CN115106329B - Wafer processing device - Google Patents
Wafer processing device Download PDFInfo
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- CN115106329B CN115106329B CN202210687882.8A CN202210687882A CN115106329B CN 115106329 B CN115106329 B CN 115106329B CN 202210687882 A CN202210687882 A CN 202210687882A CN 115106329 B CN115106329 B CN 115106329B
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- transfer device
- drying
- wafer
- cleaning
- tank
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- 238000012545 processing Methods 0.000 title claims abstract description 36
- 235000012431 wafers Nutrition 0.000 claims abstract description 123
- 238000004140 cleaning Methods 0.000 claims abstract description 83
- 238000001035 drying Methods 0.000 claims abstract description 73
- 238000012546 transfer Methods 0.000 claims abstract description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 238000013519 translation Methods 0.000 claims description 19
- 238000001914 filtration Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of wafer processing and discloses a wafer processing device which comprises a plurality of cleaning tanks, a drying tank, a transfer device, a wafer fixing device and a controller, wherein the wafer fixing device can fix wafers in batches, and the wafer fixing device fixed with the wafers is transferred to the cleaning tanks and the drying tank through the transfer device, so that the cleaning and the drying of the wafers in batches are rapidly completed, the processing efficiency of the wafers is effectively improved, and the flow production is achieved.
Description
Technical Field
The present invention relates to the field of wafer processing technology, and in particular, to a wafer processing apparatus.
Background
Gallium arsenide is an important semiconductor material, and can be made into semi-insulating high-resistance material with resistivity higher than that of silicon and germanium by more than 3 orders of magnitude, and can be used for making integrated circuit substrate, infrared detector and the like.
The existing gallium arsenide substrate cleaning method generally comprises the steps of firstly carrying out acid cleaning to remove particles and metal ions on the surface of the gallium arsenide substrate, then taking out the gallium arsenide substrate and placing the gallium arsenide substrate in another tank for alkaline cleaning to remove particles and organic matters on the surface of the gallium arsenide substrate, and then carrying out ultrapure water cleaning to remove residual ions on the surface of the gallium arsenide substrate.
Disclosure of Invention
The invention aims to provide a wafer processing device which can rapidly complete the processing work of batch wafers in different processing tanks, improve the wafer processing efficiency and realize the pipelining operation.
In order to achieve the above object, the present invention provides a wafer processing apparatus comprising:
At least one cleaning tank, each cleaning tank is provided with a cleaning cavity with an open top;
the drying groove is provided with a drying cavity with an opening at the top;
The drying device is arranged in the drying groove and is used for drying the wafer;
a transfer device for transferring the wafer to the cleaning tank and the drying tank;
The wafer fixing device is provided with at least one wafer fixing device, and comprises a clamping mechanism and a clamping box for fixing a wafer, wherein the clamping mechanism is provided with a plurality of inserting grooves for inserting the clamping box; and
And the controller is electrically connected with the transfer device.
Preferably, the blocking mechanism is a columnar frame body, a plurality of inserting grooves are formed in the blocking mechanism around the axis of the blocking mechanism, and each inserting groove extends along the length direction of the blocking mechanism.
Preferably, each cleaning tank comprises an outer tank and an inner tank sleeved in the outer tank, the inner tank is provided with the cleaning cavity, a water outlet is arranged on a bottom plate or a side plate of the inner tank, a filtering area is arranged in the outer tank, and cleaning liquid flowing out of the water outlet is sucked back to the inner tank through a pump body after passing through the filtering area to form a circulating waterway;
The pump body is electrically connected with the controller.
Preferably, the upper rim of the inner cylinder is suspended from the top of the side wall of the outer cylinder and/or a support is provided on the outer cylinder floor to support the inner cylinder.
Preferably, the drying device comprises a gas pipe, wherein the gas pipe is provided with a gas inlet and a gas outlet, the gas inlet is connected with an external gas source, and the gas outlet is communicated with the drying cavity;
An air inlet valve is arranged on the air inlet pipe and is electrically connected with the controller.
Preferably, a cover plate is movably arranged at the opening end of the drying groove, and a through hole communicated with the drying cavity is formed in the cover plate.
Preferably, the transfer device comprises a translation transfer device and a lifting transfer device;
The translation transfer device is arranged above the cleaning tank and the drying tank along the horizontal direction and drives the translation transfer device to horizontally move through a first driving piece, wherein the movement track of the translation transfer device covers the drying tank and all the cleaning tanks;
the lifting transfer device is arranged above the cleaning tank along the vertical direction, the upper end of the lifting transfer device is connected with the translation transfer device, the lower end of the lifting transfer device is connected with the wafer fixing device, and the lifting transfer device is driven to move up and down through a second driving piece;
The first driving member and the second driving member are electrically connected with the controller.
Preferably, the translation transfer device comprises a plurality of guide rails which are transversely and longitudinally staggered, at least one sliding block is movably arranged on the guide rails, and at least one lifting transfer device is connected to each sliding block;
The slider is electrically connected with the first driving piece.
Preferably, the wafer holding device is connected to the transfer device by a connection assembly;
The connecting assembly comprises a connecting rod, a mounting panel and a fixing piece, wherein the connecting rod, the mounting panel and the fixing piece are sequentially connected from top to bottom and are used for fixing the wafer fixing device;
The upper end of the connecting rod is rotationally connected with the lower end of the lifting transfer device.
Preferably, the multifunctional intelligent cabinet temperature control device further comprises a cabinet body, wherein a cavity is formed in the cabinet body, and at least one ventilation opening communicated with the cavity is formed in the cabinet body;
the drying grooves and all the cleaning grooves are horizontally arranged in the cavity, and the guide rail is fixedly arranged on the inner side surface of the top plate of the cabinet body.
Compared with the prior art, the invention provides a wafer processing device, which has the beneficial effects that:
The wafer processing device provided by the invention comprises a plurality of cleaning tanks, a drying tank, a transfer device, a wafer fixing device and a controller, wherein the wafer fixing device can fix wafers in batches, and the wafer fixing device fixed with the wafers is transferred to the cleaning tanks and the drying tank through the transfer device, so that the cleaning and the drying of the wafers in batches are rapidly completed, the processing efficiency of the wafers is effectively improved, and the pipelining operation is achieved.
Drawings
FIG. 1 is a schematic view of an overall structure of a wafer processing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a jamming mechanism according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a cleaning tank according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a fixing member and a blocking mechanism according to an embodiment of the present invention
Fig. 5 is a schematic structural view of a fixing member according to an embodiment of the present invention.
In the figure: 100. a wafer processing device; 200. a wafer fixing device;
1. A blocking mechanism; 11. a first panel; 12. a second panel; 13. a first connector; 14. a second connector; 15. a plug-in groove; 16. a first through hole; 17. a second through hole;
2. a cleaning tank; 21. an outer cylinder; 22. an inner cylinder; 23. cleaning the cavity; 24. a first water pipe; 25. a first water pump; 26. a filtration zone; 27. a second water pipe; 28. a second water pump;
3. a drying tank; 31. a drying chamber; 32. covering the plate;
4. A connection assembly; 41. a connecting rod; 42. installing a panel; 43. a fixing member;
5. A cabinet body; 6. a vent; 7. a ventilation duct; 8. a display device; 9. a partition board.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application.
It is to be understood that in the description of the present application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, i.e., features defining "first," "second," may explicitly or implicitly include one or more such features. Furthermore, unless otherwise indicated, the meaning of "a plurality" is two or more.
It should be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1, an embodiment of the present invention provides a wafer processing apparatus 100, which includes a plurality of cleaning tanks 2, a drying tank 3, a transfer device, a wafer fixing device 200 and a controller, wherein the wafer fixing device 200 can fix wafers in batches, and transfer the wafer fixing device 200 fixed with the wafers to the cleaning tanks 2 and the drying tank 3 through the transfer device, so that cleaning and drying processes of the wafers in batches are rapidly completed, the processing efficiency of the wafers is effectively improved, and the pipelining operation is achieved.
As shown in fig. 2, the wafer fixing device 200 includes a card plug box and a card plug mechanism 1, wherein a containing space for containing wafers is arranged in the card plug box, and a plurality of wafers can be stored in the containing space and uniformly clamped in the card slot, so that gaps are reserved between adjacent wafers, the adjacent wafers are not adhered together by adsorption, and the wafers are reasonably placed; meanwhile, a plurality of inserting grooves 15 for inserting the clamping boxes are formed in the clamping mechanism 1 around the axis of the clamping mechanism, so that the clamping boxes with the wafers inserted are inserted into the inserting grooves 15, and the clamping boxes are combined together through the clamping mechanism 1.
Specifically, the card plug box comprises two card plug boards which are oppositely arranged, a gap is reserved between the two card plug boards, two ends of each card plug board are respectively provided with a baffle, and the baffles are connected between the two card plug boards, so that the two card plug boards and the two baffles jointly enclose into an accommodating space for accommodating wafers, the inner side surface of each card plug board is provided with a plurality of card slots for inserting wafers, and the plurality of card slots are uniformly arranged at intervals along the length direction of the card plug board, preferably, the number of the card slots is 10-30; the two blocking plates and the two baffles enclose together to form a cuboid frame-shaped accommodating space, and a plurality of wafers are stored in the accommodating space and uniformly clamped in the clamping groove, so that gaps are reserved between adjacent wafers, the adjacent wafers are not adsorbed and adhered together, and the wafers are reasonably placed. Preferably, the clamping groove is a through groove penetrating through two sides of the clamping plug plate, so that the cleaning liquid can penetrate through the through groove to be fully contacted with the wafer when the wafer is cleaned.
As shown in fig. 2, the plug mechanism 1 is a cylindrical frame, a plurality of plug grooves 15 for plugging the plug box are formed on the plug mechanism 1 around the axis thereof, preferably, the plug grooves 15 extend along the length direction of the plug mechanism 1, the cross section shape of the plug grooves 15 corresponds to the cross section shape of the plug box, and further, the length of the plug grooves 15 is consistent with the length of the plug box. Based on the structure, the plug boxes with the wafers inserted are inserted into the inserting grooves 15, and a plurality of plug boxes are combined together through the plug mechanism 1, so that the batch fixed insertion of the wafers is realized.
Specifically, the plugging mechanism 1 comprises a first panel 11, a second panel 12, and a first connecting piece 13 and a second connecting piece 14 connected between the first panel 11 and the second panel 12, wherein the first connecting piece 13 is arranged on the central axis of the plugging mechanism 1, a plurality of second connecting pieces 14 are distributed at intervals at the edge of the plugging mechanism 1, and the first connecting piece 13 and the second connecting piece 14 jointly enclose a plugging groove 15; meanwhile, the first panel 11 is provided with a plurality of first through holes 16 around the axis thereof, the cross section shape of each first through hole 16 corresponds to the cross section shape of the cartridge, and the cartridge can be inserted into the insertion groove 15 surrounded by the first connecting piece 13 and the second connecting piece 14at the first through hole 16. As shown in fig. 4, the first panel 11, the second panel 12, the first connecting piece 13 and the second connecting piece 14 form a hollow cylindrical frame together, meanwhile, the structures of the first panel 11 and the second panel 12 are the same, four first through holes 16 are formed in the first panel 11 around the central axis, four second through holes 17 are formed in the second panel 12 around the central axis, during actual plugging, one end of the plug box is inserted into the plugging groove 15 from the first through holes 16, meanwhile, the plug box continuously extends into the plugging groove 15, the other end of the plug box reaches the second through holes 17, the cross section shapes of the first through holes 16 and the second through holes 17 are the same as the cross section shapes of the plug box, and therefore, two ends of the plug box are respectively embedded in the first through holes 16 and the second through holes 17, the middle part of the plug box is arranged in the plugging groove 15, the first connecting piece 13 and the second connecting piece 14 jointly wrap the plug box, so that the plug box is combined with the plug box 1, and the plug box can be realized, and the plug 1 can be easily contacted with the wafer cleaning solution in the wafer cleaning device in batch by the wafer cleaning device 200, and the wafer cleaning device can be fully contacted with the wafer cleaning device in batch, and the wafer cleaning device is provided by the wafer cleaning device in a wafer cleaning mode.
As shown in fig. 1, the wafer processing apparatus 100 provided in this embodiment further includes a cabinet body 5, a cavity is disposed in the cabinet body 5, and the drying tank 3 and the cleaning tank 2 are horizontally arranged in the cavity, so as to facilitate the pipelining processing of wafers. Preferably, a partition 9 is provided between the drying tub 3 and the cleaning tub 2, so as to prevent the cleaning liquid in the cleaning tub 2 from affecting each other.
As shown in fig. 3, the cleaning tank 2 includes an outer tank 21 and an inner tank 22 sleeved in the outer tank 21, the inner tank 22 has a cleaning cavity 23 with an open top, a water outlet is arranged on a bottom plate or a side plate of the inner tank 22, a filtering area 26 is arranged in the outer tank 21, and cleaning fluid flowing out of the water outlet is sucked back into the inner tank 22 by a pump body after passing through the filtering area 26 to form a circulating waterway.
Specifically, the outer cylinder 21 has an accommodating chamber with an open top, the inner cylinder 22 is disposed in the accommodating chamber, the upper edge of the inner cylinder 22 is suspended on the top of the side wall of the outer cylinder 21, and/or a supporting member is disposed on the bottom plate of the outer cylinder 21 to support the inner cylinder 22, thereby realizing stable sleeving of the inner cylinder 22 in the outer cylinder 21. Wherein, a water outlet is arranged on a bottom plate or a side plate of the inner cylinder 22, a first water pipe 24 is arranged at the water outlet, a water inlet of the first water pipe 24 is arranged at the lower end of the inner cylinder 22, a first water pump 25 is arranged on the first water pipe 24, and cleaning liquid in the inner cylinder 22 is pumped to the outer cylinder 21 through the first water pump 25; meanwhile, a filtering area 26 is arranged in the outer cylinder 21, a chemical filter element is arranged in the filtering area 26, and the chemical filter element can filter and purify cleaning fluid. The water outlet of the filtering area 26 and the inner cylinder 22 are connected through a second water pipe 27, a second water pump 28 is arranged on the second water pipe 27, the second water pump 28 pumps back the cleaning liquid filtered and purified by the filtering area 26 to the inner cylinder 22, and the first water pump 25 and the second water pump 28 are electrically connected with a controller to form a circulating water path, so that on one hand, the cleaning liquid in the inner cylinder 22 is circularly filtered; on the other hand, the fluidity of the cleaning liquid in the inner cylinder 22 is improved, and the contact with the wafer is enhanced.
As shown in fig. 1, the drying tank 3 has a drying cavity 31 with an opening at the top, a drying device for drying wafers is arranged in the drying tank 3, wherein the drying device comprises a gas pipe, the gas pipe is provided with a gas inlet and a gas outlet, the gas inlet is connected with an external gas source, the gas outlet is communicated with the drying cavity 31, a gas inlet valve is arranged on the gas inlet pipe and is electrically connected with the controller, and therefore the external gas source is introduced into the drying cavity 31 to blow and dry the wafers. In order to enhance the drying effect, preferably, the opening end of the drying groove 3 is movably provided with a cover plate 32, and the cover plate 32 covers the top of the drying groove 3, so that the drying cavity 31 is relatively closed, and an external air source is not easy to run off. Meanwhile, the cover plate 32 is provided with a through hole communicated with the drying cavity 31, and the wafer fixing device 200 can enter and exit the drying cavity 31 from the through hole. Preferably, the cabinet body 5 is provided with at least one ventilation opening 6 communicated with the cavity, and a ventilation pipeline 7 is arranged at part of the ventilation opening 6 so as to discharge the drying air source leaked from the drying cavity 31.
The shapes of the cleaning tank 2 and the drying tank 3 are not limited, and in some embodiments, the cleaning tank may be a cuboid, a cylinder, or a quadrangular prism.
The wafer cleaning method generally comprises the steps of firstly carrying out acid cleaning to remove particles and metal ions on the surface of the wafer, then taking out the wafer, placing the wafer in another groove for alkaline cleaning to remove particles and organic matters on the surface of the wafer, then carrying out pure water cleaning to remove the residual ions on the surface of the wafer, and finally carrying out drying treatment on the wafer. Since the number of wafer processing steps is large, the wafers need to be transferred in different cleaning tanks 2 and drying tanks 3 for a plurality of times, and related processing steps are sequentially performed. Based on this, the wafer processing apparatus 100 provided in the present embodiment further includes a transfer means for transferring the wafer to the cleaning tank 2 and the drying tank 3 so as to rapidly complete the cleaning and drying processes of the wafer in the different cleaning tank 2 and drying tank 3.
Preferably, the transfer device comprises a translation transfer device and a lifting transfer device, wherein the translation transfer device is arranged above the cleaning tank 2 and the drying tank 3 along the horizontal direction, and the first driving piece drives the horizontal movement of the translation transfer device, and the movement track of the translation transfer device covers the drying tank 3 and all the cleaning tanks 2; the lifting transfer device is arranged above the cleaning tank 2 along the vertical direction, the upper end of the lifting transfer device is connected with the translation transfer device, the lower end of the lifting transfer device is connected with the wafer fixing device 200, and the lifting transfer device is driven to move up and down through the second driving piece; the first driving member and the second driving member are electrically connected with the controller. It can be understood that the controller controls the horizontal movement and the up-down movement of the translation transferring device and the lifting transferring device, so that the wafer fixing device 200 with the wafer inserted therein can be rapidly transferred into the cleaning tank 2 and the drying tank 3, and the mechanical operation can effectively improve the wafer processing efficiency.
Preferably, the translation transfer device comprises a plurality of guide rails which are transversely and longitudinally staggered, at least one sliding block is movably arranged on the guide rails, each sliding block is at least connected with one lifting transfer device, and the sliding blocks are electrically connected with the first driving piece; the lifting transfer device comprises a telescopic rod, the upper end of the telescopic rod is connected with the sliding block, and the lower end of the telescopic rod is connected with the wafer fixing device 200. During actual installation, a plurality of guide rails which are transversely and longitudinally staggered are arranged on the inner side surface of the top plate of the cabinet body 5, and the drying groove 3 and the cleaning groove 2 are horizontally arranged on the upper surface of the bottom plate of the cabinet body 5.
The operation is as follows: the first driving piece drives the sliding block to slide on the guide rail, and the sliding block can slide above the cleaning tank 2, so that the longitudinal projection of the sliding block can fall into the longitudinal projection of the cleaning tank 2; then, the second driving part drives the telescopic rod to extend downwards into the cleaning cavity 23, so that the wafer fixing device 200 with the wafers inserted therein is driven to extend into the drying cavity 31, and at the moment, the controller synchronously controls the first water pump 25 and the second water pump 28 to start, thereby enhancing the cleaning effect on the wafers; after the cleaning is finished, the second driving part drives the telescopic rod to retract upwards, the first driving part drives the sliding block to slide above the drying groove 3 again, so that the longitudinal projection of the sliding block can fall into the longitudinal projection of the drying groove 3, the second driving part drives the telescopic rod to extend downwards into the drying cavity 31 from the through hole, at the moment, the controller synchronously controls the air inlet valve to open, the wafer is subjected to blowing drying treatment, and after the drying is finished, the second driving part drives the telescopic rod to retract upwards; i.e. to realize one-time transfer of the wafer.
Preferably, in some preferred embodiments, the wafer fixing device 200 is connected to the transferring device through the connection assembly 4, as shown in fig. 4 and 5, the connection assembly 4 includes a connection rod 41, a mounting panel 42 and a fixing member 43 for fixing the wafer fixing device 200, which are sequentially connected from top to bottom, the upper end of the connection rod 41 is rotatably connected with the lower end of the telescopic rod, the lower end of the connection rod 41 is fixedly connected with the mounting panel 42, wherein the fixing member 43 is connected with the lower surface of the mounting panel 42, and in this embodiment, the fixing member 43 is a plurality of hooks, and the plurality of hooks hook the wafer fixing device 200 in a matching manner, that is, the wafer fixing device 200 is rotatably connected with the telescopic rod through the connection assembly 4. It will be appreciated that when the extension rod extends downward into the cleaning chamber 23 or the drying chamber 31, the connection rod 41 rotates relative to the extension rod, thereby driving the wafer fixing device 200, in which the wafer is inserted, to rotate, and the wafer can agitate the cleaning solution during the rotation process, thereby enhancing the contact between the wafer and the cleaning solution, and reducing the cleaning dead angle.
Preferably, in some preferred embodiments, the cabinet 5 is provided with a display device 8, and the display device 8 is electrically connected to the controller, further, the display device 8 is a touch display device 8, and an operator may be able to touch the display device 8 to control the wafer processing device 100.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present invention, and these modifications and substitutions should also be considered as being within the scope of the present invention.
Claims (10)
1. A wafer processing apparatus, comprising:
At least one cleaning tank, each cleaning tank is provided with a cleaning cavity with an open top;
the drying groove is provided with a drying cavity with an opening at the top;
The drying device is arranged in the drying groove and is used for drying the wafer;
a transfer device for transferring the wafer to the cleaning tank and the drying tank;
The wafer fixing device is arranged on the transfer device and comprises a clamping mechanism and a clamping box for fixing wafers, the clamping mechanism comprises a first panel, a second panel, a first connecting piece and a second connecting piece, the first connecting piece and the second connecting piece are connected between the first panel and the second panel, the first connecting piece is arranged on the central axis of the clamping mechanism, a plurality of second connecting pieces are distributed at the edge of the clamping mechanism at intervals, and the first connecting piece and the second connecting piece jointly enclose a plurality of inserting grooves for inserting the clamping box; the first panel is provided with a plurality of first through holes around the axis of the first panel, the cross section of each first through hole corresponds to that of the corresponding clamping plug box, the clamping plug box can be inserted into the inserting groove at the first through hole, so that two ends of the clamping plug box are respectively embedded into the first through hole and the second through hole, the middle part of the clamping plug box is arranged in the inserting groove, and the clamping plug box is jointly wrapped by the first connecting piece and the second connecting piece; and
And the controller is electrically connected with the transfer device.
2. The wafer processing apparatus according to claim 1, wherein: the clamping mechanism is a columnar frame body, a plurality of inserting grooves are formed in the clamping mechanism around the axis of the clamping mechanism, and each inserting groove extends along the length direction of the clamping mechanism.
3. The wafer processing apparatus according to claim 1 or 2, wherein: each cleaning tank comprises an outer tank and an inner tank sleeved in the outer tank, the inner tank is provided with a cleaning cavity, a water outlet is arranged on a bottom plate or a side plate of the inner tank, a filtering area is arranged in the outer tank, and cleaning liquid flowing out of the water outlet is sucked back to the inner tank through a pump body after passing through the filtering area to form a circulating waterway;
The pump body is electrically connected with the controller.
4. A wafer processing apparatus according to claim 3, wherein: the upper edge of the inner cylinder is suspended at the top of the side wall of the outer cylinder and/or a supporting piece is arranged on the bottom plate of the outer cylinder to support the inner cylinder.
5. The wafer processing apparatus according to claim 1 or 2, wherein: the drying device comprises a gas pipe, wherein the gas pipe is provided with a gas inlet and a gas outlet, the gas inlet is connected with an external gas source, and the gas outlet is communicated with the drying cavity;
And the air inlet valve is arranged on the air delivery pipe and is electrically connected with the controller.
6. The wafer processing apparatus according to claim 5, wherein: the drying groove is characterized in that a cover plate is movably arranged at the opening end of the drying groove, and a through hole communicated with the drying cavity is formed in the cover plate.
7. The wafer processing apparatus according to claim 1, wherein: the transfer device comprises a translation transfer device and a lifting transfer device;
The translation transfer device is arranged above the cleaning tank and the drying tank along the horizontal direction and drives the translation transfer device to horizontally move through a first driving piece, wherein the movement track of the translation transfer device covers the drying tank and all the cleaning tanks;
the lifting transfer device is arranged above the cleaning tank along the vertical direction, the upper end of the lifting transfer device is connected with the translation transfer device, the lower end of the lifting transfer device is connected with the wafer fixing device, and the lifting transfer device is driven to move up and down through a second driving piece;
The first driving member and the second driving member are electrically connected with the controller.
8. The wafer processing apparatus according to claim 7, wherein: the translation transfer device comprises a plurality of transverse and longitudinal staggered guide rails, at least one sliding block is movably arranged on the guide rails, and at least one lifting transfer device is connected to each sliding block;
The slider is electrically connected with the first driving piece.
9. The wafer processing apparatus according to claim 7, wherein: the wafer fixing device is connected to the transferring device through a connecting component;
The connecting assembly comprises a connecting rod, a mounting panel and a fixing piece, wherein the connecting rod, the mounting panel and the fixing piece are sequentially connected from top to bottom and are used for fixing the wafer fixing device;
The upper end of the connecting rod is rotationally connected with the lower end of the lifting transfer device.
10. The wafer processing apparatus according to claim 8, wherein: the novel multifunctional cabinet also comprises a cabinet body, wherein a cavity is formed in the cabinet body, and at least one ventilation opening communicated with the cavity is formed in the cabinet body;
the drying grooves and all the cleaning grooves are horizontally arranged in the cavity, and the guide rail is fixedly arranged on the inner side surface of the top plate of the cabinet body.
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| CN115106329A (en) | 2022-09-27 |
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