CN115116997A - 一种液体循环冷却封装基板及其制作方法 - Google Patents
一种液体循环冷却封装基板及其制作方法 Download PDFInfo
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- CN115116997A CN115116997A CN202210526848.2A CN202210526848A CN115116997A CN 115116997 A CN115116997 A CN 115116997A CN 202210526848 A CN202210526848 A CN 202210526848A CN 115116997 A CN115116997 A CN 115116997A
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- layer
- heat dissipation
- cooling
- support frame
- dielectric layer
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Abstract
本申请提供一种液体循环冷却封装基板及其制作方法,其中所述基板包括循环冷却结构,包括形成在所述第一介电层内暴露出所述散热面的冷却腔、形成在所述冷却腔内表面上的金属散热层、形成在所述金属散热层上的直立支撑柱、以及支撑在所述支撑柱上沿所述冷却腔的周边封闭所述冷却腔的冷却盖,其中所述金属散热层完全覆盖所述散热面和所述冷却腔的内侧表面,所述冷却盖上形成有进液口和出液口。在第一介电层内设置循环冷却结构,该循环冷却结构在嵌埋封装基板加工过程中形成,加工流程简单、成本低;循环冷却结构与器件的散热面连接,既可以提升散热性能,又可以合理利用基板内的空间,降低基板的整体厚度。
Description
技术领域
本申请涉及半导体封装技术领域,尤其涉及一种液体循环冷却封装基板及其制作方法。
背景技术
随着电子技术的发展与进步,电子产品朝着短小轻薄的方向演进,而电子产品的功能要求越来越强大,这就促进了电子产品的封装结构朝着高度集成化、小型化的方向发展,芯片等元器件嵌埋封装应运而生;与此同时电子元件的应用也朝着高频高速高功率的方向发展,导致单位面积的热流密度迅速递增。众所周知,随着运行工作环境温度的上升,电子元件的运行的速度随之降低,损耗随之上升,同时,长时间在高温环境下运行,电子产品的可靠性相对降低。所以,如果不能及时将高频高速高功率电子元件产生的热量散发,电子产品的性能和可靠性会受到一定程度的影响。因此,在高频高速高功率的大趋势下,如何合理优化嵌埋封装基板、封装体的设计,提升嵌埋封装结构的散热性能,是当前一个重要的课题。
当前常用的两种嵌埋封装基板方式为:(1)将芯片等元器件贴装于预设空腔的聚合物框架或者芯材,再使用塑封材料封装。但是这种方式存在如下缺点:随着高频高速高功率产品的兴起,嵌入式封装产品有极高的散热需求,即使散热性再好的有机聚合物材料,散热特性都存在局限性,无法从根本上解决高频高速高功率嵌埋产品的散热问题;(2)使用金属框架来嵌埋元器件,在金属(例如铜)板上预先加工空腔,将芯片等元器件贴装于预置空腔,再通过压合介质材料进行封装。这种嵌埋封装方式利用金属相对良好的散热性能,代替有机聚合物材料框架,提升嵌埋封装结构的散热性能。但是,将芯片等元器件贴装于金属框架,再使用塑封材料封装的方案存在如下劣势:加工流程复杂,成本高,且金属框架被介电材料包覆导致散热速度依然较慢。
发明内容
有鉴于此,本申请的目的在于提出一种液体循环冷却封装基板及其制作方法,以解决上述问题。
基于上述目的,本申请第一方面提供了一种液体循环冷却封装基板,包括:
嵌入在被支撑框架包围的至少一个贯通空腔内的具有有源面和散热面的器件,所述支撑框架包括沿高度方向贯穿所述支撑框架的导通柱;
在所述支撑框架的第一表面上的第一介电层和在所述支撑框架的第二表面上的第二介电层,其中第一介电层完全填充所述器件与所述支撑框架之间的间隙;
循环冷却结构,包括形成在所述第一介电层内暴露出所述散热面的冷却腔、形成在所述冷却腔内表面上的金属散热层、形成在所述金属散热层上的直立支撑柱、以及支撑在所述支撑柱上沿所述冷却腔的周边封闭所述冷却腔的冷却盖,其中所述金属散热层完全覆盖所述散热面和所述冷却腔的内侧表面,所述冷却盖上形成有进液口和出液口;
形成在所述第一介电层上的第一线路层和形成在第二介电层上的第二线路层,其中所述第二线路层电连接所述器件的有源面上的端子,所述第一线路层和所述第二线路层通过所述导通柱电连接。
在一些实施例中,所述冷却盖通过焊料或耐腐蚀胶连接所述支撑柱和所述金属散热层的外周,从而封闭所述冷却腔。
在一些实施例中,所述进液口和所述出液口设置在所述支撑柱的两侧。
在一些实施例中,所述金属散热层包括铜层。
在一些实施例中,还包括设置在所述第一线路层和所述第二线路层的外表面上的阻焊层。
基于同一发明构思,本申请第二方面提供了一种液体循环冷却封装基板的制作方法,包括:
(a)预制支撑框架,所述支撑框架包括沿高度方向贯穿所述支撑框架的导通柱以及被所述支撑框架包围的至少一个贯通空腔;
(b)在所述贯通空腔中安装具有有源面和散热面的器件,在所述支撑框架的第一表面上施加第一介电层,使得所述第一介电层完全填充所述器件与所述支撑框架之间的间隙;
(c)在所述第一介电层上开孔形成第一图案,所述第一图案包括暴露出器件的散热面的冷却腔,填充所述第一图案形成第一线路层和所述散热面上的金属散热层,其中所述金属散热层完全覆盖所述散热面和所述冷却腔的内侧表面;
(d)在所述支撑框架的第二表面上施加第二介电层,在所述第二介电层上开孔形成第二图案,所述第二图案暴露出所述器件的有源面上的端子,填充所述第二图案形成第二电路层,其中所述第一线路层和所述第二线路层通过所述导通柱电连接;
(e)在所述器件的散热面上的所述金属散热层上形成支撑柱,在所述支撑柱上施加冷却盖,所述冷却盖沿所述冷却腔的周边封闭所述冷却腔,其中所述冷却盖上形成有进液口和出液口。
在一些实施例中,所述步骤(b)包括:
(b1)在所述支撑框架的第二表面上施加临时载体;
(b2)将所述器件置于所述贯通空腔内,使得所述器件的有源面贴附在所述临时载体上;
(b3)在所述支撑框架的第一表面上形成所述第一介电层;
(b4)移除所述临时载体。
在一些实施例中,所述步骤(c)包括:
(c1)在所述第一介电层上形成第一金属种子层;
(c2)在所述第一金属种子层上施加第一光阻层,曝光显影形成所述第一图案;
(c3)在所述第一图案中电镀形成所述第一线路层和所述散热面上的金属散热层;
(c4)移除所述第一光阻层和所述第一金属种子层。
在一些实施例中,所述步骤(c)中,所述金属散热层包括铜层。
在一些实施例中,所述步骤(d)包括:
(d1)在所述第二介电层上形成第二金属种子层;
(d2)在所述第二金属种子层上施加第二光阻层,曝光显影形成所述第二图案;
(d3)在所述第二图案中电镀形成所述第二线路层;
(d4)移除所述第二光阻层和所述第二金属种子层。
在一些实施例中,所述步骤(e)包括:
(e1)在所述冷却腔内填充介电材料形成第三介电层;
(e2)对所述第三介电层激光开窗,形成暴露出所述金属散热层的第三图案;
(e3)电镀填充所述第三图案形成所述支撑柱;
(e4)移除所述第三介电层。
在一些实施例中,所述步骤(e)还包括:
(e1’)在所述冷却腔中填充光阻材料形成第三光阻层;
(e2’)对所述第三光阻层进行曝光显影,形成暴露出所述金属散热层的第三图案;
(e3’)电镀填充所述第三图案形成所述支撑柱;
(e4’)移除所述第三光阻层。
在一些实施例中,所述步骤(e)中,所述冷却盖通过焊料或耐腐蚀胶连接所述支撑柱和所述金属散热层的外周,从而封闭所述冷却腔。
在一些实施例中,还包括:
(f)在步骤(e)之后,分别在所述第一线路层和所述第二线路层上施加阻焊材料,形成阻焊层。
从上面所述可以看出,本申请提供的液体循环冷却封装基板及其制作方法,在第一介电层内于器件散热面上直接设置循环冷却结构,该循环冷却结构在嵌埋封装基板加工过程中形成,加工流程简单、成本低;循环冷却结构可以与外部液体冷却系统连接,使得外部冷却液可以从进液口进入循环冷却结构,流经冷却腔后,最终从循环冷却结构的出液口流出,冷却液可以快速带走器件运行时产生的热量,大大提升嵌埋封装结构的散热性能。另外,循环冷却结构与器件的散热面连接,既可以提升散热性能,又可以合理利用基板内的空间,降低基板的整体厚度。循环冷却结构中设置的支撑柱还能够使得进入循环冷却结构的冷却液发生扰动形成湍流,进一步提高器件的散热效率。
附图说明
为了更清楚地说明本申请或相关技术中的技术方案,下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为根据本发明的一个实施例的液体循环冷却封装基板的截面示意图;
图2为根据本发明的一个实施例的循环冷却结构的截面示意图;
图3至12为本发明一个实施例的液体循环冷却封装基板的制作方法的各步骤中间结构的截面示意图。
图中,1、支撑框架;11、导通柱;12、贯通空腔;2、器件;21、有源面;22、散热面;3、循环冷却结构;31、金属散热层;32、冷却腔;33、支撑柱;34、冷却盖;341、进液口;342、出液口;5、第二介电层;6、第一线路层;7、第二线路层;8、阻焊层;9、临时载体。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚明白,以下结合具体实施例,并参照附图,对本申请进一步详细说明。
需要说明的是,除非另外定义,本申请实施例使用的技术术语或者科学术语应当为本申请所属领域内具有一般技能的人士所理解的通常意义。本申请实施例中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
参考图1,本申请提供了一种液体循环冷却封装基板,包括:
嵌入在被支撑框架1包围的至少一个贯通空腔12内的具有有源面21和散热面22的器件2,所述支撑框架1包括沿高度方向贯穿所述支撑框架1的导通柱11;
在所述支撑框架1的第一表面上的第一介电层和在所述支撑框架1的第二表面上的第二介电层5,其中第一介电层完全填充所述器件2与所述支撑框架1之间的间隙;
循环冷却结构3,包括形成在所述第一介电层内暴露出所述散热面22的冷却腔32、形成在所述冷却腔32内表面上的金属散热层31、形成在所述金属散热层31上的直立支撑柱33、以及支撑在所述支撑柱33上沿所述冷却腔32的周边封闭所述冷却腔32的冷却盖34,其中所述金属散热层31完全覆盖所述散热面22和所述冷却腔32的内侧表面,所述冷却盖34上形成有进液口341和出液口342;
形成在所述第一介电层上的第一线路层6和形成在第二介电层5上的第二线路层7,其中所述第二线路层7电连接所述器件2的有源面21上的端子,所述第一线路层6和所述第二线路层7通过所述导通柱11电连接。
具体地,所述支撑框架1可采用聚合物材料制成,所述聚合物材料可以是聚酰亚胺、环氧树脂、双马来酰亚胺、三嗪树脂、玻璃纤维增强树脂或它们的组合。值得理解的是,所述贯通空腔12的数量可以为一个或多个,为了便于叙述,本实施例以一个贯通空腔12为例进行说明。所述导通柱11可以包括至少一个导通铜柱作为IO通道,其截面尺寸可以相同,也可以不同;导通柱11的形状可以根据实际需要设定,例如,可以为方形、圆形等,具体不做限定。
所述器件2可以是裸芯片,如集成电路的驱动芯片(IC driver)、场效应管(FET)等、也可以是无源器件2,如电容、电阻或电感等,还可以是经初步封装后的单封装体,例如球栅阵列(BGA)/栅格阵列(LGA)等,或者是其中多种器件2的组合;器件2可以是单面具有端子的器件2,也可以是两面上均具有端子的器件2。本实施例中,以器件2为具有单面端子的芯片为例进行说明,但是并不限定只能对具有单面端子的芯片进行后续操作。
所述第一介电层和所述第二介电层5可以选自环氧树脂、酚醛树脂、苯并环丁烯树脂、聚酯亚胺树脂、ABF等中的至少一种材料制成。
所述循环冷却结构3位于所述第一介电层内,且与器件2的散热面22连接,既可以提升散热性能,又可以合理利用基板内的空间,降低基板的整体厚度。所述金属散热层31可以保护器件2不受湿气影响,又可以利用自身的金属材质进行辅助散热,提高基板的散热性能。其中,所述金属散热层31包括铜层,利用金属铜良好的导热性能,进一步提高基板的散热性能。
所述支撑柱33位于所述散热面22对应的金属散热层31上,所述支撑柱33的一端与所述冷却盖34连接,另一端与所述器件2的散热面22连接。所述支撑柱33可以包括至少一个导通铜柱作为IO通道。
参考图2,所述冷却盖34通过焊料或耐腐蚀胶连接所述支撑柱33和所述金属散热层31的外周,从而封闭所述冷却腔32。所述冷却盖34上形成有进液口341和出液口342,所述进液口341和所述出液口342设置在所述支撑柱33的两侧。所述进液口341用于与外部进液系统连接,所述出液口342用于与外部出液系统连接,如此使得所述循环冷却结构3可以与外部进液系统和外部出液系统连接,使得外部冷却液可以从进液口341进入循环冷却结构3,流经冷却腔32后,最终从循环冷却结构3的出液口342流出,冷却液可以快速带走器件2运行时产生的热量,大大提升嵌埋封装结构的散热性能。另外,循环冷却结构3与器件2的散热面22连接,既可以提升散热性能,又可以合理利用基板内的空间,降低基板的整体厚度。
在一些实施例中,所述基板还包括设置在所述第一线路层6和所述第二线路层7的外表面上的阻焊层8。所述阻焊层8可选为使用阻焊材料制成,可以通过涂布、贴膜或印刷的方式施加阻焊材料,曝光显影形成阻焊层8;可以通过化金、化银、镀金或镀锡的方式对暴露的金属进行表面处理。
基于同一发明构思,本申请第二方面提供了一种液体循环冷却封装基板的制作方法,具体包括如下步骤。
步骤(a),参考图3,预制支撑框架1,所述支撑框架1包括沿高度方向贯穿所述支撑框架1的导通柱11以及被所述支撑框架1包围的至少一个贯通空腔12。
具体地,所述贯通空腔12的数量可以为一个或多个,为了便于叙述,本实施例以一个贯通空腔12为例进行说明。所述导通柱11可以包括至少一个导通铜柱作为IO通道,其截面尺寸可以相同,也可以不同;导通柱11的形状可以根据实际需要设定,例如,可以为方形、圆形等,具体不做限定。
步骤(b),参考图4,在所述贯通空腔12中安装具有有源面21和散热面22的器件2,在所述支撑框架1的第一表面上施加第一介电层,使得所述第一介电层完全填充所述器件2与所述支撑框架1之间的间隙。
具体地,所述步骤(b)具体包括如下步骤:
步骤(b1),参考图4,在所述支撑框架1的第二表面上施加临时载体9。所述临时载体9可以为胶带、胶纸或胶布等,所述临时载体9达到在贯通空腔12的底部提供临时承载面的目的。
步骤(b2),将所述器件2置于所述贯通空腔12内,使得所述器件2的有源面21贴附在所述临时载体9上。将所述器件2粘贴在所述临时载体9上,所述临时载体9可以为所述器件2提供稳定的支撑作用。
步骤(b3),参考图5,在所述支撑框架1的第一表面上形成所述第一介电层。第一介电层完全填充所述器件2与所述支撑框架1之间的间隙。
步骤(b4),参考图6,移除所述临时载体9。
具体地,移除所述临时载体9,方便后续在所述支撑框架1的第二表面上施加第二介电层5。
步骤(c),参考图8、图9,在所述第一介电层上开孔形成第一图案,所述第一图案包括暴露出器件2的散热面22的冷却腔32,填充所述第一图案形成第一线路层6和所述散热面22上的金属散热层31,其中所述金属散热层31完全覆盖所述散热面22和所述冷却腔32的内侧表面。
具体地,所述步骤(c)具体包括如下步骤:
步骤(c1),在所述第一介电层上形成第一金属种子层。通常,可以通过化学镀或者溅射的方式在所述第一介电层上形成第一金属种子层,第一金属种子层可以包括钛、铜、钛钨合金或它们的组合。优选地,溅射钛和铜制作第一金属种子层。
步骤(c2),在所述第一金属种子层上施加第一光阻层,曝光显影形成所述第一图案。通常,可以通过贴膜或涂覆的方式在第一金属种子层上施加第一光阻层;第一光阻层的厚度可以根据需要调节。
步骤(c3),在所述第一图案中电镀形成所述第一线路层6和所述散热面22上的金属散热层31。所述第一线路层6和所述散热面22上的金属散热层31的厚度可以根据实际需求设置,通常其厚度不高于第一光阻层的厚度。其中,所述金属散热层31包括铜层,用于提升基板的散热性能。
步骤(c4),移除所述第一光阻层和所述第一金属种子层。通常,可以通过退膜的方式移除第一光阻层并蚀刻移除第一金属种子层。
步骤(d),参考图7、图8,在所述支撑框架1的第二表面上施加第二介电层5,在所述第二介电层5上开孔形成第二图案,所述第二图案暴露出所述器件2的有源面21上的端子,填充所述第二图案形成第二电路层,其中所述第一线路层6和所述第二线路层7通过所述导通柱11电连接。
具体地,所述步骤(d)具体包括如下步骤:
步骤(d1),在所述第二介电层5上形成第二金属种子层。通常,可以通过化学镀或者溅射的方式在所述第二介电层5上形成第二金属种子层,第二金属种子层可以包括钛、铜、钛钨合金或它们的组合。优选地,溅射钛和铜制作第二金属种子层。
步骤(d2),在所述第二金属种子层上施加第二光阻层,曝光显影形成所述第二图案。通常,可以通过贴膜或涂覆的方式在第二金属种子层上施加第二光阻层;第二光阻层的厚度可以根据需要调节。
步骤(d3),在所述第二图案中电镀形成所述第二线路层7。所述第二线路层7的厚度可以根据实际需求设置,通常其厚度不高于第二光阻层的厚度。
步骤(d4),移除所述第二光阻层和所述第二金属种子层。通常,可以通过退膜的方式移除第一光阻层并蚀刻移除第一金属种子层。
步骤(e),参考图10、图11和图12,在所述器件2的散热面22上的所述金属散热层31上形成支撑柱33,在所述支撑柱33上施加冷却盖34,所述冷却盖34沿所述冷却腔32的周边封闭所述冷却腔32,其中所述冷却盖34上形成有进液口341和出液口342。
其中,所述冷却盖34通过焊料或耐腐蚀胶连接所述支撑柱33和所述金属散热层31的外周,从而封闭所述冷却腔32。所述冷却盖34上形成有进液口341和出液口342,所述进液口341和所述出液口342设置在所述支撑柱33的两侧。所述进液口341用于与外部进液系统连接,所述出液口342用于与外部出液系统连接,如此使得所述循环冷却结构3可以与外部进液系统和外部出液系统连接,使得外部冷却液可以从进液口341进入循环冷却结构3,流经冷却腔32后,最终从循环冷却结构3的出液口342流出,冷却液可以快速带走器件2运行时产生的热量,大大提升嵌埋封装结构的散热性能。另外,循环冷却结构3与器件2的散热面22连接,既可以提升散热性能,又可以合理利用基板内的空间,降低基板的整体厚度。
具体地,所述步骤(e)可以包括以下两种具体实施方法。
实施方法一:所述步骤(e)具体包括如下步骤:
步骤(e1)在所述冷却腔32内填充介电材料形成第三介电层。所述介电材料可选为FR4材料。
步骤(e2)对所述第三介电层激光开窗,形成暴露出所述金属散热层31的第三图案。通常,通过镭射、钻孔或等离子蚀刻的方式局部减薄所述第三介电层,以形成暴露出所述金属散热层31的第三图案。具体实施时,可以通过磨板或等离子蚀刻的方式整体减薄所述第三介电层,还可以通过镭射或钻孔的方式局部减薄所述第三介电层。
步骤(e3)电镀填充所述第三图案形成所述支撑柱33;
步骤(e4)移除所述第三介电层。
实施方法二:所述步骤(e)具体包括如下步骤:
步骤(e1’)在所述冷却腔32中填充光阻材料形成第三光阻层。本步骤中,可以使用光阻材料作为填充材料,与介电材料起到相同的作用。
步骤(e2’)对所述第三光阻层进行曝光显影,形成暴露出所述金属散热层31的第三图案;
步骤(e3’)电镀填充所述第三图案形成所述支撑柱33;
步骤(e4’)移除所述第三光阻层。
上述各个步骤的具体实施方式参照上文,在此不做赘述。
在一些实施例中,所述液体循环冷却封装基板的制作方法在步骤(e)之后,还包括步骤(f):分别在所述第一线路层6和所述第二线路层7上施加阻焊材料,形成阻焊层8。
具体地,可以通过涂布、贴膜或印刷的方式施加阻焊材料,曝光显影形成阻焊层8。还可以可以通过化金、化银、镀金或镀锡的方式对暴露的金属进行表面处理。
综上,本申请提供的液体循环冷却封装基板的制作方法,在第一介电层内设置循环冷却结构3,该循环冷却结构3在嵌埋封装基板加工过程中形成,加工流程简单、成本低。循环冷却结构3可以与外部进液系统和外部出液系统连接,使得外部冷却液可以从进液口341进入循环冷却结构3,流经冷却腔32后,最终从循环冷却结构3的出液口342流出,冷却液可以快速带走器件2运行时产生的热量,大大提升嵌埋封装结构的散热性能。另外,循环冷却结构3与器件2的散热面22连接,既可以提升散热性能,又可以合理利用基板内的空间,降低基板的整体厚度。同时,金属散热层31本身就可以辅助散热,加上循环冷却液体的传导散热,冷却液体可以快速带走器件2运行时产生的热量,大大提升嵌埋封装基板的散热性能。
值得注意的是,在本发明实施例的描述中,对方法步骤的连续标号是为了方便审查和理解,结合本发明的整体技术方案以及各个步骤之间的逻辑关系,调整步骤之间的实施顺序并不会影响本发明技术方案所达到的技术效果。本实施例涉及的一些制作步骤,例如种子层加工、图形转移以及图形电镀等步骤在此没有详细表述,是因为这些步骤中的材料和工艺流程均为本领域的公知常识。可以很确切地说,当为某一特定产品设计相应的步骤时,本领域技术人员能够对基于例如生产批量、基板复杂程度和元器件分辨率等参数的清楚认识从各种可替换的材料和制作流程中作出合适的选择。
需要说明的是,上述对本公开的一些实施例进行了描述。其它实施例在所附权利要求书的范围内。在一些情况下,在权利要求书中记载的动作或步骤可以按照不同于上述实施例中的顺序来执行并且仍然可以实现期望的结果。另外,在附图中描绘的过程不一定要求示出的特定顺序或者连续顺序才能实现期望的结果。在某些实施方式中,多任务处理和并行处理也是可以的或者可能是有利的。
所属领域的普通技术人员应当理解:以上任何实施例的讨论仅为示例性的,并非旨在暗示本公开的范围(包括权利要求)被限于这些例子;在本公开的思路下,以上实施例或者不同实施例中的技术特征之间也可以进行组合,步骤可以以任意顺序实现,并存在如上所述的本公开实施例的不同方面的许多其它变化,为了简明它们没有在细节中提供。
本公开实施例旨在涵盖落入所附权利要求的宽泛范围之内的所有这样的替换、修改和变型。因此,凡在本公开实施例的精神和原则之内,所做的任何省略、修改、等同替换、改进等,均应包含在本公开的保护范围之内。
Claims (14)
1.一种液体循环冷却封装基板,其特征在于,包括:
嵌入在被支撑框架包围的至少一个贯通空腔内的具有有源面和散热面的器件,所述支撑框架包括沿高度方向贯穿所述支撑框架的导通柱;
在所述支撑框架的第一表面上的第一介电层和在所述支撑框架的第二表面上的第二介电层,其中第一介电层完全填充所述器件与所述支撑框架之间的间隙;
循环冷却结构,包括形成在所述第一介电层内暴露出所述散热面的冷却腔、形成在所述冷却腔内表面上的金属散热层、形成在所述金属散热层上的直立支撑柱、以及支撑在所述支撑柱上沿所述冷却腔的周边封闭所述冷却腔的冷却盖,其中所述金属散热层完全覆盖所述散热面和所述冷却腔的内侧表面,所述冷却盖上形成有进液口和出液口;
形成在所述第一介电层上的第一线路层和形成在第二介电层上的第二线路层,其中所述第二线路层电连接所述器件的有源面上的端子,所述第一线路层和所述第二线路层通过所述导通柱电连接。
2.根据权利要求1所述的液体循环冷却封装基板,其特征在于,所述冷却盖通过焊料或耐腐蚀胶连接所述支撑柱和所述金属散热层的外周,从而封闭所述冷却腔。
3.根据权利要求1所述的液体循环冷却封装基板,其特征在于,所述进液口和所述出液口设置在所述支撑柱的两侧。
4.根据权利要求1所述的液体循环冷却封装基板,其特征在于,所述金属散热层包括铜层。
5.根据权利要求1所述的液体循环冷却封装基板,其特征在于,还包括设置在所述第一线路层和所述第二线路层的外表面上的阻焊层。
6.一种液体循环冷却封装基板的制作方法,其特征在于,包括:
(a)预制支撑框架,所述支撑框架包括沿高度方向贯穿所述支撑框架的导通柱以及被所述支撑框架包围的至少一个贯通空腔;
(b)在所述贯通空腔中安装具有有源面和散热面的器件,在所述支撑框架的第一表面上施加第一介电层,使得所述第一介电层完全填充所述器件与所述支撑框架之间的间隙;
(c)在所述第一介电层上开孔形成第一图案,所述第一图案包括暴露出器件的散热面的冷却腔,填充所述第一图案形成第一线路层和所述散热面上的金属散热层,其中所述金属散热层完全覆盖所述散热面和所述冷却腔的内侧表面;
(d)在所述支撑框架的第二表面上施加第二介电层,在所述第二介电层上开孔形成第二图案,所述第二图案暴露出所述器件的有源面上的端子,填充所述第二图案形成第二电路层,其中所述第一线路层和所述第二线路层通过所述导通柱电连接;
(e)在所述器件的散热面上的所述金属散热层上形成支撑柱,在所述支撑柱上施加冷却盖,所述冷却盖沿所述冷却腔的周边封闭所述冷却腔,其中所述冷却盖上形成有进液口和出液口。
7.根据权利要求6所述的制作方法,其特征在于,所述步骤(b)包括:
(b1)在所述支撑框架的第二表面上施加临时载体;
(b2)将所述器件置于所述贯通空腔内,使得所述器件的有源面贴附在所述临时载体上;
(b3)在所述支撑框架的第一表面上形成所述第一介电层;
(b4)移除所述临时载体。
8.根据权利要求7所述的制作方法,其特征在于,所述步骤(c)包括:
(c1)在所述第一介电层上形成第一金属种子层;
(c2)在所述第一金属种子层上施加第一光阻层,曝光显影形成所述第一图案;
(c3)在所述第一图案中电镀形成所述第一线路层和所述散热面上的金属散热层;
(c4)移除所述第一光阻层和所述第一金属种子层。
9.根据权利要求6所述的制作方法,其特征在于,所述步骤(c)中,所述金属散热层包括铜层。
10.根据权利要求6所述的制作方法,其特征在于,所述步骤(d)包括:
(d1)在所述第二介电层上形成第二金属种子层;
(d2)在所述第二金属种子层上施加第二光阻层,曝光显影形成所述第二图案;
(d3)在所述第二图案中电镀形成所述第二线路层;
(d4)移除所述第二光阻层和所述第二金属种子层。
11.根据权利要求6所述的制作方法,其特征在于,所述步骤(e)包括:
(e1)在所述冷却腔内填充介电材料形成第三介电层;
(e2)对所述第三介电层激光开窗,形成暴露出所述金属散热层的第三图案;
(e3)电镀填充所述第三图案形成所述支撑柱;
(e4)移除所述第三介电层。
12.根据权利要求6所述的制作方法,其特征在于,所述步骤(e)还包括:
(e1’)在所述冷却腔中填充光阻材料形成第三光阻层;
(e2’)对所述第三光阻层进行曝光显影,形成暴露出所述金属散热层的第三图案;
(e3’)电镀填充所述第三图案形成所述支撑柱;
(e4’)移除所述第三光阻层。
13.根据权利要求6所述的制作方法,其特征在于,所述步骤(e)中,所述冷却盖通过焊料或耐腐蚀胶连接所述支撑柱和所述金属散热层的外周,从而封闭所述冷却腔。
14.根据权利要求6所述的制作方法,其特征在于,还包括:
(f)在步骤(e)之后,分别在所述第一线路层和所述第二线路层上施加阻焊材料,形成阻焊层。
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JP2023072072A JP2023168253A (ja) | 2022-05-13 | 2023-04-26 | 液体循環冷却パッケージ基板及びその製造方法 |
TW112115837A TW202345312A (zh) | 2022-05-13 | 2023-04-27 | 一種液體迴圈冷卻封裝基板及其製作方法 |
KR1020230057067A KR20230159267A (ko) | 2022-05-13 | 2023-05-02 | 액체 순환 냉각 패키지 기판 및 이의 제조 방법 |
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