CN115066713A - 纹路识别模组及其制备方法和显示装置 - Google Patents

纹路识别模组及其制备方法和显示装置 Download PDF

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Publication number
CN115066713A
CN115066713A CN202080003070.6A CN202080003070A CN115066713A CN 115066713 A CN115066713 A CN 115066713A CN 202080003070 A CN202080003070 A CN 202080003070A CN 115066713 A CN115066713 A CN 115066713A
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light
layer
region
substrate
transmitting
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CN202080003070.6A
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海晓泉
马森
凌秋雨
王雷
王迎姿
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65OLEDs integrated with inorganic image sensors
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1318Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30Devices controlled by radiation
    • H10K39/32Organic image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8791Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90Assemblies of multiple devices comprising at least one organic light-emitting element
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50Forming devices by joining two substrates together, e.g. lamination techniques
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)

Abstract

一种纹路识别模组(100),包括:基底(1);光学传感结构(2),位于基底(1)之上且在纹路识别区域(A)内;光路结构(3),位于光学传感结构(2)背离基底(1)的一侧、至少在纹路识别区域(A)内且未覆盖绑定区域(C),光路结构(3)配置为具有多个透光通道(Q)且射向光路结构(3)的光线仅能从透光通道通(Q)过;光路结构(3)包括:层叠设置的至少两层遮光层(31,31a,31b,31c)和位于每相邻两层遮光层(31,31a,31b,31c)之间的透光层(32,32a,32b),最靠近光学传感结构(2)的遮光层(31a)上设置有呈阵列排布的第一透光孔(311a),最远离光学传感结构(2)的遮光层(31b)上设置有与第一透光孔(311a)一一对应的第二透光孔(311b),第一透光孔(311a)与其所对应的第二透光孔(311b)限定出透光通道(Q),第一透光孔(311a)与其所对应的第二透光孔(311b)在基底(1)上的正投影不重叠。一种纹路识别模组(100)的制备方法和显示装置。

Description

PCT国内申请,说明书已公开。

Claims (43)

  1. PCT国内申请,权利要求书已公开。
CN202080003070.6A 2020-11-30 2020-11-30 纹路识别模组及其制备方法和显示装置 Pending CN115066713A (zh)

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PCT/CN2020/132644 WO2022110105A1 (zh) 2020-11-30 2020-11-30 纹路识别模组及其制备方法和显示装置

Publications (1)

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CN115066713A true CN115066713A (zh) 2022-09-16

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US (1) US20230255088A1 (zh)
CN (1) CN115066713A (zh)
DE (1) DE112020007154T5 (zh)
WO (1) WO2022110105A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11899320B2 (en) * 2021-01-29 2024-02-13 Boe Technology Group Co., Ltd. Array substrate and liquid crystal display panel
CN114565950A (zh) * 2021-07-23 2022-05-31 友达光电股份有限公司 光学感测装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016064222A1 (ko) * 2014-10-24 2016-04-28 주식회사 비욘드아이즈 단위 화소 및 el 지문인식센서
CN107480661B (zh) * 2017-09-30 2023-09-12 苏州迈瑞微电子有限公司 一种光学指纹传感器的光路和具有其的光学指纹传感器
CN211045441U (zh) * 2018-08-21 2020-07-17 神盾股份有限公司 光学传感系统
CN109863506B (zh) * 2019-01-22 2022-03-29 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109784303B (zh) * 2019-01-29 2021-07-30 上海天马微电子有限公司 显示装置
CN110088768B (zh) * 2019-03-12 2022-03-01 深圳市汇顶科技股份有限公司 屏下指纹识别装置和电子设备
CN110690364B (zh) * 2019-11-05 2022-05-17 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
CN111965881B (zh) * 2020-09-08 2022-08-02 厦门天马微电子有限公司 一种显示面板及其制作方法、显示装置

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DE112020007154T5 (de) 2023-03-09
US20230255088A1 (en) 2023-08-10
WO2022110105A1 (zh) 2022-06-02

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