CN115090900A - Double-beam laser selective melting forming device and method - Google Patents
Double-beam laser selective melting forming device and method Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 25
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- 230000008569 process Effects 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 50
- 238000000465 moulding Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 16
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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Abstract
The invention discloses a double-beam laser selective melting forming device and method, and relates to the field of additive manufacturing. The device comprises a forming working cavity, an air path system, a forming movement mechanism, a substrate, an auxiliary laser system, a main laser system and a control host, wherein a continuous laser in the main laser system and a pulse laser in the auxiliary laser system respectively emit light beams with controllable power and focal spot diameters, the double light beams have the same laser scanning path, and pulse light beams in the forming process can carry out pulse energy remelting on a melted area by controlling the lag time of the light beams emitted by the pulse laser relative to the light beams emitted by the continuous laser, so that the forming quality problem caused by insufficient remelting among layers and melting channels is reduced.
Description
Technical Field
The invention relates to the field of additive manufacturing, in particular to a double-beam laser selective melting forming device and method.
Background
Pure copper has excellent electric conductivity, heat conductivity, corrosion resistance and toughness, and is widely applied to the fields of power electronics, energy, petrochemical industry, machinery, metallurgical industry, aerospace and the like. As the complexity and the precision of parts in the fields of aviation and the like are gradually increased, the defects are gradually revealed in the traditional machining and manufacturing. Among all available additive manufacturing processes, laser selective melting (SLM) has shown advantages over other processes such as high flexibility in geometric design, rapid production of components with complex geometries and high spatial resolution, improved microstructure and performance, customization of products at acceptable cost, and reduction of material waste by recycling raw powder.
At present, the SLM forming technology mainly adopts a single-beam continuous beam as a processing heat source, and powder is melted and stacked layer by layer according to a two-dimensional image obtained by slicing a three-dimensional model to finally form a three-dimensional part. SLM is mainly suitable for materials with low reflectivity, low thermal conductivity, no low boiling point volatile elements. However, pure copper has low laser absorptivity at a wavelength of 1060-1080 nm due to high reflectivity and thermal conductivity, so that unfused powder exists in the formed part; at the same time, the molten pool is rapidly cooled, and the molten pool is narrow, so that insufficient remelting between layers and between melting channels is caused, and a large number of pores exist in a formed part. In addition, there is also a large deformation and cracking of the shaped parts. Finally, the SLM forming process of pure copper has more defects, so that the precision and the surface quality of a formed part are poor, and the popularization and the use of pure copper products are limited.
Disclosure of Invention
The invention aims to provide a double-beam laser selective melting (SLM) forming device and method, and aims to solve the problems of excessive unfused powder, multiple pores, deformation, cracking and the like in the process of forming powder materials such as pure copper and the like in the prior SLM technology by melting and forming pure copper through double-beam laser selective melting, so that the precision and the surface quality of a formed part are improved.
In order to solve the problems, the invention provides a double-beam laser selective melting forming device which comprises a forming working cavity, a gas path system, a forming movement mechanism, a substrate, an auxiliary laser system, a main laser system and a control host; the gas path system comprises a gas inlet and a gas outlet, and the gas inlet and the gas outlet are arranged on the end surface of the forming working cavity; the forming movement mechanism is arranged in the forming working cavity and comprises a powder supply cylinder, a forming cylinder and a powder collecting cylinder, and powder is arranged in one or more of the powder supply cylinder, the forming cylinder and the powder collecting cylinder; the base plate is arranged above the forming cylinder and used for bearing a formed part in the machining process; the auxiliary laser system and the main laser system are both arranged above the forming working cavity, and the auxiliary laser system comprises a pulse laser, an auxiliary collimating mirror, an auxiliary dynamic focusing mirror and an auxiliary vibrating mirror which are sequentially connected; the secondary vibrating mirror is connected with the pulse laser through an optical fiber; the main laser system comprises a continuous laser, a main collimating mirror, a main dynamic focusing mirror and a main vibrating mirror which are connected in sequence, and the main vibrating mirror is connected with the continuous laser through an optical fiber; the auxiliary vibrating mirror and the main vibrating mirror are relatively distributed above the forming working cavity along the horizontal direction; the light beams emitted by the pulse laser and the continuous laser have the same laser scanning path, wherein the time for emitting the light beams by the pulse laser lags behind the time for emitting the light beams by the continuous laser; the control host is respectively in communication connection with the forming working cavity, the gas circuit system, the forming movement mechanism, the substrate, the auxiliary laser system and the main laser system.
Furthermore, the double-beam laser selective melting forming device further comprises a scraper, the scraper is movably connected to the upper surface inside the forming working cavity, and the scraper is in communication connection with the control host.
Furthermore, the double-beam laser selective melting forming device also comprises a protective lens arranged above the forming working cavity.
Further, the material of the powder is pure copper; the type of the pulse laser is one of an infrared pulse laser, a green light pulse laser and an ultraviolet pulse laser; the focal spot diameter D1 of the pulse laser is about 30 μm, and the maximum laser power is 100W; the type of the continuous laser is an infrared pulse laser; the focal spot diameter D2 of the continuous laser is about 30 μm and the maximum laser power is 1000W.
Further, the lag time of the beam emitted by the pulsed laser with respect to the beam emitted by the continuous laser is related to the overlapping ratio λ of the two beams, and when the overlapping ratio λ is equal to 100, the two beams are completely overlapped.
Furthermore, the control host comprises a PLC controller, an industrial personal computer, a galvanometer control card, a servo drive, a frequency converter, a sensor and an analog quantity module.
The application also provides a double-beam laser selective melting forming method, which is realized by controlling the double-beam laser selective melting forming device, and the double-beam laser selective melting forming method comprises the following specific steps: step S1, modeling the part to be molded by using three-dimensional modeling software; step S2, slicing the part model in the step S1 by using slicing software, and guiding the generated path file into the double-beam laser selective melting forming device; step S3, debugging, cleaning and material preparing the double-beam laser selective melting forming device; step S4, the control host computer pre-reads the path file generated in the step S2 and analyzes the path file to obtain the lag time of the light beam emitted by the pulse laser relative to the light beam emitted by the continuous laser; step S5, based on the lag time obtained in step S4, the control host controls the air channel system, the forming motion mechanism, the auxiliary laser system and the main laser system in the double-beam laser selective melting forming device to perform double-light-speed two-dimensional scanning printing; and step S6, finishing printing to obtain a formed piece.
Furthermore, the control host controls the opening and closing states of the air inlet and the air outlet in the air path system, so that the air flow is controlled in real time.
Further, the control host controls the powder supply cylinder, the molding cylinder and the powder collecting cylinder in the molding movement mechanism to move up and down, so as to drive the powder arranged in the powder supply cylinder, the molding cylinder and/or the powder collecting cylinder to move in the molding working cavity according to a specified track.
Further, the control host controls the laser power and the on-off state of the pulse laser and/or the continuous laser; and controlling the lag time of the light beam emitted by the pulse laser relative to the light beam emitted by the continuous laser, so as to control the overlapping rate lambda of the two light beams; and controlling the auxiliary vibrating mirror and the main vibrating mirror to perform scanning motion according to the specified track.
The invention has the following beneficial effects:
1. the continuous laser and the pulse laser respectively emit light beams with controllable power and focal spot diameter, the double light beams have the same laser scanning path, and the delay time of the light beams emitted by the pulse laser relative to the light beams emitted by the continuous laser is controlled, so that the pulse light beams can carry out pulse energy remelting on a melted area in the forming process, and the forming quality problem caused by insufficient remelting between layers and between melting channels is reduced.
2. By arranging the independent laser system and the integrated control host, the automatic control of the SLM forming device is realized, the real-time tracking and coordination control of the motion state of the double beams are realized, the problems of time limitation, cooling speed and the like are solved, and the uniformity of light spots and the energy density of linear light spots are improved.
Drawings
Fig. 1 is a schematic structural diagram of a dual-beam SLM for forming pure copper.
Fig. 2 is a schematic diagram of a two-beam process.
Fig. 3 is a schematic diagram of the double beam overlap ratio.
Fig. 4 is a system integration diagram of the double-beam laser selective melting forming device.
Fig. 5 is a two-dimensional scanning control flow chart of the double-beam laser selective melting forming.
Description of the reference symbols in the drawings:
1-forming working cavity, 2-gas path system, 21-gas inlet, 22-gas outlet, 3-powder, 4-forming movement mechanism, 41-powder supply cylinder, 42-forming cylinder, 43-powder collection cylinder, 5-substrate, 6-scraper, 7-forming piece, 8-protective lens, 9-auxiliary laser system, 91-pulse laser, 92-auxiliary collimating lens, 93-auxiliary dynamic focusing lens, 94-auxiliary vibrating lens, 10-main laser system, 101-continuous laser, 102-main collimating lens, 103-main dynamic focusing lens, 104-main vibrating lens and 11-control host.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a dual-beam laser selective melting molding apparatus, including a molding working chamber 1, a gas path system 2, a molding movement mechanism 4, a substrate 5, a secondary laser system 9, a main laser system 10, and a control host 11; the gas path system 2 comprises a gas inlet 21 and a gas outlet 22, and the gas inlet 21 and the gas outlet 22 are arranged on the end surface of the forming working cavity 1; the forming movement mechanism 4 is arranged in the forming working cavity 1, the forming movement mechanism 4 comprises a powder supply cylinder 41, a forming cylinder 42 and a powder collecting cylinder 43, and one or more of the powder supply cylinder 41, the forming cylinder 42 and the powder collecting cylinder 43 is/are provided with powder 3; a base plate 5 is arranged above the forming cylinder 42, the base plate 5 being used for carrying the formed part 7 during processing; the auxiliary laser system 9 and the main laser system 10 are both arranged above the forming working cavity 1, the auxiliary laser system 9 comprises a pulse laser 91, an auxiliary collimating mirror 92, an auxiliary dynamic focusing mirror 93 and an auxiliary vibrating mirror 94 which are connected in sequence, and the auxiliary vibrating mirror 94 is connected with the pulse laser 91 through an optical fiber; the main laser system 10 comprises a continuous laser 101, a main collimating mirror 102, a main dynamic focusing mirror 103 and a main vibrating mirror 104 which are connected in sequence, wherein the main vibrating mirror 104 is connected with the continuous laser 101 through an optical fiber; the secondary vibrating mirror 94 and the primary vibrating mirror 104 are relatively distributed above the forming working cavity 1 along the horizontal direction; the beams emitted by the pulse laser 91 and the continuous laser 101 have the same laser scanning path, wherein the time of the beam emitted by the pulse laser 91 lags behind the time of the beam emitted by the continuous laser 101; the control host 11 is respectively connected with the forming working cavity 1, the gas path system 2, the forming movement mechanism 4, the substrate 5, the auxiliary laser system 9 and the main laser system 10 in a communication way.
Furthermore, the double-beam laser selective melting forming device also comprises a scraper 6, the scraper 6 is movably connected to the upper surface inside the forming working cavity 1, and the scraper 6 is in communication connection with a control host 11; the movable connection comprises all connection modes capable of realizing movement in a two-dimensional plane and a three-dimensional space, for example, the scraper 6 can be selectively connected to the upper surface inside the forming working cavity 1 through a lead screw guide rail, the lead screw movement of the scraper 6 is controlled through the control host 11, and then the left and right plane movement of the scraper 6 is controlled.
Further, the double-beam laser selective melting forming device also comprises a protective lens 8 arranged above the forming working cavity 1.
Further, as shown in fig. 2, in the process of SLM forming pure copper, since the reflectivity and thermal conductivity of pure copper are high, the defects of a large amount of unfused powder, pores and the like exist in the conventional SLM forming pure copper, which directly affects the precision and surface quality of the formed part. After the continuous laser processing action, the processing mode of pulse laser point scanning is utilized, the laser heat accumulation and the cyclic heat influence in the SLM process are improved, and the internal thermal stress of the formed part is reduced, so that the precision and the surface quality of the formed part are improved. The focal spot diameter of the continuous laser 101 is generally small and the resulting energy density is high, resulting in high temperature gradients and fast cooling rates and susceptibility to quality defects. The continuous laser 101 outputs a light beam, and the light beam is transmitted through a primary collimating lens 102, a primary dynamic focusing lens 103 and a primary vibrating lens 104 to emit a continuous light beam to directly melt powder; after the lag time set by the control host 11, the pulse laser 91 outputs a light beam, and the light beam is transmitted through the secondary collimating lens 92, the secondary dynamic focusing lens 93 and the secondary vibrating lens 94 to emit a pulse light beam to perform pulse energy remelting on the melted area; in the process of forming pure copper by the SLM, the control host 11 can perform real-time coordination control on the system.
Further, the material of the powder 3 is pure copper; the type of the pulse laser 91 is one of an infrared pulse laser, a green pulse laser, and an ultraviolet pulse laser; according to fig. 3, the focal spot diameter D1 of the pulsed laser 91 is about 30 μm, with a maximum laser power of 100W; the type of continuous laser 101 is an infrared pulsed laser; the focal spot diameter D2 of the continuous laser 101 is about 30 μm and the maximum laser power is 1000W. The lag time of the beam emitted by the pulsed laser 91 with respect to the beam emitted by the continuous laser 101 is related to the overlap ratio lambda of the two beams, which overlap completely when the overlap ratio lambda is equal to 100.
Further, the control host 11 includes a PLC controller, an industrial personal computer, a galvanometer control card, a servo drive, a frequency converter, a sensor and an analog module. As can be seen from fig. 4, the dual-beam laser selective melting molding device realizes system integration through the control host 11, wherein the analog quantity module is arranged on the PLC controller; the PLC controller is communicated with the industrial personal computer and the galvanometer control card through a bus; the industrial personal computer and the galvanometer control card are respectively in communication connection with the main focusing unit and the auxiliary focusing unit through galvanometer communication lines, the main focusing unit is in communication connection with the main galvanometer through the galvanometer communication line, and the auxiliary focusing unit is in communication connection with the auxiliary galvanometer through the galvanometer communication line; the primary vibrating mirror is connected with the primary laser through an optical fiber, and the secondary vibrating mirror is connected with the secondary laser through an optical fiber; the main laser and the Fu laser are respectively in communication connection with the PLC through a galvanometer communication line; the PLC receives signals of the servo drive and the frequency converter through bus control and can transmit alarm signals to the servo drive and the frequency converter; in addition, the PLC is also in communication connection with the main water cooler and the auxiliary water cooler through vibrating mirror communication lines respectively; and can receive the signal sent by the sensor and send and receive the signal with the peripheral equipment.
Another embodiment of the present invention provides a selective melting and molding method by dual-beam laser, which is implemented by controlling a selective melting and molding device, and the specific steps of the selective melting and molding method by dual-beam laser, as partially shown in fig. 4-5, include: step S1, modeling the part to be molded by using three-dimensional modeling software; step S2, slicing the part model in the step S1 by using path planning software, and guiding the generated path file into a double-beam laser selective melting forming device; the path planning software can include but is not limited to slicing software Magic, and slicing processing of the part by using the slicing software Magic specifically includes information setting such as scanning tracks, arrangement positions, scanning intervals, supporting and the like; specifically, the path planning software can generate a path file in the forms of slicing and path generation, processing segmentation and lengthening; step S3, debugging, cleaning and material preparing the double-beam laser selective melting forming device; commissioning, cleaning, and material preparation may include, but is not limited to: opening the machine and checking whether the scraper is damaged too much; the residual powder is cleaned, so that the quality is prevented from being influenced by mixed printing of the two kinds of powder; controlling the scraper 6 to return to the original point; a mounting substrate; adding the powder to be printed to the powder supply cylinder 41; the powder supply cylinder 41 is adjusted to a proper position by controlling the lead screw guide rail to move; inputting corresponding parameters through a human-computer interaction interface, checking, previewing and the like; step S4, the host controller 11 pre-reads the path file generated in step S2, and analyzes the path file to obtain the lag time of the beam emitted by the pulse laser 91 relative to the beam emitted by the continuous laser 101; specifically, the path file can be read through an industrial personal computer, and lag time is established through analysis; step S5, based on the lag time obtained in step S4, the control host machine 11 controls the air channel system 2, the forming movement mechanism 4, the auxiliary laser system 9 and the main laser system 10 in the double-beam laser selective melting forming device to perform double-light-speed two-dimensional scanning printing; specifically, control information can be written into the master/slave parallel galvanometer control card through a synchronous position and a switch signal file in the industrial personal computer, the master/slave parallel galvanometer control card respectively sends binary switch signals to the master laser and the slave laser, and then the laser and the slave laser are respectively controlled to carry out double-beam two-dimensional scanning printing. In some embodiments, the specific steps of performing dual-optical-speed two-dimensional scanning printing may include, but are not limited to: controlling the continuous light beam to realize two-dimensional plane motion through the main vibrating mirror 104, and after the set lag time, performing secondary remelting on the pulse light beam through the auxiliary vibrating mirror 904; wherein, the lag time is directly related to the overlapping ratio lambda of the two light beams, and when lambda is 100, the two light beams are completely overlapped; opening laser permission; when the oxygen content of the molding working cavity 1 is lower than 100ppm, starting printing by clicking and confirming; step S6, finishing printing to obtain a formed part; specific steps may include, but are not limited to: after printing is finished, laser permission is closed; closing the valve and cleaning the powder; taking out the parts and absorbing dust; shutting down the machine; and separating the molded part from the substrate by using wire cutting to obtain the molded part.
Further, the control host 11 controls the open/close states of the air inlet 21 and the air outlet 22 in the air channel system 2, thereby controlling the air flow in real time.
Further, the control host 11 controls the powder supply cylinder 41, the molding cylinder 42 and the powder collection cylinder 43 in the molding movement mechanism 4 to move up and down, so as to drive the powder arranged in the powder supply cylinder 41, the molding cylinder 42 and/or the powder collection cylinder 43 to move in the molding working chamber 1 according to a specified track.
Further, the control host 11 controls the laser power and the on/off state of the pulse laser 91 and/or the continuous laser 101; and controlling the lag time of the light beam emitted by the pulse laser 91 relative to the light beam emitted by the continuous laser 101, so as to control the overlapping rate lambda of the two light beams; and controls the sub galvanometer 94 and the main galvanometer 104 to perform scanning movement along a predetermined trajectory.
The continuous laser and pulse laser double-beam SLM is adopted to form pure copper, the delay time is controlled to regulate the overlapping rate lambda of the two beams, the light-emitting units are independently controllable, and the precision and the surface quality of a formed part can be greatly improved. The problems of much unfused powder, more pores, deformation, cracking and the like of the traditional single continuous beam spot SLM forming pure copper are solved, the pulse laser is introduced into the SLM forming pure copper, the influence of laser heat accumulation and circulating heat can be greatly reduced, and the pulse laser can be easily regulated and controlled in a coordinated manner through an independent set of laser system, can track in time when double-beam high-speed scanning is realized, and the problems of time limitation, cooling speed and the like are solved. Greatly improves the uniformity of light spots and the energy density of linear light spots, and has great significance for the industrial application of SLM molding pure copper.
In the present invention, the terms related to the connection structure and the spatial position should be interpreted broadly, for example, the "connection" may be a direct connection or an indirect connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The shapes of the various elements in the drawings are schematic and do not exclude certain differences from the true shapes, and the drawings are provided solely for the purpose of illustrating the principles of the invention and are not intended to be limiting.
Although specific embodiments of the present invention have been disclosed in detail with reference to the accompanying drawings, it is to be understood that such description is merely illustrative of and not restrictive on the broad invention. The scope of the present invention is defined by the appended claims, and may include various modifications, alterations, and equivalents made thereto without departing from the scope and spirit of the invention.
Claims (10)
1. A double-beam laser selective melting forming device comprises a forming working cavity (1), a gas path system (2), a forming movement mechanism (4), a substrate (5), an auxiliary laser system (9), a main laser system (10) and a control host (11); the method is characterized in that:
the gas path system (2) comprises a gas inlet (21) and a gas outlet (22), and the gas inlet (21) and the gas outlet (22) are arranged on the end surface of the forming working cavity (1);
the forming movement mechanism (4) is arranged in the forming working cavity (1), the forming movement mechanism (4) comprises a powder supply cylinder (41), a forming cylinder (42) and a powder collecting cylinder (43), and one or more of the powder supply cylinder (41), the forming cylinder (42) and the powder collecting cylinder (43) are provided with powder (3);
the base plate (5) is arranged above the forming cylinder (42), and the base plate (5) is used for bearing a formed part (7) in the processing process;
the auxiliary laser system (9) and the main laser system (10) are both arranged above the forming working cavity (1), the auxiliary laser system (9) comprises a pulse laser (91), an auxiliary collimating mirror (92), an auxiliary dynamic focusing mirror (93) and an auxiliary vibrating mirror (94) which are sequentially connected, and the auxiliary vibrating mirror (94) is connected with the pulse laser (91) through an optical fiber; the main laser system (10) comprises a continuous laser (101), a main collimating mirror (102), a main dynamic focusing mirror (103) and a main vibrating mirror (104) which are sequentially connected, wherein the main vibrating mirror (104) is connected with the continuous laser (101) through an optical fiber; the secondary vibrating mirror (94) and the main vibrating mirror (104) are relatively distributed above the forming working cavity (1) along the horizontal direction;
the light beams emitted by the pulse laser (91) and the continuous laser (101) have the same laser scanning path, wherein the time for emitting the light beam by the pulse laser (91) lags behind the time for emitting the light beam by the continuous laser (101);
the control host (11) is in communication connection with the forming working cavity (1), the gas circuit system (2), the forming movement mechanism (4), the substrate (5), the auxiliary laser system (9) and the main laser system (10) respectively.
2. The selective melting and forming device of claim 1, wherein: the double-beam laser selective melting forming device further comprises a scraper (6), the scraper (6) is movably connected to the upper surface inside the forming working cavity (1), and the scraper (6) is in communication connection with the control host (11).
3. The dual-beam laser selective melting molding apparatus according to claim 1, wherein: the double-beam laser selective melting forming device further comprises a protective glass (8) arranged above the forming working cavity (1).
4. A dual beam laser selective melt molding apparatus as claimed in any one of claims 1 to 3, wherein:
the powder (3) is made of pure copper;
the type of the pulse laser (91) is one of an infrared pulse laser, a green light pulse laser and an ultraviolet pulse laser; the focal spot diameter D1 of the pulsed laser (91) is about 30 μm, the maximum laser power is 100W; the continuous laser (101) is of the infrared pulse laser type; the continuous laser (101) has a focal spot diameter D2 of about 30 μm and a maximum laser power of 1000W.
5. A dual beam laser selective melt molding apparatus as claimed in any one of claims 1 to 3, wherein:
the lag time of the beam emitted by the pulsed laser (91) with respect to the beam emitted by the continuous laser (101) is related to the overlap ratio lambda of the two beams, which overlap completely when the overlap ratio lambda is equal to 100.
6. A dual beam laser selective melt molding apparatus as claimed in any one of claims 1 to 3, wherein:
the control host (11) comprises a PLC controller, an industrial personal computer, a galvanometer control card, a servo drive, a frequency converter, a sensor and an analog quantity module.
7. A double-beam laser selective melting forming method, which is realized by controlling the double-beam laser selective melting forming device according to any one of claims 1-6, wherein the double-beam laser selective melting forming method comprises the following specific steps:
step S1, modeling the part to be molded by using three-dimensional modeling software;
step S2, slicing the part model in the step S1 by using slicing software, and guiding the generated path file into the double-beam laser selective melting forming device;
step S3, debugging, cleaning and material preparing the double-beam laser selective melting forming device;
step S4, the control host (11) pre-reads the path file in the step S2 and analyzes the path file to obtain the lag time of the light beam emitted by the pulse laser (91) relative to the light beam emitted by the continuous laser (101);
step S5, based on the lag time obtained in the step S4, the control host (11) controls the gas path system (2), the forming movement mechanism (4), the auxiliary laser system (9) and the main laser system (10) in the double-beam laser selective melting forming device to perform double-light-speed two-dimensional scanning printing;
and step S6, finishing printing to obtain a formed part.
8. The selective fusion molding method of claim 7, wherein: in the step S5, the step S of controlling the air channel system (2), the forming movement mechanism (4), the sub-laser system (9) and the main laser system (10) in the double-beam selective laser melting and forming device by the control host (11) to perform double-beam two-dimensional scanning and printing specifically includes:
the control host (11) controls the opening and closing states of the air inlet (21) and the air outlet (22) in the air path system (2), and further controls the air flow in real time.
9. The selective melt forming method of claim 8, wherein: in the step S5, the controlling host (11) controls the air channel system (2), the forming movement mechanism (4), the auxiliary laser system (9) and the main laser system (10) in the double-beam laser selective melting forming device to perform double-light-speed two-dimensional scanning and printing specifically includes:
the control host (11) controls the powder supply cylinder (41), the forming cylinder (42) and the powder collecting cylinder (43) in the forming movement mechanism (4) to move up and down, and then the powder arranged in the powder supply cylinder (41), the forming cylinder (42) and/or the powder collecting cylinder (43) is driven to move in the forming working cavity (1) according to a specified track.
10. The selective melt forming method of claim 9, wherein: in the step S5, the step S of controlling the air channel system (2), the forming movement mechanism (4), the sub-laser system (9) and the main laser system (10) in the double-beam selective laser melting and forming device by the control host (11) to perform double-beam two-dimensional scanning and printing specifically includes:
the control host (11) controls the laser power and the on-off state of the pulse laser (91) and/or the continuous laser (101); and controlling the lag time of the light beam emitted by the pulse laser (91) relative to the light beam emitted by the continuous laser (101) so as to control the overlapping rate lambda of the two light beams; and controlling the secondary oscillating mirror (94) and the primary oscillating mirror (104) to perform scanning motion according to a specified track.
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