KR19980059895A - Wafer Wet Cleaner for Semiconductor Device Manufacturing Process - Google Patents

Wafer Wet Cleaner for Semiconductor Device Manufacturing Process Download PDF

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Publication number
KR19980059895A
KR19980059895A KR1019960079241A KR19960079241A KR19980059895A KR 19980059895 A KR19980059895 A KR 19980059895A KR 1019960079241 A KR1019960079241 A KR 1019960079241A KR 19960079241 A KR19960079241 A KR 19960079241A KR 19980059895 A KR19980059895 A KR 19980059895A
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South Korea
Prior art keywords
inner tank
wafer
washing water
semiconductor device
manufacturing process
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KR1019960079241A
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Korean (ko)
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KR100223871B1 (en
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이동현
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문정환
엘지반도체 주식회사
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Publication of KR19980059895A publication Critical patent/KR19980059895A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Abstract

본 발명은 웨이퍼 습식 세정장치의 세정 시스템을 개선하여 웨이퍼의 오염을 줄이는 한편, 세정수 절감 및 수율 향상을 도모할 수 있도록 한 것이다.The present invention is to improve the cleaning system of the wafer wet cleaning device to reduce the contamination of the wafer, while reducing the number of cleaning water and improve the yield.

이를 위해, 본 발명은 웨이퍼(1)가 로딩되는 내조(2)하부에, 내조(2)로 공급된 세정수를 웨이퍼(1)의 언로딩시 정화하여 다시 내조(2)로 보내는 세정수 내부순환수단이 구비되는 반도체소자 제조 공정용 웨이퍼 습식 세정장치이다.To this end, the present invention purifies the washing water supplied to the inner tank 2 under the inner tank 2 into which the wafer 1 is loaded, and then purifies the unloaded wafer 1 to the inner tank 2. It is a wafer wet cleaning apparatus for a semiconductor device manufacturing process provided with a circulation means.

Description

반도체소자 제조 공정용 웨이퍼 습식 세정장치Wafer Wet Cleaner for Semiconductor Device Manufacturing Process

본 발명은 반도체소자 제조 공정용 웨이퍼 습식 세정장치에 관한 것으로서, 더욱 상세하게는 웨이퍼 습식 세정장치의 세정 시스템을 개선하여 웨이퍼의 오염을 줄이는 한편, 세정수 절감 및 수율 향상을 도모할 수 있도록 한 것이다.The present invention relates to a wafer wet cleaning apparatus for a semiconductor device manufacturing process, and more particularly, to improve the cleaning system of a wafer wet cleaning apparatus to reduce contamination of wafers, and to reduce cleaning water and improve yield. .

일반적으로, 반도체소자 제조를 위한 공정 기술이 발전함에 따라 웨이퍼 세정 기술의 중요성은 부단히 증가하고 있으며, 이에 따라 세정 장치의 중요성 또한 실로 크다고 할 수 있다.In general, as the process technology for manufacturing a semiconductor device is developed, the importance of the wafer cleaning technology is constantly increasing, and thus, the importance of the cleaning apparatus is also very large.

특히, 세정조에 유입되는 세정수의 순수도 및 세정조 자체의 순수도 유지를 위한 세정 시스템 개발 노력이 계속되고 있다.In particular, efforts have been made to develop a cleaning system for maintaining the purity of the washing water flowing into the washing tank and the purity of the washing tank itself.

도 1은 종래 습식 세정장치의 기본적인 구조를 나타낸 것으로서, 오버 플로우어 세정 시스템을 채택하고 있는 경우이다.Fig. 1 shows the basic structure of a conventional wet cleaning device, which employs an overflow cleaning system.

한편, 종래 습식 세정장치를 이용한 세정작용은 다음과 같이 이루어진다.On the other hand, the cleaning action using the conventional wet cleaning device is made as follows.

먼저, 세정조를 구성하는 내조(2)에 웨이퍼(1)가 로딩된 상태에서 공급관(8)에 연결된 펌프(9)의 펌핑작용에 의해 세정수 공급유니트(10)의 세정수가 내조(2) 아래 쪽에서 내조(2) 내부로 공급된다.First, the washing water of the washing water supply unit 10 is pumped by the pumping action of the pump 9 connected to the supply pipe 8 while the wafer 1 is loaded in the inner tank 2 constituting the washing tank. It is supplied into the inner tank 2 from the bottom side.

이 때, 내조(2) 하부로부터 공급되는 세정수는 내조(2)를 채운 후 넘쳐 흘러 외조(11)로 흘러나가 배출관(12)을 통해 폐기되거나, 혹은 저장탱크(13)에 저장된 후 필터(14)에 의해 정화된 다음 다시 내조(2)로 재유입된다.At this time, the washing water supplied from the lower portion of the inner tank (2) overflows after filling the inner tank (2), flows out to the outer tank (11), is discarded through the discharge pipe 12, or stored in the storage tank (13) and then filter ( 14) and then back into the inner tank (2).

이와 같이, 내조(2)로 유입된 후 오버 플로우어되는 과정이 반복적으로 진행됨에 따라 내조(2)에 로딩된 웨이퍼(1)는 세정수의 유동에 의해 세정된다.As described above, as the process of flowing into the inner tank 2 and being overflowed is repeatedly performed, the wafer 1 loaded in the inner tank 2 is cleaned by the flow of the washing water.

그러나, 이와 같은 오버 플로우어 방식의 세정장치는 내조(2)로 유입된 세정수에 의해 세정되어 웨이퍼(1) 표면에서 떨어져 나온 파티클중 일부 무거운 파티클이 아래로 가라 앉을 경우 계속 오염원으로 작용하게 되는 단점이 있었다.However, such an overflow type cleaning apparatus is continuously cleaned as a source of contamination when some heavy particles of particles falling off the surface of the wafer 1 by being washed by the washing water flowing into the inner tank 2 sink down. There was a downside.

따라서, 이와 같은 문제점을 해결하기 위한 세정수가 세정조 상부로부터 공급되어 하부로 흘러나가는 다운 플로우잉 시스템 세정조(Down flowing system bath)이 사용되고 있으나, 이 시스템 역시 여전히 세정조 바닥에 있는 오염물들이 원할히 제거되지 않는 문제점이 있었다.Therefore, a down flowing system bath is used in which the washing water is supplied from the top of the washing tank and flows down to solve the problem, but the system still smoothly removes contaminants at the bottom of the washing tank. There was a problem.

즉, 오버 플로우어 방식에 비해서는 효과적이지만 많은 양의 세정수가 소모되며, 여전히 파티클 잔류로 인한 웨이퍼(1) 재오염의 우려가 있었다.That is, although effective compared to the overflow method, a large amount of washing water is consumed, and there is still a fear of re-contamination of the wafer 1 due to particle retention.

본 발명은 상기한 제반 문제점을 해결하기 위한 것으로서, 웨이퍼 습식 세정장치의 세정 시스템을 개선하여 웨이퍼의 오염을 줄이는 한편, 세정수 절감 및 수율 향상을 도모할 수 있도록 한 새로운 방식의 반도체소자 제조 공정용 웨이퍼 습식 세정장치를 제공하는데 그 목적이 있다.Disclosure of Invention The present invention has been made to solve the above-mentioned problems. The present invention is to improve the cleaning system of the wafer wet cleaning apparatus to reduce the contamination of the wafer, and to reduce the number of cleaning water and improve the yield. It is an object of the present invention to provide a wafer wet cleaning apparatus.

상기한 목적을 달성하기 위해, 본 발명은 웨이퍼가 로딩되는 내조 하부에, 내조로 공급된 세정수를 웨이퍼의 언로딩시 정화하여 다시 내조로 보내는 세정수 내부순환수단이 구비되는 반도체소자 제조 공정용 웨이퍼 습식 세정장치이다.In order to achieve the above object, the present invention is a semiconductor device manufacturing process is provided with a washing water internal circulation means for purifying the cleaning water supplied to the inner tank at the lower part of the inner tank in which the wafer is loaded, and sends the cleaning water to the inner tank again Wafer wet cleaning device.

도 1은 종래의 기술장치 구성을 나타낸 종단면도1 is a longitudinal cross-sectional view showing a conventional technical device configuration

도 2는 본 발명 기술장치의 구성을 나타낸 종단면도2 is a longitudinal cross-sectional view showing the configuration of the present invention apparatus

도면의 주요 부분에 대한 부호의 설명Explanation of symbols for the main parts of the drawings

1 : 웨이퍼 2 : 내조1: wafer 2: inner tank

3 : 순환관 4 : 펌프3: circulation pipe 4: pump

5 : 필터 6 : 경사면5: filter 6: slope

7 : 타이머7: timer

이하, 본 발명의 일 실시예를 첨부도면 도 2를 참조하여 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명 기술장치의 구성을 나타낸 종단면도로서, 본 발명은 웨이퍼(1)가 로딩되는 내조(2) 하부에, 내조(2)로 공급된 세정수를 웨이퍼(1)의 언로딩시 정화하여 다시 내조(2)로 보내는 세정수 내부순환수단이 구비되어 구성된다.FIG. 2 is a longitudinal sectional view showing the configuration of the apparatus of the present invention. The present invention is a lower portion of the inner tank 2 in which the wafer 1 is loaded, when the washing water supplied to the inner tank 2 is unloaded. Washing water internal circulation means for purifying and sending to the inner tank (2) is provided.

이 때, 상기 세정수 내부순환수단은 상기 세정수 내부순환수단이 내조(2)의 세정수가 순환하도록 내조(2) 하부 일측과 타측을 연결하는 순환관(3)이 관로 일측에 설치되어 내조(2)의 세정수를 흡입 및 토출시키는 펌프(4)와, 상기 펌프(4)로 흡입되는 세정수를 필터링하도록 순환관(3)의 관로 타측에 설치되는 필터(5)로 구성된다.At this time, the washing water internal circulation means is provided with a circulation tube (3) connected to one side and the other side of the lower portion of the inner tank (2) so that the washing water inner circulation means circulates the washing water of the inner tank (2) to the inner tank ( A pump 4 for sucking and discharging the washing water of 2) and a filter 5 provided on the other side of the pipe line of the circulation pipe 3 to filter the washing water sucked by the pump 4.

또한, 상기 내조(2) 하부의 바닥은 파티클이 순환관(3) 입구로 유입되기 용이하도록 순환관(3)의 입구측이 출구측에 비해 낮은 경사면(6)으로 형성되어 구성된다.In addition, the bottom of the inner tank (2) is formed by the inlet side of the circulation tube 3 is formed in the inclined surface 6 is lower than the outlet side so that particles are easily introduced into the circulation tube (3) inlet.

한편, 상기 순환관(3)에 설치되는 펌프(4)에는 펌프의 작동시간을 조절할 수 있는 타이머(7)가 장착된다.On the other hand, the pump 4 is installed in the circulation pipe (3) is equipped with a timer (7) that can adjust the operating time of the pump.

이와 같이 구성된 본 발명의 작용은 다음과 같다.The operation of the present invention configured as described above is as follows.

먼저, 세정조를 구성하는 내조(2)에 웨이퍼(1)가 로딩된 상태에서 공급관(8)에 연결된 외부순환펌프(9)가 작동하면 세정액 공급유니트(10)에 있는 세정액이 펌프(9)의 펌핑작용에 의해 세정수가 외조(11) 하부에 연결된 공급관(8)을 통해 외조(11)로 공급된다.First, when the external circulation pump 9 connected to the supply pipe 8 operates while the wafer 1 is loaded in the inner tank 2 constituting the cleaning tank, the cleaning liquid in the cleaning liquid supply unit 10 is pumped (9). By the pumping action of the washing water is supplied to the outer tank 11 through the supply pipe 8 connected to the lower portion of the outer tank (11).

이에 따라, 외조(11)에 채워진 세정수는 세정수의 지속적인 공급에 따라 넘쳐 내조(2) 내부로 흘러들어가 웨이퍼(1)에 묻은 파티클을 웨이퍼(1) 표면으로부터 분리 시키게 된다.Accordingly, the washing water filled in the outer tank 11 overflows into the inner tank 2 as the continuous supply of the washing water separates the particles from the wafer 1 from the surface of the wafer 1.

또한, 웨이퍼(1)를 세정에 쓰인 내조(2) 내부의 세정수는 배출관(12)을 통해 유출되어 저장탱크(13)로 유입된 후 폐기되거나, 혹은 저장탱크(13)에 저장된 후 필터(14)에 의해 정화된 다음 내조(2)로 재유입된다.In addition, the washing water inside the inner tank 2 used to clean the wafer 1 flows out through the discharge pipe 12 and flows into the storage tank 13 and then is disposed of, or stored in the storage tank 13 and then filtered. 14) and then re-introduced into the inner tank (2).

또한, 이와 같이, 외조(11)로 유입된 후 내조(2)로 오버 플로우어되는 과정이 반복적으로 진행됨에 따라 내조(2)에 로딩된 웨이퍼(1)의 세정이 이루어지게 된다.In addition, as described above, the process of repeatedly flowing into the inner tank 2 and then overflowing the inner tank 2 is performed to clean the wafer 1 loaded in the inner tank 2.

이와 같이 진행되는 웨이퍼(1)의 세정시, 내조(2)에 로딩된 웨이퍼(1) 언로딩되어 내조(2)를 빠져나가게 되면, 내조(2) 내의 세정수를 순환관으로 순환시켜 필터링하여 내조(2) 내부에 잔류하는 이물질을 걸러내게 된다.During the cleaning of the wafer 1 thus proceeding, when the wafer 1 loaded in the inner tank 2 is unloaded and exits the inner tank 2, the washing water in the inner tank 2 is circulated through the circulation pipe and filtered. The foreign matter remaining in the inner tank (2) is filtered out.

즉, 순환관(3)에 설치된 펌프(4)의 펌핑 작용에 의해 내조(2)내에 있던 세정수는 순환관(3)을 통해 순환하게 되며, 이때 세정수에 함유된 이물질은 순환관(3)의 관로 상에 설치된 필터(5)에 의해 걸러지게 된다.That is, the washing water in the inner tank 2 is circulated through the circulation pipe 3 by the pumping action of the pump 4 installed in the circulation pipe 3, and the foreign matter contained in the washing water is circulated in the circulation pipe 3 Is filtered by a filter (5) installed on the pipeline.

한편, 상기 내조(2) 하부의 바닥은 순환관(3)의 입구측이 출구측에 비해 낮은 경사면(6)으로 형성되므로 파티클등의 잔류물이 펌프(4)측으로 유입되기 용이하다.On the other hand, the bottom of the inner tank (2) is formed in the inclined surface 6 of the inlet side of the circulation pipe 3 is lower than the outlet side, it is easy to flow residues such as particles into the pump (4) side.

또한, 상기 순환관(3)에 설치되는 펌프(4)에는 타이머(7)가 연결되어 있으므로 펌프(4)의 작동시간을 조절하여 웨이퍼(1)의 언로딩시에만 내부 순환 시스템이 작동하도록 조절할 수 있게 된다.In addition, since the timer 7 is connected to the pump 4 installed in the circulation pipe 3, the operation time of the pump 4 is adjusted so that the internal circulation system operates only when the wafer 1 is unloaded. It becomes possible.

이와 같이, 본 발명은 웨이퍼(1) 습식 세정장치를 오버 플로우어 방식에서 다운 플로우어 방식으로 변경하는 하는 한편, 웨이퍼(1)의 언로딩시 내조(2)의 세정수를 순환 및 필터링하여 세정수의 순도를 높이므로써 웨이퍼(1) 세정 장치의 세정 효과를 향상시킬 수 있게 된다.As described above, the present invention changes the wafer 1 wet cleaning device from the overflower method to the downstreamer method, while circulating and filtering the washing water of the inner tank 2 when the wafer 1 is unloaded. By increasing the purity of the water, the cleaning effect of the wafer 1 cleaning apparatus can be improved.

본 발명은 웨이퍼 습식 세정장치의 세정 시스템을 개선하여 세정수의 순도를 높게 유지할 수 있으므로 인해 웨이퍼(1)의 세정 효과를 향상시킬 수 있게 된다.The present invention can improve the cleaning effect of the wafer 1 by improving the cleaning system of the wafer wet cleaning apparatus to maintain the purity of the cleaning water.

즉, 웨이퍼(1) 언로딩시 내조(2) 내부에 세정수에 든 이물질이 걸러지도록 세정수를 순환 및 필터링하여 적은 양의 세정수로도 확실한 웨이퍼(1) 세정효과를 가져올 수 있도록 하므로써 세정수를 절감할 수 있을 뿐만 아니라, 웨이퍼(1)의 오염을 줄여 후공정에서의 수율을 향상시킬 수 있게 된다.That is, the cleaning water is circulated and filtered so that foreign matters contained in the cleaning water are filtered in the inner tank 2 when the wafer 1 is unloaded, so that the cleaning water can be surely cleaned even with a small amount of cleaning water. In addition to reducing the cost, it is possible to reduce the contamination of the wafer 1, thereby improving the yield in the post-process.

Claims (4)

웨이퍼가 로딩되는 내조 하부에, 내조로 공급된 세정수를 웨이퍼의 언로딩시 정화하여 다시 내조로 보내는 세정수 내부순환수단이 구비됨을 특징으로 하는 반도체소자 제조 공정용 웨이퍼 습식 세정장치.A wafer wet cleaning apparatus for a semiconductor device manufacturing process, characterized in that a washing water internal circulation means is provided at a lower portion of an inner tank into which a wafer is loaded to purify the washing water supplied into the inner tank and to return the washing water to the inner tank again. 제1항에 있었서, 상기 세정수 내부순환수단이 상기 내조 내의 세정수를 흡입 및 토출하여 세정수가 내조 하부 일측과 타측열 연결하는 순환관의 관로를 따라 순환하도록 순환관 일측에 설치되는 펌프와, 상기 펌프로 흡입되는 세정수를 필터링하도록 순환관의 관로 타측에 설치되는 필터로 구성됨을 특징으로 하는 반도체 소자 제조 공정용 웨이퍼 습식 세정장치.The pump according to claim 1, wherein the washing water internal circulation means sucks and discharges the washing water in the inner tank and is installed at one side of the circulating pipe so that the washing water circulates along the duct of the circulating pipe connecting the lower side of the inner tank to the other side; Wet cleaning device for a semiconductor device manufacturing process, characterized in that consisting of a filter installed on the other side of the duct of the circulation pipe to filter the cleaning water sucked by the pump. 제2항에 있어서, 상기 내조 하부의 바닥은 파티클이 순환관 입구로 유입되기 용이하도록 순환관의 입구측이 출구측에 비해 낮은 경사면으로 형성됨을 특징으로 하는 반도체소자 제조 공정용 웨이퍼 습식 세정장치.The wafer wet cleaning apparatus of claim 2, wherein the bottom of the inner tank is formed at an inclined surface of the circulation tube having a lower slope than the outlet side so that particles are easily introduced into the circulation tube inlet. 제2항에 있어서, 상기 순환관에 설치되는 펌프에는 펌프의 작동시간을 조절할 수 있는 타이머가 장착됨을 특징으로 하는 반도체소자 제조 공정용 웨이퍼 습식 세정장치.The wafer wet cleaning apparatus for a semiconductor device manufacturing process as claimed in claim 2, wherein the pump installed in the circulation pipe is equipped with a timer for adjusting an operation time of the pump.
KR1019960079241A 1996-12-31 1996-12-31 Wet cleaning apparatus for semiconductor process KR100223871B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020082317A (en) * 2001-04-20 2002-10-31 주식회사 윌비에스엔티 Wafer cleaning material rapid supply and haste withdrawal installation
CN115106329A (en) * 2022-06-17 2022-09-27 广东先导微电子科技有限公司 Wafer processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020082317A (en) * 2001-04-20 2002-10-31 주식회사 윌비에스엔티 Wafer cleaning material rapid supply and haste withdrawal installation
CN115106329A (en) * 2022-06-17 2022-09-27 广东先导微电子科技有限公司 Wafer processing device

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