CN219541484U - Stamping die for small-sized welding bump wafer - Google Patents
Stamping die for small-sized welding bump wafer Download PDFInfo
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- CN219541484U CN219541484U CN202320025323.0U CN202320025323U CN219541484U CN 219541484 U CN219541484 U CN 219541484U CN 202320025323 U CN202320025323 U CN 202320025323U CN 219541484 U CN219541484 U CN 219541484U
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Abstract
The utility model discloses a small-sized welding bump wafer stamping die which comprises a lower die assembly, an upper die assembly and a first punch, wherein the lower die assembly comprises a lower die holder, a lower base plate and a lower die plate, the lower die holder is suitable for being fixed on a machine table, the lower base plate is arranged on the lower die holder, the lower die plate is arranged above the lower base plate, a guide sleeve is arranged on the lower die plate, the upper die assembly comprises an upper die holder, an upper clamping plate, an upper base plate and an upper stripping plate, the upper die holder is suitable for being fixed on the machine table, the upper base plate is arranged below the upper die holder, the upper clamping plate is arranged below the upper base plate, a guide column is arranged on the upper clamping plate, the upper stripping plate is arranged on the guide column in a lifting manner, the first punch is arranged on the upper clamping plate, the lower end of the first punch is arranged in the upper clamping plate in a penetrating manner and can move up and down along with the upper die assembly to stamp raw materials into finished products.
Description
5 technical field
The utility model relates to the field of dies, in particular to a small-sized die for stamping a wafer with welding bumps.
Background
Some small-size welding bump disks and other products need to be produced by using special production equipment during production, so that production cost is high, the development of enterprises is not facilitated, on the other hand, the traditional stamping die is formed in one step during production, and the products are damaged easily due to overlarge impact force, so that the yield of the products is low, and resource waste is caused.
Accordingly, there is a need in the art for further improvements.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, the utility model aims to provide a small-sized welding bump wafer stamping die.
In order to achieve the above object, according to an embodiment of the present utility model, a small-sized solder bump wafer stamping die, 0, includes a lower die assembly, an upper die assembly, and a first punch.
The lower die assembly comprises a lower die holder, a lower base plate and a lower die plate, wherein the lower die holder is suitable for being fixed on a machine table, the lower base plate is arranged on the lower die holder, the lower die plate is arranged above the lower base plate, and a guide sleeve is arranged on the lower die plate.
The upper die assembly comprises an upper die holder, an upper clamping plate, an upper base plate and an upper stripping plate, wherein the upper die holder is suitable for being fixed on a machine table by 5, the upper base plate is arranged below the upper die holder, the upper clamping plate is arranged below the upper base plate, a guide column is arranged on the upper clamping plate, and the upper stripping plate is arranged on the guide column in a lifting manner in a penetrating manner.
The first punch is arranged on the upper clamping plate, the lower end of the first punch penetrates through the upper supporting plate and can move up and down along with the upper die assembly so as to punch the raw materials into a finished product;
when the upper die assembly moves downwards, the lower ends of the guide posts are inserted into the guide sleeves, and the upper stripper plate and the lower die plate clamp raw materials.
In addition, the small-sized welding bump wafer stamping die according to the embodiment of the utility model may also have the following additional technical features:
according to one embodiment of the utility model, the lower die plate is provided with a block entering assembly, the block entering assembly and the first punch are arranged up and down oppositely, and when the upper die assembly and the lower die assembly are closed, the first punch abuts against the block entering assembly so as to punch the raw materials.
According to one embodiment of the utility model, the insert block assembly includes a first block body, a molded stripper block, an ejector pin, and a first spring.
The first block is arranged on the lower die plate, and a mounting groove is formed in the middle of the first block.
The forming stripping block can be arranged in the mounting groove in a vertically floating mode.
The thimble is arranged on the lower backing plate in a penetrating way, and the upper end of the thimble is connected with the lower end of the forming stripping block.
The first spring is arranged in the lower die holder, and the upper end of the first spring is connected with the lower end of the thimble.
According to one embodiment of the utility model, the stamping die further comprises a second punch, wherein the second punch is arranged on the upper die assembly and can move up and down along with the upper die assembly so as to punch the positioning holes on the raw materials.
According to one embodiment of the utility model, the stamping die further comprises a second block body, wherein the second block body is arranged on the lower die plate and opposite to the second punch head, and is used for stamping the positioning hole for the raw material in cooperation with the second punch head.
According to one embodiment of the utility model, the device further comprises an buoyancy assembly, wherein the buoyancy assembly is arranged on the lower die assembly and used for resetting raw materials.
According to one embodiment of the utility model, the buoyancy module comprises a buoyancy pin and a second spring.
The floating pin can be arranged on the lower template in a vertical floating mode.
The second spring is arranged in the lower base plate, and the upper end of the second spring is connected with the lower end of the floating pin.
According to one embodiment of the utility model, the upper surface of the upper stripper plate is attached with a stop plate, and the stop plate is arranged on the guide post in a penetrating manner and can slide along the length direction of the guide post.
According to one embodiment of the utility model, the upper backing plate is provided with a third spring, and the lower end of the third spring is propped against the surface of the upper stripper plate to push the upper stripper plate to move downwards.
According to one embodiment of the utility model, the upper stripper plate is provided with a positioning needle which is inserted into a positioning hole of the raw material when the upper die assembly moves downwards.
According to the small welding bump wafer stamping die provided by the embodiment of the utility model, when in use, the lower die assembly is fixed on the machine table, the upper die assembly is arranged on the machine table driving device, the lower die assembly and the upper die assembly are opposite up and down, raw materials to be processed are arranged between the upper die assembly and the lower die assembly, the upper die assembly is driven to move down by the driving device of the machine table during processing, the raw materials are clamped by the upper stripper plate and the lower die plate, the guide post is inserted into the guide sleeve, so that the lower die assembly and the upper die assembly are aligned up and down, the first punch can punch the raw materials into finished products, the production mode is simple, convenient and quick, products such as small welding bump wafers can be punched by only using the stamping die, and the production cost is effectively reduced.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a plan view of the overall structure of an embodiment of the present utility model;
FIG. 2 is a diagram showing the upper die assembly and lower die assembly separated in accordance with an embodiment of the present utility model;
fig. 3 is a view showing the closed state of the upper die assembly and the lower die assembly in the embodiment of the utility model.
Reference numerals:
a lower die assembly 10;
a lower die holder 101;
a lower pad 102;
a lower die plate 103;
a guide sleeve 104;
a block-in assembly 105;
a first block 1051;
a mounting slot 10511;
molding the knockout block 1052;
ejector pins 1053;
a first spring 1054;
a second block 106;
a buoyancy assembly 107;
a lift pin 1071;
a second spring 1072;
a positioning needle 108;
an upper die assembly 20;
an upper die holder 201;
an upper clamping plate 202;
an upper pad 203;
an upper stripper plate 204;
a guide post 205;
a first punch 206;
a second punch 207;
a stop plate 208;
and a third spring 209.
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present utility model and should not be construed as limiting the utility model, and all other embodiments, based on the embodiments of the present utility model, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The small-sized solder bump wafer stamping die according to the embodiment of the present utility model is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 3, a small-sized solder bump wafer stamping die according to an embodiment of the present utility model includes a lower die assembly 10, an upper die assembly 20, and a first punch 206.
The lower die assembly 10 comprises a lower die holder 101, a lower base plate 102 and a lower die plate 103, wherein the lower die holder 101 is suitable for being fixed on a machine table, the lower base plate 102 is arranged on the lower die holder 101, the lower die plate 103 is arranged above the lower base plate 102, and a guide sleeve 104 is arranged on the lower die plate 103.
The upper die assembly 20 comprises an upper die holder 201, an upper clamping plate 202, an upper backing plate 203 and an upper stripping plate 204, wherein the upper die holder 201 is suitable for being fixed on a machine table, the upper backing plate 203 is arranged below the upper die holder 201, the upper clamping plate 202 is arranged below the upper backing plate 203, a guide column 205 is arranged on the upper clamping plate 202, and the upper stripping plate 204 is arranged on the guide column 205 in a lifting manner.
The first punch 206 is disposed on the upper clamping plate 202, and the lower end of the first punch is disposed in the upper supporting plate in a penetrating manner, and can move up and down along with the upper die assembly 20, so as to punch the raw material into a finished product;
wherein, when the upper die assembly 20 moves down, the lower end of the guide post 205 is inserted into the guide sleeve 104, and the upper stripper plate 204 and the lower die plate 103 clamp the raw material.
Based on the above, in use, the lower die assembly 10 is fixed on a machine, the upper die assembly 20 is arranged on a machine driving device, the lower die assembly 10 and the upper die assembly 20 are opposite up and down, a raw material to be processed is arranged between the upper die assembly 20 and the lower die assembly 10, the upper die assembly 20 is driven to move down by the driving device of the machine during processing, the raw material is clamped by the upper stripper plate 204 and the lower die plate 103, the guide posts 205 are inserted into the guide sleeve 104, so that the lower die assembly 10 and the upper die assembly 20 are vertically aligned, and it is required to say that the upper clamping plate 202 and the upper stripper plate 204 are arranged at intervals, then, after the raw material is clamped by the upper stripper plate 204 and the lower die plate 103, the upper die plate and the upper clamping plate 202 can continue to move down, so that the first protruding point 206 is driven to move down continuously, the raw material is stamped out of a finished product, the production mode is simple, and the production cost of the die is reduced, and only a small-sized die is used, and the cost of the die is reduced.
Preferably, in one embodiment of the present utility model, the lower die plate 103 is provided with a block-in assembly 105, the block-in assembly 105 and the first punch 206 are disposed opposite to each other up and down, and when the upper die assembly 20 and the lower die assembly 10 are closed, the first punch 206 abuts against the block-in assembly 105 to punch the raw material.
In this way, by arranging the block entering assembly 105 vertically opposite to the first punch 206, the block entering assembly can be matched with the first punch 206, so that products such as small-sized welding bump wafers can be stably punched, and the yield of the products can be improved.
Preferably, in one embodiment of the present utility model, the inlet block assembly 105 includes a first block 1051, a molded stripper block 1052, a spike 1053, and a first spring 1054.
The first block 1051 is disposed on the lower die plate 103, and a mounting groove 10511 is disposed in the middle of the first block 1051.
The molding stripper plate 1052 is floatable up and down within the mounting slot 10511.
The ejector pin 1053 is disposed on the lower pad 102, and the upper end thereof is connected to the lower end of the molding stripper block 1052.
The first spring 1054 is disposed in the lower die holder 101, and the upper end of the first spring is connected to the lower end of the ejector pin 1053.
So, through setting up first piece 1051, then can be convenient the installation of shaping knockout piece 1052, but shaping knockout piece 1052 can reciprocate in locating in mounting groove 10511, when first drift 206 is punching press the raw and other materials, shaping knockout piece 1052 then can be pressed down and move, first spring 1054 also can shrink, after the punching press is accomplished, first drift 206 moves up, and the raw and other materials still are in by the state of upper shield oppression, at this moment first spring 1054 with thimble 1053 then can promote shaping knockout piece 1052 moves up to jack-up the product of stamping forming, make it separate with the raw and other materials, its overall structure is simple, shaping product separation convenient and fast.
Preferably, in one embodiment of the present utility model, a second punch 207 is further included, and the second punch 207 is provided on the upper die assembly 20 and moves up and down with the upper die assembly 20 to punch a positioning hole for a raw material.
It should be noted that the raw materials are fed through the feeder, and can gradually move after being punched, so that during processing, the second punching hole can be used for punching the positioning hole of the raw materials, and the raw materials are positioned through the positioning hole, so that the raw materials are placed more stably and accurately.
Preferably, in one embodiment of the present utility model, the die further includes a second block 106, where the second block 106 is disposed on the lower die plate 103 and opposite to the second punch 207, so as to punch a positioning hole for the raw material in cooperation with the second punch 207.
In this way, the second block 106 is arranged to be matched with the second punch 207 to punch a positioning hole in the raw material.
Preferably, in one embodiment of the present utility model, the device further comprises an buoyancy module 107, and the buoyancy module 107 is disposed on the lower module 10 to reset the raw material.
When the upper die assembly 20 is in the floating state, the raw material is located between the upper die assembly 20 and the lower die assembly 10 and is not in contact with the upper stripper plate 204 and the lower die plate 103, and when the upper die assembly 20 moves down, the raw material is pressed to sink and be attached to the lower die plate 103, so that after the punching is completed, the upper die assembly 20 floats upwards, and the floating assembly can push the test material to rise.
Preferably, in one embodiment of the present utility model, the buoyancy module 107 includes a buoyancy pin 1071 and a second spring 1072.
The floating pin 1071 is provided on the lower die plate 103 so as to be capable of floating up and down.
The second spring 1072 is disposed in the lower plate 102, and has an upper end connected to a lower end of the floating pin 1071.
Thus, when the upper die assembly 20 is pressed down during punching, the floating pin is pressed down, and the second spring 1072 is also in a contracted state, after punching is completed, the upper die assembly 20 is lifted, at this time, the second spring 1072 can push the floating pin 1071 to lift so as to push the raw material to reset, and the feeding mechanism moves the raw material so as to facilitate the next punching.
Preferably, in one embodiment of the present utility model, a stop plate 208 is attached to the upper surface of the upper release plate 204, and the stop plate 208 is disposed on the guide post 205 in a penetrating manner and can slide along the length direction of the guide post 205.
It should be noted that the stop plate 208 is connected to the upper release plate 204, so that other accessories can be easily installed by providing the stop plate 208.
Preferably, in one embodiment of the present utility model, a third spring 209 is disposed on the upper pad 203, and a lower end of the third spring 209 abuts against a surface of the upper release plate 204, so as to push the upper release plate 204 to move downward.
Thus, as described above, the upper clamping plate 202 and the upper release plate 204 are disposed at intervals, that is, a certain gap exists between them, and the upper backing plate 203 is provided with the third spring 209, the lower end of the third spring 209 abuts against the surface of the upper release plate 204, so when the upper release plate 204 and the lower die plate 103 are attached during punching, the upper backing plate 203 and the upper clamping plate 202 can continue to move downwards, and the third spring 209 is compressed under stress, and due to the buffering of the third spring 209 and the second spring 1072, the first punch 206 can perform preformed punching on the raw materials, and after the preforming, the first punch 206 can continue to move downwards, so as to complete the forming process.
Preferably, in one embodiment of the present utility model, the upper stripper plate 204 is provided with a positioning pin 108, and the positioning pin 108 is inserted into a positioning hole of the raw material when the upper module 20 moves down.
Thus, by arranging the positioning needle 108, the positioning needle 108 can be inserted into the positioning hole during punching to position the raw material, so that the raw material is more stable during punching and the position is more accurate.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. A small-size welding bump disk stamping die, characterized by, include:
the lower die assembly comprises a lower die holder, a lower base plate and a lower die plate, wherein the lower die holder is suitable for being fixed on a machine table, the lower base plate is arranged on the lower die holder, the lower die plate is arranged above the lower base plate, and a guide sleeve is arranged on the lower die plate;
the upper die assembly comprises an upper die holder, an upper clamping plate, an upper base plate and an upper stripper plate, wherein the upper die holder is suitable for being fixed on a machine table, the upper base plate is arranged below the upper die holder, the upper clamping plate is arranged below the upper base plate, a guide column is arranged on the upper clamping plate, and the upper stripper plate is arranged on the guide column in a penetrating manner in a lifting manner;
the first punch is arranged on the upper clamping plate, the lower end of the first punch penetrates through the upper supporting plate and can move up and down along with the upper die assembly so as to punch the raw materials into a finished product;
when the upper die assembly moves downwards, the lower ends of the guide posts are inserted into the guide sleeves, and the upper stripper plate and the lower die plate clamp raw materials.
2. The die for stamping a wafer with small solder bumps according to claim 1, wherein a block-in assembly is provided on the lower die plate, the block-in assembly and the first punch are disposed vertically opposite to each other, and when the upper die assembly and the lower die assembly are closed, the first punch is abutted against the block-in assembly to stamp the raw material.
3. The die set for stamping a compact solder bump wafer as recited in claim 2, wherein said insert assembly comprises:
the first block body is arranged on the lower die plate, and the middle part of the first block body is provided with a mounting groove;
the molding stripping block can be arranged in the mounting groove in a floating manner up and down;
the ejector pin is arranged on the lower backing plate in a penetrating way, and the upper end of the ejector pin is connected with the lower end of the forming stripping block;
the first spring is arranged in the lower die holder, and the upper end of the first spring is connected with the lower end of the thimble.
4. The die set for stamping a compact solder bump wafer as recited in claim 1, further comprising a second punch disposed on said upper die assembly and movable up and down with said upper die assembly to punch a pilot hole in a raw material.
5. The die set for stamping a compact solder bump wafer as recited in claim 4, further comprising a second block disposed on said lower die plate opposite said second punch for stamping a pilot hole in a raw material in cooperation with said second punch.
6. The die for stamping a compact solder bump wafer of claim 1 further comprising a lifting assembly disposed on the lower die assembly for resetting the raw material.
7. The die set forth in claim 6, wherein said float assembly comprises:
the floating pin can be arranged on the lower template in a floating way up and down;
the second spring is arranged in the lower base plate, and the upper end of the second spring is connected with the lower end of the buoyancy pin.
8. The die set for stamping a wafer for small solder bumps according to claim 1, wherein a stopper plate is attached to the upper surface of the upper stripper plate, and the stopper plate is disposed on the guide post in a penetrating manner and is slidable along the length direction of the guide post.
9. The die set for stamping a wafer for soldering bumps as recited in claim 1, wherein a third spring is provided on the upper pad, and a lower end of the third spring is abutted against the surface of the upper stripper plate for pushing the upper stripper plate to move downward.
10. The die set for stamping a wafer with small solder bumps according to claim 4, wherein the upper stripper plate is provided with a positioning pin, and the positioning pin is inserted into a positioning hole of the raw material when the upper die assembly moves down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320025323.0U CN219541484U (en) | 2023-01-05 | 2023-01-05 | Stamping die for small-sized welding bump wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320025323.0U CN219541484U (en) | 2023-01-05 | 2023-01-05 | Stamping die for small-sized welding bump wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219541484U true CN219541484U (en) | 2023-08-18 |
Family
ID=87734913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320025323.0U Active CN219541484U (en) | 2023-01-05 | 2023-01-05 | Stamping die for small-sized welding bump wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219541484U (en) |
-
2023
- 2023-01-05 CN CN202320025323.0U patent/CN219541484U/en active Active
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