CN115125051A - Formula of special cutting fluid for monocrystalline silicon - Google Patents
Formula of special cutting fluid for monocrystalline silicon Download PDFInfo
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- CN115125051A CN115125051A CN202210578218.XA CN202210578218A CN115125051A CN 115125051 A CN115125051 A CN 115125051A CN 202210578218 A CN202210578218 A CN 202210578218A CN 115125051 A CN115125051 A CN 115125051A
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- monocrystalline silicon
- cutting fluid
- extreme pressure
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 42
- 239000002173 cutting fluid Substances 0.000 title claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 29
- -1 silver ions Chemical class 0.000 claims abstract description 23
- 239000002994 raw material Substances 0.000 claims abstract description 20
- 239000002826 coolant Substances 0.000 claims abstract description 16
- 239000013556 antirust agent Substances 0.000 claims abstract description 14
- 239000012459 cleaning agent Substances 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 13
- 229930195729 fatty acid Natural products 0.000 claims abstract description 13
- 239000000194 fatty acid Substances 0.000 claims abstract description 13
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 13
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 11
- 239000010452 phosphate Substances 0.000 claims abstract description 10
- 239000004094 surface-active agent Substances 0.000 claims abstract description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 6
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims abstract description 6
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical group CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000005609 naphthenate group Chemical group 0.000 claims abstract description 4
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims abstract description 3
- PTMHPRAIXMAOOB-UHFFFAOYSA-L phosphoramidate Chemical compound NP([O-])([O-])=O PTMHPRAIXMAOOB-UHFFFAOYSA-L 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 6
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 3
- 229940077388 benzenesulfonate Drugs 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 description 14
- 239000010432 diamond Substances 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 9
- 230000005855 radiation Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 235000021317 phosphate Nutrition 0.000 description 7
- 230000006378 damage Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 3
- 230000001050 lubricating effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 208000019155 Radiation injury Diseases 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003974 emollient agent Substances 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- LXXDUCAGSSICDI-UHFFFAOYSA-N iron(3+);phosphite Chemical compound [Fe+3].[O-]P([O-])[O-] LXXDUCAGSSICDI-UHFFFAOYSA-N 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000008298 phosphoramidates Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
- C10M169/04—Mixtures of base-materials and additives
- C10M169/045—Mixtures of base-materials and additives the additives being a mixture of compounds of unknown or incompletely defined constitution and non-macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/08—Amides
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/04—Detergent property or dispersant property
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/08—Resistance to extreme temperature
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/12—Inhibition of corrosion, e.g. anti-rust agents or anti-corrosives
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
- C10N2040/20—Metal working
- C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Lubricants (AREA)
Abstract
The invention discloses a formula of a special cutting fluid for monocrystalline silicon, which belongs to the field of cutting fluids and comprises the following raw materials in parts by weight: 4-15 parts of extreme pressure agent, 40-84 parts of fatty acid amide, 20-36 parts of cooling agent, 10-16 parts of cleaning agent, 16-28 parts of silver ions, 6-15 parts of antirust agent, 16-30 parts of oiliness agent, 4-10 parts of surfactant and 1-2 parts of defoaming agent, wherein the extreme pressure agent is any one of phosphinate, phosphonate, phosphate, phosphoramidate and phosphate amine salt, the oiliness agent is trimethylolpropane, and the surfactant is preferably any one of alkylbenzene sulfonate, polysiloxane and naphthenate.
Description
Technical Field
The invention relates to the field of cutting fluid, in particular to a formula of a special cutting fluid for monocrystalline silicon.
Background
Through patent retrieval, Chinese patent with publication number CN105238537B discloses a water-based cutting fluid and a preparation method thereof, the antirust performance of the water-based cutting fluid is superior to that of the existing water-based cutting fluid, and the water-based cutting fluid is green and environment-friendly;
when the cutting fluid is applied to cutting and processing of the diamond wire to the monocrystalline silicon, due to the fact that the relative position between the diamond wire and the monocrystalline silicon is relatively large, the performance requirement of the cutting fluid is greatly different from that of the existing cutting fluid, the cutting effect of the diamond wire to the monocrystalline silicon is poor, the cut monocrystalline silicon can emit a large amount of radiation rays, and great radiation damage is caused to users.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a special cutting fluid formula for monocrystalline silicon, which can improve the cutting effect of diamond wires on the monocrystalline silicon, reduce the production cost and effectively reduce the radiation damage of the monocrystalline silicon to users.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
The formula of the special cutting fluid for monocrystalline silicon comprises the following raw materials in parts by weight:
4-15 parts of extreme pressure agent, 40-84 parts of fatty acid amide, 20-36 parts of coolant, 10-16 parts of cleaning agent, 16-28 parts of silver ions and 6-15 parts of antirust agent.
Further, the feed comprises the following raw materials in parts by weight:
4 parts of extreme pressure agent, 40 parts of fatty acid amide, 20 parts of coolant, 10 parts of cleaning agent, 16 parts of silver ions and 6 parts of antirust agent.
Further, the feed comprises the following raw materials in parts by weight:
8 parts of extreme pressure agent, 62 parts of fatty acid amide, 32 parts of coolant, 12 parts of cleaning agent, 20 parts of silver ions and 8 parts of antirust agent.
Further, the feed comprises the following raw materials in parts by weight:
15 parts of extreme pressure agent, 84 parts of fatty acid amide, 36 parts of cooling agent, 16 parts of cleaning agent, 28 parts of silver ions and 15 parts of antirust agent.
Further, the extreme pressure agent is any one of phosphinates, phosphonates, phosphates, phosphoramidates, and phosphate ester amine salts.
Further, the formula also comprises the following raw materials in parts by weight:
16-30 parts of an oiliness agent, 4-10 parts of a surfactant and 1-2 parts of a defoaming agent.
Further, the material of the oiliness agent is trimethylolpropane.
Furthermore, the material of the surfactant is any one of alkyl benzene sulfonate, polysiloxane and naphthenate.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme is through increaseing the ratio of emollient, coolant, can reduce the frictional force between buddha's warrior attendant line and the monocrystalline silicon and promote its quick cooling effect, satisfies the high-speed relative displacement between buddha's warrior attendant line and the monocrystalline silicon, promotes the cutting effect of buddha's warrior attendant line to monocrystalline silicon.
(2) The scheme can effectively reduce the production cost of the cutting fluid by reducing the proportion of other raw materials according to the requirements.
(3) This scheme can form an barrier film on the surface of monocrystalline silicon through setting up silver ion, reduces the radiation of monocrystalline silicon, and the radiation injury that effectual reduction monocrystalline silicon caused the user.
Detailed Description
The technical scheme in the embodiment of the invention is clearly and completely described below; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
Example 1:
the cutting fluid is at least prepared from components such as an extreme pressure agent, a lubricant, a coolant, a cleaning agent, a separant, an antirust agent and the like;
the extreme pressure agent has the function of forming an extreme pressure lubricating film with the surface of a friction pair under extreme harsh conditions such as high temperature, high pressure and the like, and assisting the cutting forming of the extreme pressure lubricating film;
the extreme pressure agent is preferably a phosphorus-based extreme pressure agent which has better hydrolytic property, and the raw material is specifically any one of phosphinate, phosphonate, phosphate, phosphoramidate and phosphate ester amine salt;
taking phosphonate as an example, when diamond wires, monocrystalline silicon and phosphonate are contacted, the phosphonate can be adsorbed on the surface of the diamond wires, and hydrolyzed into acid phosphate which is contacted with metal to form a phosphate protective film, and under the condition of extreme pressure friction, the phosphate protective film is further decomposed to form an inorganic iron phosphite film which plays a role in extreme pressure wear resistance;
the lubricant has the function of reducing the friction force between the monocrystalline silicon and the diamond wire, is preferably fatty acid amide, has good lubricating performance, mainly plays a role in external lubrication, improves the fluidity of cutting fluid, and has an obvious demolding effect;
wherein the coolant has a function of rapidly reducing heat energy generated when the monocrystalline silicon and the diamond wire are rubbed, and reducing the temperature of the monocrystalline silicon and the diamond wire;
the cleaning agent has the function of rapidly cleaning chips generated during cutting of the monocrystalline silicon in the cutting process;
the function of the isolating agent is to form an isolating film on the surface of the monocrystalline silicon, so that the radiation ray emitted by the monocrystalline silicon is reduced, and the radiation damage to a user when the monocrystalline silicon is used is reduced;
the material of the release agent is preferably silver ions, which are soluble in water and can effectively block the radiation rays;
the antirust agent has the function of forming a layer of film on the surface of the isolating membrane, reducing the contact of the isolating membrane with oxygen and water and avoiding the generation of a mixture of oxide and hydroxide on the surface of the isolating membrane by the oxygen and the water.
Example 2:
further disclosed is a formula of the special cutting fluid for monocrystalline silicon on the basis of the example 1, wherein the formula comprises the following raw materials in parts by weight:
4 parts of extreme pressure agent, 40 parts of fatty acid amide, 20 parts of coolant, 10 parts of cleaning agent, 16 parts of silver ions and 6 parts of antirust agent.
Example 3:
the difference between the embodiment and the embodiment 2 is only the mixture ratio of the raw materials, and the formula comprises the following raw materials in parts by weight:
8 parts of extreme pressure agent, 62 parts of fatty acid amide, 32 parts of coolant, 12 parts of cleaning agent, 20 parts of silver ions and 8 parts of antirust agent.
Example 4:
the difference between the embodiment and the embodiment 2 is only the mixture ratio of the raw materials, and the formula comprises the following raw materials in parts by weight:
15 parts of extreme pressure agent, 84 parts of fatty acid amide, 36 parts of cooling agent, 16 parts of cleaning agent, 28 parts of silver ions and 15 parts of antirust agent.
Example 4:
the difference between the present embodiment and the above embodiments is that the formula further comprises the following raw materials in parts by weight:
16-30 parts of an oiliness agent, 4-10 parts of a surfactant and 1-2 parts of a defoaming agent;
the oily agent is preferably trimethylolpropane which has strong affinity to metals and is adsorbed on a friction surface through a polar group to form a molecular oriented adsorption film, so that the metals are prevented from contacting with each other, and friction and abrasion are reduced;
wherein, the material of the surface active agent is preferably any one of alkyl benzene sulfonate, polysiloxane and naphthenate, which is dissolved in water to form a semitransparent solution, and the semitransparent solution is mainly used as an anionic surface active agent, can remarkably reduce the surface tension or the interfacial tension of the cutting fluid, and can improve the capacities of the cutting fluid such as solubilization, emulsification, dispersion, permeation, wetting, foaming, cleaning and the like;
wherein the defoaming agent has the function of inhibiting the generation of foam in the cutting fluid.
In conclusion, the cutting fluid is specially used for cutting monocrystalline silicon by diamond wires, the friction force between the diamond wires and the monocrystalline silicon can be reduced and the quick cooling effect of the diamond wires can be improved by increasing the proportion of the lubricant to the coolant, the high-speed relative displacement between the diamond wires and the monocrystalline silicon can be met, the cutting effect of the diamond wires on the monocrystalline silicon can be improved, meanwhile, the production cost of the cutting fluid can be effectively reduced by reducing the proportion of the rest raw materials according to the requirements, an isolating membrane can be formed on the surface of the monocrystalline silicon by arranging silver ions, the radiation of the monocrystalline silicon is reduced, and the radiation damage of the monocrystalline silicon to users is effectively reduced.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (8)
1. The formula of the special cutting fluid for monocrystalline silicon is characterized in that: the formula comprises the following raw materials in parts by weight:
4-15 parts of extreme pressure agent, 40-84 parts of fatty acid amide, 20-36 parts of coolant, 10-16 parts of cleaning agent, 16-28 parts of silver ions and 6-15 parts of antirust agent.
2. The cutting fluid formula special for monocrystalline silicon according to claim 1, characterized in that: comprises the following raw materials in parts by weight:
4 parts of extreme pressure agent, 40 parts of fatty acid amide, 20 parts of coolant, 10 parts of cleaning agent, 16 parts of silver ions and 6 parts of antirust agent.
3. The cutting fluid formula special for monocrystalline silicon according to claim 1, characterized in that: comprises the following raw materials in parts by weight:
8 parts of extreme pressure agent, 62 parts of fatty acid amide, 32 parts of coolant, 12 parts of cleaning agent, 20 parts of silver ions and 8 parts of antirust agent.
4. The cutting fluid formula special for monocrystalline silicon according to claim 1, characterized in that: comprises the following raw materials in parts by weight:
15 parts of extreme pressure agent, 84 parts of fatty acid amide, 36 parts of cooling agent, 16 parts of cleaning agent, 28 parts of silver ions and 15 parts of antirust agent.
5. The cutting fluid formula special for monocrystalline silicon according to claim 1, characterized in that: the extreme pressure agent is any one of phosphinate, phosphonate, phosphate, phosphoramidate and phosphate ester amine salt.
6. The cutting fluid formula special for monocrystalline silicon according to claim 1, characterized in that: the formula also comprises the following raw materials in parts by weight:
16-30 parts of an oiliness agent, 4-10 parts of a surfactant and 1-2 parts of a defoaming agent.
7. The cutting fluid formula special for monocrystalline silicon according to claim 6, characterized in that: the material of the oiliness agent is trimethylolpropane.
8. The cutting fluid formula special for monocrystalline silicon according to claim 6, characterized in that: the material of the surfactant is any one of alkyl benzene sulfonate, polysiloxane and naphthenate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210578218.XA CN115125051A (en) | 2022-05-25 | 2022-05-25 | Formula of special cutting fluid for monocrystalline silicon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210578218.XA CN115125051A (en) | 2022-05-25 | 2022-05-25 | Formula of special cutting fluid for monocrystalline silicon |
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| Publication Number | Publication Date |
|---|---|
| CN115125051A true CN115125051A (en) | 2022-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210578218.XA Pending CN115125051A (en) | 2022-05-25 | 2022-05-25 | Formula of special cutting fluid for monocrystalline silicon |
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|---|---|---|---|---|
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| CN106281630A (en) * | 2016-08-17 | 2017-01-04 | 南通科星化工有限公司 | A kind of micro emulsion cutting fluid and preparation technology thereof |
| CN106281616A (en) * | 2016-08-11 | 2017-01-04 | 南京科润工业介质股份有限公司 | A kind of aluminium alloy machining long-life low bubble emulsion |
| CN107384561A (en) * | 2017-08-01 | 2017-11-24 | 屏南县康迈精选科技有限公司 | A kind of fully synthetic cutting fluid |
| CN107841371A (en) * | 2017-11-07 | 2018-03-27 | 北京工业大学 | A kind of preparation method of fully synthetic crystal cutting fluid |
-
2022
- 2022-05-25 CN CN202210578218.XA patent/CN115125051A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268318A (en) * | 2010-06-01 | 2011-12-07 | 中国石油化工股份有限公司 | Water base cutting fluid composition and preparation method thereof |
| CN102559355A (en) * | 2011-12-17 | 2012-07-11 | 天津泰伦特化学有限公司 | Self-bacteriostasis general emulsion cutting fluid and preparing method thereof |
| CN104673473A (en) * | 2013-11-30 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Water-based grinding fluid and preparation method thereof |
| CN105524688A (en) * | 2014-09-29 | 2016-04-27 | 天津隆德精密机械有限公司 | Extreme pressure cutting oil used for achieving performance stability in metal processing and preparation method thereof |
| CN106010742A (en) * | 2016-05-24 | 2016-10-12 | 仪征旺海数控设备科技有限公司 | Rust-proof cutting fluid for numerically-controlled machine tool metal processing and preparation method thereof |
| CN106281616A (en) * | 2016-08-11 | 2017-01-04 | 南京科润工业介质股份有限公司 | A kind of aluminium alloy machining long-life low bubble emulsion |
| CN106281630A (en) * | 2016-08-17 | 2017-01-04 | 南通科星化工有限公司 | A kind of micro emulsion cutting fluid and preparation technology thereof |
| CN107384561A (en) * | 2017-08-01 | 2017-11-24 | 屏南县康迈精选科技有限公司 | A kind of fully synthetic cutting fluid |
| CN107841371A (en) * | 2017-11-07 | 2018-03-27 | 北京工业大学 | A kind of preparation method of fully synthetic crystal cutting fluid |
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