CN115213804A - Electrochemical mechanical hybrid polishing device and polishing method - Google Patents
Electrochemical mechanical hybrid polishing device and polishing method Download PDFInfo
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- CN115213804A CN115213804A CN202210922558.XA CN202210922558A CN115213804A CN 115213804 A CN115213804 A CN 115213804A CN 202210922558 A CN202210922558 A CN 202210922558A CN 115213804 A CN115213804 A CN 115213804A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/003—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor whereby the workpieces are mounted on a holder and are immersed in the abrasive material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/002—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using electric current
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/02—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
- B24B31/0224—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels the workpieces being fitted on a support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/02—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
- B24B31/03—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels the workpieces being continuously-travelling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The invention discloses an electrochemical mechanical mixing polishing device which is characterized by comprising a polishing tank for containing polishing liquid, a first rotating device fixedly arranged above the polishing tank, a second rotating device fixedly arranged below the polishing tank and an electrolytic polishing device, wherein the first rotating device is used for being used for containing polishing liquid; the first rotating device is used for clamping a workpiece to be polished and driving the workpiece to be polished to rotate along a first axis in the polishing solution, and the second rotating device is used for driving the polishing groove to rotate along a second axis; the first rotating device and the second rotating device are used for carrying out resistance fine grinding polishing on a workpiece to be polished, and the electrolytic polishing device is used for carrying out electrochemical polishing on the workpiece to be polished. The invention provides a mixed polishing device combining resistance fine grinding polishing and electrochemical polishing, which can quickly and effectively reduce the surface roughness of metal parts, improve the processing efficiency and have good polishing effect.
Description
Technical Field
The invention belongs to the technical field of polishing processing, and particularly relates to an electrochemical mechanical hybrid polishing device and a polishing method.
Background
Additive Manufacturing (AM) technology is commonly referred to as 3D printing technology, and combines computer aided design, material processing and molding technology, and a Manufacturing technology for stacking metal materials, non-metal materials, medical biomaterials and the like layer by layer through software and a numerical control system on the basis of a digital model file in modes of extrusion, sintering, melting, photocuring and the like to manufacture a solid object. In modern technology, the defects of the traditional manufacturing technology can be overcome by using metal additive manufacturing technologies such as Selective Laser Melting (SLM), and various parts with complex shapes, including complex curved surfaces with suspended parts, complex hollowed-out shapes and the like, can be printed.
However, the surface morphology of the parts produced by the metal additive manufacturing technology is not ideal, and polishing processing is often required, so that the production requirements are met. When the part is polished by only using the superfinishing process, the polishing time of the process is too long, and the polished surface of the part is easy to deform, so that the technical research on realizing mixed polishing by using the mixed processing process is carried out on schedule.
Since the 60 s of the 20 th century, research on hybrid processing techniques has been carried out intensively, and the background of research on the polishing field is mainly polishing on a simple regular surface or polishing using a simple linear trajectory, and research on free curved surfaces such as curved surfaces of SLM parts has not been reported.
Therefore, in order to solve the above technical problems, it is necessary to provide an electrochemical mechanical hybrid polishing apparatus and a polishing method.
Disclosure of Invention
In view of the above, the present invention provides an electrochemical mechanical hybrid polishing apparatus and a polishing method.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an electrochemical mechanical mixing polishing device comprises a polishing tank for containing polishing liquid, a first rotating device fixedly arranged above the polishing tank, a second rotating device fixedly arranged below the polishing tank and an electrolytic polishing device; the first rotating device is used for clamping a workpiece to be polished and driving the workpiece to be polished to rotate along a first axis in the polishing solution, and the second rotating device is used for driving the polishing groove to rotate along a second axis; the first rotating device and the second rotating device are used for carrying out resistance fine grinding polishing on the workpiece to be polished, and the electrolytic polishing device is used for carrying out electrochemical polishing on the workpiece to be polished.
In one embodiment, the first rotating device includes a first rotating support plate fixedly mounted on the upper surface of the polishing tank, a first power device connected to the first rotating support plate, and a workpiece clamping assembly fixedly mounted on the first power device and disposed below the first rotating support plate.
In one embodiment, the second rotating device includes a second rotating support plate fixedly mounted on the lower surface of the polishing trough, and a second power device connected to the lower portion of the second rotating support plate.
In one embodiment, the rotation speed of the first rotating device is 10rpm/min to 1000rpm/min; and/or the rotating speed of the second rotating device is 10 rpm/min-500 rpm/min.
In one embodiment, the first axis and the second axis are not coincident with each other.
In one embodiment, the electrolytic polishing device comprises an electrolytic polishing corrosion instrument, a cathode clamp and an anode clamp; the cathode clamp is used for connecting the polishing tank with the cathode of the electrolytic polishing corrosion instrument; the anode clamp is used for connecting the workpiece to be polished with the anode of the electrolytic polishing corrosion instrument.
In one embodiment, the workpiece to be polished is used as an anode, the polishing tank is used as a cathode, and the horizontal distance between the anode and the cathode is 20 mm-40 mm.
In one embodiment, the electrolytic polishing corrosion instrument adopts a direct-current stabilized power supply, and the power supply voltage value is 10V-20V; the current density formed in the polishing solution after electrification is 15A/dm 2 ～25A/dm 2 。
In one embodiment, the polishing liquid comprises: an electrolyte and an abrasive medium; the electrolyte comprises 80-90% of phosphoric acid and deionized water; the abrasive medium comprises aluminum oxide grains, is conical and has the size of 1-3 mm.
The technical scheme provided by another embodiment of the invention is as follows: a polishing method of the electrochemical mechanical hybrid polishing device comprises the following steps:
s1, preparing polishing solution:
s2, driving a workpiece to be polished to rotate along a first axis in the polishing solution through a first rotating device, driving a polishing groove to rotate along a second axis through a second rotating device, and carrying out resistance fine grinding polishing on the workpiece to be polished under the combined action of the first rotating device and the second rotating device; and carrying out electrochemical polishing on the workpiece to be polished by the electrolytic polishing device.
The invention has the following beneficial effects:
the electrochemical mechanical mixing polishing device has the advantages of simple structure, low cost, easy operation and lower maintenance cost;
the invention provides a mixed polishing method combining resistance fine grinding polishing and electrochemical polishing, which can greatly reduce the surface roughness of metal parts in a short time, keep the shape of the edges of the parts, improve the processing efficiency and have good polishing effect.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of an electrochemical mechanical hybrid polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic top view of an electrochemical-mechanical hybrid polishing apparatus and a workpiece to be polished during a polishing process according to an embodiment of the present invention;
FIG. 3 is a schematic view of a polishing groove at a microscopic level during a polishing process according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating a polishing method of the electrochemical mechanical hybrid polishing apparatus according to an embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the invention discloses an electrochemical mechanical hybrid polishing device, which comprises a polishing tank 1, a first rotating device 2, a second rotating device 3 and an electrolytic polishing device 4.
Referring to fig. 2, the polishing tank 1 is a cylindrical hollow casing structure, and contains a polishing solution 11 therein, and a sealing cover is disposed on the top of the polishing tank 1 for fixedly mounting the first rotating device 2. The shape of the polishing tank 1 is not limited to the illustrated shape, and may be a square or rectangular parallelepiped hollow casing structure.
The polishing liquid 11 in this embodiment includes: electrolyte 112 and abrasive media 111; the electrolyte 112 includes 85% phosphoric acid and deionized water. The abrasive media 111 comprises alumina grains, and the abrasive media 111 is tapered to have a size of about 2mm. The mass fraction of phosphoric acid and the size of alumina grains are not limited to the values recited, and other values not recited in the numerical ranges are also applicable.
Referring to fig. 2, the first rotating device 2 is fixedly installed above the polishing tank 1 along a vertical direction and is close to a sidewall of the polishing tank 1, and the first rotating device 2 is configured to clamp the workpiece 5 to be polished and drive the workpiece 5 to be polished to rotate along a first axis in the polishing liquid 11.
Further, the first rotating device 2 in this embodiment includes a first rotating pallet 21, a first power device 22, and a workpiece clamping assembly. The first rotary supporting plate 21 is fixedly arranged on the upper surface of the sealing cover of the polishing groove 1; the first power device 22 is connected above the first rotary supporting plate 21, and the output shaft of the first power device 22 passes through the first rotary supporting plate 21 and the cover of the polishing groove 1 downwards to be connected with the workpiece clamping assembly. By means of the design, the first power device 22 keeps stable in the process of driving the workpiece 5 to be polished to rotate along the first axis, and the workpiece 5 to be polished is prevented from being displaced in the polishing process.
Further, the workpiece holding assembly in this embodiment includes a workpiece support 23 and a workpiece holder 24, the workpiece support 23 is fixedly installed at the bottom of the polishing receptacle 1 and connected to the output shaft of the first power device 22, and the upper surface of the workpiece support 23 contacts with the lower surface of the cover of the polishing receptacle 1 for supporting the workpiece 5 to be polished. A work holder 24 is fitted to the bottom of the work support 23 for holding the work 5 to be polished.
The second rotating device 3 is fixedly arranged right below the polishing trough 1 along the axial direction of the polishing trough 1, and the second rotating device 3 is used for driving the polishing trough 1 to rotate along the second axis.
Further, the second rotating device 3 comprises a second rotating pallet 31 and a second power device 32; the second rotary supporting plate 31 is fixedly arranged on the lower surface of the polishing groove 1; the second power device 32 is connected to the lower part of the second rotary supporting plate 31, and the output shaft of the second power device 32 is arranged upward and connected to the second rotary supporting plate 31. By the design, the polishing groove 1 is kept in a horizontal state in the process of rotating along the second axis, and vertical vibration is avoided, so that the polishing liquid 11 is taken out of the polishing groove 1.
Further, in the present embodiment, the first axis is the axis of the output shaft of the first power unit 22, the second axis is the axis of the output shaft of the second power unit 32, and the first axis and the second axis do not coincide with each other.
The electrolytic polishing device 4 comprises an electrolytic polishing corrosion instrument 41, a cathode clamp 42 and an anode clamp 43; the cathode clamp 42 is used for connecting the polishing tank 1 with the negative electrode of the electrolytic polishing corrosion instrument 41; the anode jig 43 is used to connect the workpiece 5 to be polished with the anode of the electropolishing etcher 41.
The first and second rotating devices 2 and 3 are used for performing resistance finish polishing on the workpiece 5 to be polished, and the electrolytic polishing device 4 is used for performing electrochemical polishing on the workpiece 5 to be polished.
Referring to fig. 2 in conjunction with fig. 1, in the polishing process of the workpiece 5 to be polished by the electrochemical-mechanical hybrid polishing apparatus, the workpiece 5 to be polished serves as an anode, the polishing bath 1 serves as a cathode, and the horizontal distance between the anode and the cathode is set to 30mm. The horizontal distance is not limited to the recited values, and other values within the numerical range not recited are equally applicable.
The first rotating device 2 drives the workpiece 5 to be polished to rotate along a first axis, and the rotating speed of the first rotating device 2 is w 1 The rotation speed of the workpiece 5 to be polished is also w 1 ，w 1 The size of (2) was set to 500rpm/min.
The second rotating device 3 drives the polishing trough 1 to rotate along the second axis, and the rotating speed of the second rotating device 3 is w 2 The rotational speed of the polishing tank 1 is also w 2 (ii) a The rotation of the polishing tank 1 drives the polishing solution 11 to rotate along the second axis in the polishing tank 1, and the rotation speed of the polishing solution 11 is w 2 ，w 2 The size of (2) was set to 200rpm/min.
First rotating device 2 and second rotating deviceThe two rotating devices 3 cooperate in such a way that the workpiece 5 to be polished has a dragging speed V which is movable relative to the polishing liquid 11 1 The drag velocity V 1 Is determined by the rotational speed w of the first rotating means 2 1 And the rotation speed w of the second rotating device 3 2 In common decision, in this embodiment, when w is determined 1 And w 2 In the case of magnitude of (3), the towing speed V 1 Is 0.5m/s, drag velocity V 1 Always tangential to the direction of motion of the polishing liquid 11.
Rotational speed w of the first rotating device 2 1 And the rotational speed w of the second rotating means 3 2 Not limited to the recited values, other values not recited within the numerical range are equally applicable.
Referring to fig. 3, in the present embodiment, the polishing tank 1 is made of stainless steel and serves as a cathode during the polishing process, and the workpiece 5 to be polished is made of soluble metal and serves as an anode during the polishing process. In this case, the electric current oxidizes and dissolves metal ions on the surface of the workpiece 5 to be polished into the polishing liquid 11, and at the same time, the electrolyte 1122 ionizes into positive and negative ions, and the ions in the polishing liquid 11 move in two stages, thereby creating an electric current path. The electrolytic polishing corrosion instrument 41 adopts a direct current stabilized power supply, and the current density formed in the polishing solution 11 after electrification is 20A/dm 2 . The current density is not limited to the recited values, and other values within the numerical range not recited are equally applicable.
Referring to fig. 4, fig. 4 provides a polishing method of an electrochemical mechanical hybrid polishing apparatus in the above embodiment, which specifically includes:
s1, preparing polishing solution 11:
s2, driving the workpiece 5 to be polished to rotate along a first axis in the polishing solution 11 through the first rotating device 2, driving the polishing groove 1 to rotate along a second axis through the second rotating device 3, and carrying out resistance fine grinding polishing on the workpiece 5 to be polished under the combined action of the first rotating device 2 and the second rotating device 3; and, performing electrochemical polishing on the workpiece 5 to be polished by the electropolishing apparatus 4.
In summary, the specific working principle of the electrochemical mechanical hybrid polishing apparatus is as follows:
in the polishing process, resistance fine grinding polishing and electrochemical polishing are carried out simultaneously.
When the first rotating device 2 and the second rotating device 3 are opened together, the workpiece rotates along the first axis along with the output shaft of the first power device 22, the polishing groove 1 rotates along the second axis along with the output shaft of the second power device 32, and then the polishing solution 11 revolves along with the polishing groove 1, so that the workpiece moves relative to the polishing solution 11, the abrasive medium 111 in the polishing solution 11 collides with the surface of the workpiece at high speed, and the resistance fine grinding polishing is realized.
When the electropolishing corrosion meter 41 is turned on, the workpiece 5 to be polished serves as an anode, the polishing tank 1 serves as a cathode, based on the anode dissolution principle, the metal ions on the surface of the workpiece 5 to be polished are oxidized and dissolved in the polishing solution 11 by current, the separated metal ions and phosphoric acid in the polishing solution 11 form a layer of phosphate film attached to the surface of the workpiece, the phosphate film is thinner at the convex part and thicker at the concave part. The positive and negative ions in the polishing solution 11 move to two stages to generate a current path, the current density at the convex part is high, the dissolution is fast, the current flows along with the phosphate film, the surface of the rough workpiece 5 to be polished is gradually leveled, and the electrochemical polishing is realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The electrochemical mechanical mixing polishing device is characterized by comprising a polishing tank for containing polishing liquid, a first rotating device fixedly arranged above the polishing tank, a second rotating device fixedly arranged below the polishing tank and an electrolytic polishing device; the first rotary device is used for clamping a workpiece to be polished and driving the workpiece to be polished to rotate along a first axis in the polishing solution, and the second rotary device is used for driving the polishing tank to rotate along a second axis; the first rotating device and the second rotating device are used for carrying out resistance fine grinding polishing on the workpiece to be polished, and the electrolytic polishing device is used for carrying out electrochemical polishing on the workpiece to be polished.
2. The electrochemical-mechanical hybrid polishing apparatus as recited in claim 1, wherein the first rotating device comprises a first rotating blade fixedly mounted on the upper surface of the polishing receptacle, a first power device coupled to the first rotating blade, and a workpiece clamping assembly fixedly mounted on the first power device and disposed below the first rotating blade.
3. The electrochemical mechanical hybrid polishing apparatus as claimed in claim 1, wherein the second rotating device comprises a second rotating blade fixedly mounted on a lower surface of the polishing trough and a second power device connected to a lower portion of the second rotating blade.
4. The electrochemical mechanical hybrid polishing device as claimed in claim 1, wherein the first rotating means has a rotation speed of 10rpm/min to 1000rpm/min; and/or the rotating speed of the second rotating device is 10 rpm/min-500 rpm/min.
5. The electrochemical mechanical hybrid polishing apparatus of claim 1, wherein the first axis and the second axis are not coincident with each other.
6. The electrochemical mechanical hybrid polishing device according to claim 1, wherein the electropolishing device comprises an electropolishing etcher, a cathode fixture, and an anode fixture; the cathode clamp is used for connecting the polishing tank with the cathode of the electrolytic polishing corrosion instrument; the anode clamp is used for connecting the workpiece to be polished with the anode of the electrolytic polishing corrosion instrument.
7. The electrochemical-mechanical hybrid polishing device according to claim 6, wherein the workpiece to be polished serves as an anode, the polishing bath serves as a cathode, and the horizontal distance between the anode and the cathode is 20mm to 40mm.
8. The electrochemical mechanical hybrid polishing device according to claim 6, wherein the electropolishing corrosion meter employs a DC stabilized power supply, and the power supply voltage value is 10V-20V; the current density formed in the polishing solution after electrification is 15A/dm 2 ～25A/dm 2 。
9. The electrochemical-mechanical hybrid polishing apparatus as set forth in claim 1, wherein the polishing liquid comprises: an electrolyte and an abrasive medium; the electrolyte comprises 80-90% of phosphoric acid and deionized water; the abrasive medium comprises alumina grains, is conical and has the size of 1-3 mm.
10. A polishing method of the electrochemical mechanical hybrid polishing apparatus according to any one of claims 1 to 9, comprising:
s1, preparing polishing solution:
s2, driving the workpiece to be polished to rotate along a first axis in the polishing solution through a first rotating device, driving the polishing groove to rotate along a second axis through a second rotating device, and carrying out resistance fine grinding polishing on the workpiece to be polished under the combined action of the first rotating device and the second rotating device; and performing electrochemical polishing on the workpiece to be polished by the electrolytic polishing device.
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| CN202210922558.XA CN115213804A (en) | 2022-08-02 | 2022-08-02 | Electrochemical mechanical hybrid polishing device and polishing method |
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| CN202210922558.XA CN115213804A (en) | 2022-08-02 | 2022-08-02 | Electrochemical mechanical hybrid polishing device and polishing method |
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Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083796A (en) * | 1994-06-17 | 1996-01-09 | Japan Small Corp | Electrolytic flow polishing method |
| JPH083795A (en) * | 1994-06-17 | 1996-01-09 | Japan Small Corp | Electrolytic polishing method |
| KR20010107841A (en) * | 2001-10-31 | 2001-12-07 | 김우정 | Electropolishing Apparatus for Corrugated Membrane |
| US20040159557A1 (en) * | 2002-04-03 | 2004-08-19 | Shuzo Sato | Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device |
| CN101134287A (en) * | 2006-08-31 | 2008-03-05 | 富士重工业株式会社 | Process and apparatus for grinding with electrolytic dressing |
| CN102864486A (en) * | 2012-10-24 | 2013-01-09 | 哈尔滨电机厂有限责任公司 | Electrolytic polishing device |
| CN104191340A (en) * | 2014-08-29 | 2014-12-10 | 浙江工业大学 | Ultra-precision machining device based on non-Newtonian fluid shear thickening and electrolysis composition effect |
| CN104308670A (en) * | 2014-08-29 | 2015-01-28 | 浙江工业大学 | Ultra-precision processing method based on non-Newtonian fluid shear thickening and electrolyzing combined effect |
| CN105033833A (en) * | 2015-08-11 | 2015-11-11 | 浙江工业大学 | Inner hole wall polishing device based on non-Newtonian fluid shear thickening mechanism |
| CN109877657A (en) * | 2019-03-22 | 2019-06-14 | 湖南科技大学 | A kind of electrochemistry thickening polishing method |
| CN110281144A (en) * | 2019-07-22 | 2019-09-27 | 苏州大学 | Electricity induction assistant chemical mechanically polishes test device |
| CN113134784A (en) * | 2021-04-20 | 2021-07-20 | 厦门大学 | Method and device for wireless photoelectric chemical mechanical polishing of semiconductor wafer |
| CN113699580A (en) * | 2021-08-11 | 2021-11-26 | 中国矿业大学 | Electrolytic polishing solution, electrolytic polishing method and application |
| CN113897664A (en) * | 2021-11-11 | 2022-01-07 | 浙江工业大学 | Device and method for laser composite electrochemical polishing of titanium alloy |
| CN114473816A (en) * | 2022-02-21 | 2022-05-13 | 厦门大学 | Electrochemical mechanical polishing device alternately performing electrolytic corrosion and mechanical removal |
| CN114800238A (en) * | 2022-05-11 | 2022-07-29 | 北京博海康源医疗器械有限公司 | Method and device for removing burrs of micro scalpel through shear thickening |
-
2022
- 2022-08-02 CN CN202210922558.XA patent/CN115213804A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083796A (en) * | 1994-06-17 | 1996-01-09 | Japan Small Corp | Electrolytic flow polishing method |
| JPH083795A (en) * | 1994-06-17 | 1996-01-09 | Japan Small Corp | Electrolytic polishing method |
| KR20010107841A (en) * | 2001-10-31 | 2001-12-07 | 김우정 | Electropolishing Apparatus for Corrugated Membrane |
| US20040159557A1 (en) * | 2002-04-03 | 2004-08-19 | Shuzo Sato | Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device |
| CN101134287A (en) * | 2006-08-31 | 2008-03-05 | 富士重工业株式会社 | Process and apparatus for grinding with electrolytic dressing |
| CN102864486A (en) * | 2012-10-24 | 2013-01-09 | 哈尔滨电机厂有限责任公司 | Electrolytic polishing device |
| CN104191340A (en) * | 2014-08-29 | 2014-12-10 | 浙江工业大学 | Ultra-precision machining device based on non-Newtonian fluid shear thickening and electrolysis composition effect |
| CN104308670A (en) * | 2014-08-29 | 2015-01-28 | 浙江工业大学 | Ultra-precision processing method based on non-Newtonian fluid shear thickening and electrolyzing combined effect |
| CN105033833A (en) * | 2015-08-11 | 2015-11-11 | 浙江工业大学 | Inner hole wall polishing device based on non-Newtonian fluid shear thickening mechanism |
| CN109877657A (en) * | 2019-03-22 | 2019-06-14 | 湖南科技大学 | A kind of electrochemistry thickening polishing method |
| CN110281144A (en) * | 2019-07-22 | 2019-09-27 | 苏州大学 | Electricity induction assistant chemical mechanically polishes test device |
| CN113134784A (en) * | 2021-04-20 | 2021-07-20 | 厦门大学 | Method and device for wireless photoelectric chemical mechanical polishing of semiconductor wafer |
| CN113699580A (en) * | 2021-08-11 | 2021-11-26 | 中国矿业大学 | Electrolytic polishing solution, electrolytic polishing method and application |
| CN113897664A (en) * | 2021-11-11 | 2022-01-07 | 浙江工业大学 | Device and method for laser composite electrochemical polishing of titanium alloy |
| CN114473816A (en) * | 2022-02-21 | 2022-05-13 | 厦门大学 | Electrochemical mechanical polishing device alternately performing electrolytic corrosion and mechanical removal |
| CN114800238A (en) * | 2022-05-11 | 2022-07-29 | 北京博海康源医疗器械有限公司 | Method and device for removing burrs of micro scalpel through shear thickening |
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