CN115254763B - Crystal oscillator box carrier and carrier assembly - Google Patents
Crystal oscillator box carrier and carrier assembly Download PDFInfo
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- CN115254763B CN115254763B CN202210935760.6A CN202210935760A CN115254763B CN 115254763 B CN115254763 B CN 115254763B CN 202210935760 A CN202210935760 A CN 202210935760A CN 115254763 B CN115254763 B CN 115254763B
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- oscillator box
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- 239000013078 crystal Substances 0.000 title claims abstract description 144
- 230000002093 peripheral effect Effects 0.000 claims abstract description 37
- 238000004140 cleaning Methods 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000523 sample Substances 0.000 abstract description 8
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 101100438971 Caenorhabditis elegans mat-1 gene Proteins 0.000 description 1
- 230000001668 ameliorated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention provides a crystal oscillator box carrier and a carrier component, and relates to the field of crystal oscillator probe cleaning tools of evaporation machines. The crystal oscillator box carrier comprises an assembly bit, a peripheral support frame and a connecting part; the plurality of assembly positions are in the same plane, and comprise a first assembly position and at least one circle of a plurality of second assembly positions arranged around the first assembly position; the peripheral support frame surrounds the periphery of the assembly position; the plurality of connecting pieces are respectively connected between the first assembly position, the second assembly position and the peripheral support frame. The carrier assembly comprises a crystal oscillator box carrier and a carrier outer frame, wherein the carrier outer frame comprises a frame body, and a window is formed in the middle of the frame body; one side of the frame body is provided with a mounting groove, and the other side is provided with a protruding part; the peripheral support frame of the crystal oscillator box carrier is fixed in the mounting groove. According to the crystal oscillator box carrier and the carrier assembly, a plurality of crystal oscillator boxes can be loaded for cleaning at one time, and the cleaning efficiency is improved by times; the loaded crystal oscillator boxes are not contacted with each other and collide with each other, so that the crystal oscillator boxes are not easy to damage.
Description
Technical Field
The invention relates to the field of crystal oscillator probe cleaning jigs of evaporation plating machines, in particular to a crystal oscillator box carrier and a carrier assembly.
Background
The evaporation process is one of the most important processes of OLED products, and is to evaporate and attach an organic light emitting material to a substrate at a high temperature in a vacuum environment to form a functional film layer, which is generally performed in an evaporator. In the vapor deposition machine, one or more groups of crystal oscillator probes are generally arranged for monitoring the vapor deposition rate in real time, so that the thickness of the film layer is ensured to be within an error range.
In the evaporation process, the organic material is attached to the substrate and also attached to the crystal oscillator probe, and is generally mainly attached to the surface of the crystal oscillator box on the crystal oscillator probe and the surface of the crystal oscillator sheet in the crystal oscillator box, so that the organic material film layer attached to the crystal oscillator probe needs to be removed regularly to avoid affecting the monitoring accuracy of the crystal oscillator probe. Therefore, the crystal oscillator probe needs to be cleaned regularly.
In the cleaning process, the crystal oscillator box and the crystal oscillator sheets in the crystal oscillator box are generally detached, and are soaked in a corrosive solvent for cleaning. In the traditional cleaning process, the crystal oscillator wafers or crystal oscillator boxes are generally cleaned one by one, so that the efficiency is low and the cost is high. Moreover, if the cleaning process is not good, the wafer or the wafer box is often not cleaned or damaged, which affects the subsequent use. To solve the above problems, a new solution is sought.
Disclosure of Invention
In order to solve one of the above problems in the prior art, the present invention provides a crystal oscillator box carrier, which includes:
a plurality of mounting locations in the same plane, including a first mounting location and at least one turn of a plurality of second mounting locations disposed about the first mounting location; and
The peripheral support frame is annular and surrounds the periphery of the assembly position; and
The connecting part comprises a plurality of first connecting parts, a plurality of second connecting parts and a plurality of third connecting parts, wherein the first connecting parts are connected between the first assembling position and the second assembling position adjacent to the first assembling position, the second connecting parts are connected between the two adjacent second assembling positions, and the third connecting parts are connected between the peripheral supporting frame and the second assembling position adjacent to the peripheral supporting frame.
Further, the space between any two adjacent fitting positions, and the space between the peripheral support frame and the fitting position adjacent thereto are arranged to be equal.
Further, the second assembling position and the second connecting part between the second assembling positions of any circle form a regular polygon together.
Further, the assembly positions are provided with mounting tables, and the mounting tables protrude out of one side surface of the connecting part.
Further, the height from the top of the mounting table to the surface of the connecting part is h which is more than or equal to 2mm.
Further, the peripheral support frame is provided with a combining surface, and the combining surface is positioned on the same side of the mounting table;
the joint surface is higher than the surface of the connecting part and is not higher than the top surface of the mounting table.
Further, the bonding surface extends toward the inner side of the peripheral support frame to the middle of the third connection portion.
Further, the maximum thickness of the crystal oscillator box carrier is not more than 7mm.
And
The invention also provides a crystal oscillator box carrier assembly, which comprises:
The crystal oscillator box carrier; and
The carrier outer frame comprises a frame body, wherein a window is arranged in the middle of the frame body, a mounting groove encircling along the edge of the window is arranged on one side of the frame body, the mounting groove is matched with a peripheral support frame of the crystal oscillator box carrier, and a protruding part encircling along the edge of the window is arranged on the other side of the frame body; and
The peripheral support frame is fixed in the mounting groove.
In a state of loading the crystal oscillator box, the first side surface of the crystal oscillator box, which is far away from the crystal oscillator box carrier, does not exceed the protruding surface at the top of the protruding part.
The beneficial effects of the invention are as follows:
1) According to the crystal oscillator box carrier, a plurality of crystal oscillator boxes can be loaded for cleaning at one time, and the cleaning efficiency is improved in multiple times; the loaded crystal oscillator boxes are not contacted with each other and collide with each other, so that the crystal oscillator boxes are not easy to damage;
2) The crystal oscillator box carrier provided by the invention has the advantages that the overall thickness is not more than 16mm in the state of loading the crystal oscillator box, the thickness is small, and the crystal oscillator box carrier is suitable for being used in a narrow equipment channel; the structural design is light in weight and high in strength, and the crystal oscillator box is not easy to deform when being fully loaded;
3) According to the crystal oscillator box carrier, under the condition that the thickness design space is limited, the mounting table with proper height is arranged at the assembly position, a certain gap is formed between the crystal oscillator box and the crystal oscillator box carrier after the crystal oscillator box is preassembled, and in the cleaning process, cleaning liquid enters the gap to clean the inner side surface of the crystal oscillator box, so that the whole coverage and thorough cleaning of the crystal oscillator box by the cleaning liquid are ensured;
4) According to the crystal oscillator box carrier assembly, the carrier outer frame and the crystal oscillator box carrier are combined, after the crystal oscillator box is loaded, the carrier outer frame can effectively protect the exposed first side face of the crystal oscillator box, and the crystal oscillator box is prevented from being scratched by foreign objects in the cleaning process.
Still other additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic diagram of a crystal oscillator box carrier according to the present invention;
FIG. 2 is an enlarged view of a portion of a crystal box carrier of the present invention;
FIG. 3 is a schematic view of a crystal oscillator cassette carrier assembly according to the present invention;
FIG. 4 is a schematic diagram of a carrier frame;
FIG. 5 is a front view of a carrier housing;
FIG. 6 is an exploded view of a pod carrier assembly (including a pod) according to the present invention;
FIG. 7 is a schematic diagram of a crystal oscillator cassette loading state of the crystal oscillator cassette carrier assembly of the present invention;
In the figure: 1. a crystal oscillator box carrier; 11. a peripheral support frame; 110. a bonding surface; 111. a first fitting hole; 12. assembling the position; 120. a mounting table; 121. a first assembly bit; 122. a second assembly bit; 13. a connection part; 131. a first connection portion; 132. a second connecting portion; 133. a third connecting portion;
2. A carrier outer frame; 20. a frame; 201. a mounting groove; 202. a second fitting hole; 203. a protruding portion; 2031. a convex surface; 204. a rib; 205. a structural groove; 206. a first structural hole; 207. a second structural hole; 208. positioning holes; 21. a window;
3. fastening a screw; 4. preassembling screws;
5. a crystal oscillator box; 51. a first side.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. The invention will be further described with reference to the drawings and examples.
The present embodiment provides a crystal oscillator box carrier assembly, referring to fig. 3, 6 and 7, the crystal oscillator box carrier assembly includes a crystal oscillator box carrier 1 and a carrier outer frame 2, the crystal oscillator box carrier 1 and the carrier outer frame 2 are fixed together, and the crystal oscillator box carrier 1 and the carrier outer frame 2 are preferably connected in a detachable manner, for example: as shown in fig. 3, the crystal box carrier 1 and the carrier outer frame 2 are fixedly connected together by fastening screws 3. In some cases, the crystal box carrier 1 and the carrier outer frame 2 may be connected by riveting, welding, or the like. Referring to fig. 3, 6 and 7, the above-described pod carrier assembly further includes pre-load screws 4, the pre-load screws 4 being used to secure the pod 5 to the pod carrier 1. More specific structures, mounting relationships, and functions will be set forth in detail in the following description.
The carrier outer frame 2 is a high-strength metal workpiece, preferably a stainless steel workpiece. Referring to fig. 4, the structure includes a frame 20, a window 21 is provided in the middle of the frame 20, and the window 21 is adapted to the crystal oscillator box carrier 1. The shapes of the frame 20 and the window 21 are set according to actual demands, for example: the frame 20 is generally in the form of a flat plate, preferably rectangular in shape; in some cases, the frame 20 may also be provided in one of a circular shape or a regular polygon; the window 21 is adapted to receive the crystal box carrier 1, preferably circular or regular polygonal. A mounting groove 201 is circumferentially arranged along the edge of the window 21, and the mounting groove 201 is positioned on one side surface of the frame body 20; the other side surface of the frame 20 is provided with a projection 203, the projection 203 projects from the surface of the frame 20 in the thickness direction thereof, and the projection 203 also extends circumferentially around the edge of the window 21, preferably in a closed loop. The mounting groove 201 and the protruding portion 203 at the window 21 provide protection for the crystal box carrier 1 and the crystal box 5 carried by the same mounted and carried on the carrier outer frame 2.
The crystal oscillator box carrier 1 is a high-strength and light-weight material workpiece, preferably an aluminum alloy workpiece, and the surface of the aluminum alloy can be subjected to natural-color anodic oxidation and sand blasting. Referring to fig. 1, the pod carrier 1 includes a peripheral support frame 11, an assembly site 12, and a connection part 13. The crystal oscillator box carrier 1 is in a flat plate shape. The crystal box carrier 1 will be described in more detail with reference to fig. 1.
The assembly site 12 has a plurality of assembly sites 12 on the same plane, and the assembly sites 12 include a first assembly site 121 and a plurality of second assembly sites 122. The second fitting bits 122 are arranged around the first fitting bits 121 as a center, and the number of the enclosed rings is at least one. Each assembly bit 12 has a screw hole, and the preassembled screw 4 is fitted into the screw hole of each assembly bit 12. Referring to fig. 7, during cleaning, a plurality of crystal oscillator boxes 5 are respectively assembled on different assembling positions 12 through preassembled screws 4, and the crystal oscillator boxes 5 with the same number as the assembling positions 12 can be simultaneously cleaned by one-time loading, so that the cleaning efficiency of the crystal oscillator boxes 5 is improved by times.
The peripheral support frame 11 is annular, and preferably has a circular ring or a regular polygon, and surrounds the assembly member 12. The peripheral support frame 11 is adapted to the mounting groove 201 on the carrier outer frame 2. Referring to fig. 3, in a state that the crystal oscillator cassette carrier 1 is combined with the carrier outer frame 2, the peripheral support frame 11 is combined and fixed in the mounting groove 201.
The above-mentioned connection portion 13 also has a plurality of first connection portions 131, a plurality of second connection portions 132, and a plurality of third connection portions 133, wherein the first connection portions 131 are connected between the first assembly bits 121 and the second assembly bits 122 adjacent to the first assembly bits 121, the second connection portions 132 are connected between the two adjacent second assembly bits 122, and the third connection portions 133 are connected between the peripheral support frame 11 and the second assembly bits 122 adjacent to the peripheral support frame 11, so as to form the crystal oscillator cassette carrier 1 having a mesh structure as shown in fig. 1. It should be noted that the first connection portion 131 is not necessarily connected between the first assembly location 121 and the second assembly location 122 adjacent thereto, for example: of the six first connection portions 131 of the crystal oscillator cassette carrier 1 shown in fig. 1, only three of them may be provided, that is, three of the six first connection portions 131 are removed at intervals. Similarly, the third connecting portion 133 is not necessarily connected between the second fitting portion 122 and the peripheral support frame 11.
For the above-mentioned crystal oscillator cassette carrier 1, the number of turns surrounded by the second assembling line 122 is generally set mainly according to practical requirements, but it is generally preferable to use no more than two turns in consideration of the fact that the excessive size may generate unacceptable deformation. When the number of turns enclosed by the second assembling bits 122 is one or two, the deformation of the crystal oscillator box carrier 1 when the crystal oscillator box carrier 1 is preassembled on the adapted carrier outer frame 2 is insufficient to enable the crystal oscillator box 5 to be separated from the protection of the carrier outer frame 2. For example, the pod carrier 1 shown in fig. 1 includes a first mounting location 121 and only one turn of a second mounting location 122.
The peripheral support frame 11 on the crystal oscillator box carrier 1 is provided with first assembly holes 111, and the mounting groove 201 on the carrier outer frame 2 is internally provided with second assembly holes 202, and the second assembly holes 202 are in one-to-one correspondence with the first assembly holes 111. At least one of the second fitting hole 202 and the first fitting hole 111 is a screw hole. Referring to fig. 3, after the peripheral support frame 11 of the carrier 1 is pre-installed in the installation groove 201 of the carrier outer frame 2, the fastening screw 3 is installed in the pre-installation hole to fix the peripheral support frame and the carrier outer frame.
In the above-mentioned crystal oscillator box carrier assembly, after the crystal oscillator box carrier 1 is assembled in the carrier outer frame 2, the crystal oscillator box carrier 1 is not in the mounting groove 201, and when the crystal oscillator box carrier assembly is moved along the direction in the plane of the carrier outer frame 2 such as the x-axis direction or the y-axis direction as shown in fig. 4, the part of the opening of the mounting groove 201 higher than the surface of the crystal oscillator box carrier 1 provides protection for the surface of the side of the crystal oscillator box carrier 1, and the protruding part 203 on the side opposite to the mounting groove 201 provides protection for the other side of the crystal oscillator box carrier 1 and the crystal oscillator box 5 thereon.
In view of protecting the exposed first side 51 of the crystal box 5, the first side 51 of the crystal box 5 away from the crystal box carrier 1 should not exceed the protruding surface 2031 of the top of the protruding portion 203 in the state of loading the crystal box 5. In this regard, in the cassette carrier assembly, the minimum distance between the top surface of the mounting block 120 on the cassette carrier 1 and the projection surface 2031 on the top of the projection 203 on the carrier frame 2 should be at least not less than the effective thickness of the cassette 5, e.g., equal to or greater than the latter.
Considering the protection effect on the crystal oscillator box 5, the strength and deformation resistance of the carrier outer frame 2, and the passing performance of the carrier outer frame 2 in a narrow space, in this embodiment, the distance between the protruding surface 2031 at the top of the protruding portion 203 and the bottom surface of the mounting groove 201 is preferably about 10mm, for example 8-12 mm, further for example 9mm, 10mm, 11mm, etc.
In the carrier outer frame 2 of the crystal oscillator cassette carrier assembly, most of the area of the middle part is occupied by the window 21, so that the strength of the frame body 20 is poor, and deformation is easy to occur. In order to overcome this problem, the above-mentioned two structures of the mounting groove 201 and the protrusion 203 play a role. In order to further reduce the risk of deformation of the carrier outer frame 2 during processing or in a loaded state, further consideration must be given to increasing the strength of the frame body 20.
Therefore, in some embodiments, referring to fig. 4, a rib 204 is provided on the frame 20 of the carrier frame 2, and the rib 204 and the protrusion 203 are located on the same side surface of the frame 20, so as to avoid increasing the overall thickness of the carrier frame 2. The rib 204 has one end connected to the protrusion 203 and the other end extending outward to the outer edge of the frame 20. The rib 204 has a plurality of ribs symmetrically disposed on at least one set of opposite sides of the frame 20, for example: two ribs 204 are provided on each of a pair of opposite sides of the frame 20 in the x direction, as shown in fig. 4. The symmetrical arrangement of ribs 204 on opposite sides of frame 20 helps to balance the weight of the opposite sides of frame 20.
The above-mentioned rib 204 increases the weight of the carrier frame 2 to a certain extent, and in the application scenario of grabbing the crystal oscillator cassette carrier assembly by using the manipulator, the weight of the carrier frame 2 increases, or the manipulator grabs and fails, and even the manipulator with larger carrying capacity needs to be replaced. To solve this problem, referring to fig. 4, the frame 20 of the carrier outer frame 2 is further provided with a structural groove 205, and the structural groove 205 is symmetrically disposed on at least one set of opposite sides of the frame 20. Preferably, the structural groove 205 is located on the same set of opposite sides of the frame 20 as the rib 204, so as to offset the weight increase of the set of opposite sides due to the additional rib 204, so as to balance the weight around the frame 20.
As a more preferred embodiment, there are at least two ribs 204 and/or grooves 205 on the same side of the frame 20 and symmetrically disposed about the midline of the side of the frame 20. For example: as shown in fig. 4, a structural groove 205 is provided between two ribs 204 on the same side of a set of opposite sides of the frame 20 along the x direction; or two structural grooves 205 are arranged on the same side of the frame body 20, and a convex rib 204 is arranged between the two structural grooves 205; or a plurality of structural grooves 205 and a plurality of ribs 204 are simultaneously arranged on the same side of the frame body 20, and the ribs 204 and the structural grooves 205 are alternately arranged.
It should be noted that the rib 204 and the structural groove 205 do not have to exist at the same time. That is to say: only the rib 204 may be provided for reinforcing the frame 20; only the structure groove 205 may be provided to reduce the weight of one set of opposite sides of the housing 20.
In some embodiments, the frame 20 of the carrier outer frame 2 is further provided with a structural hole for further reducing the weight of a wider or heavier portion of the frame 20, and at least one structural hole is provided. When there are a plurality of structural holes, they are provided around the window 21 on the frame 20. For example, the rectangular carrier outer frame 2 shown in fig. 4 is provided with structural holes at four corners of its rectangular frame body 20, wherein: two first structure holes 206 are formed in one set of diagonal positions, two second structure holes 207 are formed in the other set of diagonal positions, and the two first structure holes 206 and the two second structure holes 207 are respectively symmetrical in center around the center of the carrier outer frame 2.
The structural grooves 205 and the structural holes can reduce the overall weight of the carrier outer frame 2, balance the weight around the frame 20, and improve the deformation resistance of the frame 20. Preferably, as shown in fig. 4, the structural holes are all stepped through holes, which further improves the structural strength of the frame 20.
For use with a robot, in some embodiments, at least one positioning hole 208 is further provided in the frame 20 of the carrier frame 2. For example, as shown in fig. 4, one positioning hole 208 is provided at each corner of a set of diagonal corners of the rectangular frame 20, and the two positioning holes 208 are center-symmetrical with respect to the center of the frame 20. In the example of fig. 4, the area of the two first structure holes 206 located on the same set of diagonal angles with the positioning holes 208 is smaller than that of the two second structure holes 207 located on the other set of diagonal angles, so as to compensate the weight loss of the frame 20 on the diagonal angles caused by the positioning holes 208, so that the dead weight around the frame 20 becomes even, and the stability when being gripped by a manipulator is improved.
In some embodiments, the above-mentioned crystal box carrier 1, on which the assembly positions 12 are spaced, generally requires: after the adjacent two assembly bits 12 are pre-assembled with the crystal oscillator boxes 5, the two crystal oscillator boxes 5 are not interfered and shielded.
As a more preferred embodiment, referring to fig. 1, in the crystal-box carrier 1, any two adjacent assembly positions 12, and between the peripheral support frame 11 and the assembly position 12 adjacent to the peripheral support frame 11, are arranged with equal pitches, for example: the minimum distance between the edges of the two crystal oscillator boxes 5 is more than 5 mm. This arrangement has the advantages that: after the crystal oscillator box carrier component carrying the crystal oscillator box 5 is immersed in the cleaning liquid, the cleaning liquid can quickly enter a gap between the crystal oscillator box 5 and the crystal oscillator box carrier 1 in a preset time, the back surface of the crystal oscillator box 5 is cleaned, and the cleaning efficiency and the cleaning effect are optimized. Considering that the size of the tray surface of the overall crystal oscillator box carrier 1 is not easy to be excessively large, the interval between the assembly bits 12 is not easy to be excessively large, and the upper limit value should be set according to practical situations and requirements.
In the above embodiment, the second fitting portions 122 enclosed in a circle are connected by the second connection portion 132 to form a closed shape. Preferably, the second fitting part 122 of any one turn and the second connection part 132 connected therebetween form a regular polygon. For example, as shown in fig. 1, the first assembly bit 121 has six second assembly holes 202 surrounding a circle, and the six second assembly holes 202 and the second connection portions 132 connected therebetween surround a regular hexagon. The advantages of this structure are: in the case where the predetermined distance between the second fitting bits 122 is determined, the length of the connection portion 13 is minimum, the structural strength is high, and the shielding of the back surface of the crystal oscillator box 5 is small.
In some embodiments, as shown in fig. 1, a mounting table 120 is provided on the assembly position 12 of the crystal-box carrier 1, the mounting table 120 protrudes from one side surface of the connecting portion 13 connected thereto, and the protruding direction is along the thickness direction of the crystal-box carrier 1. When the crystal oscillator box 5 is mounted on the assembly position 12, a gap is formed between the crystal oscillator box 5 and the surface of the connecting part 13 connected with the mounting table 120 due to the existence of the mounting table 120, and cleaning liquid passes through the gap and enters between the crystal oscillator box 5 and the connecting part 13 so as to clean the part, which is shielded by the connecting part 13, on the crystal oscillator box 5.
In the above-described embodiment, as shown in fig. 2, the height of the mount 120 from the surface of the connection portion 13 is denoted by h. If the height h is set to be smaller, for example, smaller than 1mm, in this case, after the crystal oscillator box carrier assembly carrying the crystal oscillator box 5 is immersed in the cleaning solution, a bubble area is formed in the gap between the crystal oscillator box 5 and the connecting portion 13, and due to the smaller gap, the gas in the bubble area is not sufficiently discharged during the cleaning process, that is, the cleaning solution cannot enter the area to clean the surface of the crystal oscillator box 5 in the area. Although this problem can be ameliorated by reducing the concentration of the cleaning liquid, the effect is not ideal, and the reduction in the concentration of the cleaning liquid affects the cleaning efficiency and cleaning effect.
Therefore, in order to overcome the above-described problem, the present embodiment has been studied in which the height h of the top of the mount 120 from the surface of the connection portion 13 is set to 2mm or more. In this case, the gas remaining in the gap between the crystal oscillator box 5 and the connection portion 13 is easily discharged, and the discharge is clean for a predetermined time. Considering that the thickness design of the crystal-box carrier 1 is limited, the larger the height h is, the smaller the thickness of the reserved connection portion 13 is, so that in the case of comprehensively considering strength and deformation, the height h is preferably not more than 3mm, for example: 2mm, 2.5mm, 3mm, etc.
In the above embodiment, referring to fig. 1, the peripheral support frame 11 of the crystal oscillator cassette carrier 1 has the bonding surface 110, and the bonding surface 110 is located on the same side of the mounting base 120. As shown in fig. 3, in the wafer cassette carrier assembly, the peripheral support frame 11 is fitted into the mounting groove 201 of the carrier outer frame 2, and the joint surface 110 is fitted to the bottom surface of the mounting groove 201.
As shown in fig. 2, the bonding surface 110 is higher than the surface of the connection portion 13 and not higher than the mount 120. That is, in the thickness direction of the crystal oscillator cassette carrier 1, the bonding surface 110 is located between the surface of the connecting portion 13 and the top surface of the mounting table 120.
It will be appreciated that, in the thickness direction of the crystal-box carrier 1, if the surface of the bonding surface 110 and the surface of the connecting portion 13 are on the same surface or lower than the surface of the connecting portion 13, the distance between the top surface of the mounting table 120 and the surface of the bonding surface 110 is at least the height h of the mounting table 120 relative to the surface of the connecting portion 13, and in the crystal-box carrier assembly as shown in fig. 7, when the thickness of the connecting portion 13 is constant, the distance between the top surface of the mounting table 120 and the protruding surface 2031 on the top of the protruding portion 203 on the carrier frame 2 will be smaller, and the protruding surface 2031 will not be enough to exceed the exposed first side 51 of the crystal-box 5 in the thickness direction to form protection.
For example: taking the case that the bonding surface 110 and the surface of the connecting portion 13 are on the same surface as an example, the maximum design thickness of the carrier outer frame 2 is preset to be 15mm, the height h=2mm of the mounting table 120 relative to the surface of the connecting portion 13, the thickness of the connecting portion 13 is set to be 4.5mm in consideration of the strength of the connecting portion 13, and the depth of the mounting groove 201 on the carrier outer frame 2 is 5mm, in this case, the distance between the top surface of the mounting table 120 and the protruding surface 2031 on the top of the protruding portion 203 in the crystal oscillator box carrier assembly as shown in fig. 7 is only 8mm; if the bonding surface 110 is higher than 0.5mm in the thickness direction of the crystal oscillator cassette carrier 1 and is located between the surface of the connection portion 13 and the top surface of the mounting table 120, the distance between the top surface of the mounting table 120 and the protruding surface 2031 on top of the protruding portion 203 will be increased to 8.5mm.
The design described above enlarges the distance between the top surface of the mounting table 120 and the protruding surface 2031 on top of the protruding portion 203, so that the protruding portion 203 can exceed the exposed first side surface 51 of the crystal oscillator box 5 in the thickness direction and be protected in a limited thickness design space; on the other hand, the strength of the peripheral support frame 11 of the pod carrier 1 is enhanced.
In the wafer cassette carrier 1 shown in fig. 1, the connection portion 13 is in a state of being outwardly divergent with the first assembly position 121 as a center, which results in a relatively divergent connection structure at the periphery of the wafer cassette carrier 1, and relatively weak structural strength. In this embodiment, to improve the above problem, the joint surface 110 extends to the middle of the third connecting portion 133 toward the inner side of the peripheral supporting frame 11, so as to strengthen the strength of the third connecting portion 133.
As a preferred embodiment, the maximum thickness of the crystal-box carrier 1 does not exceed 7mm, such as 7mm, 6mm, 5mm, etc. In this way, the thickness of the carrier frame 2 adapted to the pod carrier 1 and the pod carrier assembly formed by the two can be made small enough to be used in a narrower space. For example: for the crystal oscillator box with the effective thickness of 8mm and the diameter of 74mm to be cleaned, the design loading number of the crystal oscillator box carrier 1 is 7, the designed maximum thickness is set to be 6mm, and the reliable thickness of the carrier outer frame 2 can be only 15mm or even smaller.
Finally, it should be noted that the foregoing embodiments are merely for illustrating the technical solution of the embodiments of the present invention and are not intended to limit the embodiments of the present invention, and although the embodiments of the present invention have been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the embodiments of the present invention may be modified or replaced with the same, and the modified or replaced technical solution may not deviate from the scope of the technical solution of the embodiments of the present invention.
Claims (5)
1. A crystal oscillator box carrier component is characterized in that,
Comprises a crystal oscillator box carrier (1), wherein the crystal oscillator box carrier (1) comprises:
A plurality of mounting locations (12) in a same plane, wherein the plurality of mounting locations (12) comprises a first mounting location (121) and at least one circle of a plurality of second mounting locations (122) disposed around the first mounting location (121); and
A peripheral support frame (11) which is annular and surrounds the periphery of the assembly position (12); and
A connecting part (13) comprising a plurality of first connecting parts (131), a plurality of second connecting parts (132) and a plurality of third connecting parts (133), wherein the first connecting parts (131) are connected between a first assembling position (121) and a second assembling position (122) adjacent to the first assembling position, the second connecting parts (132) are connected between two adjacent second assembling positions (122), and the third connecting parts (133) are connected between the peripheral supporting frame (11) and the second assembling position (122) adjacent to the peripheral supporting frame; and
The assembly positions (12) are provided with mounting tables (120), the mounting tables (120) protrude out of one side surface of the connecting part (13), and the height h between the top of each mounting table (120) and the surface of the connecting part (13) is more than or equal to 2mm; when the crystal oscillator box (5) is mounted on the assembly position (12), a gap is formed between the crystal oscillator box (5) and the surface of the connecting part (13) connected with the mounting table (120) due to the existence of the mounting table (120), and cleaning liquid passes through the gap and enters between the crystal oscillator box (5) and the connecting part (13) so as to clean the part, which is shielded by the connecting part (13), on the crystal oscillator box (5);
The assembly bit (12) is provided with a screw hole for installing the preassembled screw (4);
The crystal oscillator box also comprises preassembled screws (4) which are used for fixing the crystal oscillator box (5) on the crystal oscillator box carrier (1);
the device also comprises a carrier outer frame (2), wherein the carrier outer frame (2) comprises a frame body (20), and a window (21) is formed in the middle of the frame body (20);
One side of the frame body (20) is provided with a mounting groove (201) encircling along the edge of the window (21), the mounting groove (201) is matched with a peripheral support frame (11) of the crystal oscillator box carrier (1), and the peripheral support frame (11) is fixed in the mounting groove (201);
the other side of the frame body (20) is provided with a bulge (203) encircling along the edge of the window (21);
in a state of loading the crystal oscillator box (5), a first side surface (51) of the crystal oscillator box (5) far away from the crystal oscillator box carrier (1) does not exceed a protruding surface (2031) at the top of the protruding part (203);
The peripheral support frame (11) is provided with a bonding surface (110), and the bonding surface (110) is positioned on the same side of the mounting table (120); the bonding surface (110) is higher than the surface of the connecting part (13) and is not higher than the top surface of the mounting table (120).
2. The crystal-box carrier assembly according to claim 1, characterized in that the spacing between any two adjacent assembly sites (12) is equal, and the spacing between the peripheral support frame (11) and the adjacent assembly sites (12) is equal.
3. The crystal box carrier assembly of claim 2, wherein any one turn of the second assembly bits (122) and the second connection portion (132) therebetween together form a regular polygon.
4. The crystal box carrier assembly according to claim 1, characterized in that the bonding surface (110) extends to the middle of the third connection portion (133) towards the inner side of the peripheral support frame (11).
5. The crystal-box carrier assembly according to claim 1, characterized in that the maximum thickness of the crystal-box carrier (1) does not exceed 7mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210935760.6A CN115254763B (en) | 2022-08-04 | 2022-08-04 | Crystal oscillator box carrier and carrier assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210935760.6A CN115254763B (en) | 2022-08-04 | 2022-08-04 | Crystal oscillator box carrier and carrier assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115254763A CN115254763A (en) | 2022-11-01 |
| CN115254763B true CN115254763B (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210935760.6A Active CN115254763B (en) | 2022-08-04 | 2022-08-04 | Crystal oscillator box carrier and carrier assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115254763B (en) |
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| CN215884469U (en) * | 2021-05-27 | 2022-02-22 | 东莞长盈精密技术有限公司 | Full-process carrier |
| CN216360107U (en) * | 2021-10-25 | 2022-04-22 | 广东长盈精密技术有限公司 | Carrier tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10759126B2 (en) * | 2017-04-03 | 2020-09-01 | Alcon Inc. | Carrier for carrying an ophthalmic lens during its treatment in a bath |
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| JP2005294378A (en) * | 2004-03-31 | 2005-10-20 | Shin Etsu Handotai Co Ltd | Apparatus and method for polishing double-surface of semiconductor wafer |
| CN101143368A (en) * | 2006-09-15 | 2008-03-19 | 鸿富锦精密工业（深圳）有限公司 | Cleaning tool |
| EP2036623A2 (en) * | 2007-09-13 | 2009-03-18 | Friedhelm Kraft | Modular carrier system |
| CN106960810A (en) * | 2016-01-11 | 2017-07-18 | 锡宬国际有限公司 | Wafer bearing device |
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| CN216360107U (en) * | 2021-10-25 | 2022-04-22 | 广东长盈精密技术有限公司 | Carrier tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115254763A (en) | 2022-11-01 |
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