CN115041580A - Single separation device of lead frame - Google Patents
Single separation device of lead frame Download PDFInfo
- Publication number
- CN115041580A CN115041580A CN202210978544.XA CN202210978544A CN115041580A CN 115041580 A CN115041580 A CN 115041580A CN 202210978544 A CN202210978544 A CN 202210978544A CN 115041580 A CN115041580 A CN 115041580A
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- die
- lead frame
- frame
- upper die
- concave
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a single lead frame separating device, and relates to the technical field of integrated circuits. The method is used for solving the problems that the single power device arranged on the lead frame after the existing plastic package can not be separated at will, and the scattered arrangement of products and inaccurate sampling data are caused after the rib cutting forming separation are adopted. The method comprises the following steps: a pressing handle provided on a manual punch press, by which the manual punch press is moved downward in a vertical direction; the upper die frame is used for arranging the manual punch press on the upper surface, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the male die is driven by the upper die frame to move downwards in the vertical direction under the action of the pressing handle; the lower die base is positioned right below the upper die frame, a concave die plate comprising a concave die is arranged on the lower die base, and a lead frame is arranged above the concave die plate; and the connecting ribs are used for cutting off the lead frame arranged on the female die when the male die moves downwards in the vertical direction.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a single lead frame separating device.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between the leading-out end of an internal circuit of a chip and an external lead by means of bonding materials to form an electrical circuit, and plays a role of a bridge connected with an external lead. Defective products exist in the single circuit arranged on the lead frame after the plastic package, and the single circuit is directly placed into a rib cutting forming die to cause die damage; moreover, the traditional sampling can only be realized after the rib cutting, forming and separation, and the separated products are scattered and arranged, so that the sampling data is inaccurate.
In summary, the single power device arranged on the lead frame after the existing plastic package can not be separated at will, and the problems of scattered arrangement of products and inaccurate sampling data exist after the rib cutting forming separation is adopted.
Disclosure of Invention
The embodiment of the invention provides a single lead frame separating device, which is used for solving the problems that single power devices arranged on a lead frame after plastic packaging cannot be separated randomly, products are arranged in a scattered mode after rib cutting forming separation is adopted, and sampling data is inaccurate.
The embodiment of the invention provides a single lead frame separating device, which comprises:
a pressing handle provided on a manual punch press, by which the manual punch press is moved downward in a vertical direction;
the upper die frame is used for arranging the manual punch press on the upper surface, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the male die is driven by the upper die frame to move downwards in the vertical direction under the action of the pressing handle;
the lower die base is positioned right below the upper die frame, a concave die plate comprising a concave die is arranged on the lower die base, and a lead frame is arranged above the concave die plate; and the connecting ribs are used for cutting off the lead frame arranged on the female die when the male die moves downwards in the vertical direction.
Preferably, the upper die assembly further comprises a material shifting plate and a positioning block;
one end of the male die is fixed on the lower surface of the upper die frame, and the other end of the male die penetrates through a positioning block arranged on the material shifting plate;
the upper surface of the kick-out plate is arranged on the lower surface of the upper die frame through two elastic fixing ends.
Preferably, the upper die carrier further comprises a pair of guide pillar pipes, the guide pillar pipes are located on one side of the upper die carrier and used for arranging two guide pillars fixed on the lower die base, and the guide pillars can move up and down in the guide pillar pipes.
Preferably, the lower die holder further comprises an X track, a Y track and a bolt;
the X track and the Y track are arranged below the concave template and are used for driving the concave template to move on the lower die seat in the front-back, left-right and left directions;
the bolt is inserted into the groove of the positioning replacement piece and used for fixing the concave template;
the positioning replacement piece is arranged on the upper surface of the lower die holder.
Preferably, the lower die base further comprises a positioning needle; the lead frame is arranged on two sides of the lower die holder, when the lead frame is positioned below the upper die holder, one end of the positioning pin is inserted into the positioning hole in the edge of the lead frame and used for fixing the lead frame.
Preferably, the sample collecting box is arranged below the lower die holder and below the female die and is used for collecting the separated single power device.
The embodiment of the invention provides a single lead frame separating device, which comprises: a pressing handle provided on a manual punch press, by which the manual punch press is moved downward in a vertical direction; the upper die frame is used for arranging the manual punch press on the upper surface, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the male die is driven by the upper die frame to move downwards in the vertical direction under the action of the pressing handle; the lower die base is positioned right below the upper die frame, a concave die plate comprising a concave die is arranged on the lower die base, and a lead frame is arranged above the concave die plate; and the connecting ribs are used for cutting off the lead frame arranged on the female die when the male die moves downwards in the vertical direction. The device comprises a pressing handle for controlling the manual punching machine to move downwards, an upper die set arranged right below the manual punching machine, and a male die arranged on the lower surface of the upper die set, wherein when the manual punching machine moves downwards, the upper die set can be driven to move downwards, and the male die arranged on the upper die set can also move downwards along with the manual punching machine; at the moment, the lead frame arranged on the lower die holder and the single power device positioned above the female die are separated from the lead frame due to the fact that the connecting rib between the single power device arranged above the female die and the lead frame is cut off due to die closing and punching when the male die moves downwards and is combined with the female die. The problems that single power devices arranged on the lead frame cannot be separated at will after the existing plastic package, products are scattered and arranged after the cutting ribs are adopted for forming and separating, and sampling data is inaccurate are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a single lead frame singulation apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an upper mold frame according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a lower die holder according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a lead frame arranged on a lower die base according to an embodiment of the present invention;
wherein, 1, the handle is pressed; 2. a manual punching machine; 3. a lower die holder; 4. feeding a mold frame; 5. a guide post; 5-1, a guide pillar pipe; 6. positioning the replacement part; 7. an upper die assembly; an X-axis orbit; a Y-axis orbit; 10. a sample collection cartridge; 11. a male die; 12. a kick-out plate; 13. a bolt; 14. positioning blocks; 16. a female die; 17. a lead frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 1 is a schematic structural diagram of a single lead frame singulation apparatus according to an embodiment of the present invention; FIG. 2 is a schematic structural diagram of an upper mold frame according to an embodiment of the present invention; FIG. 3 is a schematic structural view of a lower die holder according to an embodiment of the present invention; fig. 4 is a schematic structural view of a lead frame arranged on a lower die base according to an embodiment of the present invention; the following describes the single lead frame separating device according to the embodiment of the present invention in detail with reference to fig. 1 to 4 as an example.
The device mainly comprises a pressing handle 1, a manual punch 2, an upper die frame 4, an upper die assembly 7, a male die 11, a lower die holder 3, a female die 16 and a female die plate.
Specifically, the pressing handle 1 is arranged on the manual punching machine 2, and is a crank link mechanism with the manual punching machine 2, and the pressing handle 1 is used for enabling the manual punching machine 2 to move downwards in the vertical direction. Further, manual punch 2 sets up on upper die carrier 4, and one side of upper die carrier 4 is provided with mould subassembly 7, and the terrace die 11 that mould subassembly 7 included sets up the lower surface at upper die carrier 4, and when manual punch 2 moved down in vertical direction, the terrace die 11 that sets up on upper die carrier 4 lower surface also can be moved down in vertical direction.
In the embodiment of the invention, the lower die holder 3 is arranged right below the upper die frame 4, the die plate arranged on the lower die holder 3 is used for arranging the lead frame 17, the die plate is provided with the die 16, and the die 16 is just positioned right below the punch 11. Namely, when the punch 11 moves downwards, the punch 11 and the die 16 perform die assembly and punching, the connecting rib between a single power device positioned right above the die 16 and the lead frame 17 is cut off, and the single power device with the cut connecting rib falls from the die 16, so that the separation of the single power device of the lead frame 17 is completed.
Illustratively, the upper die assembly 7 further comprises a material shifting plate 12 and a positioning block 14, wherein one end of the male die 11 is fixed on the lower surface of the upper die frame 4, and the other end of the male die penetrates through the positioning block 14 arranged on the material shifting plate 12; further, the upper surface of the kick-out plate 12 is disposed on the lower surface of the upper mold frame 4 through two elastic fixing ends.
It should be noted that the sizes of the male die, the female die and the positioning block are matched with the size of a single power device included in the lead frame, and if the lead frame is of the same type, the lead frame has universality; if the lead frames are different in type, the concave template arranged on the lower die base and the upper die assembly arranged on the upper die base can be replaced.
In the embodiment of the invention, the positioning block 14 is used for assembling the punch 11, and the punch 11 is matched with the material shifting plate 12 and used for pressing and discharging materials to complete the normal operation of the cutter. It should be noted that, here, pressing and discharging refer to pressing down the lead frame, and discharging refers to separating a single power device from the lead frame.
Illustratively, the upper die frame 4 further comprises a pair of guide pillar pipes 5-1, which are located on one side of the upper die frame 4 and located on two sides of the upper die frame 4 respectively with the upper die assembly 7, the guide pillar pipes 5-1 are used for arranging guide pillars 5 fixed on the lower die base 3, and the guide pillar pipes 5-1 are used for enabling the guide pillars 5 arranged on the lower die base 3 to move up and down in the guide pillar pipes 5-1 when the upper die frame 4 moves towards the lower die base 3, so that product position deviation between the upper die frame 4 and the lower die base 3 is avoided.
For example, in the single lead frame separation device provided by the embodiment of the present invention, the lower die holder 3 further includes an X-axis rail 8, a Y-axis rail 9, and a latch 13. Specifically, an X-axis track 8 and a Y-axis track 9 are arranged below the cavity plate, the cavity plate can move left and right on the lower die holder 3 through the X-axis track 8, and the cavity plate can move back and forth on the lower die holder 3 through the Y-axis track 9; further, when the cavity plate moves on the X-axis rail 8 and the Y-axis rail 9 to determine the final setting position, the cavity plate can be positioned and fixed by inserting the pins 13 into the grooves of the positioning replacement member 6 provided on one side of the lower die holder 3.
Through setting up X axle track 8 and Y axle track 9 in the cavity board below, lower bolster 3 can rectangular coordinate move, after a single lead frame 17 of location, can die-cut arbitrary one single power device in the lead frame 17 of compound die, and need not to fix a position once more.
Illustratively, the lower die bed 3 further comprises a positioning pin. Specifically, the positioning pins are arranged on two sides of the lower die holder 3, when the die plate is provided with the lead frame 17 and the die plate is moved to a set position, and after the die plate is fixed by the bolts 13, the positioning pins arranged on two sides of the lower die holder 3 can be inserted into the positioning holes on the edge of the lead frame 17, so that the lead frame 17 is fixed, and the lead frame 17 is prevented from inclining and moving in the separation process.
Illustratively, the device also comprises a sample collecting box 10 which is arranged below the lower die holder 3 and below the concave die 16 and is used for collecting the separated single power device.
For example, to more clearly describe the single lead frame separating device provided in the embodiments of the present invention, the following steps are provided for the single lead frame separating device:
step 101, arranging a lead frame which needs to be separated by a single power device on a concave template;
102, moving a single power device to be separated to a female die of a female die plate through an X-axis track and a Y-axis track, and simultaneously inserting a plug pin into a corresponding hole for fixing;
and 103, pressing down a handle of the manual punch to cut off a corresponding single sample.
And repositioning other sample positions needing to be cut in the lead frame, and if not, replacing the lead frame and restarting.
In summary, an embodiment of the present invention provides a single lead frame separating device, including: a pressing handle provided on a manual punch press, by which the manual punch press is moved downward in a vertical direction; the upper die frame is used for arranging the manual punch press on the upper surface, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the male die is driven by the upper die frame to move downwards in the vertical direction under the action of the pressing handle; the lower die base is positioned right below the upper die frame, a concave die plate comprising a concave die is arranged on the lower die base, and a lead frame is arranged above the concave die plate; and the connecting ribs are used for cutting off the lead frame arranged on the female die when the male die moves downwards in the vertical direction. The device comprises a pressing handle for controlling the manual punching machine to move downwards, an upper die set arranged right below the manual punching machine, and a male die arranged on the lower surface of the upper die set, wherein when the manual punching machine moves downwards, the upper die set can be driven to move downwards, and the male die arranged on the upper die set can also move downwards along with the manual punching machine; at the moment, the lead frame arranged on the lower die holder and the single power device positioned above the female die are separated from the lead frame due to the fact that the connecting rib between the single power device arranged above the female die and the lead frame is cut off due to die closing and punching when the male die moves downwards and is combined with the female die. Moreover, the concave template arranged on the lower die holder is matched with the X track and the Y track, the lower die can move in a rectangular coordinate mode, and after one lead frame is positioned once, samples at any positions in the lead frame can be punched without being positioned again; the defective products at the lead frame can be cut off at will, and the single power device at the lead frame can be sampled at will. The single lead frame separating device provided by the embodiment of the invention solves the problems that single power devices arranged on the lead frame can not be separated at will after the existing plastic package is adopted, products are scattered and arranged after the cutting rib forming separation is adopted, and sampling data is inaccurate.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. A leadframe singulating device, comprising:
a pressing handle provided on a manual punch press, by which the manual punch press is moved downward in a vertical direction;
the upper die frame is used for arranging the manual punch press on the upper surface, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the male die is driven by the upper die frame to move downwards in the vertical direction under the action of the pressing handle;
the lower die base is positioned right below the upper die frame, a concave die plate comprising a concave die is arranged on the lower die base, and a lead frame is arranged above the concave die plate; and the connecting ribs are used for cutting off the lead frame arranged on the female die when the male die moves downwards in the vertical direction.
2. The single leadframe separator according to claim 1, wherein said upper die assembly further comprises a stripper plate, a positioning block;
one end of the male die is fixed on the lower surface of the upper die frame, and the other end of the male die penetrates through a positioning block arranged on the material shifting plate;
the upper surface of the kick-out plate is arranged on the lower surface of the upper die frame through two elastic fixing ends.
3. The single lead frame separator according to claim 1, wherein said upper frame further comprises a pair of guide posts, which are located at one side of said upper frame, for receiving two guide posts fixed to said lower frame, and said guide posts are movable up and down in said guide posts.
4. The single lead frame singulation engine of claim 1 wherein the lower die base further includes an X rail, a Y rail and a latch;
the X track and the Y track are arranged below the concave template and are used for driving the concave template to move on the lower die base in the front-back, left-right and left directions;
the bolt is inserted into the groove of the positioning replacement piece and used for fixing the concave template;
the positioning replacement piece is arranged on the upper surface of the lower die holder.
5. The single lead frame singulation engine of claim 1 wherein the lower die block further includes a locator pin; the lead frame is arranged on two sides of the lower die holder, when the lead frame is positioned below the upper die holder, one end of the positioning pin is inserted into the positioning hole in the edge of the lead frame and used for fixing the lead frame.
6. The single lead frame singulation apparatus of claim 1 further comprising a sample collection magazine disposed below the die base and below the die for collecting singulated single power devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210978544.XA CN115041580A (en) | 2022-08-16 | 2022-08-16 | Single separation device of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210978544.XA CN115041580A (en) | 2022-08-16 | 2022-08-16 | Single separation device of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115041580A true CN115041580A (en) | 2022-09-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210978544.XA Pending CN115041580A (en) | 2022-08-16 | 2022-08-16 | Single separation device of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115041580A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5410804A (en) * | 1991-03-15 | 1995-05-02 | Asm-Fico Tooling B.V. | Method for manufacturing a single product from integrated circuits received on a lead frame |
| CN2605088Y (en) * | 2003-03-18 | 2004-03-03 | 佛山市蓝箭电子有限公司 | Waste product removing apparatus for electronic element and device production |
| CN105127272A (en) * | 2015-09-30 | 2015-12-09 | 苏州索力旺新能源科技有限公司 | High-precision connection point punching and breaking device |
| CN211304393U (en) * | 2019-08-27 | 2020-08-21 | 深圳市宇星鸿精密科技有限公司 | Punching die for metal key whole frame punching finished product |
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
-
2022
- 2022-08-16 CN CN202210978544.XA patent/CN115041580A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5410804A (en) * | 1991-03-15 | 1995-05-02 | Asm-Fico Tooling B.V. | Method for manufacturing a single product from integrated circuits received on a lead frame |
| CN2605088Y (en) * | 2003-03-18 | 2004-03-03 | 佛山市蓝箭电子有限公司 | Waste product removing apparatus for electronic element and device production |
| CN105127272A (en) * | 2015-09-30 | 2015-12-09 | 苏州索力旺新能源科技有限公司 | High-precision connection point punching and breaking device |
| CN211304393U (en) * | 2019-08-27 | 2020-08-21 | 深圳市宇星鸿精密科技有限公司 | Punching die for metal key whole frame punching finished product |
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
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Application publication date: 20220913 |
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| RJ01 | Rejection of invention patent application after publication |