CN114270554A

CN114270554A - Display panel, preparation method thereof and display device

Info

Publication number: CN114270554A
Application number: CN202080000983.2A
Authority: CN
Inventors: 高昕伟; 张大成; 刘烺; 许晨
Original assignee: BOE Technology Group Co Ltd; Hefei Xinsheng Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2022-04-01
Anticipated expiration: 2040-06-12
Also published as: CN114270554B; EP4071841A1; EP4071841A4; WO2021248434A1; US20220199939A1

Abstract

A display panel, a preparation method thereof and a display device are provided. The display panel comprises an array substrate, a packaging cover plate and frame sealing glue. The array substrate comprises a display area and a non-display area at least partially surrounding the display area, wherein the display area comprises a plurality of pixels distributed in an array, each pixel comprises a plurality of sub-pixels, and each sub-pixel comprises a light-emitting device. The package cover plate is arranged opposite to the array substrate and comprises a first substrate and a plurality of organic layers. The plurality of organic layers are positioned on one side of the first substrate close to the array substrate. The frame sealing glue is positioned in the non-display area and between the array substrate and the packaging cover plate and bonds the array substrate and the packaging cover plate; an interval region is arranged between the organic layer closest to the frame sealing glue in the direction from the display region to the frame sealing glue and the frame sealing glue, the interval region separates the organic layer closest to the frame sealing glue from the frame sealing glue, and the interval region is located in the non-display region.

Description

Display panel, preparation method thereof and display device

Technical Field

At least one embodiment of the present disclosure relates to a display panel, a method of manufacturing the same, and a display device.

Background

Organic Light Emitting Diode (OLED) display technology is receiving increasing attention. However, many organic light emitting diode devices include organic materials that are sensitive to moisture and oxygen and do not resist high temperatures; in addition, oxidation of the metal electrode of the organic light emitting diode also degrades the performance of the organic light emitting diode. Therefore, it is important to insulate the organic light emitting diode from water and oxygen in the environment and to be able to dissipate heat therefrom for extending the lifetime of the device. The oled devices are typically sealed with a sealant and a cover plate, or a desiccant is used to prevent moisture from entering the oled devices.

Disclosure of Invention

The disclosed embodiment provides a display panel, which includes: the array substrate, the packaging cover plate and the frame sealing glue. The array substrate comprises a display area and a non-display area at least partially surrounding the display area, wherein the display area comprises a plurality of pixels distributed in an array, each pixel comprises a plurality of sub-pixels, and each sub-pixel comprises a light-emitting device. The package cover plate is arranged opposite to the array substrate and comprises a first substrate and a plurality of organic layers. A plurality of organic layers are positioned on one side of the first substrate close to the array substrate. The frame sealing glue is positioned in the non-display area and between the array substrate and the packaging cover plate and is used for bonding the array substrate and the packaging cover plate; an interval region is arranged between the frame sealing glue and the organic layer closest to the frame sealing glue in the direction from the display region to the frame sealing glue, the interval region separates the organic layer closest to the frame sealing glue from the frame sealing glue, and the interval region is located in the non-display region.

For example, at least one embodiment of the present disclosure provides a display panel, in which the plurality of organic layers include: a black matrix and a protective layer. The black matrix is positioned on one side of the first substrate close to the array substrate and defines a plurality of sub-color filter units, and the sub-color filter units are in one-to-one correspondence with the sub-pixels and are configured to enable light emitted by the light emitting device of each sub-pixel to transmit the sub-color filter unit corresponding to the sub-color filter unit; the protective layer covers a first surface of the black matrix, which is far away from the first substrate, and the plurality of sub-color filtering units, wherein the organic layer closest to the frame sealing glue is the black matrix.

For example, at least one embodiment of the present disclosure provides a display panel, in which the plurality of organic layers include: a black matrix and a protective layer. The black matrix is positioned on one side of the first substrate close to the array substrate and defines a plurality of sub-color filter units, and the sub-color filter units are in one-to-one correspondence with the sub-pixels and are configured to enable light emitted by the light emitting device of each sub-pixel to transmit out of the sub-color filter unit corresponding to the sub-color filter unit; the protective layer covers a first surface of the black matrix far away from the first substrate and a side surface of the black matrix intersected with the first surface, and the organic layer closest to the frame sealing glue is the protective layer.

For example, at least one embodiment of the present disclosure provides a display panel, in which the plurality of organic layers include: the black matrix, the protective layer and the first spacer. The black matrix is positioned on one side of the first substrate close to the array substrate and defines a plurality of sub-color filter units, and the sub-color filter units are in one-to-one correspondence with the sub-pixels and are configured to enable light emitted by the light emitting device of each sub-pixel to transmit out of the sub-color filter unit corresponding to the sub-color filter unit; the protective layer covers at least part of the black matrix and the plurality of sub-color filter units; the first spacer is positioned on one side of the first substrate close to the array substrate and on one sides of the black matrix and the protective layer close to the frame sealing glue, and the organic layer closest to the frame sealing glue is the first spacer.

For example, in the display panel provided by at least one embodiment of the present disclosure, the larger the size of the non-display region in a lateral direction from the black matrix to the frame sealing adhesive is, the larger the width of the spacing region in the lateral direction is.

For example, in the display panel provided by at least one embodiment of the present disclosure, the larger the size of the frame sealing adhesive in the lateral direction from the black matrix to the frame sealing adhesive is, the smaller the width of the spacing region in the lateral direction is.

For example, in the display panel provided by at least one embodiment of the present disclosure, a width of the spacing region in a direction from the protective layer to the frame sealing adhesive is greater than or equal to 10 μm.

For example, in the display panel provided by at least one embodiment of the present disclosure, a width of the frame sealing adhesive in the lateral direction is less than or equal to 2mm, and the width of the spacing region is greater than or equal to 100 μm.

For example, in a display panel provided by at least one embodiment of the present disclosure, the protection layer is a flat layer, and a surface of the flat layer away from the first substrate is a flat surface.

For example, in a display panel provided in at least one embodiment of the present disclosure, the package cover further includes a light-opaque light-shielding layer. The light shielding layer is positioned on the first substrate and covers at least part of the interval area.

For example, in a display panel provided in at least one embodiment of the present disclosure, the light shielding layer covers the entire spacing region.

For example, in the display panel provided by at least one embodiment of the present disclosure, the light-shielding layer is located on one side of the first substrate close to the array substrate, and an orthogonal projection of the light-shielding layer on the first substrate is not overlapped with an orthogonal projection of the frame sealing adhesive on the first substrate.

For example, in the display panel provided by at least one embodiment of the present disclosure, the light-shielding layer is located on one side of the first substrate close to the array substrate, and an orthogonal projection of the light-shielding layer on the first substrate is at least partially overlapped with an orthogonal projection of the frame sealing adhesive on the first substrate.

For example, in the display panel provided by at least one embodiment of the present disclosure, the light-shielding layer is located on a side of the first substrate away from the array substrate, and an orthogonal projection of the light-shielding layer on the first substrate at least partially overlaps an orthogonal projection of the frame sealing adhesive on the first substrate.

For example, in a display panel provided in at least one embodiment of the present disclosure, the light-shielding layer is made of a metal material.

For example, in a display panel provided in at least one embodiment of the present disclosure, the array substrate further includes a pixel defining layer. A pixel defining layer defines the plurality of sub-pixels, wherein an orthographic projection of the black matrix on the first substrate is within an orthographic projection of the pixel defining layer on the first substrate.

For example, in a display panel provided in at least one embodiment of the present disclosure, the array substrate further includes a second spacer. A second spacer is positioned on one side of the pixel defining layer close to the black matrix and has a space with the protective layer, wherein the orthographic projection of the second spacer on the first substrate is positioned in the orthographic projection of the pixel defining layer on the first substrate and in the orthographic projection of the black matrix on the first substrate; the height of the second spacer in the direction perpendicular to the first substrate is smaller than the height of the first spacer in the direction perpendicular to the first substrate.

For example, the display panel provided in at least one embodiment of the present disclosure further includes a filling material layer. The filling material layer is filled between the array substrate and the packaging cover plate and comprises a first part positioned in the display area and a second part positioned in the frame area; the first portion covers the light emitting device, and the second portion fills the spacing region.

For example, at least one embodiment of the present disclosure provides a display panel, in which the filler material layer is an elastic layer, and a thickness of the elastic layer in a direction perpendicular to the first substrate is reduced when the display panel is applied with a pressure in the direction perpendicular to the first substrate.

At least one embodiment of the present disclosure provides a display device including any one of the display panels provided in the embodiments of the present disclosure.

At least one embodiment of the present disclosure further provides a method for manufacturing a display panel, including: providing an array substrate, wherein the array substrate comprises a display area and a non-display area surrounding at least part of the display area, wherein the display area comprises a plurality of pixels distributed in an array, each pixel comprises a plurality of sub-pixels, and each sub-pixel comprises a light-emitting device; forming a packaging cover plate; forming frame sealing glue, wherein the frame sealing glue is positioned in the non-display area; and the array substrate is jointed with the packaging cover plate; forming the package cover plate includes: providing a first substrate; and forming a plurality of organic layers on one side of the first substrate close to the array substrate. The frame sealing glue is positioned between the array substrate and the packaging cover plate and is used for bonding the array substrate and the packaging cover plate, a spacing region is arranged between the organic layer which is closest to the frame sealing glue in the direction from the display region to the frame sealing glue and the frame sealing glue, the spacing region is used for spacing the organic layer which is closest to the frame sealing glue and the frame sealing glue, and the spacing region is positioned in the non-display region.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description relate only to some embodiments of the present disclosure and are not limiting to the present disclosure.

Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1;

fig. 3A is a schematic plan view of another display panel provided in an embodiment of the disclosure;

FIG. 3B is a schematic cross-sectional view taken along line B-B' of FIG. 3A;

fig. 4A is a schematic plan view of another display panel according to an embodiment of the disclosure;

FIG. 4B is a schematic cross-sectional view taken along line C-C' of FIG. 4A;

fig. 5A is a schematic plan view illustrating a display panel according to another embodiment of the present disclosure;

FIG. 5B is a schematic cross-sectional view taken along line D-D' of FIG. 5A;

fig. 6 is a schematic cross-sectional view illustrating a further display panel according to an embodiment of the present disclosure;

fig. 7 is a schematic cross-sectional view of another display panel according to an embodiment of the disclosure;

fig. 8 is a schematic diagram of a display device according to an embodiment of the disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. The embodiments described below are some, but not all embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the word "comprising" or "comprises", and the like, means that the element or item appearing before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

The dimensions of the drawings used in this disclosure are not to be strictly drawn to scale, the number of pixels in the display area is not limited to the number shown in the drawings, and the specific dimensions and number of the respective structures may be determined according to actual needs. The drawings described in this disclosure are merely schematic structural illustrations.

The disclosed embodiment provides a display panel, which includes: the array substrate, the packaging cover plate and the frame sealing glue. The array substrate comprises a display area and a non-display area at least partially surrounding the display area, wherein the display area comprises a plurality of pixels distributed in an array, each pixel comprises a plurality of sub-pixels, and each sub-pixel comprises a light-emitting device. The package cover plate is arranged opposite to the array substrate and comprises a first substrate and a plurality of organic layers. A plurality of organic layers are positioned on one side of the first substrate close to the array substrate. The frame sealing glue is positioned in the non-display area and between the array substrate and the packaging cover plate and is used for bonding the array substrate and the packaging cover plate; an interval region is arranged between the organic layer closest to the frame sealing glue in the direction from the display region to the frame sealing glue and the frame sealing glue, the interval region separates the organic layer closest to the frame sealing glue from the frame sealing glue, and the interval region is located in the non-display region. Especially in a large-sized display panel, the plurality of organic layers, such as a color film and a black matrix, need to be disposed on the package cover plate to obtain a higher color gamut and a better color effect. However, the organic layer has a weak ability (e.g., relatively to the inorganic layer) to block water and oxygen, in the embodiment of the disclosure, when water and oxygen in an external environment enter the display panel, that is, enter the side of the frame sealing adhesive close to the display region, because the frame sealing adhesive does not directly contact with the organic layer closest to the frame sealing adhesive, the water and oxygen entering the display panel do not directly enter the organic layer after passing through the frame sealing adhesive and diffuse to the light emitting device through the organic layer, but can be buffered in the gap region, for example, diffuse or absorbed to other positions except the position of the organic layer in the gap region, so as to better prevent the external water and oxygen from entering the display region.

Exemplarily, fig. 1 is a schematic plan view of a display panel provided in an embodiment of the present disclosure, and fig. 2 is a schematic cross-sectional view taken along a-a' line in fig. 1, for example, fig. 2 may be a schematic cross-sectional view of the display panel shown in fig. 1, and fig. 2 only shows one pixel in a display area for clarity and conciseness.

As shown in fig. 1 and 2, the display panel 10 includes: the array substrate, the packaging cover plate and the frame sealing glue 3; the array substrate comprises a display area 101 and a non-display area 102 at least partially surrounding the display area 101, wherein the display area 101 comprises a plurality of pixels 23 distributed in an array, and each pixel 23 comprises a plurality of sub-pixels 230. Each of the sub-pixels 230 includes a light emitting device. For example, one pixel 23 includes a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first, second, and third sub-pixels include first, second, and third light emitting

devices

231, 232, and 233, respectively. The first, second, and third light emitting

devices

231, 232, and 233 emit light of different colors, for example, red, green, and blue, respectively. For example, in the embodiment of the present disclosure, one pixel 23 includes three sub-pixels 230 as an example, in other embodiments, the number of sub-pixels of one pixel is not limited to three, and the embodiment of the present disclosure does not limit this.

For example, the planar shape of the frame sealing adhesive 3 is a closed ring shape to exert a good bonding effect and a water and oxygen blocking effect.

For example, the light emitting device is a Light Emitting Diode (LED) device, such as an Organic Light Emitting Diode (OLED) device. For example, the light emitting device includes a first electrode, a light emitting layer, and a second electrode stacked in a direction perpendicular to the second substrate 21. For example, the first electrode is an anode and the second electrode is a cathode. For example, the OLED device further includes a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, and the like, and for these structures, those skilled in the art can design them by referring to the conventional technology, and details are not described herein.

The packaging cover plate is arranged opposite to the array substrate. The package cover plate includes a first substrate 11 and a plurality of organic layers 1. The array substrate includes a second substrate 21 disposed opposite to the first substrate 11. The plurality of organic layers 1 are positioned on one side of the first substrate 11 near the array substrate. The frame sealing adhesive 3 is located in the non-display region 102 and between the array substrate and the package cover plate, and bonds the array substrate and the package cover plate. For example, the sealant 3 is located in the non-display region 102 and between the first substrate 11 and the second substrate 21, and bonds the first substrate 11 and the second substrate 21.

For example, the plurality of organic layers include the black matrix 12 and the protective layer 13. The black matrix 12 is located on one side of the first substrate 11 close to the array substrate and defines a plurality of sub-color filter units 14, and the sub-color filter units 14 are in one-to-one correspondence with the sub-pixels 230 and configured to allow light emitted by the light emitting device of each sub-pixel 230 to transmit through the corresponding sub-color filter unit. The protective layer 13 covers a first surface of the black matrix 12 remote from the first substrate 11 and the plurality of sub color filter units 14. In this embodiment, the organic layer closest to the sealant 3 is a black matrix 12. Namely, a spacing region 4 is provided between the black matrix 12 and the frame sealing adhesive 3, the spacing region 4 spaces the black matrix 12 from the frame sealing adhesive 3, and the spacing region 4 is located in the non-display region 102. Because the frame sealing glue 3 is not in direct contact with the black matrix 12, the water oxygen entering the display panel 10 does not directly enter the black matrix 12 after passing through the frame sealing glue 3 and is diffused to the light emitting device through the black matrix 12, but can be buffered in the spacing region 4, for example, the water oxygen is diffused or absorbed to other positions except the position of the organic layer 1 in the spacing region 4, and meanwhile, the path of the water oxygen propagating to the light emitting device is increased, so that the external water oxygen is better prevented from entering the display region. Especially for large-size display panels, the effect is more prominent. The large-sized panel has a size of more than 48 inches, for example.

For example, one filter unit includes a plurality of sub-color filter units 14, for example, a red filter unit, a green filter unit, and a blue filter unit, which are in one-to-one correspondence with the first light emitting device 231, the second light emitting device 232, and the third light emitting device 233, respectively. The red filter unit, the green filter unit and the blue filter unit respectively comprise a red filter layer, a green filter layer and a blue filter layer. For example, the thicknesses of the red filter layer, the green filter layer, and the blue filter layer in the direction perpendicular to the first substrate 11 are each 0.1 μm to 5 μm, and the material of the red filter layer, the green filter layer, and the blue filter layer is a resin material, such as a photoresist material. The material of the color filter layer is not limited in this embodiment of the disclosure.

For example, the black matrix 12 surrounds each color filter layer, that is, the black matrix 12 surrounds each red filter layer, each green filter layer, and each blue filter layer, to prevent crosstalk between different color lights. Especially in a large-sized display panel, the black matrix 12 and the plurality of sub color filter units 14 need to be disposed on the package cover plate to obtain a high color gamut and a good color effect.

The direction from the black matrix 12 to the frame sealing adhesive 3 is horizontal. For example, the width L of the spacing region 4 in the lateral direction is proportional to the size of the non-display region 102 in the lateral direction. The larger the size of the non-display area 102 in the lateral direction, the larger the width L of the spacing region 4. In this way, the width L of the space region 4 can be designed according to the width of the frame region, which is the size of the non-display region 102 in the lateral direction, so that the width L of the space region 4 can be adapted to the width of the frame region without excessively widening the frame by the space region 4.

For example, the width L of the space region 4 in the transverse direction is inversely proportional to the size of the frame sealing adhesive 3 in the transverse direction. The larger the size of the frame sealing adhesive 3 in the transverse direction is, the smaller the width L of the spacing region 4 is. The larger the size of the frame sealing glue 3 in the transverse direction is, the stronger the water and oxygen blocking capability of the frame sealing glue 3 is, so that the width L of the interval region 4 can be reduced, the width of the frame region can be reasonably distributed by the frame sealing glue 3 and the interval region 4, and the frame cannot be widened too much due to the interval region 4.

For example, the width of the spacing region 4 in the direction from the protection layer 13 to the sealant 3 is greater than or equal to 10 μm, so as to achieve a better effect of blocking water and oxygen.

For example, when the width of the frame sealing adhesive 3 in the lateral direction is less than or equal to 2mm, the width L of the spacing region 4 is greater than or equal to 100 μm.

It should be noted that the above dimensions are only exemplary, and a person skilled in the art can design the width L of the spacing region 4 according to the size of the frame, the width of the frame sealing adhesive, and the requirement for blocking water and oxygen, and the width L of the spacing region 4 is not specifically limited in the embodiment of the disclosure.

For example, the thickness of the black matrix 12 in the direction perpendicular to the first substrate 11 is 0.1 μm to 5 μm. For example, the material of the black matrix 12 is a photoresist material so as to form a pattern of the black matrix 12 through a photolithography process. For example, the material of the black matrix 12 is a negative photoresist, but may be a positive photoresist.

As shown in fig. 2, for example, the protection layer 13 is a flat layer, and a surface of the flat layer away from the first substrate 11 is a flat surface. Therefore, the filling material filled above the flat layer can be pressed more flatly, so that the packaging cover plate and the array substrate are pressed more closely, and the sealing performance of the light-emitting device is enhanced.

For example, the thickness of the planarization layer 13 in the direction perpendicular to the first substrate 11 is 0.1 μm to 5 μm. For example, the material of the planarization layer is a resin, or a positive or negative photoresist.

As shown in fig. 2, for example, the array substrate further includes a pixel defining layer 22. The pixel defining layer 22 defines a plurality of sub-pixels 23. For example, the orthographic projection of the black matrix 12 on the first substrate 11 is positioned in the orthographic projection of the pixel defining layer 22 on the first substrate 11, so that the size (opening) of one sub-color filter unit is larger than or equal to the size of the sub-pixel (opening) corresponding to the sub-color filter unit, thereby ensuring the light extraction rate.

As shown in fig. 2, for example, the display panel 10 further includes a filling material layer 5. The filling material layer 5 is filled between the array substrate and the package cover plate, and includes a first portion located in the display area 101 and a second portion located in the frame area. The first part covers the light emitting device and the second part fills the spacer region 4. In this way, the water and oxygen entering the display panel 10 can diffuse into the filler layer 5 in the spacer region 4 and be absorbed by the filler layer 5, thereby preventing the external water and oxygen from entering the display region.

For example, the material of the filler material layer 5 includes a resin such as acryl, epoxy, or the like. For example, in some embodiments, the filling material layer 5 further includes at least one of a desiccant, an oxygen absorbent, and a heat dissipation material, so as to achieve the effects of blocking water and oxygen more effectively and dissipating heat effectively. For example, the drying agent may be quicklime (CaO), or may be a water-absorbent resin; the oxygen absorbent may be an inorganic oxygen absorbent such as metal powder (including iron powder, copper powder, etc.), a mixture of sodium sulfide and iron powder, or sodium bisulfite, etc., or an organic oxygen absorbent such as Butylated Hydroxyanisole (BHA) or Butylated Hydroxymethylether (BHT), etc.; the heat sink material may be a thermally conductive grease such as heat sink particles made of zinc oxide, aluminum oxide, or boron nitride, among others. Of course, in the present embodiment, the material included in the filling material layer 5 is not limited to the three materials of the drying agent, the oxygen absorbent and the heat dissipation material, and may also include other materials that are advantageous for protecting the organic light emitting device, and the three materials are not limited to the listed kinds, and the disclosure does not limit the present invention. For example, in some embodiments, the filler material layer 5 may also not include a desiccant, an oxygen getter, and a heat sink material. The filler material layer 5 is not limited in the embodiments of the present disclosure.

For example, the filler material layer 5 is an elastic layer whose thickness in the direction perpendicular to the first substrate 11 is reduced in the case where the display panel 10 is applied with pressure in the direction perpendicular to the first substrate 11. For example, the Young's modulus of the filler material layer 5 may be about 0.1MPa to 10 MPa. Young's modulus is a physical quantity that characterizes the ability of a material to resist tensile or compressive forces within the elastic limit. If the Young's modulus of the filler material layer 5 is less than about 0.1MPa, a greater pressure may be required to deform the filler material layer 5, thereby greatly reducing the cushioning effect of the filler material layer 5; if the young's modulus is greater than about 10MPa, it means that the elastic layer 15 is too soft, which may reduce the durability of the display panel 10.

For example, fig. 3A is a schematic plan view of another display panel provided in an embodiment of the disclosure, and fig. 3B is a schematic cross-sectional view taken along line B-B' in fig. 3A. The embodiment shown in fig. 3A and 3B has the following differences from the embodiment shown in fig. 2. As shown in fig. 3A and 3B, the protective layer 13 covers a first surface of the black matrix 12 far from the first substrate 11 and a side surface of the black matrix 12 intersecting the first surface, and an organic layer closest to the sealant 3 in a lateral direction among the plurality of organic layers 1 is the protective layer 13. Therefore, the water and oxygen entering the display panel 10 can not directly enter the protective layer 13 after passing through the frame sealing adhesive 3 and then diffuse to the light emitting device through the protective layer 13, but can be buffered in the spacing region 4, for example, the water and oxygen can diffuse or be absorbed to other positions except the position of the organic layer 1 in the spacing region 4, and meanwhile, the path of the water and oxygen propagating to the light emitting device is increased, so that the external water and oxygen can be better prevented from entering the display region. Other features and corresponding technical effects of the embodiment shown in fig. 3B and the embodiment shown in fig. 2 are the same as those of fig. 2, please refer to the previous description.

For example, fig. 4A is a schematic plan view of another display panel provided in an embodiment of the disclosure, and fig. 4B is a schematic cross-sectional view taken along line C-C' in fig. 4A. The embodiment shown in fig. 4A and 4B has the following differences from the embodiment shown in fig. 2. As shown in fig. 4A and 4B, the plurality of organic layers include first spacers 71 in addition to the black matrix 12 and the protective layer 13. The first spacer 71 is located on one side of the first substrate 11 close to the array substrate, and is located on one side of the black matrix 12 and the protective layer 13 close to the frame sealing adhesive 3, and an organic layer closest to the frame sealing adhesive 3 among the plurality of organic layers is the first spacer 71. Therefore, the water and oxygen entering the display panel 10 can not directly enter the first spacer 71 and then diffuse to the light emitting device through the first spacer 71 after passing through the frame sealing adhesive 3, but can be buffered in the spacing region 4, for example, the water and oxygen can diffuse or be absorbed to other positions except the position of the organic layer 1 in the spacing region 4, and meanwhile, the path of the water and oxygen propagating to the light emitting device is increased, so that the external water and oxygen can be better prevented from entering the display region.

For example, an end of the first spacer 71 away from the second substrate 21 is in contact with the first substrate 11, an interval is provided between an end of the first spacer 71 away from the first substrate 11 and the second substrate 21, and the first spacer 71 is supported between the first substrate 11 and the second substrate 21 to maintain a stable distance between the first substrate 11 and the second substrate 21, and at the same time, the display panel 10 can block water and oxygen from entering further into the display region inside the first spacer 71 in a direction perpendicular to the first substrate 11, and has a better effect of blocking water and oxygen from entering the display region than a display panel without the first spacer 71. For example, in other embodiments, an end of the first spacer 71 remote from the first substrate 11 may be in contact with the second substrate 21.

For example, in the embodiment shown in fig. 4A and 4B, the planar shape of the first spacer 71 is a closed loop shape to achieve a better supporting effect and a water and oxygen blocking effect at the edge of the entire display area. Of course, in other embodiments, the first spacer 71 may also include a plurality of columns spaced apart from one another.

As shown in fig. 4B, for example, the display panel 10 further includes a second spacer 72. The second spacer 72 is located on one side of the pixel defining layer 22 close to the black matrix 12, and has a space with the protective layer 13; the orthographic projection of the second spacer 72 on the first substrate 11 is located within the orthographic projection of the pixel defining layer 22 on the first substrate 11, and is located within the orthographic projection of the black matrix 12 on the first substrate 11. When the display panel 10 is under external pressure, the second spacer 72 can maintain a relatively stable distance between the first substrate 11 and the second substrate 21; meanwhile, the second spacer 72 does not affect the aperture ratio of the display panel 10.

For example, the height of the second spacer 72 in the direction perpendicular to the first substrate 11 is smaller than the height of the first spacer 71 in the direction perpendicular to the first substrate 11.

For example, the material of the second spacer and the material of the first spacer are resins; or a positive or negative photoresist, in order to simplify the photolithography process during the patterning of the second spacer and the first spacer by photolithography.

Other features and corresponding technical effects of the embodiment shown in fig. 4B and the embodiment shown in fig. 3B are the same as those of fig. 3B, please refer to the previous description.

For example, fig. 5A is a schematic plan view of another display panel provided in an embodiment of the disclosure, and fig. 5B is a schematic cross-sectional view taken along line D-D' in fig. 5A. The embodiment shown in fig. 5A and 5B has the following differences from the embodiment shown in fig. 3B. As shown in fig. 5A and 5B, the package cover further includes a light-opaque light-shielding layer 6. The opaque light shielding layer 6 is disposed on the first substrate 11 and covers at least a portion of the spacing region 4 to shield the display panel from light leakage in the spacing region 4, and at the same time, the light shielding layer 6 can further block water and oxygen. For example, the light-shielding layer covers the entire interval region 4 to better perform the light-shielding and water-oxygen blocking functions.

For example, the planar shape of the light shielding layer 6 is a closed ring shape to achieve a better light shielding effect and a water and oxygen blocking effect at the edge of the entire display area.

For example, the light-shielding layer 6 is made of a metal material. Such as a metal or alloy, for example, molybdenum, copper, aluminum, chromium, nickel, or alloys thereof, and the like. Of course, the above metal materials are merely exemplary and are not limited to the above listed kinds. The metal material has stronger water and oxygen blocking capability, for example, the metal material has stronger water and oxygen blocking capability than that of the organic opaque material, and is favorable for obtaining better water and oxygen blocking effect. Of course, in some embodiments, the material of the light shielding layer 6 may also be an organic material, such as a light shielding tape.

For example, as shown in fig. 5B, the light shielding layer 6 is located on a side of the first substrate 11 close to the array substrate, and an orthogonal projection of the light shielding layer 6 on the first substrate 11 does not overlap an orthogonal projection of the sealant 3 on the first substrate 11. Therefore, the frame sealing glue 3 directly contacts with the first substrate 11 and has stronger adhesive force to the first substrate 11 and the second substrate 21, and the phenomenon that the light shielding layer 6 is overlapped with the frame sealing glue 3 to reduce the adhesive force of the frame sealing glue 3 to the first substrate 11 and the second substrate 21 is avoided.

In some embodiments, the first side surface of the light-shielding layer 6, i.e., the surface of the light-shielding layer 6 close to the sealant 3, contacts or has a certain gap with the first side surface of the sealant 3, i.e., the surface close to the light-shielding layer 6, so as to further effectively utilize the gap to prevent water and oxygen from entering the display region. In some embodiments, a layer of filler material 5 is present in the gap to further effectively use the layer of filler material 5 in the gap to prevent the ingress of water oxygen into the display area.

In some embodiments, a second side surface of the light-shielding layer 6 opposite to the first side surface, that is, a surface of the light-shielding layer 6 away from the sealant 3, contacts or has a certain gap with a first side surface of the protection layer 13, that is, a surface close to the sealant 3, so as to further effectively use the gap to prevent water and oxygen from entering the display region. In some embodiments, a layer of filler material 5 is present in the gap to further effectively use the layer of filler material 5 in the gap to prevent the ingress of water oxygen into the display area.

Other features and corresponding technical effects of the embodiment shown in fig. 5B and the embodiment shown in fig. 3B are the same as those of fig. 3B, please refer to the previous description.

For example, fig. 6 is a schematic cross-sectional view of another display panel according to an embodiment of the disclosure. The embodiment shown in fig. 6 has the following differences from the embodiment shown in fig. 5B. As shown in fig. 6, an orthographic projection of the light shielding layer 6 on the first substrate 11 and an orthographic projection of the sealant 3 on the first substrate 11 at least partially overlap, for example, the light shielding layer 6 extends outward from the spacing region 4 to be stacked with the sealant 3. For example, in some embodiments, the frame sealing adhesive 3 is transparent, and the light shielding layer 6 shown in fig. 6 can obtain better light shielding effect.

Other features and corresponding technical effects of the embodiment shown in fig. 6 and the embodiment shown in fig. 5B are the same as those in fig. 5B, please refer to the previous description.

For example, fig. 7 is a schematic cross-sectional view of another display panel according to an embodiment of the disclosure. The embodiment shown in fig. 7 has the following differences from the embodiment shown in fig. 6. As shown in fig. 7, the light shielding layer 6 is located on a side of the first substrate 11 away from the array substrate, and an orthographic projection of the light shielding layer 6 on the first substrate 11 at least partially overlaps an orthographic projection of the frame sealing adhesive 3 on the first substrate 11. For example, in fig. 7, the orthographic projection of the light-shielding layer 6 on the first substrate 11 overlaps with the orthographic projection of the frame sealing adhesive 3 on the first substrate 11, or in other embodiments, the orthographic projection of the light-shielding layer 6 on the first substrate 11 overlaps with the entire orthographic projection of the frame sealing adhesive 3 on the first substrate 11. The embodiment shown in fig. 7 has the same or similar technical effects as the embodiment shown in fig. 6, and reference may be made to the previous description, which is not repeated here.

Exemplarily, fig. 8 is a schematic diagram of a display device according to an embodiment of the present disclosure. As shown in fig. 8, a display device 100 provided in at least one embodiment of the present disclosure includes any one of the display panels 10 provided in the embodiments of the present disclosure.

For example, other structures of the display device 100, such as a pixel driving circuit, etc., may be designed in the art with reference to the conventional technology, and the embodiment of the present disclosure is not limited thereto.

For example, the display device is a light emitting diode display (LED) device, such as an Organic Light Emitting Diode (OLED) display device. For example, the display device may be implemented as a mobile phone, a tablet computer, a display, a notebook computer, an ATM machine, and the like.

Illustratively, the preparation method comprises the following steps.

Step 1: providing an array substrate; as shown in fig. 1, the array substrate includes a display region 101 and a non-display region 102 surrounding at least a portion of the display region, the display region 101 includes a plurality of pixels 23 distributed in an array, each pixel 23 includes a plurality of sub-pixels 230, and each sub-pixel includes a light emitting device.

Step 2: forming a packaging cover plate; referring to fig. 2, forming the package cover plate includes: providing a first substrate 11; and forming a plurality of organic layers 1 on a first side of the first substrate 11. Forming the plurality of organic layers 1 includes sequentially forming a plurality of sub color filter units 1, a black matrix 12, and a protective layer 13. For example, forming the plurality of sub color filter units 14 includes forming a red filter layer, a green filter layer, and a blue filter layer through a patterning process. The patterning process is, for example, a photolithography process. For example, the material of the red filter layer, the green filter layer, and the blue filter layer is a resin material, such as a photoresist material. For example, the black matrix 12 is located on a side of the first substrate 11 close to the array substrate and defines a plurality of sub-color filter units 14, and the plurality of sub-color filter units 14 are in one-to-one correspondence with the plurality of sub-pixels 230 and configured to transmit light emitted by the light emitting device of each sub-pixel 230 out of the corresponding sub-color filter unit. The protective layer 13 covers a first surface of the black matrix 12 remote from the first substrate 11 and the plurality of sub color filter units 14.

And step 3: the frame sealing glue 3 is formed on the first side of the first substrate 11. The frame sealing glue 3 is located in the non-display area 102, and the planar shape of the frame sealing glue 3 is a closed ring shape surrounding the display area.

And 4, step 4: a filling material is formed on the first side of the first substrate 11, and the filling material is located inside the frame sealing adhesive 3 (on the side close to the display region 101). For example, the filling material may be formed inside the frame sealing adhesive 3 by a dot coating method.

And 5: before the array substrate and the packaging cover plate are combined, the filling material and the frame sealing glue are semi-cured to reduce the fluidity of the filling material and the frame sealing glue.

Step 6: the array substrate and the packaging cover plate are closed, wherein the frame sealing glue 3 is positioned between the array substrate and the packaging cover plate and bonds the array substrate and the packaging cover plate, and the first side of the first substrate 11 is positioned at one side of the first substrate 11, which is close to the array substrate; the organic layer closest to the frame sealing adhesive in the direction from the display region to the frame sealing adhesive in the plurality of organic layers 1 is a black matrix 12, a spacing region 4 is arranged between the black matrix 12 and the frame sealing adhesive 3, the black matrix 12 and the frame sealing adhesive 3 are spaced by the spacing region 4, and the spacing region 4 is located in the non-display region 102.

And 7: after the array substrate and the packaging cover plate are closed, the filling material and the frame sealing glue 3 are completely cured to obtain a filling material layer 5, so that the array substrate and the packaging cover plate are firmly combined. The filling material layer 5 is filled between the array substrate and the package cover plate, and includes a first portion located in the display area 101 and a second portion located in the frame area. The first part covers the light emitting device and the second part fills the spacer region 4.

For example, the material of the filling material and the frame sealing adhesive 3 includes an ultraviolet curing resin, and the filling material and the frame sealing adhesive 3 can be cured by an ultraviolet curing method. Thereby obtaining the display panel 10 shown in fig. 2.

The manufacturing method of the display panel shown in fig. 3B is different from the manufacturing method of the display panel shown in fig. 2 in that the protective layer 13 is formed to cover the first surface of the black matrix 12 away from the first substrate 11 and the side surface of the black matrix 12 intersecting the first surface, and the organic layer closest to the sealant 3 in the lateral direction among the plurality of organic layers 1 is the protective layer 13. Other steps and features of the method for manufacturing the display panel shown in fig. 3B are the same as those of the method for manufacturing the display panel shown in fig. 2, and reference is made to the previous description.

The manufacturing method of the display panel shown in fig. 4B is different from the manufacturing method of the display panel shown in fig. 2 in that the method further includes: before the array substrate and the package cover are aligned, a first spacer 71 is formed on the first side of the first substrate 11. The first spacer 71 is located on one side of the first substrate 11 close to the array substrate, and is located on one side of the black matrix 12 and the protective layer 13 close to the frame sealing adhesive 3, and an organic layer closest to the frame sealing adhesive 3 among the plurality of organic layers is the first spacer 71. After the array substrate and the package cover plate are joined, for example, one end of the first spacer 71 away from the second substrate 21 contacts the first substrate 11, and a space is formed between one end of the first spacer 71 away from the first substrate 11 and the second substrate 21. And, the array substrate further includes a second spacer 72. The second spacer 72 is located on one side of the pixel defining layer 22 close to the black matrix 12, and has a space with the protective layer 13; the orthographic projection of the second spacer 72 on the first substrate 11 is located within the orthographic projection of the pixel defining layer 22 on the first substrate 11, and is located within the orthographic projection of the black matrix 12 on the first substrate 11. Other steps and features of the method for manufacturing the display panel shown in fig. 4B are the same as those of the method for manufacturing the display panel shown in fig. 2, and reference is made to the previous description.

The manufacturing method of the display panel shown in fig. 5B is different from the manufacturing method of the display panel shown in fig. 2 in that the method further includes: before the array substrate and the package cover are joined, a light-opaque light-shielding layer 6 is formed on the first side of the first substrate 11. The opaque light shielding layer 6 is disposed on the first substrate 11 and covers at least a portion of the spacing region 4 to shield the display panel from light leakage in the spacing region 4, and at the same time, the light shielding layer 6 can further block water and oxygen. For example, the light-shielding layer covers the entire interval region 4 to better perform the light-shielding and water-oxygen blocking functions. The light shielding layer 6 is located on one side of the first substrate 11 close to the array substrate, and an orthographic projection of the light shielding layer 6 on the first substrate 11 is not overlapped with an orthographic projection of the frame sealing glue 3 on the first substrate 11.

For example, the light-shielding layer 6 is made of a metal material. Such as a metal or alloy, for example, molybdenum, copper, aluminum, chromium, nickel, or alloys thereof, and the like. Of course, the above metal materials are merely exemplary and are not limited to the above listed kinds. The pattern of the light shielding layer 6 may be formed by screen printing or photolithography. For example, the material of the light shielding layer 6 may also be an organic material, such as a light shielding tape, and in this case, in addition to the screen printing and the photolithography process, the light shielding layer 6 may also be patterned by, for example, an imprinting method, such as a roll-to-roll method.

Other steps and features of the method for manufacturing the display panel shown in fig. 5B are the same as those of the method for manufacturing the display panel shown in fig. 2, and reference is made to the previous description.

The difference between the method for manufacturing the display panel shown in fig. 6 and the method for manufacturing the display panel shown in fig. 5B is that an orthographic projection of the light shielding layer 6 on the first substrate 11 at least partially overlaps an orthographic projection of the sealant 3 on the first substrate 11, for example, the light shielding layer 6 extends outward from the spacing region 4 to be stacked with the sealant 3.

In some embodiments, a second side surface of the light-shielding layer 6 opposite to the first side surface, that is, a surface of the light-shielding layer 6 away from the sealant 3, contacts or has a certain gap with a first side surface of the protection layer 13, that is, a surface close to the sealant 3, so as to further effectively use the gap to prevent water and oxygen from entering the display region. In some embodiments, a layer of filler material 5 is present in the gap to further effectively use the layer of filler material 5 in the gap to prevent the ingress of water oxygen into the display area. Other steps and features of the manufacturing method of the display panel shown in fig. 6 are the same as those of the manufacturing method of the display panel shown in fig. 5B, and reference is made to the previous description.

The method for manufacturing the display panel shown in fig. 7 is different from the method for manufacturing the display panel shown in fig. 6 in that the method includes: before the array substrate and the package cover plate are combined, a light shielding layer 6 is formed on a second side of the first substrate 11 opposite to the first side of the first substrate, and after the package cover plate and the array substrate are combined, the second side of the first substrate 11 is located on one side, far away from the array substrate, of the first substrate 11. The orthographic projection of the light shielding layer 6 on the first substrate 11 is at least partially overlapped with the orthographic projection of the frame sealing glue 3 on the first substrate 11. For example, in fig. 7, the orthographic projection of the light-shielding layer 6 on the first substrate 11 overlaps with the orthographic projection of the frame sealing adhesive 3 on the first substrate 11, or in other embodiments, the orthographic projection of the light-shielding layer 6 on the first substrate 11 overlaps with the entire orthographic projection of the frame sealing adhesive 3 on the first substrate 11. Other steps and features of the method for manufacturing the display panel shown in fig. 7 are the same as those of the method for manufacturing the display panel shown in fig. 6, and reference is made to the previous description.

The above description is only exemplary of the present disclosure and is not intended to limit the scope of the present disclosure, which is defined by the scope of the claims.

Claims

A display panel, comprising:

the array substrate comprises a display area and a non-display area at least partially surrounding the display area, wherein the display area comprises a plurality of pixels distributed in an array, each pixel comprises a plurality of sub-pixels, and each sub-pixel comprises a light-emitting device;

the encapsulation apron, with the array substrate sets up relatively, and includes:

a first substrate; and

the organic layers are positioned on one side, close to the array substrate, of the first substrate;

and

the frame sealing glue is positioned in the non-display area, positioned between the array substrate and the packaging cover plate and used for bonding the array substrate and the packaging cover plate, wherein a spacing area is arranged between the organic layer, closest to the frame sealing glue, in the direction from the display area to the frame sealing glue, of the organic layers and the frame sealing glue, the spacing area separates the organic layer closest to the frame sealing glue from the frame sealing glue, and the spacing area is positioned in the non-display area.
The display panel of claim 1, wherein the plurality of organic layers comprises:

the black matrix is positioned on one side, close to the array substrate, of the first substrate and defines a plurality of sub-color filter units, the sub-color filter units correspond to the sub-pixels one by one and are configured to enable light emitted by the light emitting device of each sub-pixel to transmit the corresponding sub-color filter unit; and

and the protective layer covers the first surface of the black matrix, which is far away from the first substrate, and the plurality of sub-color filtering units, wherein the organic layer closest to the frame sealing glue is the black matrix.
The display panel of claim 1, wherein the plurality of organic layers comprises:

the black matrix is positioned on one side, close to the array substrate, of the first substrate and defines a plurality of sub-color filter units, the sub-color filter units correspond to the sub-pixels one by one and are configured to enable light emitted by the light emitting device of each sub-pixel to transmit the corresponding sub-color filter unit; and

and the protective layer covers the first surface of the black matrix far away from the first substrate and the side surface of the black matrix intersected with the first surface, and the organic layer closest to the frame sealing glue is the protective layer.
The display panel of any of claims 1-3, wherein the plurality of organic layers comprises:

the black matrix is positioned on one side, close to the array substrate, of the first substrate and defines a plurality of sub-color filter units, the sub-color filter units correspond to the sub-pixels one by one and are configured to enable light emitted by the light emitting device of each sub-pixel to transmit the corresponding sub-color filter unit;

a protective layer covering at least a portion of the black matrix and the plurality of sub color filter units; and

the first spacer is positioned on one side of the first substrate close to the array substrate and on one sides of the black matrix and the protective layer close to the frame sealing glue, and the organic layer closest to the frame sealing glue is the first spacer.
The display panel according to any one of claims 1 to 4,

the larger the size of the non-display region in a lateral direction from the black matrix to the frame sealing adhesive is, the larger the width of the spacing region in the lateral direction is.
The display panel according to any one of claims 1 to 4,

the larger the size of the frame sealing adhesive in the transverse direction from the black matrix to the frame sealing adhesive is, the smaller the width of the interval region in the transverse direction is.
The display panel according to claim 6, wherein a width of the gap region in a direction from the protective layer to the sealant is 10 μm or more.
The display panel according to claim 7, wherein a width of the frame sealing adhesive in the lateral direction is less than or equal to 2mm, and the width of the spacing region is greater than or equal to 100 μm.
The display panel according to any one of claims 1 to 8, wherein the protective layer is a flat layer, and a surface of the flat layer remote from the first substrate is a flat surface.
The display panel of any of claims 1-9, wherein the encapsulating cover further comprises:

and the lighttight light shading layer is positioned on the first substrate and covers at least part of the interval region.
The display panel according to claim 10, wherein the light shielding layer covers the entire spacing region.
The display panel according to claim 10 or 11, wherein the light-shielding layer is located on a side of the first substrate close to the array substrate, and an orthogonal projection of the light-shielding layer on the first substrate does not overlap an orthogonal projection of the frame sealing adhesive on the first substrate.
The display panel according to claim 10 or 11, wherein the light-shielding layer is located on a side of the first substrate close to the array substrate, and an orthogonal projection of the light-shielding layer on the first substrate at least partially overlaps an orthogonal projection of the frame sealing glue on the first substrate.
The display panel according to claim 10 or 11, wherein the light-shielding layer is located on a side of the first substrate away from the array substrate, and an orthogonal projection of the light-shielding layer on the first substrate at least partially overlaps an orthogonal projection of the frame sealing glue on the first substrate.
The display panel according to any one of claims 10 to 14, wherein the light shielding layer is made of a metal material.
The display panel of any of claims 4-15, wherein the array substrate further comprises:

a pixel defining layer defining the plurality of sub-pixels, wherein an orthographic projection of the black matrix on the first substrate is within an orthographic projection of the pixel defining layer on the first substrate.
The display panel of claim 16, further comprising:

the second spacer is positioned on one side, close to the black matrix, of the pixel defining layer and is spaced from the protective layer, wherein the orthographic projection of the second spacer on the first substrate is positioned in the orthographic projection of the pixel defining layer on the first substrate and in the orthographic projection of the black matrix on the first substrate;

the height of the second spacer in the direction perpendicular to the first substrate is smaller than the height of the first spacer in the direction perpendicular to the first substrate.
The display panel of any of claims 1-17, further comprising:

a filling material layer filled between the array substrate and the package cover plate and including a first portion located in the display region and a second portion located in the frame region,

the first portion covers the light emitting device, and the second portion fills the spacing region.
The display panel according to claim 18, wherein the filler material layer is an elastic layer whose thickness in a direction perpendicular to the first substrate is reduced in a case where the display panel is applied with a pressure in the direction perpendicular to the first substrate.
A method of manufacturing a display panel, comprising:

providing an array substrate, wherein the array substrate comprises a display area and a non-display area surrounding at least part of the display area, wherein the display area comprises a plurality of pixels distributed in an array, each pixel comprises a plurality of sub-pixels, and each sub-pixel comprises a light-emitting device;

forming a package cover plate comprising:

providing a first substrate; and

forming a plurality of organic layers on one side of the first substrate close to the array substrate;

forming frame sealing glue, wherein the frame sealing glue is positioned in the non-display area; and

the array substrate and the packaging cover plate are combined, wherein the frame sealing glue is located between the array substrate and the packaging cover plate and bonds the array substrate and the packaging cover plate, a spacing region is arranged between an organic layer, closest to the frame sealing glue, in the direction from the display region to the frame sealing glue, of the plurality of organic layers and the frame sealing glue, the spacing region separates the organic layer closest to the frame sealing glue from the frame sealing glue, and the spacing region is located in the non-display region.
A display device comprising the display panel of any one of claims 1-19.