at this time, the whole water cooling bank 5 dissipates heat in a low-intensity forced convection heat dissipation manner.

As shown in fig. 6, when the CPU is in a high load state, the cross-flow fan 11 operates at a high speed, the air duct baffle 15 rotates to a limit position around the shaft due to a large air pressure, the air duct of the fan is completely open at this time, the air duct below the heat dissipation fins 8 is completely shielded by the air duct baffle 15, air blown out by the fan participates in heat dissipation through the heat dissipation fins 8 at a high speed, and at this time, the whole water-cooled generator 5 dissipates heat in a high-strength forced convection heat dissipation manner.

It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and although the invention has been described in detail with reference to the foregoing examples, it will be apparent to those skilled in the art that various changes in the form and details of the embodiments may be made and equivalents may be substituted for elements thereof. All modifications, equivalents and the like which come within the spirit and principle of the invention are intended to be included within the scope of the invention.

Claims

1. An integrated CPU water-cooling radiator is characterized by comprising water-cooling heads (2) arranged on the periphery of a CPU on a main board (4) in a case (1), and further comprising heat-radiating fins (8) arranged outside the case (1), a supporting bottom plate (10), a water pump motor (7), a circulating water pump (14), a water storage tank (16), a fan (11), a fan motor (12) and an air duct baffle (15);

the water cooling bar (5) is formed by the radiating fins (8) and the supporting base plate (10), the water pump motor (7), the circulating water pump (14) and the water storage tank (16) are all installed on the water cooling bar (5), the water storage tank (16), the circulating water pump (14) and the radiating fins (8) are sequentially communicated, the radiating fins (8) and the water cooling head (2) are connected through one connecting hose (3), and the water cooling head (2) and the water storage tank (16) are connected through the other connecting hose (3) to form closed circulation of the whole water cooling liquid;

a cavity communicated with the outside is formed in the water cooling bar (5), the fan (11) and the fan motor (12) are installed on the water cooling bar (5), and an air duct baffle (15) capable of being automatically opened is arranged between the fan (11) and the cavity; the air duct baffle (15) is arranged on the side wall between the fan (11) and the cavity through an elastic element (13) and can be opened and closed towards the inside of the cavity; the air duct baffle (15) is tightly attached to the side wall under the action of the elastic element (13) when the fan (11) is not started.

2. The integrated CPU water-cooled heat sink according to claim 1, further comprising a fin cover plate (6), wherein the fin cover plate (6) is mounted on the supporting bottom plate (10) and can be drawn out, so that dust deposited inside the fin air duct can be cleaned conveniently.

3. The integrated CPU water-cooled heat sink according to claim 2, wherein the heat dissipating fins (8) are arranged in parallel, and the fin cover plate (6) forms independent channels between the adjacent heat dissipating fins (8).

4. The integrated CPU water-cooled radiator according to claim 1, further comprising a control circuit (9), wherein the control circuit (9) is connected to a CPU _ FAN jack of the main board (4), and the BIOS program of the main board (4) automatically controls the rotation speed of the FAN (11) to match different use scenes.

5. The integrated CPU water-cooled heat sink according to claim 1, characterized in that the water-cooled rows (5) are kept in a vertically mounted state.

6. The integrated CPU water-cooled heat sink according to claim 1, wherein the elastic member (13) is a coil spring.

7. The integrated CPU water-cooled heat sink according to claim 1, wherein the fan (11) is a cross-flow fan.