CN217884247U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN217884247U CN217884247U CN202220786468.8U CN202220786468U CN217884247U CN 217884247 U CN217884247 U CN 217884247U CN 202220786468 U CN202220786468 U CN 202220786468U CN 217884247 U CN217884247 U CN 217884247U
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- heat
- conducting
- source device
- heat dissipating
- heat dissipation
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Abstract
The utility model relates to the field of machinary, a heat abstractor and electronic equipment is disclosed. The utility model discloses in, heat abstractor for dispel the heat to the heat source device, include: a heat conductive base surrounding a receiving space for receiving the heat source device; a heat dissipating assembly disposed on the heat conductive base and outside the receiving space. Compared with the prior art, the utility model discloses heat abstractor and electronic equipment that embodiment provided have and make the electron device of surface unevenness can reach the advantage of good radiating effect.
Description
Technical Field
The utility model relates to the field of machinary, in particular to heat abstractor and electronic equipment.
Background
The heat radiator is widely applied to the electronic equipment industry at present as a commonly used heat radiating device of electronic products, and aims to timely take away generated heat for high-loss electronic components.
However, the present invention discloses an inventor finds that, in the prior art, the radiator can only be connected to electronic components with smooth surface, because these electronic components special design are more for smooth and flat heat dissipation surface, make electronic components surface can with the fine contact of radiator base plate to make the radiating effect maximize of radiator, like IGBT module, CPU module. For electronic components with irregular shapes, that is, the surfaces of the components are not flat, for example, a plurality of electronic components with different heights are welded on an inductor, a reactor and a PCB, and the like, the single components or the whole components cannot be in good contact with a radiator substrate or cannot be in contact with the radiator substrate, so that an ideal radiating effect cannot be achieved, the temperature of the components is too high, and the failure of equipment or the shortening of the service life of the equipment is caused.
SUMMERY OF THE UTILITY MODEL
An embodiment of the present invention provides a heat dissipation device and an electronic apparatus, so that the electronic device with uneven surface can achieve good heat dissipation effect.
In order to solve the above technical problem, an embodiment of the present invention provides a heat dissipation device, which is used for dissipating heat of a heat source device, including: a heat conductive base surrounding a receiving space for receiving the heat source device; a heat dissipation assembly disposed on the heat conductive base and outside the receiving space.
The utility model discloses an embodiment still provides an electronic equipment, include: heat source devices and heat sinks as previously described; and the heat conduction pouring sealant is used for connecting the heat dissipation device and the heat source device.
The utility model discloses embodiment is for prior art, set up the heat conduction basal portion around forming accommodating space, when using, can set up the heat source device in accommodating space, because accommodating space's existence, can directly pour the heat conduction glue into accommodating space, after the heat conduction glue pours into accommodating space, can fill the clearance between heat conduction basal portion and the heat source device, consequently, even if heat source device and the relative surperficial unevenness of heat conduction basal portion, because the packing of heat conduction glue, can have better heat conduction effect between heat source device and the heat conduction basal portion equally, thereby make the heat source device of surperficial unevenness can reach good radiating effect.
Additionally, the thermally conductive base includes: the heat-conducting substrate and the baffle arranged on the heat-conducting substrate surround to form the accommodating space, and the heat-radiating assembly is arranged on the heat-conducting substrate. The baffle and the heat conducting substrate are arranged to surround together to form the accommodating space, the manufacturing process is simple, the cost is low, and the manufacturing cost of the heat dissipation device can be effectively reduced.
In addition, a heat conduction pouring sealant is arranged in the accommodating space and used for connecting the heat source device and the heat conduction substrate.
In addition, the baffle is detachably arranged on the heat conducting substrate. Baffle detachable sets up on the heat conduction base plate, can dismantle the baffle after the heat conduction pouring sealant solidifies, reduces heat abstractor's volume, the heat abstractor's of being more convenient for installation and application.
In addition, the baffle plate and the heat conduction substrate are integrally formed.
In addition, the baffle plate and the heat conduction substrate are mutually fixed through screws.
In addition, the heat dissipation base comprises a plurality of heat conduction substrates, the heat conduction substrates surround to form the accommodating space, the number of the heat dissipation assemblies is multiple, and the heat dissipation assemblies are respectively arranged on the heat conduction substrates. The plurality of heat conducting substrates and the plurality of heat dissipation assemblies are arranged, so that the heat dissipation efficiency of the heat dissipation device can be effectively improved.
In addition, the heat dissipation assembly is a heat dissipation fin arranged on one side of the heat conduction base part, which is far away from the accommodating space. The heat dissipation fins are arranged on one side, far away from the accommodating space, of the heat conduction base, so that air circulation can be facilitated, and the heat dissipation speed of the heat dissipation fins is accelerated.
In addition, the heat dissipation assembly is a flow guide pipeline arranged inside the heat conduction base.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation device according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present invention;
fig. 4 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following will explain in detail each embodiment of the present invention with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
The utility model discloses a first embodiment relates to a heat abstractor for dispel the heat to the heat source device, the concrete structure of heat abstractor and heat source device is as shown in figure 1, include: the heat source device comprises a heat conduction base 10, wherein an accommodating space 20 is formed by the heat conduction base 10 in a surrounding mode, the accommodating space 20 is used for accommodating the heat source device 100, a heat dissipation assembly 30 is arranged on the heat conduction base 10, and the heat dissipation assembly 30 is located outside the accommodating space 20.
Compared with the prior art, the heat conducting base 10 is arranged to surround to form the accommodating space, when the heat source device 100 is used, the heat source device 100 can be arranged in the accommodating space 20, heat conducting glue can be directly poured into the accommodating space 20 due to the existence of the accommodating space 20, and after the heat conducting glue is poured into the accommodating space 20, a gap between the heat conducting base 10 and the heat source device 100 can be filled, so that even if the surface of the heat source device 100 opposite to the heat conducting base 10 is uneven, due to the filling of the heat conducting glue, the heat conducting effect between the heat source device 100 and the heat conducting base 10 can be better, and the heat source device 100 with the uneven surface can achieve a good heat dissipation effect. In addition, the heat dissipation assembly 30 is disposed outside the accommodating space 20, so that the heat dissipation effect of the heat dissipation assembly 30 can be better.
Specifically, in the present embodiment, as shown in fig. 1, the heat conducting base 10 includes a heat conducting substrate 11 and a baffle 12 disposed on the heat conducting substrate 11, the baffle 12 and the heat conducting substrate 11 together form a receiving space 20, and the heat dissipation assembly 30 is disposed on the heat conducting substrate. The baffle plate 12 and the heat conducting substrate 11 are arranged to surround together to form the accommodating space 20, the manufacturing process is simple, the cost is low, and the manufacturing cost of the heat dissipation device can be effectively reduced.
Specifically, in the present embodiment, the material of the heat conductive base 11 is the same as the material of the baffle 12. It should be understood that the material of the heat conducting base 11 and the material of the baffle 12 are the same and are only a specific example in this embodiment, and are not limited thereto, and in other embodiments of the present invention, the material of the heat conducting base 11 and the material of the baffle 12 may not be the same, and may be flexibly set according to actual needs.
Specifically, in the present embodiment, the heat conducting base 11 and the baffle 12 are integrally formed, and the heat conducting base 11 and the baffle 12 are integrally formed, so that the heat conducting base 11 and the baffle 12 are attached to each other more tightly, and the heat conducting potting adhesive is prevented from leaking. It is understood that the aforementioned integral molding between the heat conducting base 11 and the baffle 12 is only a specific example in this embodiment, and is not limited thereto, and in other embodiments of the present invention, the heat conducting base 11 and the baffle 12 may be fixed to each other via screws, and the heat conducting base 11 and the baffle 12 are fixed by screws, so that the manufacturing difficulty and the manufacturing cost can be reduced.
Furthermore, in some embodiments of the present invention, the baffle 12 is detachably disposed on the heat conductive substrate 11. Baffle 12 detachable sets up on heat conduction base plate 11, can dismantle baffle 12 after the heat conduction pouring sealant solidifies, reduces heat abstractor's volume, the installation and the application of heat abstractor of being more convenient for.
Preferably, in the present embodiment, a heat conducting potting adhesive (not shown) is disposed in the accommodating space 20. The heat-conducting potting adhesive is used to connect the heat source device 100 and the heat-conducting substrate 11. It can be understood that the heat conducting potting adhesive may also be disposed to cover the entire surface of the heat source device 100, and thus, the heat conducting potting adhesive may complete the sealing of the heat source device 100 while increasing the contact area between the heat conducting potting adhesive and the heat source device 100.
It should be understood that fig. 1 is only an illustration of a specific structure of the heat dissipation device in the embodiment of the present invention, and is not limited thereto, and in other embodiments of the present invention, other structures may also be adopted, for example, as shown in fig. 2, the number of the heat conduction substrates 11 is two, two heat conduction substrates 11 and the baffle 12 together form the receiving space 20 around the arrangement, and two heat conduction substrates 11 are respectively provided with the heat dissipation assembly 30. The two heat-conducting substrates 11 are arranged, so that the contact area between the heat-conducting pouring sealant and the heat-conducting substrates 11 can be effectively increased, and on the basis, the heat-radiating assemblies 30 are respectively arranged on the two heat-conducting substrates 11, so that the heat-radiating efficiency can be effectively increased.
It is understood that the aforementioned structure formed by the heat conducting substrate 11 and the baffle 12 together surrounding the accommodating space 20 is only a specific example and is not a limitation in some embodiments of the present invention, and in other embodiments of the present invention, as shown in fig. 3, the heat dissipation base 10 may further include a plurality of heat conducting substrates 11, the plurality of heat conducting substrates 11 surround the accommodating space 20, the number of heat dissipation assemblies 30 is also a plurality, and the plurality of heat dissipation assemblies 30 are respectively disposed on the plurality of heat conducting substrates 11. The plurality of heat conducting substrates 11 and the plurality of heat dissipation assemblies 30 are arranged, so that the heat dissipation efficiency of the heat dissipation device can be further improved.
Specifically, in some embodiments of the present invention, as shown in fig. 1, 2 and 3, the heat dissipation assembly 30 is a heat dissipation fin disposed on a side of the heat conducting base 10 away from the receiving space 20. The heat dissipation fins 30 are disposed on the side of the heat conductive base 10 away from the accommodating space 20, so as to facilitate air circulation and accelerate the heat dissipation speed of the heat dissipation fins. It is understood that the heat dissipation assembly 30 is a heat dissipation fin, which is only an example of some specific embodiments of the present invention, and is not limited thereto, in other embodiments of the present invention, as shown in fig. 4, the heat dissipation assembly 30 may also be a flow guiding pipe disposed inside the heat conducting base 10, and may be flexibly disposed according to actual needs.
A second embodiment of the present invention relates to an electronic apparatus, including: a heat source device, a heat dissipation device provided in the foregoing embodiments, and a heat conductive potting adhesive connecting the heat dissipation device and the heat source device.
It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in its practical application.
Claims (10)
1. A heat dissipating device for dissipating heat from a heat source device, comprising:
a heat conductive base surrounding a receiving space for receiving the heat source device;
a heat dissipation assembly disposed on the heat conductive base and outside the receiving space.
2. The heat dissipating device of claim 1, wherein the thermally conductive base comprises: the heat-conducting substrate comprises a heat-conducting substrate and a baffle plate arranged on the heat-conducting substrate, the baffle plate and the heat-conducting substrate surround to form the accommodating space, and the heat dissipation assembly is arranged on the heat-conducting substrate.
3. The heat dissipating device of claim 1, wherein a heat conducting potting adhesive is disposed in the receiving space, and the heat conducting potting adhesive is used for connecting the heat source device and the heat conducting substrate.
4. The heat dissipating device of claim 2, wherein the baffle is removably disposed on the thermally conductive substrate.
5. The heat dissipating device of claim 2, wherein the baffle is integrally formed with the thermally conductive substrate.
6. The heat dissipating device of claim 2, wherein the baffle is secured to the thermally conductive substrate via screws.
7. The heat dissipating device of claim 1, wherein the heat dissipating base comprises a plurality of heat conducting substrates surrounding the accommodating space, the number of the heat dissipating assemblies is plural, and the plurality of heat dissipating assemblies are respectively disposed on the plurality of heat conducting substrates.
8. The heat dissipating device of claim 1, wherein the heat dissipating assembly is a heat dissipating fin disposed on a side of the heat conducting base away from the receiving space.
9. The heat dissipating device of claim 1, wherein the heat dissipating component is a flow conduit disposed inside the thermally conductive base.
10. An electronic device, comprising: a heat source device and a heat sink as claimed in any one of claims 1 to 9;
and the heat conduction pouring sealant is used for connecting the heat dissipation device and the heat source device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220786468.8U CN217884247U (en) | 2022-03-29 | 2022-03-29 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220786468.8U CN217884247U (en) | 2022-03-29 | 2022-03-29 | Heat dissipation device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217884247U true CN217884247U (en) | 2022-11-22 |
Family
ID=84086358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220786468.8U Active CN217884247U (en) | 2022-03-29 | 2022-03-29 | Heat dissipation device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217884247U (en) |
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2022
- 2022-03-29 CN CN202220786468.8U patent/CN217884247U/en active Active
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