CN209607735U - A kind of semiconductor-sealing-purpose tooling - Google Patents
A kind of semiconductor-sealing-purpose tooling Download PDFInfo
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- CN209607735U CN209607735U CN201920614697.XU CN201920614697U CN209607735U CN 209607735 U CN209607735 U CN 209607735U CN 201920614697 U CN201920614697 U CN 201920614697U CN 209607735 U CN209607735 U CN 209607735U
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Abstract
The utility model discloses a kind of semiconductor-sealing-purpose toolings, belong to electronic component encapsulation field.For the problem that the case where cutting using blade is still required in the separation of frame in the prior art, and the problem of warpage easily occurs for lead frame product, keeps the coplanarity of lead frame product entirety poor, and Yi Fasheng gets stuck.The utility model provides a kind of semiconductor-sealing-purpose tooling, including lead frame, frame is provided with outside the lead frame product zone, the area Zhua Jiao of a transition is spaced between product zone inside the frame and lead frame, a circle or multi-turn half-etching slot are provided in the area Zhua Jiao, it further include film, the film is covered on lead frame, and film is provided with dark border in lead frame half-etching groove location.It may ensure that frame can directly tear without influencing internal components, it is smooth effectively to control product zone to be cut, and transmission when will not get stuck, and improves cutting quality and efficiency.
Description
Technical field
The utility model relates to electronic component encapsulation fields, more specifically to a kind of semiconductor-sealing-purpose tooling.
Background technique
Position of the integrated antenna package in electronics pyramid is both pyramidal pinnacle and pyramidal pedestal.From
For in this angle of the density of electronic component (such as transistor), IC represents the tip of electronics.But IC is one again
Starting point is a kind of basic structural unit, is the basis for forming most of electronic systems in our lives.Equally, IC is not only
It is monolithic chip or basic electronic structure, the type of IC multifarious (analog circuit, digital circuit, radio circuit, sensor
Deng), thus for the demand of encapsulation and require also different.The pins base such as FBP, DFN island intensity frame, is cut
Process is cut to separate device.
In the prior art, certain improvement, such as Chinese Patent Application No. have also been carried out to cutting mode accordingly
201120121602.4, publication date on November 23rd, 2011, disclose a kind of QFN frame, including core devices frame and outline border
Frame, it is characterized in that being additionally provided with separable node, separable node is fixedly connected with core devices frame, outer framework.Core
Device frame is separated from from whole frame after being molded by cutting off separable node, thus is avoided in cutting process
Cutting of the cutter to copper material is reduced to the cutting of outer framework.There is also following deficiencies for a kind of QFN frame of above-mentioned patent disclosure
And defect: only by separable node connection between core devices frame, outer framework, support strength is low, therefore is being given birth to
During producing processing, it is easy to warpage occur, coplanarity is poor, is easy to happen and gets stuck when product is transmitted, and is cutting
It cuts and has been cut inclined problem in process by Warping Effect, product entirety warpage degree is bigger, and it is also higher to cut inclined risk；And
Its separation for still needing to be carried out frame using the mode of cutting, is needed using blade, when cutting forms single package product,
Cutting blade can still cut frame, increase cutting tool abrasion.
Utility model content
1. technical problems to be solved
It still needs to cut using blade for framework apart in the prior art, during being produced and processed, because
There are biggish thermal expansion coefficient differences with plastic packaging material for lead frame, after the completion of encapsulating, it may occur that warpage keeps lead frame product whole
The coplanarity of body is poor, and then the problem of easily get stuck when follow-up process lead frame product is transmitted, and in cutting action
In inclined problem has been cut by Warping Effect, the utility model provides a kind of semiconductor-sealing-purpose tooling.It may ensure that
Frame can directly tear without influencing internal components, guarantee that product zone is smooth during tearing off, transmission when will not block
Material is also beneficial to improve the precision of cutting, improves cutting action operation quality.
2. technical solution
The purpose of the present invention is achieved through the following technical solutions.
A kind of semiconductor-sealing-purpose tooling, including lead frame, the lead frame are provided with one or more product zones, produce
It is frame outside product area, the area Zhua Jiao is provided between frame and each product zone, is arranged in the area Zhua Jiao around product zone
There is a circle half-etching slot.
It further, further include film, the film is covered in the lead frame back side, and film is in lead frame half
Etching groove location is provided with dark border.Dark border product zone covers blue film, can hide dark border after exposing blue film
Blue film development firmly is got rid of, and the remaining metal of half-etching slot then without the covering of blue film can carry out all etching away, and is formed
Total eclipse carves ring, can carve ring by the total eclipse etched and discharge stress, to reduce product entirety warpage degree.
Further, the area Zhua Jiao being arranged between frame and each product zone is a circle.
Further, hollow out is all arranged in the area Zhua Jiao inside and outside half-etching slot grabs glue groove.Half in the area Zhua Jiao
It etching groove and grabs glue groove and all plays the role of grabbing glue, in addition the half-etching slot later period, which has etched after remaining metal and played, removes frame
Effect, and laid between half-etching slot and product zone and grabbed glue groove, can be to avoid influence when removing frame to product, such as
The burr generated when removing frame, only there are the areas Zhua Jiao jagged, or while removing frame causes plastic packaging material to be broken,
If half-etching slot is set up directly on product zone edge, the section of plastic packaging material is uneven to will affect product zone edge product
Appearance.
Further, the lead frame is made of metal.Last total eclipse is carried out using acid solution to carve, it is convenient fast
Existing etching solution can be used to work for victory.
Further, side is provided with cutting identification hole in or beyond the lead frame half-etching slot, advanced before cutting
The contraposition work of row cutter.
Further, the cutting identification hole is that cross cuts shape.
Further, one short side of lead frame is provided with handle in frame edge position, if necessary can also be with
Other positions conveniently caught are set, facilitate the later period that hand or tweezers is directly used to grab when removing.
A kind of method for packaging semiconductor, specific steps are as follows: include the following steps,
A, above-mentioned encapsulation tooling is made, half-etching slot is provided on lead frame；
B, in the enterprising luggage piece of lead frame, progress ball bonding process；
C, upper one layer of photosensitive film is pressed at the product back side after encapsulating, solidifying afterwards, pastes film, and film is covered in lead frame
The back side；Film is provided with dark border in lead frame half-etching groove location；In addition, film is golden other than the pin of product zone
Belong to position and black pattern is set；
D, after being exposed, develop, etching, lead frame exposes total eclipse and carves ring, exposes after metal etch falls other than pin
Pin, after pin extending part is electroplated, plating generally carries out tin plating, carries out upper circuit board convenient for subsequent process.
E, whole product is completed after cutting preceding pad pasting, is placed on cutting equipment workbench, by cutting identification hole to knife
Tool is positioned, and product zone is sucked by the vacuum on workbench, the handle of clamping lead frame edge setting removes frame manually；
F, cutting forms single package product.
Further, after pad pasting, after clamping frame using tweezers or pin handle, frame is removed.
3. beneficial effect
Compared with the prior art, utility model has the advantages that
The tooling of this programme guarantees that under the conditions of prior art, frame front has half-etching slot around each product zone
On the basis of improve film design, at the corresponding frame back side of this half-etching carry out one again through pad pasting, exposure, development etch process
Secondary etching, the frame back side after making etching form total eclipse and carve ring, can be directly by product zone surrounding after cutting action pad pasting
The step of frame removes manually, saves cutting frame, it may ensure that frame can directly tear without influencing internal components, tears
Guarantee that product zone is smooth during going, transmission when will not get stuck, and reduce the employee work time and process-cycle, raising are cut
Efficiency is cut, manufacturing cost is reduced；The abrasion of cutting tool is reduced simultaneously, reduces material cost；Cutting stress is reduced, product is improved
Reliability, while reducing product and cutting hemiplegia danger.
Detailed description of the invention
Fig. 1 is lead frame structure schematic diagram；
Fig. 2 lead frame turning and marginal portion a-quadrant enlarged drawing.
Figure label explanation:
1, handle；2, identification hole is cut；3, frame；4, glue groove is grabbed；5, half-etching slot；6, product zone；7, the area Zhua Jiao.
Specific embodiment
With reference to the accompanying drawings of the specification and specific embodiment, the utility model is described in detail.
Embodiment 1
As shown in Figure 1, 2, this programme devises a kind of semiconductor-sealing-purpose tooling, including lead frame, is that one kind is directed to
Field of semiconductor package need to carry out the lead frame of device isolation with cutting, the product zone 6 of multiple arrangements is provided in lead frame, often
The frame 3 being arranged outside a product zone 6, adjacent product area 6 are connected with frame 3, the product zone 6 inside frame 3 and lead frame it
Between the area Zhua Jiao 7 of a transition is set, a circle half-etching slot 5 is provided in the area Zhua Jiao 7, in the area Zhua Jiao 7 two inside and outside half-etching slot 5
What side was all arranged multiple hollow outs grabs glue groove 4, and the part area Zhua Jiao retained on the inside of half-etching slot 5 can make directly to tear before cutting
For frame without influencing internal components, also can protect product zone 6 will not be etched liquid erosion.The design of half-etching slot 5 does not influence to lose
The UPH of process is carved, it is synchronous when pin being etched after producing encapsulating and rear solidification to carry out.Half-etching is to use acid flux material,
Such as etching solution, the area Zhua Jiao of frame is etched into the groove of certain shapes and is unlikely to wear lead frame etching.
Half-etching slot 5 is to grab glue in the effect of encapsulating process, improves the binding ability of encapsulating process plastic packaging material and lead frame,
When needing to remove, removed with etching；Etched after product packaging, will metal whole etching off herein, do not need to cut, then
Can direct torn edges frame, trimming frame is not necessarily to, because half-etched regions are not related to product zone, directly by frame and internal product
Area's separation, frame can directly tear without influencing internal components after etching, directly raising cutting efficiency.Frame 3 is etched, to upper
Procedure etches UPH without influence, while reducing cutting stress, and chip is prevented to be damaged in cutting.
The lead frame half-etching slot is outer or inside is provided with cutting identification hole 2.The cutting identification hole 2 of this programme is
Cross also can choose other shapes, as long as guaranteeing positioning, cutting identification hole 2 exists as cutting alignment mark, setting
Half-etching slot is peripheral, after product pad pasting, is fixed on the workbench of cutting machine, working at the same time platform has vacuum suction, it is ensured that product
Region is fixed.
In addition, cutting identification hole 2 can be set on the inside of half-etching slot as cutting alignment mark, torn edges frame is being carried out
Afterwards, it still can be positioned.
One short side of lead frame is provided with handle 1 in frame edge position.The later period is facilitated directly to use hand when removing
Crawl.Frame 3 directly is removed, it is convenient and efficient, it is high-efficient.
It further include film, the film is covered on lead frame, and film is set in 5 position of lead frame half-etching slot
It is equipped with dark border.Around each product zone, through exposing after pad pasting, corresponding frame back position below this dark border,
That is the position of half-etching slot 5, no dry film protection, is etched by liquid medicine, forms total eclipse and carves ring, before pad pasting, can directly remove frame and
Product is not influenced, cutting action is carried out to propose effect, improves cutting efficiency, reduces blade abrasion, and can be by etching
Total eclipse carve ring and discharge stress, to reduce product entirety warpage degree, improve cutting aligning accuracy, avoid cutting partially, raising is cut
Cut quality.
By being provided with the frame 3 of half-etching slot 5, frame can be effectively ensured can directly tear without influencing this programme
Internal components guarantee that product zone is smooth during tearing off, and transmission when will not get stuck, directly raising cutting efficiency.
Using a kind of method for packaging semiconductor of above-mentioned lead frame and progress, specific steps are as follows: including as follows
Step,
A, the tooling in above-described embodiment is made, half-etching slot 5 is provided on lead frame；
B, in the enterprising luggage piece of lead frame, progress ball bonding process；
C, upper one layer of photosensitive film is pressed at the product back side after encapsulating, solidifying afterwards, pastes film, and film is covered in lead frame
On；Film is provided with dark border in lead frame half-etching groove location；In addition, film metal other than the pin of product zone
Black pattern is arranged in position.
D, after being exposed, develop, etching, lead frame expose total eclipse carve ring, after be electroplated；Metal etch other than pin
Expose pin after falling, after pin extending part is electroplated；Plating progress is tin plating, carries out upper circuit convenient for subsequent process
Plate.
E, after pad pasting, product is placed on cutting equipment workbench, and product zone is sucked in vacuum, using tweezers clamp frame or
After person pins handle, frame is removed manually；
F, cutting forms single package product.
Cooperate film using original half-etching slot 5 by using above-mentioned tool structure, guarantee in prior art item
Under part, surrounding is cut with film design is improved on the basis of half-etching slot in the positive each product zone of frame, through pad pasting, exposure, shows
Shadow etch process is once etched again at the corresponding frame back side of this half-etching, and the frame back side after making etching forms one entirely
Ring is etched, the total eclipse that etches carves ring release stress, to reduce product entirety warpage degree, when transmitting subsequent product not
The problem of getting stuck；After cutting action pad pasting, directly product zone circumferential side frame can be removed manually, so that subsequent handling
Directly frame can be torn, save cutting frame the step of, reduce technique, it may ensure that frame can directly tear without
Influence internal components, further reduce product entirety warpage degree to be cut after tearing frame off, reduce the employee work time and
Process-cycle improves cutting efficiency, reduces manufacturing cost；The abrasion of cutting tool is reduced simultaneously, reduces material cost；Reduction is cut
Stress improves product reliability, while reducing product and cutting hemiplegia danger.
Make original half-etching slot become total eclipse cutting when etching, improve cutting efficiency, reduces employee work
Time and process-cycle reduce manufacturing cost；The abrasion of cutting tool is reduced, material cost is reduced；And it reduces product and cuts hemiplegia
The yield of danger, product improves, and improves the reliability of tearing frame.
Embodiment 2
Embodiment 2 is substantially the same manner as Example 1, the difference is that, this programme uses in lead frame and is provided with one
Product zone 6 is frame 3 outside product zone 6, is the area Zhua Jiao 7 between frame 3 and product zone 6, and a circle half is provided in the area Zhua Jiao 7
Etching groove 5, multiple hollow outs are all arranged in the area Zhua Jiao 7 inside and outside half-etching slot 5 grabs glue groove 4.
Schematically the invention and embodiments thereof are described above, description is not limiting, not
In the case where spirit or essential characteristics of the invention, the present invention can be realized in other specific forms.Institute in attached drawing
What is shown is also one of the embodiment of the invention, and actual structure is not limited to this, any attached in claim
Icon note should not limit the claims involved.So not departed from if those of ordinary skill in the art are inspired by it
In the case where this creation objective, frame mode similar with the technical solution and embodiment are not inventively designed, it should all
Belong to the protection scope of this patent.In addition, one word of " comprising " is not excluded for other elements or step, "one" word before the component
It is not excluded for including " multiple " element.The multiple element stated in claim to a product can also by an element by software or
Person hardware is realized.The first, the second equal words are used to indicate names, and are not indicated any particular order.
Claims (8)
1. a kind of semiconductor-sealing-purpose tooling, including lead frame, it is characterised in that: the lead frame is provided with one or more
Product zone (6) is frame (3) outside product zone (6), is provided with the area Zhua Jiao (7) between frame (3) and each product zone (6),
Product zone (6) are provided with a circle half-etching slot (5) in the area Zhua Jiao (7).
2. a kind of semiconductor-sealing-purpose tooling according to claim 1, it is characterised in that: it further include film, it is described
Film is covered in the lead frame back side, and film is provided with dark border in lead frame half-etching slot (5) position.
3. a kind of semiconductor-sealing-purpose tooling according to claim 1, it is characterised in that: frame (3) and each product
The area Zhua Jiao (7) being arranged between area (6) is a circle.
4. a kind of semiconductor-sealing-purpose tooling according to claim 1, it is characterised in that: in half in the area Zhua Jiao (7)
Multiple hollow outs are all arranged inside and outside etching groove (5) grabs glue groove (4).
5. a kind of semiconductor-sealing-purpose tooling according to claim 1 or 4, it is characterised in that: the lead frame half loses
Side is provided with several cuttings identification hole (2) in or beyond cutting (5).
6. a kind of semiconductor-sealing-purpose tooling according to claim 5, it is characterised in that: the cutting identification hole (2)
Shape is cut for cross.
7. a kind of semiconductor-sealing-purpose tooling according to claim 1 or 4, it is characterised in that: the lead frame edge
Position is provided with handle (1).
8. a kind of semiconductor-sealing-purpose tooling according to claim 7, it is characterised in that: handle (1) setting exists
Frame (3) wherein short side one or both ends.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920614697.XU CN209607735U (en) | 2019-04-29 | 2019-04-29 | A kind of semiconductor-sealing-purpose tooling |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920614697.XU CN209607735U (en) | 2019-04-29 | 2019-04-29 | A kind of semiconductor-sealing-purpose tooling |
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| CN209607735U true CN209607735U (en) | 2019-11-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098168A (en) * | 2019-04-29 | 2019-08-06 | 长电科技（滁州）有限公司 | A kind of semiconductor-sealing-purpose tooling and packaging method |
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- 2019-04-29 CN CN201920614697.XU patent/CN209607735U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098168A (en) * | 2019-04-29 | 2019-08-06 | 长电科技（滁州）有限公司 | A kind of semiconductor-sealing-purpose tooling and packaging method |
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