CN115143911A

CN115143911A - Semiconductor device measuring device

Info

Publication number: CN115143911A
Application number: CN202211083595.2A
Authority: CN
Inventors: 吴玮; 王贵峰; 王梓怡
Original assignee: Jiangsu Kelu Electric Co ltd
Current assignee: Jiangsu Kelu Electric Co ltd
Priority date: 2022-09-06
Filing date: 2022-09-06
Publication date: 2022-10-04

Abstract

The invention discloses a semiconductor device measurement device, which belongs to the technical field of semiconductor device measurement. One end of the first contact component is fixedly installed with a measuring component, an adjustment component is slidably clamped on one side of the upper surface of the frame component, and a detection component is slidably clamped inside the adjustment component, and a pressure component is fixedly installed on the upper side of the placing component. Tightening components, by using measuring components, it is convenient to accurately measure semiconductor devices, and by using testing components, it is convenient to quickly test the semiconductor devices in the same group, and it is easy to operate, and by using pressing components, it is convenient to measure when measuring. The semiconductor device is pressed to avoid displacement and improve the accuracy of measurement, and through the guide plate and multiple measurement components, it is convenient to quickly measure multiple semiconductor devices at the same time, which is easy to use.

Description

Semiconductor device measuring device

Technical Field

The invention relates to a measuring device, in particular to a semiconductor device measuring device, and belongs to the technical field of semiconductor device measurement.

Background

The basic structure of most two-terminal devices (i.e., crystal diodes) is a PN junction, and the dimensions of the semiconductor device need to be accurately measured during the production of the semiconductor device. As disclosed in publication No.: CN202111224401.1, a semiconductor device measuring device belongs to semiconductor device and measures technical field, including supporting part, first drive division, second drive division, detection portion, the portion of holding and the portion of unloading, it rotates to set up to hold the portion for provide the support to semiconductor device, first drive division sets up supporting part one side is used for driving it rotates to hold the portion, detection portion sets up it keeps away from to hold the portion one side of supporting part for measure semiconductor device's thickness, the portion of unloading is installed hold inside the portion, the second drive division sets up the supporting part is inboard, and the second drive division is used for driving the portion of unloading removes, with the semiconductor device after measuring from it is ejecting to hold a portion edge. Compared with the prior art, the embodiment of the invention can realize continuous measurement of a plurality of semiconductor devices and has the advantage of high measurement efficiency.

And as disclosed in publication: CN113188433B, diameter measuring device for semiconductor material device, includes: the device comprises a test board body, a device adsorption mechanism and a limiting moving mechanism; a plurality of air holes are drilled on the test board body; the device adsorption mechanism is arranged at the bottom of the test board body and comprises an expansion base, a sealing separation cover is arranged in the expansion base, one end, far away from the test board body, of the sealing separation cover is connected with a plurality of connecting air pipes, and one side of each connecting air pipe is connected with a suction fan; the limiting moving mechanism is arranged on one side of the test board body and comprises a mounting plate, and a first lantern ring and a second lantern ring are arranged on one side of the mounting plate. According to the invention, through the arrangement of the corresponding mechanism on the test board, the semiconductor material device can be stably placed on the test board, the diameter of the device is conveniently measured by a user, meanwhile, the situation that the semiconductor material device is influenced by the outside to generate deviation in the measurement process is avoided, and the measurement accuracy is improved to a certain extent.

However, when the device is used and measurement is needed, each device needs to be measured, rapid measurement cannot be performed on a plurality of semiconductor devices, the device is inconvenient to use, and when the device is used and measurement is performed, the semiconductor devices are prone to displacement, measurement accuracy is poor, and use is affected.

Disclosure of Invention

The present invention is directed to solve the above problems, and an object of the present invention is to provide a semiconductor device measuring apparatus, which is convenient for rapid dimension measurement, convenient for use, convenient for operation, rapid measurement, high in measurement accuracy, and convenient for use.

The invention achieves the above object by the following technical scheme, a semiconductor device measuring device comprises a placing component, a frame body component is slidably clamped on the upper surface of the placing component, a contact component is uniformly inserted into one side inside the frame body component, a measuring component is fixedly installed at one end of a first contact component, the measuring end of the measuring component is contacted with one side of the frame body component, an adjusting component is slidably clamped on one side of the upper surface of the frame body component, a detecting component is slidably clamped inside the adjusting component, one side of the detecting component is contacted with one side of the contact component, a pressing component is fixedly installed at one side of the upper end of the placing component, one end of the pressing component is positioned right above one side of the placing component, the output ends of the pressing component are matched with the number of the contact components, the output ends of the pressing component and one end of the contact component are in a horizontal structure, when in use, a semiconductor device to be measured is uniformly placed inside the placing component, the pressing component is opened, the pressing component is enabled to press and fix the semiconductor device, the displacement of the semiconductor device is avoided, the measuring precision is improved, and the measuring component is enabled to be moved to be convenient for measuring the distance between the frame body component and the measuring component when the measuring component is moved to the frame body component, the measuring component, the resistance of the frame body component is conveniently, and right the regulating part is adjusted, make in the regulating part the sense terminal of determine module with the one end of contact module contacts, then promote determine module makes determine module moves on the regulating part, through determine module measures whether the one end of contact module is on the coplanar, when being on the coplanar, it is the same to explain the data that carry out the measurement to a plurality of semiconductor subassemblies, when one of them the one end of contact module is not on the same horizontal plane with other the one end of contact module, determine module's sense terminal produces undulantly, makes determine module send the warning, is convenient for carry out the individual measurement to the semiconductor device who sends the warning, facilitates the use, and is convenient for operate, and after detecting the completion, through relieving compress tightly the subassembly, conveniently take out semiconductor device, convenient to use.

Preferably, for the convenience of placing the semiconductor device, the placing assembly comprises a placing plate, a baffle is fixedly mounted on one side of the upper surface of the placing plate, a guide plate is uniformly and fixedly mounted on one side of the baffle, the contact end of the contact assembly is clamped between the guide plates, suckers are uniformly and fixedly mounted on four corners of the lower surface of the placing plate, slide rails are uniformly arranged on two sides of the upper surface of the placing plate, the support body assembly is clamped in a sliding mode in the slide rails, the compressing assembly is fixedly mounted on the upper surface of the placing plate and located on the other side of the baffle, and the semiconductor device is conveniently placed on the guide plate.

Preferably, in order to facilitate the movement of the contact assembly, the contact assembly is tightly pressed against the semiconductor device, the frame assembly comprises a movable frame, guide rails are fixedly mounted on two sides of the lower end of the movable frame, the guide rails are slidably clamped inside the slide rails, a partition plate is fixedly mounted on one side of the upper end of the movable frame, through holes of a square structure are uniformly formed in the partition plate, the contact assembly is inserted into the through holes, first sliding grooves are formed in two sides of the upper end of the movable frame, and two ends of the adjusting assembly are slidably clamped inside the first sliding grooves.

Preferably, for the convenience of being convenient for contact module compresses tightly with semiconductor device, and makes measurement element measures length to semiconductor device, contact module includes the movable rod, just the movable rod is square structure, the one end fixed mounting of movable rod has the contact plate, the contact plate is located between the deflector, just the intermediate position fixed mounting of movable rod has first spring, the other end of first spring with one side looks fixed connection of baffle, just first spring is located the movable rod with between the baffle, just the movable rod is pegged graft the inside of through-hole, just the movable rod passes through the through-hole extends to the other end of baffle, measurement element's one end and first on the contact module the one end looks fixed connection of movable rod.

Preferably, in order to measure the semiconductor device conveniently, the measuring component comprises a connecting plate, the connecting plate is fixedly mounted on the first contact component, one end of the movable rod is arranged on the first contact component, the connecting plate is of an L-shaped structure, a dial indicator is fixedly mounted in the middle of one end of the connecting plate, and the measuring end of the dial indicator is in contact with one side of the placing plate.

Preferably, in order to facilitate simultaneous measurement of semiconductor devices in the same group and improve measurement efficiency, the adjusting assembly comprises an adjusting frame, the adjusting frame is of an inverted concave structure, two ends of the adjusting frame are slidably connected with the inside of the first sliding groove, a second sliding groove is transversely formed in the middle position of the inside of the adjusting frame, the detecting assembly is slidably connected with the inside of the second sliding groove, the upper end and the lower end of the second sliding groove are communicated, one side of each of the two ends of the adjusting frame is in threaded connection with a locking nut, one end of the locking nut extends to the inside of the first sliding groove and is tightly pressed with the first sliding groove, the detecting assembly comprises a movable box, sliders are fixedly mounted on two outer sides of the movable box, and the movable box is slidably connected with the inside of the second sliding groove through the sliders, two ends of the movable box respectively extend to the upper end and the lower end of the adjusting frame, the lower end of the movable box is in an open design, a detection plate is rotatably installed in the movable box, a detection wheel is rotatably installed at the lower end of the detection plate, one side of the detection wheel is attached to one end of the movable rod, a handle is fixedly installed at the upper end of the movable box, an observation hole is formed in the middle position of the upper end of the movable box, a second spring is uniformly and fixedly installed at the upper end of the inner part of the movable box, the other end of the second spring is fixedly connected with the detection plate, shaft levers are fixedly installed at two ends of the detection plate, the detection plate is rotatably installed in the movable box through the shaft levers, contact pins are fixedly installed at two sides of the detection plate, and conductive bars are fixedly installed at two sides of the inner part of the movable box, and an indicator lamp is fixedly arranged at the upper end of the detection plate below the observation hole, and the indicator lamp is lighted when the contact pin is contacted with the conductive bar.

Preferably, for the convenience of compressing tightly semiconductor device, it includes the mounting bracket to compress tightly the subassembly, just the mounting bracket is L type structure, mounting bracket fixed mounting be located place the board directly over be located one side of baffle, just the guiding hole has all been seted up to the upper end both sides of mounting bracket, peg graft in the inside of guiding hole has the guide bar, just the lower extreme fixed mounting of guide bar has the lifter plate, the even fixed mounting of lower extreme of lifter plate has the connecting rod, just the lower extreme fixed mounting of connecting rod has deformation ball, deformation ball is located between the guide plate, just the upper end intermediate position fixed mounting of mounting bracket has electric telescopic handle, electric telescopic handle's the end that stretches out with lifter plate fixed connection mutually.

The beneficial effects of the invention are: through adopting measuring component, conveniently carry out accurate measurement to semiconductor device, and through adopting detection assembly, after measuring the completion, be convenient for carry out short-term test to the semiconductor device of the same group, facilitate the use, be convenient for operate, and compress tightly the subassembly through adopting, when measuring, conveniently compress tightly semiconductor device, avoid producing the displacement, improve measured accurate nature, and through deflector and a plurality of measuring component, be convenient for carry out short-term test to a plurality of semiconductor devices simultaneously, convenient to use.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic view of another embodiment of the present invention.

Fig. 3 is a schematic structural diagram of the placement module and the adjustment module of the present invention.

Fig. 4 is a schematic structural view of a placement module according to the present invention.

Fig. 5 is a schematic structural view of the frame assembly of the present invention.

FIG. 6 is a schematic structural diagram of a contact assembly and a measurement assembly according to the present invention.

Fig. 7 is a schematic structural view of a frame assembly and a detection assembly according to the present invention.

FIG. 8 is a cross-sectional view of a detection assembly of the present invention.

Fig. 9 is a schematic structural view of the pressing member of the present invention.

In the figure: 1. placing the component; 101. placing a plate; 102. a baffle plate; 103. a guide plate; 104. a suction cup; 105. a slide rail; 2. a frame assembly; 201. a movable frame; 202. a guide rail; 203. a partition plate; 204. a through hole; 205. a first chute; 3. a contact assembly; 301. a movable rod; 302. a contact plate; 303. a first spring; 4. a measurement component; 401. a connecting plate; 402. a dial indicator; 5. an adjustment assembly; 501. an adjusting bracket; 502. a second chute; 503. locking the nut; 6. a detection component; 601. a movable box; 602. a slider; 603. detecting a plate; 604. detecting a wheel; 605. a handle; 606. an observation hole; 607. a second spring; 608. a shaft lever; 609. a stylus; 6010. a conductive strip; 6011. an indicator light; 7. a compression assembly; 701. a mounting frame; 702. a guide hole; 703. a guide bar; 704. a lifting plate; 705. a connecting rod; 706. a deformation ball; 707. an electric telescopic rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

A semiconductor device measuring device comprises a placing component 1, a frame body component 2 is connected to the upper surface of the placing component 1 in a sliding and clamping manner, a contact component 3 is uniformly inserted into one side of the inner portion of the frame body component 2 in a splicing manner, a measuring component 4 is fixedly installed at one end of the first contact component 3, the measuring end of the measuring component 4 is contacted with one side of the frame body component 2, an adjusting component 5 is connected to one side of the upper surface of the frame body component 2 in a sliding and clamping manner, a detecting component 6 is connected to the inner portion of the adjusting component 5 in a sliding and clamping manner, one side of the detecting component 6 is contacted with one side of the contact component 3, a compressing component 7 is fixedly installed on one side of the upper end of the placing component 1, one end of the compressing component 7 is positioned right above one side of the placing component 1, the output ends of the compressing components 7 are matched with the number of the contact components 3, and the output ends of the compressing components 7 and one end of the contact component 3 are in a horizontal structure, when the device is used, semiconductor devices to be measured are uniformly placed in the placing component 1, the pressing component 7 is opened, the pressing component 7 presses and fixes the semiconductor devices, the semiconductor devices are prevented from displacement, the measuring precision is improved, the frame body component 2 moves towards the direction of the semiconductor devices by moving the frame body component 2, when the contact component 3 contacts the semiconductor devices, the measuring end of the measuring component 4 is far away from the frame body component 2 due to resistance, the distance between the measuring component 4 and the frame body component 2 is measured by the measuring component 4, the length of the semiconductor devices is convenient to measure, after the measurement is finished, the frame body component 2 is fixed, the adjusting component 5 is adjusted, and the detecting end of the detecting component 6 in the adjusting component 5 is contacted with one end of the contact component 3, then promote determine module 6 for determine module 6 moves on adjusting part 5, whether the one end of measuring contact module 3 through determine module 6 is on the coplanar, when being on the coplanar, it is the same to explain carrying out the data that measure to a plurality of semiconductor subassemblies, when one end that wherein has a contact module 3 is not on the coplanar with the one end of other contact module 3, determine module 6's sense terminal produces undulantly, make determine module 6 send out the warning, be convenient for carry out the independent measurement to the semiconductor device who sends the warning, convenient to use, the operation of being convenient for, and after detecting the completion, through relieving compressing tightly subassembly 7, conveniently take out the semiconductor device, convenient to use.

As shown in fig. 4, the placing assembly 1 includes a placing plate 101, a baffle plate 102 is fixedly mounted on one side of the upper surface of the placing plate 101, a guide plate 103 is uniformly and fixedly mounted on one side of the baffle plate 102, contact ends of contact assemblies 3 are clamped between the guide plates 103, suckers 104 are uniformly and fixedly mounted on four corners of the lower surface of the placing plate 101, slide rails 105 are uniformly arranged on two sides of the upper surface of the placing plate 101, a frame body assembly 2 is slidably clamped inside the slide rails 105, a pressing assembly 7 is fixedly mounted on the other side of the placing plate 101, the suction cups 104 are used for facilitating placing and fixing, the guide plate 103 is used for facilitating placing of a semiconductor device between the guide plates 103, measurement is facilitated, and displacement is avoided.

As shown in fig. 5, the frame body assembly 2 includes a movable frame 201, and the lower end of the movable frame 201 is fixedly mounted with a guide rail 202 on both sides, and the guide rail 202 is slidably connected inside the slide rail 105, and a partition 203 is fixedly mounted on one side of the upper end of the movable frame 201, a through hole 204 of a square structure is uniformly provided on the partition 203, the contact assembly 3 is inserted into the through hole 204, and the upper end of the movable frame 201 is provided with a first chute 205 on both sides, the two ends of the adjusting assembly 5 are slidably connected inside the first chute 205, and are connected with the guide rail 202 through a sliding joint, so that the movable frame 201 can move conveniently, when measuring, one end of the movable frame 201 is attached to one side of the baffle 102.

As shown in fig. 6, the contact assembly 3 includes a movable rod 301, the movable rod 301 is of a square structure, a contact plate 302 is fixedly mounted at one end of the movable rod 301, the contact plate 302 is located between the guide plates 103, a first spring 303 is fixedly mounted at a middle position of the movable rod 301, the other end of the first spring 303 is fixedly connected with one side of the partition plate 203, the first spring 303 is located between the movable rod 301 and the partition plate 203, the movable rod 301 is inserted into the through hole 204, the movable rod 301 extends to the other end of the partition plate 203 through the through hole 204, one end of the measurement assembly 4 is fixedly connected with one end of the movable rod 301 on the first contact assembly 3, the measurement assembly 4 includes a connection plate 401, the connection plate 401 is fixedly mounted at one end of the movable rod 301 on the first contact assembly 3, the connection plate 401 is of an L-shaped structure, a dial indicator 402 is fixedly mounted at a middle position of one end of the connection plate 401, and a measurement end of the dial indicator 402 is in contact with one side of the placement plate 101, and a length of the semiconductor device can be obtained by measuring the length of the dial indicator 402.

As shown in fig. 7, the adjusting assembly 5 includes an adjusting frame 501, and the adjusting frame 501 is of an inverted concave structure, the two ends of the adjusting frame 501 are all slidably clamped inside the first sliding groove 205, and the inside middle position of the adjusting frame 501 has transversely provided the second sliding groove 502, the detecting assembly 6 is slidably clamped inside the second sliding groove 502, and the upper end and the lower end of the second sliding groove 502 are communicated, the two ends of the adjusting frame 501 are all threadedly connected with a locking nut 503, one end of the locking nut 503 extends to the inside of the first sliding groove 205, and is tightly pressed with the first sliding groove 205, and by means of the locking nut 503, the adjusting frame 501 is convenient to fix, and further the position of the detecting assembly 6 is convenient to adjust.

As shown in fig. 8, the detecting assembly 6 includes a movable box 601, and both outer sides of the movable box 601 are fixedly installed with sliders 602, the movable box 601 is slidably clamped inside the second sliding slot 502 through the sliders 602, and both ends of the movable box 601 respectively extend to the upper end and the lower end of the adjusting bracket 501, the lower end of the movable box 601 is of an open design, and the inner portion of the movable box 601 is rotatably installed with a detecting plate 603, the lower end of the detecting plate 603 is rotatably installed with a detecting wheel 604, and one side of the detecting wheel 604 is attached to one end of the movable rod 301, the upper end of the movable box 601 is fixedly installed with a handle 605, and an observation hole 606 is formed in the middle position of the upper end of the movable box 601, the inner upper end of the movable box 601 is uniformly and fixedly installed with a second spring 607, and the other end of the second spring 607 is fixedly connected to the detecting plate 603, both ends of the detecting plate 603 are fixedly installed with a shaft 608, and the shaft 603 is rotatably installed inside the movable box 601 through the shaft 608, both sides of the detecting plate 603 are fixedly installed with contact pins 609, and contact pins 6010 are fixedly installed under the observation hole 606, and when the contact with a light guide bar 6011, and a light guide bar 6011, so that the contact of the same size of the semiconductor light bar 6011 is convenient for determining device 6011, and the light bar 6010, when the light bar 6011 is in contact with the light bar 6011, and the light bar 6011, and the light bar 6011.

Example two

Referring to fig. 1-9, a semiconductor device measuring apparatus includes a placing assembly 1, a frame assembly 2 is slidably engaged with an upper surface of the placing assembly 1, a contact assembly 3 is uniformly inserted into one side of an inner portion of the frame assembly 2, a measuring assembly 4 is fixedly installed at one end of a first contact assembly 3, a measuring end of the measuring assembly 4 contacts one side of the frame assembly 2, an adjusting assembly 5 is slidably engaged with one side of the upper surface of the frame assembly 2, and a detecting assembly 6 is slidably engaged with an inner portion of the adjusting assembly 5, one side of the detecting assembly 6 contacts one side of the contact assembly 3, a pressing assembly 7 is fixedly installed at one side of an upper end of the placing assembly 1, one end of the pressing assembly 7 is positioned right above the side of the placing assembly 1, an output end of the pressing assembly 7 matches the number of the contact assemblies 3, and an output end of the pressing assembly 7 is in a horizontal structure with one end of the contact assembly 3, when in use, a semiconductor device to be measured is uniformly placed in the placing assembly 1, the pressing assembly 7 is opened, the semiconductor device is pressed and fixed, displacement of the semiconductor device is avoided, and the semiconductor device is measured, and the measuring assembly is measured by moving the measuring assembly 2, and the measuring assembly 4, the measuring assembly is measured by the measuring assembly 2, and the measuring assembly 4, when the measuring assembly is moved to the measuring assembly 2, the measuring assembly 2, the length of the measuring assembly is measured, the measuring assembly 2, and the measuring assembly 4, and the measuring assembly is measured by the measuring assembly, and the measuring assembly 2, and the measuring assembly is convenient for measuring assembly, and the measuring assembly 4, then promote determine module 6 for determine module 6 moves on adjusting part 5, whether the one end of measuring contact module 3 through determine module 6 is on the coplanar, when being on the coplanar, it is the same to explain carrying out the data that measure to a plurality of semiconductor subassemblies, when one end that wherein has a contact module 3 is not on the coplanar with the one end of other contact module 3, determine module 6's sense terminal produces undulantly, make determine module 6 send out the warning, be convenient for carry out the independent measurement to the semiconductor device who sends the warning, convenient to use, the operation of being convenient for, and after detecting the completion, through relieving compressing tightly subassembly 7, conveniently take out the semiconductor device, convenient to use.

As shown in fig. 9, the pressing assembly 7 includes a mounting frame 701, the mounting frame 701 is of an L-shaped structure, the mounting frame 701 is fixedly mounted right above the placing plate 101 and located on one side of the baffle 102, guide holes 702 are formed in both sides of the upper end of the mounting frame 701, guide rods 703 are inserted into the guide holes 702, a lifting plate 704 is fixedly mounted at the lower end of the guide rods 703, connecting rods 705 are uniformly and fixedly mounted at the lower end of the lifting plate 704, a deformation ball 706 is fixedly mounted at the lower end of each connecting rod 705, the deformation ball 706 is located between the guide plates 103, an electric telescopic rod 707 is fixedly mounted at the middle position of the upper end of the mounting frame 701, an extending end of the electric telescopic rod 707 is fixedly connected with the lifting plate 704, and when the lifting plate 704 is fixed, the electric telescopic rod 707 pushes the lifting plate 704 to descend, the deformation ball 706 is pressed on the semiconductor device, the deformation ball 706 deforms, so that the semiconductor device is conveniently fixed, and the measurement accuracy is improved.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor device measuring device, characterized in that it comprises a placing assembly (1), the upper surface of the placing assembly (1) is slidably clamped with a frame body assembly (2), and the frame body assembly (2) is A contact assembly (3) is evenly plugged into one side of the interior, and a measurement assembly (4) is fixedly installed at one end of the first contact assembly (3), and the measurement end of the measurement assembly (4) is connected to the frame body One side of the assembly (2) is in contact, the upper surface side of the frame body assembly (2) is slidably clamped with the adjustment assembly (5), and the inside of the adjustment assembly (5) is slidably clamped with the detection assembly ( 6), one side of the detection component (6) is in contact with one side of the contact component (3), and a pressing component (7) is fixedly installed on the upper end side of the placing component (1), and the One end of the pressing component (7) is located just above the side of the placing component (1), the output end of the pressing component (7) matches the number of the contact components (3), and all the The output end of the pressing component (7) and one end of the contact component (3) are in a horizontal structure.

2 . The semiconductor device measuring device according to claim 1 , wherein the placing assembly ( 1 ) comprises a placing plate ( 101 ), and a side of the upper surface of the placing plate ( 101 ) is fixedly mounted with a baffle plate (102), a guide plate (103) is evenly fixed on one side of the baffle plate (102), the contact end of the contact assembly (3) is clamped between the guide plates (103), and The four corners of the lower surface of the placing plate (101) are evenly fixed with suction cups (104), and the two sides of the upper surface of the placing plate (101) are evenly provided with sliding rails (105), and the frame assembly (2) The slide is clamped inside the slide rail (105), and the pressing component (7) is fixedly installed on the upper surface of the placing plate (101) on the other side of the baffle plate (102).

3 . The semiconductor device measuring device according to claim 2 , wherein the frame body assembly ( 2 ) comprises a movable frame ( 201 ), and both sides of the lower end of the movable frame ( 201 ) are fixedly installed. 4 . There are guide rails (202), and the guide rails (202) are slidably clamped inside the slide rails (105), and a partition plate (203) is fixedly installed on the upper end side of the movable frame (201). Square-shaped through holes (204) are evenly opened on the partition plate (203), the contact assembly (3) is inserted into the through holes (204), and the upper end of the movable frame (201) has two sides. Both sides are provided with a first chute (205), and both ends of the adjustment assembly (5) are slidably clamped inside the first chute (205).

4 . The semiconductor device measuring device according to claim 3 , wherein the contact assembly ( 3 ) comprises a movable rod ( 301 ), and the movable rod ( 301 ) is a square structure, and the movable rod One end of (301) is fixedly installed with a contact plate (302), the contact plate (302) is located between the guide plates (103), and a first spring ( 303), the other end of the first spring (303) is fixedly connected to one side of the partition plate (203), and the first spring (303) is located between the movable rod (301) and the partition plate (203). between the plates (203), the movable rod (301) is inserted inside the through hole (204), and the movable rod (301) extends to the partition plate through the through hole (204) At the other end of (203), one end of the measuring assembly (4) is fixedly connected with one end of the movable rod (301) on the first contact assembly (3).

5. A semiconductor device measuring device according to claim 4, characterized in that: the measuring assembly (4) comprises a connecting plate (401), and the connecting plate (401) is fixedly installed on the first said One end of the movable rod (301) on the contact assembly (3) is contacted, and the connecting plate (401) is of an L-shaped structure, and a dial indicator (402) is fixedly installed in the middle of one end of the connecting plate (401), And the measuring end of the dial indicator (402) is in contact with one side of the placing plate (101).

6 . The semiconductor device measuring device according to claim 5 , wherein the adjustment assembly ( 5 ) comprises an adjustment frame ( 501 ), and the adjustment frame ( 501 ) is an undercut structure, and the adjustment frame ( 501 ) Both ends of the frame (501) are slidably clamped in the interior of the first chute (205), and a second chute (502) is laterally opened at the inner middle position of the adjustment frame (501). The assembly (6) is slidably clamped inside the second chute (502), and the upper end and the lower end of the second chute (502) communicate with each other, and both ends of the adjustment frame (501) are on one side. A locking nut (503) is threadedly connected, and one end of the locking nut (503) extends into the interior of the first chute (205) and is pressed against the first chute (205).

7 . The semiconductor device measuring device according to claim 6 , wherein the detection assembly ( 6 ) comprises a movable box ( 601 ), and both outer sides of the movable box ( 601 ) are fixedly installed with A slider (602), the movable box (601) is slidably clamped inside the second chute (502) through the slider (602), and both ends of the movable box (601) extend respectively To the upper and lower ends of the adjusting frame (501), the lower end of the movable box (601) is designed with an opening, and a detection board (603) is rotatably installed inside the movable box (601), and the detection board ( The lower end of 603) is rotatably installed with a detection wheel (604), and one side of the detection wheel (604) is in contact with one end of the movable rod (301), and the upper end of the movable box (601) is fixedly installed with a A handle (605) is provided, and an observation hole (606) is provided in the middle position of the upper end of the movable box (601).

8 . The semiconductor device measuring device according to claim 7 , wherein a second spring ( 607 ) is uniformly and fixedly installed on the inner upper end of the movable box ( 601 ), and the second spring ( 607 ) The other end of the detection board (603) is fixedly connected to the detection board (603), and both ends of the detection board (603) are fixedly installed with shaft rods (608), and the detection board (603) passes through the shaft rod (608). ) is rotatably installed inside the movable box (601), the detection board (603) is fixedly installed with contact pins (609) on both sides, and both sides of the movable box (601) are fixedly installed with Conductive strip (6010), an indicator light (6011) is fixedly installed on the upper end of the detection board (603) below the observation hole (606), and the contact pin (609) is in phase with the conductive strip (6010). When touched, the indicator light (6011) lights up.

9 . The semiconductor device measuring device according to claim 2 , wherein the pressing assembly ( 7 ) comprises a mounting frame ( 701 ), and the mounting frame ( 701 ) is an L-shaped structure, and the The mounting bracket (701) is fixedly installed on one side of the baffle plate (102) directly above the placing plate (101), and guide holes (702) are provided on both sides of the upper end of the mounting bracket (701) A guide rod (703) is inserted into the guide hole (702), and a lift plate (704) is fixedly installed at the lower end of the guide rod (703), and the lower end of the lift plate (704) is evenly fixed and installed There is a connecting rod (705), and a deformation ball (706) is fixedly installed at the lower end of the connecting rod (705), the deformation ball (706) is located between the guide plates (103), and the mounting bracket ( An electric telescopic rod (707) is fixedly installed in the middle position of the upper end of 701), and the extension end of the electric telescopic rod (707) is fixedly connected with the lifting plate (704).