CN1150438C - Microcomputer heat radiation system - Google Patents
Microcomputer heat radiation system Download PDFInfo
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- CN1150438C CN1150438C CNB991232208A CN99123220A CN1150438C CN 1150438 C CN1150438 C CN 1150438C CN B991232208 A CNB991232208 A CN B991232208A CN 99123220 A CN99123220 A CN 99123220A CN 1150438 C CN1150438 C CN 1150438C
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- microcomputer
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- cpu
- heat radiation
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Abstract
The present invention relates to a microcomputer heat radiation system, particularly to a heat radiation system, which can realize the heat radiation of a microcomputer and can also reduce the noise of the microcomputer. The present invention discloses microcomputer heat radiation structure which is composed of a power supply device heat radiation device, a CPU, a functional chip heat radiation device and a chassis. The present invention is characterized in that the chassis of the microcomputer is provided with a plastic heat radiation plate mounting bracket, the front position and the back position of the plastic heat radiation plate mounting bracket are fixed to a power supply radiating fin and a CPU radiating fin, the heat of the power supply device is radiated outside the microcomputer by the power supply radiating fin, and the heat of the CPU is led in the CPU radiating fin by a CPU heat radiation box, a liquid delivery pump and a metal heat radiation pipe. Consequently, the present invention replaces an original fan system of the microcomputer to make the microcomputer run quietly.
Description
Affiliated technical field:
The present invention relates to a kind of microcomputer heat radiation system, can realize that especially the heat of microcomputer distributes, can reduce the cooling system of microcomputer noise simultaneously again.
Background technology:
At present, known microcomputer heat radiation system is made up of cpu fan and power supply fan, and the high-speed rotation of two fans forms the industrial frequency noise up to 55db, and this is a kind of pollution of working environment for the professional computer operating personnel.
The purpose of invention:
The purpose of this invention is to provide a kind of microcomputer heat radiation system, the heat that it produces in the time of can not only effectively distributing the microcomputer operation, and the noise of microcomputer is dropped to below the 15db, make microcomputer reach quiet operation.
Technical scheme:
The object of the present invention is achieved like this: a kind of cooling system of microcomputer includes cycle cooling system and the power supply cooling system be located in the Microcomputer box: it is characterized in that; Described cycle cooling system is to utilize to be located at several heat sinks on the heatable electric elements in the microcomputer; This heat sink is by the suitable serial or parallel connection of pipeline, and conducting can be gone here and there at least on this liquid circulating apparatus and be provided with the radiating tube that can be attached on the heat radiator in a liquid circulating apparatus, and this heat radiator is located at the outside wall surface of Microcomputer box.Described power supply cooling system is that the heating face with the high power transistor on the computer power supply is connected in large-scale heat radiator by a heat-transfer device with the face way of contact; This heat radiator is located at the outside wall surface of Microcomputer box.
Beneficial effect:
Owing to adopted such scheme to make the major part of the heat of microcomputer generation be dispersed into the microcomputer outside, made microcomputer become very quiet owing to cancelled the microcomputer fan inside simultaneously by heat radiator.
Brief Description Of Drawings:
Fig. 1 is one-piece construction figure
Fig. 2 is power supply unit heat abstractor figure
Fig. 3 is circulation heat abstractor figure
Fig. 4 is the liquid delivery pump structural drawing
Fig. 5 is the heat sink structural drawing
Fig. 6 is that equalizing pipe reaches towards liquid duct ligation composition
Fig. 7 chassis structure chart
Fig. 8 is liquid delivery pump design of part figure
Fig. 9 is slotl slot cpu heat dissipation box mounting structure figure
Implement mode of the present invention:
Embodiment 1:
In Fig. 1, expressed the characteristic portion installation site figure of embodiments of the invention, A: be power supply unit heat abstractor installation site figure, B: be circulation heat abstractor installation site figure, C: be heat sink mounting bracket and chassis structure chart.
The power supply heat sinking structural drawing that Fig. 2 expresses; Be to take off high power transistor (7) from power supply unit, its heating face is attached at a surface of metal heat-conducting plate (6), the another side of metal heat-conducting plate (6) is sticked at the lower surface of power supply heat sinking sheet (1).The limb of high power transistor (7) is welded on the circuit board (3), pin, the other end that circuit one end on the circuit board (3) is communicated with high power transistor are communicated with the connector body (4) that is welded on the circuit board, and are communicated in the welding position of the high power transistor on the power supply unit circuit board by the lead (9) on connector plug (5) and the plug.
Described power supply heat sinking sheet is that metal processes one side and the radiated rib of arranging arranged for the plane another side.Be fixed in the following circuit board of power supply heat sinking sheet (1) and guaranteed installing and fixing of power supply cooling system by dress support (2) and bridge type pressing plate (8).
Effectively lead the heat of high power transistor on the power supply heat sinking sheet and distribute in the microcomputer outer air by the aspectant applying of metal heat-conducting plate (6) and power supply heat sinking sheet (1).
Among the circulation heat abstractor figure shown in Figure 3; Form towards liquid joint (16) and heat-conducting liquid by heat sink (14), heat pipe (12) liquid circulation heat radiator (11), liquid delivery pump (17), liquid delivery tube (19), equalizing pipe (18).The liquid entrance end of said elements is respectively installed 1 pipe adapter, and serial connection becomes the fluid path of a sealing.Heat pipe (12) is that the metal tube of complications and liquid circulation heat radiator (11) paste and touch the outside wall surface that heat radiator together is arranged on the microcomputer case.Described heat radiator is that metal processes, and one side has the radiated rib of arranging for the plane another side.
Heat-conducting liquid is imported heat radiator (11) at the heat that under the driving of liquid delivery pump (17) subsides is touched heat sink (14) in microcomputer heater element surface, drawn and heat is distributed in the air outside microcomputer by metal heat-conducting pipe (12) by liquid delivery tube (19).
Described liquid delivery pump (17) is that damping is connected with the cabinet bottom surface
In above-mentioned circulation path heat sink, heat pipe, can utilize pipe adapter and liquid delivery pump tandem compound by any order and quantity, heat sink itself can utilize pipe adapter by any amount and order serial or parallel connection.
Fig. 5 has expressed the structural drawing of heat sink (14); Chamber outer wall face a hollow is provided with two pipe adapters, connects with cavity, and it is planar structure that this hollow cavity has a face at least, and this plane will be used for pasting touches at microcomputer internal heat generation element.(14-2) is that box body, (14-1) are absorber plate among the figure.
Fig. 6 has expressed equalizing pipe and towards the structural drawing of liquid joint; Part (18-1) is the threeway body, and the threeway body is provided with to be had screw thread and lid (18-3) to join on two other end cylindricals of pipe adapter to be associated with the sealing that gasket seal (18-2) reaches mouth of pipe end face.Towards liquid pipe connection; Body (16) is a tubular body, and two ends are provided with two pipe adapters.
Fig. 7 sees in the Microcomputer box system; A heat sink mounting bracket (20) is arranged, and can fixedly connected and be integral in heat sink mounting bracket rear and front end with cabinet header board (26), back plate (25).The heat sink mounting bracket has former and later two cavitys above (20), and liquid circulation heat radiator (11) is fixed on the heat sink mounting bracket (20) by front and back position respectively with power supply heat sinking sheet (1).Circuit board (3) bridge type pressing plate (8), circuit board mounting bracket (2), connector body end (4) that cavity also is used to hold the high power transistor (7) that is fixed on below the power supply heat sinking sheet, welds together with high power transistor, and be fixed on radiating tube (12) below the heat radiator (11).Two chambeies are all porose before and after the heat sink mounting bracket, and be respectively applied for to hold and appear connector body, and the pipe adapter of radiating tube (12).
Embodiment 2
Power supply cooling system is identical with embodiment 1 with the liquid cycle cooling system, in embodiment 2; Fig. 4 has expressed liquid delivery pump shock-damping structure figure; (1-2) be the pump housing, the pump housing cooperates enclosing cover (1-1) and outter box (1-4) by buffer layer (1-3), and damping pin (1-5) is installed in outter box (1-4) bottom surface and is fixed together with the cabinet inner bottom surface.
This pump is by (17-5) inner cap, (17-12) inner box, and the pump housing (17-6), rubber bag tank (17-9), pressure ring (17-7) rubber cut down sheet (17-6) rubber (17-8), rocking bar (17-10), permanent magnet (17-13) electromagnet (17-14).
Heat sink mounting bracket (20) is attached on the former Microcomputer box machine top board, and cpu radiating tube (12) and connector body end (4) pass cycle cooling system and the power supply unit that Microcomputer box machine top board and heat sink mounting bracket are communicated in cabinet respectively.
Fig. 9 has expressed the installation of a kind of heat sink (14), be fit to be equipped with the computer motherboard of slotl slot, structure is: cpu is fixed on original cpu circuit board (22), the heat-absorbent surface of heat sink (14) is fitted in above the cpu, there is a pressing plate (21) to fix riveted joint above the pressing plate four connecting links are arranged, the other end has ring shaped slot on the connecting link, the original cpu circuit of microcomputer backplate (23) and elastic card (24), four grooves are arranged on the elastic card, four grooves of elastic card are pushed in the ring shaped slot on the connecting link, reach the fixedly effect of heat sink (14).
Power supply cooling system is identical with embodiment 1 with the liquid cycle cooling system, its heat sink mounting bracket (20) is fixed on the former Microcomputer box side panel promptly on the side plate of traditional cabinet, heat sink mounting bracket (20) outside has a dividing plate to be divided into former and later two cavitys, and liquid circulation heat radiator (11) is fixed on the heat sink mounting bracket (20) by front and back position respectively with power supply heat sinking sheet (1).Circuit board (3) bridge type pressing plate (8), circuit board mounting bracket (2), connector body end (4) that cavity also is used to hold power supply high power transistor (7) down, welds together with high power transistor, and the radiating tube (12) below the heat radiator.Two chambeies are all porose before and after the heat sink mounting bracket, and be respectively applied for to hold and appear connector body, and the pipe adapter of radiating tube (12).
The heat sink (14) that Fig. 1 expresses is fixed on the cpu socket (13) on the computer motherboard by an elasticity card (15), heat sink (14) bottom surface is fitted in above the cpu, elasticity card (15), symmetry 90 degree bendings in two ends also have two square holes, can hang on the convex edge of cpu slot, present embodiment is fit to be equipped with the computer motherboard of soct7 cpu slot.
Claims (12)
1, a kind of microcomputer heat radiation system, comprise cpu and functional chip liquid circulation heat abstractor, it is characterized in that, be provided with more than one cpu heat dissipation box, this cpu heat dissipation box can be by any series and parallel conducting of liquid conveying hose, the cpu heat dissipation box can be attached in the microcomputer on the heatable electrical part and by the liquid conveying hose conducting in a liquid circulating apparatus, this liquid circulating apparatus is established a liquid delivery pump, can be attached at the heat dissipation metal pipe on the metal fin by the liquid delivery tube string, and this metal fin is located at the outside wall surface of cabinet.
2, according to the described a kind of microcomputer heat radiation system of claim 1, it is characterized in that the liquid delivery pump in described cpu and the functional chip liquid circulation heat abstractor is fixedly arranged in the cabinet, and with cabinet between vibration damping connect.
3, a kind of microcomputer heat radiation system according to claim 1, the cpu heat dissipation box that it is characterized in that described cpu and functional chip liquid circulation heat abstractor is one to have the box body of liquid inlet joint and fluid joint and the hollow cavity of the sealing that the metal absorber plate is combined into, but the heat-absorbent surface heat conduction of metal absorber plate is attached at heatable device surface in the microcomputer.
4, a kind of microcomputer heat radiation system according to claim 1 is characterized in that the described metal fin of being located at the cabinet outside wall surface can be a slice at least, and this metal fin can be located at the roof or the sidewall of cabinet.
5, a kind of microcomputer heat radiation system according to claim 4 is characterized in that described metal fin can be fixed on the cabinet by a mounting bracket, and above-mentioned heat dissipation metal pipe passes cabinet wall subsides touch and is connected in heat radiator.
6, a kind of microcomputer heat radiation system according to claim 5 is characterized in that the outside wall surface of described cabinet can be set to radiator structure, to constitute heat radiator.
7, a kind of cooling system of microcomputer includes power supply unit cooling system and cpu and the functional chip liquid cycle cooling system be located in the Microcomputer box; It is characterized in that described power supply heat sinking device is that the heat generating components in this power supply unit is connected in the outside wall surface that this heat radiator of metal fin is arranged on microcomputer by a heat-transfer device with face way of contact heat conduction; Described cpu and functional chip liquid cycle cooling system are, include an above cpu heat dissipation box device, this device can be by any series and parallel conducting of liquid delivery tube, cpu heat dissipation box device is attached in the microcomputer and is connected in series liquid delivery pump, can be attached at the heat dissipation metal pipe on the metal fin on the heatable electrical part and by liquid delivery tube, and this heat radiator is located at the outside wall surface of cabinet.
8, a kind of microcomputer heat radiation system according to claim 5, the heat generating components that it is characterized in that described power supply unit by circuit board, connector, and lead be connected to the power supply unit main circuit board.
9, a kind of microcomputer heat radiation system according to claim 7 is characterized in that the cpu heat dissipation box of described cpu and functional chip liquid cycle cooling system; The hollow cavity of the sealing that to be a cpu heat radiation box body that has liquid-inlet joint and an outlet connection be combined into the metal absorber plate, but the heat-absorbent surface heat conduction of described absorber plate is attached at heatable devices such as the interior cpu of microcomputer.
10, a kind of microcomputer heat radiation system according to claim 7 is characterized in that described metal fin can be at least more than a slice, and this heat radiator can be fixed on the cabinet outside wall surface of microcomputer by mounting bracket.
11, a kind of microcomputer heat radiation system according to claim 7 is characterized in that the outer wall panel of described cabinet can be provided with radiator structure, to constitute heat radiator.
12,, it is characterized in that described metal fin can be a sheet metal, also can be set to the fin of arranging according to claim 1 or the described a kind of microcomputer heat radiation system of claim 7.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB991232208A CN1150438C (en) | 1999-11-01 | 1999-11-01 | Microcomputer heat radiation system |
| KR10-2001-7015269A KR100479763B1 (en) | 1999-06-02 | 2000-03-24 | A computer heat ―radiation system |
| EP00914015A EP1207446A4 (en) | 1999-06-02 | 2000-03-24 | A computer heat-radiation system |
| AU35492/00A AU3549200A (en) | 1999-06-02 | 2000-03-24 | A computer heat-radiation system |
| CA002375598A CA2375598A1 (en) | 1999-06-02 | 2000-03-24 | Microcomputer heat dissipation system |
| JP2001501971A JP2003501737A (en) | 1999-06-02 | 2000-03-24 | Heat dissipation system in computer |
| PCT/CN2000/000061 WO2000075763A1 (en) | 1999-06-02 | 2000-03-24 | A computer heat-radiation system |
| RU2001132634/09A RU2218591C2 (en) | 1999-06-02 | 2000-03-24 | Heat removal system of computer |
| US09/996,846 US6747869B2 (en) | 1999-06-02 | 2001-11-20 | Microcomputer heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB991232208A CN1150438C (en) | 1999-11-01 | 1999-11-01 | Microcomputer heat radiation system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1266213A CN1266213A (en) | 2000-09-13 |
| CN1150438C true CN1150438C (en) | 2004-05-19 |
Family
ID=5282835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB991232208A Expired - Fee Related CN1150438C (en) | 1999-06-02 | 1999-11-01 | Microcomputer heat radiation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1150438C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI709364B (en) * | 2020-02-24 | 2020-11-01 | 美商美國未來科技公司 | Adjusting device for computer water cooling |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6807056B2 (en) * | 2002-09-24 | 2004-10-19 | Hitachi, Ltd. | Electronic equipment |
| CN1893802B (en) * | 2005-06-30 | 2010-05-12 | 英特尔公司 | Liquid cooling system comprising component capable of heat exchanging |
| CN103135715A (en) * | 2011-12-01 | 2013-06-05 | 英业达股份有限公司 | Cooling module |
| CN104349648B (en) * | 2013-08-09 | 2017-03-01 | 技嘉科技股份有限公司 | Combined radiating component |
| CN106066674A (en) * | 2016-05-27 | 2016-11-02 | 东莞市联洲知识产权运营管理有限公司 | A kind of superconductive radiating quiet case |
| CN108714752B (en) * | 2018-06-20 | 2023-12-12 | 江苏英杰电子器件有限公司 | Welding equipment for radiator assembly unit |
| CN109240439A (en) * | 2018-09-11 | 2019-01-18 | 苏州苏琼网络科技有限公司 | A kind of multi-functional computer cabinet |
| CN111930213B (en) * | 2020-09-04 | 2022-04-01 | 安徽财贸职业学院 | Self-cooling machine case of computer |
| CN112631050B (en) * | 2020-12-24 | 2021-11-26 | 安徽优品智能科技有限公司 | Heat dissipation mechanism of projector |
-
1999
- 1999-11-01 CN CNB991232208A patent/CN1150438C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI709364B (en) * | 2020-02-24 | 2020-11-01 | 美商美國未來科技公司 | Adjusting device for computer water cooling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1266213A (en) | 2000-09-13 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040519 Termination date: 20101101 |