CN115064511B - Semiconductor packaging part with heat radiation structure - Google Patents
Semiconductor packaging part with heat radiation structure Download PDFInfo
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- CN115064511B CN115064511B CN202210987418.0A CN202210987418A CN115064511B CN 115064511 B CN115064511 B CN 115064511B CN 202210987418 A CN202210987418 A CN 202210987418A CN 115064511 B CN115064511 B CN 115064511B
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- heat dissipation
- silicon substrate
- pipeline
- protective sheath
- usb interface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
Abstract
The invention relates to a semiconductor package with a heat dissipation structure. The semiconductor packaging piece comprises a packaging piece body, wherein the packaging piece body comprises a silicon substrate, a chip, a USB interface, an input lead and an output lead, the chip is installed on the upper surface of the silicon substrate, and the input lead is arranged at one end of the silicon substrate.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging parts, and particularly relates to a semiconductor packaging part with a heat dissipation structure.
Background
A semiconductor package is a semiconductor device or integrated circuit that is metal, plastic, glass, or ceramic containing one or more discrete housings. The semiconductor packaging part is usually integrally fixed on the inner wall of the outer shell, the semiconductor packaging part and the outer shell are mutually attached, heat accumulation is easily formed, high temperature generated by other components in the outer shell easily influences the semiconductor packaging part, and if the semiconductor packaging part is exposed, the waterproof performance of the semiconductor packaging part cannot be considered.
Therefore, a semiconductor package with a heat dissipation structure is proposed to solve the above drawbacks.
Disclosure of Invention
The present invention is directed to solve the above problems and to provide a semiconductor package having a simple structure and a reasonable design.
The invention achieves the above purpose through the following technical scheme:
a semiconductor package with a heat dissipation structure comprises a package body, wherein the package body comprises a silicon substrate, a chip, a USB interface, an input lead and an output lead, the chip is installed on the upper surface of the silicon substrate, the input lead is arranged at one end of the silicon substrate, the output lead is arranged at the other end of the silicon substrate, the USB interface is installed on the surface of the silicon substrate, a metal sheet is arranged between the bottom of the chip and the upper surface of the silicon substrate, a protective sleeve is wrapped on the outer portion of the silicon substrate and forms an upper heat dissipation cavity and a lower heat dissipation cavity which are distributed up and down by wrapping the silicon substrate, an opening is formed above the protective sleeve and is used for extending out the USB interface, the protective sleeve keeps a stretching state and is hermetically attached to the periphery of the USB interface, baffle one and baffle two are installed respectively at the both ends of silicon substrate, the both ends of protective sheath cladding respectively at the outer lane of baffle one, baffle two, and the protective sheath keeps laminated in baffle one, two outer lanes of baffle by tensile state, the one end that the protective sheath corresponds respectively with baffle one, keep sealed between the baffle two, the protective sheath laminating all is provided with the heat dissipation clearance with the position of baffle one, two outer lanes of baffle around the USB interface, the heat dissipation clearance is provided with the multiunit, and the heat dissipation clearance forms at the position of baffle one, two outer lanes of baffle through the position of foil puncture protective sheath laminating around the USB interface and puncture protective sheath laminating, multiunit heat dissipation clearance equidistance distribution.
As a further optimization scheme of the invention, the contact positions of the first partition plate, the second partition plate, the silicon substrate, the USB interface and the protective sleeve are fixed in a hot pressing mode.
The mode that the silicon substrate is coated with the protective sleeve is adopted, the whole waterproof performance and the heat dissipation performance of the packaging part body are considered, specifically, the protective sleeve is coated outside the silicon substrate, the position, through which the USB interface needs to penetrate, is provided with the opening, the periphery of the USB interface and the inner wall of the opening still keep sealing, external water can only be blocked outside the protective sleeve and slide down through the smooth surface of the protective sleeve when falling, the external water cannot enter the silicon substrate, the USB interface, the chip and the like on the silicon substrate are affected, and the waterproof performance is good; the protective sleeve coats the silicon substrate and is an upper heat dissipation cavity and a lower heat dissipation cavity which are vertically distributed, so that the phenomenon that external heat enters the upper heat dissipation cavity and the lower heat dissipation cavity to further heat the periphery of the silicon substrate is prevented, heat generated by elements such as a chip on the silicon substrate during working can be accumulated in the upper heat dissipation cavity and the lower heat dissipation cavity, high pressure is formed after the heat is accumulated, the pressure pushes a heat dissipation gap to be opened, the heat is discharged outwards, the phenomenon that the temperature around the silicon substrate is too high is avoided, the width of the heat dissipation gap is set to be small, when water stains and the like impact on the surface of the protective sleeve, the heat dissipation gap is not easy to open, and the water stains on the outside can easily and directly slide off through the surface of the protective sleeve; the waterproof property and the heat radiation property of the whole packaging piece body are both considered.
The both ends of protective sheath are towards the position locking of input wire, output conductor outer lane respectively for water stain easy smooth tip towards the protective sheath flows out when the protective sheath surface is remained water stain, thereby avoids in the surface flow direction USB interface along the protective sheath, and itself has certain waterproof nature in the USB interface, for current common technique, does not do here and give unnecessary details.
Wherein, the curve distribution of protective sheath tip is just for better avoiding water stain to remain on the surface of protective sheath.
As a further optimization scheme of the invention, one end of the end part of the protective sleeve, which extends out of the first partition plate and the second partition plate, forms a second open cavity and a first open cavity respectively, a second heat dissipation pipeline and a first heat dissipation pipeline are arranged in the first open cavity and the second open cavity respectively, one end of the second heat dissipation pipeline is communicated with one end of the upper heat dissipation cavity, one end of the first heat dissipation pipeline is communicated with the other end of the upper heat dissipation cavity, and sealing plugs are arranged at the ends, far away from the upper heat dissipation cavity, of the first heat dissipation pipeline and the second heat dissipation pipeline in a sealing manner.
When the sealing plugs at the positions of the first heat dissipation pipeline and the second heat dissipation pipeline are opened, the heat inside the upper heat dissipation cavity can be directly dissipated, the area and the direction of the heat dissipation are increased, the first heat dissipation pipeline and the second heat dissipation pipeline are distributed at two ends of the silicon substrate and are opposite to each other, so that air can form a circulating state, the pipe diameters of the first heat dissipation pipeline and the second heat dissipation pipeline are small, and external water cannot easily enter the inner part of the upper heat dissipation cavity through the first heat dissipation pipeline and the second heat dissipation pipeline.
As a further optimization scheme of the invention, the upper heat dissipation cavity and the lower heat dissipation cavity are isolated from each other through the silicon substrate, and two side faces of the silicon substrate are movably attached to the inner wall of the protective sleeve.
Wherein, the chip in the upper heat dissipation cavity, the component positions such as USB interface are the main positions that the heat produced, therefore, use the silicon substrate will go up the heat dissipation cavity, lower heat dissipation cavity mutual isolation, make the heat that produces in the upper heat dissipation cavity be difficult for diffusing to lower heat dissipation cavity, make the temperature in the lower heat dissipation cavity be less than the temperature in the upper heat dissipation cavity all the time, the setting up of lower heat dissipation cavity makes the silicon substrate unsettled, make the silicon substrate bottom have certain heat dissipation space, replaced fixing the silicon substrate on the structure and reduced the mode in heat dissipation space, make the heat in the upper heat dissipation cavity can be shared in the lower heat dissipation cavity through the transmission of silicon substrate structural layer, and the heat in the upper heat dissipation cavity is real-time discharges again, such structural design has also guaranteed that silicon substrate upper and lower layer structure is in the state that the difference in temperature is less, avoided silicon substrate both sides temperature difference is big and further lead to components and silicon substrate surface impaired phenomenon, the holistic life of packaging part body has been increased.
As a further optimization scheme of the invention, one side of the package body is provided with an external heat dissipation mechanism, the external heat dissipation mechanism comprises a circulation unit, air inlet and outlet pipelines and heat dissipation pipelines, the heat dissipation pipelines are provided with two groups, the two groups of heat dissipation pipelines and the one group of air inlet and outlet pipelines are both communicated on the circulation unit, one ends of the two groups of heat dissipation pipelines far away from the circulation unit are respectively provided with a first butt joint pipe and a second butt joint pipe, the first butt joint pipe is connected to the first heat dissipation pipeline, and the second butt joint pipe is connected to the second heat dissipation pipeline.
The arrangement of the external heat dissipation mechanism can be used for increasing the overall heat dissipation effect of the packaging part body, when the packaging part body is in a normal working range of temperature, the external heat dissipation mechanism does not need to be started, when the packaging part body works for a long time, the overall temperature of the packaging part body can be accumulated and increased, at the moment, the external heat dissipation mechanism is started, the heat dissipation effect of the packaging part body is increased, and the phenomenon that the working temperature of the packaging part body exceeds a normal value is avoided.
In the device, the circulating unit can use devices such as a fan and the like, the circulating unit can convey wind power to the inside of the upper heat dissipation cavity through one group of heat dissipation pipelines, and after heat in the upper heat dissipation cavity is taken out by the wind power, the wind power is discharged through the other group of heat dissipation pipelines and the air inlet and outlet pipeline at one end of the circulating unit, so that the purpose of efficient heat dissipation is achieved.
As a further optimized scheme of the invention, when the second heat dissipation pipeline and the first heat dissipation pipeline are respectively connected with the second butt joint pipe and the first butt joint pipe, the sealing plugs at the end parts of the first heat dissipation pipeline and the second heat dissipation pipeline are removed, and the end parts of the heat dissipation pipelines and the end parts of the air inlet and outlet pipelines are respectively provided with an electromagnetic valve.
The sealing plug needs to be removed when the external heat dissipation mechanism is used, when the packaging part body is used under the low-temperature condition, the end parts of the first heat dissipation pipeline and the second heat dissipation pipeline are directly sealed through the sealing plug, so that the operation of the packaging part body is not influenced by the fact that water enters the upper heat dissipation cavity through the first heat dissipation pipeline and the second heat dissipation pipeline, the packaging part body is used under the low-temperature condition, and the packaging part body does not have the phenomenon of overhigh temperature.
As a further optimization scheme of the invention, an adjusting device is arranged on the silicon substrate, the adjusting device comprises a threaded rod, a limiting plate, a rotating plate, an external sheath, a rotating groove and a pasting plate, a threaded hole for the middle part of the threaded rod to pass through is formed in the silicon substrate, the threaded rod is in threaded fit connection with the threaded hole, the limiting plate is in threaded fit connection with the upper end of the threaded rod, the rotating plate is in threaded fit connection with the lower end of the threaded rod, the external sheath is fixedly welded on the upper surface of the pasting plate, the rotating groove is formed between the inside of the external sheath and the pasting plate, the rotating plate is rotatably arranged in the rotating groove, and the pasting plate is movably pasted on the inner wall below the protective sheath.
In actual use, when the packaging part body is used integrally, different chips or USB interfaces are required to be added on the silicon substrate at a later stage, so that the aim of updating equipment used by enterprises under the condition of low cost is fulfilled; specifically, when silicon substrate upper surface is provided with new chip and USB interface, go up the volume in heat dissipation chamber and be enlarged, the protective sheath top needs upwards stretching, thereby reserve sufficient space and supply new chip and USB interface installation, therefore, be provided with adjusting device on the silicon substrate, the adjustable volume size in heat dissipation chamber and lower heat dissipation chamber of going up of adjusting device, the volume expansion that supplies the heat dissipation chamber when the volume in heat dissipation chamber reduces down, thereby can make the protective sheath need not to change, use cost is reduced, and avoided the protective sheath again and the silicon substrate between the loaded down with trivial details mode of installing, high durability and convenient use.
When the volume of the upper heat dissipation cavity and the lower heat dissipation cavity is adjusted, only the threaded rod needs to be rotated, the threaded rod drives the rotating plate to rotate movably in the rotating groove, the threaded rod goes up and down in the threaded hole, the rotating plate at the end part of the threaded rod also keeps synchronous going up and down, so that the whole sticking plate is driven to go up and down, the purpose of changing the inner wall bracing degree of the sticking plate to the lower end of the protective sleeve is achieved, and the self-adaptive tightness of the protective sleeve can be adjusted.
As a further optimized solution of the present invention, the upper surface of the metal sheet is movably attached to the bottom surface of the chip, and the upper surface of the metal sheet and the lower surface of the chip are kept in a completely attached state, the lower surface of the metal sheet is attached to the upper surface of the silicon substrate, and the lower surface of the metal sheet and the upper surface of the silicon substrate are kept in a completely attached state, and the metal sheet is fixedly connected to the upper surface of the silicon substrate by screws.
Specifically, the mode that the metal sheet is attached to the bottom surface of the chip enables heat generated by the chip to be better transferred to the silicon substrate to be evenly distributed, and the heat dissipation area and the heat dissipation efficiency are increased.
As a further optimization scheme of the invention, the end part of the input lead passes through the first partition plate, the position where the input lead passes through the first partition plate is kept sealed with the first partition plate, the output lead passes through the second partition plate, and the position where the output lead passes through the second partition plate is kept sealed with the second partition plate.
During the in-service use, the protective sheath passes through the fixed mode of hot pressing and baffle one, baffle two, the silicon substrate, the contact of USB interface, can make the protective sheath easy plastic deformation under the heating condition with baffle one, baffle two, the laminating between the silicon substrate, make the protective sheath adhere to firmly between baffle one, baffle two, the silicon substrate, on the USB interface, can establish the outer lane at the silicon substrate with the plastic bag cover that originally is the tube-shape, under the heating condition, the plastic bag is automatic to shrink tightly and forms the cladding at baffle one, baffle two, the silicon substrate, the outside protective sheath of USB interface, later on the position that corresponds the USB interface with the burin draw the opening can, according to actual demand, also can use outside roller etc. to press the protective sheath surface, make the protective sheath surface form shape and the orbit that makes its remaining water stain landing in surface easily.
As a further optimization scheme of the invention, the protective sleeve is a transparent high-strength plastic film.
When the protective sleeve uses a transparent high-strength plastic film, the protective sleeve structure is not easy to break, can keep long service life, can clearly observe the element structure on the surface of the silicon substrate, and is convenient for subsequent overhaul and maintenance.
The invention has the beneficial effects that:
1. the mode that the silicon substrate is coated with the protective sleeve is adopted, the whole waterproof performance and the heat dissipation performance of the packaging part body are considered, specifically, the protective sleeve is coated outside the silicon substrate, the position, through which the USB interface needs to penetrate, is provided with the opening, the periphery of the USB interface and the inner wall of the opening still keep sealing, external water can only be blocked outside the protective sleeve and slide down through the smooth surface of the protective sleeve when falling, the external water cannot enter the silicon substrate, the USB interface, the chip and the like on the silicon substrate are affected, and the waterproof performance is good; the protective sleeve coats the silicon substrate and is an upper heat dissipation cavity and a lower heat dissipation cavity which are vertically distributed, so that the phenomenon that external heat enters the upper heat dissipation cavity and the lower heat dissipation cavity to further heat the periphery of the silicon substrate is prevented, heat generated by elements such as a chip on the silicon substrate during working can be accumulated in the upper heat dissipation cavity and the lower heat dissipation cavity, high pressure is formed after the heat is accumulated, the pressure pushes a heat dissipation gap to be opened, the heat is discharged outwards, the phenomenon that the temperature around the silicon substrate is too high is avoided, the width of the heat dissipation gap is set to be small, when water stains and the like impact on the surface of the protective sleeve, the heat dissipation gap is not easy to open, and the water stains on the outside can easily and directly slide off through the surface of the protective sleeve; the waterproof performance and the heat dissipation performance of the whole packaging piece body are both considered.
2. According to the invention, when the sealing plugs at the positions of the first heat dissipation pipeline and the second heat dissipation pipeline are opened, the heat in the upper heat dissipation cavity can be directly dissipated, so that the heat dissipation area and the heat dissipation direction are increased, the first heat dissipation pipeline and the second heat dissipation pipeline are distributed at two ends of the silicon substrate and are opposite to each other, so that air can form a circulating state, the diameters of the first heat dissipation pipeline and the second heat dissipation pipeline are small, and external water cannot easily enter the upper heat dissipation cavity through the first heat dissipation pipeline and the second heat dissipation pipeline.
3. The positions of components such as a chip, a USB interface and the like in the upper heat dissipation cavity are main positions for generating heat, so that the upper heat dissipation cavity and the lower heat dissipation cavity are isolated from each other by using the silicon substrate, the heat generated in the upper heat dissipation cavity is not easy to diffuse into the lower heat dissipation cavity, the temperature in the lower heat dissipation cavity is always lower than that in the upper heat dissipation cavity, the silicon substrate is suspended by the lower heat dissipation cavity, a certain heat dissipation space is formed at the bottom of the silicon substrate, the mode that the heat dissipation space is reduced by fixing the silicon substrate on a structural member is replaced, the heat in the upper heat dissipation cavity can be shared into the lower heat dissipation cavity through the transmission of a silicon substrate structure layer, the heat in the upper heat dissipation cavity is discharged in real time, the structural design also ensures that an upper layer structure and a lower layer structure of the silicon substrate are in a state with small temperature difference, the phenomenon that the surfaces of the components and the silicon substrate are further damaged due to large temperature difference between the two surfaces of the silicon substrate is avoided, and the service life of the whole packaging part body is prolonged.
4. The arrangement of the external heat dissipation mechanism can be used for increasing the heat dissipation effect of the whole packaging piece body, when the temperature of the packaging piece body is in a normal working range, the external heat dissipation mechanism does not need to be started, when the packaging piece body works for a long time, the temperature of the whole packaging piece body is accumulated and increased, at the moment, the external heat dissipation mechanism is started to increase the heat dissipation effect of the packaging piece body, and the phenomenon that the working temperature of the packaging piece body exceeds a normal value is avoided,
5. the adjusting device can correspondingly adjust and adapt the overall position of the protective sleeve when components are added on the silicon substrate subsequently.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic diagram of a silicon substrate structure according to the present invention;
FIG. 5 is a cross-sectional view of the present invention;
FIG. 6 is a schematic view of a heat sink mechanism connected to the package body according to the present invention;
FIG. 7 is a schematic view of the structure of the adjusting device of the present invention;
FIG. 8 is a schematic view of a second heat dissipation pipe according to the present invention.
In the figure: 1. a package body; 2. a USB interface; 3. a protective sleeve; 4. an opening; 5. an input lead; 6. an output lead; 7. a silicon substrate; 8. a chip; 9. a metal sheet; 10. a first clapboard; 11. a second clapboard; 12. an upper heat dissipation cavity; 13. a lower heat dissipation cavity; 14. opening the first chamber; 15. opening the second chamber; 16. an adjustment device; 17. a first heat dissipation duct; 18. a second heat dissipation duct; 19. a sealing plug; 20. a first butt joint pipe; 21. a second butt joint pipe; 22. a heat dissipation pipe; 23. a circulation unit; 24. an inlet and outlet duct; 25. a limiting plate; 26. a threaded rod; 27. a threaded hole; 28. a rotating plate; 29. an outer sheath; 30. pasting a plate; 31. a rotating groove; 401. a heat dissipation gap.
Detailed Description
The present application will now be described in further detail with reference to the drawings, it should be noted that the following detailed description is given for illustrative purposes only and is not to be construed as limiting the scope of the present application, as those skilled in the art will be able to make numerous insubstantial modifications and adaptations to the present application based on the above disclosure.
As shown in fig. 1 to 8, a semiconductor package with a heat dissipation structure comprises a package body 1, wherein the package body 1 comprises a silicon substrate 7, a chip 8, a USB interface 2, an input lead 5 and an output lead 6, the chip 8 is mounted on the upper surface of the silicon substrate 7, the input lead 5 is disposed at one end of the silicon substrate 7, the output lead 6 is disposed at the other end of the silicon substrate 7, the USB interface 2 is mounted on the surface of the silicon substrate 7, a metal sheet 9 is disposed between the bottom of the chip 8 and the upper surface of the silicon substrate 7, a protective sheath 3 is wrapped outside the silicon substrate 7, the silicon substrate 7 is wrapped by the protective sheath 3 to form an upper heat dissipation cavity 12 and a lower heat dissipation cavity 13 which are distributed up and down, an opening 4 is disposed above the protective sheath 3, the opening 4 is used for extending out of the USB interface 2, the protective sheath 3 keeps a stretching state and is hermetically attached around the USB interface 2, first 10 and second 11 baffles are installed respectively to silicon substrate 7's both ends, the both ends cladding respectively of protective sheath 3 is at first 10 baffles, the outer lane of second 11 baffles, and protective sheath 3 keeps being laminated at first 10 baffles by tensile state, two 11 outer lanes of baffles, the one end that protective sheath 3 corresponds respectively with first 10 baffles, keep sealed between two 11 baffles, protective sheath 3 laminating is around USB interface 2 and first 10 baffles, the position of two 11 outer lanes of baffles all is provided with heat dissipation clearance 401, heat dissipation clearance 401 is provided with the multiunit, heat dissipation clearance 401 is laminated at first 10 baffles through the position of foil puncture protective sheath 3 laminating around USB interface 2 and the laminating of puncture protective sheath 3, the position of two 11 outer lanes of baffles forms, multiunit heat dissipation clearance 401 equidistance distributes.
The first partition plate 10, the second partition plate 11, the silicon substrate 7, the USB interface 2 and the protection sleeve 3 are fixed in a contact position in a hot pressing mode.
In the invention, the silicon substrate 7 is coated with the protective sleeve 3, the whole waterproof property and heat dissipation property of the packaging part body 1 are considered, specifically, the protective sleeve 3 is coated outside the silicon substrate 7, the opening 4 is formed at the position through which the USB interface 2 needs to pass, but the periphery of the USB interface 2 and the inner wall of the opening 4 still keep sealing, when the external water is scattered, the external water can only be blocked outside the protective sleeve 3 and slide down through the smooth surface of the protective sleeve 3, but can not enter the silicon substrate 7, the USB interface 2, the chip 8 and the like on the silicon substrate 7 are affected, and the waterproof property is good; the protective sleeve 3 coats the silicon substrate 7 with the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 which are vertically distributed, so that the phenomenon that external heat enters the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 to further heat the periphery of the silicon substrate 7 is prevented, heat generated by elements such as a chip 8 on the silicon substrate 7 during working can be accumulated in the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13, high pressure is formed after heat accumulation, the pressure pushes the heat dissipation gap 401 to open, heat is discharged outwards, the phenomenon that the temperature around the silicon substrate 7 is too high is avoided, the width of the heat dissipation gap 401 is set to be small, when water stains and the like impact on the surface of the protective sleeve 3, the heat dissipation gap 401 is not easy to open, and the external water stains are easy to directly slide off through the surface of the protective sleeve 3; the entire package body 1 is both waterproof and heat dissipation.
The both ends of protective sheath 3 are towards the position locking of input wire 5, 6 outer lanes of output wire respectively for water stain easy smooth tip towards protective sheath 3 flows out when water stain is remained on 3 surfaces of protective sheath, thereby avoids flowing to USB interface 2 along the surface of protective sheath 3, and itself has certain waterproof nature in the USB interface 2, for current common technique, does not do here and give unnecessary detail.
Wherein, the curve distribution of protective sheath 3 tip is just in order to better avoid water stain to remain at the surface of protective sheath 3.
One end of the end portion of the protective sleeve 3 extending out of the first partition plate 10 and one end of the second partition plate 11 form a first opening cavity 15 and a second opening cavity 14 respectively, the first opening cavity 14 and the second opening cavity 15 are respectively provided with a second heat dissipation pipeline 18 and a first heat dissipation pipeline 17, one end of the second heat dissipation pipeline 18 is communicated with one end of the upper heat dissipation cavity 12, one end of the first heat dissipation pipeline 17 is communicated with the other end of the upper heat dissipation cavity 12, and one ends, far away from the upper heat dissipation cavity 12, of the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are respectively provided with a sealing plug 19 in a sealing mode.
When the sealing plugs 19 at the positions of the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are opened, the heat inside the upper heat dissipation cavity 12 can be directly dissipated, the heat dissipation area and the heat dissipation direction are increased, the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are distributed at two ends of the silicon substrate 7 and are opposite to each other, so that air can form a circulating state, the pipe diameters of the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are small, and external water cannot easily enter the inner part of the upper heat dissipation cavity 12 through the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18.
The upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 are isolated from each other through the silicon substrate 7, and two side faces of the silicon substrate 7 are movably attached to the inner wall of the protective sleeve 3.
The positions of the components such as the chip 8 and the USB interface 2 in the upper heat dissipation cavity 12 are the main positions where heat is generated, therefore, the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 are isolated from each other by the silicon substrate 7, so that the heat generated in the upper heat dissipation cavity 12 is not easily diffused into the lower heat dissipation cavity 13, and the temperature in the lower heat dissipation cavity 13 is always lower than the temperature in the upper heat dissipation cavity 12, the silicon substrate 7 is suspended by the lower heat dissipation cavity 13, so that the bottom of the silicon substrate 7 has a certain heat dissipation space, instead of fixing the silicon substrate 7 on a structural member and reducing the heat dissipation space, so that the heat in the upper heat dissipation cavity 12 can be shared into the lower heat dissipation cavity 13 through the transmission of the silicon substrate 7 structural layer, and the heat in the upper heat dissipation cavity 12 is discharged in real time, such a structural design also ensures that the upper and lower layers of the silicon substrate 7 are in a state with a small temperature difference, thereby avoiding the phenomenon that the components and the surface of the silicon substrate 7 are further damaged due to a large temperature difference between the two surfaces of the silicon substrate 7, and increasing the service life of the whole package body 1.
One side of packaging part body 1 is provided with outer heat dissipation mechanism, and outer heat dissipation mechanism includes circulation unit 23, business turn over trachea way 24, heat dissipation pipeline 22, and heat dissipation pipeline 22 is provided with two sets ofly, and two sets of heat dissipation pipelines 22 and a set of business turn over trachea way 24 all communicate on circulation unit 23, and the one end that circulation unit 23 was kept away from to two sets of heat dissipation pipelines 22 is provided with respectively to manage one 20, manage two 21 to the butt joint, and manage one 20 to connect on first heat dissipation pipeline 17 to the butt joint, and manage two 21 to connect on second heat dissipation pipeline 18 to the butt joint.
The arrangement of the external heat dissipation mechanism can be used for increasing the overall heat dissipation effect of the packaging part body 1, when the temperature of the packaging part body 1 is within a normal working range, the external heat dissipation mechanism does not need to be started, when the packaging part body 1 works for a long time, the overall temperature of the packaging part body 1 can be increased in an accumulated mode, at the moment, the external heat dissipation mechanism is started, the heat dissipation effect of the packaging part body 1 is increased, and the situation that the working temperature of the packaging part body 1 exceeds a normal value is avoided.
In the device, the circulating unit 23 can use a fan or other devices, the circulating unit 23 can convey wind power to the inside of the upper heat dissipation cavity 12 through one group of heat dissipation pipelines 22, and after the heat in the upper heat dissipation cavity 12 is taken out by the wind power, the wind power is discharged through the other group of heat dissipation pipelines 22 and the air inlet and outlet pipeline 24 at one end of the circulating unit 23, so that the purpose of efficient heat dissipation is achieved.
When the second heat dissipation pipeline 18 and the first heat dissipation pipeline 17 are connected with the second butt joint pipe 21 and the first butt joint pipe 20 respectively, the sealing plugs 19 at the ends of the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are removed, and electromagnetic valves are arranged at the end of the heat dissipation pipeline 22 and the end of the air inlet and outlet pipeline 24.
Need get rid of sealing plug 19 when using outer heat dissipation mechanism, when packaging part body 1 used under the low temperature condition, the tip of first heat dissipation pipeline 17, second heat dissipation pipeline 18 is direct sealed through sealing plug 19 to better assurance water can not get into the inside in last heat dissipation chamber 12 and influence packaging part body 1 work through first heat dissipation pipeline 17, second heat dissipation pipeline 18, and uses packaging part body 1 under the low temperature condition, and packaging part body 1 does not have the too high phenomenon of temperature yet.
Be provided with adjusting device 16 on silicon substrate 7, adjusting device 16 includes threaded rod 26, limiting plate 25, rotor plate 28, outside sheath 29, rotation groove 31 and flitch 30, be provided with the screw hole 27 that supplies the threaded rod 26 middle part to pass on silicon substrate 7, be connected through screw-thread fit between threaded rod 26 and the screw hole 27, limiting plate 25 passes through screw-thread fit connection in the upper end of threaded rod 26, rotor plate 28 passes through the lower extreme of screw-thread fit connection at threaded rod 26, the fixed welding of outside sheath 29 is on the upper surface of flitch 30, form rotation groove 31 between the inside of outside sheath 29 and the flitch 30, rotor plate 28 rotates and sets up in rotation groove 31, flitch 30 activity laminating is on the below inner wall of protective sheath 3.
In practical use, when the package body 1 is used as a whole, different chips 8 or USB interfaces 2 need to be added on the silicon substrate 7 at a later stage, so as to achieve the purpose of updating equipment used by enterprises at low cost; specifically, when silicon substrate 7 upper surface is provided with new chip 8 and USB interface 2, go up the volume in heat dissipation chamber 12 and be enlarged, protective sheath 3 top needs upwards tensile, thereby reserve sufficient space and supply new chip 8 and the installation of USB interface 2, therefore, be provided with adjusting device 16 on silicon substrate 7, adjusting device 16 is adjustable goes up the volume size in heat dissipation chamber 12 and heat dissipation chamber 13 down, the volume that supplies heat dissipation chamber 12 when reducing the volume in heat dissipation chamber 13 down enlarges, thereby can make protective sheath 3 need not to change, use cost is reduced, and avoided the loaded down with trivial details mode of installing between protective sheath 3 and the silicon substrate 7 once more, high durability and convenient use.
When adjusting the volume of the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13, only the threaded rod 26 needs to be rotated, at the moment, the threaded rod 26 drives the rotating plate 28 to movably rotate in the rotating groove 31, the threaded rod 26 goes up and down in the threaded hole 27, and the rotating plate 28 at the end part of the threaded rod 26 also keeps synchronous going up and down, so that the flitch 30 is driven to integrally go up and down, the purpose of changing the inner wall bracing degree of the lower end of the protective sleeve 3 by the flitch 30 is achieved, and the adjustable tightness of the protective sleeve 3 capable of being self-adaptive is achieved.
The upper surface of the metal sheet 9 is movably attached to the bottom surface of the chip 8, the upper surface of the metal sheet 9 and the lower surface of the chip 8 are kept in a completely attached state, the lower surface of the metal sheet 9 is attached to the upper surface of the silicon substrate 7, the lower surface of the metal sheet 9 and the upper surface of the silicon substrate 7 are kept in a completely attached state, and the metal sheet 9 is fixedly connected to the upper surface of the silicon substrate 7 through screws.
Specifically, the way that the metal sheet 9 is attached to the bottom surface of the chip 8 can enable the heat generated by the chip 8 to be better transferred to the silicon substrate 7 to be uniformly distributed, and the heat dissipation area and the heat dissipation efficiency are increased.
The end part of the input lead 5 penetrates through the first partition plate 10, the position where the input lead 5 penetrates through the first partition plate 10 is sealed with the first partition plate 10, the output lead 6 penetrates through the second partition plate 11, and the position where the output lead 6 penetrates through the second partition plate 11 is sealed with the second partition plate 11.
During actual use, the protective sleeve 3 is in contact with the first partition plate 10, the second partition plate 11, the silicon substrate 7 and the USB interface 2 in a hot-pressing fixing mode, namely, the protective sleeve 3 is attached to the first partition plate 10, the second partition plate 11, the silicon substrate 7 and the USB interface 2 in a heating state which enables the protective sleeve 3 to be easily subjected to plastic deformation, so that the protective sleeve 3 is adhered to the first partition plate 10, the second partition plate 11, the silicon substrate 7 and the USB interface 2, an original cylindrical plastic bag can be sleeved on the outer ring of the silicon substrate 7, under a heating condition, the plastic bag is automatically shrunk to form the protective sleeve 3 covering the first partition plate 10, the second partition plate 11, the silicon substrate 7 and the USB interface 2, then an opening 4 is formed in the position corresponding to the USB interface 2 by a graver, according to actual requirements, an external roller shaft and the like can be used for pressing the outer surface of the protective sleeve 3, and a shape and a track which enable water stains remaining on the surface of the protective sleeve 3 to easily slide off are formed on the outer surface.
The protective sleeve 3 is a transparent high-strength plastic film.
When the protective sleeve 3 uses a transparent high-strength plastic film, the protective sleeve 3 is not easy to break, can keep long service life, can clearly observe the element structure on the surface of the silicon substrate 7, and is convenient for subsequent overhaul and maintenance.
In the semiconductor package, the silicon substrate 7 is coated with the protective sleeve 3, which takes into account the water resistance and heat dissipation of the whole package body 1, specifically, the protective sleeve 3 is coated outside the silicon substrate 7, the opening 4 is formed at the position where the USB interface 2 needs to pass through, but the periphery of the USB interface 2 and the inner wall of the opening 4 still keep sealed, when the external water is sprinkled, the external water can only be blocked outside the protective sleeve 3 and slide down through the smooth surface of the protective sleeve 3, but can not enter the silicon substrate 7, thereby affecting the USB interface 2, the chip 8 and the like on the silicon substrate 7, and the water resistance is good; the protective sleeve 3 coats the silicon substrate 7 with the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 which are vertically distributed, so that the phenomenon that external heat enters the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 to further heat the periphery of the silicon substrate 7 is prevented, heat generated by elements such as a chip 8 on the silicon substrate 7 during working can be accumulated in the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13, high pressure is formed after heat accumulation, the pressure pushes the heat dissipation gap 401 to open, heat is discharged outwards, the phenomenon that the temperature around the silicon substrate 7 is too high is avoided, the width of the heat dissipation gap 401 is set to be small, when water stains and the like impact on the surface of the protective sleeve 3, the heat dissipation gap 401 is not easy to open, and the external water stains are easy to directly slide off through the surface of the protective sleeve 3; the entire package body 1 is both waterproof and heat dissipation.
When the sealing plugs 19 at the positions of the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are opened, the heat inside the upper heat dissipation cavity 12 can be directly dissipated, the heat dissipation area and the heat dissipation direction are increased, the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are distributed at two ends of the silicon substrate 7 and are opposite to each other, so that air can form a circulating state, the pipe diameters of the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18 are small, and external water cannot easily enter the inner part of the upper heat dissipation cavity 12 through the first heat dissipation pipeline 17 and the second heat dissipation pipeline 18.
The positions of the components such as the chip 8 and the USB interface 2 in the upper heat dissipation cavity 12 are the main positions where heat is generated, therefore, the upper heat dissipation cavity 12 and the lower heat dissipation cavity 13 are isolated from each other by the silicon substrate 7, so that the heat generated in the upper heat dissipation cavity 12 is not easily diffused into the lower heat dissipation cavity 13, and the temperature in the lower heat dissipation cavity 13 is always lower than the temperature in the upper heat dissipation cavity 12, the silicon substrate 7 is suspended by the lower heat dissipation cavity 13, so that the bottom of the silicon substrate 7 has a certain heat dissipation space, instead of fixing the silicon substrate 7 on a structural member and reducing the heat dissipation space, so that the heat in the upper heat dissipation cavity 12 can be shared into the lower heat dissipation cavity 13 through the transmission of the silicon substrate 7 structural layer, and the heat in the upper heat dissipation cavity 12 is discharged in real time, such a structural design also ensures that the upper and lower layers of the silicon substrate 7 are in a state with a small temperature difference, thereby avoiding the phenomenon that the components and the surface of the silicon substrate 7 are further damaged due to a large temperature difference between the two surfaces of the silicon substrate 7, and increasing the service life of the whole package body 1.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. The utility model provides a semiconductor package with heat radiation structure, a serial communication port, including packaging part body (1), packaging part body (1) includes silicon substrate (7), chip (8), USB interface (2), input wire (5), output wire (6), the upper surface at silicon substrate (7) is installed in chip (8), and input wire (5) set up in the one end of silicon substrate (7), and output wire (6) set up in the other end of silicon substrate (7), and USB interface (2) are installed on silicon substrate (7) surface, be provided with sheetmetal (9) between the bottom of chip (8) and the upper surface of silicon substrate (7), the outside cladding of silicon substrate (7) is provided with protective sheath (3), and protective sheath (3) form silicon substrate (7) cladding upper heat dissipation chamber (12) and lower heat dissipation chamber (13) that distribute from top to bottom, protective sheath (3) top is provided with opening (4), and opening (4) supply USB interface (2) to stretch out, protective sheath (3) keep the sealed laminating of tensile state around USB interface (2), the two ends of silicon substrate (7) are installed one and the cladding is respectively at two baffles (10), and two baffles (10) are at silicon substrate (10) cladding respectively the protective sheath (10), and one protection cover (10) are wrapped at one protection cover (3) and two baffles (10) are wrapped respectively, the outer lane of two baffles (11), and protective sheath (3) keep being laminated at baffle (10), two baffles (11) outer lanes by tensile state, the one end that protective sheath (3) correspond respectively with baffle (10), keep sealed between two baffles (11), protective sheath (3) laminating all is provided with heat dissipation clearance (401) around USB interface (2) and the position of baffle (10), two baffles (11) outer lanes, heat dissipation clearance (401) are provided with the multiunit, and heat dissipation clearance (401) form at the position of baffle (10), two baffles (11) outer lanes through the position of sheetmetal puncture protective sheath (3) laminating around USB interface (2) and puncture protective sheath (3) laminating, multiunit heat dissipation clearance (401) equidistance distribution.
2. The semiconductor package with the heat dissipation structure as recited in claim 1, wherein: the contact positions of the first partition plate (10), the second partition plate (11), the silicon substrate (7), the USB interface (2) and the protective sleeve (3) are fixed in a hot pressing mode.
3. The semiconductor package with the heat dissipation structure as recited in claim 1, wherein: the one end that the tip of protective sheath (3) stretched out baffle one (10), baffle two (11) forms open cavity two (15), open cavity one (14) respectively, be provided with second heat dissipation pipeline (18) and first heat dissipation pipeline (17) in open cavity one (14), open cavity two (15) respectively, the one end intercommunication of second heat dissipation pipeline (18) is in the one end of last heat dissipation chamber (12), the one end intercommunication of first heat dissipation pipeline (17) is at the other end of last heat dissipation chamber (12), the one end that heat dissipation chamber (12) were kept away from in first heat dissipation pipeline (17) and second heat dissipation pipeline (18) all seals and is provided with sealing plug (19).
4. The semiconductor package with the heat dissipation structure as recited in claim 1, wherein: go up heat dissipation chamber (12), separate each other through silicon substrate (7) between heat dissipation chamber (13) down, the activity laminating between silicon substrate (7) both sides face and protective sheath (3) inner wall.
5. The semiconductor package with a heat dissipation structure of claim 1, wherein: one side of packaging part body (1) is provided with outer heat dissipation mechanism, and outer heat dissipation mechanism includes circulation unit (23), business turn over trachea way (24), heat dissipation pipeline (22) are provided with two sets ofly, and two sets of heat dissipation pipeline (22) and a set of business turn over trachea way (24) all communicate on circulation unit (23), and the one end of keeping away from circulation unit (23) in two sets of heat dissipation pipeline (22) is provided with respectively to manage (20), to managing two (21), connects on first heat dissipation pipeline (17) to managing (20), connects on second heat dissipation pipeline (18) to managing two (21).
6. The semiconductor package with the heat dissipation structure as recited in claim 5, wherein: when second heat dissipation pipeline (18), first heat dissipation pipeline (17) are connected with butt joint pipe two (21), butt joint pipe one (20) respectively, sealing plug (19) of first heat dissipation pipeline (17), second heat dissipation pipeline (18) tip are got rid of, the tip of heat dissipation pipeline (22) and the tip of business turn over trachea way (24) all are provided with the solenoid valve.
7. The semiconductor package with a heat dissipation structure of claim 1, wherein: be provided with adjusting device (16) on silicon substrate (7), adjusting device (16) include threaded rod (26), limiting plate (25), rotor plate (28), outside sheath (29), rotation groove (31) and flitch (30), be provided with screw hole (27) that supply threaded rod (26) middle part to pass on silicon substrate (7), be connected through screw-thread fit between threaded rod (26) and screw hole (27), limiting plate (25) are connected in the upper end of threaded rod (26) through screw-thread fit, rotor plate (28) are connected at the lower extreme of threaded rod (26) through screw-thread fit, the fixed welding of outside sheath (29) is at the upper surface of flitch (30), form rotation groove (31) between the inside of outside sheath (29) and flitch (30), rotor plate (28) rotate and set up in rotation groove (31), flitch (30) activity laminating is on the below inner wall of protective sheath (3).
8. The semiconductor package with the heat dissipation structure as recited in claim 1, wherein: the upper surface activity of sheetmetal (9) is laminated in the bottom surface of chip (8), and keeps the state of laminating completely between sheetmetal (9) upper surface and chip (8) lower surface, the lower surface laminating of sheetmetal (9) keeps the state of laminating completely between sheetmetal (9) lower surface and silicon substrate (7) upper surface at the upper surface of silicon substrate (7), sheetmetal (9) pass through the upper surface of screw fixed connection at silicon substrate (7).
9. The semiconductor package with a heat dissipation structure of claim 1, wherein: the end part of the input lead (5) penetrates through the first partition plate (10), the position, where the input lead (5) penetrates through the first partition plate (10), of the first partition plate (10) keeps sealed, the position, where the output lead (6) penetrates through the second partition plate (11), of the output lead (6) keeps sealed, and the position, where the output lead (6) penetrates through the second partition plate (11), of the second partition plate (11).
10. The semiconductor package with the heat dissipation structure as recited in claim 1, wherein: the protective sleeve (3) is a transparent high-strength plastic film.
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| TWI234860B (en) * | 2004-04-02 | 2005-06-21 | Advanced Semiconductor Eng | Chip package and process thereof |
| CN103022307B (en) * | 2012-12-27 | 2015-01-07 | 江阴长电先进封装有限公司 | Wafer-level LED packaging method |
| JP2019016784A (en) * | 2017-07-10 | 2019-01-31 | 日本特殊陶業株式会社 | Package for mounting light-emitting device |
| CN207993847U (en) * | 2018-03-29 | 2018-10-19 | 长华科技股份有限公司 | Semiconductor package |
| CN108470725B (en) * | 2018-05-02 | 2019-11-15 | 江苏感测通电子科技有限公司 | A kind of high performance control chip-packaging structure |
| CN112635646B (en) * | 2021-01-14 | 2021-10-01 | 深圳市科润光电股份有限公司 | Wafer-level LED packaging structure applied to low thermal resistance |
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