CN114089614A - A kind of container - Google Patents
A kind of container Download PDFInfo
- Publication number
- CN114089614A CN114089614A CN202111676385.XA CN202111676385A CN114089614A CN 114089614 A CN114089614 A CN 114089614A CN 202111676385 A CN202111676385 A CN 202111676385A CN 114089614 A CN114089614 A CN 114089614A
- Authority
- CN
- China
- Prior art keywords
- chip
- container
- contact
- image forming
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 23
- 238000007599 discharging Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0865—Arrangements for supplying new developer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0887—Arrangements for conveying and conditioning developer in the developing unit, e.g. agitating, removing impurities or humidity
Abstract
The present invention relates to a container for detachably mounting in an imaging apparatus provided with a plurality of contact terminals, the container comprising a housing forming a cavity in which an imaging material can be accommodated, and a chip mounting portion on the housing, the chip mounting portion comprising a plurality of supporting portions for supporting a chip, the plurality of supporting portions being different in distance from a reference plane; the reference plane is a plane passing through the geometric center of the cavity and parallel to at least one of the plurality of supports, and when the chip is mounted, on one hand, the electric contact portions of the chip farther from the reference plane are in contact with the contact terminals in the imaging device more closely, and on the other hand, the lateral movement of the plurality of contact terminals in the imaging device can be prevented, and the situation that the chip is mounted misplaced or inverted, which may occur, is eliminated.
Description
Technical Field
The present invention relates to the field of image forming, and more particularly, to a container detachably mounted in an image forming apparatus.
Background
In a general office or home environment, an imaging device is one of indispensable devices, and graphic information displayed in a visual electronic device can be imaged on a medium through the imaging device for people to read conveniently. Prior image forming apparatuses require a container containing image forming material to be installed therein before operation, and when the image forming apparatus is operated, the image forming material is transferred to a medium in a predetermined manner so that graphic information to be imaged is displayed.
In order for the image forming apparatus to know information on the type of the container mounted therein, the amount of the image forming material remaining in the container, and the like, the existing container is mounted with a chip that can establish communication connection with the image forming apparatus, the chip including a storage portion and an electrical contact portion connected to each other, information on the type, manufacturer, date of production, service life, and the like of the container being stored in the storage portion, the electrical contact portion being for contact with a contact terminal of a contact mechanism in the image forming apparatus, and thus, communication connection between the container and the image forming apparatus can be established.
Disclosure of Invention
In general, the electrical contact portion includes a plurality of terminals such as a short-circuit detection terminal, a ground terminal, a power supply terminal, a drive terminal, a reset terminal, a clock terminal, and a data terminal, and accordingly, the number of contact terminals in the image forming apparatus is not less than the number of terminals in the electrical contact portion, and when the number of terminals in the electrical contact portion and the number of contact terminals in the image forming apparatus are both plural, stable and accurate contact between the electrical contact portion and the contact terminals is an important issue.
The present invention provides a container which can accurately and stably maintain contact between a plurality of terminals in an electric contact part and a plurality of contact terminals in an image forming apparatus, and adopts the following technical scheme:
a container for detachably mounting in an imaging apparatus provided with a plurality of contact terminals, the container comprising a housing forming a cavity in which an imaging material can be accommodated, and a chip mounting portion on the housing, the chip mounting portion comprising a plurality of supporting portions for supporting a chip, the plurality of supporting portions being at different distances from a reference plane; the reference plane is a plane passing through a geometric center of the cavity and parallel to at least one of the plurality of support portions.
The chip supportable by the chip mounting part is provided with a plurality of electrical contacts contactable with the contact terminals, and a height difference is formed between the plurality of electrical contacts when the chip is mounted to the chip mounting part.
Wherein the plurality of supporting parts are all parallel to the reference surface; alternatively, one of the plurality of support portions may be inclined with respect to the reference surface.
In some embodiments, the chip comprises a plurality of portions formed separately, each portion having at least one electrical contact disposed therein; it is necessary to electrically connect the various parts of the chip.
In other embodiments, the chip includes a substrate on which the electrical contacts are disposed, the substrate being a flexible wiring board.
Preferably, the plurality of electrical contacts are arranged in more than two rows in a direction perpendicular to the extending direction along the extending direction of the electrical contacts.
In the embodiment of the invention, the container is an ink box, and the imaging material is ink; or the container is a toner cartridge, the imaging material is carbon powder, the toner cartridge further comprises a developing part rotatably mounted in the housing, and the developing part is used for conveying the carbon powder out; or, the container is a powder cylinder, the imaging material is carbon powder, the powder cylinder further comprises a powder discharging part arranged on the shell, and the powder discharging part is used for conveying the carbon powder out.
In the container of the present invention, when the chip is mounted, on the one hand, the electrical contact portions of the chip farther from the reference plane are brought into contact with the contact terminals in the image forming apparatus more closely, and on the other hand, lateral movement of the plurality of contact terminals in the image forming apparatus can be prevented, and the possibility that the chip is mounted misaligned or inverted can be eliminated.
Drawings
Fig. 1 is a perspective view of a contact mechanism in an image forming apparatus to which a container according to the present invention is applied.
Fig. 2 is a schematic diagram of a state in which a chip and a chip mounting portion in a container according to an embodiment of the present invention are disassembled.
Fig. 3 is a top view of a chip according to an embodiment of the invention.
FIG. 4 is a perspective view of a chip mounting portion in the container according to the first embodiment of the present invention.
FIG. 5 is a schematic view showing the position of a chip mounting portion in a container case according to an embodiment of the present invention.
Fig. 6 is a side view of a chip in contact with contact terminals according to an embodiment of the present invention.
Fig. 7 is a schematic diagram showing a state where the chip and the chip mounting portion in the container according to the second embodiment of the present invention are disassembled.
FIG. 8 is a perspective view of a chip mounting portion in a container according to a second embodiment of the present invention.
FIG. 9 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to a third embodiment of the present invention.
FIG. 10 is a schematic view showing the position of a chip mounting portion in a container case according to a third embodiment of the present invention.
FIG. 11 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to a fourth embodiment of the present invention.
FIG. 12 is a schematic view showing the position of a chip mounting portion in a container case in a container according to a fourth embodiment of the present invention.
Fig. 13 is a schematic view of the container according to the fifth embodiment of the present invention, in which the chip mounting portion and the chip are separated.
FIG. 14 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to a sixth embodiment of the present invention.
FIG. 15 is a schematic view showing the position of a chip mounting portion in a container case according to a sixth embodiment of the present invention.
Fig. 16 is a perspective view of a container according to a seventh embodiment of the present invention.
FIG. 17 is a schematic view showing a state where the chip mounting portion and the chip are disassembled in the container according to the seventh embodiment of the present invention.
FIG. 18 is a schematic view showing the position of a chip mounting portion in a container casing in a container according to a seventh embodiment of the present invention.
Fig. 19 is a perspective view of a container according to an eighth embodiment of the present invention.
FIG. 20 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to an eighth embodiment of the present invention.
Fig. 21 is a perspective view of a chip according to an eighth embodiment of the present invention.
FIG. 22 is a schematic view showing the position of a chip mounting portion in a container casing in a container according to an eighth embodiment of the present invention.
Fig. 23 is a perspective view of a container according to the ninth embodiment of the present invention.
FIG. 24 is a schematic view showing the position of a chip mounting portion in a container casing in a ninth embodiment of the present invention.
Detailed Description
Embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Fig. 1 is a perspective view of a contact mechanism in an image forming apparatus to which a container according to the present invention is applied.
To show the structure of the contact mechanism more clearly, the image forming apparatus is not shown in the drawings, and the contact mechanism shown in fig. 1 is only one of them; in general, the external appearance and the internal structure of different models of image forming apparatuses may be different, and the structure of the contact mechanism in the image forming apparatus and the number of contact terminals in the contact mechanism may also be different, however, when the container is mounted to the image forming apparatus, the contact terminals must be in contact with the electrical contact portions in the container, and thus, the technical solution of the present invention can be explained by using the contact mechanism shown in fig. 1.
As shown in the figure, the contact mechanism 9 includes a bracket 91 and a plurality of contact terminals mounted on the bracket 91, the plurality of contact terminals are movable along the thickness direction b of the bracket 91, in the shown contact mechanism 9, the plurality of contact terminals are distributed in two rows including a first contact terminal 92a1, a second contact terminal 92a2, a third contact terminal 92a3 and a fourth contact terminal 92a4 located in the first row 92a, and a fifth contact terminal 92b1, a sixth contact terminal 92b2, a seventh contact terminal 92b3, an eighth contact terminal 92b4 and a ninth contact terminal 92b4 located in the second row 92b, wherein the contact portions of the first contact terminal 92a1, the second contact terminal 92a2, the third contact terminal 92a3 and the fourth contact terminal 92a4 are connected to form the first row 92a, the first contact terminal 92a1 and the fourth contact terminal 92a4 are respectively located at two ends of the first row, the contact portions of the fifth contact terminal 92b1, the sixth contact terminal 92b2, the seventh contact terminal 92b3, the eighth contact terminal 92b4 and the ninth contact terminal 92b4 are connected to form a second row 92b, the fifth contact terminal 92b1 and the ninth contact terminal 92b4 are respectively located at both ends of the second row, and each contact terminal of the first row is located between two adjacent contact terminals of the second row, so that, in the angle shown in fig. 1, the contact terminals of the first row and the contact terminals of the second row are arranged offset in the up-down direction (one direction perpendicular to the b direction) and also in the left-right direction (the other direction perpendicular to the b direction).
Before the container is mounted, each contact terminal of the contact mechanism 9 protrudes to the outside of the holder 91, and when the container is mounted, each contact terminal comes into contact with a corresponding terminal in the container chip to move in the direction substantially along the b direction toward the holder 91, and when the container is taken out, each contact terminal moves in the direction substantially along the b direction away from the holder 91 to protrude therefrom to the outside of the holder 91.
[ example one ]
FIG. 2 is a schematic diagram illustrating a state in which a chip and a chip mounting portion are disassembled in a container according to an embodiment of the present invention; fig. 3 is a top view of a chip according to an embodiment of the invention.
The container 100 according to this embodiment is an ink cartridge, and accordingly, the image forming material is ink, and the image forming apparatus is an inkjet printer, as shown in the drawing, the ink cartridge 100 includes a housing 1, an ink discharging portion 3 (an embodiment of an image forming material supplying portion) combined with the housing 1, and a chip mounting portion 5, the ink cartridge 100 may be mounted in a mounting direction a, a cavity 2 accommodating ink is formed in the housing 1, ink is supplied to the outside through the ink discharging portion 3, a chip 6 is mounted in the chip mounting portion 5, and a handle 4 is combined with the housing 1, and when the ink cartridge 100 is mounted to the inkjet printer, the handle 4 abuts against an abutting portion in the inkjet printer, and the ink cartridge is prevented from being withdrawn in a direction opposite to the mounting direction a.
The chip 6 includes a plurality of portions formed separately, in practice, the chip 6 may include two portions formed separately, or three portions, or more than three portions, however, no matter how many portions the chip 6 is configured to include, the technical solution of the present invention is still applicable, and for convenience of description, the present embodiment is described by taking the example that the chip 6 includes the first portion 61 and the second portion 62 formed separately.
As shown, the first part 61 comprises a first substrate 611 and at least one electrical contact 612 arranged on the first substrate, in this embodiment, four electrical contacts are arranged in two rows on the first substrate 611, two electrical contacts 612a arranged in the first row and two electrical contacts 612b arranged in the second row, respectively, said first substrate 611 is further provided with a bonding portion 614 for bonding with the second part 62.
The second portion 62 comprises a second substrate 621 and at least one electrical contact 622 arranged on the second substrate, in this embodiment, five electrical contacts are arranged on the second substrate 621 in two rows, two electrical contacts 622a arranged in the first row and three electrical contacts 622b arranged in the second row; adapted to the first substrate 611, the second substrate 621 is further provided with a bonded portion which can be bonded with the bonding portion 614, and it is realized that the bonding portion 614 is a clearance groove provided on the first substrate 611, and the bonded portion has a shape matching with the clearance groove, in which case the second portion 62 is received by the first portion 61, or the bonded portion is a clearance groove provided on the second substrate 621, and the bonding portion has a shape matching with the clearance groove, in which case the first portion 61 is received by the second portion 62; typically, the chip 6 further comprises a memory portion (not shown) for storing data, which memory portion may be arranged on at least one of the first portion 61 and the second portion 62, depending on the arrangement of the electrical contacts.
Further, at least one of the first portion 61 and the second portion 62 is provided with a stopper 613/623 capable of engaging with the chip mounting portion 5, that is, the first portion 61 and the second portion 62 can be engaged with the chip mounting portion 5 respectively to be stopped, or after the two portions are engaged, the stopper provided by one of the two portions can be engaged with the chip mounting portion to be stopped.
As shown in fig. 3, when the first portion 61 is joined to the second portion 62, the contact points cp of the two electrical contacts 612a of the first row of the first portion are located on a straight line L1, the contact points cp of the two electrical contacts 622a of the first row of the second portion are located on a straight line L2, the contact points cp of the two electrical contacts 612b of the second row of the first portion are located on a straight line L3, and the contact points cp of the three electrical contacts 622b of the second row of the second portion are located on a straight line L4, which straight lines L1, L2, L3, and L4 are parallel to each other but do not overlap.
FIG. 4 is a perspective view of a chip mounting portion in a container according to an embodiment of the present invention; FIG. 5 is a schematic view showing the position of a chip mounting portion in a container case in a container according to an embodiment of the present invention; fig. 6 is a side view of a chip in contact with contact terminals according to an embodiment of the present invention.
The chip mounting portion 5 includes a base portion 50 and chip supporting portions provided on the base portion 50, preferably, the number of the chip supporting portions is the same as the number of portions formed by dividing the chip 6, in the present embodiment, as shown in fig. 4, the chip mounting portion 5 includes a first supporting portion 51 and a second supporting portion 52 adjacently provided on the base portion 50, the first chip portion 61 is supported by the first supporting portion 51, the second chip portion 62 is supported by the second supporting portion 52, and the first supporting portion 51 and the second supporting portion 52 protrude from the base portion 50 in the same direction but with different protruding dimensions (heights). In the present embodiment, the first support 51 supports the first chip part 61 in a point-supported manner, and the second support 52 supports the second chip part 62 in a point-supported manner, as shown in fig. 4, the first support 51 includes a front support 511 and a rear support 512 which are spaced apart and protrude from the base 50 by the same size (height), the second support 52 includes a front support 521 and a rear support 522 which are spaced apart and protrude from the base 50 by the same size (height), a groove 53 (shown in an enlarged view of a portion R2 in fig. 4) is provided between the front support 511/521 and the rear support 512/522, the first chip part 61 is supported by the front support 511 and the rear support 512 of the first support, and the second chip part 62 is supported by the front support 521 and the rear support 522 of the second support.
As shown in fig. 5, the geometric center point of the chamber 2 is C, the plane passing through the point C and parallel to the mounting direction a is S1, the plane passing through the center line of the ink discharging part 3 and parallel to the mounting direction a is S2, the line connecting the front support 511 and the rear support 512 of the first support 51 is parallel to the plane S1/S2, and the line connecting the front support 521 and the rear support 522 of the second support 52 is parallel to the plane S1/S2. In the enlarged schematic view of the partial R1, the distance from the plane S2 of the first supporting portion 51 is h1, the distance from the plane S2 of the second supporting portion 52 is h2, and h1 is not equal to h2, and since the plane S1 and the plane S2 are parallel to each other, the distance from the plane S1 of the first supporting portion 51 is different from the distance from the plane S1 of the second supporting portion 52, that is, the distance from the plane S1 of the first supporting portion 51 is different from the distance from the plane S2 of the second supporting portion 52 when the plane S1 is taken as a reference.
As shown in fig. 6, when the chip 6 is mounted to the chip mounting portion 5, the first portion 61 and the second portion 62 are not overlapped, and a height difference will be formed between the first portion 61 and the second portion 62 in the thickness direction of the substrate; when the ink cartridge 100 mounted with the chip 6 is mounted to the image forming apparatus, the contact terminals of the contact mechanism 9 are in contact with the corresponding electrical contacts, respectively, and with the chip 6 having nine electrical contacts as described in the present embodiment, the two electrical contacts 612a located in the first partial first row are in contact with the first contact terminal 92a1 and the fourth contact terminal 92a4, respectively, the two electrical contacts 612b located in the first partial second row are in contact with the fifth contact terminal 92b1 and the ninth contact terminal 92b5, respectively, the two electrical contacts 622a located in the second partial first row are in contact with the second contact terminal 92a2 and the third contact terminal 92a3, respectively, and the three electrical contacts 622b located in the second partial second row are in contact with the sixth contact terminal 92b2, the seventh contact terminal 92b3, and the eighth contact terminal 92b4, respectively.
For the chip 6, it is generally mass-produced, and therefore, the thicknesses of the first substrate 611 and the second substrate 621 may be the same by default, however, since the first supporting portion 51 and the second supporting portion 52 are different from the plane S1, the distances of the first portion 61 and the second portion 62 from the plane S1 are also different; taking h2 > h1 as an example, the second portion 62 will be further away from the plane S1 than the first portion 61, as reflected in the situation where the chip 6 is in contact with the contact mechanism 9, as shown in figure 6, the contact terminals 92a2/92a3/92b2/92b3/92b4 in contact with the electrical contacts of the second portion move further in the b-direction than the contact terminals 92a1/92a4/92b1/92b5 in contact with the electrical contacts of the first portion, relative to the carriage 91, the contact terminals 92a2/92a3/92b2/92b3/92b4 in contact with the electrical contacts of the second portion are deformed more than the contact terminals 92a1/92a4/92b1/92b5 in contact with the electrical contacts of the first portion, as described above, since the straight lines L1, L2, L3 and L4 do not overlap, four rows will be formed when the contact terminals of the contact mechanism are brought into contact with the chip 6.
The height difference between the first portion 61 and the second portion 62, or between the first support 51 and the second support 52, has the following advantages:
in a first aspect, the electrical contacts on the chip portion further from the plane S1 will be in contact with the contact terminals more closely and the communication connection between the two will be more stable, whereby the chip designer can place the electrical contacts with relatively higher frequency of use on the chip portion further from the plane S1 and the electrical contacts with relatively lower frequency of use on the other chip portion;
in the second aspect, when the ink cartridge 100 or the image forming apparatus is shaken, the lateral (in the direction of the straight lines L1, L2, L3, and L4) movement of the contact terminals can be stopped;
in the third aspect, compared to the existing chip support portion being a whole plane, the offset arrangement of the first support portion 51 and the second support portion 52 is more beneficial for the chip installer to find the corresponding mounting positions, prevent the first portion 61 and the second portion 62 from being misplaced, and prevent the chip 6 from being turned upside down.
[ example two ]
FIG. 7 is a schematic view showing a state where a chip and a chip mounting portion are disassembled in a container according to a second embodiment of the present invention; FIG. 8 is a perspective view of a chip mounting portion in a container according to a second embodiment of the present invention.
The present embodiment is modified from the first embodiment in that the first portion 61 and the second portion 62 are supported by the first support portion 51 and the second support portion 52 in a surface contact manner, which ensures that the chip 6 is supported more stably than the point support manner in the first embodiment.
As shown in fig. 7 and a part R3 of fig. 8, the plane of the front support 511 and the rear support 512 of the first support part 51 is parallel to the mounting direction a, and the plane of the front support 521 and the rear support 522 of the second support part 52 is parallel to the mounting direction a, but the first support part 51 and the second support part 52 are still disposed in a displaced manner, and the first support part 51 is spaced from the plane S1 by a different distance from the plane S1 than the second support part 52 is spaced from the plane S1 with respect to the plane S1, and when the chip 6 is mounted, the first part 61 and the second part 62 of the chip are also displaced.
[ third example ]
FIG. 9 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to a third embodiment of the present invention; FIG. 10 is a schematic view showing the position of a chip mounting portion in a container case according to a third embodiment of the present invention.
As shown in a part R4 in fig. 9, the present embodiment is different from the second embodiment in that the plane of the first support 51 is set to be not parallel to the plane S1, and the plane of the second support 52 is set to be parallel to the plane S1. For the sake of simplicity, as shown in fig. 10 by the partial R5, the second support 52 is at a distance h2 from the plane S2, the distance between the first support 51 and the plane S2 varies gradually, with a maximum distance h11 and a minimum distance h12, and the distance h11 is less than or equal to h2, and the distance between the first support 51 and the plane S2 decreases along the mounting direction a, or along the length/extension direction of the electrical contact, it being understood that the first support 51 may also be arranged such that the distance between the first support 51 and the plane S2 increases along the mounting direction a, or along the length/extension direction of the electrical contact.
Similarly, in this embodiment, the height difference between the first supporting portion 51 and the second supporting portion 52, or the first supporting portion 51 and the second supporting portion 52 are arranged in a staggered manner, and when the chip 6 is mounted, the height difference between the first portion 61 of the chip and the second portion 62 of the chip is also formed, or the first portion 61 and the second portion 62 are arranged in a staggered manner, which still can provide the above-mentioned advantages.
[ example four ]
FIG. 11 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to a fourth embodiment of the present invention; FIG. 12 is a schematic view showing the position of a chip mounting portion in a container case in a container according to a fourth embodiment of the present invention.
In this embodiment, as shown in a part R6 in fig. 11, the plane of the second support 52 is not parallel to the plane S1, and the plane of the first support 51 is parallel to the plane S1. As shown in fig. 12, in detail by the partial R7, the first support part 51 is at a distance h1 from the plane S2, the second support part 52 is at a maximum distance h21 from the plane S2 and at a minimum distance h22, the h21 is less than or equal to h1, and the distance between the second support part 52 and the plane S2 decreases in the mounting direction a, or in the length/extension direction of the electrical contact, it being understood that the second support part 51 may also be arranged such that the distance between the second support part 51 and the plane S2 increases in the mounting direction a, or in the length/extension direction of the electrical contact.
In the present embodiment and the third embodiment, the case where one of the plane of the first supporting portion 51 and the plane of the second supporting portion 52 is not parallel to the reference plane S1 is described, and the plane of the first supporting portion 51 and the plane of the second supporting portion 52 are both planes, it can be understood that the technical solution of the present invention is still applicable when the first supporting portion 51 is set to be a curved surface or the second supporting portion 52 is set to be a curved surface, and at this time, at least one of the two end connecting lines of the curved surface forming the first supporting portion 51 and the two end connecting lines of the curved surface forming the second supporting portion 52 is parallel to the reference plane S1.
[ example five ]
Fig. 13 is a schematic view of the container according to the fifth embodiment of the present invention, in which the chip mounting portion and the chip are separated.
In the present embodiment, the chip mounting portion 5 is formed separately from the housing 1, and a height difference is still formed between the first supporting portion 51 and the second supporting portion 52 in the chip mounting portion 5, so that a height difference is also formed between the first portion 61 and the second portion 62 of the chip 6.
One of the advantages of forming the chip mounting portion 5 separately from the case 1 is that the mounting operation of the chip 6 is more free, and for a production factory, before the ink cartridge 100 is produced, the chip 6 can be pre-mounted to the chip mounting portion 5, and then the chip mounting portion 5 is mounted to the case 1, so that not only is the operating freedom of the operator for mounting the chip 6 higher, but also other portions of the case 1 cannot be damaged when the chip 6 is mounted.
[ sixth example ]
FIG. 14 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to a sixth embodiment of the present invention; FIG. 15 is a schematic view showing the position of a chip mounting portion in a container case according to a sixth embodiment of the present invention.
In the present embodiment, the ink cartridge can still be mounted in the mounting direction a, except that the chip mounting portion 5 as a whole is disposed to be inclined with respect to the mounting direction a, as shown in fig. 14, and both the first support portion 51 and the second support portion 52 are inclined with respect to the mounting direction a, at which time the reference surface S1 will no longer be parallel to the plane S2 on which the center line of the ink outlet portion 3 is located, as shown in fig. 15, the reference surface S1 will intersect the plane S2, and at least one of the first support portion 51 or the second support portion 52 will be parallel to the reference surface S1.
Similarly, the distance h1 of the first support portion 51 from the reference plane S1 is different from the distance h2 of the second support portion 52 from the reference plane S2, and there is a difference in height between the first chip portion 61 and the second chip portion 62 when the chip 6 is mounted.
[ seventh example ]
Fig. 16 is a perspective view of a container according to a seventh embodiment of the present invention; FIG. 17 is a schematic view showing a state in which a chip mounting portion and a chip are disassembled in a container according to a seventh embodiment of the present invention; FIG. 18 is a schematic view showing the position of a chip mounting portion in a container casing in a container according to a seventh embodiment of the present invention.
The container that this embodiment relates to is the cartridge, and is corresponding, and imaging material is the carbon powder, and imaging device is laser printer. As shown in fig. 16, the toner cartridge 100 includes a housing 1, a developing member 11 and an image forming member 12 rotatably mounted in the housing 1, the housing 1 includes a developing housing 1a and an image forming housing 1b combined with each other, and a first end cap 1c and a second end cap 1d respectively located at both longitudinal ends of the developing housing, the developing member 11 is located in the developing housing 1a, the image forming member 12 is located in the image forming housing 1b, the developing housing 1a and the image forming housing 1b are combined by the first end cap 1c and the second end cap 1d, a cavity 2 containing toner is formed in the developing housing 1a, the developing member 11 is used to supply toner to the image forming member 12, and the image forming member 12 (another embodiment of an image forming material supply portion) is used to supply toner to the outside.
As shown in part R8 in fig. 17, the toner cartridge further includes a chip mounting portion 5 provided on the casing 1, the chip mounting portion 5 being provided on any one of the developing casing, the imaging casing, the first end cap, and the second end cap of the casing 1 depending on the position of the contact mechanism 9; the chip 6 is mounted on the chip mounting portion 5, and as in the above-described embodiment, the chip 6 in this embodiment still includes the first portion 61 and the second portion 62 which are separately provided, and accordingly, the chip mounting portion 5 is still provided with the first support portion 51 for supporting the first portion 61 and the second support portion 52 for supporting the second portion 62.
The reference surface S1 in the present embodiment is different from the above-described embodiment, and as shown in fig. 18, in order to more clearly show the reference surface S1 in the present embodiment, only the developing casing 1a and the first cap 1C are shown in the drawing, and the first cap 1C is cut along a plane parallel to the mounting direction, the reference surface S1 passes through the geometric center point C of the chamber 2, and the reference surface S1 is also parallel to at least one of the first support portion 51 and the second support portion 52, and at this time, the reference surface S1 intersects with the mounting direction a, and preferably, the reference surface S1 is perpendicular to the mounting direction a.
The first support part 51 is spaced apart from the reference plane S1 by a distance h1, the second support part 52 is spaced apart from the reference plane S2 by a distance h2, and h1 is not equal to h2, so that a height difference is formed between the first support part 51 and the second support part 52, and a height difference is also formed between the chip first part 61 and the chip second part 62 when the chip 6 is mounted.
[ eighth example ]
Fig. 19 is a perspective view of a container according to an eighth embodiment of the present invention; FIG. 20 is a schematic view showing a state where a chip mounting portion and a chip are disassembled in a container according to an eighth embodiment of the present invention; fig. 21 is a perspective view of a chip according to an eighth embodiment of the present invention; FIG. 22 is a schematic view showing the position of a chip mounting portion in a container casing in a container according to an eighth embodiment of the present invention.
Unlike the seventh embodiment in which the toner cartridge 100 of the present embodiment is no longer provided with the imaging housing 1b and the imaging member 12 in the imaging housing 1b, as shown in fig. 19, the developing member 11 (still another embodiment of the imaging material supply portion) is rotatably mounted on the housing 1, the housing 1 includes a developing housing 1a forming the cavity 2 and first and second end caps 1c and 1d respectively at both longitudinal ends of the developing housing 1a, and similarly, the chip mounting portion 5 in the present embodiment may be provided on any one of the developing housing 1a, the first end cap 1c, and the second end cap 1 d.
As shown in fig. 20, the height difference is still formed between first supporting portion 51 and second supporting portion 52 of chip mounting portion 5, and as shown in fig. 22, the toner cartridge may be mounted in mounting direction a, reference plane S1 passes through geometric center point C of chamber 2 and is parallel to at least one of first supporting portion 51 and second supporting portion 52, at this time, reference plane S1 is parallel to mounting direction a, first supporting portion 51 is at a distance of h1 from reference plane S1, second supporting portion 52 is at a distance of h2 from reference plane S1, h1 is not equal to h2, and when chip 6 is mounted, the height difference is also formed between chip first portion 61 and chip second portion 62.
When electrical connection is required between the first portion 61 and the second portion 62 of the chip 6, as shown in fig. 21, the chip 6 further includes a connection portion 63 for electrically connecting the first portion 61 and the second portion 62, the connection portion 63 is preferably a flexible wiring board, so that the first portion 61 and the second portion 62 can be placed in an overlapping manner or placed apart from each other depending on the position of the housing 1; alternatively, the connection portion 63 may also be a metal contact provided at a corresponding position of the first portion 61 and the second portion 62.
[ example nine ]
FIG. 23 is a perspective view of a container according to example nine of the present invention; FIG. 24 is a schematic view showing the position of a chip mounting portion in a container casing in a ninth embodiment of the present invention.
The container in this embodiment is further simplified with respect to the seventh and eighth embodiments, and as shown in fig. 23, the container is a powder cartridge that can be mounted in a mounting direction a parallel to the longitudinal direction thereof, and includes a housing 1, a powder discharging portion 3 (still another embodiment of an image forming material supplying portion) provided on the housing 1, and a chip mounting portion 5 provided on the housing 1, and a cavity 2 for accommodating carbon powder is formed in the housing 1.
As shown in fig. 24, in a part R9, the chip mounting portion 5 still includes a first supporting portion 51 and a second supporting portion 52 having a height difference, the reference plane S1 in this embodiment passes through the geometric center point C of the cavity 2 and is parallel to at least one of the first supporting portion 51 and the second supporting portion 52, the first supporting portion 51 is at a distance h1 from the reference plane S1, the second supporting portion 52 is at a distance h2 from the reference plane S1, and the h1 is not equal to h 2. When the chip 6 is mounted, a height difference is also formed between the chip first portion 61 and the chip second portion 62.
[ other explanations ]
In the case where the chip 6 is formed separately as described above, it is obvious to those skilled in the art that the chip 6 may be integrally formed, when the chip 6 has a shape in which the second portion 62 is accommodated in the first portion 61, the substrate 611 of the first portion and the substrate 621 of the second portion are integrally formed, and the first portion 61 and the second portion 62 are arranged in a shifted manner in the thickness direction of the substrate, and a space is left between the side of the second portion 62 where no electrical contact is arranged and the side of the first portion 61 where no electrical contact is arranged, and the first supporting portion 51 and the second supporting portion 52 having the height difference may be provided for the chip mounting portion 5, and finally, the chip 6 may be stably supported in the chip mounting portion 5.
In addition, the substrate of the chip 6 may be a flexible wiring board, in which case the chip 6 may be integrally formed, and the chip mounting portion may still be provided with the above-described first supporting portion 51 and second supporting portion 52 having a height difference, and when the chip 6 is mounted, the flexible wiring board may cause the chip 6 to also form a height difference.
As described above, the chip mounting portion 5 provided in the container according to the present invention is applicable to both integrally formed chips and separately formed chips, and a plurality of supporting portions for supporting the chip 6 are formed in the chip mounting portion 5 at different distances from the reference surface S1, so that a height difference is formed between the plurality of supporting portions, and when the chip 6 is mounted, the electrical contact portions of the chip also form a height difference, and on the one hand, the electrical contact portions of the chip 6 farther from the reference surface are brought into contact with the contact terminals in the imaging apparatus more closely, and on the other hand, lateral movement of the plurality of contact terminals in the imaging apparatus can be restrained, and a situation in which the chip 6 is mounted misaligned or inverted, which may occur, is eliminated.
Claims (11)
1. A container for detachably mounting in an image forming apparatus provided with a plurality of contact terminals, the container comprising a housing forming a cavity in which an image forming material can be accommodated, and a chip mounting portion on the housing,
the chip mounting part comprises a plurality of supporting parts for supporting the chip, and the plurality of supporting parts have different distances from the reference surface;
the reference plane is a plane passing through a geometric center of the cavity and parallel to at least one of the plurality of support portions.
2. The container according to claim 1, wherein the chip supportable by the chip mounting part is provided with a plurality of electrical contacts contactable with the contact terminals, and a height difference is formed between the plurality of electrical contacts when the chip is mounted to the chip mounting part.
3. The container of claim 2, wherein the plurality of supports are each parallel to a reference plane.
4. The container of claim 2, wherein one of the plurality of supports is inclined relative to the reference plane.
5. The container of claim 2, wherein the chip comprises a plurality of sections formed separately, each section having at least one electrical contact disposed therein.
6. The container of claim 5, wherein the plurality of portions of the chip are electrically connected.
7. The container of claim 5, wherein the chip comprises a substrate, the electrical contacts being disposed on the substrate, and the substrate being a flexible wiring board.
8. The container according to claim 2, wherein the plurality of electrical contacts are arranged in more than two rows in a direction perpendicular to the extending direction along the extending direction of the electrical contacts.
9. The container according to any one of claims 1 to 8, wherein the container is an ink cartridge and the image forming material is ink.
10. The container according to any one of claims 1 to 8, wherein the container is a toner cartridge, the image forming material is toner, and the toner cartridge further comprises a developer rotatably mounted in the housing for transporting the toner away.
11. The container according to any one of claims 1 to 8, wherein the container is a toner cartridge, the image forming material is toner, and the toner cartridge further comprises a toner discharge portion provided on the housing for discharging the toner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111676385.XA CN114089614A (en) | 2021-12-31 | 2021-12-31 | A kind of container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111676385.XA CN114089614A (en) | 2021-12-31 | 2021-12-31 | A kind of container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114089614A true CN114089614A (en) | 2022-02-25 |
Family
ID=80308358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111676385.XA Pending CN114089614A (en) | 2021-12-31 | 2021-12-31 | A kind of container |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114089614A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020075337A1 (en) * | 2000-09-06 | 2002-06-20 | Torachika Osada | Ink jet recording head and ink jet recording apparatus |
| JP2005007893A (en) * | 2004-09-01 | 2005-01-13 | Seiko Epson Corp | Terminal of circuit board |
| CN102381045A (en) * | 2010-09-03 | 2012-03-21 | 精工爱普生株式会社 | Printing material cartridge and printing material supply system |
| JP2012061706A (en) * | 2010-09-16 | 2012-03-29 | Seiko Epson Corp | Printing device, printing material cartridge, circuit board, and adapter |
| CN102667640A (en) * | 2010-06-11 | 2012-09-12 | 株式会社理光 | Information storage device, removable device, developer container, and image forming apparatus |
| CN203004522U (en) * | 2012-12-21 | 2013-06-19 | 珠海艾派克微电子有限公司 | Ink box chip used for printer and the ink box comprising the chip |
| CN107901611A (en) * | 2017-10-12 | 2018-04-13 | 珠海纳思达企业管理有限公司 | Chip and print cartridge |
| CN211684116U (en) * | 2019-07-12 | 2020-10-16 | 珠海纳思达企业管理有限公司 | Chip mounted on ink box and ink box using chip |
| WO2021238581A1 (en) * | 2020-05-25 | 2021-12-02 | 珠海纳思达企业管理有限公司 | Ink cartridge and printing apparatus |
-
2021
- 2021-12-31 CN CN202111676385.XA patent/CN114089614A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020075337A1 (en) * | 2000-09-06 | 2002-06-20 | Torachika Osada | Ink jet recording head and ink jet recording apparatus |
| JP2005007893A (en) * | 2004-09-01 | 2005-01-13 | Seiko Epson Corp | Terminal of circuit board |
| CN102667640A (en) * | 2010-06-11 | 2012-09-12 | 株式会社理光 | Information storage device, removable device, developer container, and image forming apparatus |
| CN102381045A (en) * | 2010-09-03 | 2012-03-21 | 精工爱普生株式会社 | Printing material cartridge and printing material supply system |
| JP2012061706A (en) * | 2010-09-16 | 2012-03-29 | Seiko Epson Corp | Printing device, printing material cartridge, circuit board, and adapter |
| CN203004522U (en) * | 2012-12-21 | 2013-06-19 | 珠海艾派克微电子有限公司 | Ink box chip used for printer and the ink box comprising the chip |
| CN107901611A (en) * | 2017-10-12 | 2018-04-13 | 珠海纳思达企业管理有限公司 | Chip and print cartridge |
| CN211684116U (en) * | 2019-07-12 | 2020-10-16 | 珠海纳思达企业管理有限公司 | Chip mounted on ink box and ink box using chip |
| WO2021238581A1 (en) * | 2020-05-25 | 2021-12-02 | 珠海纳思达企业管理有限公司 | Ink cartridge and printing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7490929B2 (en) | Ink cartridge and ink cartridge holder | |
| US8721045B2 (en) | Cartridge and printing material supply system | |
| US8297739B1 (en) | Cartridge and printing material supply system | |
| US8974044B2 (en) | Cartridge and printing material supply system | |
| US10394160B2 (en) | Toner cartridge and developing cartridge for image forming apparatus, and image forming apparatus | |
| US9481181B2 (en) | Ink cartridge chip, ink cartridge, and structural body | |
| CA2588407A1 (en) | Ink cartridge with semiconductor storage device | |
| US8083401B2 (en) | Connector holder unit, carriage, recording apparatus, and liquid ejecting apparatus | |
| CN107962873B (en) | Ink box chip, ink box and ink-jet printer | |
| CN114089614A (en) | A kind of container | |
| JP2006272642A (en) | Liquid container | |
| CN214608729U (en) | Consumable packaging assembly | |
| CN217574546U (en) | Ink cartridge and ink jet printer | |
| CN212708576U (en) | Ink box | |
| JP2008000992A (en) | Carriage device, recorder and liquid jetting apparatus | |
| JP7256331B2 (en) | Ink container tip and ink container | |
| EP1286431B1 (en) | Electrical connector with biased positioning | |
| CN219467339U (en) | Printer cartridge and printer | |
| CN217333115U (en) | Carbon powder box | |
| CN220390739U (en) | Ink cartridge | |
| CN212135483U (en) | Support combination | |
| CN116766776A (en) | Ink box chip, ink box and ink-jet printing equipment | |
| US20030109159A1 (en) | Insertion detection switch, connection apparatus and connector apparatus | |
| JP2008000994A (en) | Connector holder unit, carriage, recorder and liquid jetting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220402 Address after: 519000 room 505, building 3, No. 798, qinzheng Road, Hengqin new area, Zhuhai City, Guangdong Province Applicant after: Zhuhai Yuzhi Technology Co.,Ltd. Address before: 519000 Room 301, 3 / F, forming workshop (building a), No. 8, Pingdong Second Road, Nanping, Zhuhai, Guangdong Applicant before: E-JET TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230317 Address after: 519000 Room 301, 3 / F, forming workshop (building a), No. 8, Pingdong Second Road, Nanping, Zhuhai, Guangdong Applicant after: E-JET TECHNOLOGY Co.,Ltd. Address before: 519000 room 505, building 3, No. 798, qinzheng Road, Hengqin new area, Zhuhai City, Guangdong Province Applicant before: Zhuhai Yuzhi Technology Co.,Ltd. |
|
| TA01 | Transfer of patent application right |