CN115258785A - Device and method for tearing thermal peeling film on surface of wafer - Google Patents
Device and method for tearing thermal peeling film on surface of wafer Download PDFInfo
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- CN115258785A CN115258785A CN202210927418.1A CN202210927418A CN115258785A CN 115258785 A CN115258785 A CN 115258785A CN 202210927418 A CN202210927418 A CN 202210927418A CN 115258785 A CN115258785 A CN 115258785A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
- B65H23/1888—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling web tension
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of chip manufacturing, in particular to a device and a method for tearing off a thermal peeling film on the surface of a wafer, wherein the device comprises a rack, the upper end part of the rack is respectively provided with a waste collecting roller and an adhesive tape fixing roller, the waste collecting roller and the adhesive tape fixing roller are arranged at intervals, and the adhesive tape fixing roller is sleeved with a hot-melt film tearing adhesive tape; the frame is also provided with a tensioning assembly, a film tearing assembly and a blanching assembly respectively; the tensioning assembly comprises a first tensioning roller arranged below the waste collecting roller, a second tensioning roller and a third tensioning roller arranged below the adhesive tape fixing roller, and the second tensioning roller and the third tensioning roller are arranged at intervals up and down. The servo linear module is adopted to tear off the film, the moving speed of the module is adjustable and uniform, the acting force is uniform and stable, the quality of the film tearing process of the wafer is ensured, automatic control is realized, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a tearing device and a tearing method for a wafer surface thermal peeling film.
Background
The manufacturing process of the IC chip comprises various process processes, wherein a thermal stripping film is required to be coated on one surface of the wafer chip in the bonding process before the wafer is baked so as to ensure the quality of the chip, and the subsequent process flow can be carried out only after the thermal stripping film is required to be torn from the surface of the wafer in the bond releasing process.
At present, the method for tearing off the thermal release film in China is to lift the thermal release film from a Notch position by manually holding a craft blade. Then people take the film with hands and tear off, the wafer needs another hand to press in the tearing off process, if the hand is not pressed firmly, the wafer is often dragged away, the wafer is broken due to falling, meanwhile, the force of the hand is hard to keep consistency, the wafer is possibly damaged due to overlarge hand force, and therefore, the adoption of an automatic machine is of great importance in tearing off.
Therefore, the present application provides a device and a method for peeling a thermal peeling film on a wafer surface to solve the above technical problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a device and a method for tearing off a thermal peeling film on the surface of a wafer.
In order to achieve the purpose, the invention adopts the following technical scheme:
a tearing device for a wafer surface thermal stripping film comprises a rack, wherein a waste collecting roller and an adhesive tape fixing roller are respectively arranged at the upper end of the rack, the waste collecting roller and the adhesive tape fixing roller are arranged at intervals, and a hot-melt film tearing adhesive tape is sleeved on the adhesive tape fixing roller;
the frame is also provided with a tensioning assembly, a film tearing assembly and a hot stamping assembly respectively;
the tensioning assembly comprises a first tensioning roller arranged below the waste collecting roller, a second tensioning roller and a third tensioning roller which are arranged below the adhesive tape fixing roller, and the second tensioning roller and the third tensioning roller are arranged at intervals up and down;
the film tearing assembly comprises a film tearing roller and a film tearing roller moving module connected with the film tearing roller, the film tearing roller is arranged below the first tensioning roller, the film tearing roller is arranged on one side of the rack, and the film tearing roller moving module is arranged on the other side of the rack;
the film tearing and tearing device comprises a film tearing roller, a film heating assembly and a film heating assembly, wherein the film tearing roller is arranged on the film tearing roller;
a heating adsorption jig is arranged at the lower end part of the rack, and a wafer is horizontally placed on the heating adsorption jig;
the hot-melt film tearing adhesive tape is wound by a waste collecting roller, a first tensioning roller, a film tearing roller, a third tensioning roller and a second tensioning roller in sequence and then is connected with an adhesive tape fixing roller; and the hot-melt film-tearing adhesive tape is arranged on the surface of the wafer.
The invention also provides a use method of the tearing device for the wafer surface thermal stripping film, which comprises the following steps:
step one, starting: initializing the tearing device, moving the hot ironing roller moving module to a standby position, moving the film tearing roller moving module to the standby position, automatically detecting the temperature of the heating adsorption jig by the system, judging whether the temperature of the hot ironing mechanism reaches the standard, continuously heating the film tearing roller moving module to reach the standard after the temperature of the film tearing roller moving module does not reach the standard, finishing initialization, and waiting for feeding;
step two, feeding: placing the wafer on a heating adsorption jig through manual feeding or other modes, and opening the heating adsorption jig in vacuum to adsorb the wafer;
step three, moving the module to a tearing position: moving the film tearing roller moving module to a tearing position;
step four, blanching: moving the blanching roller moving module to a wafer tearing position, descending the blanching mechanism to contact the surface of the wafer, waiting for 15 seconds of heating time, firmly adhering the front end of the hot-melt film-tearing adhesive tape to a hot peeling film on the surface of the wafer, lifting the blanching mechanism, then moving the blanching mechanism to the tail of the wafer, descending the blanching mechanism again to contact the surface of the wafer, waiting for 10 seconds of heating time, firmly adhering the rear end of the hot-melt film-tearing adhesive tape to the hot peeling film on the surface of the wafer, lifting the blanching mechanism, and moving the blanching roller moving module to a standby position;
step five, tearing the film: moving the film tearing roller module towards the wafer direction, tearing the thermal peeling film on the surface of the wafer through the film tearing roller and the hot-melt film tearing adhesive tape, and moving the film tearing roller module to a standby position after tearing;
step six, waste material rolling: the waste collecting roller starts to rotate in reverse time, and stops rotating after the film is completely wound;
step seven, blanking: taking the wafer away manually or by a mechanical arm;
and step eight, repeating the steps from two to seven until the tearing of a batch of wafer films is finished.
By adopting the technical scheme: with hot melt dyestripping sticky tape receive the waste material roller in proper order, first tensioning roller, the dyestripping roller, third tensioning roller and second tensioning roller winding back are connected with the fixed roller of sticky tape, and make hot melt dyestripping sticky tape place the wafer surface on the heating adsorption jig, when dyestripping roller removes the module and removes to tear the position, hot melt dyestripping sticky tape just falls to wafer diameter direction, then firmly paste hot melt dyestripping sticky tape front end and rear end and the membrane on the wafer through the mechanism that scalds, the rethread dyestripping roller tears the membrane from under the removal that the dyestripping roller removed the module.
The invention has the following beneficial effects:
1. the vacuum adsorption jig is adopted, so that the wafer is firmly adsorbed and uniformly stressed, and the damage of the wafer caused by infirm pressing or nonuniform force is effectively avoided.
2. The invention adopts the hot melt adhesive tape to tear the film, thereby avoiding the risk of scratching the wafer by using a sharp tool to pick the film during manual tearing.
3. The servo linear module is adopted to tear off the film, the moving speed of the module is adjustable and uniform, the acting force is uniform and stable, the quality of the film tearing process of the wafer is ensured, automatic control is realized, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of another perspective structure of FIG. 1;
fig. 3 is a schematic diagram of the back structure of the present invention.
In the figure: the hot-pressing device comprises a frame 1, a waste collecting roller 2, a first tensioning roller 3, a film tearing roller 4, a heating adsorption jig 5, a wafer 6, a hot-pressing mechanism 7, a second tensioning roller 8, a third tensioning roller 9, a hot-melting film tearing adhesive tape 10, an adhesive tape fixing roller 11, a film tearing roller moving module 12 and a hot-pressing roller moving module 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a device for tearing a thermal release film on a wafer surface comprises a frame 1, wherein the upper end of the frame 1 is provided with a waste collecting roller 2 and an adhesive tape fixing roller 11 respectively, the waste collecting roller 2 and the adhesive tape fixing roller 11 are arranged at intervals, and a hot-melt film-tearing adhesive tape 10 is sleeved on the adhesive tape fixing roller 11.
Wherein, still be equipped with tensioning assembly, tear film assembly and heat respectively on the frame 1 and scald the subassembly.
Specifically, the tensioning assembly comprises a first tensioning roller 3 arranged below the waste collecting roller 2, and a second tensioning roller 8 and a third tensioning roller 9 arranged below the adhesive tape fixing roller 11, wherein the second tensioning roller 8 and the third tensioning roller 9 are arranged at intervals up and down. In practical application, in a film tearing process, the first tensioning roller 3, the second tensioning roller 8 and the third tensioning roller 9 are adopted to tension the hot-melt film tearing tape 10.
Specifically, the dyestripping subassembly is including dyestripping roller 4 and the dyestripping roller removal module 12 of being connected with dyestripping roller 4, the below of first tensioning roller 3 is located to dyestripping roller 4, one side of frame 1 is located to dyestripping roller 4, the opposite side of frame 1 is located to dyestripping roller removal module 12. In practical application, the film tearing roller moving module 12 drives the film tearing roller 4 to horizontally move on the heating and adsorbing jig 5, which is described below, so as to tear the film on the wafer 6.
Specifically, the heat scalds the subassembly including heat scald mechanism 7 and with heat the heat of scalding mechanism 7 and be connected scalds roller mobile module 13, heat scald mechanism 7 sets up with dyestripping roller 4 is relative, and heat scald mechanism 7 locates one side of frame 1, the opposite side of frame 1 is located to heat scald roller mobile module 13. In practical application, the blanching roller moving module 13 drives the blanching mechanism 7 to horizontally translate and vertically move on the heating adsorption jig 5, so that the blanching mechanism 7 can firmly heat and adhere the hot-melt film tearing adhesive tape 10 and the film on the surface of the wafer 6, and further, preparation work is prepared for subsequent film tearing.
In addition, the film tearing roller moving module 12 and the blanching roller moving module 13 both adopt a servo linear module to tear off the film, the module moving speed is adjustable and uniform, the acting force is uniform and stable, and the quality of the wafer film tearing process is ensured.
Wherein, the lower end part of the frame 1 is provided with a heating adsorption jig 5, and a wafer 6 is horizontally placed on the heating adsorption jig 5; the heating adsorption jig 5 adopts a vacuum adsorption jig, the wafer is firmly adsorbed, the stress of the wafer is uniform, and the damage of the wafer caused by infirm pressing or uneven force is effectively avoided.
The hot-melt film tearing tape 10 is wound by a waste collecting roller 2, a first tensioning roller 3, a film tearing roller 4, a third tensioning roller 9 and a second tensioning roller 8 in sequence and then is connected with a tape fixing roller 11; and the hot melt tear tape 10 is disposed on the surface of the wafer 6.
In this embodiment, hot melt dyestripping sticky tape 10 is connected with sticky tape fixed roller 11 after receiving waste material roller 2, first tensioning roller 3, dyestripping roller 4, third tensioning roller 9 and the winding of second tensioning roller 9 in proper order, and make hot melt dyestripping sticky tape 10 place the wafer 6 surface on heating adsorption jig 5, when dyestripping roller removes module 12 and removes to the position of tearing, hot melt dyestripping sticky tape 10 just falls to 6 diameter directions of wafer, then it is firm with the membrane pasting on hot melt dyestripping sticky tape 10 front end and rear end and the wafer 6 through scalding mechanism 7, rethread dyestripping roller 4 tears the membrane off under the removal of dyestripping roller removal module 12. The hot melt adhesive tape is adopted to tear the film, so that the risk of scratching the wafer by picking the film by a sharp tool when the film is torn manually is avoided.
A use method of a tearing device for a wafer surface thermal release film comprises the following steps:
step one, starting: initializing a tearing device, moving a blanching roller moving module 13 to a standby position, moving a film tearing roller moving module 12 to the standby position, automatically detecting the temperature of a heating adsorption jig 5 by a system, judging whether the temperature of a blanching mechanism 7 reaches the standard, continuously heating until the temperature reaches the standard after the temperature does not reach the standard, finishing initialization, and waiting for feeding;
step two, feeding: placing the wafer 6 on the heating adsorption jig 5 through manual feeding or other modes, and opening the heating adsorption jig 5 in vacuum to adsorb the wafer 6;
step three, moving the module to a tearing position: moving the film tearing roller moving module 12 to the tearing position;
step four, blanching: moving the blanching roller moving module 13 to a wafer tearing position, descending the blanching mechanism 7 to contact the surface of the wafer 6, waiting for 15 seconds of heating time, firmly adhering the front end of the hot-melt film-tearing tape 10 to a hot peeling film on the surface of the wafer 6, lifting and moving to the tail of the wafer, descending the blanching mechanism 7 to contact the surface of the wafer 6 again, waiting for 10 seconds of heating time, firmly adhering the rear end of the hot-melt film-tearing tape 10 to the hot peeling film on the surface of the wafer 6, lifting the blanching mechanism 7, and moving the blanching roller moving module 13 to a standby position;
step five, tearing the film: the film tearing roller module 12 starts to move towards the direction of the wafer 6, the hot-melt film tearing adhesive tape 10 passes through the film tearing roller 4 until the hot-melt film tearing of the surface of the wafer 6 is torn, and after tearing is finished, the film tearing roller module 12 moves to a standby position;
step six, winding waste materials: the waste collecting roller 2 starts to rotate in reverse time, and stops rotating after the film is completely wound;
step seven, blanking: taking the wafer 6 away manually or by a manipulator;
and step eight, repeating the step two to the step seven until the tearing of one batch of the wafer films is finished.
In conclusion, the vacuum adsorption jig is adopted, so that the wafer is firmly adsorbed and uniformly stressed, and the damage of the wafer caused by infirm pressing or nonuniform force is effectively avoided; the hot melt adhesive tape is adopted to tear the film, so that the risk that the wafer is scratched by adopting a sharp tool to pick the film during manual tearing is avoided; the servo linear module is adopted to tear off the film, the moving speed of the module is adjustable and uniform, the acting force is uniform and stable, the quality of the film tearing process of the wafer is ensured, automatic control is realized, and the production efficiency is improved.
In addition, it should be noted that the film tearing roller moving module, the blanching roller moving module, the heating and adsorbing jig, the blanching mechanism and the like in the present invention are not essential to the prior art, and therefore, the structure and the operation principle thereof are not described in detail herein.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (2)
1. A tearing device for a wafer surface thermal peeling film comprises a rack (1) and is characterized in that the upper end of the rack (1) is respectively provided with a waste collecting roller (2) and an adhesive tape fixing roller (11), the waste collecting roller (2) and the adhesive tape fixing roller (11) are arranged at intervals, and a hot-melt film-tearing adhesive tape (10) is sleeved on the adhesive tape fixing roller (11);
the frame (1) is also provided with a tensioning assembly, a film tearing assembly and a hot stamping assembly respectively;
the tensioning assembly comprises a first tensioning roller (3) arranged below the waste collecting roller (2), a second tensioning roller (8) and a third tensioning roller (9) arranged below the adhesive tape fixing roller (11), and the second tensioning roller (8) and the third tensioning roller (9) are arranged at intervals up and down;
the film tearing component comprises a film tearing roller (4) and a film tearing roller moving module (12) connected with the film tearing roller (4), the film tearing roller (4) is arranged below the first tensioning roller (3), the film tearing roller (4) is arranged on one side of the rack (1), and the film tearing roller moving module (12) is arranged on the other side of the rack (1);
the film tearing and film tearing machine is characterized in that the hot ironing component comprises a hot ironing mechanism (7) and a hot ironing roller moving module (13) connected with the hot ironing mechanism (7), the hot ironing mechanism (7) is arranged opposite to the film tearing roller (4), the hot ironing mechanism (7) is arranged on one side of the rack (1), and the hot ironing roller moving module (13) is arranged on the other side of the rack (1);
a heating adsorption jig (5) is arranged at the lower end part of the rack (1), and a wafer (6) is horizontally placed on the heating adsorption jig (5);
the hot-melt film tearing adhesive tape (10) is wound by a waste collecting roller (2), a first tensioning roller (3), a film tearing roller (4), a third tensioning roller (9) and a second tensioning roller (8) in sequence and then is connected with an adhesive tape fixing roller (11); and the hot-melt film-tearing tape (10) is arranged on the surface of the wafer (6).
2. The use method of the device for tearing the thermal release film on the surface of the wafer according to claim 1, which is characterized by comprising the following steps:
step one, starting: initializing a tearing device, moving a blanching roller moving module (13) to a standby position, moving a film tearing roller moving module (12) to the standby position, automatically detecting the temperature of a heating adsorption jig (5) by a system, judging whether the temperature of a blanching mechanism (7) reaches the standard or not, continuously heating until the temperature reaches the standard if the temperature does not reach the standard, finishing initialization, and waiting for feeding;
step two, feeding: putting the wafer (6) on the heating adsorption jig (5) through manual feeding or other modes, and opening the heating adsorption jig (5) in vacuum to adsorb the wafer (6);
step three, moving the module to a tearing position: moving the film tearing roller moving module (12) to a tearing position;
step four, blanching: moving a blanching roller moving module (13) to a wafer tearing position, descending a blanching mechanism (7) to contact the surface of a wafer (6), waiting for 15 seconds of heating time, firmly adhering the front end of a hot-melt film tearing adhesive tape (10) to a hot peeling film on the surface of the wafer (6), rising the front end of the hot-melt film tearing adhesive tape to the tail of the wafer, descending the blanching mechanism (7) to contact the surface of the wafer (6) again, waiting for 10 seconds of heating time, firmly adhering the rear end of the hot-melt film tearing adhesive tape (10) to the hot peeling film on the surface of the wafer (6), rising the blanching mechanism (7), and moving the blanching roller moving module (13) to a standby position;
step five, tearing the film: the film tearing roller module (12) starts to move towards the direction of the wafer (6), the hot-melt film tearing adhesive tape (10) passes through the film tearing roller (4) until the hot peeling film on the surface of the wafer (6) is torn up, and after tearing is finished, the film tearing roller module (12) moves to a standby position;
step six, winding waste materials: the waste collecting roller (2) starts to rotate in reverse time, and stops rotating after the film is wound;
step seven, blanking: taking the wafer (6) manually or by a manipulator;
and step eight, repeating the step two to the step seven until the tearing of one batch of the wafer films is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210927418.1A CN115258785A (en) | 2022-08-03 | 2022-08-03 | Device and method for tearing thermal peeling film on surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210927418.1A CN115258785A (en) | 2022-08-03 | 2022-08-03 | Device and method for tearing thermal peeling film on surface of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115258785A true CN115258785A (en) | 2022-11-01 |
Family
ID=83748990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210927418.1A Pending CN115258785A (en) | 2022-08-03 | 2022-08-03 | Device and method for tearing thermal peeling film on surface of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115258785A (en) |
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2022
- 2022-08-03 CN CN202210927418.1A patent/CN115258785A/en active Pending
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