CN115213981A - Fabric-base-containing conductive adhesive die-cut piece and preparation method thereof - Google Patents
Fabric-base-containing conductive adhesive die-cut piece and preparation method thereof Download PDFInfo
- Publication number
- CN115213981A CN115213981A CN202110431426.2A CN202110431426A CN115213981A CN 115213981 A CN115213981 A CN 115213981A CN 202110431426 A CN202110431426 A CN 202110431426A CN 115213981 A CN115213981 A CN 115213981A
- Authority
- CN
- China
- Prior art keywords
- die
- cloth
- waste
- conductive adhesive
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000004744 fabric Substances 0.000 claims abstract description 59
- 238000005520 cutting process Methods 0.000 claims abstract description 54
- 239000002699 waste material Substances 0.000 claims abstract description 47
- 239000002390 adhesive tape Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000004080 punching Methods 0.000 claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000007599 discharging Methods 0.000 claims abstract description 12
- 229920002799 BoPET Polymers 0.000 claims description 6
- 239000005041 Mylar™ Substances 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a fabric base-containing conductive adhesive die-cut piece and a preparation method thereof, wherein the method comprises the following steps: (1) bonding of the primary material belt: sequentially attaching the auxiliary release film (2), the cloth-based double-sided adhesive tape (3) and the auxiliary release film (4) to the auxiliary protective film (1) to form a primary material belt; (2) a die cutting waste discharge: feeding the primary material belt into a die cutting machine for die cutting, and discharging a punching waste material to form a semi-finished die cutting piece; (3) bonding of the secondary material belt: attaching a handle release film (5) to the cloth-based double-sided adhesive tape (3) to form a secondary material belt; (4) secondary die cutting and waste discharge: and (3) feeding the secondary material belt into a two-die cutting machine for punching, and discharging two punching wastes to form a finished product of the conductive adhesive die-cut piece containing the cloth base. Compared with the prior art, the invention has the advantages of no exposed broken filament, avoiding the deflection of the chip mounter and the like.
Description
Technical Field
The invention relates to the field of die-cut piece processing, in particular to a die-cut piece containing a cloth-based conductive adhesive and a preparation method thereof.
Background
When the die-cut piece product is prepared, at least one layer of double-sided adhesive tape and one layer of handle film are generally included. Then, when the double-sided adhesive tape is made of a fabric-based conductive adhesive, if the two outlines are subjected to die cutting and forming at the same time, broken filaments are generated, as shown in fig. 7, and further, a phenomenon of partial grabbing of a chip mounter is caused, so that the product cannot be used.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a die-cut piece containing a fabric-based conductive adhesive and a preparation method thereof, wherein the die-cut piece does not have exposed broken filaments and further avoids the deviation of a chip mounter.
The purpose of the invention can be realized by the following technical scheme:
the inventor knows that the cloth-based conductive adhesive has a three-layer structure: glue, conductive cloth, glue. The conductive cloth is woven by superfine wires coated with conductive metal particles, and the diameter of the woven wire of the conductive cloth is relatively thick, about 0.03-0.08MM, in order to ensure the conductivity. And just cut the braided wire gap when the cutter is die-cut, will produce the broken filament, and the industry camera that chip mounter used can only snatch the product outline generally, and the broken filament that exposes is many more than the product, will lead to the positioning error, considers to above factual to propose following concrete scheme:
a preparation method of a die-cut piece containing a cloth-based conductive adhesive comprises the following steps:
(1) Bonding of the primary material belt: sequentially attaching the auxiliary release film, the cloth-based double-sided adhesive and the auxiliary release film to the auxiliary protective film to form a primary material belt;
(2) A die cutting and waste discharge: feeding the primary material belt into a die cutting machine for die cutting, and discharging a punching waste to form a semi-finished die cutting piece;
(3) And (3) bonding of the secondary material belt: attaching the handle release film to the cloth-based double-faced adhesive tape to form a secondary material tape;
(4) Secondary die cutting and waste discharge: and (3) feeding the secondary material belt into a two-die cutting machine for die cutting, and discharging two punching waste materials to form a finished product of the conductive adhesive die-cut piece containing the cloth base.
Furthermore, a die cutting machine is provided with knife lines a and b matched with a die cutting pattern; the punching layers of the knife line a sequentially comprise an auxiliary release film, a cloth-based double-sided adhesive and an auxiliary release film from top to bottom, and the punching layers of the knife line b sequentially comprise an auxiliary release film and a cloth-based double-sided adhesive from top to bottom.
Further, the knife line b is used for die cutting the cloth-based double-sided adhesive to form a cloth-based double-sided adhesive finished product and frame waste.
Further, the one-time punching waste material comprises the whole auxiliary release film, side line waste materials except the cutting line a and frame waste materials.
Furthermore, the two-die cutting machine is provided with knife lines c and d matched with the patterns of the two-die cutting machine; the punching layers of the knife lines c and d sequentially comprise a handle release film and a cloth base double-sided adhesive tape from top to bottom.
Further, the handle is die-cut from the release film by the cutter line d to form a handle release film finished product and second frame waste.
Further, the second punching waste comprises second frame waste, side line waste except the knife line c and an auxiliary protective film.
Further, the waste discharge mode of the auxiliary protective film is specifically as follows: and (3) attaching the waste mylar under the auxiliary protective film, then rolling, and discharging the waste mylar and the auxiliary protective film together.
Furthermore, the contour surrounded by the knife line b is smaller than the contour surrounded by the knife line d.
The die-cut piece containing the cloth-based conductive adhesive prepared by the method comprises a finished cloth-based double-sided adhesive tape product and a finished handle release film product.
The die cutting piece also comprises an auxiliary release film during rolling, and the outline of the finished cloth-based double-sided adhesive tape is 2-4mm away from the outline of the finished handle release film except for the handle part.
Compared with the prior art, the invention has the following advantages:
(1) When the invention is processed, the outline of the knife line b is slightly smaller than the outline surrounded by the knife line d, so that when the conductive adhesive containing the cloth base is processed at the beginning, even if burrs appear, the conductive adhesive can be covered by the handle release film at the later stage and cannot be exposed;
(2) By adopting the technology of the invention, the broken filaments are not exposed any more, so that the problem that the machine cannot grab is solved, and the product quality is improved.
Drawings
FIG. 1 is a schematic view of a die cut product of the present invention;
FIG. 2 is a flow chart of the production of the die-cut piece in the embodiment;
FIG. 3 illustrates an embodiment of a die cut pattern;
FIG. 4 is a die cut level view of the embodiment;
FIG. 5 illustrates an embodiment of a two-die cut pattern;
FIG. 6 is a die cut level diagram of the second die of the embodiment;
FIG. 7 is a schematic representation of a prior art die cut to produce fuzz;
the reference numbers in the figures indicate: the auxiliary protective film comprises an auxiliary protective film 1, an auxiliary release film 2, a cloth base double-sided adhesive tape 3, a cloth base double-sided adhesive tape finished product 31, frame waste 32, an auxiliary release film 4, a handle release film 5, a handle release film finished product 51 and second frame waste 52.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments.
Examples
A method for preparing a die-cut piece of conductive adhesive containing a cloth base, as shown in fig. 2, the method comprises the following steps:
(1) Bonding of the primary material belt: sequentially attaching an auxiliary release film 2, a cloth-based double-sided adhesive tape 3 and an auxiliary release film 4 to the auxiliary protective film 1 to form a primary material belt, as shown in fig. 2; the type of the cloth-based double-sided adhesive tape 3 is 3M9711S-200;
(2) A die cutting and waste discharge: feeding the primary material belt into a die cutting machine for die cutting, and discharging a punching waste material to form a semi-finished die cutting piece; wherein, a die cutting machine is provided with knife lines a and b matched with a die cutting pattern, as shown in figure 3; the punching layers of the knife line a sequentially comprise an auxiliary release film 4, a cloth-based double-sided adhesive tape 3 and an auxiliary release film 2 from top to bottom, and the punching layers of the knife line b sequentially comprise an auxiliary release film 4 and a cloth-based double-sided adhesive tape 3 from top to bottom, as shown in fig. 4. And cutting the cloth base double-sided adhesive tape 3 by a cutter line b to form a cloth base double-sided adhesive tape finished product 31 and frame waste 32. The first punching waste comprises the whole auxiliary release film 4, side line waste except the knife line a and frame waste 32;
(3) And (3) bonding of the secondary material belt: attaching the handle release film 5 to the cloth base double-sided adhesive tape 3 to form a secondary material belt;
(4) Secondary die cutting and waste discharge: and (3) feeding the secondary material belt into a two-die cutting machine for punching, and discharging two punching wastes to form a finished product of the conductive adhesive die-cut piece containing the cloth base. Wherein, the two-die cutting machine is provided with knife lines c and d matched with the patterns cut by the two dies, as shown in figure 5; the die-cut layers of the knife lines c and d sequentially comprise a handle release film 5 and a cloth-based double-sided adhesive tape 3 from top to bottom, as shown in fig. 6. And d, die-cutting the handle release film 5 by using a cutting line d to form a finished handle release film 51 and second frame waste 52. The secondary punching waste includes the secondary frame waste 52, the edge line waste except the cutting line c, and the auxiliary protective film 1. The waste discharge mode of the auxiliary protective film 1 is as follows: attaching the waste mylar 6 under the auxiliary protective film 1, then rolling, and discharging the waste mylar 6 and the auxiliary protective film 1 together; the contour enclosed by the knife line b is smaller than that enclosed by the knife line d.
The finished product of the die-cutting piece comprises a finished product 31 of the cloth-based double-sided adhesive tape and a finished product 51 of the handle release film as shown in figure 1, and the die-cutting piece also comprises an auxiliary release film 2 during rolling, wherein the outline of the finished product 31 of the cloth-based double-sided adhesive tape is 2-4mm away from the outline of the finished product 51 of the handle release film except for the handle part.
In this embodiment, the probability of the later-stage chip mounter being subjected to the grabbing deviation is almost 0.
Comparative example
The difference from the embodiment is that in the comparative example, the outlines of the handle release film 5 and the cloth-based double-sided adhesive tape 3 are simultaneously die-cut and formed.
In the comparative example, as the lifting handle is formed by die cutting the release film 5 and the cloth-based double-sided adhesive tape 3 at the same time, broken filaments are exposed on a finished product, and the probability of partial grabbing of the chip mounter in the later stage is as high as about 40%.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention in any way, so that any person skilled in the art can make modifications or changes in the technical content disclosed above. However, any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the protection scope of the technical solution of the present invention.
Claims (10)
1. The preparation method of the die-cut piece containing the cloth-based conductive adhesive is characterized by comprising the following steps of:
(1) Bonding of the primary material belt: sequentially attaching the auxiliary release film (2), the cloth-based double-sided adhesive tape (3) and the auxiliary release film (4) to the auxiliary protective film (1) to form a primary material belt;
(2) A die cutting and waste discharging: feeding the primary material belt into a die cutting machine for die cutting, and discharging a punching waste material to form a semi-finished die cutting piece;
(3) And (3) bonding of the secondary material belt: attaching a handle release film (5) to the cloth base double-sided adhesive tape (3) to form a secondary material belt;
(4) Secondary die cutting and waste discharge: and (3) feeding the secondary material belt into a two-die cutting machine for die cutting, and discharging two punching waste materials to form a finished product of the conductive adhesive die-cut piece containing the cloth base.
2. The method for preparing the die-cut piece of the conductive adhesive containing the cloth base according to claim 1, wherein the die-cutting machine is provided with knife lines a and b matched with a die-cutting pattern; the utility model discloses a line of a sword, including the die-cut level from the top down of line of a sword in proper order from type membrane (4), cloth base double faced adhesive tape (3) and supplementary type membrane (2), the die-cut level from the top down of line of a sword b in proper order including supplementary type membrane (4) and cloth base double faced adhesive tape (3).
3. The method for preparing the die-cut piece containing the cloth-based conductive adhesive according to claim 2, wherein the cutting line b is used for die-cutting the cloth-based double-sided adhesive tape (3) to form a finished cloth-based double-sided adhesive tape product (31) and frame waste (32).
4. The method for preparing the die-cut piece containing the conductive adhesive on the cloth base according to claim 3, wherein the one-time punching waste comprises the whole auxiliary release film (4), the side line waste except the cutting line a and the frame waste (32).
5. The method for preparing the die-cut piece containing the conductive adhesive with the cloth base according to claim 2, wherein the two-die cutting machine is provided with knife lines c and d matched with a cutting pattern of the two dies; the punching layers of the knife lines c and d sequentially comprise a handle release film (5) and a cloth-based double-sided adhesive tape (3) from top to bottom.
6. The method for preparing the die-cut pieces containing the cloth-based conductive adhesive according to claim 5, wherein the cutting line d is used for die-cutting the handle release film (5) to form a finished handle release film (51) and second frame waste (52).
7. The method for preparing the die-cut piece of the conductive adhesive containing the cloth base according to claim 6, wherein the two punching scraps include a second frame scrap (52), a side line scrap except the cutting line c, and an auxiliary protective film (1).
8. The method for preparing the fabric-based conductive adhesive die-cut piece according to claim 7, wherein the auxiliary protective film (1) is discarded in a specific manner: and (3) adhering the waste mylar (6) below the auxiliary protective film (1), then rolling, and discharging the waste mylar (6) and the auxiliary protective film (1) together.
9. The method for preparing the die-cut piece containing the conductive adhesive with the cloth base as claimed in claim 2, wherein the contour defined by the knife line b is smaller than the contour defined by the knife line d.
10. A die-cut piece containing a cloth-based conductive adhesive prepared by the method according to any one of claims 1 to 9, wherein the die-cut piece comprises a finished cloth-based double-sided adhesive tape (31) and a finished handle release film (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110431426.2A CN115213981B (en) | 2021-04-21 | 2021-04-21 | Cloth-based conductive adhesive die-cut piece and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110431426.2A CN115213981B (en) | 2021-04-21 | 2021-04-21 | Cloth-based conductive adhesive die-cut piece and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115213981A true CN115213981A (en) | 2022-10-21 |
| CN115213981B CN115213981B (en) | 2024-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110431426.2A Active CN115213981B (en) | 2021-04-21 | 2021-04-21 | Cloth-based conductive adhesive die-cut piece and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN115213981B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001301066A (en) * | 2000-04-25 | 2001-10-30 | Canon Inc | Method for cutting seal member |
| JP2004026884A (en) * | 2002-06-21 | 2004-01-29 | Chiyoda Integre Co Ltd | Method for producing double-sided tape for profile member |
| US20040057984A1 (en) * | 1998-08-20 | 2004-03-25 | Frank Hardt | Method for producing adhesive blanks from an endless band and blanks obtained according to said method |
| CN205033305U (en) * | 2015-09-22 | 2016-02-17 | 上海景奕电子科技有限公司 | Cross cutting exhaust device of in -band frame cross cutting spare |
| CN106541448A (en) * | 2015-09-22 | 2017-03-29 | 上海景奕电子科技有限公司 | A kind of cross cutting discharge device with interior handle film cut piece and cross cutting discharging method |
| CN207344719U (en) * | 2017-09-22 | 2018-05-11 | 昊佰电子科技（上海）有限公司 | It is a kind of for Kapton product without knife stamp cutting apparatus |
| KR20180085444A (en) * | 2017-01-19 | 2018-07-27 | 조금복 | Double-Sided Adhesive Tape with Easy Separation of Release Sheet and Manufacturing Method |
| CN212170681U (en) * | 2019-12-30 | 2020-12-18 | 昊佰电子科技（上海）有限公司 | Production system of mylar die cutting piece |
-
2021
- 2021-04-21 CN CN202110431426.2A patent/CN115213981B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040057984A1 (en) * | 1998-08-20 | 2004-03-25 | Frank Hardt | Method for producing adhesive blanks from an endless band and blanks obtained according to said method |
| JP2001301066A (en) * | 2000-04-25 | 2001-10-30 | Canon Inc | Method for cutting seal member |
| JP2004026884A (en) * | 2002-06-21 | 2004-01-29 | Chiyoda Integre Co Ltd | Method for producing double-sided tape for profile member |
| CN205033305U (en) * | 2015-09-22 | 2016-02-17 | 上海景奕电子科技有限公司 | Cross cutting exhaust device of in -band frame cross cutting spare |
| CN106541448A (en) * | 2015-09-22 | 2017-03-29 | 上海景奕电子科技有限公司 | A kind of cross cutting discharge device with interior handle film cut piece and cross cutting discharging method |
| KR20180085444A (en) * | 2017-01-19 | 2018-07-27 | 조금복 | Double-Sided Adhesive Tape with Easy Separation of Release Sheet and Manufacturing Method |
| CN207344719U (en) * | 2017-09-22 | 2018-05-11 | 昊佰电子科技（上海）有限公司 | It is a kind of for Kapton product without knife stamp cutting apparatus |
| CN212170681U (en) * | 2019-12-30 | 2020-12-18 | 昊佰电子科技（上海）有限公司 | Production system of mylar die cutting piece |
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| Publication number | Publication date |
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| CN115213981B (en) | 2024-03-08 |
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Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Applicant after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Applicant before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
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