CN115094381A - 防止金属零件电解加工过程杂散腐蚀的涂层制备方法 - Google Patents
防止金属零件电解加工过程杂散腐蚀的涂层制备方法 Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims abstract description 121
- 239000011248 coating agent Substances 0.000 title claims abstract description 114
- 238000003754 machining Methods 0.000 title claims abstract description 69
- 230000007797 corrosion Effects 0.000 title claims abstract description 39
- 238000005260 corrosion Methods 0.000 title claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 91
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 91
- 230000003647 oxidation Effects 0.000 claims abstract description 39
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 39
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000280 densification Methods 0.000 claims abstract description 13
- 230000015556 catabolic process Effects 0.000 claims abstract description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 34
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 21
- 229910052786 argon Inorganic materials 0.000 claims description 20
- 238000004140 cleaning Methods 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 17
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 11
- 239000002608 ionic liquid Substances 0.000 claims description 11
- 150000002500 ions Chemical class 0.000 claims description 11
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 238000007743 anodising Methods 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
- 238000005269 aluminizing Methods 0.000 claims description 7
- ZXPNHQOWDWPUEH-UHFFFAOYSA-N boric acid;sulfuric acid Chemical compound OB(O)O.OS(O)(=O)=O ZXPNHQOWDWPUEH-UHFFFAOYSA-N 0.000 claims description 7
- 239000012459 cleaning agent Substances 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 6
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- 238000005422 blasting Methods 0.000 claims description 3
- 230000001276 controlling effect Effects 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 238000005516 engineering process Methods 0.000 abstract description 28
- 229910001069 Ti alloy Inorganic materials 0.000 abstract description 21
- 229910045601 alloy Inorganic materials 0.000 abstract description 19
- 239000000956 alloy Substances 0.000 abstract description 19
- 239000003792 electrolyte Substances 0.000 abstract description 12
- 238000005868 electrolysis reaction Methods 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract description 2
- 238000009991 scouring Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- 239000006187 pill Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000003487 electrochemical reaction Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 101100139835 Homo sapiens RAC1 gene Proteins 0.000 description 1
- 102100022122 Ras-related C3 botulinum toxin substrate 1 Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012738 dissolution medium Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
本发明属于氧化铝涂层制备技术技术领域,涉及防止金属零件电解加工过程杂散腐蚀的涂层制备方法。本发明采用纯铝制备技术,在电解加工的金属零件表面制备一层纯铝涂层,再对其进行致密化处理,然后采用阳极氧化技术,将纯铝涂层转变为致密绝缘的氧化铝涂层。氧化铝涂层具有良好的绝缘性能,击穿电压大于15V/μm,与基体的结合力良好,能够在高流速电解液冲刷和电解加工电压下保持稳定,保证非加工面免受杂散腐蚀影响。本发明所制备的涂层对不同牌号的钛合金或高温合金适应性优异。
Description
技术领域
本发明属于氧化铝涂层制备技术技术领域,涉及防止金属零件电解加工过程杂散腐蚀的涂层制备方法。本发明在电解加工的金属零件表面制备一层纯铝涂层,再对其进行致密化处理,然后采用阳极氧化技术,将纯铝涂层转变为致密绝缘的氧化铝涂层。
背景技术
电解加工技术是一种利用电化学腐蚀实现零件材料去除和成型的制造技术,在加工过程中,成型工具阴极与电源负极相连,零件阳极与电源正极相连。电解液从阴极和阳极间所存在的加工间隙中高速流动,充当溶解介质。随着工具阴极按照指定路径不断向零件待加工区域进给,零件表面不断发生材料蚀除,直至预定位置后停止完成加工过程。电解加工过程涉及复杂的电场、流场和化学腐蚀场,电源提供电化学反应所需的电场,电解液带走加工过程中所产生的热量和电化学反应产物。
航空发动机上的整体叶盘、扩压器等复杂构型的整体构件,多数由钛合金、高温合金等制成,加工难度大、制造工艺复杂,机械铣削等传统常规加工方式往往存在加工周期长、刀具消耗快等问题,而电解加工技术在复杂整体构件的加工中具有突出的优势,主要体现在以下几点:
1)不受材料切削性能限制。钛合金和高温合金等难加工材料的硬度高、机械切削性能差,采用传统机械加工时会发生磨损等问题。电解加工技术基于电化学反应腐蚀原理去除材料,基本不会受到零件材质的限制。
2)加工成本低。电解加工基于金属材料阳极溶解的原理实现材料加工,因此工具阴极理论上不会损耗。电解加工整体叶盘的工具成本在批量生产时几乎可以忽略不计,成本仅为所需的水、电费用,合计在万元以下,与铣削加工相比,可称为“零成本”加工。每加工一个高温合金整体叶盘,就可节约数十万元的刀具费用。
3)加工效率高。采用叶栅通道电解粗加工和叶身型面电解精加工方法,可提高整体叶盘的加工效率、缩短制造周期。例如采用铣削技术加工一个中等直径(约600mm)窄通道高温合金整体叶盘,需360小时左右,而采用电解加工技术,只需120小时左右,加工周期显著缩短。
4)适合于窄通道、复杂扭曲、超薄叶型整体叶盘的精密加工。电解加工时工具和工件不接触,因此加工超薄叶片时不会出现加工变形、振动等问题,也不会增加因制造而产生的残余应力。在加工狭窄通道的叶盘时,采用片状成型电极,通过最佳工具运动轨迹识别与控制技术,可将电极准确送入狭窄的叶栅通道中,实现叶盆、叶背型面的精密成型。因此电解加工技术非常适合于加工将来不断发展的窄通道、复杂扭曲、超薄叶型整体叶盘。
正是由于上述突出优势,电解加工技术是国内外制造技术的前沿科技,在航空发动机领域正逐步获得推广应用。然而,电解加工技术仍存在一些技术难题亟待解决,其中杂散腐蚀问题正是困扰电解加工的难点之一。
金属零件的电解加工过程中非加工面的杂散腐蚀问题,涉及到电解液、电源参数、阴阳极形状、工装保护等多个方面的因素。在电解加工过程中,加工阴极接电源负极,零件接电源正极,理论上阴阳极之间由于有电力线的存在,一定范围内只要阴阳极之间充满电解液,零件非加工部位就有被腐蚀的可能。由于加工中间隙的不断变化,阴阳极之间高速流动的电解液会向不同方向喷射。电解液的喷溅和电场的不定域性,使得零件的非加工表面很容易发生阳极溶解,由此会对加工区域附近的非加工表面产生杂散腐蚀,其表现形式多数为点蚀凹坑,通常称之为点蚀或杂散腐蚀。杂散腐蚀的发生不但降低非加工表面质量,而且如果发生在接续电解加工表面上,在电解加工的遗传误差的影响下,容易使预留余量无法满足电解加工的整平比要求;非加工面在杂散腐蚀的作用下会产生锥度,影响零件尺寸和轮廓。因此必须对非加工面进行适当防护,以隔绝或减少杂散腐蚀的效果。
目前常用的防护措施包括改进胶带保护、施加绝缘粒子填充、预设牺牲阳极等手段。国内外已对上述方法开展了相关研究工作,各具优劣。
1)胶带保护方法简单易行,但是电解加工过程中电解液的流速一般可达到20m/s,电解液进/出口的压力差在1MPa以上,在高流速电解液的持续冲击下,胶带保护往往难以持久。
2)施加绝缘粒子填充的方法,是设计专用的阴极工装,在非机加面局部设置空腔,内部充满绝缘粒子,从而达到减少杂散电流的目的。但是这种方法需根据每种零件的特点专门设计工装,空腔的密封性要求严格,复杂性极大,造成工艺调整困难,不适合大规模生产应用。
3)预设牺牲阳极的方法是在非加工面连接额外的同质材料作为阳极,主动吸收杂散电流,从而避免非机加面的腐蚀。然而当前精密电解加工的阴阳极初始间隙仅为0.5~1mm,这对牺牲阳极的设置提出了极高的要求,稍有不当就可能造成短路,击伤零件。因此这种方法仅适合最初级的粗糙加工阶段使用。同时对于复杂构型的零件,所需的牺牲阳极形状需借助电解腐蚀软件进行仿真设计,加工难度也较大。
图1所示为单个叶片的电解加工过程杂散腐蚀及防护涂层示意图,其中波浪箭头代表电解液流向,实线箭头代表电解加工正常电流,虚线箭头代表杂散电流,叶片边缘斜条纹区域代表对叶片区域进行涂层防护。
图1(a)所示为理想状态下电解加工过程,叶片区域已经加工完毕,需要对底面阳极区域进行电解加工,此时叶片区域不应被继续加工。然而实际电解加工过程中,这种理想状态很难完全实现,因为叶片区域也会分配部分电流,即杂散电流,如图1(b)所示。在杂散电流的作用下,叶片区域也会逐渐被溶解,造成表面尺寸变化或者局部发生点蚀。本发明针对上述情况,对叶片区域采用涂层进行防护,起到了隔绝杂散电流的目的,如图1(c)所示。
发明内容
本发明的目的在于提供一种用于金属零件电解加工过程中防止杂散腐蚀的涂层制备方法。这种涂层采用纯铝制备技术,在电解加工的金属零件表面制备一层纯铝涂层,再对其进行致密化处理,然后采用阳极氧化技术,将纯铝涂层转变为致密绝缘的氧化铝涂层,具有制备方法简便、涂层绝缘性好、结合力良好的优点。
本发明的技术方案:防止金属零件电解加工过程杂散腐蚀的涂层制备方法,主要包括以下步骤:1)对金属零件非加工面清洗;2)纯铝涂层制备,纯铝涂层厚度为5~50μm;3)致密化处理;4)阳极氧化,使氧化铝涂层的孔隙率不大于5%,氧化铝涂层的厚度为5~100μm,氧化铝涂层的电阻率不小于1×1012Ω·cm,氧化铝涂层的击穿电压不小于15V/μm;5)涂层退除。
所述步骤1)非加工面清洗具体工艺为:对金属零件,主要是钛合金或高温合金的非加工表面,采用有机溶剂或符合HB 5226的水基清洗剂进行清洗,并保持水膜连续30秒以上。
所述有机溶剂包括碳氢清洗剂、乙醇、丙酮中的一种。
所述步骤2)纯铝涂层制备包括真空离子镀铝、离子液体电镀铝和磁控溅射铝。
所述真空离子镀铝制备纯铝涂层的方案如下:
i)将清洗干净、装挂好的零件放入真空室,关闭舱室;
j)抽真空至低于2.0×10-2Pa,优选低于1.0×10-2Pa;
k)回充氩气至0.5Pa~4.0Pa,优选1.0Pa~2.5Pa;
l)辉光放电清理2min~30min,优选5min~20min;
m)调节蒸发电源,采用纯铝丝靶材或圆筒状纯铝靶材,靶材纯度不低于99.99%;调节电流,控制镀覆速度,镀至铝层厚度2μm~150μm,优选5μm~100μm;
n)冷却1min~30min,优选3min~10min;
o)回充氩气进一步冷却至室温;
p)对真空室放气,取出零件。
所述离子液体电镀铝制备纯铝涂层的方案如下:
e)将清洗干净、装挂好的零件放入氩气或氮气保护的手套箱中;
f)将零件带电状态下浸入到离子液体电镀铝溶液中,溶液温度调整至10℃~90℃,优选25℃~50℃;
g)调节电镀电源,电流密度至0.1A/dm2~5.0A/dm2,优选0.5A/dm2~2.0A/dm2,镀至铝层厚度2μm~150μm,优选5μm~100μm;
h)从溶液中取出零件,清理干净,并退出手套箱。
所述磁控溅射铝制备纯铝涂层的方案如下:
i)将清洗干净、装挂好的零件放入真空室,关闭舱室;
j)抽真空至低于1.0×10-2Pa,优选低于4.0×10-3Pa;
k)回充氩气至0.5Pa~4.0Pa,优选1.0Pa~2.5Pa;
l)辉光放电清理2min~30min,优选5min~20min;
m)调节电源偏压至100V~300V,优选150V~250V;调节溅射电流至5A~30A,优选10A~20A;溅射至铝层厚度2μm~150μm,优选5μm~100μm;
n)冷却1min~30min,优选3min~10min;
o)回充氩气进一步冷却至室温;
p)对真空室放气,取出零件。
所述步骤3)致密化处理是对所制备出的纯铝涂层,采用喷丸处理,丸粒采用完整度不小于95%的玻璃丸或陶瓷丸,丸粒粒径为30μm~250μm,优选60μm~150μm。
所述步骤4)阳极氧化是采用硫酸阳极氧化、硼酸-硫酸阳极氧化、铬酸阳极氧化、硬质阳极氧化、苹果酸-硫酸阳极氧化中的一种工艺进行;其中硫酸阳极氧化按照HB/Z 233进行,硼酸-硫酸阳极氧化按照AMS-A-8625进行,铬酸阳极氧化按照HB/Z 118进行,硬质阳极氧化按照HB/Z 237进行,苹果酸-硫酸阳极氧化按照Q/AVIC 06145进行。
所述步骤5)涂层退除是钛合金或高温合金零件经过电解加工处理后,将非加工面的涂层浸入铬酐和磷酸混合溶液中退除涂层,其中铬酐含量15g/L~20g/L,磷酸含量35g/L~70g/L,溶液温度70℃~90℃,处理时间为除净为止。
本发明的优点在于:
1、本发明提出了用于金属零件电解加工过程中防止杂散腐蚀的涂层的制备方法。采用纯铝制备技术,在电解加工的金属零件表面制备一层纯铝涂层,再对其进行致密化处理,然后采用阳极氧化技术,将纯铝涂层转变为致密绝缘的氧化铝涂层。氧化铝涂层具有良好的绝缘性能,击穿电压大于15V/μm,与基体的结合力良好,能够在高流速电解液冲刷和电解加工电压下保持稳定,保证非加工面免受杂散腐蚀影响。本发明所制备的涂层对不同牌号的钛合金或高温合金适应性优异。
2、纯铝涂层的制备采用真空离子镀铝、离子液体电镀铝和磁控溅射铝等技术进行,其中真空铝和磁控溅射铝技术是基于物理气相沉积的涂层制备技术,能够在各类金属材料上制备;离子液体电镀铝技术是在非水型的离子液体中进行电沉积的新工艺,能够在钢制、钛制和高温合金等材料上沉积纯铝涂层。
3、涂层制备工艺成熟稳定,最终获得的氧化铝涂层性能可靠,结构稳定。本发明的涂层主要包括两个工序,即纯铝涂层的制备和阳极氧化。两个工序所采用的制备方法均为目前成熟的技术。最终获得的氧化铝涂层具有高阻抗、耐击穿、结合力好的突出优点。
4、涂层退除采用磷酸、铬酐混合溶液,对钛合金、高温合金等金属零件不会产生腐蚀等影响。
附图说明
图1杂散腐蚀及涂层防护示意图;其中:(a)理想状态、(b)杂散腐蚀、(c)涂层防护图2是本发明工艺步骤流程图。
具体实施方式
下面结合附图对本发明进一步说明:
本发明的技术方案:防止金属零件电解加工过程杂散腐蚀的涂层制备方法,主要包括以下步骤:1)对金属零件非加工面清洗;2)纯铝涂层制备,纯铝涂层厚度为5~50μm;3)致密化处理;4)阳极氧化,使氧化铝涂层的孔隙率不大于5%,氧化铝涂层的厚度为5~100μm,氧化铝涂层的电阻率不小于1×1012Ω·cm,氧化铝涂层的击穿电压不小于15V/μm;5)涂层退除。详细技术方案如下:
1)非加工面的前处理
金属零件,主要是钛合金或高温合金的非加工表面,可采用碳氢清洗剂、乙醇、丙酮等有机溶剂或符合HB 5226的水基清洗剂进行,并能够保持水膜连续30秒以上。否则需要再进行处理以达到上述效果。
2)纯铝涂层制备
纯铝制备技术包括真空离子镀铝、离子液体电镀铝和磁控溅射铝等技术,可根据技术条件和需要任选其一。
①真空离子镀铝
采用真空离子镀铝制备纯铝涂层的方案如下:
q)将清洗干净、装挂好的零件放入真空室,关闭舱室;
r)抽真空至低于2.0×10-2Pa,优选低于1.0×10-2Pa;
s)回充氩气至0.5Pa~4.0Pa,优选1.0Pa~2.5Pa;
t)辉光放电清理2min~30min,优选5min~20min;
u)调节蒸发电源,采用纯铝丝靶材或圆筒状纯铝靶材,靶材纯度不低于99.99%;调节电流,控制镀覆速度,镀至铝层厚度2μm~150μm,优选5μm~100μm;
v)冷却1min~30min,优选3min~10min;
w)回充氩气进一步冷却至室温;
x)对真空室放气,取出零件。
②离子液体电镀铝
采用离子液体电镀铝制备纯铝涂层的方案如下:
i)将清洗干净、装挂好的零件放入氩气或氮气保护的手套箱中;
j)将零件带电状态下浸入到离子液体电镀铝溶液中,溶液温度调整至10℃~90℃,优选25℃~50℃;
k)调节电镀电源,电流密度至0.1A/dm2~5.0A/dm2,优选0.5A/dm2~2.0A/dm2,镀至铝层厚度2μm~150μm,优选5μm~100μm;
l)从溶液中取出零件,清理干净,并退出手套箱。
③磁控溅射铝
采用磁控溅射铝制备纯铝涂层的方案如下:
q)将清洗干净、装挂好的零件放入真空室,关闭舱室;
r)抽真空至低于1.0×10-2Pa,优选低于4.0×10-3Pa;
s)回充氩气至0.5Pa~4.0Pa,优选1.0Pa~2.5Pa;
t)辉光放电清理2min~30min,优选5min~20min;
u)调节电源偏压至100V~300V,优选150V~250V;调节溅射电流至5A~30A,优选10A~20A;溅射至铝层厚度2μm~150μm,优选5μm~100μm;
v)冷却1min~30min,优选3min~10min;
w)回充氩气进一步冷却至室温;
x)对真空室放气,取出零件。
对所制备出的纯铝涂层,进一步采用致密化处理,降低内部疏松,提高涂层致密度。致密化处理采用喷丸处理,丸粒采用完整度不小于95%的玻璃丸或陶瓷丸,丸粒粒径为30μm~250μm,优选60μm~150μm。
3)阳极氧化
阳极氧化采用硫酸阳极氧化、硼酸-硫酸阳极氧化、铬酸阳极氧化、硬质阳极氧化、苹果酸-硫酸阳极氧化等工艺,其中硫酸阳极氧化按照HB/Z 233进行,硼酸-硫酸阳极氧化按照AMS-A-8625进行,铬酸阳极氧化按照HB/Z 118进行,硬质阳极氧化按照HB/Z 237进行,苹果酸-硫酸阳极氧化按照Q/AVIC 06145进行。
4)涂层退除
钛合金或高温合金零件经过电解加工处理后,将非加工面的涂层浸入铬酐和磷酸混合溶液中退除涂层,其中铬酐含量15g/L~20g/L,磷酸含量35g/L~70g/L,溶液温度70℃~90℃,处理时间为除净为止。
所述金属零件一般是指钛合金或高温合金,在钛合金或高温合金上制备的涂层能够保护非加工面在电解加工过程中免受杂散腐蚀影响效果更好;所指钛合金为TC4、TC17、TC25、TA19等;所指高温合金为GH4169、GH4169D、GH4169G、GH3536、GH4096等。
实施例1
1)钛合金试样前处理
TC4钛合金试样非加工面采用无水乙醇清洗干净。
2)纯铝涂层制备
将TC4钛合金需进行电解加工的表面采用专用工装进行保护,然后放入真空离子镀铝设备中,抽真空至1.0×10-2Pa;回充氩气至1.5Pa;辉光放电清理5min;调节蒸发电源,镀铝至厚度10μm;冷却8min;回充氩气进一步冷却至室温。
采用完整度98%、粒径90μm陶瓷丸进行致密化处理。
3)阳极氧化
将纯铝涂层清洗干净后,浸入硫酸阳极氧化槽液中,设置电流密度1.0A/dm2,处理时间约25min。
按照上述步骤制备的涂层,外观呈现淡灰色,均匀致密,没有明显的缺陷。将非加工面涂层保护的TC4钛合金零件进行电解加工,加工完毕后,退除非加工面涂层,发现非加工面未出现杂散腐蚀引起的点蚀坑、尺寸变化等现象。
实施例2
1)钛合金试样前处理
TC17钛合金试样非加工面采用丙酮清洗干净。
2)纯铝涂层制备
将TC17钛合金需进行电解加工的表面采用专用工装进行保护,然后装挂好放入氩气保护的手套箱中;钛合金零件连接电源阴极,带电浸入到离子液体电镀铝溶液中,溶液温度控制在50℃;调节电镀电源电流,电流密度在1.0A/dm2,镀至纯铝层厚度约15μm。镀后取出零件,清理干净,然后从手套箱中取出。
采用完整度98%、粒径150μm陶瓷丸进行致密化处理。
3)阳极氧化
将纯铝涂层清洗干净后,浸入硼酸-硫酸阳极氧化槽液中,设置电流密度1.0A/dm2,处理时间约30min。
按照上述步骤制备的涂层,外观呈现淡灰色,均匀致密,没有明显的缺陷。将非加工面涂层保护的TC17钛合金零件进行电解加工,加工完毕后,退除非加工面涂层,发现非加工面未出现杂散腐蚀引起的点蚀坑、尺寸变化等现象。
实施例3
1)高温合金试样前处理
GH4169高温合金试样非加工面采用水基清洗剂清洗干净。
2)纯铝涂层制备
将GH4169高温合金需进行电解加工的表面采用专用工装进行保护,然后放入磁控溅射设备中。抽真空至4.0×10-3Pa;回充氩气至1.5Pa;辉光放电清理10min;调节电源偏压至200V,溅射电流至15A,溅射铝层厚度约5μm。冷却5min,回充氩气进一步冷却至室温。对真空室放气,取出零件。
采用完整度98%、粒径150μm玻璃丸进行致密化处理。
3)阳极氧化
将纯铝涂层清洗干净后,浸入苹果酸-硫酸阳极氧化槽液中,设置电流密度1.0A/dm2,处理时间约10min。
按照上述步骤制备的涂层,外观呈现淡灰色,均匀致密,没有明显的缺陷。将非加工面涂层保护的GH4169高温合金零件进行电解加工,加工完毕后,退除非加工面涂层,发现非加工面未出现杂散腐蚀引起的点蚀坑、尺寸变化等现象。
Claims (10)
1.防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,主要包括以下步骤:1)对金属零件非加工面清洗;2)纯铝涂层制备,纯铝涂层厚度为5~50μm;3)致密化处理;4)阳极氧化,使氧化铝涂层的孔隙率不大于5%,氧化铝涂层的厚度为5~100μm,氧化铝涂层的电阻率不小于1×1012Ω·cm,氧化铝涂层的击穿电压不小于15V/μm;5)涂层退除。
2.如权利要求1所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述步骤1)对金属零件非加工面清洗具体工艺为:采用有机溶剂或符合HB 5226的水基清洗剂进行清洗,并保持水膜连续30秒以上。
3.如权利要求2所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述有机溶剂为碳氢清洗剂、乙醇、丙酮中的一种。
4.如权利要求1所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述步骤2)纯铝涂层制备包括真空离子镀铝、离子液体电镀铝和磁控溅射铝。
5.如权利要求4所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述真空离子镀铝制备纯铝涂层的方案如下:
a)将清洗干净、装挂好的零件放入真空室,关闭舱室;
b)抽真空至低于2.0×10-2Pa;
c)回充氩气至0.5Pa~4.0Pa;
d)辉光放电清理2min~30min;
e)调节蒸发电源,采用纯铝丝靶材或圆筒状纯铝靶材,靶材纯度不低于99.99%;调节电流,控制镀覆速度,镀至铝层厚度2μm~150μm;
f)冷却1min~30min;
g)回充氩气进一步冷却至室温;
h)对真空室放气,取出零件。
6.如权利要求4所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述离子液体电镀铝制备纯铝涂层的方案如下:
a)将清洗干净、装挂好的零件放入氩气或氮气保护的手套箱中;
b)将零件带电状态下浸入到离子液体电镀铝溶液中,溶液温度调整至10℃~90℃;
c)调节电镀电源,电流密度至0.1A/dm2~5.0A/dm2,镀至铝层厚度2μm~150μm;
d)从溶液中取出零件,清理干净,并退出手套箱。
7.如权利要求4所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述磁控溅射铝制备纯铝涂层的方案如下:
a)将清洗干净、装挂好的零件放入真空室,关闭舱室;
b)抽真空至低于1.0×10-2Pa;
c)回充氩气至0.5Pa~4.0Pa;
d)辉光放电清理2min~30min;
e)调节电源偏压至100V~300V;调节溅射电流至5A~30A;溅射至铝层厚度2μm~150μm;
f)冷却1min~30min;
g)回充氩气进一步冷却至室温;
h)对真空室放气,取出零件。
8.如权利要求1所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述步骤3)致密化处理是对所制备出的纯铝涂层,采用喷丸处理,丸粒采用完整度不小于95%的玻璃丸或陶瓷丸,丸粒粒径为30μm~250μm,优选60μm~150μm。
9.如权利要求1所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述步骤4)阳极氧化是采用硫酸阳极氧化、硼酸-硫酸阳极氧化、铬酸阳极氧化、硬质阳极氧化、苹果酸-硫酸阳极氧化中的一种工艺进行;其中硫酸阳极氧化按照HB/Z 233进行,硼酸-硫酸阳极氧化按照AMS-A-8625进行,铬酸阳极氧化按照HB/Z 118进行,硬质阳极氧化按照HB/Z 237进行,苹果酸-硫酸阳极氧化按照Q/AVIC 06145进行。
10.如权利要求1所述的防止金属零件电解加工过程杂散腐蚀的涂层制备方法,其特征在于,所述步骤5)涂层退除是金属零件经过电解加工处理后,将非加工面的涂层浸入铬酐和磷酸混合溶液中退除涂层,其中铬酐含量15g/L~20g/L,磷酸含量35g/L~70g/L,溶液温度70℃~90℃,处理时间为除净为止。
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