CN210924386U

CN210924386U - Heat abstractor for computer

Info

Publication number: CN210924386U
Application number: CN201922084985.1U
Authority: CN
Inventors: 宗光远
Original assignee: Shenzhen Diyun Lianchang Technology Co ltd
Current assignee: Shenzhen Diyun Lianchang Technology Co ltd
Priority date: 2019-11-27
Filing date: 2019-11-27
Publication date: 2020-07-03
Anticipated expiration: 2029-11-27

Abstract

The utility model discloses a heat abstractor for computer, the power distribution box comprises a box body, and be located inside mainboard and the fan of box, be provided with the chip on the left end face of mainboard, be provided with the stand on the right side inboard face of box, set up the screw on the stand, be provided with the through-hole on the mainboard, be provided with the mounting hole on the fan, it has the screw rod round pin to peg graft in the mounting hole, the screw rod round pin pass the through-hole and with screw threaded connection, the fan is provided with the square sleeve pipe towards the one end of chip, the square sleeve pipe cup joints. Realized carrying out the pertinence convulsions heat dissipation to chip on the main board, effectually with the quick pump away of the heat that the chip produced and discharge through guide duct and exhaust pipe, effectively improved the chip on the main board to the thermal diffusivity, when carrying out the extraction to the chip, improved the leakproofness between fan and the chip, avoid the dust to enter into between fan and the chip and influence the radiating effect.

Description

Heat abstractor for computer

Technical Field

The utility model relates to a computer heat dissipation technical field specifically is a heat abstractor for computer.

Background

The north bridge chip on the computer mainboard is one of two chips of a personal computer mainboard chip set based on an Intel processor, the north bridge chip is used for processing high-speed signals, the data processing amount of the north bridge chip is very large, the calorific value is also very large, and therefore the north bridge chip needs to be subjected to targeted heat dissipation processing.

However, most of the existing heat dissipation structures for the chassis main board do not have the fan and the air duct structure for the main chip, so that the heat dissipation of the main chip cannot be realized by the targeted air draft, and the heat dissipation of the main chip is greatly reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor for computer to solve the problem to the thermal diffusivity of chip on the mainboard.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat abstractor for computer, includes the box to and be located the inside mainboard and the fan of box, the fan is direct current 12V's high rotational speed axial fan, and the model is AFB0612EH-F00, be provided with the chip on the left end face of mainboard, be provided with the stand on the right side inboard face of box, set up the screw on the stand, be provided with the through-hole on the mainboard, be provided with the mounting hole on the fan, it has the screw pin to peg graft in the mounting hole, the screw pin pass the through-hole and with screw threaded connection, the fan is provided with the square sleeve pipe towards the one end of chip, and the square sleeve pipe cup joints with the chip.

Preferably, a box cover is installed at the left end of the box body, a square opening is formed in the box cover, an exhaust pipe is arranged in the square opening, an air guide pipe is arranged at the left end of the fan, the left end of the air guide pipe is sleeved with the exhaust pipe, and the exhaust pipe and the air guide pipe are both made of hard PVC pipes.

Preferably, the number of the upright columns, the through holes, the screw pins and the mounting holes is four respectively, and the upright columns, the through holes, the screw pins and the mounting holes are arranged in an up-down and left-right symmetrical mode by taking the lateral transverse and vertical central axis of the chip as the center.

Preferably, the lateral section of the square sleeve is of a square structure, the square structure just matches and sleeves the square chip, and the sleeving sealing performance is improved.

Preferably, the square sleeve is provided with sealed the pad towards the one end of mainboard, and sealed whole silica gel pad that adopts of filling up makes, and it has good resilience, realizes the leakproofness to between fan and the chip.

Preferably, an elastic pad is arranged between the left end surface of the fan and a pin cap of the screw pin.

Preferably, the exhaust duct and the air guide duct are aligned with an air suction opening of the fan.

Compared with the prior art, the beneficial effects of the utility model are that:

the fan and the air duct structure which are arranged on the box body and the box cover and aim at the chip on the main board are used for realizing the targeted air draft and heat dissipation of the chip on the main board, effectively and quickly pumping away the heat generated by the chip and discharging the heat through the air duct and the exhaust duct, and effectively improving the targeted heat dissipation of the chip on the main board;

through square sleeve pipe and sealed pad structure, when drawing air to the chip, improved the leakproofness between fan and the chip, avoid the dust to enter into between fan and the chip and influence the radiating effect.

Drawings

FIG. 1 is a sectional view of the whole structure of the present invention;

fig. 2 is a partial enlarged view of the fan and air duct structure for the chip on board main board according to the present invention;

FIG. 3 is a side cross-sectional view of the square sleeve and the gasket of the present invention;

fig. 4 is a side sectional view of the air guide duct and the exhaust duct of the present invention.

In the figure: the air conditioner comprises a case body 1, a case cover 2, a square opening 21, an exhaust duct 22, a main board 3, a chip 31, a through hole 32, a vertical column 4, a screw hole 41, a fan 5, a mounting hole 51, an air guide pipe 6, a screw pin 7, an elastic pad 71, a square sleeve 8 and a sealing pad 81.

Detailed Description

Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: a heat dissipating double-fuselage for computer, including the container body 1, the container body 1 is the metal sheet chassis of the common computer, the whole is the cuboid model, the inside is the cavity, the left end opening, the case lid 2 of the same material is fixedly mounted with container body 1 through the screw, and main board 3 and fan 5 located inside container body 1, the fan 5 is the high rotational speed axial fan of the direct current 12V, the model is AFB0612EH-F00, it is connected to direct current fan power supply 3PIN interface on the main board 3 through the specialized fan wire, the rotational speed revolution is 6800RPM, the low noise, there are chips 31 on the left end of the main board 3, the main board 3 is the main breadboard for computer, the main board 3 is fixedly mounted through pillar and screw that preset in the container body 1, the chip 31 is the north bridge chip on the main board 3, weld on the right side inboard wall of the container body 1 has the pillar 4, set up the screw 41 on the pillar 4, there are, be provided with mounting hole 51 on fan 5, it has screw pin 7 to peg graft in mounting hole 51, screw pin 7 body is the long post screw rod, the left end at the long post screw rod has preset the round pin cap, be provided with the cross recess on the round pin cap, be used for screwdriver locking, stand 4, through-hole 32, screw pin 7, the quantity of mounting hole 51 respectively is four and uses the horizontal vertical axis of side direction of chip 31 to set up as central bilateral symmetry from top to bottom, screw pin 7 passes through-hole 32 and with screw 41 threaded connection, fan 5 has square sleeve 8 towards the one end bonding of chip 31, square sleeve 8 cup joints with chip 31, square sleeve 8 adopts stereoplasm PVC pipe to make, can set up a plurality of air inlets on square sleeve 8's pipe wall, can bond preset dustproof filter screen on the inner hole wall of air inlet, when guaranteeing the heat dissipation of admitting air, can avoid the dust to get into.

Referring to fig. 1, 2 and 4, a case cover 2 is mounted at the left end of a case body 1, a square opening 21 is arranged on the case cover 2, an exhaust duct 22 is bonded in the square opening 21 through resin adhesive, an air guide duct 6 is bonded at the left end of a fan 5 through resin adhesive, the exhaust duct 22 and the air guide duct 6 are both made of hard PVC pipes, the external dimension of the air guide duct 6 is slightly smaller than the internal dimension of the exhaust duct 22, the air guide duct and the exhaust duct 22 are ensured to be inserted, the left end of the air guide duct 6 is sleeved with the exhaust duct 22, and the exhaust duct 22 and the air guide duct 6 are both aligned with an air suction opening of the fan.

Referring to fig. 2 and 3, a sealing gasket 81 is disposed at an end of the square sleeve 8 facing the motherboard 3, the sealing gasket 81 is integrally made of a silicone gasket, and has good resilience, when the fan 5 is locked and fastened by the threaded pin 7, the sealing gasket 81 is deformed by mutual extrusion of the square sleeve 8 and the left end surface of the motherboard 3, so as to achieve sealing between the fan 5 and the chip 31, and prevent dust from entering between the fan 5 and the chip 31 to affect the heat dissipation effect.

Referring to fig. 3, the lateral cross section of the square sleeve 8 is a square structure, and the square structure just matches and sleeves the square chip 31, so as to improve the sealing performance of the sleeve.

Referring to fig. 2 and 3, an elastic pad 71 is disposed between the left end surface of the fan 5 and the pin cap of the screw pin 7, the elastic pad 71 is a high-elastic polyurethane rubber pad, and is adhered to the right end surface of the pin cap of the screw pin 7 by surrounding the screw pin 7 by a circle through resin adhesive, when the screw pin 7 is locked clockwise through the screw hole 41, the elastic pad 71 is extruded and deformed by the pin cap and the left end surface of the fan 5, and the elastic pad 71 generates a transverse resilient force after being extruded and deformed, and the resilient force has an anti-loosening effect on the screw pin 7 and the screw hole 41 after being transmitted to the screw pin 7.

The utility model discloses when concrete implementation: during installation, earlier mainboard 3 is fixed through locking of preset pillar and screw, then, take fan 5, and aim at four mounting holes 51 on the fan 5 and four through-holes 32 of presetting on mainboard 3, then move fan 5 to the right, treat that sealed pad 81 of the square sleeve 8 of fan 5 right-hand member and the left end face extrusion contact laminating of mainboard 3 are up, then pass four mounting holes 51 and through-hole 32 respectively and clockwise rotation with four screw pins 7, screw drive through screw 41 drives screw pin 7 and moves right and rotate the locking, sealed pad 81 is extruded deformation and realizes sealed between fan 5 and the chip 31 this moment, avoid the dust to enter into between fan 5 and the chip 31 and influence the radiating effect.

Then, after aligning exhaust pipe 22 of case lid 2 right-hand member with guide duct 6, move case lid 2 and laminate with the left end of box 1 rightwards, then lock case lid 2 through the screw, exhaust pipe 22 has been pegged graft with guide duct 6 this moment, start the power of box 1 after that, fan 5 circular telegram is worked, fan 5 flabellum rotates at a high speed and forms the suction force to the left, this suction force can draw away the heat that chip 31 produced fast, then flow the hot gas flow to the left through square sleeve 8, and discharge to the left through guide duct 6 and exhaust pipe 22, realized carrying out the pertinence convulsions heat dissipation to chip 31 on mainboard 3, improved the heat dissipation of chip 31 on mainboard 3 to the right side.

Claims

1. The utility model provides a heat abstractor for computer, includes box (1) to and be located inside mainboard (3) and fan (5) of box (1), its characterized in that: be provided with chip (31) on the left end face of mainboard (3), be provided with stand (4) on the right side inboard wall face of box (1), set up screw (41) on stand (4), be provided with through-hole (32) on mainboard (3), be provided with mounting hole (51) on fan (5), it has screw pin (7) to peg graft in mounting hole (51), screw pin (7) pass through-hole (32) and with screw (41) threaded connection, fan (5) are provided with square sleeve pipe (8) towards the one end of chip (31), and square sleeve pipe (8) cup joint with chip (31), can set up a plurality of air inlets on the pipe wall of square sleeve pipe (8).

2. The heat dissipating device for a computer according to claim 1, wherein: the left end of the box body (1) is provided with a box cover (2), a square opening (21) is formed in the box cover (2), an exhaust pipe (22) is arranged in the square opening (21), the left end of the fan (5) is provided with an air guide pipe (6), and the left end of the air guide pipe (6) is sleeved with the exhaust pipe (22).

3. The heat dissipating device for a computer according to claim 1, wherein: the quantity of the upright columns (4), the through holes (32), the screw pins (7) and the mounting holes (51) is four respectively, and the upright columns, the through holes (32), the screw pins and the mounting holes are arranged in an up-down and left-right symmetrical mode by taking the lateral transverse and vertical central axis of the chip (31) as the center.

4. The heat dissipating device for a computer according to claim 1, wherein: the lateral section of the square sleeve (8) is of a square structure.

5. The heat dissipating device for a computer according to claim 1, wherein: and a sealing gasket (81) is arranged at one end of the square sleeve (8) facing the main board (3).

6. The heat dissipating device for a computer according to claim 1, wherein: an elastic pad (71) is arranged between the left end surface of the fan (5) and the pin cap of the screw pin (7).

7. The heat dissipating device for a computer according to claim 2, wherein: the exhaust pipe (22) and the air guide pipe (6) are aligned with the air suction opening of the fan (5).