CN115275766A - Heat sink device - Google Patents
Heat sink device Download PDFInfo
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- CN115275766A CN115275766A CN202210527818.3A CN202210527818A CN115275766A CN 115275766 A CN115275766 A CN 115275766A CN 202210527818 A CN202210527818 A CN 202210527818A CN 115275766 A CN115275766 A CN 115275766A
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- hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Abstract
The invention discloses a heat sink device, comprising: the liquid inlet side cover layer is provided with a first liquid inlet through hole; the liquid return layer is provided with a second liquid inlet through hole corresponding to the first liquid inlet through hole, one side of the liquid return layer is provided with a first slow flow region, and two sides adjacent to the first slow flow region are provided with first strip-shaped liquid outlet holes; the guide layer is provided with a first liquid outlet through hole, a third liquid inlet through hole corresponding to the second liquid inlet through hole, a backflow through hole corresponding to the first slow flow region, and two second strip-shaped liquid outlet holes corresponding to the two first strip-shaped liquid outlet holes respectively; the first liquid outlet through hole is positioned on one side of the third liquid inlet through hole, which is far away from the reflux through hole; the liquid inlet layer is provided with a confluence area, two third strip-shaped liquid outlet holes respectively corresponding to the two second strip-shaped liquid outlet holes, and a second liquid outlet through hole corresponding to the first liquid outlet through hole; and the liquid return side cover layer is provided with a third liquid outlet through hole corresponding to the second liquid outlet through hole. The heat sink device has high heat dissipation strength, compact structure, small unit volume and light weight.
Description
Technical Field
The invention relates to the technical field of semiconductor laser arrays, in particular to a heat sink device.
Background
The high-power semiconductor laser has the advantages of light weight, small volume, high electro-optic conversion rate, long service life and the like, so that the high-power semiconductor laser is widely applied to various industries. In the working process, high heat can be generated, if the high heat is not discharged in time, the threshold current can be increased, the temperature of a laser chip can be increased rapidly, the efficiency of the laser chip is reduced, the laser wavelength is subjected to temperature drift and the like, and the quality and the stability of the laser output beam are seriously influenced. The problem of chip heat dissipation is an important research content of semiconductor laser development, and the microchannel heat sink has become a key device for high-performance work of a high-power semiconductor laser due to the characteristics of high heat dissipation strength, compact structure, small unit volume, light weight and the like.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the heat sink device which can effectively improve the heat exchange efficiency of the semiconductor laser cooling heat sink device.
A heat sink device according to an embodiment of the present invention includes:
the liquid inlet side cover layer is provided with a first liquid inlet through hole;
the liquid returning layer is arranged on the lower surface of the liquid inlet side cover layer and provided with a second liquid inlet through hole corresponding to the first liquid inlet through hole, a first slow flow area is arranged on one side of the liquid returning layer, two sides of the liquid returning layer adjacent to the first slow flow area are provided with first strip-shaped liquid outlet holes, the two first strip-shaped liquid outlet holes are distributed on two sides of the second liquid inlet through hole, and the first slow flow area and the two first strip-shaped liquid outlet holes penetrate through the liquid returning layer;
the guide layer is arranged on the lower surface of the liquid return layer and is provided with a first liquid outlet through hole, a third liquid inlet through hole corresponding to the second liquid inlet through hole, a backflow through hole corresponding to the first slow flow area and two second strip-shaped liquid outlet holes respectively corresponding to the two first strip-shaped liquid outlet holes; the first liquid outlet through hole is positioned on one side of the third liquid inlet through hole, which is far away from the reflux through hole, and the first liquid outlet through hole is communicated with the two second strip-shaped liquid outlet holes;
the liquid inlet layer is arranged on the lower surface of the guide layer and provided with a confluence area, two third strip-shaped liquid outlet holes respectively corresponding to the two second strip-shaped liquid outlet holes and a second liquid outlet through hole corresponding to the first liquid outlet through hole; the confluence region is communicated with the backflow through hole and the third liquid inlet through hole, and the second liquid outlet through hole is communicated with the two third strip-shaped liquid outlet holes;
and the liquid return side cover layer is arranged on the lower surface of the liquid inlet layer and is provided with a third liquid outlet through hole corresponding to the second liquid outlet through hole.
The heat sink device provided by the embodiment of the invention has at least the following beneficial effects:
the feed liquor passageway that constitutes through first feed liquor through-hole, second feed liquor through-hole and third feed liquor through-hole is used for introducing heat-conducting medium, and heat-conducting medium enters into the confluence zone of liquid layer behind the third feed liquor through-hole, and the confluence zone plays the effect of guide heat-conducting medium toward return water layer backward flow, and heat-conducting medium in the confluence zone flows back to the first gentle stream district of returning the liquid layer through the backward flow through-hole on guide layer, accomplishes the backward flow of entering liquid layer to returning the liquid layer. The heat-conducting medium in the first slow flow region flows through the adjacent first strip-shaped liquid outlet holes at two sides to the liquid inlet layer and sequentially passes through the strip-shaped liquid outlet channels formed by the two second strip-shaped liquid outlet holes and the two third strip-shaped liquid outlet holes. And a part of the heat-conducting medium flowing through the second strip-shaped liquid outlet hole flows through the first liquid outlet through hole, and a part of the heat-conducting medium flowing through the third strip-shaped liquid outlet hole flows through the second liquid outlet through hole and finally flows out through the third liquid outlet through hole of the liquid return side cover layer, so that uniform circulating flow of the heat-conducting medium in the heat sink device is realized, and heat dissipation of the whole heat sink device is completed. The heat sink device has the advantages of high heat dissipation strength, compact structure, small unit volume and light weight, and effectively improves the heat exchange efficiency of the heat sink device.
According to some embodiments of the invention, the confluence region comprises a second flow slowing region corresponding to the backflow through hole and a fourth liquid inlet through hole corresponding to the third liquid inlet through hole.
According to some embodiments of the invention, the liquid-returning side cover layer is further provided with a fifth liquid inlet through hole corresponding to the fourth liquid inlet through hole.
According to some embodiments of the invention, the first slow flow region comprises a plurality of first microchannels.
According to some embodiments of the invention, the second slow flow region comprises a plurality of second microchannels.
According to some embodiments of the invention, the backflow through hole is formed at an edge of one side of the third liquid inlet through hole, which is far away from the first liquid outlet through hole.
According to some embodiments of the invention, the liquid return layer is further provided with a fourth liquid outlet through hole corresponding to the first liquid outlet through hole.
According to some embodiments of the invention, the liquid inlet side cover layer is further provided with a fifth liquid outlet through hole corresponding to the fourth liquid outlet through hole.
According to some embodiments of the invention, two of the first strip-shaped liquid outlets are symmetrically arranged.
According to some embodiments of the invention, the heat sink device is integrally formed by 3D printing.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of the overall structure of a heat sink device according to an embodiment of the present invention;
FIG. 2 is a schematic view of the overall structure of a heat sink device according to an embodiment of the present invention in layers;
FIG. 3 is a schematic view of a liquid inlet side cover layer according to an embodiment of the invention;
FIG. 4 is a schematic view of a liquid return layer according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a guiding layer according to an embodiment of the invention;
FIG. 6 is a schematic view of a liquid inlet layer according to an embodiment of the present invention;
fig. 7 is a schematic view of a liquid-returning side cap layer according to an embodiment of the invention.
Reference numerals:
a liquid inlet side cover layer 100, a first liquid inlet through hole 110, a fifth liquid outlet through hole 120, a first positioning hole 130, a first fixing through hole 140,
A liquid recovery layer 200, a second liquid inlet through hole 210, a first slow flow zone 220, a first micro-channel 221, a first strip-shaped liquid outlet 230, a fourth liquid outlet through hole 240, a second positioning hole 250, a second fixing through hole 260, a third fixing through hole 260, a fourth fixing through hole 240, a fourth fixing through hole 260, a third fixing through hole 220, a fourth fixing through hole 260, a fourth fixing through hole 240, a fourth fixing through hole 220, a third fixing through hole 220, a fourth fixing through hole 260, a third fixing through hole 260, a fourth fixing through hole 240, a fourth fixing through hole 250, a fourth fixing through hole,
A guide layer 300, a third liquid inlet through hole 310, a backflow through hole 320, a second strip-shaped liquid outlet hole 330, a first liquid outlet through hole 340, a third positioning hole 350, a third fixing through hole 360,
A liquid inlet layer 400, a fourth liquid inlet through hole 410, a second slow flow area 420, a second micro-channel 421, a third strip-shaped liquid outlet hole 430, a second liquid outlet through hole 440, a fourth positioning hole 450, a fourth fixing through hole 460,
A liquid return side cover layer 500, a fifth liquid inlet through hole 510, a third liquid outlet through hole 520, a fifth positioning hole 530 and a fifth fixing through hole 540.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, if there are first, second, etc. described, it is only for the purpose of distinguishing technical features, and it is not understood that relative importance is indicated or implied or that the number of indicated technical features is implicitly indicated or that the precedence of the indicated technical features is implicitly indicated.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to, for example, the upper, lower, etc., is indicated based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly defined, terms such as arrangement, installation, connection and the like should be broadly understood, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the embodiments described below are some, but not all embodiments of the present invention.
In some embodiments, a heat sink apparatus, comprising: the liquid inlet side cover layer 100, the liquid return layer 200, the guide layer 300, the liquid inlet layer 400, and the liquid return side cover layer 500.
A liquid inlet side cover layer 100, which is provided with a first liquid inlet through hole 110;
the liquid return layer 200 is arranged on the lower surface of the liquid inlet side cover layer 100, the liquid return layer 200 is provided with a second liquid inlet through hole 210 corresponding to the first liquid inlet through hole 110, one side of the liquid return layer 200 is provided with a first slow flow region 220, two sides of the liquid return layer 200 adjacent to the first slow flow region 220 are provided with first strip-shaped liquid outlets 230, the two first strip-shaped liquid outlets 230 are distributed on two sides of the second liquid inlet through hole 210, and the first slow flow region 220 and the two first strip-shaped liquid outlets 230 penetrate through the liquid return layer 200;
the guide layer 300 is arranged on the lower surface of the liquid recovery layer 200, and the guide layer 300 is provided with a first liquid outlet through hole 340, a third liquid inlet through hole 310 corresponding to the second liquid inlet through hole 210, a backflow through hole 320 corresponding to the first slow flow region 220, and two second strip-shaped liquid outlet holes 330 corresponding to the two first strip-shaped liquid outlet holes 230; the first liquid outlet through hole 340 is positioned at one side of the third liquid inlet through hole 310 far away from the backflow through hole 320, and the first liquid outlet through hole 340 is communicated with the two second strip-shaped liquid outlet holes 330;
the liquid inlet layer 400 is arranged on the lower surface of the guide layer 300, and the liquid inlet layer 400 is provided with a confluence area, two third strip-shaped liquid outlet holes 430 respectively corresponding to the two second strip-shaped liquid outlet holes 330, and a second liquid outlet through hole 440 corresponding to the first liquid outlet through hole 340; the confluence area is communicated with the backflow through hole 320 and the third liquid inlet through hole 310, and the second liquid outlet through hole 440 is communicated with the two third strip-shaped liquid outlet holes 430;
and a liquid return side cover layer 500 provided on the lower surface of the liquid inlet layer 400, the liquid return side cover layer 500 having a third liquid outlet hole 520 corresponding to the second liquid outlet hole 440.
Referring to fig. 1 to 7, the liquid inlet side cover layer 100, the liquid return layer 200, the guide layer 300, the liquid inlet layer 400, and the liquid return side cover layer 500 are arranged in this order from top to bottom. The liquid inlet side cover layer 100 is provided with a first liquid inlet through hole 110, and the heat conducting medium enters the heat sink device through the first liquid inlet through hole 110, then sequentially flows through a second liquid inlet through hole 210 arranged on the liquid return layer 200 and a third liquid inlet through hole 310 arranged on the guide layer 300, and is converged into the converging area of the liquid inlet layer 400. The heat-conducting medium entering the confluence area flows back to the guide layer 300 through the backflow through holes 320 communicated with the confluence area, flows back to the first slow flow area 220 of the liquid return layer 200 through the backflow through holes 320 of the guide layer 300, the first strip-shaped liquid outlet holes 230 are arranged on two adjacent sides of the first slow flow area 220, the heat-conducting medium flows slowly to the first strip-shaped liquid outlet holes 230 on two sides through the first slow flow area 220, flows downwards through the second strip-shaped liquid outlet holes 330 arranged on the guide layer 300, the second strip-shaped liquid outlet holes are communicated with the first liquid outlet through holes 340 arranged on the guide layer 300, and a part of the heat-conducting medium is distributed to the first liquid outlet through holes 340. The heat transfer medium flowing through the second strip-shaped liquid outlet through holes can continuously flow downwards through the third strip-shaped liquid outlet through holes of the liquid inlet layer 400, the heat transfer medium flowing through the first liquid outlet through holes 340 can continuously flow downwards through the second liquid outlet through holes 440 of the liquid inlet layer 400, the third strip-shaped liquid outlet through holes are communicated with the second liquid outlet through holes 440, finally, all the heat transfer medium is collected to the second liquid outlet through holes 440 and then continuously flows downwards through the third liquid outlet through holes 520 of the liquid return side cover layer 500 to flow out, and therefore a complete cooling heat exchange cycle is completed. The whole heat sink device has high heat dissipation strength, compact structure, small unit volume and light weight, and effectively improves the heat exchange efficiency of the heat sink device.
All the through holes provided in the liquid inlet side cover layer 100, the liquid return layer 200, the guide layer 300, the liquid inlet layer 400, and the liquid return side cover layer 500 are provided so as to penetrate therethrough.
In some embodiments, the confluence region includes a second flow slowing region 420 corresponding to the backflow through hole 320 and a fourth liquid inlet through hole 410 corresponding to the third liquid inlet through hole 310.
Referring to fig. 2 and 6, the flow-merging region includes two portions, one portion is a fourth inlet through hole 410 for receiving the heat transfer medium, and the other portion is a second slow flow region 420 for promoting the backflow of the heat transfer medium. The second slow flow region 420 is communicated with the backflow through hole 320, and promotes backflow of the heat transfer medium to the liquid return layer 200 through the backflow through hole 320.
It should be noted that the backflow through holes 320 provided in this embodiment are a plurality of small holes, but the number and size of the backflow through holes 320 are not limited in this embodiment, and the backflow through holes may also be a whole strip-shaped through hole as long as the backflow through holes are provided corresponding to the first slow flow region 220 and the second slow flow region 420.
In some embodiments, the liquid-returning side cover layer 500 is further provided with a fifth liquid-feeding through hole 510 corresponding to the fourth liquid-feeding through hole 410. Referring to fig. 7, the liquid return side cover layer 500 is further provided with a fifth liquid inlet through hole 510 communicated with the fourth liquid inlet through hole 410, the semiconductor laser generally needs a plurality of heat sink devices for cooling, and the plurality of heat sink devices are correspondingly vertically mounted when dissipating heat together. It should be noted that, when a single heat sink device operates, the fifth inlet hole 510 of the liquid-returning side cover layer 500 is in a closed state.
In some embodiments, the first slow flow zone 220 comprises a plurality of first microchannels 221. Referring to fig. 4, 10 first microchannels 221 are further disposed in the first slow flow region 220 of the liquid recovery layer 200, and the first microchannels 221 perform a uniform heat dissipation function. The 10 first microchannels 221 are correspondingly communicated with the 10 return through holes 320. The 10 first microchannels 221 are symmetrically distributed on the left and right sides and are respectively communicated with the two first strip-shaped liquid outlet holes 230. A part of the 10 first microchannels 221, which is close to the second liquid inlet through hole 210, is bent at a certain angle to form a diversion ridge, which is beneficial to the backflow of water.
In some embodiments, the second slow flow zone 420 comprises a plurality of second micro-channels 421. Referring to fig. 6, 10 second microchannels 421 are correspondingly disposed in the second slow flow region 420. The 10 second microchannels 421 are communicated with the fourth liquid inlet through hole 410, and the heat-conducting medium flows into the fourth liquid inlet through hole 410 and then flows back to the water return layer through the 10 second microchannels 421. The number of the second micro-channels 421 is set to 10, so that the flow speed reduction effect of the heat-conducting medium entering the slow flow region is better, and the full development of the heat-conducting medium is facilitated.
It should be noted that the cross sections of the first microchannel 221 and the second microchannel 421 are both rectangular, the larger the aspect ratio of the rectangular microchannel is, the smaller the hydraulic diameter is, the larger the wet perimeter of the microchannel with the smaller hydraulic diameter is, the larger the wet perimeter is, the convective heat transfer area is increased, and the increase of the convective heat transfer area is beneficial to increase of the heat flow to a certain extent, so that the heat sink resistance of the microchannel can be reduced, and the smaller the heat resistance is, the higher the heat transfer efficiency is. The cooling performance of the micro-channel heat sink is improved. And the aspect ratio set to 10 has a better heat dissipation effect.
In some embodiments, the backflow through hole 320 is disposed at an edge of the third liquid inlet through hole 310 on a side away from the first liquid outlet through hole 340. Referring to fig. 5, the reflow via 320 is disposed at the edge to facilitate the heat transfer medium to flow through each portion sufficiently, thereby promoting uniform heat dissipation. However, the positions of the reflow through holes 320 are not particularly limited in this embodiment, and the reflow through holes may be reasonably arranged on the basis that the reflow through holes are arranged and communicated with the first slow flow region 220 and the second slow flow region 420.
In some embodiments, the liquid recovery layer 200 is further provided with a fourth liquid outlet hole 240 arranged corresponding to the first liquid outlet hole 340.
In some embodiments, the liquid inlet side cover layer 100 is further provided with a fifth liquid outlet through hole 120 corresponding to the fourth liquid outlet through hole 240. The liquid return layer 200 and the liquid inlet side cover layer 100 are sequentially provided with a fourth liquid outlet through hole 240 and a fifth liquid outlet through hole 120 corresponding to the first liquid outlet through hole 340. The semiconductor laser usually needs a plurality of heat sink devices for cooling, and usually, when a plurality of heat sink devices commonly dissipate heat, the heat sink devices are correspondingly and vertically installed, so that the integrally communicated liquid outlet through holes need to be correspondingly arranged. It should be noted that, when a single heat sink device works, the fourth liquid outlet hole 240 of the liquid return layer 200 and the fifth liquid outlet hole 120 of the liquid inlet side cover layer 100 are both in a closed state.
In some embodiments, the two first strip-shaped exit openings 230 are symmetrically disposed. Referring to fig. 4 to 6, the two first strip-shaped liquid outlet holes 230, the two second strip-shaped liquid outlet holes 330, and the two third strip-shaped liquid outlet holes 430 are symmetrically disposed, and in order to ensure that each part sufficiently dissipates heat, the strip-shaped liquid outlet holes are symmetrically disposed on both left and right sides of the liquid return layer 200, the guide layer 300, and the liquid inlet layer 400. But this embodiment does not do the restriction to the strip goes out the liquid hole, and reasonable setting can.
In some embodiments, the heat sink device is integrally formed by 3D printing. The heat sink device of the embodiment is integrally formed and prepared through the SLM technology, so that extra thermal stress and thermal resistance caused by welding among layers are avoided, and the integral heat dissipation capability of the device is improved. And this embodiment adopts copper chromium zirconium alloy powder to carry out SLM 3D printing as the material, can be fine realize heat sink and harrow strip chip's coefficient of thermal expansion phase-match, and copper chromium zirconium alloy has higher heat conductivility simultaneously, and the device inner wall need not gilt, has also avoided in the prior art because long-term use oxygen-free copper surface gold layer drops and leads to the problem of heat sink jam, has improved heat exchange efficiency.
In some embodiments, the liquid inlet side cover layer 100 further includes a first positioning hole 130, the liquid outlet layer 200 further includes a second positioning hole 250, the guiding layer 300 further includes a third positioning hole 350, the liquid inlet layer 400 further includes a fourth positioning hole 450, the liquid outlet side cover layer 500 further includes a fifth positioning hole 530, and the first positioning hole 130, the second positioning hole 250, the third positioning hole 350, the fourth positioning hole 450, and the fifth positioning hole 530 are correspondingly connected and have axes on the same straight line. Referring to fig. 3 to 7, since the heat sink device of the present embodiment is integrally formed by printing using 3D technology, the positioning holes of each layer are correspondingly connected and function as positioning holes.
In some embodiments, the liquid inlet side cover layer 100 further includes a first fixing through hole 140, the liquid return layer 200 further includes a second fixing through hole 260, the guiding layer 300 further includes a third fixing through hole 360, the liquid inlet layer 400 further includes a fourth fixing through hole 460, the liquid return side cover layer 500 further includes a fifth fixing through hole 540, the first fixing through hole 140, the second fixing through hole 260, the third fixing through hole 360, the fourth fixing through hole 460 and the fifth fixing through hole 540 are all correspondingly communicated, and the axes are all located on the same straight line. Referring to fig. 3 to 7, since the heat sink device of the present embodiment is integrally formed by printing using 3D technology, the fixing through holes of each layer are correspondingly communicated and jointly play a fixing role.
In some embodiments, the number of the first fixing through holes 140, the second fixing through holes 260, the third fixing through holes 360, the fourth fixing through holes 460 and the fifth fixing through holes 540 is plural. The plurality of first fixing through holes 140, the second fixing through holes 260, the third fixing through holes 360, the fourth fixing through holes 460, and the fifth fixing through holes 540 are disposed in a one-to-one correspondence. The number of the fixing through holes is two, but the fixing through holes are not limited to this and can be reasonably arranged.
In some embodiments, the first positioning hole 130 is located between the first liquid inlet through hole 110 and the fifth liquid outlet through hole 120, the centers of the first positioning hole 130, the first liquid inlet through hole 110 and the fifth liquid outlet through hole 120 are located on the same straight line, and the first fixing through hole 140 is located on one side of the fifth liquid outlet through hole 120 away from the first positioning hole 130. Referring to fig. 3, the first liquid inlet through hole 110 is provided with a laser bar at one side and a fifth liquid outlet through hole 120 at the other side. The first positioning hole 130 is disposed between the first liquid inlet through hole 110 and the fifth liquid outlet through hole 120. The two first fixing through holes 140 are disposed at two corners of the fifth liquid outlet through hole 120 on a side far from the first positioning hole 130. The first liquid inlet through hole 110 and the fifth liquid outlet through hole 120 have the same aperture, the aperture of the first positioning hole 130 is slightly smaller than that of the first liquid inlet through hole 110, and the apertures of the two first fixing through holes 140 are slightly smaller than that of the first positioning hole 130. However, this embodiment is not limited to this, and may be set appropriately.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A heat sink apparatus, comprising:
the liquid inlet side cover layer is provided with a first liquid inlet through hole;
the liquid returning layer is arranged on the lower surface of the liquid inlet side cover layer and provided with a second liquid inlet through hole corresponding to the first liquid inlet through hole, a first slow flow area is arranged on one side of the liquid returning layer, two sides of the liquid returning layer adjacent to the first slow flow area are provided with first strip-shaped liquid outlet holes, the two first strip-shaped liquid outlet holes are distributed on two sides of the second liquid inlet through hole, and the first slow flow area and the two first strip-shaped liquid outlet holes penetrate through the liquid returning layer;
the guide layer is arranged on the lower surface of the liquid return layer and is provided with a first liquid outlet through hole, a third liquid inlet through hole corresponding to the second liquid inlet through hole, a backflow through hole corresponding to the first slow flow area and two second strip-shaped liquid outlet holes respectively corresponding to the two first strip-shaped liquid outlet holes; the first liquid outlet through hole is positioned on one side of the third liquid inlet through hole, which is far away from the reflux through hole, and the first liquid outlet through hole is communicated with the two second strip-shaped liquid outlet holes;
the liquid inlet layer is arranged on the lower surface of the guide layer and provided with a confluence area, two third strip-shaped liquid outlet holes respectively corresponding to the two second strip-shaped liquid outlet holes and a second liquid outlet through hole corresponding to the first liquid outlet through hole; the confluence region is communicated with the backflow through hole and the third liquid inlet through holes, and the second liquid outlet through hole is communicated with the two third strip-shaped liquid outlet holes;
and the liquid return side cover layer is arranged on the lower surface of the liquid inlet layer and is provided with a third liquid outlet through hole corresponding to the second liquid outlet through hole.
2. The heat sink device as claimed in claim 1, wherein the flow merging region comprises a second flow slowing region corresponding to the backflow through hole and a fourth liquid inlet through hole corresponding to the third liquid inlet through hole.
3. The heat sink device according to claim 2, wherein the liquid return side cover layer is further provided with a fifth liquid inlet through hole corresponding to the fourth liquid inlet through hole.
4. The heat sink device of claim 2, wherein the first slow flow region comprises a plurality of first micro-channels.
5. The heat sink device of claim 4, wherein the second slow flow region comprises a plurality of second micro-channels.
6. The heat sink device according to claim 1, wherein the return flow through hole is provided at an edge of the third liquid inlet through hole on a side away from the first liquid outlet through hole.
7. The heat sink device as recited in claim 1 wherein the liquid return layer is further provided with a fourth liquid outlet hole corresponding to the first liquid outlet hole.
8. The heat sink device as claimed in claim 7, wherein the liquid inlet side cover layer is further provided with a fifth liquid outlet through hole corresponding to the fourth liquid outlet through hole.
9. A heat sink device in accordance with claim 1, wherein two of said first strip-shaped exit openings are arranged symmetrically.
10. The heat sink device of claim 1, wherein the heat sink device is integrally formed by 3D printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210527818.3A CN115275766A (en) | 2022-05-16 | 2022-05-16 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210527818.3A CN115275766A (en) | 2022-05-16 | 2022-05-16 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115275766A true CN115275766A (en) | 2022-11-01 |
Family
ID=83760348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210527818.3A Pending CN115275766A (en) | 2022-05-16 | 2022-05-16 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115275766A (en) |
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2022
- 2022-05-16 CN CN202210527818.3A patent/CN115275766A/en active Pending
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