CN115241233A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN115241233A
CN115241233A CN202210656960.8A CN202210656960A CN115241233A CN 115241233 A CN115241233 A CN 115241233A CN 202210656960 A CN202210656960 A CN 202210656960A CN 115241233 A CN115241233 A CN 115241233A
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CN
China
Prior art keywords
substrate
layer
display panel
display
ultraviolet absorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210656960.8A
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Chinese (zh)
Inventor
黄辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL Huaxing Photoelectric Technology Co Ltd
Original Assignee
TCL Huaxing Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL Huaxing Photoelectric Technology Co Ltd filed Critical TCL Huaxing Photoelectric Technology Co Ltd
Priority to CN202210656960.8A priority Critical patent/CN115241233A/en
Publication of CN115241233A publication Critical patent/CN115241233A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The embodiment of the invention discloses a display panel and a display device, wherein the display panel comprises a display substrate and a packaging cover plate, the display substrate comprises a substrate and a light-emitting device layer, the packaging cover plate comprises a packaging substrate, a filling adhesive layer and an ultraviolet absorption layer, the packaging substrate comprises a middle area and a peripheral area surrounding the middle area, the filling adhesive layer is arranged on one side, close to the substrate, of the packaging substrate and is positioned in the middle area, and the ultraviolet absorption layer covers one side, close to the substrate, of the filling adhesive layer and is positioned in the middle area. When the filling adhesive layer is subjected to UV curing by adopting UV light on one side of the packaging cover plate, which is far away from the display substrate, the residual UV light can be absorbed by the ultraviolet absorption layer and cannot be injected into the luminescent device layer, so that the damage of luminescent materials is avoided; simultaneously, the pressfitting homogeneity of filling the glue film obtains promoting, and plywood pressfitting stress point distributes more evenly.

Description

Display panel and display device
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a display device.
Background
In the prior OLED display panel, a film packaging mode is mostly adopted for water and oxygen blocking, but the film packaging film layer is thin and has stress between film layers, so that the water and oxygen blocking capability does not achieve the required effect.
To enhance the packaging effect, the packaging is currently performed by using a packaging cover plate 20, as shown in fig. 1, which is a schematic film structure of a display panel in the prior art, as shown in fig. 2, which is a schematic plane structure of the packaging cover plate in fig. 1, as can be seen from fig. 1 and 2, the display panel 100 includes a substrate 11, a light emitting device layer 12, and a film packaging layer 13, which are stacked, and when the packaging is performed by using the packaging cover plate 20, a filling adhesive layer 22 covering the film packaging layer 13 is formed on a packaging substrate 21 in advance, and the filling adhesive layer 22 usually uses an Ultraviolet (UV) curing process. However, during UV curing, the ultraviolet portion of the UV light may cause damage to the material in the thin film transistor device or light emitting device layer 12, resulting in accelerated material degradation and reduced device performance and lifetime.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, and aims to solve the technical problem that materials in a thin film transistor device or a light-emitting device layer are easily damaged by ultraviolet light when an existing display panel is packaged by a packaging cover plate.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the invention provides a display panel, which comprises a display substrate and an encapsulation cover plate arranged on one side of the display substrate, wherein the display substrate comprises a substrate and a light-emitting device layer arranged on one side of the substrate, which is close to the encapsulation cover plate; the package cover plate includes:
a package substrate including a middle region and a peripheral region surrounding the middle region;
the filling adhesive layer is arranged on one side of the packaging substrate close to the substrate and is positioned in the middle area; and
and the ultraviolet absorption layer is covered on one side of the filling adhesive layer close to the substrate and is positioned in the middle area.
According to the display panel provided by the invention, the packaging cover plate further comprises a barrier layer, the barrier layer is arranged on one side of the packaging base plate close to the substrate and is positioned in the peripheral area, the barrier layer forms an annular groove surrounding the middle area, and the filling adhesive layer and the ultraviolet absorption layer are filled in the annular groove; wherein the height of the barrier layer is greater than or equal to the height of the ultraviolet absorption layer.
According to the display panel provided by the invention, the height of the barrier layer is equal to the distance between the packaging substrate and the display substrate.
According to the display panel provided by the invention, the height range of the barrier layer is more than 500 nanometers.
According to the display panel provided by the invention, the material of the barrier layer comprises an inorganic barrier material, and the inorganic barrier material comprises one or more of silicon oxide, silicon nitride and silicon oxynitride.
According to the display panel provided by the invention, the material of the ultraviolet absorption layer comprises metal oxide or organic compound, the metal oxide comprises one or more of iron oxide, zinc oxide and titanium oxide, and the organic compound comprises one of salicylate and benzophenone.
According to the display panel provided by the invention, the filling adhesive layer comprises a plurality of filling particles, and the height of the ultraviolet absorption layer is greater than the particle size of the filling particles.
According to the display panel provided by the invention, the height range of the ultraviolet absorption layer is 100-500 nanometers.
According to the display panel provided by the invention, the display substrate further comprises a thin film packaging layer, the thin film packaging layer covers one side of the light-emitting device layer, which is far away from the substrate, and the ultraviolet absorption layer is positioned on one side of the thin film packaging layer, which is far away from the array substrate.
The invention provides a display device which comprises the display panel.
The invention has the beneficial effects that: according to the display panel and the display device, the filling adhesive layer is arranged on one side, close to the substrate, of the packaging adhesive layer, the ultraviolet absorption layer is arranged on one side, close to the substrate, of the filling adhesive layer, the filling adhesive layer and the ultraviolet absorption layer are located in the middle area of the packaging base plate, when the UV light is adopted on one side, far away from the display base plate, of the packaging cover plate to carry out UV curing on the filling adhesive layer, the residual UV light after curing or the UV light with the wavelength not generating the curing effect can be completely absorbed by the ultraviolet absorption layer and cannot be emitted into the light-emitting device layer, so that the damage of a light-emitting material is avoided, and the service life of the display panel is prolonged; simultaneously, because the ultraviolet absorption layer covers the filling adhesive layer for the pressfitting homogeneity of filling adhesive layer obtains promoting, and plywood pressfitting stress point distributes more evenly.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a diagram illustrating a film structure of a display panel in the prior art;
FIG. 2 is a schematic plan view of the package cover plate of FIG. 1;
fig. 3 is a schematic diagram of a film structure of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic plan view of the package cover plate in fig. 3;
fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 6A to 6F are schematic flow structure diagrams of a method for manufacturing a display panel according to an embodiment of the invention.
Description of reference numerals:
100. a display panel;
10. a display substrate; 11. a substrate; 12. a light emitting device layer; 13. a thin film encapsulation layer;
20. packaging the cover plate; 21. a package substrate; 22. filling the adhesive layer; 221. filling particles; 23. an ultraviolet absorbing layer; 24. a barrier layer; 241. an annular groove; 25. and (6) sealing the frame glue layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Furthermore, it should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, and are not intended to limit the present invention. In the present invention, unless otherwise specified, the use of directional terms such as "upper" and "lower" generally means upper and lower in the actual use or operation of the device, particularly in the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
According to the display panel and the display device, the filling adhesive layer is arranged on one side, close to the substrate, of the packaging adhesive layer, the ultraviolet absorption layer is arranged on one side, close to the substrate, of the filling adhesive layer, the filling adhesive layer and the ultraviolet absorption layer are located in the middle area of the packaging substrate, when the UV light is adopted to carry out UV curing on the filling adhesive layer on one side, far away from the display substrate, of the packaging cover plate, the residual UV light after curing or the UV light with the wavelength without the curing effect can be completely absorbed by the ultraviolet absorption layer and cannot enter the light-emitting device layer, so that the damage of a light-emitting material is avoided, and the service life of the display panel is prolonged; simultaneously, because the ultraviolet absorption layer covers the filling adhesive layer for the pressfitting homogeneity of filling adhesive layer obtains promoting, and plywood pressfitting stress point distributes more evenly.
For a better understanding of the technical solutions and effects of the present invention, the following detailed description of specific embodiments will be given with reference to the accompanying drawings.
Referring to fig. 3 and 4, fig. 3 is a schematic diagram of a film structure of a display panel according to an embodiment of the present invention, and fig. 4 is a schematic diagram of a planar structure of the package cover plate in fig. 3. The embodiment of the invention provides a display panel 100, where the display panel 100 includes a display substrate 10 and a package cover plate 20, the package cover plate 20 is disposed on one side of the display substrate 10, and the display substrate 10 includes a substrate 11 and a light emitting device layer 12 disposed on one side of the substrate 11 close to the package cover plate 20.
The package cover plate 20 comprises a package substrate 21, a filling adhesive layer 22 and an ultraviolet absorption layer 23, wherein the package substrate 21 comprises a middle area and a peripheral area surrounding the middle area. The filling adhesive layer 22 is disposed on one side of the package substrate 21 close to the substrate 11 and located in the middle region, and the ultraviolet absorption layer 23 is covered on one side of the filling adhesive layer 22 close to the substrate 11 and located in the middle region.
The display panel 100 may be an active matrix organic light emitting diode display panel 100 or a passive matrix organic light emitting diode display panel 100 according to a driving type. Although not shown, a driving circuit layer for driving the light emitting devices in the light emitting device layer 12 to emit light is further provided between the substrate 11 and the light emitting device layer 12, and the driving circuit layer includes an active matrix driving circuit or a passive matrix driving circuit. The display panel 100 further includes other functional structures, not shown, such as a pixel definition layer and a touch layer.
The display panel 100 may be a rigid display panel or a flexible display panel. The substrate 11 of the display panel 100 may be glass, plastic, or a flexible substrate according to its type. The flexible substrate may include two flexible substrates and a barrier layer disposed between the two flexible substrates. The materials of the two flexible substrates are respectively and independently selected from one of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyarylate (PAR), polycarbonate (PC), polyetherimide (PEI) and Polyethersulfone (PES). The material of the barrier layer may be selected from inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and a laminate thereof, for preventing water vapor from diffusing from the flexible substrate to the driving circuit layer.
In the direction away from the substrate 11, the light emitting device layer 12 includes a first electrode, a hole injection layer, a hole transport layer, a light emitting material layer, an electron transport layer, an electron injection layer, and a second electrode, which are sequentially stacked, and when the display panel 100 is in a top emission structure, the first electrode is an anode, the second electrode is a cathode, and when the display panel 100 is in a bottom emission structure, the first electrode is a cathode, and the second electrode is an anode.
The packaging substrate 21 is a transparent substrate, so that UV light can penetrate through the packaging substrate 21 and irradiate the inside of the filling adhesive layer 22, and the filling adhesive layer 22 is cured. Specifically, the package substrate 21 may be a rigid substrate such as glass, transparent resin, or the like, or may be a flexible substrate such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyarylate, or glass fiber reinforced plastic, or the like.
The filling adhesive layer 22 is made of adhesive material filled with drying agent, plays a role in absorbing water and oxygen, is arranged in the middle area in an array mode, the filling adhesive layer 22 comprises a plurality of filling particles 221, the filling adhesive layer 22 is dropped in a droplet shape, and after dropping, the filling adhesive layer 22 is mixed with each other to form a dough-like object, and the dough-like object is gradually leveled. Specifically, the material of the filling glue layer 22 may be a water-absorbing material, and optionally, the water-absorbing material includes one or a mixture of epoxy resin (polymer) and calcium oxide.
The ultraviolet absorption layer 23 is used for absorbing the UV light incident to the filling adhesive layer 22, and when the filling adhesive layer 22 is UV cured, the ultraviolet absorption layer 23 may absorb the remaining UV light after curing or the UV light with the wavelength which does not produce the curing effect, so that the UV light is not incident to the inside of the light emitting device layer 12, thereby avoiding causing damage of the luminescent material, and being beneficial to prolonging the service life of the display panel 100.
In addition, because the filling adhesive layer 22 is in a particle single-drop form, the filling particles 221 are uniformly distributed on the package substrate 21, and the front surfaces of the filling particles 221 need to be spread on the package substrate 21 by pressing, however, due to different material viscosities and solid contents of the filling adhesive layer 22, the situation that the pressing of the filling adhesive layer 22 is not uniform is likely to occur, so that an obvious aperture is formed or display unevenness (mura) is likely to occur, and thus the situation that the light emission is not uniform when a product is lighted is likely to occur.
Specifically, the material of the ultraviolet absorption layer 23 includes a metal oxide including one or more of iron oxide, zinc oxide and titanium oxide in combination, or an organic compound including one of salicylates and benzophenones.
In the embodiment of the present invention, the filling adhesive layer 22 includes a plurality of filling particles 221, and the height of the ultraviolet absorption layer 23 is greater than the particle size of the filling particles 221.
In the embodiment of the present invention, the height of the ultraviolet absorption layer 23 ranges from 100 nm to 500 nm.
Further, the package cover plate 20 further includes a barrier layer 24, the barrier layer 24 is disposed on one side of the package base plate 21 close to the substrate 11 and located in the peripheral region, the barrier layer 24 forms an annular groove 241 surrounding the middle region, and the filling adhesive layer 22 and the ultraviolet absorption layer 23 are filled in the annular groove 241.
In the embodiment of the present invention, the ultraviolet absorption layer 23 may be formed by a coating process, and since the material of the ultraviolet absorption layer 23 has fluidity and tends to flow to both sides, the barrier layer 24 is disposed and the height of the barrier layer 24 is set to be greater than or equal to the height of the ultraviolet absorption layer 23, so that the barrier layer 24 can block the flow path of the ultraviolet absorption layer 23 and only locate in the annular groove 241, thereby preventing the overflow thereof.
In an embodiment of the present invention, the height of the barrier layer 24 is greater than 500 nm.
Specifically, the material of the barrier layer 24 includes an inorganic barrier material, optionally, the inorganic barrier material includes one or more of silicon oxide, silicon nitride, and silicon oxynitride. Because the barrier layer 24 is made of an inorganic material, the barrier layer 24 can increase the water and oxygen permeation path due to the characteristics of an inorganic film, and can improve the packaging effect while wrapping the ultraviolet absorption layer 23.
Further, display panel 100 still includes a frame glue layer 25, frame glue layer 25 is located display substrate 10 with between the packaging substrate 21 and be located peripheral region, the packaging glue layer centers on barrier layer 24 sets up, the packaging glue layer also is the loop configuration, works as packaging cover plate 20 with when display substrate 10 pastes, the packaging glue layer with display substrate 10 contacts, makes through UV light irradiation the solidification of packaging glue layer, thereby realizes packaging cover plate 20 with display substrate 10's fixed connection.
Further, the height of the barrier layer 24 is equal to the distance between the package substrate 21 and the display substrate 10. After the encapsulation cover plate 20 is attached to the display substrate 10, since the height of the barrier layer 24 is equal to the distance between the encapsulation substrate 21 and the display substrate 10, on one hand, a certain supporting effect can be exerted on the encapsulation cover plate 20, and on the other hand, when water vapor outside the frame sealing glue enters, the water vapor needs to pass through the barrier layer 24, so that the water oxygen blocking capability is improved to a certain extent.
Further, on this basis, since the barrier layer 24 is an inorganic film layer and is in contact with the display substrate 10 and the package cover plate 20 respectively, the barrier layer can function as the package adhesive layer, and therefore, the embodiment of the present invention can also omit the package adhesive layer, which is beneficial to saving the manufacturing process and reducing the cost.
Further, the display substrate 10 may further include a thin film encapsulation layer 13 for encapsulating the light emitting device layer 12, so as to prevent external water and oxygen from invading the light emitting device layer 12, and protect the light emitting material. The thin film packaging layer 13 covers one side of the light emitting device layer 12 far away from the substrate 11, and the ultraviolet absorption layer 23 is located on one side of the thin film packaging layer 13 far away from the array substrate. The thin film encapsulation layer 13 is typically a laminated structure of an inorganic encapsulation layer, an organic encapsulation layer and an inorganic encapsulation layer, wherein the inorganic encapsulation layer is typically silicon oxide or silicon nitride, and the organic encapsulation layer is typically acrylate, epoxy resin, polyimide, silicone, etc.
Because the film layer of the film packaging layer 13 is thin and stress exists between the film layers, the water and oxygen blocking capability of the film packaging layer often cannot achieve the expected effect, and in order to enhance the packaging effect, the packaging cover plate 20 is arranged on the film packaging layer 13 for enhancing the packaging. Naturally, in the case that the thin film encapsulation layer 13 is not provided, the encapsulation may be performed by using only the encapsulation cover plate 20, and the specific encapsulation method may be determined according to actual situations.
Referring to fig. 5 and fig. 6A to 6F, fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention, and fig. 6A to 6F are schematic structural flow diagrams of the method for manufacturing a display panel according to an embodiment of the present invention. The embodiment of the invention also provides a preparation method of the display panel, which comprises the following steps:
step S1: providing a substrate 11, and forming a light-emitting device layer 12 on the substrate 11 to form a display substrate 10;
step S2: providing a packaging substrate 21, forming a filling adhesive layer 22 and an ultraviolet absorption layer 23 on the packaging substrate 21, wherein the ultraviolet absorption layer 23 covers one side of the filling adhesive layer 22 away from the packaging substrate 21;
and step S3: attaching the package cover plate 20 to the display substrate 10; and
and step S4: and carrying out UV light irradiation on the side of the package cover plate 20 far away from the substrate 11 so as to cure the filling adhesive layer 22.
Specifically, as shown in fig. 6A, in the step S1, the step of forming the light emitting device layer 12 specifically includes:
step S11: forming a first electrode on one side of the substrate 11;
step S12: forming a pixel defining layer on a side of the first electrode away from the substrate 11, the pixel defining layer including a plurality of pixel openings;
step S13: forming a hole injection layer, a hole transport layer, a light emitting material layer, an electron transport layer and an electron injection layer in the pixel opening; and
step S14: forming a second electrode on the pixel defining layer and the electron injection layer.
Specifically, as shown in fig. 6B, before forming the light emitting device layer 12, the step S1 further includes: forming a driving circuit layer on one side of the substrate 11; after forming the light emitting device layer 12, the step S1 further includes: a thin film encapsulation layer 13 is formed covering the light emitting device layer 12. Specifically, the thin film encapsulation layer 13 is typically a stacked structure of an inorganic encapsulation layer, an organic encapsulation layer and an inorganic encapsulation layer, wherein the inorganic encapsulation layer material is typically silicon oxide or silicon nitride, and the organic encapsulation layer material is typically acrylate, epoxy, polyimide, silicone, or the like.
Specifically, as shown in fig. 6C, before forming the filling adhesive layer 22 in the step S2, the step S2 further includes: a barrier layer 24 is formed on one side of the package substrate 21, the barrier layer 24 is located in a peripheral region of the package substrate 21, and the barrier layer 24 forms an annular groove 241 surrounding the middle region.
In the embodiment of the present invention, the barrier layer 24 is formed by a yellow light process, and the material of the barrier layer 24 includes an inorganic barrier material, and the inorganic barrier material includes one or more of silicon oxide, silicon nitride, and silicon oxynitride.
Further, after forming the barrier layer 24, the step S2 further includes: a frame sealing adhesive layer 25 is formed on one side of the packaging substrate 21, the frame sealing adhesive layer 25 is located in the peripheral area of the packaging substrate 21, and the packaging adhesive layer is arranged around the barrier layer 24.
Specifically, as shown in fig. 6D, the filling adhesive layer 22 and the ultraviolet absorption layer 23 are formed in the annular groove 241, the filling adhesive layer 22 may be formed through a coating process, and the ultraviolet absorption layer 23 may also be formed through a coating process. The material of the filling glue layer 22 can be selected from water-absorbing materials, and optionally, the water-absorbing materials include one or a mixture of epoxy resin (polymer) and calcium oxide. The material of the ultraviolet absorption layer 23 includes metal oxide or organic compound, the metal oxide includes one or more of iron oxide, zinc oxide and titanium oxide, and the organic compound includes one of salicylate and benzophenone.
Specifically, as shown in fig. 6E, in the step S3, a side of the ultraviolet absorption layer 23 away from the package substrate 21 and a side of the light emitting device layer 12 away from the substrate 11 are bonded, and the two substrates are pressed and fixed to form the display panel 100.
Specifically, as shown in fig. 6F, in the step S4, the filling adhesive layer 22 is cured by UV light irradiation, and of course, the frame sealing adhesive layer 25 is cured simultaneously by UV light.
It is understood that the display panel 100 manufactured by the above manufacturing method can obtain all the technical effects of the display panel 100, and the above description is referred to in detail, and will not be described in detail herein.
An embodiment of the present invention further provides a display device, where the display device includes the display panel 100 in the above embodiment, and the display device may be a mobile phone, a tablet computer, an electronic reader, an electronic display screen, a notebook computer, a mobile phone, an Augmented Reality (AR) \ Virtual Reality (VR) device, a media player, a wearable device, a digital camera, a vehicle-mounted navigator, or the like.
The beneficial effects are that: according to the display panel and the display device, the filling adhesive layer is arranged on one side, close to the substrate, of the packaging adhesive layer, the ultraviolet absorption layer is arranged on one side, close to the substrate, of the filling adhesive layer, the filling adhesive layer and the ultraviolet absorption layer are located in the middle area of the packaging substrate, when the UV light is adopted to carry out UV curing on the filling adhesive layer on one side, far away from the display substrate, of the packaging cover plate, the residual UV light after curing or the UV light with the wavelength without the curing effect can be completely absorbed by the ultraviolet absorption layer and cannot enter the light-emitting device layer, so that the damage of a light-emitting material is avoided, and the service life of the display panel is prolonged; simultaneously, because the ultraviolet absorption layer covers the filling adhesive layer for the pressfitting homogeneity of filling adhesive layer obtains promoting, and plywood pressfitting stress point distributes more evenly.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (10)

1. The display panel is characterized by comprising a display substrate and an encapsulation cover plate arranged on one side of the display substrate, wherein the display substrate comprises a substrate and a light-emitting device layer arranged on one side, close to the encapsulation cover plate, of the substrate; the package cover plate includes:
a package substrate including a middle region and a peripheral region surrounding the middle region;
the filling adhesive layer is arranged on one side of the packaging substrate close to the substrate and is positioned in the middle area; and
and the ultraviolet absorption layer is covered on one side of the filling adhesive layer close to the substrate and is positioned in the middle area.
2. The display panel according to claim 1, wherein the package cover further comprises a barrier layer disposed on a side of the package substrate close to the substrate and located in the peripheral region, the barrier layer forms an annular groove surrounding the middle region, and the filling glue layer and the ultraviolet absorption layer are filled in the annular groove; wherein the height of the barrier layer is greater than or equal to the height of the ultraviolet absorption layer.
3. The display panel according to claim 2, wherein the barrier layer has a height equal to a distance between the encapsulation substrate and the display substrate.
4. The display panel according to claim 3, wherein the barrier layer has a height in the range of greater than 500 nm.
5. The display panel of claim 2, wherein the material of the barrier layer comprises an inorganic barrier material comprising one or more combinations of silicon oxide, silicon nitride, and silicon oxynitride.
6. The display panel according to claim 1, wherein the material of the ultraviolet absorption layer comprises a metal oxide or an organic compound, the metal oxide comprises one or more of iron oxide, zinc oxide and titanium oxide, and the organic compound comprises one of salicylate and benzophenone.
7. The display panel according to claim 1, wherein the filling glue layer comprises a plurality of filling particles, and the height of the ultraviolet absorption layer is larger than the particle size of the filling particles.
8. The display panel according to claim 7, wherein the height of the ultraviolet absorbing layer is in a range of 100 nm to 500 nm.
9. The display panel of claim 1, wherein the display substrate further comprises a thin film encapsulation layer overlying the light emitting device layer on a side thereof away from the substrate, and wherein the ultraviolet absorption layer is on a side thereof away from the array substrate.
10. A display device comprising the display panel according to any one of claims 1 to 9.
CN202210656960.8A 2022-06-10 2022-06-10 Display panel and display device Pending CN115241233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210656960.8A CN115241233A (en) 2022-06-10 2022-06-10 Display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210656960.8A CN115241233A (en) 2022-06-10 2022-06-10 Display panel and display device

Publications (1)

Publication Number Publication Date
CN115241233A true CN115241233A (en) 2022-10-25

Family

ID=83668971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210656960.8A Pending CN115241233A (en) 2022-06-10 2022-06-10 Display panel and display device

Country Status (1)

Country Link
CN (1) CN115241233A (en)

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