CN115247032A - Efficient grinding adhesive tape for wafer thinning and preparation method thereof - Google Patents

Efficient grinding adhesive tape for wafer thinning and preparation method thereof Download PDF

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Publication number
CN115247032A
CN115247032A CN202210358572.1A CN202210358572A CN115247032A CN 115247032 A CN115247032 A CN 115247032A CN 202210358572 A CN202210358572 A CN 202210358572A CN 115247032 A CN115247032 A CN 115247032A
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styrene
parts
butadiene
nitrile rubber
adhesive tape
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CN202210358572.1A
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CN115247032B (en
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张程
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Shanghai Guke Technology Co ltd
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Shanghai Guke Adhesive Tape Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to the technical field of C09J grinding adhesive tapes, and particularly provides a high-efficiency grinding adhesive tape for wafer thinning and a preparation method thereof. The multifunctional adhesive prepared by using vinyl acetate, N-hydroxymethyl acrylamide, glycidyl methacrylate, benzoyl peroxide, styrene-butadiene-styrene block copolymer, nitrile rubber, triethanolamine, hexamethylenetetramine and the like as raw materials has no bubbles in the coating process, has uniform adhesive layer thickness, has excellent wear resistance, compressive strength, tensile strength and peeling strength compared with the prior art, and has potential application prospect in the field of semiconductor processing.

Description

Efficient grinding adhesive tape for wafer thinning and preparation method thereof
Technical Field
The invention relates to the technical field of C09J grinding adhesive tapes, and particularly provides a high-efficiency grinding adhesive tape for wafer thinning and a preparation method thereof.
Background
With the rapid development of electronic technology, semiconductor materials are widely used in the fields of integrated circuits, communication systems, and power conversion. The overall performance of the semiconductor material directly affects the usage of the integrated circuit and the communication system, and in order to further improve the overall performance of the semiconductor material, wafer thinning processing is usually performed on the semiconductor chip. The grinding tape is a common tool in the process of thinning and processing wafers, and how to enhance the bonding property and the wear resistance of the grinding tape becomes one of the work centers of researchers.
Chinese patent publication No. CN108587502a discloses an adhesive tape for semiconductor wafer processing and a method for manufacturing the same, wherein the adhesive tape manufactured in the present disclosure has excellent moisture tolerance, adhesion and durability, but when the thickness of the adhesive in the solution is 150 μm, bubbles may occur during coating, and the uniformity of the adhesive layer thickness is not good, which may affect the effect of the adhesive tape in the semiconductor processing.
Therefore, the development of the grinding adhesive tape which is not easy to generate bubbles in the preparation process and has excellent uniformity of the thickness of the adhesive layer has potential application value in the field of wafer thinning processing.
Disclosure of Invention
In order to solve the technical problems, the invention provides a high-efficiency grinding adhesive tape for wafer thinning, which is prepared from raw materials including an elastic resin matrix, a multifunctional binder and abrasive particles.
In a preferred embodiment of the present invention, the elastic resin matrix includes at least one of a polyethylene elastomer, a polyurethane elastomer, a polystyrene elastomer, a polyamide elastomer, and a polypropylene elastomer.
In a more preferred embodiment of the present invention, the elastic resin matrix is a polyurethane elastomer.
As a preferable technical scheme, the multifunctional binder comprises the following raw materials in parts by weight: 60-100 parts of acrylate compounds, 1-5 parts of initiators, 5-15 parts of toughness modifiers, 1-3 parts of organic amine compounds, 3-10 parts of viscosity modifiers, 1-3 parts of accelerators, 1-3 parts of silane coupling agents and 1-3 parts of functional auxiliaries.
In a preferred embodiment of the present invention, the acrylate compound includes at least one of butyl acrylate, isooctyl acrylate, methyl methacrylate, vinyl acetate, N-methylol acrylamide, glycidyl methacrylate, hydroxyethyl methacrylate, and the like.
As a more preferable technical scheme of the invention, the acrylic ester compound is vinyl acetate, N-hydroxymethyl acrylamide and glycidyl methacrylate, and the weight ratio of the vinyl acetate, the N-hydroxymethyl acrylamide and the glycidyl methacrylate is (0.5-1.5): (0.2-0.8): (0.6-1.2).
In a most preferred embodiment of the present invention, the weight ratio of vinyl acetate, N-methylolacrylamide and glycidyl methacrylate is 1:0.4:0.8.
in a preferred embodiment of the present invention, the initiator includes at least one of an organic peroxide initiator, an inorganic peroxide initiator, and an azo initiator.
As a more preferable technical scheme of the invention, the initiator is an organic peroxide initiator.
In a preferred embodiment of the present invention, the organic peroxide initiator includes at least one of benzoyl peroxide, lauroyl peroxide, cumene hydroperoxide, tert-butyl peroxybenzoate, and diisopropyl peroxydicarbonate.
In a more preferred embodiment of the present invention, the organic peroxide initiator is benzoyl peroxide.
In a preferred embodiment of the present invention, the toughness modifier comprises at least one of nitrile rubber, isobutylene rubber, styrene-butadiene-styrene block copolymer, methylmethacrylate-butadiene-styrene terpolymer, oxidized polyethylene, and the like.
As a more preferable technical scheme of the invention, the toughness modifier is styrene-butadiene-styrene block copolymer and nitrile rubber, and the weight ratio of the styrene-butadiene copolymer to the nitrile rubber is (0.4-1.2): (1-1.5).
As a most preferred technical solution of the present invention, the weight ratio of the styrene-butadiene-styrene block copolymer to the nitrile rubber is 0.6:1.2.
in a preferred embodiment of the present invention, the styrene-butadiene-styrene block copolymer has a styrene molar content of 25 to 35%.
In a more preferred embodiment of the present invention, the styrene-butadiene-styrene block copolymer has a styrene content of 30% by mole.
As a preferable technical scheme of the invention, the nitrile rubber is semi-crosslinked powder nitrile rubber.
As a preferred technical scheme of the invention, the mol content of the combined acrylonitrile in the semi-crosslinked powder nitrile rubber is 30-35%.
As a more preferable technical scheme of the invention, the bonded acrylonitrile molar content in the semi-crosslinked powder nitrile rubber is 33%.
As a preferred technical solution of the present invention, the organic amine compound includes at least one of diethanolamine, triethanolamine, and hexamethylenetetramine.
As a more preferable technical scheme of the invention, the organic amine compound is triethanolamine and hexamethylenetetramine, and the weight ratio of the triethanolamine to the hexamethylenetetramine is (0.2-0.4): (0.7-1.3).
As a most preferred technical solution of the present invention, the weight ratio of the triethanolamine to the hexamethylenetetramine is 0.3:1.1.
in a preferred embodiment of the present invention, the viscosity modifier includes at least one of terpene resin, petroleum resin, polystyrene, phenol resin, and the like.
As a more preferable technical scheme of the invention, the viscosity modifier is phenolic resin and polystyrene, and the weight ratio of the phenolic resin to the polystyrene is (1-1.7): (0.3-0.7).
As a most preferred technical solution of the present invention, the weight ratio of the phenolic resin to the polystyrene is 1.5:0.5.
in a preferred embodiment of the present invention, the mole content of the methylol group in the phenolic resin is 8 to 10%.
In a more preferred embodiment of the present invention, the phenolic resin has a hydroxymethyl group content of 9.8% by mole.
As a preferred technical scheme of the invention, the melt flow rate of the polystyrene at 230 ℃ is 4-10g/10min.
As a more preferred embodiment of the present invention, the polystyrene has a melt flow rate of 7.2g/10min at 230 ℃.
As a preferable technical scheme of the invention, the accelerator comprises at least one of thiourea, hydroquinone, p-hydroxyanisole, N-dimethyl-p-phenylenediamine and tetramethyl thiourea.
In a preferred embodiment of the present invention, the silane coupling agent includes at least one of KH550, KH560, KH570, KH580, KH590, KH902, and KH 792.
As a preferred technical solution of the present invention, the functional assistant includes at least one of a wetting agent, a defoaming agent, and a leveling agent.
In a more preferred embodiment of the present invention, the functional additive is a wetting agent.
In a preferred embodiment of the present invention, the wetting agent is a silicone-based wetting agent.
As a preferable technical scheme of the invention, the abrasive particles are inorganic oxide with the particle size of 14-18 μm, and the addition amount is 10-30% of the weight of the multifunctional adhesive.
As a more preferable embodiment of the present invention, the inorganic oxide includes Al 2 O 3 、Cr 2 O 3 、Fe 2 O 3 、ZrO 2 、CaO、SiO 2 At least one of (1).
The invention provides a preparation method of a high-efficiency grinding adhesive tape for wafer thinning, which comprises the following steps;
(1) Uniformly stirring an acrylate compound, a toughness improver, an organic amine compound, a viscosity modifier, an accelerator, a silane coupling agent and a functional auxiliary agent at 60-90 ℃ to obtain a mixture;
(2) And (2) uniformly coating the mixture obtained in the step (1) on the surface of a base material, uniformly coating abrasive particles on the surface of the mixture, adding an initiator, and baking at 70-80 ℃ for 0.5-2h to obtain the efficient grinding adhesive tape for wafer thinning.
Wherein the thickness of the base material in the step (2) is 20-30 μm.
The thickness of the dry glue in the grinding adhesive tape in the step (2) is 20-150 mu m.
Compared with the prior art, the invention has the following beneficial effects:
1. the efficient grinding adhesive tape for thinning the wafer, which is prepared by the invention, is prepared by reasonably compounding vinyl acetate, N-hydroxymethyl acrylamide and glycidyl methacrylate, and a large number of researches show that when the weight ratio of the vinyl acetate to the N-hydroxymethyl acrylamide to the glycidyl methacrylate is 1:0.4:0.8, the adhesive tape interacts with other components in the system and has excellent wettability and cohesiveness, the prepared grinding adhesive tape has a good coating effect with a polyurethane elastomer matrix in the system on one hand, and has good affinity with abrasive silica particles in the system on the other hand, and when the adhesive tape is applied to a wafer thinning processing process, the internal stress, the packaging volume, the heat dissipation efficiency and the like of a chip are obviously improved, and the service life and the application range of the chip are expanded.
2. The high-efficiency grinding adhesive tape for thinning the wafer, which is prepared by the invention, is prepared by reasonably compounding styrene-butadiene-styrene block copolymer and nitrile rubber, particularly when the weight ratio of the styrene-butadiene-styrene block copolymer to the nitrile rubber is 0.6:1.2, when the styrene-butadiene-styrene block copolymer contains 30 mol% of styrene and 33 mol% of acrylonitrile, the acrylonitrile-butadiene rubber is half-crosslinked powder acrylonitrile-butadiene rubber, on the basis of improving the bearing strength and fatigue resistance of the multifunctional adhesive, the multifunctional adhesive and phenolic resin in the components have synergistic effect, so that the problem that the multifunctional adhesive is easy to generate bubbles in the coating process is effectively avoided, the bubbles cannot be generated when the dry adhesive thickness is 150 mu m, the prepared grinding adhesive tape has excellent comprehensive performance, and the phenomenon of chip pollution cannot be generated in the semiconductor processing process.
3. The efficient grinding adhesive tape for thinning the wafer, which is prepared by the invention, is prepared by introducing polystyrene with the mole content of hydroxymethyl of 9.8% and the melt flow rate of 7.2g/10min at 230 ℃ into a system for reasonable compounding, and particularly when the weight ratio of phenolic resin to polystyrene is 1.5: when 0.5, on one hand, the full and uniform dispersion of all components in the system is promoted, and the stability of the system is improved; on the other hand, the internal structure in the system can be improved, the bonding performance, the compression resistance, the wear resistance, the tensile strength and the peel strength of the multifunctional adhesive are enhanced, the problem that the grinding adhesive tape is easy to break when being heated in the wafer thinning process is effectively avoided, and the uniformity of the adhesive layer thickness of the multifunctional adhesive in the coating process is improved.
4. The high-efficiency grinding adhesive tape for thinning the wafer, which is prepared by the invention, can be mixed with phenolic resin, semi-crosslinked powdered nitrile rubber and the high-efficiency grinding adhesive tape for thinning the wafer, wherein the weight ratio of the KH550 to the silicone wetting agent is 0.3:1.1, the triethanolamine and the hexamethylenetetramine effectively improve the compatibility of the phenolic resin and the semi-crosslinked powder nitrile rubber in the system through the synergistic effect, simultaneously improve the caking property between the multifunctional adhesive and the polyurethane elastomer base material, and promote Al with the granularity of 14 mu m 2 O 3 The dispersion uniformity on the surface of the adhesive layer improves the thinning effect of the grinding adhesive tape on the chip.
5. The efficient grinding tape for thinning the wafer, which is prepared by the invention, takes vinyl acetate, N-hydroxymethyl acrylamide and glycidyl methacrylate as substrates, and substances such as benzoyl peroxide, styrene-butadiene-styrene block copolymer, nitrile rubber, triethanolamine, hexamethylenetetramine and the like are added into a system, so that the prepared grinding tape has excellent wear resistance, compressive strength, tensile strength and peeling strength, and has wide application prospects in the field of thinning the wafer.
Examples
Example 1
Embodiment 1 provides a high-efficiency grinding tape for wafer thinning, which is prepared from the following raw materials in parts by weight: an elastomeric resin matrix, a multifunctional binder, and abrasive particles.
The elastic resin matrix is a polyurethane elastomer, is purchased from Yingcang plastification Co., ltd, and has a model of basf C95A;
the multifunctional binder comprises the following raw materials in parts by weight: 80 parts of acrylate compounds, 3 parts of initiators, 5 parts of toughness modifiers, 2 parts of organic amine compounds, 6 parts of viscosity modifiers, 2 parts of accelerators, 1.5 parts of silane coupling agents and 2 parts of functional auxiliaries.
The acrylate compounds are vinyl acetate, N-hydroxymethyl acrylamide and glycidyl methacrylate, and the weight ratio of the vinyl acetate to the N-hydroxymethyl acrylamide to the glycidyl methacrylate is 1:0.4:0.8; the vinyl acetate has a CAS number of 108-05-4,N-methylolacrylamide and a CAS number of 924-42-5, glycidyl methacrylate was purchased from Mica chemical company;
the initiator is benzoyl peroxide; the CAS number for benzoyl peroxide is 94-36-0;
the toughness improver is styrene-butadiene-styrene block copolymer and semi-crosslinked powder nitrile rubber, and the weight ratio of the styrene-butadiene-styrene block copolymer to the semi-crosslinked powder nitrile rubber is 0.6:1.2; the styrene-butadiene-styrene block copolymer is purchased from Suzhou David New Material science and technology Co., ltd, and is of a Kraton D1101, and the molar content of styrene is 30%; the semi-crosslinked powdered nitrile rubber is purchased from new constant water plastic overflow material science and technology limited, the model is P630, and the mol content of the combined acrylonitrile is 33 percent;
the organic amine compound is triethanolamine and hexamethylenetetramine, and the weight ratio of the triethanolamine to the hexamethylenetetramine is 0.3:1.1;
the viscosity modifier is phenolic resin and polystyrene, and the weight ratio of the phenolic resin to the polystyrene is 1.5:0.5; the phenolic resin is purchased from Shandong Jinnaite environmental protection science and technology Limited company, the model is 2402, and the molar content of hydroxymethyl is 9.8 percent; polystyrene purchased from Yingcang plastification Co., ltd, yuyao, model GPPS GP33, melt flow rate at 230 ℃ of 7.2g/10min
The accelerant is hydroquinone; the silane coupling agent is KH550;
the functional assistant is an organic silicon wetting agent which is purchased from Shanghai Kaiyin chemical Co., ltd and has the model of BYK-333.
The abrasive particles are SiO 2 The adhesive is purchased from the Jinan Hongquan titanium industry Co., ltd, has a particle size of 14 μm and is added in an amount of 25% of the weight of the multifunctional adhesive.
The preparation method of the efficient grinding adhesive tape for thinning the wafer comprises the following steps;
(1) Uniformly stirring an acrylate compound, a toughness improver, an organic amine compound, a viscosity modifier, an accelerator, a silane coupling agent and a functional auxiliary agent at 70 ℃ to obtain a mixture;
(2) And (2) uniformly coating the mixture obtained in the step (1) on the surface of a base material, uniformly coating abrasive particles on the surface of the mixture, adding an initiator, and baking at 75 ℃ for 1h to obtain the efficient grinding adhesive tape for thinning the wafer.
Wherein the thickness of the base material in the step (2) is 25 μm.
And (3) the thickness of the dry glue in the grinding adhesive tape in the step (2) is 140 mu m.
Comparative example 1
The embodiment of comparative example 1 is the same as example 1 except that no toughness modifier is added.
Comparative example 2
Comparative example 2 the embodiment is the same as example 1 except that no viscosity modifier is added.
Evaluation of Performance
(1) Peel strength test
The grinding adhesive tapes prepared in example 1 and comparative examples 1-2 were prepared into 120mm × 30mm samples, GB/T2791-1995 "adhesive T Peel Strength test method", and the peel strength of the products was tested, and the measured data are shown in Table 1;
(2) Test of adhesive layer stability
The multifunctional adhesives prepared according to the schemes of example 1 and comparative examples 1-2 were observed for the bondline during coating: if no bubble exists, the level is A; if bubbles appear, the state is B level.
TABLE 1 high efficiency abrasive tape Performance test results
Figure BDA0003582902600000071
Figure BDA0003582902600000081

Claims (10)

1. The efficient grinding adhesive tape for thinning the wafer is characterized in that raw materials for preparation comprise an elastic resin matrix, a multifunctional binder and abrasive particles.
2. The high efficiency abrasive tape according to claim 1, wherein the elastic resin matrix comprises at least one of a polyethylene elastomer, a polyurethane elastomer, a polystyrene elastomer, a polyamide elastomer, and a polypropylene elastomer.
3. The efficient grinding adhesive tape according to claim 1, wherein the raw materials for preparing the multifunctional adhesive comprise the following components in parts by weight: 60-100 parts of acrylate compounds, 1-5 parts of initiators, 5-15 parts of toughness modifiers, 1-3 parts of organic amine compounds, 3-10 parts of viscosity modifiers, 1-3 parts of accelerators, 1-3 parts of silane coupling agents and 1-3 parts of functional auxiliaries.
4. The high efficiency abrasive tape according to claim 3, wherein the acrylate compound comprises at least one of butyl acrylate, isooctyl acrylate, methyl methacrylate, vinyl acetate, N-methylol acrylamide, glycidyl methacrylate, hydroxyethyl methacrylate, and the like.
5. The high efficiency grinding tape of claim 3, wherein the toughness modifier comprises at least one of nitrile rubber, isobutylene rubber, styrene-butadiene-styrene block copolymer, methyl methacrylate-butadiene-styrene terpolymer, oxidized polyethylene, and the like.
6. The high-efficiency grinding tape according to claim 3 or 5, wherein the toughness modifier is styrene-butadiene-styrene block copolymer, nitrile rubber, and the weight ratio of the styrene-butadiene copolymer to the nitrile rubber is (0.4-1.2): (1-1.5).
7. The high efficiency abrasive tape according to claim 6, wherein the styrene-butadiene-styrene block copolymer has a styrene content of 25 to 35% by mole; the nitrile rubber is semi-crosslinked powder nitrile rubber with the mol content of bound acrylonitrile of 30-35%.
8. The high efficiency abrasive tape according to claim 3, wherein the viscosity modifier comprises at least one of terpene resin, petroleum resin, polystyrene, phenolic resin, and the like.
9. The high efficiency grinding tape according to claim 8, wherein the molar content of the hydroxymethyl group in the phenolic resin is 8-10%; the melt flow rate of the polystyrene at 230 ℃ is 4-10g/10min.
10. A method for preparing a high efficiency abrasive tape according to any one of claims 3 to 9, comprising the steps of;
(1) Uniformly stirring an acrylate compound, a toughness improver, an organic amine compound, a viscosity modifier, an accelerator, a silane coupling agent and a functional auxiliary agent at 60-90 ℃ to obtain a mixture;
(2) And (2) uniformly coating the mixture obtained in the step (1) on the surface of a base material, uniformly coating abrasive particles on the surface of the mixture, adding an initiator, and baking at 70-80 ℃ for 0.5-2h to obtain the efficient grinding adhesive tape for wafer thinning.
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