CN107901611A - Chip and print cartridge - Google Patents
Chip and print cartridge Download PDFInfo
- Publication number
- CN107901611A CN107901611A CN201711397088.5A CN201711397088A CN107901611A CN 107901611 A CN107901611 A CN 107901611A CN 201711397088 A CN201711397088 A CN 201711397088A CN 107901611 A CN107901611 A CN 107901611A
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- CN
- China
- Prior art keywords
- contact site
- row
- terminal
- chip
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17543—Cartridge presence detection or type identification
- B41J2/17546—Cartridge presence detection or type identification electronically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/1752—Mounting within the printer
- B41J2/17523—Ink connection
Landscapes
- Ink Jet (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The present invention provides a kind of chip and print cartridge, for installation on print cartridge, print cartridge is used to be installed in the mounting portion in printer in assembly direction the chip；Chip includes memory, the first contact site for installing detection, the second contact site；At least one second contact site is electrically connected with memory；First contact site and the second contact site be in contact respectively with the contact pilotage in printer；First contact site is in multiple rows of arrangement in the mounting direction；In the mounting direction, the first contact site formed it is multiple rows of between be provided with the second contact site formed it is a row or multi-row；Alternatively, the second contact site formed it is multiple rows of between be provided with the first contact site formed it is multiple rows of.First contact site and the second contact site are not arranged in same row, this structure advantageously reduces due to non-contacting electromagnetic interference caused by the voltage difference between the first contact site and the second contact site and burr ripple occurs, prevent terminal from the situation of wrong data signal occur, ensure chip normal work.
Description
Technical field
The present invention relates to inkjet printer technologies field, more particularly to chip and print cartridge.
Background technology
With the continuous progress of science and technology, printer industry development is rapid, and the application of ink-jet printer is more and more extensive,
Print cartridge has become the easy consumption component of ink-jet printer.Chip is provided with print cartridge, print cartridge chip is used to store factory
The information such as information, amount information, print cartridge classification information, ink color, normal work of the print cartridge chip for ink-jet printer
Play decisive role.
Fig. 1 is the schematic diagram on the mounting portion 90 to be installed to of print cartridge 10.Fig. 2 is the schematic diagram of prior art chip 20.Such as
Shown in Fig. 1 and Fig. 2, mounting portion 90 is the component of printer, and for carrying a multiple or print cartridge 10, print cartridge 10 is along installation side
It is releasably attached to P in mounting portion 90.Print cartridge 10 includes chip 20, handle 30, ink outlet port 40, box body 50.Mounting portion 90
With contact pilotage portion 91, ink supply 92.50 memory of box body contains ink, and ink is reached at ink supply 92 through ink outlet port 40, and then is supplied
Black portion 92 can be by providing ink at printhead, so that ink can be used for the action for performing printing.There is end on chip 20
Subgroup 200, terminal group 200 can contact electrical connection with the contact pilotage 91a in contact pilotage portion 91, for the mutual transmission between electric signal.
Handle 30 is used to print cartridge 10 being fixed to mounting portion 90, prevents print cartridge 10 from spinning off from mounting portion 90.
There is substrate 20a, the terminal group 200 being arranged on substrate 20a, memory (in figure in the chip 20 of the prior art
It is not shown).Terminal group 200 includes 9 terminal 201-209, and 9 terminals are divided into the first terminal 201,204,205,209, second end
Son 202,203,206-208.The first terminal is the end for carrying out installation detection when print cartridge 10 is installed to mounting portion 90
Son.Second terminal is the terminal in addition to the first terminal.In Second terminal at least a portion terminal be for chip 20
What memory was connected.Each terminal in 9 terminal 201-209 includes the contact site 201a- being in contact with contact pilotage 91a
209a.9 contact site 201a-209a on installation direction P in 2 rows arrange (first row L1, second row L2), with installation direction
On width T vertical P, 9 contact site 201a-209a are offset from each other arrangement.Terminal 201,204 in the first terminal
Contact site 201a, 204a and Second terminal in second contact site 202a, 203a of terminal 202,203 be arranged on first row L1
In, and contact site 201a, 204a are located at the both ends of the width T of first row L1 respectively；Terminal 205,209 in the first terminal
Contact site 205a, 209a and Second terminal in the second contact site 206a-208a of terminal 206-208 be arranged on second row L2
In, and contact site 205a, 209a are located at the both ends of the width T of second row L2 respectively.
In the prior art, in order to preferably carry out installation detection, the first terminal 201,204,205,209 under normal circumstances
Input voltage is different from Second terminal 202,203,206-208.Electric signal on each terminal is in certain scope, chip 20
Installation detection and signal transmission could normally be carried out.Voltage difference between the first terminal and Second terminal is (for example, for installing
The first terminal of detection is transfused to the high voltage of 42V, and the Second terminal being connected with memory is transfused to the low-voltage of 3.3V),
But for installing the first terminal and Second terminal set-up mode as shown in Figure 2 of detection, the first terminal and Second terminal mistake
In closing on, the installation detection signal on the first terminal can be caused to cause signal interference with the signal in Second terminal, it may appear that quilt
The situation that the terminal of interference can be mistaken for data-signal (is closed on terminal for example, the 42V high voltages on the first terminal can trigger
There is the situation that burr waveguide causes its terminal to be mistakenly considered data-signal).Occurs terminal between the first terminal and Second terminal
Between signal interference, terminal can be caused the situation of wrong data signal occur, cause the terminal group 200 of chip 20 can not be normal
Work.
The content of the invention
The present invention provides a kind of chip and print cartridge, is interfered with each other for presence signal between solution in the prior art terminal
Technical problem.
The first aspect of the embodiment of the present invention provides a kind of chip, and the chip is for installation on print cartridge, the ink
Box is used to be installed in the mounting portion in printer in assembly direction；The chip include memory, for detection is installed the
One contact site, the second contact site；At least one second contact site is electrically connected with the memory；First contact site
It is in contact respectively with the contact pilotage in the printer with second contact site；
First contact site is in multiple rows of arrangement on the installation direction；
On the installation direction, first contact site formed it is multiple rows of between be provided with what the second contact site was formed
It is a row or multi-row；Alternatively, second contact site formed it is multiple rows of between be provided with first contact site formed it is multiple rows of.
Optionally, first contact site includes：First group of installation detection contact site for being connected with each other, be connected with each other the
Two groups of installations detect contact site；First group of installation detection contact site and second group of installation detect contact site in the peace
It is in multiple rows of arrangement to fill on direction.
Optionally, first group of installation detection contact site forms first row on the installation direction；Described second group
Installation detection contact site forms second row on the installation direction；The a row or multi-row setting that second contact site is formed
Between the first row and the second row.
Optionally, first group of installation detection contact site is connected by conducting wire, and second group of installation detection connects
Contact portion is connected by resistance；The voltage that second group of installation detection contact site is applied in is examined higher than first group of installation
Survey the voltage of contact site.
Optionally, second contact site includes the ground connection contact site not being connected with the memory；Further include and deposit
Electrical power contacts portion that reservoir is connected, data exposure portion, reset contact site.
Optionally, the chip includes：Multiple the first terminals, multiple Second terminals；Multiple first contact sites are set
On multiple the first terminals, multiple second contact sites are arranged in multiple Second terminals.
Optionally, the chip includes：Multiple the first terminals, multiple Second terminals；On the installation direction, described
One terminal formed it is multiple rows of between be provided with Second terminal formed it is a row or multi-row.
Optionally, multiple rows of and second contact site that first contact site is formed it is a row or multi-row between it is mutual
Every.
Optionally, in the mounting direction, multiple rows of and second contact site of first contact site it is multiple rows of between one
One is spaced.
Optionally, in the mounting direction, first contact site forms first row, second row；The second contact site shape
Into the 3rd row, the 4th row；It is spaced one by one between first row, second row and the 3rd row, the 4th row.
Optionally, the second row than the 3rd row and the 4th row closer to the front of the installation direction.
Optionally, first row described in the 4th parallelism and the second row are closer to the front of the installation direction.
Optionally, the chip includes Part I, Part II；The Part I and the Part II are by two
Block circuit substrate is fabricated.
Optionally, the Part I is made with the Part II of the substrate of different materials；The Part II
It is made of electric silica gel or conductive metallic material.
Optionally, second contact site is arranged on the Part I, and first contact site is arranged on described
On two parts.
Optionally, the chip further includes breakthrough part；The breakthrough part is on the thickness direction of the chip through described
Chip.
Optionally, the chip further includes substrate, and first contact site is compared with second contact site relative to base
Plate is more prominent.
Optionally, terminal hole is provided with the Part I, for the terminal for being provided with contact site on Part II
Pass through and protruded relative to Part I.
Optionally, in the mounting direction, first contact site forms first row, second row；The second contact site shape
Into the 3rd row, the 4th row；First row, second row are arranged between the 3rd row, the 4th row.
Optionally, in the vertical direction of the installation direction, second group of installation detects contact site in all contacts
The outermost in portion, first group of installation detection contact site is in time outside of all contact sites.
Optionally, first contact site compared to second contact site in the front end of the installation direction；It is described
Front end is the downstream of the installation direction.
Optionally, described first contacted between each first contact site, between each second contact site, each
The distance between portion and each second contact site are more than or equal to pre-determined distance threshold value.
Second aspect of the embodiment of the present invention provides a kind of print cartridge, including any of the above-described chip.Using above-mentioned
After technical solution, beneficial effect is：In the mounting direction, the first contact site formed it is multiple rows of between be provided with the second contact site institute
What is formed is a row or multi-row；Second contact site formed it is multiple rows of between be provided with the first contact site formed it is multiple rows of, i.e. first
Contact site and the second contact site are not arranged in same row, this structure advantageously reduce due to the first contact site and the second contact site it
Between voltage difference caused by non-contacting electromagnetic interference and there is burr ripple, prevent that the situation of wrong data signal from occurring in terminal,
Ensure chip normal work.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this area
For those of ordinary skill, without having to pay creative labor, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the schematic diagram on print cartridge mounting portion to be installed to；
Fig. 2 is the schematic diagram of prior art chip；
Fig. 3 is the chip schematic diagram of embodiment one；
Fig. 4 is the schematic diagram of the chip upper contact part of embodiment two；
Fig. 5 is the schematic diagram of the first chip of embodiment two；
Fig. 6 is the schematic diagram of the first chip of embodiment two；
Fig. 7 a, Fig. 7 b are the chip structure figure of the first embodiment of embodiment two；
Fig. 8 is the chip structure figure of the second embodiment of embodiment two；
Fig. 9 is the schematic diagram of the chip upper contact part of embodiment three；
Figure 10 is the chip structure figure of the first embodiment of embodiment three；
Figure 11 is the chip structure figure of the second embodiment of embodiment three；
Figure 12 is the chip structure figure of the 3rd embodiment of embodiment three；
Figure 13 a, Figure 13 b are the chip structure figure of the 4th embodiment of embodiment three；
Figure 14 a, Figure 14 b are the chip structure figure of the 5th embodiment of embodiment three；
Figure 15 is the schematic diagram of the chip of example IV；
Figure 16 is the chip structure figure of the first embodiment of example IV；
Figure 17 is the chip structure figure of the second embodiment of example IV.
Embodiment
For a better understanding of the technical solution of the present invention, the embodiment of the present invention is retouched in detail below in conjunction with the accompanying drawings
State.
It will be appreciated that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
Its embodiment, belongs to the scope of protection of the invention.
Embodiment one：
Fig. 1 is the schematic diagram on the mounting portion 90 to be installed to of print cartridge 10.As shown in Figure 1, mounting portion 90 is the portion of printer
Part, for carrying a multiple or print cartridge 10, P is detachably mounted in mounting portion 90 print cartridge 10 in assembly direction.Print cartridge
Chip 20 is installed on 10.Print cartridge 10 includes chip 20, handle 30, ink outlet port 40, box body 50.Mounting portion 90 has contact pilotage portion
91st, ink supply 92.50 memory of box body contains ink, and ink is reached at ink supply 92 through ink outlet port 40, and then ink supply 92 can be with
By providing ink at printhead, so that ink can be used for the action for performing printing.There is terminal group 200 on chip 20, hold
Subgroup 200 can be electrically connected with the contact pilotage 91a in contact pilotage portion 91, for the mutual transmission between electric signal.Handle 30 is used for will
Print cartridge 10 is fixed on mounting portion 90, prevents print cartridge 10 from spinning off from mounting portion 90.
Fig. 3 is the chip schematic diagram of embodiment one.As shown in figures 1 and 3, there is substrate 20a in chip 20, be arranged on base
Terminal group 200, memory (not shown) on plate 20a.Optionally, which can include terminal group 200, including 9
Terminal 201-209,9 terminals are divided into the first terminal 201,204,205,209, Second terminal 202,203,206-208；First end
Son is the terminal for carrying out installation detection when print cartridge 10 is installed to mounting portion 90, and Second terminal is except the first terminal
Outside terminal, Second terminal at least a portion terminal is for being connected with the memory of chip 20.9 terminal 201-209
In each terminal include the contact site 201a-209a that is in contact with contact pilotage 91a.First contact site 201a, 204a, 205a,
209a is arranged on the first terminal 201,204,205,209, and the second contact site (not shown in figure contact site identify) is arranged on the
Two-terminal 202,203, on 206-208.Wherein, the first contact site its arranged on installation direction P in multiple rows of, i.e. the first contact
Portion 201a, 204a, 205a, 209a form row L11, row L12.Second terminal 202,203, the second contact site on 206-208
It is in a row that it is arranged on installation direction P, the row of foring L21；Second terminal 202,203, the second contact site on 206-208
Plurality of rows of arrangement can be formed, the situation that Fig. 3 is only arranged as a row L21 with the second contact site is illustrated.Wherein, arrange
It is spaced between L21 and row L11, row L12 on installation direction P, that is, arranges L21 and row L11 and row L12 on installation direction P
Not in same row, row L21 between row L11 and row L12, wherein, on installation direction P, the second contact site L21 both can be as
, can also be as shown in figure 15 shown in Fig. 3 between the row L11 and row L12 that the first contact site is formed, the row of the first contact site
L11 and row L12 are located between the row L21 of the second contact site formation and row L22.Which kind of arrangement knot in either Fig. 3 or Figure 15
Structure, using on installation direction P, the first contact site formed it is multiple rows of between be provided with the row or more that the second contact site is formed
Row；Alternatively, the second contact site formed it is multiple rows of between be provided with the plurality of rows of structure that the first contact site is formed, be conducive to subtract
It is few burr ripple occur due to non-contacting electromagnetic interference caused by the voltage difference between the first contact site and the second contact site, prevent
There is the situation of wrong data signal in not-go-end, ensures chip normal work.
Optionally, first contact site 201a, 204a, 205a, 209a can include：The first group of installation detection being connected with each other
Contact site 200a (201a, 204a), the second group of installation detection contact site 200b (205a, 209a) being connected with each other；First group of peace
Dress detection contact site 200a (201a, 204a) and second group of installation detection contact site 200b (205a, 209a) are on installation direction P
In multiple rows of arrangement；Specifically, as shown in figure 3, first group of installation detects contact site 200a (201a, 204a) shapes in the mounting direction
Into first row L11；Second group of installation detection contact site 200b (205a, 209a) forms second row L12 on installation direction P；The
The row (L21) or multiple rows of setting that two contact sites are formed (such as the contact site shown on Second terminal 202,203,206-208)
Between first row L11 and second row L12.In said structure, first group of installation detection contact site 201a, 204a form row L11,
Second group of installation detection contact site 205a, 209a form row L12, so that multiple first contact sites are grouped and divide row to arrange, can
So that terminal group 200 has the design space of bigger, so as to preferably carry out arrangement layout on substrate 20a.
Optionally, first group of installation detection contact site 200a (201a, 204a) is connected by conducting wire, second group of installation
Detection contact site 200b (205a, 209a) is connected by resistance；Second group of installation detection contact site 200b (205a, 209a)
Higher than first group installation of the voltage being applied in detects the voltage of contact site 200a (201a, 204a).The contact site quilt of different grouping
Access different operating voltages, and the installation detection contact site of different grouping is in same row, using spaced mode cloth
Office, non-contacting electromagnetic interference caused by further reducing the voltage difference between different groups of installations detection contact site and there is burr
Ripple, prevents terminal from the situation of wrong data signal occur, ensures chip normal work.With Fig. 3 for example, the first terminal 201,
204th, 205,209 are divided into 2 groups when installing and detecting, and the first installation detection terminal 201, second installs detection terminal 204 and is
First group of installation detection terminal；The first contact site 201a thereon and 204a is interconnected to form first group of installation detection contact site
200a；It is second group of installation detection terminal that 3rd installation detection terminal the 205, the 4th, which installs detection terminal 209,；First thereon connects
Contact portion 205a and 209a is interconnected to form second group of installation detection contact site 200b.First group of installation detection terminal 201,204
By the voltage of the 2.4V of printer input, the voltage for the 42V that second group of installation detection terminal 205,209 is inputted by printer.The
What the terminal being connected in two-terminal 202,203,206-208 with memory was inputted by printer is 3.3V voltages, to maintain core
The transmission of signal between piece 20 and printer.First contact site and the second contact site form row L11, row L12, row L21.Row L11,
Between row L12 and row L21 on installation direction P separately, i.e., it is separately independent not in same row.This structure is conducive to subtract
First group of installation detection contact site 200a of few different access voltages, second group of installation detection contact site 200b, second contact site
Between voltage difference caused by non-contacting electromagnetic interference and there is burr ripple, also help prevent terminal from error number occur it is believed that
Number situation, ensure chip normal work.
Optionally, the second contact site (such as contact site shown on Second terminal 202,203,206-208) is included not with depositing
The ground connection contact site (contact site on terminal 207) that reservoir (not shown) is connected；Further include what is be connected with memory
Electrical power contacts portion (contact site on terminal 206), data exposure portion (contact site on terminal 208), reset contact site (terminal
Contact site on 202).
Specifically, the effect of each terminal in terminal group 200 and function are as follows：
Terminal 201：First group of installation detection terminal；
Terminal 202：Reseting terminal；
Terminal 203：Clock terminal；
Terminal 204：First group of installation detection terminal；
Terminal 205：Second group of installation detection terminal；
Terminal 206：Power supply terminal；
Terminal 207：Ground terminal；
Terminal 208：Data terminal；
Terminal 209：Second group of installation detection terminal.
In Second terminal 202,203,206-208, terminal 202,203,207,208 is connected with memory, for beating
Mutual transmission telecommunications number between print machine, runs under the voltage of 3.3V.Terminal 207 is ground terminal, voltage 0V.Terminal 207
It is not connected with memory.Those skilled in the art is not it is understood that can also have terminal 207 in terminal group 200.
Optionally, the pressure difference between terminal is bigger, more easily influences each other, and signal interference easily occurs, is easy to cause end
There is error signal in son, can not work normally.Therefore, second group of installation detection terminal 205,209 (being transfused to 42V voltages) and the
The pressure difference of two-terminal (being transfused to 3.3V) is larger, can will arrange L12 and be arranged on the front of installation direction P, i.e. terminal group 200
Outermost.And first group of installation detection terminal 201,204 (being transfused to 2.4V) less with the pressure difference of Second terminal is arranged on
Arrange L11.From the point of view of installation direction P, the input voltage of arranging L11 is 2.4V, the input voltage of arranging L21 is 3.3V, the input for arranging L12
Voltage is 42V, and arrangement from low to high is presented in voltage.That is, the first contact site and/or the second contact site it is multiple rows of between
The voltage levels order accessed according to it arranges, so that it is all small as far as possible per the voltage difference between two rows of, so as to subtract
Non-contacting electromagnetic interference caused by few voltage difference and there is burr ripple, also helping prevents terminal from wrong data signal occur
Situation, ensures chip normal work.
Further, the alignment placement of first contact site 201a, 204a, 205a, 209a in Fig. 3 forms four sides
The second contact site in shape, Second terminal or Second terminal is arranged at first contact site 201a, 204a, 205a, 209a and is surrounded
Quadrangle in, can ensure the good contact of Second terminal and contact pilotage.Because the outermost of terminal group 200 is to be used to install inspection
The first contact site surveyed, then if in 10 installation process of print cartridge, chip 20 and printer contact pilotage 91a completes installation detection, then
Illustrate that all installation detection terminals (the first terminal) are all connected with place, then all positions in the polygon that the first contact site is formed
It can ensure that contact is good.Further, the quantity of the first contact site can be any number of more than 3, as long as
It is to meet the second contact site to can reach this beneficial effect in the polygon that the first contact site is formed.
Optionally, as shown in figure 3, the row L12 that first contact site 205a, 209a of the first terminal 205,209 is formed is compared
It is located at the front end of installation direction P in the row L21 where the second contact site, so-called front end is the downstream of installation direction P.This structure
It can cause, during print cartridge 10 is installed to mounting portion 90, the terminal for arranging L12 first touches contact pilotage 91a, is first installed
Detection, the Second terminal for then arranging L21 touch contact pilotage 91a again, and therefore, in installation process, contact pilotage 91a is first with being installed
The termination contact of detection, the termination contact being connected afterwards with memory, it is therefore prevented that chip 20 installation dislocation or with memory phase
The situation of the terminal connection error of connection.Further, on the vertical direction T of installation direction P, second group of installation detection contact
Portion 200b is in the outermost of all contact sites, and first group of installation detection contact site 200a is in time outside of all contact sites.Such as Fig. 3
Shown, second group of installation detects outermosts of the first contact site 205a and 209a of contact site 200b on vertical direction T, secondly
The first contact site 201a and 204a of contact site 200a is detected for first group of installation, most inner side is where remaining second contact site
Second terminal 202,203,206-208.Such layout, can equally realize the terminal (terminal of foregoing high voltage input
205th, 209 42V voltages are transfused to) in outermost, for the high terminal of voltage time, (terminal 201,204 is transfused to 2.4V electricity in secondary outside
Pressure), most inner side is the layout of the relatively low terminal (Second terminal is transfused to 3.3V voltages) of input voltage so that between terminals of adjacent
Voltage difference it is all small as far as possible so that non-contacting electromagnetic interference caused by reducing voltage difference and there is burr ripple, it is also favourable
In preventing terminal from the situation of wrong data signal occur, ensure chip normal work.
Embodiment two：
Fig. 4 is the schematic diagram of the chip upper contact part of embodiment two.Fig. 5 is the signal of the first chip of embodiment two
Figure.Fig. 6 is the schematic diagram of the first chip of embodiment two.Fig. 4 eliminates the terminal on chip, only embodies showing for contact site
It is intended to.Fig. 5 and Fig. 6 is the schematic diagram of two kinds of chips respectively.Fig. 7 a, Fig. 7 b are the chip knot of the first embodiment of embodiment two
Composition.Fig. 8 is the chip structure figure of the second embodiment of embodiment two.As Figure 4-Figure 6, the first terminal 201,204,
205th, 209 first contact site 201a, 204a, 205a, 209a forms row L11, row L12.Second terminal 202,203,206-
208 second contact site 202a, 203a, 206a-208a row of foring L21, row L22 on installation direction P.First contact site shape
Into multiple rows of (row L11, row L12) between be provided with a row or multi-row (row L21, the row L22) that the second contact site formed；Or
Person, multiple rows of (row L11, row that the first contact site is formed are provided between multiple rows of (row L21, row L22) that the second contact site is formed
L12), the beneficial effect of the application can still be reached.
Further, multiple rows of (row L21, the row L22) of multiple rows of (row L11, the row L12) of the first contact site and the second contact site
Between it is spaced one by one.I.e. on installation direction P, the first contact site forms first row L11, second row L12；Second contact site
Form the 3rd row L21, the 4th row L22；It is mutual one by one between first row L11, second row L12 and the 3rd row L21, the 4th row L22
Interval.So that the first contact site and the second contact site have sequentially formed row L21, row L11, row L22, row L12.This structure makes
The first terminal and Second terminal are obtained, it is spaced one by one between the first contact site and the second contact site in other words so that terminal
Design space is larger, is conducive to increase the spacing between each terminal, the electromagnetism reduced between terminal interferes with each other.
Optionally, as shown in figure 4, second row (row L12) (the row L12 that first contact site 205a, 209a is formed) ratio the 3rd
L21 and the 4th row L22 is arranged closer to the front of installation direction P, that is, the front end side that L12 is located at installation direction P is arranged, in print cartridge
During 10 are installed to mounting portion 90, the terminal for arranging L12 first touches contact pilotage 91a, first carries out installation detection, then arranges L22
Second terminal touch contact pilotage 91a again, therefore, can allow in installation process, first carry out installation detection, be connected afterwards with memory
The termination contact contact 91a connect, it is therefore prevented that the feelings of the installation of chip 20 dislocation or the terminal connection error being connected with memory
Condition.
Fig. 5 and Fig. 6 is two kinds of specific arrangement modes of terminal arrangement.As long as ensure contact site be the distribution mode of Fig. 4 i.e.
Can.Further, the arrangement mode of the terminal of chip 20 is not limited solely to the arrangement mode of Fig. 5 or Fig. 6, its arrangement mode can
It is a variety of to have.The different arrangement mode of terminal based on Fig. 4, belongs to the protection domain of the application.
It can be reseting terminal that terminal 202 is described in embodiment one, and terminal 203 can be clock terminal；Terminal 206 can
Think power supply terminal, terminal 207 can be ground terminal, and terminal 208 can be data terminal；The Second terminal of terminal group 200
In terminal 206-208 it is more important compared to terminal 202, terminal 203.Optionally, as shown in figure 5, the first contact site 201a,
The layout of 204a, 205a, 209a form a virtual quadrangle, and a part of terminal 206-208 in Second terminal is set
In the range of this quadrangle, terminal (being terminal 206-208 in the present embodiment) important in Second terminal is arranged at
In the quadrangle that the first terminal surrounds, the good contact of these terminals can be ensured (in other words, the weight for being more susceptible to effect of signals
The communication terminal wanted is arranged far from the region of four the first terminals).In 10 installation process of print cartridge, chip 20 and printer
Contact pilotage 91a completes installation detection, then illustrates that all installation detections (the first terminal) are all connected with place, then the first contact site is formed
All positions can ensure that contact is good in polygon.Thereby it is ensured that end important in Second terminal
The good contact of sub (being terminal 206-208 in the present embodiment).Further, the quantity of the first contact site can be 3 with
On, as long as meet the second contact site can reach this beneficial effect in the polygon that the first contact site is formed.
Further, print cartridge 10 is installed to 90 print cartridge of mounting portion can certain moving range on width T, it is possible to
There is situations below：Chip 20 has installed, but the first terminal (installation detection terminal) is not in contact with contact pilotage 91a.
The described chip of the present embodiment can solve the appearance of this situation, what the row that the first terminal is formed was formed with Second terminal
Row can increase the width of each terminal not in same row, and increase width will avoid such a situation from occurring.
Further, the first terminal can be prevented since the foreign matter (such as ink) inadvertently fallen off covers away from Second terminal
Lid the first terminal and Second terminal, cause short circuit between the two, cause the damage of chip or printer.It is that is, every
Between a first contact site, between each second contact site, the distance between each first contact site and each second contact site
More than or equal to pre-determined distance threshold value.Wherein, which can be applied by those skilled in the art according on each terminal
The size of magnitude of voltage be preset as a variety of different values, can reduce so as to fulfill above-mentioned technique effect and further each
Signal between terminal interferes with each other.
Remaining and embodiment one are identical.
It is two kinds of embodiments of the present embodiment below.
First embodiment：
Fig. 7 a, Fig. 7 b are the chip structure figure of the first embodiment of embodiment two.As shown in Fig. 7 a, Fig. 7 b, chip 20
With Part I 21, Part II 22.Second terminal 202,203,206-208 are arranged on Part I 21；The first terminal
201st, 204,205,209 it is arranged on Part II 22.
Part I 21 with Part II 22 is fabricated by two pieces of circuit substrates 21a, 22a, then by Part I
21 with Part II 22 using weld, paste, be clamped etc. mode fixation will together with, eventually form chip 20.
Chip 20 is manufactured into using two pieces of circuit substrates 21a, 22a, can cause the terminal on Part I 21 and second
Terminal on part 22 is located on different height so that contacts the difference of contact pilotage 91a respectively when being in contact with contact pilotage 91a
Position, to realize the first contact site and the second contact site reaches layout such as Fig. 4.
Chip 20 also has：Additional terminal 210,211, fixed part 251,252,253.Additional terminal 210,211 not with peace
Contact pilotage 91a in dress portion 90 is in contact, its act on can be between the terminal for preventing terminal group 200 short circuit or with contact pilotage 91a
Contact pilotage 91a is scraped when contact so as to clean the effect of contact pilotage 91a.Can be by chip 20 by fixed part 251,252,253
Fixed on print cartridge 10, prevent chip 20 from departing from from print cartridge 10.
Second embodiment：
Fig. 8 is the chip structure figure of the second embodiment of embodiment two.As shown in figure 8, chip 20 has a base
Plate 20a.Chip 20 also has：Additional terminal 210,211, fixed part 251,252, further includes, breakthrough part 255；Breakthrough part 255 exists
Run through the chip on the thickness direction of chip.Additional terminal 210,211, fixed part 251,252 are implemented with the first of the present embodiment
Mode is consistent, is not repeated to illustrate.Breakthrough part 255 is used to accommodate contact pilotage 91a so that the first terminal contacts respectively with Second terminal
The diverse location of contact pilotage 91a, to realize the first contact site and the second contact site reaches layout such as Fig. 4.Thickness direction is and peace
Fill direction P, width T direction vertical at the same time.In present embodiment, the thickness direction of chip is also most short with the chip
The parallel direction of edge direction.The thickness direction of chip and perpendicular where terminal.
Embodiment three：
Fig. 9 is the schematic diagram of the chip upper contact part of embodiment three.Figure 10 is the core of the first embodiment of embodiment three
Chip architecture figure.Figure 11 is the chip structure figure of the second embodiment of embodiment three.Figure 12 is the 3rd embodiment party of embodiment three
The chip structure figure of formula.Figure 13 a, Figure 13 b are the chip structure figure of the 4th embodiment of embodiment three.Figure 14 a, Figure 14 b are
The chip structure figure of 5th embodiment of embodiment three.Wherein, Fig. 9 eliminates the terminal on chip, only embodies contact site
Schematic diagram.Figure 10 to Figure 14 b is the structure chart of 5 kinds of chips respectively.As shown in figure 9, the first terminal 201,204,205,209
First contact site 201a, 204a, 205a, 209a forms row L11, row L12.Second terminal 202,203, the second of 206-208
Contact site 202a, 203a, 206a-208a row of foring L21, row L22 on installation direction P.First contact site is formed multiple rows of
It is provided between (row L11, row L12) a row or multi-row (row L21, row L22) that the second contact site is formed；Alternatively, second connects
Multiple rows of (row L11, row L12) that the first contact site is formed is provided between multiple rows of (row L21, row L22) that contact portion is formed, still may be used
To reach the beneficial effect of the application.
Further, arrange spaced one by one between L11, row L12 and row L21, row L22.I.e. on installation direction P, the
One contact site forms first row L11, second row L12；Second contact site forms the 3rd row L21, the 4th row L22；First row L11,
It is spaced one by one between second row L12 and the 3rd row L21, the 4th row L22.So that contacted along installation direction P, first
Portion has sequentially formed row L11, row L21, row L12, row L22 with the second contact site.This structure causes the first terminal and Second terminal,
Spaced one by one between first contact site and the second contact site in other words, the design space of terminal is larger.
Optionally, as shown in figure 9, the 4th row L22 than first row L11 and second row L12 closer to the front end of installation direction
Side, that is, arrange the front end side that L22 is located at installation direction P.
The function of the terminal of terminal group 200 is not restricted to the terminal function described in embodiment three, in Second terminal
Terminal 202, terminal 203 are more important compared to terminal 206-208.As shown in figure 9, first contact site 201a, 204a, 205a, 209a
Layout form a virtual quadrangle, a part of terminal 202, terminal 203 in Second terminal are set in this quadrangle
In the range of, terminal (being terminal 202, terminal 203 in the present embodiment) important in Second terminal is arranged at first end
In the quadrangle that son surrounds, it can ensure that good contact (in other words, is set the important communication terminal for being more susceptible to effect of signals
In the region away from four the first terminals).In 10 installation process of print cartridge, chip 20 and printer contact pilotage 91a completes to install
Detection, then illustrate that all installation detections (the first terminal) are all connected with place, then first contact site 201a, 204a, 205a, 209a shape
Into polygon in all position can ensure that contact is good.It is thereby it is ensured that important in Second terminal
Terminal (being terminal 202, terminal 203 in the present embodiment) good contact.
Remaining and embodiment two are identical.
It is four kinds of embodiments of the present embodiment below.
First embodiment：
Figure 10 is the chip structure figure of the first embodiment of embodiment three.As shown in Figure 10, chip 20 has first
Divide 21, Part II 22.The first terminal 201,204,205,209 is arranged on Part I 21；Second terminal 202,203,
206-208 is arranged on Part II 22.
Part I 21 from Part II 22 is fabricated by 2 pieces of different circuit substrate 21a, 22a, then by first
Part 21 and Part II 22 using weld, paste, be clamped etc. mode fixation will together with, eventually form chip 20.
Chip 20 is manufactured into using two pieces of circuit substrates 21a, 22a, can cause the terminal on Part I 21 and second
Terminal on part 22 is located on different height so that contacts the difference of contact pilotage 91a respectively when being in contact with contact pilotage 91a
Position, to realize the first contact site and the second contact site reaches layout such as Fig. 9.
Chip 20 also has：Fixed part 251,252,253.Chip 20 can be fixed by fixed part 251,252,253
Onto print cartridge 10, prevent chip 20 from departing from from print cartridge 10.
Chip 20 can also have additional terminal (not shown in figure, to may be referred to setting for additional terminal 210,211 in Fig. 8
Put mode), additional terminal is not in contact with the contact pilotage 91a in mounting portion 90, and it can be the terminal for preventing terminal group 200 that it, which is acted on,
Between short circuit or contact pilotage 91a is scraped when contacted with contact pilotage 91a so as to clean the effect of contact pilotage 91a.
Second embodiment：
Figure 11 is the chip structure figure of the second embodiment of embodiment three.As shown in figure 11, chip 20 has one
Substrate 20a.Chip 20 also has：Additional terminal 210,211, fixed part 251,252, breakthrough part 255.Additional terminal 210,211,
Fixed part 251,252 is consistent with the first embodiment of the present embodiment, is not repeated to illustrate.Breakthrough part 255 is used to accommodate contact pilotage
91a so that the first terminal contacts the diverse location of contact pilotage 91a with Second terminal respectively, to realize that the first contact site and second connects
Contact portion reaches the layout such as Fig. 9.
The breakthrough part 255 of the perforation chip 20 of this embodiment is respectively positioned at Second terminal 202,203, the width of 206-208
Spend the both sides of direction T, this structure cause by penetrate through the breakthrough part 255 of chip 20 by the first terminal 201,204,205,209 with
Second terminal 202,203,206-208 are spatially separated, and further prevent foreign matter (such as ink due to inadvertently falling off
Deng) the first terminal and Second terminal are covered, cause short circuit between the two, cause the damage of chip or printer.Such as ink
When water is dropped between the first terminal and Second terminal, the breakthrough part 255 of perforation chip 20 can allow ink to be led at breakthrough part 255
The lower section of chip 20 is flowed to without remaining on the upper surface (surface for being provided with terminal) of chip 20.
3rd embodiment：
Figure 12 is the chip structure figure of the 3rd embodiment of embodiment three.As shown in figure 12, the first terminal 201,204,
205th, 209 be relative to substrate 20a be prominent.The first terminal 201,204,205,209 can be connected by modes such as welding
It is connected on substrate 20a.That is, the first contact site on the first terminal 201,204,205,209 (does not show in Figure 12
Go out) compared with positioned at Second terminal 202,203, the second contact site (not shown in Figure 12) on 206-208 relative to substrate 20a
It is more prominent.
Further, the first terminal 201,204,205,209 relative to substrate 20a protrude, Second terminal 202,203,
206-208 is arranged on substrate 20a；The first terminal 201,204,205,209 is with Second terminal 202,203,206-208 in height
On have difference in height so that the first terminal contacts the diverse location of contact pilotage 91a with Second terminal respectively, with realize the first contact site and
Second contact site reaches the layout such as Fig. 9.
The first terminal 201,204,205,209 relative to substrate 20a protrude, this structure by the first terminal 201,204,205,
209 spatially separate with Second terminal 202,203,206-208, further prevent due to the foreign matter that inadvertently falls off (such as
Ink etc.) the first terminal and Second terminal are covered, cause short circuit between the two, cause the damage of chip or printer.
4th embodiment：
Figure 13 a, Figure 13 b are the chip structure figure of the 4th embodiment of embodiment three.As shown in Figure 13 a, Figure 13 b, the
One terminal 201,204,205,209 is arranged on Part II 22, and Second terminal 202,203,206-208 are arranged on Part I 21
Substrate 21a on；Terminal hole 201b, 204b, 205b, 209b are provided with Part I 21, for setting on Part II 22
The terminal (the first terminal 201,204,205,209) for being equipped with contact site is passed through and protruded relative to Part I 21.That is, second
22 the first terminal 201,204,205,209 is divided to pass through terminal hole 201b, 204b, 205b, 209b and relative to Part I 21
It is prominent.The first terminal 201,204,205,209 has difference in height in height with Second terminal 202,203,206-208 so that the
One terminal contacts the diverse location of contact pilotage 91a with Second terminal respectively, with realize the first contact site and the second contact site reach as
The layout of Fig. 9.Part II 22 can either conductive metallic material be made or the substrate of Part II 22 by electric silica gel
22a is made of nonconducting baseplate material, and the first terminal 201,204,205,209 is made of an electrically conducting material.
Remaining is consistent with the 3rd embodiment of the present embodiment.
5th embodiment：
Figure 14 a, Figure 14 b are the chip structure figure of the 5th embodiment of embodiment three.As shown in Figure 14 a, Figure 14 b, core
Piece 20 is made of Part I 21, Part II 22.Part II 22 is to be used to carry chip and can be fixed to print cartridge box body
On chip carrier.First group of installation detection terminal 201,204 in the first terminal is arranged on Part II 22.In the first terminal
First group of installation detection terminal 205,209 be arranged on the substrate 21a of Part I 21, Second terminal 202,203,206-
208 (not shown)s are arranged on the substrate 21a of Part I 21.Terminal hole 201b, 204b are provided with Part I 21,
The first terminal 201,204 of Part II 22 is dashed forward through terminal hole 201b, 204b and relative to the substrate 21a of Part I 21
Go out.The first terminal 205,209 is protruded relative to the substrate 21a of Part I 21, and the first terminal 205,209 can be by being arranged on base
Cushion block or convex block and then copper facing on plate 21a are formed.The first terminal 201,204,205,209 and Second terminal 202,203,
206-208 has difference in height in height so that the first terminal contacts the diverse location of contact pilotage 91a with Second terminal respectively, with reality
Existing first contact site and the second contact site reach the layout such as Fig. 9.The same of the first terminal 201,204 is provided with Part II 22
When, also act as the effect (carry chip and be fixed on the box body of print cartridge) of chip carrier.Such a structure reduces cartridge parts
Quantity, so as to have the function that to reduce cost.Part II 22 can be made of electric silica gel or conductive metallic material,
Or the substrate 22a of Part II 22 is made of nonconducting baseplate material, the first terminal 201,204,205,209 is by conduction
Material is made.Part II 22 can be made of electric silica gel, so when chip 20 contacts contact pilotage 91a, second
Divide 22 can produce certain deformation, avoid because the terminal on chip 20 and contact pilotage 91a occur hard contact and cause terminal quilt
Abrasion or situation about scratching.
Remaining is consistent with the 3rd embodiment of the present embodiment.
Example IV：
Figure 15 is the schematic diagram of the chip of example IV.Figure 16 is the chip structure of the first embodiment of example IV
Figure.Figure 17 is the chip structure figure of the second embodiment of example IV.Figure 16 and Figure 17 is the structure chart of two kinds of chips respectively.
As shown in figure 15, first contact site 201a, 204a, 205a, 209a of the first terminal 201,204,205,209 is (not shown in figure
Mark) form first row (row L11), second row (row L12).Second terminal 202,203, the second contact site of 206-208
202a, 203a, 206a-208a (being identified not shown in figure) form the 3rd row (row L21), the 4th row (row on installation direction P
L22).Be provided between multiple rows of (row L11, row L12) that first contact site is formed the second contact site formed it is a row or multi-row
(row L21, row L22)；Alternatively, it is provided with the first contact site institute shape between multiple rows of (row L21, row L22) that the second contact site is formed
Into multiple rows of (row L11, row L12), can still reach the beneficial effect of the application.
Further, the first contact site forms first row (row L11), second row (row L12)；Second contact site forms the 3rd
Row (row L21), the 4th row (row L22)；First row (row L11), second row (row L12) are arranged on the 3rd row (row L21), the 4th row
Between (row L22).I.e. along on installation direction P, the first contact site and the second contact site have sequentially formed row L21, row L11, row
L12, row L22.This structure causes the 3rd row (row L21) of the second contact site formation, the 4th row (row L22) in the first contact site institute
The first row (row L11) of formation, the peripheral side of second row (row L12), second contact site 202a, 203a, 206a-208a exist completely
The periphery of first contact site 201a, 204a, 205a, 209a, second contact site 202a, 203a, 206a-208a are located at multiple first
Outside the region for the polygon (the present embodiment is quadrangle) that contact site 201a, 204a, 205a, 209a are formed, further prevent
The interference of electric signal between the first terminal and Second terminal.
Remaining and embodiment three are identical.
It is two kinds of embodiments of the present embodiment below.
First embodiment：
Figure 16 is the chip structure figure of the first embodiment of embodiment five.As shown in figure 16, chip 20 has first
Divide 21, Part II 22.Terminal 202,203 and terminal 205,209 are arranged on Part I 21；Terminal 201,204,206-
208 are arranged on Part II 22.
Part I 21 from Part II 22 is fabricated by 2 pieces of different circuit substrate 21a, 22b, then by first
Part 21 and Part II 22 using weld, paste, be clamped etc. mode fixation will together with, eventually form chip 20.
Chip 20 is manufactured into using 2 pieces of circuit substrates 21a, 22b, can cause the terminal on Part I 21 and second
The terminal divided on 22 is located on different height so that contacts the different positions of contact pilotage 91a respectively when being in contact with contact pilotage 91a
Put, to reach the layout such as Figure 15.
Chip 20 also has an additional terminal 210,211, additional terminal 210,211 not with the contact pilotage 91a phases in mounting portion 90
Contact, its act on can be between the terminal for preventing terminal group 200 short circuit or contacted with contact pilotage 91a when scrape contact pilotage
91a is so as to clean the effect of contact pilotage 91a.
Second embodiment：
Figure 17 is the chip structure figure of the second embodiment of embodiment five.As shown in figure 17, terminal 202,203,205,
209 are arranged on Part II 22, and terminal 201,204,206-208 are arranged on the substrate 21a of Part I 21；Part I 21
On be provided with terminal hole 202b, 203b, 205b, 209b, the terminal 202,203,205,209 of Part II 22 passes through terminal hole
202b, 203b, 205b, 209b and protruded relative to Part I 21, terminal 202,203,205,209 and terminal 201,204,
206-208 has difference in height in height so that terminal contacts the diverse location of contact pilotage 91a respectively, with realize the first contact site and
Second contact site reaches the layout such as Figure 15.Part II 22 can be made of electric silica gel or conductive metallic material, or
The substrate 22a of person's Part II 22 is made of nonconducting baseplate material, and the first terminal 201,204,205,209 is by conduction material
Material is made.
Remaining is consistent with the first embodiment of the present embodiment.
The present invention also provides a kind of print cartridge, includes any chip that above-described embodiment describes.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God and any modification, equivalent substitution, improvement and etc. within principle, done, should be included within the scope of protection of the invention.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modifications or replacement, the essence of appropriate technical solution is departed from the scope of various embodiments of the present invention technical solution.
Claims (23)
1. a kind of chip, for installation on print cartridge, the print cartridge is used to be installed in printer in assembly direction the chip
Mounting portion in；The chip includes memory, the first contact site for installing detection, the second contact site；At least one institute
The second contact site is stated to be electrically connected with the memory；First contact site and second contact site are beaten with described respectively
Contact pilotage in print machine is in contact；It is characterized in that：
First contact site is in multiple rows of arrangement on the installation direction；
On the installation direction, first contact site formed it is multiple rows of between be provided with the row that the second contact site is formed
It is or multiple rows of；Alternatively, second contact site formed it is multiple rows of between be provided with first contact site formed it is multiple rows of.
2. chip according to claim 1, first contact site includes：The first group of installation detection contact being connected with each other
Portion, the second group of installation detection contact site being connected with each other；First group of installation detection contact site and second group of installation inspection
It is in multiple rows of arrangement on the installation direction to survey contact site.
3. chip according to claim 2, first group of installation detection contact site forms the on the installation direction
One row；Second group of installation detection contact site forms second row on the installation direction；Second contact site is formed
A row or multi-row be arranged between the first row and the second row.
4. chip according to claim 3, first group of installation detection contact site is connected by conducting wire, described the
Two groups of installation detection contact sites are connected by resistance；The voltage that second group of installation detection contact site is applied in is higher than institute
State the voltage of first group of installation detection contact site.
5. chip according to claim 3, the ground connection that second contact site includes with the memory not being connected connects
Contact portion；Further include the electrical power contacts portion being connected with memory, data exposure portion, reset contact site.
6. chip according to claim 1, the chip includes：Multiple the first terminals, multiple Second terminals；It is multiple described
First contact site is arranged on multiple the first terminals, and multiple second contact sites are arranged on multiple Second terminals
On.
7. chip according to claim 6, the chip includes：Multiple the first terminals, multiple Second terminals；In the peace
Fill on direction, the first terminal formed it is multiple rows of between be provided with Second terminal formed it is a row or multi-row.
8. chip according to claim 1, the multiple rows of and row of second contact site that first contact site is formed
Or it is multiple rows of between it is spaced.
9. according to any chips of claim 1-8, in the mounting direction, first contact site it is multiple rows of with described the
Two contact sites it is multiple rows of between it is spaced one by one.
10. chip according to claim 9, in the mounting direction, first contact site form first row, second row；
Second contact site forms the 3rd row, the 4th row；It is spaced one by one between first row, second row and the 3rd row, the 4th row.
11. chip according to claim 10, the second row is than the 3rd row and the 4th row closer to described
The front of installation direction.
12. chip according to claim 10,
First row described in 4th parallelism and the second row are closer to the front of the installation direction.
13. chip according to claim 9, the chip includes Part I, Part II；The Part I and institute
Stating Part II is fabricated by two pieces of circuit substrates.
14. chip according to claim 13, the Part I and the substrate that the Part II is by different materials
It is made；The Part II is made of electric silica gel or conductive metallic material.
15. chip according to claim 13, second contact site is arranged on the Part I, and described first connects
Contact portion is arranged on the Part II.
16. chip according to claim 9, the chip further includes breakthrough part；Thickness of the breakthrough part in the chip
Degree side extends upward through the chip.
17. chip according to claim 9, the chip further includes substrate, and first contact site connects with described second
Contact portion is compared more prominent relative to substrate.
18. chip according to claim 13, terminal hole is provided with the Part I, for setting on Part II
The terminal for being equipped with contact site is passed through and protruded relative to Part I.
19. chip according to claim 9, in the mounting direction, first contact site form first row, second row；
Second contact site forms the 3rd row, the 4th row；First row, second row are arranged between the 3rd row, the 4th row.
20. chip according to claim 1, in the vertical direction of the installation direction, second group of installation detection connects
Contact portion is in the outermost of all contact sites, and first group of installation detection contact site is in time outside of all contact sites.
21. chip according to claim 1, first contact site is compared to second contact site in the installation
The front end in direction；The front end is the downstream of the installation direction.
22. chip according to claim 1, between each first contact site, between each second contact site,
The distance between each first contact site and each second contact site are more than or equal to pre-determined distance threshold value.
23. a kind of print cartridge, including any chip in claim 1 to 22.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210006104.8A CN115246270B (en) | 2017-10-12 | 2017-12-21 | Chip and ink box |
| PCT/CN2018/099628 WO2019072010A1 (en) | 2017-10-12 | 2018-08-09 | Chip and ink cartridge |
| EP18865563.3A EP3666527B1 (en) | 2017-10-12 | 2018-08-09 | Chip and ink cartridge |
| JP2018172903A JP7261553B2 (en) | 2017-10-12 | 2018-09-14 | chip and ink cartridge |
| JP2023014785A JP7442702B2 (en) | 2017-10-12 | 2023-02-02 | Chips and ink cartridges |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721313686 | 2017-10-12 | ||
| CN2017213136865 | 2017-10-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210006104.8A Division CN115246270B (en) | 2017-10-12 | 2017-12-21 | Chip and ink box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107901611A true CN107901611A (en) | 2018-04-13 |
| CN107901611B CN107901611B (en) | 2023-06-20 |
Family
ID=61869596
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711397088.5A Active CN107901611B (en) | 2017-10-12 | 2017-12-21 | Chip and ink box |
| CN201721807245.0U Active CN207790032U (en) | 2017-10-12 | 2017-12-21 | Chip and print cartridge |
| CN202210006104.8A Active CN115246270B (en) | 2017-10-12 | 2017-12-21 | Chip and ink box |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721807245.0U Active CN207790032U (en) | 2017-10-12 | 2017-12-21 | Chip and print cartridge |
| CN202210006104.8A Active CN115246270B (en) | 2017-10-12 | 2017-12-21 | Chip and ink box |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3666527B1 (en) |
| JP (2) | JP7261553B2 (en) |
| CN (3) | CN107901611B (en) |
| WO (1) | WO2019072010A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019072010A1 (en) * | 2017-10-12 | 2019-04-18 | 珠海纳思达企业管理有限公司 | Chip and ink cartridge |
| CN110936723A (en) * | 2019-06-28 | 2020-03-31 | 珠海纳思达企业管理有限公司 | Ink box |
| CN113942313A (en) * | 2021-09-10 | 2022-01-18 | 珠海天威技术开发有限公司 | Connecting piece, consumable chip, consumable container, electronic imaging device, and method for mounting connecting piece and consumable container |
| CN113954525A (en) * | 2021-09-30 | 2022-01-21 | 珠海天威技术开发有限公司 | Connecting piece, consumable chip, electronic imaging device, method for mounting connecting piece and consumable container |
| CN114089614A (en) * | 2021-12-31 | 2022-02-25 | 珠海益捷科技有限公司 | A kind of container |
| CN114475003A (en) * | 2021-12-16 | 2022-05-13 | 珠海天威技术开发有限公司 | Consumable container, consumable chip and electronic imaging device |
| CN115257187A (en) * | 2021-04-30 | 2022-11-01 | 无锡翼盟电子科技有限公司 | PCB structure for bearing ink box chip |
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| JP7256331B2 (en) * | 2019-06-28 | 2023-04-11 | ジュハイ ナインスター マネージメント カンパニー リミテッド | Ink container tip and ink container |
| CN212796256U (en) * | 2020-07-03 | 2021-03-26 | 珠海纳思达企业管理有限公司 | Chip and ink box |
| CN215970705U (en) | 2021-07-19 | 2022-03-08 | 浙江鼎旗微电子科技有限公司 | Consumable chip and consumable box with same |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3666527A4 (en) | 2020-12-02 |
| WO2019072010A1 (en) | 2019-04-18 |
| CN207790032U (en) | 2018-08-31 |
| CN115246270A (en) | 2022-10-28 |
| CN107901611B (en) | 2023-06-20 |
| JP7442702B2 (en) | 2024-03-04 |
| JP2023052865A (en) | 2023-04-12 |
| CN115246270B (en) | 2024-03-12 |
| EP3666527B1 (en) | 2021-12-22 |
| JP2019073004A (en) | 2019-05-16 |
| JP7261553B2 (en) | 2023-04-20 |
| EP3666527A1 (en) | 2020-06-17 |
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