CN209148525U - Fixed wafer jig - Google Patents
Fixed wafer jig Download PDFInfo
- Publication number
- CN209148525U CN209148525U CN201821832531.7U CN201821832531U CN209148525U CN 209148525 U CN209148525 U CN 209148525U CN 201821832531 U CN201821832531 U CN 201821832531U CN 209148525 U CN209148525 U CN 209148525U
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- microscope carrier
- substrate
- circular open
- support columns
- wafer
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- 239000000758 substrate Substances 0.000 claims abstract description 53
- 230000001681 protective effect Effects 0.000 claims description 14
- 229920001821 foam rubber Polymers 0.000 claims 1
- 210000003205 muscle Anatomy 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000628997 Flos Species 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model embodiment discloses a kind of fixed wafer jig.The fixation wafer jig of the utility model, comprising: substrate, round sponge pad, the first microscope carrier, the first support column, the second microscope carrier and the second support column.First microscope carrier has the first circular open in circular ring shape, and the top of substrate is erected at by the first support column.Second microscope carrier has the second circular open in circular ring shape, the top of substrate is erected at by the second support column, and be located at the top of the first microscope carrier.Round sponge pad is disposed on the substrate, and positioned at the lower section of the first circular open, the area of round sponge pad is greater than the area of the first circular open, and the diameter of the second circular open is greater than the diameter of the first circular open.The fixation wafer jig of the utility model, backside of wafer is placed on upward on corresponding microscope carrier, is pressed down the chip of needs from wafer by thimble, easy to operate, and the back side that can observe wafer in time collapses scarce situation, grasps the cutting quality of wafer.
Description
Technical field
The utility model embodiment is related to wafer technology field, and in particular to a kind of fixed wafer jig.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC products for having specific electrical functionality.It is brilliant
Round periphery is equipped with iron ring, for protecting wafer.
Chip refers to the silicon wafer for including integrated circuit, volume very little, often one of computer or other electronic equipments
Point.Wafer is the raw material for manufacturing chip, requires to cut wafer according to different chip size, then by chip from crystalline substance
It is taken out on circle, carries out follow-up process.
The inventors of the present application found that wafer is put into board, calibration bits when in the prior art taking out chip from wafer
It postpones and chip is sucked out by suction device, the time of cumbersome, consuming is longer.
Utility model content
The purpose of this utility model is to provide a kind of fixed wafer jigs, facilitate and take out chip from wafer.
The utility model embodiment provides a kind of fixed wafer jig, comprising: substrate, round sponge pad, the first microscope carrier, more
The second support column of the first support column of root, the second microscope carrier and Duo Gen；
First microscope carrier is in circular ring shape and has the first circular open, and first microscope carrier passes through more described first
Dagger is erected at the top of the substrate；
Second microscope carrier is in circular ring shape and has the second circular open, and second microscope carrier passes through more described second
Dagger is erected at the top of the substrate, and second microscope carrier is located at the top of first microscope carrier；
The round sponge pad is arranged in the upper surface of the substrate, positioned at the lower section of first circular open, institute
The area for stating round sponge pad is greater than the area of first circular open；
The diameter of second circular open is greater than the diameter of first circular open, and second circular open exists
Projection on the round sponge pad covers projection of first circular open on the round sponge pad.
In a kind of feasible scheme, first microscope carrier is horizontally disposed, is fixed on by more first support columns
The top of the substrate；
Second microscope carrier and first microscope carrier are arranged in parallel, are fixed on institute by more second support columns
State the top of substrate；
And first microscope carrier is overlapped with the axial line of second microscope carrier.
In a kind of feasible scheme, the top surface of first microscope carrier is protruded on the top of more first support columns；
Protrude the top surface of second microscope carrier in the top of more second support columns.
In a kind of feasible scheme, further includes: multiple first protective cases and multiple second protective cases；
Multiple first protective cases are socketed in the top of more first support columns respectively；
Multiple second protective cases are socketed in the top of more second support columns respectively.
In a kind of feasible scheme, the opposite two sides of first circular open are equipped with first rectangular notch；
The opposite two sides of second circular open are equipped with the second rectangular notch.
In a kind of feasible scheme, the substrate includes: substrate body, more dowels and annular portion；
The middle part of the substrate body is equipped with through-hole, and the annular portion is located in the through-hole, the annular portion with it is described
Substrate body forms multiple hollowed out areas by the more dowel connections in the middle part of the substrate.
In a kind of feasible scheme, the inner surface of the more dowels is lower than outer surface, in the dowel
Upper formation step, the round sponge pad are connected at the step.
In a kind of feasible scheme, the opposite two sides of the substrate are equipped with handle.
In a kind of feasible scheme, the bottom surface of the substrate is equipped with non-slip mat.
In a kind of feasible scheme, further includes: multiple first adjusting nuts and multiple second adjusting nuts；
The upper end of more first support columns is equipped with external screw thread, and multiple first adjusting nuts are engaged on more respectively
On first support column；
The upper end of more second support columns is equipped with external screw thread, and multiple second adjusting nuts are engaged on more respectively
On second support column；
First microscope carrier is equipped with multiple first through hole, and the aperture of the first through hole is greater than the straight of first support column
Diameter, more first support columns are each passed through multiple first through hole, so that first microscope carrier is shelved on described first and adjust
It saves on nut；
Second microscope carrier is equipped with multiple second through-holes, and the aperture of second through-hole is greater than the straight of second support column
Diameter, more second support columns are each passed through multiple second through-holes, so that second microscope carrier is shelved on described second and adjust
It saves on nut.
Based on above scheme it is found that the utility model passes through setting substrate, the first microscope carrier, the second microscope carrier and round sponge
Pad.First microscope carrier and the second microscope carrier pass through the first support column respectively and the second support column is erected at the top of substrate.First microscope carrier
There is various sizes of circular open with the second microscope carrier, for placing various sizes of wafer.When use upward by backside of wafer
It being placed on corresponding microscope carrier, is pressed down the chip of needs from wafer by thimble, round sponge pad is placed on substrate,
For accepting chip, wafer damage is prevented.The fixation wafer jig of the utility model, it is easy to operate, and wafer can be observed in time
The back side collapse scarce situation, grasp the cutting quality of wafer.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the main view of the fixation wafer jig in the utility model embodiment one；
Fig. 2 is the left view of the fixation wafer jig in the utility model embodiment one；
Fig. 3 is the top view of the fixation wafer jig in the utility model embodiment one；
Fig. 4 is the use state diagram of the fixation wafer jig in the utility model embodiment one；
Fig. 5 is the main view of the fixation wafer jig in the utility model embodiment two.
Figure label:
1, wafer；11, iron ring；2, substrate；21, substrate body；22, dowel；221, step；23, annular portion；24,
Hand；25, non-slip mat；3, round sponge pad；4, the first microscope carrier；41, the first circular open；42, first rectangular notch；5, first
Dagger；5 ˊ, the first support column；51, the first protective case；52, the first adjusting nut；6, the second microscope carrier；61, the second circular open；
62, the second rectangular notch；7, the second support column；7 ˊ, the second support column；71, the second protective case；72, the second adjusting nut.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
"front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " axial direction ", " radial direction ", " circumferential direction " etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, be also possible to integral；
It can be mechanical connection, be also possible to be electrically connected, be also possible to communication connection；It can be and be directly connected to, centre can also be passed through
Medium is indirectly connected with, and can be the connection inside two elements or the interaction relationship of two elements, unless otherwise clear
Restriction.For the ordinary skill in the art, above-mentioned term can be understood in the utility model as the case may be
In concrete meaning.
The technical solution of the utility model is described in detail with specifically embodiment below.These are specific below
Embodiment can be combined with each other, and the same or similar concept or process may be repeated no more in some embodiments.
Fig. 1 is the main view of the fixation wafer jig in the utility model embodiment one, and Fig. 2 is the utility model embodiment
The left view of fixation wafer jig in one, Fig. 3 are the top view of the fixation wafer jig in the utility model embodiment one, figure
4 be the use state diagram of the fixation wafer jig in the utility model embodiment one.As shown in Figures 1 to 4, the present embodiment
Fixation wafer jig, for fixing wafer 1.Wafer 1 is thin rounded flakes, and the periphery of wafer 1 has 11 edge sealing of iron ring, will
Wafer 1 is wrapped in the middle part of iron ring 11, to protect wafer 1.Wafer 1 has different diameter specifications, therefore the outer diameter of iron ring 11
There is different dimensions.Iron ring 11 is placed on the jig of the utility model, i.e., it is wafer 1 is fixed.
The fixation wafer jig of the present embodiment, comprising: substrate 2, round sponge pad 3, the first microscope carrier 4, more first supports
Column 5, the second microscope carrier 6 and the second support column of Duo Gen 7.
Substrate 2 is square plate.
First microscope carrier 4 is in circular ring shape, in first circular open 41 that is centrally formed of the first microscope carrier 4, the first circular open 41
Aperture be used for and iron ring 11 cooperate.First microscope carrier 4 is erected at the top of substrate 2 by more first support columns 5.First is round
The aperture of opening 41 is less than the outer diameter of iron ring 11, so that iron ring 11 can be placed on the first microscope carrier 4, to fix wafer 1.
Second microscope carrier 6 is also in circular ring shape, is centrally formed the second circular open 61, the second circular open in the second microscope carrier 6
61 aperture is used to cooperate with the iron ring 11 of different size.Second microscope carrier 6 is erected at substrate 2 by more second support columns 7
Top, and the second microscope carrier 6 is located at the top of the first microscope carrier 4.The aperture of second circular open 61 is less than the outer diameter of iron ring 11, so that
The iron ring 11 of different size can be placed on the second microscope carrier 6, to fix wafer 1.
Round sponge pad 3 is arranged on the upper surface of substrate 2, positioned at the lower section of the first circular open 41 of the first microscope carrier 4,
The area of round sponge pad 3 is greater than the area of the first circular open 41, for accepting the chip pressed down from wafer 1.
The diameter of second circular open 61 is greater than the diameter of the first circular open 41, and the second circular open 61 is in round sea
Projection of projection the first circular open 41 of covering on round sponge pad 3 on continuous pad 3.
It should be noted that those skilled in the art should be understood that according to actual needs, above the substrate of jig also
More microscope carriers can be set up, for fixing the wafer of different size.
Through the above it is not difficult to find that the utility model passes through setting substrate, the first microscope carrier, the second microscope carrier and circle sea
Silk floss pad.First microscope carrier and the second microscope carrier pass through the first support column respectively and the second support column is erected at the top of substrate.First carries
Platform and the second microscope carrier have various sizes of circular open, for placing fixed various sizes of wafer.Wafer is carried on the back when use
It is placed on corresponding microscope carrier, is pressed down the chip of needs from wafer up by thimble, the setting of round sponge pad exists
On substrate, for accepting chip, wafer damage is prevented.The fixation wafer jig of the utility model, it is easy to operate, and can see in time
The back side for examining wafer collapses scarce situation, grasps the cutting quality of wafer.
Optionally, the first microscope carrier 4 is horizontally disposed, and the first microscope carrier 4 is fixed on the upper of substrate 2 by more first support columns 5
Side.
Second microscope carrier 6 and the first microscope carrier 4 are arranged in parallel, i.e., the second microscope carrier 6 is also horizontally disposed with, and the second microscope carrier 6 passes through
More second support columns 7 are fixed on the top of substrate 2.
And first microscope carrier 4 be overlapped with the axial line of the second microscope carrier 6.Round sponge pad 3 is located at the underface of the first microscope carrier 4.
Further, the top surface of the first microscope carrier 4 is protruded at the top of more first support columns 5.More first support column 5 formation
Interior diameter of a circle be adapted to the diameter of iron ring 11, make iron ring 11 be connected to more first support columns 5 formation inner circle in.
Equally, the top surface of the second microscope carrier 6 is protruded at the top of more second support columns 7.More second support columns 7 form interior
Diameter of a circle is adapted to the diameter of the iron ring of different size, is connected to iron ring in the inner circle of more second support columns 7 formation.
Further, the fixation wafer jig of the utility model, further includes: multiple first protective cases 51 flexible and
Two protective cases 71.
Multiple first protective cases 51 are socketed in the top of more first support columns 5 respectively.
Multiple second protective cases 71 are socketed in the top of more second support columns 7 respectively.
Optionally, the opposite two sides of 41 inner ring of the first circular open of the first microscope carrier 4 are equipped with first rectangular notch 42.
The opposite two sides of 61 inner ring of the second circular open of second microscope carrier 6 are equipped with the second rectangular notch 62.
First rectangular notch 42 and the second rectangular notch 62 are set, the pick-and-place of wafer can be facilitated.
Optionally, substrate 2 includes: substrate body 21, more dowels 22 and annular portion 23.
The middle part of substrate body 21 is equipped with circular through hole.Annular portion 23 is located at the centre of substrate 2, annular portion 23 and base
Plate ontology 21 is connected by more dowels 22, forms multiple hollowed out areas at the middle part of substrate 2, to mitigate the weight of jig,
Facilitate the carrying of jig.
Further, more dowels 22 are equipped with step 221.That is the table at 22 inside (middle part) and annular portion 23 of dowel
Face forms step 221 lower than the surface in 22 outside of dowel on dowel 22.The inner circle and round sponge that step 221 is formed
The outer circle of pad 3 is adapted to.Round sponge pad 3 is connected at the step of dowel 22, prevents round sponge pad 3 mobile in substrate 2.
Optionally, the opposite two sides of substrate 2 are equipped with handle 24, are used for handling fixture.
Optionally, the bottom surface of substrate 2 is equipped with non-slip mat 25, prevents jig from moving on the table.
Fig. 5 is the main view of the fixation wafer jig in the utility model embodiment two.Embodiment is second is that be based on embodiment
One improvement project thes improvement is that further include the first adjusting nut and the second adjusting nut, for adjusting the first microscope carrier
With the height of the second microscope carrier.
As shown in figure 5, the fixation wafer jig of the present embodiment, further includes: multiple first adjusting nuts 52 and multiple second
Adjusting nut 72.
The top of more first support column, 5 ˊ is equipped with external screw thread, and multiple first adjusting nut, 52 branches are engaged on more first
On the screw thread on 5 top ˊ of support column.
The top of more second support column, 7 ˊ is equipped with external screw thread, and multiple second adjusting nut, 72 branches are engaged on more second
On the screw thread on 7 top ˊ of support column.
First microscope carrier is equipped with multiple first through hole, and the position of first through hole is corresponding with the first support column, the hole of first through hole
Diameter is greater than the diameter of the first support column.More first support column, 5 ˊ are each passed through multiple first through hole, are shelved on the first microscope carrier
On first adjusting nut 52.
Second microscope carrier is equipped with multiple second through-holes, and the position of the second through-hole is corresponding with the second support column, the hole of the second through-hole
Diameter is greater than the diameter of the second support column.More second support column, 7 ˊ are each passed through multiple second through-holes, are shelved on the second microscope carrier
On second adjusting nut 72.
The first adjusting nut and the second adjusting nut, the first microscope carrier and second is arranged in the fixation wafer jig of the present embodiment
Microscope carrier is respectively rested on the first adjusting nut and the second adjusting nut.The first adjusting nut and the second adjusting nut are rotated, it can
The height and level of the first microscope carrier and the second microscope carrier are adjusted separately, the different demands in production are met.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that fisrt feature and second feature directly contact or fisrt feature and second feature pass through intermediary mediate contact.
Moreover, fisrt feature can be fisrt feature in second feature above the second feature " above ", " above " and " above "
Directly above or obliquely above, or first feature horizontal height is merely representative of higher than second feature.Fisrt feature is in second feature " it
Under ", " lower section " and " following " can be fisrt feature and be directly under or diagonally below the second feature, or be merely representative of fisrt feature water
Flat height is lower than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc., it is intended that specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in one or more any embodiment or example.In addition, without conflicting with each other, this
The technical staff in field can be by the spy of different embodiments or examples described in this specification and different embodiments or examples
Sign is combined.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (10)
1. a kind of fixed wafer jig characterized by comprising substrate, round sponge pad, the first microscope carrier, more first supports
The second support column of column, the second microscope carrier and Duo Gen；
First microscope carrier is in circular ring shape and has the first circular open, and first microscope carrier passes through more first support columns
It is erected at the top of the substrate；
Second microscope carrier is in circular ring shape and has the second circular open, and second microscope carrier passes through more second support columns
It is erected at the top of the substrate, and second microscope carrier is located at the top of first microscope carrier；
The round sponge pad is arranged in the upper surface of the substrate, positioned at the lower section of first circular open, the circle
The area of shape foam-rubber cushion is greater than the area of first circular open；
The diameter of second circular open is greater than the diameter of first circular open, and second circular open is described
Projection on round sponge pad covers projection of first circular open on the round sponge pad.
2. fixed wafer jig according to claim 1, which is characterized in that first microscope carrier is horizontally disposed, by more
First support column described in root is fixed on the top of the substrate；
Second microscope carrier and first microscope carrier are arranged in parallel, are fixed on the base by more second support columns
The top of plate；
And first microscope carrier is overlapped with the axial line of second microscope carrier.
3. fixed wafer jig according to claim 2, which is characterized in that the top protrusion of more first support columns
The top surface of first microscope carrier；
Protrude the top surface of second microscope carrier in the top of more second support columns.
4. fixed wafer jig according to claim 3, which is characterized in that further include: multiple first protective cases and multiple
Second protective case；
Multiple first protective cases are socketed in the top of more first support columns respectively；
Multiple second protective cases are socketed in the top of more second support columns respectively.
5. fixed wafer jig according to claim 1, which is characterized in that the opposite two sides of first circular open
Equipped with first rectangular notch；
The opposite two sides of second circular open are equipped with the second rectangular notch.
6. fixed wafer jig according to claim 1, which is characterized in that the substrate includes: substrate body, Duo Genlian
Connect muscle and annular portion；
The middle part of the substrate body is equipped with through-hole, and the annular portion is located in the through-hole, the annular portion and the substrate
Ontology forms multiple hollowed out areas by the more dowel connections in the middle part of the substrate.
7. fixed wafer jig according to claim 6, which is characterized in that the inner surface of the more dowels is lower than
Outer surface, forms step on the dowel, and the round sponge pad is connected at the step.
8. fixed wafer jig according to claim 1, which is characterized in that the opposite two sides of the substrate are equipped with handle
Hand.
9. fixed wafer jig according to claim 1, which is characterized in that the bottom surface of the substrate is equipped with non-slip mat.
10. fixed wafer jig according to claim 1, which is characterized in that further include: multiple first adjusting nuts and more
A second adjusting nut；
The upper end of more first support columns is equipped with external screw thread, and multiple first adjusting nuts are engaged on respectively described in more
On first support column；
The upper end of more second support columns is equipped with external screw thread, and multiple second adjusting nuts are engaged on respectively described in more
On second support column；
First microscope carrier is equipped with multiple first through hole, and the aperture of the first through hole is greater than the diameter of first support column,
More first support columns are each passed through multiple first through hole, so that first microscope carrier is shelved on described first and adjust spiral shell
On mother；
Second microscope carrier is equipped with multiple second through-holes, and the aperture of second through-hole is greater than the diameter of second support column,
More second support columns are each passed through multiple second through-holes, so that second microscope carrier is shelved on described second and adjust spiral shell
On mother.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821832531.7U CN209148525U (en) | 2018-11-08 | 2018-11-08 | Fixed wafer jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821832531.7U CN209148525U (en) | 2018-11-08 | 2018-11-08 | Fixed wafer jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209148525U true CN209148525U (en) | 2019-07-23 |
Family
ID=67271387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821832531.7U Active CN209148525U (en) | 2018-11-08 | 2018-11-08 | Fixed wafer jig |
Country Status (1)
| Country | Link |
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| CN (1) | CN209148525U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111516022A (en) * | 2020-04-30 | 2020-08-11 | 紫光宏茂微电子(上海)有限公司 | A glued membrane cutting device for wafer |
| CN115254763A (en) * | 2022-08-04 | 2022-11-01 | 江苏高光半导体材料有限公司 | Crystal oscillator box carrier and carrier assembly |
-
2018
- 2018-11-08 CN CN201821832531.7U patent/CN209148525U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111516022A (en) * | 2020-04-30 | 2020-08-11 | 紫光宏茂微电子(上海)有限公司 | A glued membrane cutting device for wafer |
| CN115254763A (en) * | 2022-08-04 | 2022-11-01 | 江苏高光半导体材料有限公司 | Crystal oscillator box carrier and carrier assembly |
| CN115254763B (en) * | 2022-08-04 | 2024-05-14 | 江苏高光半导体材料有限公司 | Crystal oscillator box carrier and carrier assembly |
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