CN115246270A

CN115246270A - Chip and ink box

Info

Publication number: CN115246270A
Application number: CN202210006104.8A
Authority: CN
Inventors: 夏敬章
Original assignee: Zhuhai Ninestar Management Co Ltd
Current assignee: Zhuhai Ninestar Management Co Ltd
Priority date: 2017-10-12
Filing date: 2017-12-21
Publication date: 2022-10-28
Anticipated expiration: 2037-12-21
Also published as: CN207790032U; WO2019072010A1; JP7442702B2; CN107901611B; JP7261553B2; JP2023052865A; EP3666527A4; EP3666527B1; CN115246270B; JP2019073004A; EP3666527A1; CN107901611A

Abstract

The invention provides a chip and ink box, the chip is used for installing on the ink box, the ink box is used for installing in the installation part in the printer along the installation direction; the chip comprises a memory, a first contact part and a second contact part, wherein the first contact part and the second contact part are used for installation detection; at least one second contact electrically connected to the memory; the first contact part and the second contact part are respectively contacted with contact pins in the printer; the first contact parts are arranged in a plurality of rows in the mounting direction; in the mounting direction, one or more rows formed by the second contact parts are arranged among the rows formed by the first contact parts; or, the multiple rows formed by the first contact parts are arranged among the multiple rows formed by the second contact parts. First contact site and second contact site are not arranged in same row, and this structure is favorable to reducing the electromagnetic interference of non-contact that leads to owing to the voltage difference between first contact site and the second contact site and appears the burr wave, prevents that the terminal from appearing wrong data signal's the condition, guarantees that the chip normally works.

Description

Chip and ink box

The invention is a divisional application with the application number of 201711397088.5, the application date of 2017, 12 months and 21 days, and the invention name of the invention is chip and ink box.

Technical Field

The invention relates to the technical field of ink-jet printers, in particular to a chip and an ink box.

Background

With the continuous progress of science and technology, the printer industry develops rapidly, the application of the ink-jet printer is more and more extensive, and the ink box becomes a consumable part of the ink-jet printer. The ink box is provided with a chip, the chip for the ink box is used for storing information such as production factory information, ink quantity information, ink box category information and ink colors, and the chip for the ink box plays a decisive role in normal work of the ink-jet printer.

Fig. 1 is a schematic view of an ink cartridge 10 to be mounted on a mounting portion 90. Fig. 2 is a schematic diagram of a prior art chip 20. As shown in fig. 1 and 2, the mounting portion 90 is a component of a printer for carrying a plurality of or one ink cartridge 10, and the ink cartridge 10 is detachably mounted in the mounting portion 90 in a mounting direction P. The ink cartridge 10 includes a chip 20, a handle 30, an ink outlet 40, and a cartridge body 50. The mounting portion 90 includes a stylus portion 91 and an ink supply portion 92. The cartridge 50 stores ink, the ink reaches the ink supply portion 92 through the ink outlet 40, and the ink supply portion 92 can supply the ink to the print head, so that the ink can be used for printing. The chip 20 has a terminal set 200 thereon, and the terminal set 200 can be electrically connected in contact with the contact pins 91a of the contact pin part 91 for mutual transmission of electrical signals. The handle 30 is used to fix the ink cartridge 10 to the mounting portion 90 and prevent the ink cartridge 10 from coming out of the mounting portion 90.

The chip 20 of the related art includes a substrate 20a, a terminal group 200 provided on the substrate 20a, and a memory (not shown). The terminal group 200 includes 9 terminals 201-209,9 divided into

first terminals

201, 204, 205, 209 and

second terminals

202, 203, 206-208. The first terminal is a terminal for performing mounting detection when the ink cartridge 10 is mounted to the mounting portion 90. The second terminal is a terminal other than the first terminal. At least a portion of the second terminals are for connection to the memory of chip 20. Each of the 9 terminals 201 to 209 includes a contact portion 201a to 209a to be in contact with the contact pin 91 a. The 9 contact portions 201a to 209a are arranged in 2 rows (first row L1, second row L2) in the mounting direction P, and the 9 contact portions 201a to 209a are arranged to be shifted from each other in the width direction T perpendicular to the mounting direction P. The

contact portions

201a, 204a of the

terminals

201, 204 in the first terminal and the

second contact portions

202a, 203a of the

terminals

202, 203 in the second terminal are arranged in the first row L1, and the

contact portions

201a, 204a are respectively located at both ends in the width direction T of the first row L1; the

contact portions

205a, 209a of the

terminals

205, 209 in the first terminals and the second contact portions 206a-208a of the terminals 206-208 in the second terminals are arranged in the second row L2, and the

contact portions

205a, 209a are located at both ends in the width direction T of the second row L2, respectively.

In the prior art, for better mounting detection, the input voltage of the

first terminals

201, 204, 205, 209 is generally different from the input voltage of the

second terminals

202, 203, 206-208. The chip 20 can normally perform mounting detection and signal transmission only within a certain range of the electrical signal on each terminal. However, the first terminal and the second terminal for mounting detection are arranged in the manner shown in fig. 2, and the first terminal and the second terminal are too close to each other, so that the mounting detection signal on the first terminal and the signal on the second terminal cause signal interference, and the interfered terminal may be mistaken as a data signal (for example, the 42V high voltage on the first terminal may cause a glitch on the adjacent terminal, so that the terminal may be mistaken as a data signal). Signal interference between the terminals occurs between the first terminal and the second terminal, which may cause the terminals to generate error data signals, and thus the terminal group 200 of the chip 20 may not work normally.

Disclosure of Invention

The invention provides a chip and an ink box, which are used for solving the technical problem that signals are interfered with each other between terminals in the prior art.

A first aspect of embodiments of the present invention provides a chip for mounting to an ink cartridge for mounting in a mounting portion in a printer in a mounting direction; the chip comprises a memory, a first contact part and a second contact part, wherein the first contact part and the second contact part are used for installation detection; at least one of the second contacts is electrically connected to the memory; the first contact part and the second contact part are respectively contacted with contact pins in the printer;

the first contact portions are arranged in a plurality of rows in the mounting direction;

in the mounting direction, one or more rows formed by second contact parts are arranged among the rows formed by the first contact parts; or, a plurality of rows formed by the first contact parts are arranged among the plurality of rows formed by the second contact parts.

Optionally, the first contact portion includes: a first set of interconnected mounting sensing contacts, a second set of interconnected mounting sensing contacts; the first and second sets of mounting detection contacts are arranged in a plurality of rows in the mounting direction.

Optionally, the first set of mounting detection contacts form a first row in the mounting direction; the second set of mounting detection contacts form a second row in the mounting direction; the second contact portion forms one or more rows disposed between the first row and the second row.

Optionally, the first set of mounting detection contacts are connected by a wire, and the second set of mounting detection contacts are connected by a resistor; the second set of mounting detection contacts is applied with a voltage higher than the voltage of the first set of mounting detection contacts.

Optionally, the second contact portion includes a ground contact portion not connected to the memory; the memory also comprises a power supply contact part, a data contact part and a reset contact part which are connected with the memory.

Optionally, the chip includes: a plurality of first terminals, a plurality of second terminals; the plurality of first contact portions are provided on the plurality of first terminals, and the plurality of second contact portions are provided on the plurality of second terminals.

Optionally, the chip includes: a plurality of first terminals, a plurality of second terminals; in the mounting direction, one or more rows of second terminals are provided between the rows of the first terminals.

Optionally, the rows of the first contact portions and the row or rows of the second contact portions are spaced from each other.

Optionally, in the mounting direction, the multiple rows of the first contact portions and the multiple rows of the second contact portions are spaced from each other one by one.

Optionally, in the mounting direction, the first contact portions form a first row and a second row; the second contact portions form a third row and a fourth row; the first row and the second row are mutually spaced with the third row and the fourth row one by one.

Alternatively, the second row is closer to a front end side in the mounting direction than the third row and the fourth row.

Alternatively, the fourth row is closer to a front end side in the mounting direction than the first row and the second row.

Optionally, the chip includes a first portion and a second portion; the first portion and the second portion are manufactured from two circuit substrates.

Optionally, the first portion and the second portion are made of substrates of different materials; the second part is made of conductive silica gel or conductive metal material.

Optionally, the second contact portion is provided on the first portion and the first contact portion is provided on the second portion.

Optionally, the chip further comprises a through portion; the through portion penetrates the chip in a thickness direction of the chip.

Optionally, the chip further includes a substrate, and the first contact portion protrudes more than the second contact portion with respect to the substrate.

Optionally, the first portion is provided with a terminal hole through which a terminal provided with a contact portion on the second portion can pass and protrude with respect to the first portion.

Optionally, in the mounting direction, the first contact portions form a first row and a second row; the second contact portions form a third row and a fourth row; the first row and the second row are arranged between the third row and the fourth row.

Optionally, in a direction perpendicular to the mounting direction, the second group of mounting detection contacts is outermost of all the contacts, and the first group of mounting detection contacts is second-outermost of all the contacts.

Optionally, the first contact portion is located at a front end of the mounting direction compared with the second contact portion; the front end is a downstream side of the mounting direction.

Optionally, the distance between each first contact portion, between each second contact portion, and between each first contact portion and each second contact portion is greater than or equal to a preset distance threshold.

According to a second aspect of embodiments of the present invention, there is provided an ink cartridge including any one of the above-described chips. After adopting above-mentioned technical scheme, beneficial effect is: in the mounting direction, one or more rows formed by the second contact parts are arranged among the rows formed by the first contact parts; be provided with the multirow that first contact site formed between the multirow that the second contact site formed, promptly, first contact site is not arranged in same row with the second contact site, and this structure is favorable to reducing the electromagnetic interference of non-contact that leads to because the voltage difference between first contact site and the second contact site and the burr wave appears, prevents that the terminal from the condition of wrong data signal, guarantees that the chip normally works.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.

FIG. 1 is a schematic view of an ink cartridge to be mounted on a mounting portion;

FIG. 2 is a schematic diagram of a prior art chip;

FIG. 3 is a chip diagram according to the first embodiment;

FIG. 4 is a schematic view of a contact on a chip according to a second embodiment;

FIG. 5 is a diagram of a first chip according to a second embodiment;

FIG. 6 is a diagram of a first chip according to a second embodiment;

FIG. 7a and FIG. 7b are chip structures of the first embodiment of the second embodiment;

FIG. 8 is a chip configuration diagram of a second embodiment of a second example;

FIG. 9 is a schematic view of a contact on a chip according to a third embodiment;

FIG. 10 is a chip configuration diagram of the first embodiment of the third embodiment;

FIG. 11 is a chip configuration diagram of the second embodiment of the third embodiment;

FIG. 12 is a chip configuration diagram of a third embodiment of a third example;

FIGS. 13a and 13b are chip configuration diagrams of a fourth embodiment of the third embodiment;

fig. 14a and 14b are chip structure diagrams of a fifth embodiment of the third embodiment;

FIG. 15 is a diagram showing a chip according to a fourth embodiment;

FIG. 16 is a chip configuration diagram of the first embodiment of the fourth embodiment;

fig. 17 is a chip configuration diagram of the second embodiment of the fourth example.

Detailed Description

For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.

It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

fig. 1 is a schematic view of an ink cartridge 10 to be mounted on a mounting portion 90. As shown in fig. 1, the mounting portion 90 is a component of a printer for carrying a plurality of or one ink cartridge 10, and the ink cartridge 10 is detachably mounted in the mounting portion 90 in the mounting direction P. The ink cartridge 10 has a chip 20 mounted thereon. The ink cartridge 10 includes a chip 20, a handle 30, an ink outlet 40, and a cartridge body 50. The mounting portion 90 includes a stylus portion 91 and an ink supply portion 92. The cartridge 50 stores ink, the ink reaches the ink supply portion 92 through the ink outlet 40, and the ink supply portion 92 can supply the ink to the print head, so that the ink can be used for printing. The chip 20 has a terminal set 200 thereon, and the terminal set 200 can be electrically connected to the contact pins 91a of the contact pin part 91 for mutual transmission of electrical signals. The handle 30 is used to fix the ink cartridge 10 to the mounting portion 90, preventing the ink cartridge 10 from coming out of the mounting portion 90.

Fig. 3 is a chip diagram according to the first embodiment. As shown in fig. 1 and 3, the chip 20 includes a substrate 20a, a terminal group 200 provided on the substrate 20a, and a memory (not shown). Optionally, the chip may include a terminal group 200, which includes 9 terminals 201 to 209,9 divided into

first terminals

201, 204, 205, 209,

second terminals

202, 203, 206 to 208; the first terminal is a terminal for performing mounting detection when the ink cartridge 10 is mounted to the mounting portion 90, the second terminal is a terminal other than the first terminal, and at least a part of the second terminal is for connection to a memory of the chip 20. Each of the 9 terminals 201 to 209 includes a contact portion 201a to 209a to be brought into contact with the contact pin 91 a.

First contact portions

201a, 204a, 205a, 209a are provided on the

first terminals

201, 204, 205, 209, and second contact portions (contact portion marks are not shown in the figure) are provided on the

second terminals

202, 203, 206-208. The first contact portions are arranged in a plurality of rows in the mounting direction P, that is, the

first contact portions

201a, 204a, 205a, 209a form rows L11, L12. The second contact portions on the

second terminals

202, 203, 206-208 are arranged in a row in the mounting direction P, forming a row L21; the second contact portions of the

second terminals

202, 203, 206-208 may be arranged in a plurality of rows, and fig. 3 illustrates a case where only the second contact portions are arranged in one row L21. The row L21 is spaced from the rows L11 and L12 in the mounting direction P, that is, the row L21 is different from the rows L11 and L12 in the mounting direction P, and the row L21 is located between the rows L11 and L12, wherein in the mounting direction P, the second contact portion L21 may be located between the row L11 and the row L12 formed by the first contact portion as shown in fig. 3, or the row L11 and the row L12 of the first contact portion may be located between the row L21 and the row L22 formed by the second contact portion as shown in fig. 15. In either of the arrangement configurations of fig. 3 or 15, one or more rows formed by the second contact portions being disposed between the rows formed by the first contact portions in the mounting direction P are adopted; or, be provided with the structure of the multirow that first contact site formed between the multirow that the second contact site formed, all be favorable to reducing the electromagnetic interference of non-contact that leads to because the voltage difference between first contact site and the second contact site and appear the burr wave, prevent that the terminal from the condition of wrong data signal, guarantee chip normal work.

Alternatively, the

first contact portions

201a, 204a, 205a, 209a may include: a first set of interconnected mounting sensing contacts 200a (201 a, 204 a), a second set of interconnected mounting sensing contacts 200b (205 a, 209 a); the first set of mounting detection contacts 200a (201 a, 204 a) and the second set of mounting detection contacts 200b (205 a, 209 a) are arranged in a plurality of rows in the mounting direction P; specifically, as shown in fig. 3, the first set of mounting detection contacts 200a (201 a, 204 a) form a first row L11 in the mounting direction; the second group of mounting detection contacts 200b (205 a, 209 a) form a second row L12 in the mounting direction P; one row (L21) or a plurality of rows of second contact portions (contact portions shown on the

second terminals

202, 203, 206-208) is provided between the first row L11 and the second row L12. In the above configuration, the first set of mounting

detection contacts

201a and 204a forms the row L11, and the second set of mounting

detection contacts

205a and 209a forms the row L12, so that the plurality of first contacts are arranged in parallel, and the terminal set 200 can have a larger design space, thereby performing better layout on the substrate 20a.

Alternatively, the first set of mounting detection contacts 200a (201 a, 204 a) are connected by wires and the second set of mounting detection contacts 200b (205 a, 209 a) are connected by resistors; the second set of mounting detection contacts 200b (205 a, 209 a) are applied with a higher voltage than the first set of mounting detection contacts 200a (201 a, 204 a). Different operating voltage is switched in to the contact portions grouped differently, the installation detection contact portions grouped differently are not arranged in the same row, and the mode layout of interval arrangement is adopted, so that the non-contact electromagnetic interference caused by the voltage difference between the installation detection contact portions in different groups is further reduced, the burr wave is generated, the condition that the terminal generates a wrong data signal is prevented, and the normal work of the chip is ensured. By way of example in fig. 3, the

first terminals

201, 204, 205, 209 are divided into 2 groups at the time of mounting detection, and the first mounting detection terminal 201 and the second mounting detection terminal 204 are a first group of mounting detection terminals; the

first contact portions

201a and 204a thereon are connected to each other to form a first set of mounting detection contact portions 200a; the third mounting detection terminal 205 and the fourth mounting detection terminal 209 are a second group of mounting detection terminals; the

first contact portions

205a and 209a thereon are connected to each other to form a second set of mounting detection contact portions 200b. The first set of mounting

detection terminals

201, 204 receives a voltage of 2.4V from the printer, and the second set of mounting

detection terminals

205, 209 receives a voltage of 42V from the printer. The terminal of the

second terminals

202, 203, 206-208 connected to the memory is supplied with 3.3V by the printer to maintain the signal transmission between the chip 20 and the printer. The first contact portion and the second contact portion form a row L11, a row L12, and a row L21. The rows L11, L12, and L21 are spaced apart in the mounting direction P, i.e., not in the same row, and are independent. This structure is favorable to reducing the first group installation of different access voltages and detecting contact 200a, the installation of second group and detecting the non-contact electromagnetic interference that the voltage difference between contact 200b, the second contact leads to and appear the burr wave, still is favorable to preventing that the terminal from the condition of wrong data signal, guarantees that the chip normally works.

Optionally, the second contact (e.g., the contacts shown on the

second terminals

202, 203, 206-208) includes a ground contact (contact on terminal 207) that is not connected to a memory device (not shown); also included are power contacts (contacts on terminal 206), data contacts (contacts on terminal 208), and reset contacts (contacts on terminal 202) that are connected to the memory.

Specifically, the functions and functions of the respective terminals in the terminal group 200 are as follows:

the terminal 201: a first group of mounting detection terminals;

terminal 202: a reset terminal;

the terminal 203: a clock terminal;

a terminal 204: a first group of mounting detection terminals;

terminal 205: a second group of mounting detection terminals;

the terminal 206: a power supply terminal;

the terminal 207: a ground terminal;

the terminal 208: a data terminal;

terminal 209: the second group mounts the detection terminal.

Of the

second terminals

202, 203, 206-208, the

terminals

202, 203, 207, 208 are connected to a memory for electrical signal transmission with the printer, operating at a voltage of 3.3V. The terminal 207 is a ground terminal and has a voltage of 0V. The terminal 207 is not connected to the memory. It will be understood by those skilled in the art that the terminal set 200 may not have the terminal 207.

Optionally, the larger the voltage difference between the terminals is, the easier the terminals are to influence each other, the signal interference is easy to occur, the terminals are easy to generate error signals, and the terminals cannot work normally. Therefore, the voltage difference between the second group mounting detection terminals 205 and 209 (to which the voltage of 42V is input) and the second terminal (to which 3.3V is input) is large, and the row L12 can be disposed on the front end side in the mounting direction P, that is, the outermost side of the terminal group 200. And the first group of mounting detection terminals 201, 204 (to which 2.4V is input) whose pressure difference with the second terminal is small are arranged in the row L11. When viewed in the mounting direction P, the input voltage of the row L11 is 2.4V, the input voltage of the row L21 is 3.3V, and the input voltage of the row L12 is 42V, and the voltages are arranged from low to high. That is to say, the rows of the first contact portions and/or the second contact portions are arranged according to the voltage levels connected to the first contact portions and/or the second contact portions, so that the voltage difference between every two rows is as small as possible, the occurrence of glitches caused by non-contact electromagnetic interference due to the voltage difference is reduced, the situation that wrong data signals occur on terminals is prevented, and the normal operation of the chip is ensured.

Further, the arrangement layout of the

first contact portions

201a, 204a, 205a, 209a in fig. 3 forms a quadrangle, and the second terminal or the second contact portion on the second terminal is disposed in the quadrangle surrounded by the

first contact portions

201a, 204a, 205a, 209a, thereby ensuring good contact between the second terminal and the contact pin. Since the outermost periphery of the terminal group 200 is the first contact portion for mounting detection, if the chip 20 and the printer contact pins 91a complete mounting detection during the mounting of the ink cartridge 10, it is said that all the mounting detection terminals (first terminals) are connected in place, and all the positions within the polygon formed by the first contact portions are such that good contact can be ensured. Furthermore, the number of the first contact portions may be any number greater than 3, and the beneficial effect can be achieved as long as the second contact portions are matched in the polygon formed by the first contact portions.

Alternatively, as shown in fig. 3, the row L12 formed by the

first contact portions

205a and 209a of the

first terminals

205 and 209 is located at the front end of the mounting direction P with respect to the row L21 in which the second contact portions are located, the front end being the downstream side in the mounting direction P. This structure makes it possible that, during the mounting of the ink cartridge 10 to the mounting portion 90, the terminals of the row L12 first come into contact with the contact pins 91a to perform mounting inspection, and then the second terminals of the row L21 come into contact with the contact pins 91a, so that, during the mounting, the contact pins 91a first come into contact with the terminals to perform mounting inspection and then come into contact with the terminals connected to the memory, preventing the chip 20 from being mounted out of position or the terminals connected to the memory from being erroneously connected. Further, in the perpendicular direction T to the mounting direction P, the second group of mounting detection contacts 200b is outermost of all the contacts, and the first group of mounting detection contacts 200a is second-outermost of all the contacts. As shown in fig. 3, the

first contact portions

205a and 209a of the second mounting detection contact 200b are outermost in the vertical direction T, the

first contact portions

201a and 204a of the first mounting detection contact 200a are next to the innermost, and the

second terminals

202, 203, 206-208 where the remaining second contact portions are located. With such a layout, the layout that the high-voltage input terminals (the

terminals

205 and 209 are inputted with 42V voltage) are arranged on the outermost side, the second outer side is provided with the terminal with the second highest voltage (the

terminals

201 and 204 are inputted with 2.4V voltage), and the innermost side is provided with the terminal with the lower input voltage (the second terminal is inputted with 3.3V voltage), so that the voltage difference between the adjacent terminals is as small as possible, thereby reducing the occurrence of glitch due to non-contact electromagnetic interference caused by the voltage difference, and being beneficial to preventing the terminals from generating error data signals and ensuring the normal operation of the chip.

Example two:

fig. 4 is a schematic diagram of a contact on a chip according to a second embodiment. Fig. 5 is a schematic diagram of a first chip according to a second embodiment. Fig. 6 is a schematic diagram of a first chip according to a second embodiment. Fig. 4 omits the terminals on the chip and only shows a schematic view of the contact portions. Fig. 5 and 6 are schematic diagrams of two chips, respectively. Fig. 7a and 7b are chip configuration diagrams of the first embodiment of the second embodiment. Fig. 8 is a chip configuration diagram of the second embodiment of the second example. As shown in fig. 4 to 6, the

first contact portions

201a, 204a, 205a, 209a of the

first terminals

201, 204, 205, 209 form rows L11, L12. The

second contact portions

202a, 203a, 206a-208a of the

second terminals

202, 203, 206-208 form rows L21, L22 in the mounting direction P. One or more rows (L21 and L22) formed by the second contact parts are arranged among the rows (L11 and L12) formed by the first contact parts; alternatively, the rows (L11 and L12) of the first contact portions may be disposed between the rows (L21 and L22) of the second contact portions, and the advantageous effects of the present application may still be achieved.

Further, the rows (rows L11, L12) of the first contact portions and the rows (rows L21, L22) of the second contact portions are spaced apart from each other. I.e. in the mounting direction P, the first contact portions form a first row L11, a second row L12; the second contact portions form a third row L21 and a fourth row L22; the first and second rows L11 and L12 are spaced from the third and fourth rows L21 and L22 one by one. So that the first contact portion and the second contact portion form a row L21, a row L11, a row L22, and a row L12 in this order. The structure enables the first terminal and the second terminal, or the first contact part and the second contact part to be mutually spaced one by one, so that the design space of the terminals is larger, the increase of the space between the terminals is facilitated, and the electromagnetic mutual interference between the terminals is reduced.

Alternatively, as shown in fig. 4, the second row (row L12) (the row L12 formed by the

first contact portions

205a, 209 a) is closer to the front end side of the mounting direction P than the third row L21 and the fourth row L22, that is, the row L12 is located at the foremost side of the mounting direction P, and during the mounting of the ink cartridge 10 to the mounting portion 90, the terminals of the row L12 first contact the contact pins 91a to perform mounting detection, and then the second terminals of the row L22 contact the contact pins 91a, so that the mounting detection first and the terminal contact 91a connected to the memory during the mounting process can be performed, thereby preventing the mounting of the chip 20 from being misaligned or the terminal connection error connected to the memory.

Fig. 5 and 6 show two specific arrangements of terminal arrangements. As long as it is ensured that the contact portions are distributed in the manner of fig. 4. Further, the arrangement of the terminals of the chip 20 is not limited to the arrangement of fig. 5 or fig. 6, and the arrangement may be various. Different arrangements of the terminals based on fig. 4 belong to the protection scope of the present application.

In the first embodiment, it is described that the terminal 202 may be a reset terminal, and the terminal 203 may be a clock terminal; terminal 206 may be a power terminal, terminal 207 may be a ground terminal, and terminal 208 may be a data terminal; the terminals 206-208 of the second terminals of the terminal set 200 are more important than the

terminals

202, 203. Alternatively, as shown in fig. 5, the layout of the

first contact portions

201a, 204a, 205a, 209a forms a virtual quadrangle, a part of the terminals 206 to 208 of the second terminals are arranged within the quadrangle, and the important terminals (in this embodiment, the terminals 206 to 208) of the second terminals are arranged within the quadrangle enclosed by the first terminals, so that good contact of the terminals can be ensured (or the important communication terminals which are more susceptible to signals are arranged in an area away from the four first terminals). When the chip 20 and the printer contact 91a complete the mounting test during the mounting process of the ink cartridge 10, it means that all the mounting tests (first terminals) are connected in place, and all the positions in the polygon formed by the first contact portions can ensure that the contact is good. Therefore, good contact of the more important ones of the second terminals (terminals 206 to 208 in the present embodiment) can be ensured. Further, the number of the first contact portions may be more than 3, and the beneficial effect can be achieved as long as the second contact portions are matched in the polygon formed by the first contact portions.

Further, the ink cartridge 10 mounted to the mounting portion 90 may have a certain movement range in the width direction T, and the following may occur: the chip 20 has been mounted, but the first terminals (mounting detection terminals) are not in contact with the contact pins 91 a. The chip described in this embodiment can solve this situation, and the row formed by the first terminals and the row formed by the second terminals are not in the same row, so that the width of each terminal can be increased, and this situation can be avoided by increasing the width.

Further, the first terminal is far away from the second terminal, so that the first terminal and the second terminal can be prevented from being covered by foreign matters (such as ink and the like) accidentally dropped to cause short circuit between the first terminal and the second terminal, and damage to the chip or the printer is prevented. That is, the distance between each first contact portion, between each second contact portion, between each first contact portion and each second contact portion is equal to or greater than a preset distance threshold. The distance threshold may be preset to a plurality of different values by those skilled in the art according to the magnitude of the voltage value applied to each terminal, so as to achieve the above technical effects and further reduce mutual signal interference between the terminals.

The rest is the same as the first embodiment.

The following are two embodiments of the present example.

The first embodiment:

fig. 7a and 7b are chip configuration diagrams of the first embodiment of the second embodiment. As shown in fig. 7a and 7b, the chip 20 has a first portion 21 and a second portion 22.

Second terminals

202, 203, 206-208 are provided on the first portion 21; the

first terminals

201, 204, 205, 209 are arranged on the second portion 22.

The first portion 21 and the second portion 22 are manufactured by two

circuit substrates

21a and 22a, and then the first portion 21 and the second portion 22 are fixed together by welding, adhering, clamping, and the like, and finally the chip 20 is formed.

The chip 20 is manufactured using two

circuit substrates

21a, 22a, so that the terminals on the first portion 21 and the terminals on the second portion 22 are located at different heights, so that the contact pins 91a are contacted at different positions when contacting the contact pins 91a, respectively, to achieve the layout of the first contact portion and the second contact portion as shown in fig. 4.

The chip 20 also has:

additional terminals

210, 211, fixing

portions

251, 252, 253. The

additional terminals

210 and 211 do not contact the contact pins 91a in the mounting part 90, and may function to prevent short-circuiting between the terminals of the terminal set 200 or scraping the contact pins 91a when contacting the contact pins 91a, thereby cleaning the contact pins 91 a. The chip 20 can be fixed to the ink cartridge 10 by the fixing

portions

251, 252, and 253, and the chip 20 is prevented from being detached from the ink cartridge 10.

Second embodiment:

fig. 8 is a chip configuration diagram of the second embodiment of the second example. As shown in fig. 8, the chip 20 has only one substrate 20a. The chip 20 also has:

additional terminals

210 and 211, fixing

parts

251 and 252, and a through part 255; the through portion 255 penetrates the chip in the thickness direction of the chip. The

additional terminals

210 and 211 and the fixing

portions

251 and 252 are the same as those of the first embodiment of the present embodiment, and will not be described again. The through part 255 is used to accommodate the contact pins 91a such that the first and second terminals contact different positions of the contact pins 91a, respectively, to achieve the layout of the first and second contact parts as shown in fig. 4. The thickness direction is a direction perpendicular to both the mounting direction P and the width direction T. In the present embodiment, the thickness direction of the chip is also a direction parallel to the shortest side direction of the chip. The thickness direction of the chip is perpendicular to the surface of the terminal.

Example three:

fig. 9 is a schematic diagram of a contact on a chip according to a third embodiment. Fig. 10 is a chip configuration diagram of the first embodiment of the third embodiment. Fig. 11 is a chip configuration diagram of the second embodiment of the third embodiment. Fig. 12 is a chip configuration diagram of a third embodiment of the third example. Fig. 13a and 13b are chip configuration diagrams of a fourth embodiment of the third embodiment. Fig. 14a and 14b are chip configuration diagrams of a fifth embodiment of the third embodiment. Fig. 9 shows only schematic views of the contact portions, with terminals on the chip omitted. Fig. 10 to 14b are structural diagrams of 5 kinds of chips, respectively. As shown in fig. 9, the

first contact portions

201a, 204a, 205a, 209a of the

first terminals

201, 204, 205, 209 form rows L11, L12. The

second contact portions

202a, 203a, 206a-208a of the

second terminals

Further, the rows L11 and L12 are spaced from the rows L21 and L22. I.e. in the mounting direction P, the first contact portions form a first row L11, a second row L12; the second contact portions form a third row L21 and a fourth row L22; the first and second rows L11 and L12 are spaced from the third and fourth rows L21 and L22 one by one. So that the first contact portion and the second contact portion form a row L11, a row L21, a row L12, and a row L22 in this order along the mounting direction P. The structure enables the first terminal and the second terminal, or the first contact part and the second contact part to be mutually spaced one by one, and the design space of the terminal is larger.

Alternatively, as shown in fig. 9, the fourth row L22 is closer to the front end side in the mounting direction than the first and second rows L11 and L12, that is, the row L22 is located on the foremost end side in the mounting direction P.

The functions of the terminals of the terminal group 200 are not limited to the functions of the terminals described in the third embodiment, and the

terminals

202 and 203 of the second terminals are more important than the terminals 206 to 208. As shown in fig. 9, the layout of the

first contact portions

201a, 204a, 205a, 209a forms a virtual quadrangle, and some

terminals

202, 203 of the second terminals are disposed within the range of the quadrangle, and the important terminals (in the present embodiment, the terminals 202, 203) of the second terminals are disposed within the quadrangle surrounded by the first terminals, thereby ensuring good contact (or, an important communication terminal that is more susceptible to signals is disposed in an area away from the four first terminals). During the mounting of the ink cartridge 10, the chip 20 and the printer contact 91a complete the mounting detection, which means that all the mounting detections (first terminals) are connected in place, all the positions within the polygon formed by the

first contact portions

201a, 204a, 205a, 209a are such that good contact is ensured. Therefore, good contact of the important terminals (the

terminals

202 and 203 in the present embodiment) of the second terminals can be ensured.

The rest is the same as the example.

The following are four embodiments of the present example.

The first embodiment:

fig. 10 is a chip configuration diagram of the first embodiment of the third embodiment. As shown in fig. 10, the chip 20 has a first portion 21 and a second portion 22. The

first terminals

201, 204, 205, 209 are arranged on the first portion 21;

second terminals

202, 203, 206-208 are disposed on second portion 22.

The first part 21 and the second part 22 are manufactured by 2

different circuit substrates

21a, 22a, and then the first part 21 and the second part 22 are fixed together by welding, pasting, clamping and the like, and finally the chip 20 is formed.

The chip 20 is manufactured using two

circuit substrates

21a, 22a, so that the terminals on the first portion 21 and the terminals on the second portion 22 are located at different heights, so that different positions of the contact pins 91a are contacted when contacting the contact pins 91a, respectively, to achieve the layout of the first contact portion and the second contact portion as shown in fig. 9.

The chip 20 also has: fixing

portions

251, 252, 253. The chip 20 can be fixed to the ink cartridge 10 by the fixing

portions

The chip 20 may further have additional terminals (not shown in the drawings, and refer to the arrangement of the

additional terminals

210 and 211 in fig. 8) which do not contact the contact pins 91a in the mounting portion 90, and the function of the additional terminals may be to prevent short-circuiting between the terminals of the terminal group 200 or to scrape the contact pins 91a when contacting the contact pins 91a, thereby cleaning the contact pins 91 a.

Second embodiment:

fig. 11 is a chip configuration diagram of the second embodiment of the third embodiment. As shown in fig. 11, the chip 20 has only one substrate 20a. The chip 20 also has:

additional terminals

210 and 211, fixing

portions

251 and 252, and a through portion 255. The

additional terminals

210 and 211, and the fixing

portions

251 and 252 are the same as those of the first embodiment of the present embodiment, and will not be described again. The through part 255 is used to accommodate the contact pin 91a such that the first terminal and the second terminal contact different positions of the contact pin 91a, respectively, to achieve the layout of the first contact part and the second contact part as shown in fig. 9.

The through-chip 20 of this embodiment has the through-portions 255 located on both sides of the

second terminals

202, 203, 206 to 208 in the width direction T, respectively, and this structure spatially separates the

first terminals

201, 204, 205, 209 from the

second terminals

202, 203, 206 to 208 by the through-chip 20 having the through-portions 255, and further prevents the first and second terminals from being covered with foreign matter (such as ink, etc.) accidentally dropped, causing a short circuit therebetween, resulting in damage to the chip or the printer. For example, when ink drops between the first terminal and the second terminal, the through portion 255 penetrating the chip 20 allows the ink to flow from the through portion 255 to the lower side of the chip 20 without remaining on the upper surface (surface on which the terminal is provided) of the chip 20.

The third embodiment:

fig. 12 is a chip configuration diagram of a third embodiment of the third example. As shown in fig. 12, the

first terminals

201, 204, 205, 209 are protruded with respect to the substrate 20a. The

first terminals

201, 204, 205, 209 may be connected to the substrate 20a by soldering or the like. That is, the first contact portions (not shown in fig. 12) located on the

first terminals

201, 204, 205, 209 protrude more with respect to the substrate 20a than the second contact portions (not shown in fig. 12) located on the

second terminals

202, 203, 206-208.

Further, the

first terminals

201, 204, 205, 209 protrude with respect to the substrate 20a, and the

second terminals

202, 203, 206-208 are provided on the substrate 20 a; the

first terminals

201, 204, 205, 209 and the

second terminals

202, 203, 206-208 have a height difference in height such that the first terminals and the second terminals respectively contact different positions of the contact pins 91a to achieve the layout of the first contact portions and the second contact portions as shown in fig. 9.

The

first terminals

201, 204, 205, 209 protrude with respect to the substrate 20a, and this structure spatially separates the

first terminals

201, 204, 205, 209 from the

second terminals

202, 203, 206-208, further preventing the first terminals and the second terminals from being covered with foreign substances (such as ink, etc.) accidentally dropped, causing a short circuit therebetween, resulting in damage to the chip or the printer.

Fourth embodiment:

fig. 13a and 13b are chip configuration diagrams of a fourth embodiment of the third embodiment. As shown in fig. 13a, 13b, the

first terminals

201, 204, 205, 209 are provided on the second portion 22, and the

second terminals

202, 203, 206-208 are provided on the substrate 21a of the first portion 21; the first portion 21 is provided with

terminal holes

201b, 204b, 205b, 209b through which terminals (

first terminals

201, 204, 205, 209) provided with contact portions on the second portion 22 pass and protrude with respect to the first portion 21. That is, the

first terminals

201, 204, 205, 209 of the second portion 22 pass through the

terminal holes

201b, 204b, 205b, 209b and protrude with respect to the first portion 21. The

first terminals

201, 204, 205, 209 and the

second terminals

202, 203, 206-208 have a height difference in height such that the first terminals and the second terminals respectively contact different positions of the contact pins 91a to achieve the layout of the first contact portions and the second contact portions as shown in fig. 9. The second portion 22 may be made of a conductive silicone or a conductive metal material, or the substrate 22a of the second portion 22 is made of a non-conductive substrate material and the

first terminals

201, 204, 205, 209 are made of a conductive material.

The rest is the same as the third embodiment of this example.

Fifth embodiment:

fig. 14a and 14b are chip configuration diagrams of a fifth embodiment of the third embodiment. As shown in fig. 14a and 14b, the chip 20 is composed of a first portion 21 and a second portion 22. The second part 22 is a chip carrier for carrying a chip and which can be secured to the cartridge body. A first set of mounting

detection terminals

201, 204 of the first terminals are provided on the second portion 22. A

first set

205, 209 of the first terminals are provided on the substrate 21a of the first portion 21, and

second terminals

202, 203, 206-208 (not shown in the figure) are provided on the substrate 21a of the first portion 21. The first portion 21 is provided with

terminal holes

201b, 204b, and the

first terminals

201, 204 of the second portion 22 pass through the

terminal holes

201b, 204b and protrude with respect to the substrate 21a of the first portion 21. The

first terminals

205, 209 protrude with respect to the substrate 21a of the first portion 21, and the

first terminals

205, 209 may be formed of pads or bumps provided on the substrate 21a and then plated with copper. The

first terminals

201, 204, 205, 209 and the

second terminals

202, 203, 206-208 have a height difference in height such that the first terminals and the second terminals respectively contact different positions of the contact pins 91a to achieve the layout of the first contact portions and the second contact portions as shown in fig. 9. The second part 22, while being provided with the

first terminals

201, 204, also functions as a chip carrier (carrying the chip and being fixed to the body of the cartridge). The structure reduces the number of parts of the ink box, thereby achieving the effect of reducing the cost. The second portion 22 may be made of a conductive silicone or a conductive metal material, or the substrate 22a of the second portion 22 is made of a non-conductive substrate material and the

first terminals

201, 204, 205, 209 are made of a conductive material. The second portion 22 may be made of conductive silicone, so that when the chip 20 contacts the contact pins 91a, the second portion 22 may deform to some extent, thereby avoiding the situation that the terminals are worn or scratched due to hard contact between the terminals on the chip 20 and the contact pins 91 a.

The rest corresponds to the third embodiment of the present embodiment.

Example four:

FIG. 15 is a diagram illustrating a chip according to a fourth embodiment. Fig. 16 is a chip configuration diagram of the first embodiment of the fourth embodiment. Fig. 17 is a chip configuration diagram of the second embodiment of the fourth example. Fig. 16 and 17 are structural diagrams of two types of chips, respectively. As shown in fig. 15, the

first contact portions

201a, 204a, 205a, 209a (not shown) of the

first terminals

201, 204, 205, 209 form a first row (row L11) and a second row (row L12). The

second contact portions

202a, 203a, 206a-208a (not shown) of the

second terminals

202, 203, 206-208 form a third row (row L21), a fourth row (row L22) in the mounting direction P. One or more rows (L21 and L22) formed by the second contact parts are arranged among the rows (L11 and L12) formed by the first contact parts; alternatively, the rows (L11 and L12) of the first contact portions may be disposed between the rows (L21 and L22) of the second contact portions, and the advantageous effects of the present application may still be achieved.

Further, the first contact portions form a first row (row L11), a second row (row L12); the second contact portions form a third row (row L21), a fourth row (row L22); the first row (row L11) and the second row (row L12) are provided between the third row (row L21) and the fourth row (row L22). That is, the first contact portion and the second contact portion form a row L21, a row L11, a row L12, and a row L22 in this order along the mounting direction P. This structure allows the third row (row L21) and the fourth row (row L22) of the second contacts to be located on the outer peripheral sides of the first row (row L11) and the second row (row L12) of the first contacts, the

second contacts

202a, 203a, 206a-208a are completely located on the outer periphery of the

first contacts

201a, 204a, 205a, 209a, and the

second contacts

202a, 203a, 206a-208a are located outside the polygonal (in this embodiment, quadrangular) area formed by the plurality of

first contacts

201a, 204a, 205a, 209a, thereby further preventing the interference of the electrical signals between the first terminals and the second terminals.

The rest is the same as that of the embodiment.

The following are two embodiments of the present example.

The first embodiment:

fig. 16 is a chip configuration diagram of the first embodiment of the fifth embodiment. As shown in fig. 16, the chip 20 has a first portion 21 and a second portion 22.

Terminals

202, 203 and

terminals

205, 209 are provided on the first portion 21;

terminals

201, 204, 206-208 are disposed on second portion 22.

The first part 21 and the second part 22 are manufactured by 2 different circuit substrates 21a and 22b, and then the first part 21 and the second part 22 are fixed together by welding, pasting, clamping and the like, and finally the chip 20 is formed.

The chip 20 is manufactured using 2 circuit substrates 21a, 22b, and it is possible to make the terminals on the first portion 21 and the terminals on the second portion 22 at different heights so as to contact different positions of the contact pins 91a, respectively, when making contact with the contact pins 91a, to achieve the layout as shown in fig. 15.

The chip 20 also has

additional terminals

210, 211, and the

additional terminals

210, 211 do not contact the contact pins 91a in the mounting portion 90, and may function to prevent short-circuiting between the terminals of the terminal group 200 or scraping the contact pins 91a when contacting the contact pins 91a, thereby cleaning the contact pins 91 a.

Second embodiment:

fig. 17 is a chip configuration diagram of the second embodiment of the fifth example. As shown in fig. 17,

terminals

202, 203, 205, 209 are provided on the second portion 22, and

terminals

201, 204, 206-208 are provided on the substrate 21a of the first portion 21; the first portion 21 is provided with

terminal holes

202b, 203b, 205b, 209b, the

terminals

202, 203, 205, 209 of the second portion 22 pass through the

terminal holes

202b, 203b, 205b, 209b and protrude relative to the first portion 21, and the

terminals

202, 203, 205, 209 and the

terminals

201, 204, 206-208 have height differences in height, so that the terminals respectively contact different positions of the contact pins 91a to realize the layout of the first contact part and the second contact part as shown in fig. 15. The second portion 22 may be made of a conductive silicone or a conductive metal material, or the substrate 22a of the second portion 22 is made of a non-conductive substrate material and the

first terminals

201, 204, 205, 209 are made of a conductive material.

The rest is the same as the first embodiment of this example.

The invention also provides an ink box which comprises any chip described in the embodiment.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip for mounting to an ink cartridge for mounting in a mounting direction in a printer, the chip comprising a memory, a first terminal for mounting detection, a second terminal, at least one of the second terminals being electrically connected to the memory, the first terminal and the second terminal being in contact with a contact pin in the printer respectively and forming a first contact portion and a second contact portion, characterized in that the chip further comprises a through portion for accommodating the contact pin, the through portion penetrating the chip in a thickness direction of the chip, at least a part of the first terminal or at least a part of the second terminal being provided on a wall surface of the through portion and extending upward to an upper surface of the chip.

2. The chip of claim 1, wherein the first contacts and the second contacts are arranged in a plurality of rows in the mounting direction.

3. The chip according to claim 1, wherein the through portion is a U-shaped structure with an opening at one side, the opening of the through portion faces forward in the mounting direction, the first terminal or the second terminal is provided on a side wall of a bottom portion of the U-shaped structure of the through portion or on a side surface of an outer end portion, and the first terminal or the second terminal on the wall surface of the bottom portion of the U-shaped structure of the through portion or on the side surface of the outer end portion extends upward to an upper surface of the chip.

4. The chip of claim 1, further comprising a plurality of securing portions for securing the chip to an ink cartridge, the securing portions being indentations disposed at edges of the chip.

5. The chip of claim 1, wherein the first contacts are arranged in a plurality of rows in the mounting direction;

6. The chip according to any one of claims 1 to 5, wherein the number of the through portions is 2, and 2 through portions are provided on both sides of the chip in the mounting direction.

7. The chip according to any one of claims 1 to 5, wherein the through portions include a first through portion, a second through portion, and a third through portion each having a U-shaped configuration;

openings of the first through part, the second through part and the third through part face the front side of the mounting direction, and the second through part and the third through part are positioned at the bottom of the first through part;

the first contact portion or the second contact portion is provided at the bottom of the first through-hole and/or at the bottom of the second through-hole and the third through-hole.

8. The chip of any one of claims 1-5, wherein the first terminal and the second terminal contact different locations of the contact pins, respectively.

9. The chip according to claim 8, wherein the first terminals are disposed on the wall surface of the through portion and extend upward to the upper surface of the chip, and the second terminals are disposed on the upper surface of the chip, or the second terminals are disposed on the wall surface of the through portion and extend upward to the upper surface of the chip, and the first terminals are disposed on the upper surface of the chip.

10. An ink cartridge comprising a chip according to any one of claims 1 to 9.